CN116466804A

CN116466804A - Computing device

Info

Publication number: CN116466804A
Application number: CN202211103130.9A
Authority: CN
Inventors: 刘勇; 姬忠礼; 刘国强; 邓治高
Original assignee: XFusion Digital Technologies Co Ltd
Current assignee: XFusion Digital Technologies Co Ltd
Priority date: 2022-09-09
Filing date: 2022-09-09
Publication date: 2023-07-21

Abstract

The application discloses computing equipment, computing equipment includes first circuit board, second circuit board, first treater, second treater and heat abstractor, and heat abstractor includes first radiator, second radiator, third radiator, first connecting pipe and second connecting pipe, and first treater and first radiator are installed in the first face of first circuit board, and second treater and second radiator are installed in the second face of second circuit board, and wherein, first face and second face set up in opposite directions. The first radiator is used for radiating the first processor, the second radiator is used for radiating the second processor, the first connecting pipe is connected with the first radiator and the third radiator, the second connecting pipe is connected with the second radiator and the third radiator, and the third radiator is used for radiating the first radiator and the second radiator. The heat of the first radiator and the heat of the second radiator can be transferred to the third radiator to radiate, so that the radiating performance of the whole radiating device can be effectively improved.

Description

Computing device

Technical Field

The present application relates to the field of electronics, and in particular, to a computing device.

Background

With the advent of big data, cloud computing, and artificial intelligence (Artificial intelligence, AI), the computing demands of data centers and servers are increasing. The integration level of devices or circuits such as data processing, storage and transmission of the current server is higher and higher, more and more heat is generated by the circuit board unit, and how to realize efficient heat dissipation of the circuit board unit becomes an important research content in the electronic industry.

Disclosure of Invention

The application provides a computing device, through setting up the third radiator with first radiator and second radiator intercommunication, increase heat radiating area realizes even heat dissipation, helps improving heat abstractor's radiating efficiency to solve computing device high-efficient heat dissipation problem.

In a first aspect, the application provides a computing device, the computing device includes first circuit board, second circuit board, first treater, second treater, heat abstractor, cooling medium is located inside the heat abstractor, heat abstractor includes first radiator, second radiator, third radiator, first connecting pipe and second connecting pipe, first treater and first radiator are installed in the first face of first circuit board, second treater and second radiator are installed in the second face of second circuit board, wherein, first face and second face are set up in opposite directions. The first radiator is used for radiating the first processor, the second radiator is used for radiating the second processor, the first connecting pipe is connected with the first radiator and the third radiator, the second connecting pipe is connected with the second radiator and the third radiator, and the third radiator is used for radiating the first radiator and the second radiator.

In the present application, the first heat sink is used for dissipating heat for the first processor on the first circuit board, and the second heat sink is used for dissipating heat for the second processor on the second circuit board. The first connecting pipe is connected with the first radiator and the third radiator, the second connecting pipe is connected with the second radiator and the third radiator, therefore, heat of the first radiator can be transferred to the third radiator through the first connecting pipe to radiate, heat of the second radiator can be transferred to the third radiator through the second connecting pipe to radiate, heat accumulation around the first processor and the second processor is avoided, heat generated by the first processor and the second processor is effectively discharged, radiating performance of the whole radiating device can be effectively improved, radiating bottleneck problems of a server can be solved, lifting and evolution of XPU power consumption of computing equipment can be met only by adopting the low-cost or low-power radiator, and total cost of the computing equipment is further reduced.

In some possible implementations, the heat dissipating device further includes a third connecting pipe, and the third connecting pipe communicates the first heat sink with the second heat sink.

In this application, first radiator and second radiator are connected to the third connecting pipe for heat can be transferred between first radiator and the second radiator, with realizing soaking effect, promoting heat diffusion, avoid the heat to pile up at first radiator or second radiator, thereby help improving whole heat abstractor's heat dispersion.

In some possible implementations, the first radiator has a first closed cavity, the second radiator has a second closed cavity, and the first and second closed cavities are provided with cooling medium.

In some possible implementations, a capillary structure is disposed on a side of the second closed chamber adjacent to the second processor. The second enclosure may include, for example, a first plate and a second plate disposed opposite each other, the first plate being adjacent to the second processor relative to the second plate. Wherein the first plate may be provided with a capillary structure. The second airtight chamber is equipped with a plurality of plates, and a plurality of plates connect first board, and a plurality of plates all are equipped with capillary structure.

In this application, in the second radiator, due to the effect of the gravity in the first direction Z, the cooling medium in the second closed cavity is mainly concentrated in the area of the second closed cavity away from the second processor, which is unfavorable for the cooling medium to directly absorb the heat generated by the second processor through the first plate. The first plate is provided with the capillary structure, the first plate is connected with the plate, the capillary structure can guide the cooling working medium to the first plate, and the capillary structure of the first plate can enable the cooling working medium to be uniformly distributed on the first plate, so that the cooling working medium in the second closed cavity can absorb heat from the second processor better. Meanwhile, the capillary structure can also increase the number of vaporization cores of the cooling working medium, so that the evaporation and heat dissipation of the cooling working medium in the second closed cavity are promoted, and the heat dissipation performance of the second radiator is improved.

In some possible implementations, the first connecting pipe includes a first hot flow pipe and a first cold flow pipe, the first hot flow pipe is used for conveying the cooling working medium after temperature rise from the first radiator to the third radiator, and the first cold flow pipe is used for conveying the cooling working medium after temperature drop from the third radiator to the first radiator. The second connecting pipe comprises a second heat flow pipe and a second cold flow pipe, the second heat flow pipe is used for conveying the cooled working medium after temperature rise from the second radiator to the third radiator, and the second cold flow pipe is used for conveying the cooled working medium after temperature reduction from the third radiator to the second radiator.

In this application, first heat flow pipe intercommunication first radiator and third radiator, second heat flow pipe intercommunication second radiator and third radiator for the cooling medium after the intensification in first radiator and the second radiator can be imported in the third radiator and cool off. The first cold flow pipe is communicated with the first radiator and the third radiator, the second cold flow pipe is communicated with the second radiator and the third radiator, so that cooling working media cooled by the third radiator return to the first radiator and the second radiator through the first connecting pipe and the second connecting pipe respectively, and the radiating effect of the first radiator and the second radiator on the first processor and the second processor is improved.

In some possible implementations, the third radiator includes fins and radiating pipes embedded in the fins, the radiating pipes are used for cooling the cooling medium after temperature rise, the first connecting pipe is communicated with the first radiator and the radiating pipes, and the second connecting pipe is communicated with the second radiator and the radiating pipes.

In some possible implementations, the radiating pipe has a first port for receiving the warmed cooling medium and a second port for outputting the cooled cooling medium. The first heat flow pipe is communicated with the first closed cavity and the first port of the radiating pipe, the first cold flow pipe is communicated with the first closed cavity and the second port of the radiating pipe, the second heat flow pipe is communicated with the second closed cavity and the first port of the radiating pipe, and the second cold flow pipe is communicated with the second closed cavity and the second port of the radiating pipe.

