CN116469800A - Automatic eutectic welding equipment for core light - Google Patents

Automatic eutectic welding equipment for core light Download PDF

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Publication number
CN116469800A
CN116469800A CN202310370337.0A CN202310370337A CN116469800A CN 116469800 A CN116469800 A CN 116469800A CN 202310370337 A CN202310370337 A CN 202310370337A CN 116469800 A CN116469800 A CN 116469800A
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CN
China
Prior art keywords
module
clamping jaw
voice coil
visual
grinding
Prior art date
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Pending
Application number
CN202310370337.0A
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Chinese (zh)
Inventor
吴涛
陈华
陈少滨
陈文烨
梁婷婷
刘勇杰
罗升
梁玉宁
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Jiangxi Xinkang Technology Co ltd
Original Assignee
Shantou A Plux Optoelectronic Technology Co ltd
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Application filed by Shantou A Plux Optoelectronic Technology Co ltd filed Critical Shantou A Plux Optoelectronic Technology Co ltd
Priority to CN202310370337.0A priority Critical patent/CN116469800A/en
Publication of CN116469800A publication Critical patent/CN116469800A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

The invention relates to automatic eutectic welding equipment for core light, which comprises a grinding device and a visual detection module, wherein the grinding device comprises an electric grinding machine, a ball screw linear module and a wire pressing mechanism, the electric grinding machine is fixedly arranged on the ball screw linear module, the wire pressing mechanism is arranged on one side of the electric grinding machine, the electric grinding machine comprises a grinding head, a double-bearing seat and a high-speed motor, a straight shank drill chuck is rotatably arranged on the double-bearing seat, the grinding head is clamped on the straight shank drill chuck, the grinding head is linked to rotate through the high-speed motor, the ball screw linear module moves in a matched mode, the visual detection module comprises a support, a visual module and a clamping piece, the clamping piece is rotatably arranged on the support, and the visual module is fixedly arranged on the clamping piece. The invention realizes high-precision coaxial control of the grinding head by utilizing the double-end bearing and the miniature chuck, greatly reduces the end jump of the grinding head in the high-speed grinding process, and trims the grinding quantity under the visual guiding effect, thereby improving the manufacturing quality of the soft bracket.

Description

Automatic eutectic welding equipment for core light
Technical Field
The invention relates to the field of copper wire soft support packaging, in particular to automatic eutectic welding equipment for core wires.
Background
Copper wire lamp packages are commercially available that are formed by laser welding. The SMD lamp bead device is adopted, so that the lamp beads are subjected to die bonding packaging, and the electrode of the lamp beads has strong fusion welding capability, and the scheme is feasible. The present project uses flip chip, and the chip electrode is flip-chip bonded to the copper wire. Because the chip is relatively fragile, the chip is not suitable for laser welding, and an alloy bracket needs to be manufactured on a copper wire in advance. The technology and equipment for eutectic welding of the flip chip to the surface of the molten copper wire support are studied, and the chip packaging is realized through eutectic deposition, so that a good effect of the flexible luminous line is formed.
At present, the core light is pasted by adopting a traditional die bonding method, and the chip is fixed on a hard bracket. The bracket can be designed into a better cup-shaped form, is easy to fix and isolate, and cannot generate short circuit. When packaging, only the positioning in the horizontal direction needs to be considered, and the positioning in the vertical direction is mainly ensured by the processing precision of the positioning device. Moreover, the single device can be subjected to a piece-by-piece light splitting test, and the packaging of other chips is not affected. However, the copper wire has stronger flexibility, the support seat is formed by grinding, the surface height of the soft support is uncertain, short circuit is easy to occur, and once a single short circuit occurs, the whole wire can be influenced. Therefore, the eutectic welding process of the chip needs to analyze the height of the molten surface of the bracket, timely adjusts the packaging surface of the chip according to the surface height, realizes high-precision flight control positioning, and can only realize the chip packaging of a single copper wire by the existing equipment, so that the packaging efficiency is low.
