CN116466217A - Multi-port radio frequency microwave chip testing method and device - Google Patents
Multi-port radio frequency microwave chip testing method and device Download PDFInfo
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Abstract
The invention provides a method and a device for testing a multi-port radio frequency microwave chip, wherein the method comprises the following steps: controlling a plurality of modularized instruments integrated in an integrated test system to test different chip parameters of a tested piece so as to obtain a parameter test result; acquiring an actual reflection coefficient and a test reflection coefficient of a tested piece according to a parameter test result; the tested piece comprises an open circuit, a short circuit and a load; the test reflection coefficient of the load is not equal to 0; calculating a single-port error term of the 8-term error model according to the actual reflection coefficient and the test reflection coefficient so as to calculate an error correction T parameter matrix corresponding to each of the two ports according to the single-port error term; s parameters of the clamp are calculated according to the actual reflection coefficient and the test reflection coefficient; and calibrating and correcting the parameter test result according to the error correction T parameter matrix and the S parameter of the clamp, which are respectively corresponding to the two ports. According to the scheme, the testing efficiency and the testing precision of the multi-port radio frequency microwave chip can be improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of chip testing, in particular to a multi-port radio frequency microwave chip testing method and device.
Background
With the demand traction of new generation communication technologies such as 5G and low-orbit satellite communication, and with the rapid development and progress of semiconductor manufacturing processes, the operating frequency of related rf microwave components is gradually increased, the functional integration level is continuously increased, the test ports are gradually increased, and the complexity of test items is continuously increased. Among these, the beamforming chip is the most typical one, and a plurality of sets of radio frequency devices are integrated therein. In the face of such complex chips, a more complete index system is needed to evaluate their performance.
At present, a plurality of instruments are needed to be connected with the multi-port radio frequency microwave chip and tested, the current instrument is needed to be manually dismantled after the current instrument is tested, and the next instrument is manually connected to test the next parameter, so that the test efficiency is low. And the calibration mode used in the test process is too complex, and the test precision is lower.
Therefore, it is desirable to provide a method that satisfies both the test efficiency and the test accuracy.
Disclosure of Invention
The embodiment of the invention provides a method and a device for testing a multi-port radio frequency microwave chip, which can improve the testing efficiency and the testing precision of the multi-port radio frequency microwave chip.
In a first aspect, an embodiment of the present invention provides a method for testing a multiport rf microwave chip, including:
controlling a plurality of modularized instruments integrated in an integrated test system to test different chip parameters of a tested piece so as to obtain a parameter test result;
according to the parameter test result, obtaining the actual reflection coefficient and the test reflection coefficient of the tested piece; the tested piece comprises an open circuit, a short circuit and a load; the test reflection coefficient of the load is not equal to 0;
calculating a single-port error term of an 8-term error model according to the actual reflection coefficient and the test reflection coefficient so as to calculate an error correction T parameter matrix corresponding to the two ports respectively according to the single-port error term;
s parameters of the clamp are calculated according to the actual reflection coefficient and the test reflection coefficient;
and calibrating and correcting the parameter test result according to the error correction T parameter matrix and the S parameter of the clamp, which are respectively corresponding to the two ports.
In a second aspect, an embodiment of the present invention further provides a multi-port rf microwave chip testing apparatus, including:
the control unit is used for controlling a plurality of modularized instruments integrated in the integrated test system so as to test different chip parameters of the tested piece and obtain a parameter test result;
the acquisition unit is used for acquiring the actual reflection coefficient and the test reflection coefficient of the tested piece according to the parameter test result; the tested piece comprises an open circuit, a short circuit and a load; the test reflection coefficient of the load is not equal to 0;
the first calculation unit is used for calculating a single-port error term of the 8-term error model according to the actual reflection coefficient and the test reflection coefficient so as to calculate an error correction T parameter matrix corresponding to the two ports respectively according to the single-port error term;
the second calculation unit is used for calculating the S parameter of the clamp according to the actual reflection coefficient and the test reflection coefficient;
and the calibration correction unit is used for correcting and correcting the parameter test result according to the error correction T parameter matrix and the S parameter of the clamp, which are respectively corresponding to the two ports.