In this application, first heat flow pipe intercommunication first airtight chamber and first port, the cooling medium after the intensification in the airtight intracavity of first can get into first port through first heat flow pipe, cools off in the third radiator. The first cold flow pipe is communicated with the first closed cavity and the second port, and the cooling working medium in the third radiator can return to the first closed cavity through the first cold flow pipe, so that the circulation of the cooling working medium between the first radiator and the third radiator is realized, and the radiating efficiency of the radiating device is improved. The second heat flow pipe is communicated with the second closed cavity and the first port, and the warmed cooling working medium in the second closed cavity can enter the first port through the second heat flow pipe and is cooled in the third radiator. The second cold flow pipe is communicated with the second closed cavity and the second port, and cooled cooling working medium in the third radiator can return to the second closed cavity through the second cold flow pipe, so that the circulation of the cooling working medium between the second radiator and the third radiator is realized, and the radiating efficiency of the radiating device is improved.

In some possible implementations, the third radiator includes a cooling cavity and fins, where the fins are connected to the cooling cavity, and the cooling cavity is used for cooling the cooling medium after temperature rise. The first connecting pipe is communicated with the first radiator and the cooling cavity, and the second connecting pipe is communicated with the second radiator and the cooling cavity.

In some possible implementations, the cooling cavity has a first inlet for receiving the warmed cooling medium and a first outlet for outputting the cooled cooling medium. The first heat flow pipe is communicated with the first inlets of the first closed cavity and the cooling cavity, the first cold flow pipe is communicated with the first outlets of the first closed cavity and the cooling cavity, the second heat flow pipe is communicated with the first inlets of the second closed cavity and the cooling cavity, and the second cold flow pipe is communicated with the first outlets of the second closed cavity and the cooling cavity.

In this application, first heat flow pipe intercommunication first airtight chamber and first entry, the cooling medium after the intensification in the airtight intracavity of first can get into first port through first heat flow pipe, cools off in the third radiator. The first cold flow pipe is communicated with the first closed cavity and the first outlet, and the cooling working medium in the third radiator can return to the first closed cavity through the first cold flow pipe, so that the circulation of the cooling working medium between the first radiator and the third radiator is realized, and the radiating efficiency of the radiating device is improved. The second heat flow pipe is communicated with the second closed cavity and the first inlet, and the warmed cooling working medium in the second closed cavity can enter the first inlet through the second heat flow pipe and is cooled in the third radiator. The second cold flow pipe is communicated with the second closed cavity and the first outlet, and cooled cooling working medium in the third radiator can return to the second closed cavity through the second cold flow pipe, so that the circulation of the cooling working medium between the second radiator and the third radiator is realized, and the radiating efficiency of the radiating device is improved.

In some possible implementations, at least one of the first hot flow tube and the first cold flow tube is provided with a pump, and at least one of the second hot flow tube and the second cold flow tube is provided with a pump.

In this application, the pump can drive cooling medium circulation flow between first radiator and third radiator, drives cooling medium circulation flow between second radiator and third radiator to improve heat abstractor's radiating efficiency.

Drawings

FIG. 1 is a partial schematic diagram of a computing device provided by embodiments of the present application in some embodiments;

FIG. 2 is a schematic cross-sectional view of the computing device of FIG. 1 taken along line A-A;

FIG. 3 is a schematic cross-sectional partial structure view of the computing device shown in FIG. 1 taken along line A-A in some embodiments;

FIG. 4 is a schematic diagram of a portion of the heat dissipating device shown in FIG. 1;

FIG. 5 is a schematic cross-sectional partial structure view of the computing device shown in FIG. 1 taken along line A-A in other embodiments;

FIG. 6 is a schematic illustration of a portion of a structure of a computing device provided in embodiments of the present application in other embodiments;

FIG. 7 is a partial schematic view of a cross-section of the computing device shown in FIG. 6 taken at B-B at another angle;

FIG. 8 is a schematic view of a cross-section of the computing device of FIG. 6 taken at C-C at another angle;

FIG. 9 is a partial schematic diagram of a computing device provided in embodiments of the present application in further embodiments;

FIG. 10 is a schematic cross-sectional view of the computing device of FIG. 9 taken along line D-D;

FIG. 11 is a schematic view of a portion of the computing device of FIG. 1 in other embodiments;

FIG. 12 is a schematic view of a portion of the computing device of FIG. 1 in other embodiments.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings. Wherein, in the description of the embodiments of the present application, "/" means or is meant unless otherwise indicated, for example, a/B may represent a or B; the text "and/or" is merely an association relation describing the associated object, and indicates that three relations may exist, for example, a and/or B may indicate: the three cases where a exists alone, a and B exist together, and B exists alone, and in addition, in the description of the embodiments of the present application, "plural" means two or more than two.

In the following, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as implying or implying relative importance or as implying a number of such features. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "disposed on … …" are to be construed broadly, and for example, "connected" may be either detachably connected or non-detachably connected; may be directly connected or indirectly connected through an intermediate medium. Wherein, "fixedly connected" means that the relative positional relationship is unchanged after being connected with each other. "rotationally coupled" means coupled to each other and capable of relative rotation after coupling. "slidingly coupled" means coupled to each other and capable of sliding relative to each other after being coupled.

Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic diagram of a partial structure of a computing device 100 in some embodiments according to an embodiment of the present application, and fig. 2 is a schematic diagram of a cross-sectional structure of the computing device 100 shown in fig. 1 taken along A-A.

In some embodiments, computing device 100 may be a server, a computer host, a communication device, or the like. The computing device 100 of the embodiment shown in fig. 1 is illustrated as a server. The server is a high-performance computer on the network for providing various services for client computers, and under the control of the network operating system, the server provides the data accessor, tape, printer and various special communication devices connected with the server for sharing of client sites on the network, and can also provide centralized computing, information publishing, data management and other services for network users. Servers may include general purpose servers, blade servers, high performance servers, high density servers, cluster servers, and supercomputer servers, among others.

In some embodiments, computing device 100 may include a chassis 10, a first circuit board 1, a second circuit board 2, a first processor 11, a second processor 21, at least one heat sink 20, and a cooling medium (not shown) located inside heat sink 20. The first circuit board 1, the second circuit board 2, the first processor 11, the second processor 21, and the heat sink 20 are mounted on the chassis 10. It will be appreciated that the enclosure 10 is a three-dimensional structure having an interior space, for example, the enclosure 10 may include a top plate, a side plate, and a bottom plate, the top plate and the bottom plate being disposed opposite to each other, the side plate being connected to a periphery of the top plate and a periphery of the bottom plate, and the top plate, the side plate, and the bottom plate enclosing the interior space of the enclosure 10. The first circuit board 1 and the second circuit board 2 are stacked and fixed to each other to form a circuit board assembly 24, and the circuit board assembly 24 can be fixed to the chassis 10. Illustratively, the computing device 100 may also include a plurality of connectors 101, the plurality of connectors 101 fixedly connecting the circuit board assembly 24 with the chassis 10. Wherein the connection member 101 may be a stud or a screw, etc. In other embodiments, the circuit board assembly 24 may be secured to the chassis 10 by other means, which are not strictly limited in this application. It should be noted that fig. 1 and 2 only show a part of the structure of the chassis 10.