Disclosure of Invention
The embodiment of the invention aims to solve the problem of providing the automatic eutectic welding equipment for the core light, which realizes parallel scheduling of double packaging lines by utilizing single-straight line and double voice coil driving, improves the packaging efficiency and ensures the patch precision and quality.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a core beam automatic eutectic welding apparatus comprising:
the chip stripping device comprises a double-shaft displacement platform, a wafer disc and a jacking mechanism, wherein the double-shaft displacement platform drives the wafer disc to move a chip on a blue film to the position above the jacking mechanism, and the chip is jacked up by the jacking mechanism;
the chip moving die bonding device comprises a horizontal displacement module, a pair of voice coil linear modules and a pair of suction nozzles, wherein the horizontal displacement module is arranged above the wafer disc and used for driving the voice coil linear modules to horizontally move, the suction nozzles are fixedly arranged on the voice coil linear modules, the voice coil linear modules drive the suction nozzles to vertically move, and the suction nozzles are matched with the horizontal displacement module to enable the suction nozzles to suck up the chip on the jacking mechanism or enable the chip to be attached to a copper wire;
the visual observation system comprises a plurality of visual modules which are respectively used for detecting the crystal suction and crystal fixing conditions of the core moving fixing device and the surface height of the solder paste of the copper wire.
Preferably, the device further comprises a pair of heating die bonding tables respectively arranged on two sides of the wafer tray, the heating die bonding tables comprise a heating module, an installation table, a fine tuning base, a wire pressing iron sheet and a limiting assembly, the heating module is fixedly arranged on the installation table and used for heating solder paste on copper wire wires, the limiting assembly is arranged on the heating module and used for limiting the swing of the copper wire wires, and the wire pressing iron sheet is retractably arranged above the limiting assembly and used for compressing the copper wire wires on the limiting assembly.
Preferably, the voice coil linear module comprises a voice coil motor, a guide rail, a slider and a grating detection module, wherein the guide rail is vertically arranged on the voice coil motor, the slider is in sliding fit with the guide rail, a connecting frame is fixedly installed on the slider, a suction nozzle is fixedly installed on the connecting frame, the slider is driven by the voice coil motor to drive the suction nozzle to vertically move, and the grating detection module is arranged on one side of the voice coil motor and is used for detecting the linear displacement of the slider.
Further, the jacking mechanism comprises a stepping motor, a cam and a thimble, the thimble is slidably inserted on the stepping motor, a linkage block is fixedly arranged at the bottom of the thimble, and the cam is fixedly arranged on an output shaft of the stepping motor and is in contact fit with the linkage block, so that the linkage block drives the thimble to vertically move under the action of the cam.
Further, the device comprises a pair of line shifting devices, the line shifting devices are respectively arranged on one side of the heating die bonding table, each line shifting device comprises a line shifting linear module and a pair of clamping jaw assemblies, mounting plates are slidably arranged on the line shifting linear module, the clamping jaw assemblies are respectively and fixedly arranged at two ends of the mounting plates, and the clamping jaw assemblies are driven to horizontally move through the line shifting linear modules.
Further, the clamping jaw assembly comprises a clamping jaw air cylinder, a fixed clamping jaw and a movable clamping jaw, wherein the fixed clamping jaw is fixedly arranged on the clamping jaw air cylinder, the movable clamping jaw is fixedly connected with the telescopic end of the clamping jaw air cylinder, and the movable clamping jaw is driven by the clamping jaw air cylinder to be matched with the fixed clamping jaw to clamp the copper wire.
Further, the device also comprises paired pre-tightening devices, wherein the pre-tightening devices are respectively arranged on two sides of the double-shaft displacement module, each pre-tightening device comprises a guide rail sliding block, a plurality of pulleys and a pre-tightening frame, each guide rail sliding block is arranged on the pre-tightening frame in a sliding manner, the pulleys are respectively arranged on the upper parts of the pre-tightening frames in a rotating manner, and one pulley is arranged on the guide rail sliding block in a rotating manner.