In a third aspect, an embodiment of the present invention further provides an electronic device, including a memory and a processor, where the memory stores a computer program, and when the processor executes the computer program, the method described in any embodiment of the present specification is implemented.
In a fourth aspect, embodiments of the present invention also provide a computer-readable storage medium having stored thereon a computer program which, when executed in a computer, causes the computer to perform a method according to any of the embodiments of the present specification.
The embodiment of the invention provides a multi-port radio frequency microwave chip testing method and device, which are characterized in that a plurality of modularized instruments are integrated to form an integrated testing system, and the modularized instruments in the integrated testing system are controlled by a control algorithm to test different chip parameters of a tested piece, so that manual switching is not needed, and the testing efficiency can be improved; in addition, the single-port error item of the 8-item error model and the S parameter of the clamp are calculated through the actual reflection system and the test reflection coefficient, so that the QSOT method and the OSL method are optimized in calculation precision, and the calibration and correction of the test result are realized by utilizing the higher-precision error correction T parameter matrix and the S parameter of the clamp. Therefore, the scheme can not only meet the test efficiency of the multi-port radio frequency microwave chip, but also ensure the test precision.
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In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for testing a multi-port RF microwave chip according to an embodiment of the present invention;
FIG. 2 is a hardware architecture diagram of an electronic device according to an embodiment of the present invention;
fig. 3 is a block diagram of a multi-port rf microwave chip testing apparatus according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present invention are within the scope of protection of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a method for testing a multi-port rf microwave chip, including:
step 100, controlling a plurality of modularized instruments integrated in an integrated test system to test different chip parameters of a tested piece, so as to obtain a parameter test result;
102, acquiring an actual reflection coefficient and a test reflection coefficient of a tested piece according to the parameter test result; the tested piece comprises an open circuit, a short circuit and a load; the test reflection coefficient of the load is not equal to 0;
104, calculating a single-port error term of an 8-item error model according to the actual reflection coefficient and the test reflection coefficient, so as to calculate an error correction T parameter matrix corresponding to the two ports respectively according to the single-port error term;
step 106, calculating the S parameter of the clamp according to the actual reflection coefficient and the test reflection coefficient;
and step 108, calibrating and correcting the parameter test result according to the error correction T parameter matrix and the S parameter of the clamp, which are respectively corresponding to the two ports.
In the embodiment of the invention, the integrated test system is formed by integrating a plurality of modularized instruments, and the modularized instruments in the integrated test system are controlled by the control algorithm to test different chip parameters of the tested piece, so that the test efficiency can be improved without manual switching; in addition, the single-port error item of the 8-item error model and the S parameter of the clamp are calculated through the actual reflection system and the test reflection coefficient, so that the QSOT method and the OSL method are optimized in calculation precision, and the calibration and correction of the test result are realized by utilizing the higher-precision error correction T parameter matrix and the S parameter of the clamp. Therefore, the scheme can not only meet the test efficiency of the multi-port radio frequency microwave chip, but also ensure the test precision.
The manner in which the individual steps shown in fig. 1 are performed is described below.
Firstly, for step 100, a plurality of modularized instruments integrated in an integrated test system are controlled to test different chip parameters of a tested piece, so as to obtain a parameter test result.
In the embodiment of the invention, the tested piece is a multi-port radio frequency microwave chip, and the chip parameters to be completed at least can comprise one or more of the following: dc parameters, scattering parameters, power parameters and noise parameters.