In some embodiments, the first circuit board 1 has a first board surface 12, the second circuit board 2 has a second board surface 22, the second board surface 22 is opposite to the first board surface 12, the first processor 11 is mounted on the first board surface 12 of the first circuit board 1, and the second processor 21 is mounted on the second board surface 22 of the second circuit board 2. The first processor 11 and the second processor 21 may be various processor chips (X Processing Unit, XPU), such as a central processing unit (Central Processing Unit, CPU), a graphics processor (Graphics Processing Unit, GPU), a data processor (Data Processing Unit, DPU), and the like, which generate a large amount of heat during operation. The first processor 11 and the second processor 21 may be different types of devices or the same type of device. Since the computing device 100 in the present embodiment adopts a stacked dual circuit board structure, the conventional heat sink cannot meet the heat dissipation requirement of the heat generating device on the dual circuit board. In addition, according to the working requirements of the computing device 100, the first circuit board 1 and/or the second circuit board 2 may further be provided with a memory bank 13, a resistor device, a capacitor device, and the like, which is not limited in this application.

In some embodiments, the heat dissipating device 20 may include a first heat sink 3, a second heat sink 4, a third heat sink 5, a first connection pipe 6, and a second connection pipe 7, where the first heat sink 3 is mounted on the first board 12 of the first circuit board 1, and the first heat sink 3 is used for dissipating heat of the first processor 11. The second heat sink 4 is mounted on the second board 22 of the second circuit board 2, the second heat sink 4 is used for dissipating heat of the second processor 21, and the first board 12 and the second board 22 are disposed opposite to each other. The first connecting pipe 6 connects the first radiator 3 and the third radiator 5, and the second connecting pipe 7 connects the second radiator 4 and the third radiator 5. The third radiator is used for radiating heat for the first radiator 3 and the second radiator 4. It will be appreciated that the first connection pipe 6 may be one or more, and the second connection pipe 7 may be one or more, which is not limited in this application.

In this embodiment, the first circuit board 1 and the second circuit board 2 are stacked, the first heat sink 3 is used for dissipating heat from the first processor 11 on the first circuit board 1, and the second heat sink 4 is used for dissipating heat from the second processor 21 on the second circuit board 2. The first connecting pipe 6 is connected with the first radiator 3 and the third radiator 5, the second connecting pipe 7 is connected with the second radiator 4 and the third radiator 5, therefore, the heat of the first radiator 3 can be transferred to the third radiator 5 through the first connecting pipe 6 to radiate, the heat of the second radiator 4 can be transferred to the third radiator 5 through the second connecting pipe 7 to radiate, the heat is prevented from accumulating around the first processor 11 and the second processor 21, the heat generated by the first processor 11 and the second processor 21 is favorably and rapidly discharged, the radiating performance of the whole radiating device 20 can be effectively improved, the radiating bottleneck problem of the computing device 100 can be solved, the lifting and evolution of XPU power consumption of the computing device 100 can be met only by adopting a low-cost or low-power radiator, and the total cost of the computing device 100 is further reduced.

In some embodiments, the first circuit board 1 and the second circuit board 2 are disposed at intervals, and a plurality of supporting members (not shown in the drawings) are disposed between the first circuit board 1 and the second circuit board 2, and the first circuit board 1 and the second circuit board 2 are fixed to each other by the plurality of supporting members. The first circuit board 1 may be further provided with a resistor, a capacitor, and other devices toward the board surface of the second circuit board 2, and the second circuit board 2 may be further provided with a resistor, a capacitor, and other devices toward the board surface of the first circuit board 1.

In some embodiments, the first circuit board 1 and the second circuit board 2 are stacked in a first direction Z to form a circuit board assembly 24, and the third heat sink 5 is located on one side of the circuit board assembly 24 and is arranged in a second direction X, which is perpendicular to the first direction Z. In the embodiment of the present application, the "first direction", "second direction" and "third direction" of the circuit board assembly 24 are descriptions of opposite directions, where the circuit board assembly 24 may be substantially rectangular, and the rectangular parallelepiped of the circuit board assembly 24 includes three faces approximately perpendicular to each other, and a direction parallel to one of the faces of the rectangular parallelepiped of the circuit board assembly 24 is the first direction, a direction parallel to the other face of the rectangular parallelepiped of the circuit board assembly 24 is the second direction, and a direction parallel to the third face of the rectangular parallelepiped of the circuit board assembly 24 is the third direction. In this embodiment, referring to fig. 1, the z direction is the first direction, the X direction is the second direction, and the Y direction is the third direction. In the related description, the relative orientations of the first direction, the second direction, and the third direction are similarly understood, and will not be described in detail.

In the present embodiment, the first circuit board 1 and the second circuit board 2 are stacked in the first direction Z, so that the space utilization of the computing device 100 in the first direction Z can be improved, and more electronic components can be laid out on the circuit board assembly 24, so that the circuit board assembly 24 is prevented from occupying a larger space in the second direction X or the third direction Y. In addition, the first radiator 3 and the second radiator 4 are arranged in the first direction Z of the circuit board assembly 24, and the third radiator 5 is located at one side of the circuit board assembly 24 and arranged in the second direction X, so that heat generated by the first processor 11 and the second processor 21 can be transferred to the third radiator 5 which is far away to one side of the circuit board assembly 24, which is helpful to increase the effective heat dissipation area of the heat dissipation device 20, and thus the heat dissipation efficiency of the heat dissipation device 20 can be increased.

In some embodiments, the first circuit board 1 and the second circuit board 2 are provided with through holes, and the through holes of the first circuit board 1 and the through holes of the second circuit board 2 are disposed opposite to each other. The heat sink 20 may further include a third connection pipe 8, the third connection pipe 8 being mounted to the through hole of the first circuit board 1 and the through hole of the second circuit board 2, the third connection pipe 8 connecting the first heat sink 3 and the second heat sink 4.

In this embodiment, the third connecting pipe 8 connects the first radiator 3 and the second radiator 4, so that heat can be transferred between the first radiator 3 and the second radiator 4 to achieve soaking effect, promote heat diffusion, and avoid heat accumulation on the first radiator 3 or the second radiator 4, thereby helping to improve the heat dissipation performance of the whole heat dissipation device 20.

In other embodiments, the third connecting pipe 8 may not be disposed on the heat dissipating device 20, and the first heat sink 3 and the second heat sink 4 may be independent from each other, and heat transfer therebetween is not performed.

In some embodiments, the heat sink 20 may further include a first support 91, a second support 92, and a fixing 93. One end of the first supporting member 91 is fixed to the first heat sink 3, and the other end of the first supporting member 91 is fixed to the third heat sink 5. One end of the second supporting member 92 is fixed to the second heat sink 4, and the other end of the second supporting member 92 is fixed to the third heat sink 5. The fixing member 93 is fixedly connected to the first supporting member 91, the circuit board assembly 24, and the second supporting member 92. The first supporting member 91 and the second supporting member 92 may have a substantially plate shape or a column shape, and the fixing member 93 may be a stud or the like. The first heat sink 3 and the second heat sink 4 may be fixed to the first circuit board 1 and the second circuit board 2, respectively, by fasteners such as screws.

In this embodiment, the first supporting member 91, the second supporting member 92 and the fixing member 93 may form a mounting bracket, and the third heat sink 5 is fixed with the first heat sink 3, the second heat sink 4 and the circuit board assembly 24 through the first supporting member 91, the second supporting member 92 and the fixing member 93, so that the fixing of the third heat sink 5 is more firm, which is helpful for improving the stability of the heat dissipating device 20.

