CN116448884A - Epoxy insert interface defect detection device based on laser and ultrasonic phased array - Google Patents
Epoxy insert interface defect detection device based on laser and ultrasonic phased array Download PDFInfo
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- CN116448884A CN116448884A CN202310432012.0A CN202310432012A CN116448884A CN 116448884 A CN116448884 A CN 116448884A CN 202310432012 A CN202310432012 A CN 202310432012A CN 116448884 A CN116448884 A CN 116448884A
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- phased array
- epoxy
- insert
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 60
- 230000007547 defect Effects 0.000 title claims abstract description 47
- 238000001514 detection method Methods 0.000 title claims abstract description 22
- 239000000523 sample Substances 0.000 claims abstract description 50
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000012800 visualization Methods 0.000 abstract 1
- 238000003491 array Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/262—Arrangements for orientation or scanning by relative movement of the head and the sensor by electronic orientation or focusing, e.g. with phased arrays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
- G01N29/46—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by spectral analysis, e.g. Fourier analysis or wavelet analysis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/0289—Internal structure, e.g. defects, grain size, texture
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/10—Number of transducers
- G01N2291/105—Number of transducers two or more emitters, two or more receivers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Optics & Photonics (AREA)
- Acoustics & Sound (AREA)
- Mathematical Physics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention provides an epoxy insert interface defect detection device based on laser and ultrasonic phased array, which comprises a laser driver, a mechanical arm, a clamp, a laser ultrasonic phased array probe, an ultrasonic signal processor and a display, wherein the laser driver is connected with the mechanical arm; the laser driver converts an input voltage signal into a current signal and drives the probe by using the current signal; the laser ultrasonic phased array probe is used for emitting multiple paths of laser beams to the interface area of the epoxy insert to be tested; and receiving ultrasonic waves; the signal processor acquires amplitude information and phase information of the ultrasonic signal and determines the size and the position of the interface defect of the tested epoxy insert; visualization of display interface defects. Compared with the prior art, the laser ultrasonic phased array probe emits multiple paths of laser beams to irradiate the interface of the epoxy insert, and then the ultrasonic signal processor is used for determining the size and the position of the interface defect, so that the external electromagnetic interference can be effectively reduced, the accuracy of detecting the interface defect is improved, and the defect position is early warned in time.
Description
Technical Field
The invention relates to the field of epoxy resin insert detection, in particular to an epoxy insert interface defect detection device based on laser and ultrasonic phased arrays.
Background
The epoxy-insert interface refers to the interface between the epoxy and the insert (such inserts typically comprise a type of material such as metal, glass, or ceramic). The quality of this interface will directly affect the bond strength and durability between the insert and the epoxy. However, there are often some drawbacks at the interface, such as: bubbles in the epoxy resin curing process, oxide existing on the surface of the insert, cracks formed by the mechanical action of the epoxy-insert interface in the use process, and the like. These defects may result in reduced bond strength, thereby affecting the bonding properties of the insert to the epoxy.
At present, in order to ensure the quality of an epoxy-insert structure, methods such as X-ray detection and infrared thermal imaging are often adopted for epoxy-interface defects, however, the prior art schemes cannot show finer defects, the defect detection accuracy is low, and the defect positioning is not accurate enough.
Disclosure of Invention
The invention provides an epoxy insert interface defect detection device based on laser and ultrasonic phased arrays, which aims to solve the technical problem of how to improve the accuracy of epoxy insert interface defect detection.
In order to solve the technical problems, an embodiment of the present invention provides an epoxy insert interface defect detection device based on laser and ultrasonic phased array, including
Preferably, the epoxy insert interface defect detection device further comprises a signal generator, wherein the signal generator comprises a double-path signal adder for generating the voltage signal and inputting the voltage signal into the laser driver.
As a preferable scheme, the signal generator further comprises five adder output modules, and the voltage signal output by each adder output module is a superposition voltage signal of 10Hz sawtooth wave and 20kHz sine wave; the output voltage range of the voltage signal output by each adder output module is-5V to +5V.
Preferably, the laser driver comprises five laser driving modules, and each laser driving module converts a voltage signal input by the signal generator into a current signal of 10mA to 30 mA.
Preferably, the laser ultrasonic phased array probe comprises five lasers and five ultrasonic receiving probes, and each laser is provided with a collimating mirror with adjustable focal length.
Preferably, the bandwidth of each ultrasonic receiving probe is 50kHz, and the quality factor of each ultrasonic receiving probe is greater than 230.