In order to realize the testing of the different chip parameters, a plurality of the following instruments can be modularized to form an integrated testing system in an integrated way: the system comprises a multiport vector network analyzer, a vector signal transceiver, an up-converter, a digital pattern generator and a precise direct current power supply. The power supply, the case, the controller and the like can be shared by a plurality of modularized instruments, so that the cost is reduced, and the size is reduced.
Because the communication standards executed by different instruments are different, each instrument can meet the PXIe standard in a customized mode, and the connection reliability can be greatly improved by combining a special operation turntable, a test fixture and the multi-port radio frequency microwave film probe card to be connected, all port connections can be completed by one-time contact, and the test stability is improved.
Then, aiming at step 102, according to the parameter test result, acquiring the actual reflection coefficient and the test reflection coefficient of the tested piece; the tested piece comprises an open circuit, a short circuit and a load; the test reflection coefficient of the load is not equal to 0.
Specifically, various tested pieces can be connected to the actual test end face according to actual conditions, and the tested pieces comprise: open (Open), short (Short), and Load (Load).
In the conventional manner, the chip frequency is low, the test reflection coefficient of the load is generally ignored, and the test reflection coefficient of the load is assigned 0. However, with the gradual increase of the working frequency of the multiport radio frequency microwave chip, the test result is affected by the test accuracy of the test reflection coefficient of the load, so in order to improve the test accuracy, in the embodiment of the invention, the test reflection coefficient of the load is not equal to 0, and the test reflection coefficient of the load is measured by a modularized instrument corresponding to a vector network analyzer meeting the accuracy of the corresponding frequency requirement.
In the embodiment of the invention, the actual reflection coefficient of the measured piece can be includedThe method comprises the following steps: actual reflection coefficient Γ of open circuit O Actual reflection coefficient Γ of short circuit S And the actual reflection coefficient Γ of the load L And Γ L Not equal to 0; the test reflection coefficient of the test piece may include: test reflection coefficient Γ of open circuit O Actual reflection coefficient Γ of short circuit S And the actual reflection coefficient Γ of the load L 。
Next, for step 104, a single-port error term of the 8-term error model is calculated according to the actual reflection coefficient and the test reflection coefficient, so as to calculate an error correction T parameter matrix corresponding to each of the two ports according to the single-port error term.
The existing calibration modes have various problems, such as complex calculation, large calculation amount, low precision and the like. In the embodiment of the invention, an optimized QSOT (quick Short Open Load Through, quick short-circuit open-circuit load straight-through calibration method) can be adopted, and the method is a calibration method based on 8 error models. It requires open/short/load single port calibration and also requires a deterministic path because the method requires single port calibration on only one port and therefore calibration is fast.
In the traditional QSOT calibration method, Γ L1 =0, so that the calibration accuracy is low. In the embodiment of the invention, in the optimized QSOT calibration method, Γ L1 Not equal to 0. Thus, the single-port error term of the 8-term error model may be calculated as follows:
and constructing an error equation set of the following 8 error models according to the actual reflection coefficient and the test reflection coefficient:
wherein E is 00 、E 11 、E 10 And E is 01 An error term for a first of the two ports; Γ -shaped structure O1 、Γ S1 And Γ L1 The actual reflection coefficients of the open circuit, the short circuit and the load corresponding to the first port, respectively, and Γ L1 ≠0；Γ MO1 、Γ MS1 And Γ ML1 The test reflection coefficients of the open circuit, the short circuit and the load corresponding to the first port are respectively;
and solving the error equation set to obtain an error term of the first port.
Due to gamma L1 Not equal to 0, a certain computational complexity is increased, but the error equation set may be solved by the following manner, to obtain an error term of the first port:
and transforming the error equation set to obtain the following transformation formula:
e is calculated by using the transformation formula 11 、E 00 And E is 01 E 10 。
It follows that in this embodiment, only three unknown terms E in the error term are solved 11 、E 00 And E is 01 E 10 Can be obtained without solving four unknown terms E of all error terms 00 、E 11 、E 10 And E is 01 So that the computational complexity can be reduced as a whole.