In some embodiments, the heat dissipating device 20 may further include a fan (not shown in the drawings), where the fan is located in the second direction X of the circuit board assembly 24, that is, the fan is located on the same side or opposite side of the third heat sink 5, so as to avoid that other shielding components exist between the fan and the three heat sinks to affect heat dissipation of the fan, and wind of the fan may be blown by the third heat sink 5 to the first heat sink 3 and the second heat sink 4, or wind of the fan may be blown by the first heat sink 3 and the second heat sink 4 to the third heat sink 5 to take away heat of the three heat sinks, thereby enhancing heat dissipation performance of the heat dissipating device 20. In other embodiments, the fan may be mounted at other locations of the heat sink 20, which is not strictly limited in this application.

In some embodiments, the materials of the first heat spreader 3, the second heat spreader 4 and the third heat spreader 5 may be metal materials with good thermal conductivity, such as copper, aluminum, etc., so that the first heat spreader 3, the second heat spreader 4 and the third heat spreader 5 conduct heat and dissipate heat.

Referring to fig. 3 and 4 in combination, fig. 3 is a schematic structural diagram of a cross-section of the computing device 100 shown in fig. 1 taken along A-A in some embodiments, and fig. 4 is a schematic structural diagram of a portion of the heat sink 20 shown in fig. 1.

In some embodiments, the first radiator 3 has a first closed cavity 31, the second radiator 4 has a second closed cavity 41, and the first closed cavity 31 and the second closed cavity 41 are provided with a cooling medium. Wherein the cooling medium fills the inside of the first closed chamber 31 and the inside of the second closed chamber 41. The cooling working medium can be a medium such as deionized water, a mixed solution of glycol and water, and the like. The first radiator 3 may further include a first heat dissipation fin 32, where the first heat dissipation fin 32 is connected to the first closed cavity 31. The second heat sink 4 may further include a second heat radiating fin 42, and the second heat radiating fin 42 is connected to the second closed chamber 41.

In some embodiments, the first circuit board 1 and the second circuit board 2 are both fixed to the chassis 10, and the second circuit board 2 is located between the first circuit board 1 and the chassis 10. The first radiator 3 and the second radiator 4 are both mounted in the first direction Z of the chassis 10. The second closed cavity 41 of the second heat sink 4 is internally provided with a capillary structure. Wherein at least one side of the second closed chamber 41 close to the second processor 21 is provided with a capillary structure. Illustratively, the second enclosure 41 may include a first plate 411 and a second plate 412, the first plate 411 and the second plate 412 being disposed opposite each other, the first plate 411 being proximate the second processor 21 relative to the second plate 412. Wherein the first plate 411 may be provided with a capillary structure 43. The second closed chamber 41 is provided with a plurality of plate members 413, the plurality of plate members 413 are connected to the first plate 411, and the plurality of plate members 413 are each provided with a capillary structure 43. Among them, the capillary structure 43 may be formed by coating the surfaces of the first plate 411 and the plate 413 with copper porous particles, or sintering powder. A plurality of plate members 413 are at least partially submerged in the cooling medium. Wherein plate 413 may be a plate fin or a pin fin. Illustratively, plate 413 may be secured to first plate 411 by welding or the like, or plate 413 may be integrally formed with first plate 411. It should be noted that fig. 3 only illustrates the position of the capillary structure 43 on one plate 413.

In this embodiment, in the second radiator 4, due to the gravity in the first direction Z, the cooling medium in the second closed cavity 41 is mainly concentrated in the area of the second closed cavity 41 away from the second processor 21, which is unfavorable for the cooling medium to directly absorb the heat generated by the second processor 21 through the first plate 411. Capillary structure 43 is arranged on first plate 411, and capillary structure 43 is arranged on plate 413, first plate 411 is connected with plate 413, capillary structure 43 can guide cooling medium to first plate 411, and capillary structure 43 of first plate 411 can make the cooling medium evenly distributed on first plate 411, and the cooling medium in second closed cavity 41 can absorb heat from second processor 21 better. At the same time, the capillary structure 43 can also increase the number of vaporization cores of the cooling medium, so as to promote the evaporation and heat dissipation of the cooling medium in the second closed cavity 41, and improve the heat dissipation performance of the second radiator 4.

In other embodiments, the second closed cavity 41 may further include a side plate 414, where the side plate 414 is connected to the peripheral edges of the first plate 411 and the second plate 412, and the first plate 411, the second plate 412, and the side plate 414 enclose the second closed cavity 41. The side plate 414 may be provided with a capillary structure 43. The capillary structure 43 disposed on the side plate 414 and the first plate 411 may guide the cooling medium to the first plate 411, so that the cooling medium is uniformly distributed on the first plate 411, which is helpful for better absorbing heat from the second processor 21 by the cooling medium in the second closed cavity 41. In addition, the second plate 412 may also have a capillary structure 43, and the capillary structure 43 may further increase the number of vaporization cores of the cooling medium, so as to promote evaporation and heat dissipation of the cooling medium in the second closed cavity 41, so as to improve the heat dissipation performance of the second radiator 4.

In some embodiments, the first connecting pipe 6 may include a first hot flow pipe 61 and a first cold flow pipe 62, where the first hot flow pipe 61 is used to convey the warmed cooling medium from the first radiator 3 to the third radiator 5, and the first cold flow pipe 62 is used to convey the cooled cooling medium from the third radiator 5 to the first radiator 3. The second connection pipe 7 may include a second heat flow pipe 71 and a second cold flow pipe 72, the second heat flow pipe 71 being used for conveying the warmed cooling medium from the second radiator 4 to the third radiator 5, and the second cold flow pipe 72 being used for conveying the cooled cooling medium from the third radiator 5 to the second radiator 4.

In this embodiment, the first heat flow pipe 61 communicates the first radiator 3 with the third radiator 5, and the second heat flow pipe 71 communicates the second radiator 4 with the third radiator 5, so that the cooling medium heated in the first radiator 3 and the second radiator 4 can be introduced into the third radiator 5 for cooling. The first cold flow pipe 62 is communicated with the first radiator 3 and the third radiator 5, the second cold flow pipe 72 is communicated with the second radiator 4 and the third radiator 5, so that cooling working media cooled by the third radiator 5 return to the first radiator 3 and the second radiator 4 through the first cold flow pipe 62 and the second cold flow pipe 72 respectively, and the heat dissipation effect of the first radiator 3 and the second radiator 4 on the first processor 11 and the second processor 21 is improved.

In some embodiments, the third radiator 5 may include a radiating tube 51 and a fin 52, the radiating tube 51 is embedded in the fin 52, the first connecting tube 6 communicates the first radiator 3 with the radiating tube 51, and the second connecting tube 7 communicates the second radiator 4 with the radiating tube 51. In this embodiment, the first connecting pipe 6 is connected to the first radiator 3 and the radiating pipe 51, the second connecting pipe 7 is connected to the second radiator 4 and the radiating pipe 51, so that the warmed cooling medium in the first radiator 3 and the second radiator 4 can be led into the radiating pipe 51 of the third radiator 5 to be cooled, and the cooled cooling medium returns to the first radiator 3 and the second radiator 4 through the first connecting pipe 6 and the second connecting pipe 7, respectively, so as to improve the heat dissipation effect of the first radiator 3 and the second radiator 4 on the first processor 11 and the second processor 21.