Preferably, the ultrasonic signal processor comprises a lock-in amplifier module, the bandwidth of the lock-in amplifier module is 100kHz, and the noise level of the lock-in amplifier module is 5mV.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
the embodiment of the invention provides an epoxy insert interface defect detection device based on laser and ultrasonic phased arrays, which comprises a laser driver, a mechanical arm, a clamp, a laser ultrasonic phased array probe, an ultrasonic signal processor and a display; the clamp is used for clamping and fixing the epoxy insert to be tested; the mechanical arm is used for clamping and fixing the laser ultrasonic phased array probe; the laser driver is used for converting an input voltage signal into a current signal and driving the laser ultrasonic phased array probe by utilizing the current signal; the laser ultrasonic phased array probe is used for emitting multiple paths of laser beams to the interface area of the epoxy insert to be tested so as to enable the interface of the epoxy insert to generate ultrasonic waves; the laser ultrasonic phased array probe comprises a plurality of ultrasonic receiving probes, wherein the ultrasonic receiving probes are used for receiving ultrasonic signals of the ultrasonic waves; the ultrasonic signal processor is used for acquiring amplitude information and phase information of the ultrasonic signal, and performing Fourier transform on the ultrasonic signal through a frequency domain imaging method to acquire corresponding frequency domain information; determining the size and the position of the interface defect of the tested epoxy insert based on the frequency domain information; the display is used for visually displaying the interface defect of the tested epoxy insert according to the determined size and position of the interface defect of the tested epoxy insert. Compared with the prior art, the laser ultrasonic phased array probe emits multiple paths of laser beams to irradiate the interface of the epoxy insert, and certain thermal expansion is generated, so that ultrasonic waves propagate inside the epoxy insert, then the size and the position of the interface defect are determined through the ultrasonic signal processor, and compared with the prior art, the external electromagnetic interference can be effectively reduced, the accuracy of detecting the interface defect is improved, and early warning is timely carried out on the defect.
Drawings
Fig. 1: the invention provides a structural schematic diagram of one embodiment of an epoxy insert interface defect detection device based on laser and ultrasonic phased arrays.
Wherein, the reference numerals of the specification drawings are as follows: 1-a signal generator; a 2-laser driver; 3-laser ultrasonic phased array probe; 4-a mechanical arm; 5-clamping; 6-an ultrasonic signal processor; 7-display.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1, fig. 1 is a schematic diagram showing an epoxy insert interface defect detection device based on a laser and ultrasonic phased array according to an embodiment of the present invention, including a signal generator 1, a laser driver 2, a laser ultrasonic phased array probe 3, a mechanical arm 4, a fixture 5, an ultrasonic signal processor 6 and a display 7; wherein,,
the clamp 5 is used for clamping and fixing the epoxy insert to be tested, the epoxy resin and the insert form the epoxy insert, the contact surface of the clamp is the interface of the epoxy insert, and the clamp 5 plays roles of fixing and limiting the epoxy insert to prevent the epoxy insert from moving under the influence of external factors. In fact, if an external environmental factor occurs, even if the epoxy insert is slightly displaced, a large difference may occur in measurement results, so that the epoxy insert is fixed in this embodiment, and is not easily displaced, so as to ensure stable measurement.
The mechanical arm 4 is used for clamping and fixing the laser ultrasonic phased array probe 3, the mechanical arm 4 can move to adjust the laser ultrasonic phased array probe 3, and laser emitted by the probe irradiates on a target position of the epoxy insert through adjusting the position and the angle of the laser ultrasonic phased array probe.
The signal generator 1 comprises a two-way signal adder, and the signal generator 1 is arranged to generate the voltage signal and to input the voltage signal into the laser driver 2. The signal generator 1 further comprises five adder output modules, each adder output module is made of an AD9833DDS chip of ADI company, and the voltage signal output by the adder output module is a superposition voltage signal of 10Hz sawtooth wave and 20kHz sine wave; the output voltage range of the voltage signal output by each path of adder output module is-5V to +5V.
The laser driver 2 is configured to convert an input voltage signal of-5V to +5v into a current signal, and drive the laser ultrasonic phased array probe 3 by using the current signal, specifically: the laser driver 2 comprises five laser driving modules, each laser driving module converts a voltage signal in a range from-5V to +5V input by the signal generator 1 into a current signal of 10mA to 30mA, and the current signal is used for driving a laser in the laser ultrasonic phased array probe 3.