Further, after obtaining the single-port error term of the port 1, calculating an error correction T parameter matrix corresponding to each of the two ports according to the single-port error term, specifically:
matrix of T parameters [ T ] to be uncorrected Meas ]Regarded as an error correction T parameter matrix [ T ] between the first port and the measured piece A ]T parameter matrix [ T ] of true value of measured piece Act ]Error correction T parameter matrix [ T ] between measured piece and second port of two ports B ]Is a cascade of products, resulting in the following formula:
T Meas ＝T A T Act T B (5)
according to the conversion relation between the S parameter and the T parameter of the tested piece, the following formulas (6) to (13) are obtained:
Δ Meas ＝S 11Meas S 22Meas S 12Meas S 21Meas (7)
Δ Act ＝S 11Act S 22Act S 21Act S 12Act (9)
Δ A ＝E 00 E 11 E 01 E 10 (11)
Δ B ＝E 22 E 33 E 23 E 32 (13)
wherein S is 11Meas 、S 22Meas 、S 21Meas 、S 12Meas Respectively measuring S parameters of the measured piece; s is S 11Act 、S 22Act 、S 21Act 、S 12Act The actual S parameters of the measured piece are respectively; e (E) 22 、E 33 、E 23 、E 32 Error terms of a second port of the two ports respectively;
continuing to construct the following formula:
wherein T is Meas_Thru 、T Act_Thru The measured T parameter and the actual T parameter of the straight-through standard component are respectively, so that a matrix A can be calculated according to formulas (1) - (4); if the matrix B can be found, error correction can be accomplished, specifically, the required error term in the matrix B can be calculated according to the following formula:
A -1 [T Act_thru ] -1 [T Meas_Thru ]＝B (17)
wherein B is 11 、B 12 、B 21 、B 22 Respectively the elements in matrix B.
Due to [ T ] in the QSOline method Act_Thru ]Is alreadyThe other 4 error terms can be solved through the formula (17), the solving process is shown in the formulas (18) to (21), all required error terms are obtained, and finally the complete two-port calibration work is completed. The solving process is simpler, the calculating speed is faster, and the testing efficiency is improved on the premise of meeting the testing precision.
The main application scenario of QSOLT calibration is the calibration of multiport systems. If a multi-port test piece has N ports, all of the same polarity, n+1 test systems can be built using a variable cable that mates with the test piece connector on the additional port. And carrying out 1-time simple single-port calibration on the port, and carrying out 1-time through connection on other ports respectively to obtain the complete N+1-port calibration. With this approach, no other ports need to be moved, and even calibration kits of different polarity.
Continuing with step 106, calculating the S parameter of the fixture according to the actual reflection coefficient and the test reflection coefficient.
At present, the deblocking modes are also various, and problems such as complex calculation, large calculation amount, low precision and the like exist. In the embodiment of the invention, an optimized OSL (two-tier deembedding method) de-embedding method can be adopted, wherein the OSL de-embedding method is a method for extracting the complete S parameters of a reciprocal two-port network by two single-port tests on the basis of a single-port calibration algorithm and is used for extracting the S parameters of a radio frequency probe or other special-shaped connectors. Taking the parameter extraction process of the radio frequency probe S as an example, the parameter extraction process is to calibrate the coaxial or rectangular waveguide end face, and then measure calibration pieces such as on-chip open circuit, short circuit, load or bias short circuit. The load accuracy is difficult to control when entering the terahertz frequency band, and the offset short circuit can be used for replacing the terahertz frequency band. Conventional OSL de-embedding methods generally assume Γ L =0, in the embodiment of the present invention, an optimized OSL method is used, Γ L Not equal to 0, to further improve algorithm accuracy.