In some embodiments, the radiating pipe 51 may include a first port 511 for receiving the warmed cooling medium and a second port 512 for outputting the cooled cooling medium. Illustratively, the radiating pipe 51 may be an integral U-shaped pipe that opens toward the circuit board assembly 24. The radiating pipe 51 may have other shapes, for example, various shapes such as a spiral shape.

In some embodiments, the first hot runner 61 communicates the first enclosed cavity 31 with the first port 511, and the first cold runner 62 communicates the first enclosed cavity 31 with the second port 512. In this embodiment, the first heat flow pipe 61 communicates the first closed cavity 31 with the first port 511, and the warmed cooling medium in the first closed cavity 31 may enter the first port 511 through the first heat flow pipe 61 to be cooled in the third radiator 5. The first cold flow pipe 62 is communicated with the first closed cavity 31 and the second port 512, and the cooling working medium in the third radiator 5 can return to the first closed cavity 31 through the first cold flow pipe 62, so that circulation of the cooling working medium between the first radiator 3 and the third radiator 5 is realized, and the heat dissipation efficiency of the heat dissipation device 20 is improved.

In some embodiments, at least one of the first hot flow tube 61 and the first cold flow tube 62 is provided with a pump (not shown in the figures), wherein the first hot flow tube 61 is provided with a pump, or the first cold flow tube 62 is provided with a pump, or both the first hot flow tube 61 and the first cold flow tube 62 are provided with a pump.

In some embodiments, referring to fig. 4, the first cold flow pipe 62 may be provided with a pump 63, a first section 621 of the first cold flow pipe 62 connects the pipe of the first radiator 3 with the pump 63, and a second section 622 of the first cold flow pipe 62 connects the pump 63 with the third radiator 5. Illustratively, the pump 63 may be located between the first heat sink 3 and the third heat sink 5, or on a side of the first heat sink 3 facing away from the first circuit board 1, or on a side of the third heat sink 5 facing away from the chassis 10, or elsewhere. In this embodiment, the pump 63 provides power to make the cooled cooling medium in the second port 512 smoothly flow back to the first closed cavity 31 through the first cold flow pipe 62.

In some embodiments, the second hot runner 71 communicates the second enclosed cavity 41 with the first port 511 and the second cold runner 72 communicates the second enclosed cavity 41 with the second port 512. In this embodiment, the second heat flow pipe 71 communicates the second closed cavity 41 with the first port 511, and the warmed cooling medium in the second closed cavity 41 may enter the first port 511 through the second heat flow pipe 71 to be cooled in the third radiator 5. The second cold flow pipe 72 is communicated with the second closed cavity 41 and the second port 512, and cooled cooling working medium in the third radiator 5 can return to the second closed cavity 41 through the second cold flow pipe 72, so that circulation of the cooling working medium between the second radiator 4 and the third radiator 5 is realized, and the radiating efficiency of the radiating device 20 is improved.

In some embodiments, at least one of the second hot flow tube 71 and the second cold flow tube 72 is provided with a pump (not shown in the figures), wherein the second hot flow tube 71 is provided with a pump, or the second cold flow tube 72 is provided with a pump, or both the second hot flow tube 71 and the second cold flow tube 72 are provided with a pump. In this embodiment, the pump may drive the cooling medium to circulate between the first radiator 3 and the third radiator 5, and drive the cooling medium to circulate between the second radiator 4 and the third radiator 5, thereby improving the heat dissipation efficiency of the heat dissipation device 20.

In some embodiments, the third connecting pipe 8 may include a third heat flow pipe 81 and a third cold flow pipe 82, where the third heat flow pipe 81 connects the first radiator 3 and the second radiator 4, so that the cooling medium in the first radiator 3 may flow to the second radiator 4. The third cold flow pipe 82 connects the first radiator 3 and the second radiator 4, and the third hot flow pipe 81 and/or the third cold flow pipe 82 are provided with pumps, so that the cooling medium in the second radiator 4 can flow in the first radiator 3. The first radiator 3 and the second radiator 4 form a loop through the third heat flow pipe 81 and the third cold flow pipe 82, and cooling working mediums inside the first radiator 3 and the second radiator 4 can flow mutually, so that soaking effect is realized, and heat diffusion is promoted. The third connection pipe 8 may not be provided in the heat sink 20, and the present application is not limited thereto.

In some embodiments, the first connection tube 6, the second connection tube 7, and the third connection tube 8 may be flexible tubes. In this embodiment, the first connecting pipe 6, the second connecting pipe 7 and the third connecting pipe 8 are flexible pipes, and the first connecting pipe 6, the second connecting pipe 7 and the third connecting pipe 8 can be bent into any shape, so that the first connecting pipe 6, the second connecting pipe 7 and the third connecting pipe 8 are convenient to be installed and arranged in the heat dissipating device 20. In other embodiments, the first connecting pipe 6, the second connecting pipe 7 and the third connecting pipe 8 may be rigid pipes, which is not strictly limited in this application. It should be noted that, in fig. 4, only one installation arrangement of the first connection pipe 6, the second connection pipe 7, and the third connection pipe 8 is illustrated, and in other embodiments, the installation arrangement of the first connection pipe 6, the second connection pipe 7, and the third connection pipe 8 may be adjusted according to actual needs.

In other embodiments, the first heat sink 3 and the second heat sink 4 may be heat pipe type heat sinks. Wherein the first closed cavity 31 of the first heat sink 3 may be a heat pipe. The second closed cavity 41 of the second radiator 4 may be a heat pipe, and the inner wall of the heat pipe of the second radiator 4 may be provided with a capillary structure to guide the cooling medium to the side of the heat pipe close to the second processor 21, which is not strictly limited in the specific type of the first radiator 3 and the second radiator 4.

Referring to fig. 3 and 5 in combination, fig. 5 is a schematic cross-sectional partial structure of the computing device 100 of fig. 1 taken along A-A in other embodiments.

In some embodiments, the heat dissipating device 20 may further include a first heat sink 3, a second heat sink 4, a third heat sink 5, a first connection pipe 6, and a second connection pipe 7. The first heat sink 3 is fixed on the first surface 12 of the first circuit board 1, the second heat sink 4 is fixed on the second surface 22 of the second circuit board 2, and the first heat sink 3 is disposed opposite to the second heat sink 4. The first connecting pipe 6 connects the first radiator 3 and the third radiator 5, and the second connecting pipe 7 connects the second radiator 4 and the third radiator 5. The present embodiment may include most of the technical features of the foregoing embodiments, and the differences between the two are mainly described below, and most of the same contents of the two will not be described again.

In some embodiments, the third heat sink 5 may be a vacuum cavity heat sink. The third heat sink 5 may include a cooling cavity 53 and fins 52, the fins 52 connecting the cooling cavity 53, for example. The cooling cavity 53 is a closed cavity, and the cooling cavity 53 is used for cooling the warmed cooling medium. The first connecting pipe 6 communicates the first radiator 3 with the cooling chamber 53, and the second connecting pipe 7 communicates the second radiator 4 with the cooling chamber 53.

In this embodiment, the first connecting pipe 6 is connected to the first radiator 3 and the cooling cavity 53, the second connecting pipe 7 is connected to the second radiator 4 and the cooling cavity 53, so that the warmed cooling medium in the first radiator 3 and the second radiator 4 can be led into the cooling cavity 53 of the third radiator 5 to be cooled, and the cooled cooling medium returns to the first radiator 3 and the second radiator 4 through the first connecting pipe 6 and the second connecting pipe 7, respectively, so as to improve the heat dissipation effect of the first radiator 3 and the second radiator 4 on the first processor 11 and the second processor 21.