Further, the vision observation system further comprises a camera frame, a plurality of light source lamps and a plurality of clamping seats, wherein the clamping seats are respectively and fixedly installed on the camera frame at equal intervals, the vision module is fixedly installed on the clamping seats, and the light source lamps are arranged below the vision module and are fixedly connected with the bottom of the camera frame.
Further, a fine adjustment assembly is arranged between the clamping seat and the camera frame and used for adjusting the position of the vision module.
Compared with the prior art, the invention has the beneficial effects that:
the invention realizes parallel dispatch of double packaging lines by utilizing single-line and double-voice coil driving, improves packaging efficiency, realizes high-precision flight landing control of the chip in the vertical direction by utilizing visual control and voice coil motor driving, ensures that the patch precision is within 5um, and ensures high quality of the patch.
The active vacuum breaking generator is adopted to eliminate residual vacuum suction of the suction nozzle, so that the chip keeps good separation, and the defects of vertical sheets and flying sheets are avoided;
the system comprises line shifting, visual scanning, chip stripping and transferring, flight landing control and the like, and realizes the automatic production of high-precision eutectic welding.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present embodiment;
FIG. 2 is a schematic diagram of a chip detachment apparatus according to the present embodiment;
fig. 3 is a schematic structural view of a jack-up mechanism in the present embodiment;
fig. 4 is a schematic structural diagram of a die-bonding apparatus with a moving core in this embodiment;
FIG. 5 is a schematic diagram of a coil linear module in the present embodiment;
FIG. 6 is a schematic diagram of a heating stage according to the present embodiment;
FIG. 7 is a schematic view of the structure of the pre-tightening device in this embodiment;
fig. 8 is a schematic structural diagram of the lane-change apparatus in the present embodiment;
fig. 9 is a schematic structural diagram of the visual observation system in the present embodiment.
In the figure: 1. a chip peeling device; 11. a biaxial displacement platform; 12. a die bonding disc; 13. a jack-up mechanism; 131. a stepping motor; 132. a cam; 133. a thimble;
2. a core-moving die bonding device; 21. a frame, 22, a horizontal displacement module; 23. a voice coil linear module; 24. a suction nozzle; 231. a voice coil motor; 232. a guide rail; 233. a slide block; 234. a grating detection module;
3. heating the crystal table; 31. a heating module; 32. a mounting table; 33. fine tuning the base; 34. a wire pressing cylinder; 35. a limit component;
4. a pre-tightening device; 41. a guide rail slide block; 42. a pulley;
5. a lane change device; 51. a servo motor; 52. a line shifting straight line module; 53. a clamping jaw cylinder; 54. a movable clamping jaw.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In addition, an element in the present disclosure may be referred to as being "fixed" or "disposed" on another element or being directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Referring to fig. 1, in an embodiment of the invention, an automatic eutectic soldering apparatus for core light includes a workbench, a chip peeling device 1, a core-moving die bonding device 2, and a vision observation system 6.
Referring to fig. 1 and 2, the chip peeling apparatus 1 includes a biaxial displacement platform 11, a wafer tray 12, and a jack-up mechanism 13, wherein the biaxial displacement platform 11 is fixedly disposed on a workbench, a blue film is disposed on the wafer tray 12, a plurality of chips are disposed on the blue film, the jack-up mechanism 13 is disposed below the wafer tray 12, and the wafer tray 12 is driven by the biaxial displacement platform 11 to move the chips on the blue film to the upper side of the jack-up mechanism 13, so that the jack-up mechanism 13 jacks up the chips.