Specifically, in one embodiment of the present invention, the S parameter of the fixture may be calculated to optimize the OSL de-embedding method by:
and constructing the following fixture parameter equation set according to the actual reflection coefficient and the test reflection coefficient:
wherein S is F11 、S F22 、S F21 And S is F12 S parameters of the clamp; Γ -shaped structure O 、Γ S And Γ L Actual reflection coefficients of the open circuit, the short circuit, and the load, respectively, and Γ L ≠0；Γ MO 、
Γ MS And Γ ML Test reflection coefficients for the open circuit, the short circuit, and the load, respectively;
and solving the clamp parameter equation set to obtain the S parameter of the clamp.
Due to gamma L Not equal to 0, a certain computational complexity is increased, but the system of clamp parameter equations may be solved by:
transforming the clamp parameter equation set to obtain the following transformation formula:
S F12 S F21 ＝ΔS+S F11 S F22 (26)
s is calculated by using the transformation formula F11 、S F22 And S is F12 S F21 。
It can be seen that in this embodiment, onlySolving for three unknowns S in S parameters F11 、S F22 And S is F12 S F21 Can be obtained without solving four unknown terms S of all S parameters F11 、S F22 、S F21 And S is F12 So that the computational complexity can be reduced as a whole.
And finally, aiming at the step 108, calibrating and correcting the parameter test result according to the error correction T parameter matrix and the S parameter of the clamp, which are respectively corresponding to the two ports.
Specifically, when the parameter test result is calibrated and corrected, the S parameter of the fixture can be de-embedded on the basis of calibrating by using the error correction T parameter matrix, so as to complete calibration and correction.
As shown in fig. 2 and 3, the embodiment of the invention provides a multi-port radio frequency microwave chip testing device. The apparatus embodiments may be implemented by software, or may be implemented by hardware or a combination of hardware and software. In terms of hardware, as shown in fig. 2, a hardware architecture diagram of an electronic device where a multi-port rf microwave chip testing apparatus provided by an embodiment of the present invention is located, in addition to a processor, a memory, a network interface, and a nonvolatile memory shown in fig. 2, the electronic device where the embodiment is located may generally include other hardware, such as a forwarding chip responsible for processing a packet, and so on. Taking a software implementation as an example, as shown in fig. 3, the device in a logic sense is formed by reading a corresponding computer program in a nonvolatile memory into a memory by a CPU of an electronic device where the device is located and running the computer program. The multi-port radio frequency microwave chip testing device provided in this embodiment includes:
the control unit 301 is configured to control a plurality of modularized instruments integrated in the integrated test system, so as to test different chip parameters of the tested piece, and obtain a parameter test result;
an obtaining unit 302, configured to obtain an actual reflection coefficient and a test reflection coefficient of the tested piece according to the parameter test result; the tested piece comprises an open circuit, a short circuit and a load; the test reflection coefficient of the load is not equal to 0;
a first calculating unit 303, configured to calculate a single-port error term of an 8-term error model according to the actual reflection coefficient and the test reflection coefficient, so as to calculate an error correction T parameter matrix corresponding to each of the two ports according to the single-port error term;
a second calculating unit 304, configured to calculate an S parameter of the fixture according to the actual reflection coefficient and the test reflection coefficient;
and the calibration correction unit 305 is configured to perform calibration correction on the parameter test result according to the error correction T parameter matrix and the S parameter of the fixture corresponding to the two ports respectively.
The structures and principles of the control unit 301, the obtaining unit 302, the first calculating unit 303, the second calculating unit 304, and the calibration correcting unit 305 are in one-to-one correspondence with the steps in the multi-port rf microwave chip testing method, and therefore will not be described herein.
It will be appreciated that the structure illustrated in the embodiments of the present invention is not intended to be limiting in any particular way for a multi-port rf microwave chip testing device. In other embodiments of the invention, a multi-port RF microwave chip testing apparatus may include more or less components than those shown, or certain components may be combined, certain components may be split, or different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.