In some embodiments, cooling chamber 53 has a first inlet 531 for receiving warmed cooling medium and a first outlet 532 for outputting cooled cooling medium, wherein first inlet 531 is configured to receive warmed cooling medium. The first hot runner 61 communicates the first closed chamber 31 with the first inlet 531 of the cooling chamber 53 and the first cold runner 62 communicates the first closed chamber 31 with the first outlet 532 of the cooling chamber 53. In this embodiment, the first heat flow pipe 61 communicates the first closed cavity 31 with the first inlet 531, and the warmed cooling medium in the first closed cavity 31 may enter the first port 511 through the first heat flow pipe 61 to be cooled in the third radiator 5. The first cold flow pipe 62 is communicated with the first closed cavity 31 and the first outlet 532, and the cooling working medium in the third radiator 5 can return to the first closed cavity 31 through the first cold flow pipe 62, so that circulation of the cooling working medium between the first radiator 3 and the third radiator 5 is realized, and the heat dissipation efficiency of the heat dissipation device 20 is improved.

In some embodiments, the second hot runner 71 communicates the second enclosed cavity 41 with the first inlet 531 of the cooling cavity 53 and the second cold runner 72 communicates the second enclosed cavity 41 with the first outlet 532 of the cooling cavity 53. In this embodiment, the second heat flow pipe 71 communicates the second closed cavity 41 with the first inlet 531, and the warmed cooling medium in the second closed cavity 41 may enter the first inlet 531 through the second heat flow pipe 71, and be cooled in the third radiator 5. The second cold flow pipe 72 is communicated with the second closed cavity 41 and the first outlet 532, and cooled cooling working medium in the third radiator 5 can return to the second closed cavity 41 through the second cold flow pipe 72, so that circulation of the cooling working medium between the second radiator 4 and the third radiator 5 is realized, and the radiating efficiency of the radiating device is improved.

In some embodiments, at least one of the first hot flow tube 61 and the first cold flow tube 62 is provided with a pump (not shown in the figures), wherein the first hot flow tube 61 is provided with a pump, or the first cold flow tube 62 is provided with a pump, or both the first hot flow tube 61 and the first cold flow tube 62 are provided with a pump. At least one of the second hot flow tube 71 and the second cold flow tube 72 is provided with a pump (not shown in the figure), wherein the second hot flow tube 71 is provided with a pump, or the second cold flow tube 72 is provided with a pump, or both the second hot flow tube 71 and the second cold flow tube 72 are provided with a pump. In this embodiment, the pump may drive the cooling medium to circulate between the first radiator 3 and the third radiator 5, and drive the cooling medium to circulate between the second radiator 4 and the third radiator 5, thereby improving the heat dissipation efficiency of the heat dissipation device 20.

Referring to fig. 6 to 8 in combination, fig. 6 is a schematic diagram of a portion of a structure of a computing device 100 in other embodiments according to an embodiment of the present application, fig. 7 is a schematic diagram of a portion of a structure of a cross section of the computing device 100 shown in fig. 6 taken along B-B at another angle, and fig. 8 is a schematic diagram of a structure of a cross section of the computing device 100 shown in fig. 6 taken along C-C at another angle. Fig. 7 is a schematic view showing a cross section of the structure shown in fig. 6 taken along B-B, and the structure shown in fig. 6 is rotated by a certain angle for clarity. Fig. 8 is a schematic view showing a cross section of the structure shown in fig. 6 taken along C-C, with the structure shown in fig. 6 rotated at an angle for clarity. The present embodiment may include most of the technical features of the foregoing embodiments, and the differences between the two are mainly described below, and most of the same contents of the two will not be described again.

In some embodiments, the computing device 100 may include a chassis 10, a first circuit board 1, a second circuit board 2, a first processor 11, a second processor 21, and at least one heat sink 20, wherein the first circuit board 1, the second circuit board 2, and the heat sink 20 are mounted to the chassis 10. The heat sink 20 may include a first heat sink 3, a second heat sink 4, a third heat sink 5, a first connection pipe 6, and a second connection pipe 7. The first circuit board 1 and the second circuit board 2 are stacked and fixed to each other. The first heat sink 3 and the first processor 11 are both mounted to the first board surface 12 of the first circuit board 1. The second heat sink 4 and the second processor 21 are both mounted on a second board surface 22 of the second circuit board 2, and the second board surface 22 and the first board surface 12 are disposed opposite to each other. The first connecting pipe 6 connects the first radiator 3 and the third radiator 5, and the second connecting pipe 7 connects the second radiator 4 and the third radiator 5. The first heat sink 3 is used for radiating heat for the first processor 11, the second heat sink 4 is used for radiating heat for the second processor 21, and the third heat sink 5 is used for radiating heat for the first heat sink 3 and the second heat sink 4.

In some embodiments, the first heat sink 3 may include a first closed cavity 31 and a first heat dissipation fin 32, the first heat dissipation fin 32 being connected to the first closed cavity 31. The second heat sink 4 may include a second closed cavity 41 and a second heat radiating fin 42, the second heat radiating fin 42 connecting the second closed cavity 41. The first and second closed chambers 31, 41 are provided with a cooling medium. Wherein the cooling medium fills the inside of the first closed chamber 31 and the inside of the second closed chamber 41.

In some embodiments, the first circuit board 1 and the second circuit board 2 are both fixed to the chassis 10 and perpendicular to the chassis 10, and the first radiator 3 and the second radiator 4 are both mounted in the third direction Y of the chassis 10. The surface of the first closed cavity 31 near the first processor 11 is provided with a capillary structure 33, and the surface of the second closed cavity 41 near the second processor 21 is provided with a capillary structure 43.

In this embodiment, when the first radiator 3 and the second radiator 4 are both located in the third direction Y of the chassis 10, the cooling medium in the first closed chamber 31 and the second closed chamber 41 is mainly concentrated in the region of the first closed chamber 31 and the second closed chamber 41 near the side of the chassis 10 due to the gravity in the third direction Y, which is disadvantageous in that the cooling medium directly absorbs heat from the first processor 11 or the second processor 21. The surface of the first closed cavity 31, which is close to the first processor 11, is provided with a capillary structure 33, and the capillary structure 33 can guide the cooling working medium to the surface of the first closed cavity 31, which is close to the first processor 11, so as to promote the heat absorption and evaporation of the cooling working medium in the first closed cavity 31, and improve the heat dissipation performance of the first radiator 3. The surface of the second closed cavity 41, which is close to the second processor 21, is provided with a capillary structure 43, and the capillary structure 43 can guide the cooling working medium to the surface of the second closed cavity 41, which is close to the second processor 21, so as to promote the heat absorption and evaporation of the cooling working medium in the second closed cavity 41, and improve the heat dissipation performance of the second radiator 4.

In some embodiments, the third heat sink 5 is exemplified as a heat pipe type heat sink. The third radiator 5 may include a fin 52 and a radiating pipe 51 embedded in the fin 52, the first connection pipe 6 communicates the first radiator 3 with the radiating pipe 51, and the second connection pipe 7 communicates the second radiator 4 with the radiating pipe 51. Illustratively, the radiating pipe 51 may be an integral U-shaped pipe that opens toward the side of the circuit board assembly 24. The radiating pipe 51 may have other shapes, such as a variety of shapes including a long strip shape and a spiral shape.