Referring to fig. 3, specifically, the jack-up mechanism 13 includes a stepper motor 131, a cam 132, and a thimble 133, where the thimble 133 is slidably inserted on the stepper motor 131, and a linkage block is fixedly disposed at the bottom of the thimble 133, and the cam 132 is fixedly mounted on an output shaft of the stepper motor 131 and is in contact with the linkage block, and the cam is driven by the stepper motor to rotate, so that the linkage block drives the thimble 133 to vertically move under the action of the cam 132, thereby driving the thimble 133 to extend into the wafer 12 to jack up a chip on the blue film, and completing the chip stripping operation.
The jack-up mechanism 13 still includes fine setting subassembly 134, fine setting subassembly 134 includes fixed base, movable base, the mount pad, movable base longitudinal sliding sets up on fixed base, mount pad lateral sliding sets up on movable base, step motor 131 fixed mounting is on the mount pad, threaded connection has first accommodate spindle on the fixed base, and first accommodate spindle rotates with movable base to be connected, threaded connection has the second accommodate spindle on the movable base, and the second accommodate spindle rotates with the mount pad to be connected, error that produces when compensating each part processing or installation through manual rotatory first, second accommodate spindle, improve positioning accuracy.
Compared with the traditional chip stripper, the invention has high repeated positioning precision and can accurately strip the micron-sized chip; and a manual fine adjustment base is additionally arranged below the thimble mechanism and used for compensating errors generated during processing or mounting of each component in the system and improving positioning accuracy.
Referring to fig. 1 and 6, the invention further comprises a pair of heating die bonding tables 3 respectively arranged at two sides of the wafer tray 12, wherein the heating die bonding tables comprise a heating module 31, a mounting table 32, a fine adjustment base 33, a wire pressing iron sheet and a limiting component 35, the heating module is provided with an inwards concave accommodating cavity on the top surface of the mounting table, the heating module 31 is fixedly arranged in the accommodating cavity of the mounting table 32, a wire pressing cylinder 34 is fixedly arranged on the side wall of the mounting table 32, the telescopic end of the wire pressing cylinder is fixedly connected with the wire pressing iron sheet, and the fine adjustment base 33 is arranged below the mounting table 32;
wherein, spacing subassembly 35 includes a plurality of spacing sliders, heating module's vertical section is "protruding" font, heating module's top both sides respectively with hold and form the concave position between the chamber, preferably adopt four spacing sliders in this embodiment, spacing sliders set up on the concave position respectively the symmetry, and be connected with the fine setting screw between spacing slider and the lateral wall of mount table 32, the slit between the spacing slider is adjusted to the accessible fine setting screw, and then the copper wire line of adaptation not unidimensional, make the more various product of processing, the suitability of equipment has been improved.
When the copper wire pressing device is used, copper wires are arranged between the limiting sliding blocks, the pressing wire iron sheet is driven to press downwards to the heating module 31 through the pressing wire cylinder 34, the copper wires are pressed on the heating module 31, so that solder paste on the copper wires is fully heated, meanwhile, the heating module can adjust the heating temperature according to the type of the solder paste, and the pressing wire iron sheet is made of flexible materials, so that the pressing wire iron sheet is prevented from clamping the copper wires.
The fine adjustment base 33 is fixedly arranged on the workbench, the fine adjustment base 33 is provided with a sliding rail, the bottom of the mounting table 32 is provided with a sliding groove in sliding fit with the sliding rail, the side wall of the fine adjustment base 33 is rotatably provided with an adjusting screw, the adjusting screw is in threaded connection with the workbench, the mounting table 32 can be adjusted to move horizontally along the fine adjustment base 33 through the adjusting screw, further, the fact that a slit between limiting sliding blocks and a copper wire are kept on the same straight line is ensured, and therefore machining precision of the copper wire is improved.