The content of information interaction and execution process between the modules in the device is based on the same conception as the embodiment of the method of the present invention, and specific content can be referred to the description in the embodiment of the method of the present invention, which is not repeated here.
The embodiment of the invention also provides electronic equipment, which comprises a memory and a processor, wherein the memory stores a computer program, and the processor realizes the multi-port radio frequency microwave chip testing method in any embodiment of the invention when executing the computer program.
The embodiment of the invention also provides a computer readable storage medium, and the computer readable storage medium stores a computer program, and when the computer program is executed by a processor, the processor is caused to execute the multi-port radio frequency microwave chip testing method in any embodiment of the invention.
Specifically, a system or apparatus provided with a storage medium on which a software program code realizing the functions of any of the above embodiments is stored, and a computer (or CPU or MPU) of the system or apparatus may be caused to read out and execute the program code stored in the storage medium.
In this case, the program code itself read from the storage medium may realize the functions of any of the above-described embodiments, and thus the program code and the storage medium storing the program code form part of the present invention.
Examples of the storage medium for providing the program code include a floppy disk, a hard disk, a magneto-optical disk, an optical disk (e.g., CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), a magnetic tape, a nonvolatile memory card, and a ROM. Alternatively, the program code may be downloaded from a server computer by a communication network.
Further, it should be apparent that the functions of any of the above-described embodiments may be implemented not only by executing the program code read out by the computer, but also by causing an operating system or the like operating on the computer to perform part or all of the actual operations based on the instructions of the program code.
Further, it is understood that the program code read out by the storage medium is written into a memory provided in an expansion board inserted into a computer or into a memory provided in an expansion module connected to the computer, and then a CPU or the like mounted on the expansion board or the expansion module is caused to perform part and all of actual operations based on instructions of the program code, thereby realizing the functions of any of the above embodiments.
It is noted that relational terms such as first and second, and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one …" does not exclude the presence of additional identical elements in a process, method, article or apparatus that comprises the element.
Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the above method embodiments may be implemented by hardware related to program instructions, and the foregoing program may be stored in a computer readable storage medium, where the program, when executed, performs steps including the above method embodiments; and the aforementioned storage medium includes: various media in which program code may be stored, such as ROM, RAM, magnetic or optical disks.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A method for testing a multi-port radio frequency microwave chip, comprising:
controlling a plurality of modularized instruments integrated in an integrated test system to test different chip parameters of a tested piece so as to obtain a parameter test result;
according to the parameter test result, obtaining the actual reflection coefficient and the test reflection coefficient of the tested piece; the tested piece comprises an open circuit, a short circuit and a load; the test reflection coefficient of the load is not equal to 0;
calculating a single-port error term of an 8-term error model according to the actual reflection coefficient and the test reflection coefficient so as to calculate an error correction T parameter matrix corresponding to the two ports respectively according to the single-port error term;
s parameters of the clamp are calculated according to the actual reflection coefficient and the test reflection coefficient;
and calibrating and correcting the parameter test result according to the error correction T parameter matrix and the S parameter of the clamp, which are respectively corresponding to the two ports.
2. The method of claim 1, wherein the calculating single-port error terms for the 8-term error model comprises:
and constructing an error equation set of the following 8 error models according to the actual reflection coefficient and the test reflection coefficient:
wherein E is 00 、E 11 、E 10 And E is 01 An error term for a first of the two ports; Γ -shaped structure O1 、Γ S1 And Γ L1 The actual reflection coefficients of the open circuit, the short circuit and the load corresponding to the first port, respectively, and Γ L1 ≠0；Γ MO1 、Γ MS1 And Γ ML1 The test reflection coefficients of the open circuit, the short circuit and the load corresponding to the first port are respectively;
and solving the error equation set to obtain an error term of the first port.