In some embodiments, the first connection tube 6 may include a first hot flow tube 61 and a first cold flow tube 62, the first hot flow tube 61 facing away from the chassis 10 than the first cold flow tube 62. The first heat flow pipe 61 is communicated with the first closed cavity 31 and the radiating pipe 51, and the warmed cooling working medium in the first closed cavity 31 can enter the radiating pipe 51 through the first heat flow pipe 61 for cooling. The first cold flow pipe 62 is communicated with the first closed cavity 31 and the radiating pipe 51, and the cooled cooling working medium in the radiating pipe 51 can return to the first closed cavity 31 through the first cold flow pipe 62, so that circulation of the cooling working medium between the first radiator 3 and the third radiator 5 is realized, and the radiating efficiency of the radiating device 20 is improved. The second hot flow tube 71 (not shown) and the second cold flow tube 72 of the second connection tube 7 may refer to the arrangement of the first connection tube 6, and will not be described in detail in this application.

In other embodiments, the first radiator 3 and the second radiator 4 may be other types of radiators, such as a heat pipe radiator, where the inner walls of the heat pipe of the first radiator 3 and the heat pipe of the second radiator 4 are provided with capillary structures to guide the cooling medium to the side of the heat pipe close to the heat generating device. The third radiator 5 may be another type of radiator, such as a vacuum radiator, etc. The specific types of the first radiator 3, the second radiator 4, and the third radiator 5 are not strictly limited in this application.

Referring to fig. 9 to 10 in combination, fig. 9 is a schematic diagram illustrating a partial structure of a computing device 100 in still other embodiments according to an embodiment of the present application, and fig. 10 is a schematic diagram illustrating a cross-sectional structure of the computing device 100 shown in fig. 9 taken along the line D-D. The present embodiment may include most of the technical features of the foregoing embodiments, and the differences between the two are mainly described below, and most of the same contents of the two will not be described again.

In some embodiments, the specific structures of the first heat sink 3 and the second heat sink 4 may be set up according to the first embodiment, and the third heat sink 5 is exemplified as a heat pipe type heat sink. The third radiator 5 may include a first radiating pipe 513, a second radiating pipe 514, and a fin 52. The fins 52 may include a first fin 521 and a second fin 522, the first radiating pipe 513 is embedded in the first fin 521, and the second radiating pipe 514 is embedded in the second fin 522. For example, the first radiating pipe 513 and the first fin 521 may be an integrated structural member, and the second radiating pipe 514 and the second fin 522 may be an integrated structural member. The third heat sink 5 may further include a heat conductive member 54, the heat conductive member 54 connecting the first fin 521 and the second fin 522. By way of example, the thermally conductive member 54 may be a thermal interface material such as a carbon fiber thermal pad, a thermal silicone pad, silicone grease, gel, phase change thermal conductive material, or the like. The first connection pipe 6 communicates the first radiating pipe 513 with the pipe of the first radiator 3, and the second connection pipe 7 communicates the second radiating pipe 514 with the pipe of the second radiator 4.

In this embodiment, the first radiating pipe 513 and the second radiating pipe 514 of the third radiator 5 are not communicated with each other, the first radiating pipe 513 is embedded in the first fin 521, the second radiating pipe 514 is embedded in the second fin 522, and the heat conducting member 54 connects the first fin 521 and the second fin 522. That is, the first heat radiating pipe 513 and the second heat radiating pipe 514 can perform heat transfer through the first fin 521, the second fin 522, and the heat conductive member 54, thereby realizing a soaking effect, promoting heat diffusion, and avoiding heat accumulation in the first heat radiating pipe 513 or the second heat radiating pipe 514, thereby contributing to improvement of the heat radiation performance of the third heat radiator 5. In addition, the third radiator 5 can be divided into two parts, and assembled with the first radiator 3 and the second radiator 4 respectively, so that the installation mode of the third radiator 5 is more flexible.

In other embodiments, the third heat sink 5 may not be provided with the heat conducting member 54, and the first fin 521 abuts against the second fin 522, and heat is transferred between the first fin 521 and the second fin 522 by contact, which is not strictly limited in this application.

In other embodiments, the third radiator 5 may also include a first radiating pipe 513, a second radiating pipe 514 and a fin 52, the first connecting pipe 6 communicates with the first radiating pipe 513 and the first radiator 3, the second connecting pipe 7 communicates with the second radiating pipe 514 and the second radiator 4, and the first radiating pipe 513 and the second radiating pipe 514 are both embedded in the fin 52. For example, the first radiating pipe 513, the second radiating pipe 514, and the fin 52 may be an integrated structure.

In this embodiment, the first heat dissipating tube 513 and the second heat dissipating tube 514 of the third heat sink 5 are not communicated with each other, and the first heat dissipating tube 513 and the second heat dissipating tube 514 are embedded in the fins 52, that is, the first heat dissipating tube 513 and the second heat dissipating tube 514 can transfer heat through the fins 52, so as to achieve soaking effect, promote heat diffusion, and avoid heat accumulation on the first heat dissipating tube 513 or the second heat dissipating tube 514, thereby helping to improve the heat dissipation performance of the third heat sink 5.

In some embodiments, the first radiating pipe 513 and the second radiating pipe 514 may each be an integral U-shaped pipe that is open toward the side of the circuit board assembly 24. The first radiating pipe 513 may include a first pipe 5131, a second pipe 5132, and a third pipe 5133, where the first pipe 5131 faces away from the chassis 10 compared to the second pipe 5132, and the third pipe 5133 connects the first pipe 5131 and the second pipe 5132. The first connecting pipe 6 may include a first heat flow pipe 61 and a first cold flow pipe 62, where the first heat flow pipe 61 communicates the first closed cavity 31 with the first pipe 5131, and the warmed cooling medium in the first closed cavity 31 may enter the third radiator 5 through the first heat flow pipe 61 for cooling. The first cold flow pipe 62 is communicated with the first closed cavity 31 and the second pipe 5132, and the cooled cooling working medium in the third radiator 5 can return to the first closed cavity 31 through the first cold flow pipe 62, so that circulation of the cooling working medium between the first radiator 3 and the third radiator 5 is realized, and the heat dissipation efficiency of the heat dissipation device 20 is improved. The second radiating pipe 514 is similar to the first radiating pipe 513, the second radiating pipe 514 may be set with reference to the first radiating pipe 513, and the second hot flow pipe 71 and the second cold flow pipe 72 of the second connecting pipe 7 may be set with reference to the first connecting pipe 6, which will not be described in detail herein.

In other embodiments, the first radiating pipe 513 and the second radiating pipe 514 may have other shapes, such as various shapes including an elongated shape, a spiral shape, and the like. The first radiator 3 and the second radiator 4 may also be other types of radiators, such as heat pipe type radiator, wherein the inner walls of the heat pipes of the first radiator 3 and the second radiator 4 may be provided with capillary structures to guide the cooling medium to the side of the radiating pipe 51 close to the second processor 21. The third radiator 5 may also be another type of radiator, for example the third radiator 5 may comprise two cooling chambers which are not in communication with each other, the two cooling chambers being connected by fins. The present application is not strictly limited thereto.