Referring to fig. 1 and 4, the die bonding device 2 includes a horizontal displacement module 22, a pair of voice coil linear modules 23, and a pair of suction nozzles 24, where the horizontal displacement module 22 is disposed above the wafer tray 12, in this embodiment, the horizontal displacement module is composed of a servo motor and a screw nut, a slide plate is slidably disposed on the horizontal displacement module 22, the pair of voice coil linear modules 23 are respectively disposed at ends of the slide plate, and the voice coil linear modules 23 are driven to reciprocate horizontally toward the two sets of heating solid tables 3 by the horizontal displacement module 22, and the suction nozzles 24 are driven to move vertically by the voice coil linear modules 23, so as to absorb a chip on the jack-up mechanism 13 or paste the chip on a copper wire on the heating solid table 3.
Referring to fig. 4 and 5, the voice coil linear module 23 includes a voice coil motor 231, a guide rail 232, a slider 233, and a grating detection module 234, where the guide rail 232 is vertically disposed on the voice coil motor 231, the slider 233 is in sliding fit with the guide rail 232, and a connecting frame is fixedly installed on the slider 232, the suction nozzle 24 is fixedly installed on a cantilever of the connecting frame, the voice coil motor 231 drives the slider 232 to drive the suction nozzle 24 to vertically move, and the grating detection module 234 is vertically disposed on the voice coil motor 231, and in this embodiment, the grating detection module preferably adopts a grating sensor for detecting the linear displacement of the slider 232.
Specifically, when in use, the horizontal displacement module 22 drives the two groups of voice coil linear modules 23 to horizontally move towards the left direction until the voice coil linear module 23 positioned on the right side of the horizontal displacement module 22 reaches the upper part of the ejector pins 133, the voice coil linear module 23 positioned on the left side of the horizontal displacement module 22 reaches the upper part of the heating die table 3, the horizontal displacement module 22 stops moving, and simultaneously the voice coil linear module 23 drives the suction nozzles 24 to respectively move downwards, so that one suction nozzle 24 sucks the chip on the ejector pins 133, and the other suction nozzle 24 pastes the chip on the solder paste of the copper wire on the heating die table 3;
then, the two groups of voice coil linear modules 23 drive the suction nozzles 24 to move upwards respectively, the rear horizontal displacement module driver 22 enables the voice coil linear modules 23 to move to the other end until the voice coil linear modules 23 positioned on the left side of the horizontal displacement module 22 reach the upper portion of the ejector pins 133, after the voice coil linear modules 23 positioned on the right side of the horizontal displacement module 22 reach the upper portion of the other heating die table 3, the voice coil linear modules 22 stop moving, and then the voice coil linear modules 23 drive the suction nozzles 24 to move downwards respectively, so that one suction nozzle 24 sucks a chip on the ejector pins 133, and the other suction nozzle 24 pastes the chip on solder paste of copper wires on the heating die table 3, thereby realizing die sucking and die bonding operation.
Through the arrangement, the horizontal displacement module 22 is responsible for moving left and right, carrying chips on the suction nozzles 24 to the heating die bonding table 3, the left suction nozzle 24 and the right suction nozzle 24 are symmetrically distributed, and when one side suction nozzle 24 is used for die bonding, the other side suction nozzle 24 is used for die bonding, so that double-head die bonding is realized, and the die bonding efficiency is greatly improved.
Compared with the prior art, the invention adopts the voice coil motor for driving, has no any motion conversion mechanism, greatly simplifies the driving structure, has higher motion efficiency, can realize high-precision detection of linear displacement by utilizing the grating sensor, has the characteristics of high speed, high acceleration, quick response and the like, can realize high-speed approaching when in surface mounting, then decelerates and flexibly contacts with the eutectic point, and finally leaves at high speed, thereby realizing controllable surface mounting pressure.