3. The method of claim 2, wherein solving the set of error equations to obtain the error term for the first port comprises:
and transforming the error equation set to obtain the following transformation formula:
e is calculated by using the transformation formula 11 、E 00 And E is 01 E 10 。
4. A method according to claim 3, wherein the calculating the error correction T parameter matrix corresponding to each of the two ports according to the single-port error term includes:
matrix of T parameters [ T ] to be uncorrected Meas ]Regarded as an error correction T parameter matrix [ T ] between the first port and the measured piece A ]T parameter matrix [ T ] of true value of measured piece Act ]Error correction T parameter matrix [ T ] between measured piece and second port of two ports B ]To obtain the formula T Meas ＝T A T Act T B ；
According to the conversion relation between the S parameter and the T parameter of the measured piece, the following formula is obtained:
Δ Meas ＝S 11Meas S 22Meas -S 12Meas S 21Meas
Δ Act ＝S 11Act S 22Act -S 21Act S 12Act
Δ A ＝E 00 E 11 -E 01 E 10
Δ B ＝E 22 E 33 -E 23 E 32
wherein S is 11Meas 、S 22Meas 、S 21Meas 、S 12Meas Respectively measuring S parameters of the measured piece; s is S 11Act 、S 22Act 、S 21Act 、S 12Act The actual S parameters of the measured piece are respectively; e (E) 22 、E 33 、E 23 、E 32 Error terms of a second port of the two ports respectively;
continuing to construct the following formula:
wherein T is Meas_Thru 、T Act_Thru The measured T parameter and the actual T parameter of the straight-through standard component are respectively calculated to obtain a matrix A; and calculates the required error term in matrix B according to the following formula:
A -1 [T Act_thru ] -1 [T Meas_Thru ]＝B
wherein B is 11 、B 12 、B 21 、B 22 Respectively the elements in matrix B.
5. The method of claim 1, wherein the calculating S parameters of the jig comprises:
and constructing the following fixture parameter equation set according to the actual reflection coefficient and the test reflection coefficient:
wherein S is F11 、S F22 、S F21 And S is F12 S parameters of the clamp; Γ -shaped structure O 、Γ S And Γ L Actual reflection coefficients of the open circuit, the short circuit, and the load, respectively, and Γ L ≠0；Γ MO 、Γ MS And Γ ML Test reflection coefficients for the open circuit, the short circuit, and the load, respectively;
and solving the clamp parameter equation set to obtain the S parameter of the clamp.
6. The method of claim 5, wherein solving the set of jig parameter equations to obtain the S parameters of the jig comprises:
transforming the clamp parameter equation set to obtain the following transformation formula:
S F12 S F21 ＝ΔS+S F11 S F22
s is calculated by using the transformation formula F11 、S F22 And S is F12 S F21 。
7. A multi-port rf microwave chip testing apparatus, comprising:
the control unit is used for controlling a plurality of modularized instruments integrated in the integrated test system so as to test different chip parameters of the tested piece and obtain a parameter test result;
the acquisition unit is used for acquiring the actual reflection coefficient and the test reflection coefficient of the tested piece according to the parameter test result; the tested piece comprises an open circuit, a short circuit and a load; the test reflection coefficient of the load is not equal to 0;
the first calculation unit is used for calculating a single-port error term of the 8-term error model according to the actual reflection coefficient and the test reflection coefficient so as to calculate an error correction T parameter matrix corresponding to the two ports respectively according to the single-port error term;
the second calculation unit is used for calculating the S parameter of the clamp according to the actual reflection coefficient and the test reflection coefficient;
and the calibration correction unit is used for correcting and correcting the parameter test result according to the error correction T parameter matrix and the S parameter of the clamp, which are respectively corresponding to the two ports.
8. An electronic device comprising a memory and a processor, the memory having stored therein a computer program, the processor implementing the method of any of claims 1-6 when the computer program is executed.
9. A computer readable storage medium having stored thereon a computer program which, when executed in a computer, causes the computer to perform the method of any of claims 1-6.
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