Referring to fig. 11, fig. 11 is a schematic diagram illustrating a portion of the computing device 100 shown in fig. 1 in other embodiments. The present embodiment may include most of the technical features of the foregoing embodiments, and the differences between the two are mainly described below, and most of the same contents of the two will not be described again.

In some embodiments, the computing device 100 may include a first circuit board 1 and a second circuit board 2, a plurality of first processors 11, and a plurality of second processors 21 (please refer to fig. 2 in combination). The first circuit board 1 and the second circuit board 2 are stacked and fixed, the first processors 11 are mounted on the first board surface 12 of the first circuit board 1, the second processors 21 are mounted on the second board surface 22 of the second circuit board 2, and the second board surface 22 and the first board surface 12 are arranged opposite to each other. The heat sink 20 may further include a plurality of first heat sinks 3, a plurality of second heat sinks 4, a plurality of third heat sinks 5, a plurality of first connection pipes 6, and a plurality of second connection pipes 7. The plurality of first heat sinks 3 are mounted on the first board surface 12 of the first circuit board 1, and the plurality of first heat sinks 3 are respectively used for radiating heat for the plurality of first processors 11. The second heat sinks 4 are all installed on the second board surface 22 of the second circuit board 2, the second heat sinks 4 are respectively used for dissipating heat for the second processors 21, and the first heat sinks 3 can be arranged opposite to the second heat sinks 4 one by one. The first connecting pipes 6 are respectively connected with the first radiators 3 and the third radiators 5, and the second connecting pipes 7 are respectively connected with the first radiators 3 and the third radiators 5.

In this embodiment, the solution for enhancing the heat dissipation performance of the first heat sink 3 and the second heat sink 4 through the third heat sink 5 that is far away can be applied to various application scenarios, so as to meet the heat dissipation requirement when the first circuit board 1 and/or the second circuit board 2 have a plurality of heat generating devices thereon.

Referring to fig. 12, fig. 12 is a schematic diagram illustrating a portion of the computing device 100 of fig. 1 in alternative embodiments. The present embodiment may include most of the technical features of the foregoing embodiments, and the differences between the two are mainly described below, and most of the same contents of the two will not be described again.

In some embodiments, the heat dissipation device 20 further includes a plurality of first heat sinks 3, a plurality of second heat sinks 4, a third heat sink 5, a plurality of first connection pipes 6 and a plurality of second connection pipes 7, wherein the plurality of first heat sinks 3 are respectively mounted on the first surface 12 of the first circuit board 1, and the plurality of first heat sinks 3 are respectively used for dissipating heat for the plurality of first processors 11 (please refer to fig. 2). The second heat sinks 4 are all installed on the second board surface 22 of the second circuit board 2, the second heat sinks 4 are respectively used for dissipating heat for the second processors 21, and the first heat sinks 3 can be arranged opposite to the second heat sinks 4 one by one. The first connecting pipes 6 are respectively connected with the first radiators 3 and the third radiators 5, and the second connecting pipes 7 are respectively connected with the first radiators 3 and the third radiators 5.

In this embodiment, the plurality of first processors 11 and the plurality of second processors 21 can share one third heat sink 5 to realize remote heat dissipation, the number of the third heat sinks 5 arranged in the heat dissipation device 20 is smaller, the space occupation rate of the heat dissipation device 20 in the computing device 100 is smaller, and the total cost is lower.

The above embodiments are merely for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. The computing device is characterized by comprising a first circuit board, a second circuit board, a first processor, a second processor, a heat dissipation device and a cooling working medium; the cooling medium is positioned in the heat dissipation device; the heat dissipation device comprises a first heat radiator, a second heat radiator, a third heat radiator, a first connecting pipe and a second connecting pipe;

The first processor and the first radiator are mounted on a first plate surface of the first circuit board;

the second processor and the second radiator are mounted on a second plate surface of the second circuit board; wherein the first plate surface and the second plate surface are arranged opposite to each other;

the first radiator is used for radiating heat for the first processor; the second radiator is used for radiating heat for the second processor;

the first connecting pipe is connected with the first radiator and the third radiator;

the second connecting pipe is connected with the second radiator and the third radiator;

the third radiator is used for radiating heat for the first radiator and the second radiator.

2. The computing device of claim 1, wherein the computing device is configured to,

the heat dissipation device further comprises a third connecting pipe, and the third connecting pipe is communicated with the first radiator and the second radiator.

3. The computing device of claim 1 or 2, wherein the computing device is configured to,

the first radiator is provided with a first closed cavity; the second radiator is provided with a second closed cavity; the first closed cavity and the second closed cavity are provided with the cooling working medium.

4. A computing device as claimed in claim 3, wherein a side of the second enclosure adjacent the second processor is provided with a capillary structure.

5. The computing device of claim 3 or 4, wherein the computing device is configured to,

the first connecting pipe comprises a first hot flow pipe and a first cold flow pipe; the first heat flow pipe is used for conveying the warmed cooling working medium from the first radiator to the third radiator; the first cold flow pipe is used for conveying cooled cooling working medium from the third radiator to the first radiator;

the second connecting pipe comprises a second hot flow pipe and a second cold flow pipe; the second heat flow pipe is used for conveying the warmed cooling working medium from the second radiator to the third radiator; the second cold flow pipe is used for conveying cooled cooling working medium from the third radiator to the second radiator.

6. The computing device of claim 5, wherein the computing device is configured to,

the third radiator comprises fins and radiating pipes embedded in the fins; the radiating pipes are used for cooling the warmed cooling working medium;

the first connecting pipe is communicated with the first radiator and the radiating pipe;

The second connecting pipe is communicated with the second radiator and the radiating pipe.

7. The computing device of claim 6, wherein the computing device is configured to,

the radiating pipe is provided with a first port and a second port; the first port is used for receiving the warmed cooling working medium; the second port is used for outputting the cooled cooling working medium;

the first heat flow pipe is communicated with the first closed cavity and a first port of the radiating pipe;

the first cold flow pipe is communicated with the first closed cavity and the second port of the radiating pipe;

the second heat flow pipe is communicated with the second closed cavity and the first port of the radiating pipe;

the second cold flow pipe is communicated with the second closed cavity and the second port of the radiating pipe.

8. The computing device of claim 5, wherein the computing device is configured to,

the third radiator comprises a cooling cavity and fins; the fins are connected with the cooling cavity; the cooling cavity is used for cooling the warmed cooling working medium;

the first connecting pipe is communicated with the first radiator and the cooling cavity;

the second connecting pipe is communicated with the second radiator and the cooling cavity.

9. The computing device of claim 8, wherein the computing device is configured to,

The cooling cavity has a first inlet and a first outlet; the first inlet is used for receiving the warmed cooling working medium; the first outlet is used for outputting cooled cooling working medium;

the first heat flow pipe is communicated with the first closed cavity and the first inlet of the cooling cavity;

the first cold flow pipe is communicated with the first closed cavity and a first outlet of the cooling cavity;

the second heat flow pipe is communicated with the second closed cavity and the first inlet of the cooling cavity;

the second cold flow pipe is communicated with the second closed cavity and the first outlet of the cooling cavity.

10. The computing device of any one of claim 5 to 9,

at least one of the first hot runner pipe and the first cold runner pipe is provided with a pump; at least one of the second hot runner tube and the second cold runner tube is provided with a pump.