Referring to fig. 1 and 9, the vision observation system 6 includes a camera frame 61, a plurality of vision modules 62, a plurality of light source lamps 63, a plurality of clamping seats 64 are respectively and fixedly installed on the camera frame 61 at equal intervals, the vision modules 62 are fixedly installed on the clamping seats 64, in this embodiment, industrial cameras are preferably adopted as the vision modules, the light source lamps 63 are arranged below the vision modules 62 and fixedly connected with the bottom of the camera frame 61, in this embodiment, the number of the vision modules 62, the light source lamps 63 and the clamping seats 64 is preferably three, wherein the middle vision module 62 is responsible for detecting the condition that the suction nozzle 24 sucks a wafer, and the vision modules 62 on the other two sides are responsible for detecting the surface mounting condition of the suction nozzle 24 and analyzing the height of the solder paste surface on the copper wire.
Wherein, be provided with the trimming subassembly between grip slipper 64 and the camera frame 61, the trimming subassembly includes fine setting base, movable slide, and the fine setting base is fixed to be set up on camera frame 61, has the slide rail on the fine setting base, and the bottom surface of movable slide has the spout with slide rail sliding fit, rotates on the fine setting base to with movable slide threaded connection, but through the position of rotatory adjusting screw adjustable vision module 62, make it aim at the thimble and heat the chip on the solid brilliant platform.
Compared with the traditional die bonding mechanism, the parallel scheduling of the double-packaging line is realized by utilizing single-linear and double-voice coil motor driving, and the packaging efficiency is improved. And two voice coil motors are independent control, can be according to the solder paste surface height of vision observation system feedback, adjust the paster decline height for the paster precision reaches within 5um, ensures the paster high quality, realizes the high accuracy landing control of chip vertical direction, improves eutectic welding quality.
Referring to fig. 1 and 2, an automatic eutectic welding device for core light further includes a pair of pretensioning devices 4 and a pair of line shifting devices 5, wherein the pretensioning devices 4 are respectively arranged at two sides of the biaxial displacement module, and the line shifting devices 5 are respectively arranged at one side of the heating crystal table 3.
Referring to fig. 7, the pre-tightening device includes a guide rail slider 41, a plurality of pulleys 42, and a pre-tightening frame, wherein the guide rail slider 41 is slidably disposed on the pre-tightening frame, the plurality of pulleys 42 are respectively rotatably disposed on the upper portion of the pre-tightening frame, and one of the pulleys 42 is rotatably disposed on the guide rail slider 41.
When the copper wire tension control device is used, the copper wire bypasses the lower part of the pulley 42 on the guide rail sliding block 41 and bypasses the upper parts of the pulleys 42 on two sides, so that a pretightening force is provided for the copper wire under the action of self gravity of the guide rail sliding block 41, the tension state of the copper wire is kept, the copper wire is conveyed more stably, the position of the sliding block is detected by the position sensor, and the tension of the copper wire is indirectly controlled.
Through the arrangement, the tension of the copper wire is under a controllable condition, the phenomenon that the copper wire is stretched out when the gravity is overlarge is avoided, and meanwhile, the phenomenon that the copper wire is obliquely folded in the process of pasting is effectively avoided due to the existence of the tension, so that the pasting precision is improved, and meanwhile, the pasting defective rate is reduced.
Referring to fig. 1 and 8, the line transfer devices 5 are respectively disposed at one side of the heating crystal table 3, the line transfer devices 5 include a line transfer linear module 52 and a pair of clamping jaw assemblies, the line transfer linear module 52 is slidably provided with a mounting plate, the clamping jaw assemblies are respectively and fixedly mounted at two ends of the mounting plate, and the clamping jaw assemblies are driven to horizontally move by the line transfer linear module 52.
The clamping jaw assembly comprises a clamping jaw air cylinder 53, a fixed clamping jaw and a movable clamping jaw 54, wherein the fixed clamping jaw is fixedly arranged on the clamping jaw air cylinder 53, the movable clamping jaw 54 is fixedly connected with the telescopic end of the clamping jaw air cylinder 53, and the clamping jaw air cylinder 53 drives the movable clamping jaw 54 to be matched with the fixed clamping jaw to clamp a copper wire.
When the line shifting operation is performed, the line shifting linear module 52 drives the clamping jaw air cylinder 53 and the movable clamping jaw 54 to move towards the direction of the pre-tightening device 4, at the moment, the movable clamping jaw 54 and the fixed clamping jaw are in a separated state, when the line shifting linear module 52 drives the clamping jaw air cylinder 53 and the movable clamping jaw 54 to move to the stroke end, the telescopic end of the clamping jaw air cylinder 53 drives the movable clamping jaw 54 to move towards the fixed clamping jaw, and clamps a copper wire arranged between the fixed clamping jaw and the movable clamping jaw 54, the line shifting linear module 52 moves reversely, drives the copper wire to move, and when the line shifting linear module 52 drives the clamping jaw air cylinder 53 and the movable clamping jaw 54 to move to the other end of the stroke end, the telescopic end of the clamping jaw air cylinder 53 drives the movable clamping jaw 54 to move away from the fixed clamping jaw, and after the movable clamping jaw 54 and the fixed clamping jaw are separated, the telescopic end of the clamping jaw air cylinder 53 releases the copper wire, so that solder paste on the copper wire can move to the heating die bonding table 3.
Compared with the prior art, the wire moving mode of the double copper wires is realized by arranging the two groups of wire moving linear modules 52 and the two groups of clamping jaws arranged on the wire moving linear modules 52, so that the packaging efficiency is greatly improved. Meanwhile, the fact that the weakest part of the copper wire is not subjected to rated pretightening force from the front direction and the rear direction in the wire transferring process is avoided, deformation and errors are further generated, the clamping jaw cylinder 53 drives the movable clamping jaw 54 to move, clamping action and clamping force can be adjusted through the air circuit element and air pressure, meanwhile, the synchronous belt is adopted as the wire transferring linear module, the wire transferring linear module is stable in starting and stopping, and interference of vibration to the position of the flexible wire is reduced.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (9)

1. A core beam automatic eutectic welding apparatus, comprising:
the chip stripping device (1), wherein the chip stripping device (1) comprises a double-shaft displacement platform (11), a wafer disc (12) and a jacking mechanism (13), the double-shaft displacement platform (11) drives the wafer disc (12) to move chips on a blue film to the position above the jacking mechanism (13), and the chips are jacked by the jacking mechanism (13);
the core-moving die bonding device (2) comprises a horizontal displacement module (22), a pair of voice coil linear modules (23) and a pair of suction nozzles (24), wherein the horizontal displacement module (22) is arranged above the wafer tray (12) and is used for driving the voice coil linear modules (23) to move horizontally, the suction nozzles (24) are fixedly arranged on the voice coil linear modules (23), the voice coil linear modules (23) drive the suction nozzles (24) to move vertically, and the suction nozzles are matched with the horizontal displacement module (22) to enable the suction nozzles to suck up chips on the jacking mechanism or attach the chips on copper wires;
the visual observation system (6), the visual observation system (6) comprises a plurality of visual modules (62) which are respectively used for detecting the crystal suction and crystal fixing conditions of the core moving fixing device (2) and the solder paste surface height of the copper wire.
2. The automatic eutectic soldering equipment for core light according to claim 1, further comprising a pair of heating die bonding tables (3) respectively arranged on two sides of the wafer tray (12), wherein each heating die bonding table comprises a heating module (31), a mounting table (32), a fine tuning base (33), a wire pressing iron sheet and a limiting assembly (35), the heating module (31) is fixedly arranged on the mounting table (32) and is used for heating solder paste on copper wires, the limiting assembly (35) is arranged on the heating module (31) and is used for limiting copper wires to swing, and the wire pressing iron sheet is retractably arranged above the limiting assembly (35) and is used for compressing the copper wires on the limiting assembly (35).
3. The automatic eutectic soldering device for core light according to claim 1, wherein the voice coil linear module (23) comprises a voice coil motor (231), a guide rail (232), a slider (233) and a grating detection module (234), the guide rail (232) is vertically arranged on the voice coil motor (231), the slider (233) is in sliding fit with the guide rail (232), a connecting frame is fixedly arranged on the slider (232), the suction nozzle (24) is fixedly arranged on the connecting frame, the voice coil motor (231) drives the slider (232) to drive the suction nozzle (24) to vertically move, and the grating detection module (234) is arranged on one side of the voice coil motor (231) and is used for detecting the linear displacement of the slider (233).
4. The automatic eutectic welding equipment for core light according to claim 1, wherein the jacking mechanism (13) comprises a stepping motor (131), a cam (132) and a thimble (133), the thimble (133) is slidably inserted on the stepping motor (131), a linkage block is fixedly arranged at the bottom of the thimble (133), and the cam (132) is fixedly arranged on an output shaft of the stepping motor (131) and is in contact fit with the linkage block, so that the linkage block drives the thimble (133) to vertically move under the action of the cam (132).
5. The automatic eutectic welding equipment for core light rays according to claim 2, further comprising a pair of line shifting devices (5), wherein the line shifting devices (5) are respectively arranged on one side of the heating die bonding table (3), each line shifting device (5) comprises a line shifting linear module (52) and a pair of clamping jaw assemblies, a mounting plate is slidably arranged on each line shifting linear module (52), each clamping jaw assembly is fixedly mounted at two ends of the mounting plate, and the clamping jaw assemblies are driven to horizontally move through the line shifting linear modules (52).
6. The automatic eutectic welding equipment for core light rays according to claim 5, wherein the clamping jaw assembly comprises a clamping jaw air cylinder (53), a fixed clamping jaw and a movable clamping jaw (54), the fixed clamping jaw is fixedly arranged on the clamping jaw air cylinder (53), the movable clamping jaw (54) is fixedly connected with a telescopic end of the clamping jaw air cylinder (53), and the movable clamping jaw (54) is driven by the clamping jaw air cylinder (53) to be matched with the fixed clamping jaw to clamp a copper wire.
7. The automatic eutectic welding equipment for core light rays according to claim 1, further comprising paired pre-tightening devices (4), wherein the pre-tightening devices (4) are respectively arranged on two sides of the double-shaft displacement platform (11), the pre-tightening devices (4) comprise a guide rail sliding block (41), a plurality of pulleys (42) and a pre-tightening frame, the guide rail sliding block (41) is slidably arranged on the pre-tightening frame, the pulleys (42) are respectively rotatably arranged on the upper part of the pre-tightening frame, and one pulley (42) is rotatably arranged on the guide rail sliding block (41).
8. The automatic eutectic welding equipment for core light rays according to claim 1, wherein the visual observation system (6) further comprises a camera frame (61), a plurality of light source lamps (63) and a plurality of clamping seats (64), the plurality of clamping seats (64) are respectively and fixedly installed on the camera frame (61) at equal intervals, the visual module (62) is fixedly installed on the clamping seats (64), and the light source lamps (63) are arranged below the visual module (62) and are fixedly connected with the bottom of the camera frame (61).
9. The automatic eutectic soldering apparatus for core light according to claim 8, wherein a fine adjustment assembly is provided between the holder (64) and the camera frame (61) for adjusting the position of the vision module (62).
CN202310370337.0A 2023-04-07 2023-04-07 Automatic eutectic welding equipment for core light Pending CN116469800A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310370337.0A CN116469800A (en) 2023-04-07 2023-04-07 Automatic eutectic welding equipment for core light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310370337.0A CN116469800A (en) 2023-04-07 2023-04-07 Automatic eutectic welding equipment for core light

Publications (1)

Publication Number Publication Date
CN116469800A true CN116469800A (en) 2023-07-21

Family

ID=87180022

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310370337.0A Pending CN116469800A (en) 2023-04-07 2023-04-07 Automatic eutectic welding equipment for core light

Country Status (1)

Country Link
CN (1) CN116469800A (en)

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