The laser ultrasonic phased array probe 3 is used for emitting multiple paths of laser beams to the interface area of the epoxy insert to be tested so as to enable the interface of the epoxy insert to generate tiny thermal expansion, thereby generating ultrasonic waves, and the ultrasonic waves propagate and reflect inside the epoxy insert; the laser ultrasonic phased array probe 3 further comprises a plurality of ultrasonic receiving probes, wherein the ultrasonic receiving probes are used for collecting ultrasonic waves and receiving ultrasonic signals of the ultrasonic waves.
Further, the laser ultrasonic phased array probe 3 includes five lasers and five ultrasonic receiving probes, each laser has a collimating mirror with an adjustable focal length, the adjustable focal length range is preferably 5 cm to 30 cm, and the position of the focal point can be adjusted by adjusting the focal length, so that the adjustment of laser is realized, and further, the thermal expansion position, the thermal expansion temperature and the heating speed are changed, so that the purpose of adjusting ultrasonic waves is achieved, and the quality of the generated ultrasonic waves is improved; the bandwidth of each ultrasonic receiving probe is 50kHz, and the quality factor of each ultrasonic receiving probe is larger than 230.
The ultrasonic signal processor 6 comprises a lock-in amplifier module, wherein the lock-in amplifier module is made of an AD630 chip of ADI company, the bandwidth of the lock-in amplifier module is 100kHz, and the noise level of the lock-in amplifier module is 5mV. The ultrasonic signal processor 6 is configured to obtain amplitude information and phase information of the ultrasonic signal, and perform fast fourier transform on the received ultrasonic signal by using a frequency domain imaging method (FDI) to obtain frequency domain information corresponding to the ultrasonic signal; the size and the position of the interface defect of the tested epoxy insert can be determined based on the frequency domain information, the method can obtain the amplitude phase information of the second harmonic of the ultrasonic signal by utilizing a specific arrangement mode of a phased array, electromagnetic interference of external environmental factors is effectively isolated in the measuring process, the influence of other noise on a measuring result is avoided, and the measuring accuracy is improved.
The display 7 is used for visually displaying the interface defect of the tested epoxy insert according to the determined size and position of the interface defect of the tested epoxy insert.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
the embodiment of the invention provides an epoxy insert interface defect detection device based on laser and ultrasonic phased arrays, which comprises a laser driver, a mechanical arm, a clamp, a laser ultrasonic phased array probe, an ultrasonic signal processor and a display; the clamp is used for clamping and fixing the epoxy insert to be tested; the mechanical arm is used for clamping and fixing the laser ultrasonic phased array probe; the laser driver is used for converting an input voltage signal into a current signal and driving the laser ultrasonic phased array probe by utilizing the current signal; the laser ultrasonic phased array probe is used for emitting multiple paths of laser beams to the interface area of the epoxy insert to be tested so as to enable the interface of the epoxy insert to generate ultrasonic waves; the laser ultrasonic phased array probe comprises a plurality of ultrasonic receiving probes, wherein the ultrasonic receiving probes are used for receiving ultrasonic signals of the ultrasonic waves; the ultrasonic signal processor is used for acquiring amplitude information and phase information of the ultrasonic signal, and performing Fourier transform on the ultrasonic signal through a frequency domain imaging method to acquire corresponding frequency domain information; determining the size and the position of the interface defect of the tested epoxy insert based on the frequency domain information; the display is used for visually displaying the interface defect of the tested epoxy insert according to the determined size and position of the interface defect of the tested epoxy insert. Compared with the prior art, the laser ultrasonic phased array probe emits multiple paths of laser beams to irradiate the interface of the epoxy insert, and certain thermal expansion is generated, so that ultrasonic waves propagate inside the epoxy insert, then the size and the position of the interface defect are determined through the ultrasonic signal processor, and compared with the prior art, the external electromagnetic interference can be effectively reduced, the accuracy of detecting the interface defect is improved, and early warning is timely carried out on the defect.
The foregoing embodiments have been provided for the purpose of illustrating the general principles of the present invention, and are not to be construed as limiting the scope of the invention. It should be noted that any modifications, equivalent substitutions, improvements, etc. made by those skilled in the art without departing from the spirit and principles of the present invention are intended to be included in the scope of the present invention.
Claims (7)
1. The epoxy insert interface defect detection device based on the laser and ultrasonic phased array is characterized by comprising a laser driver, a mechanical arm, a clamp, a laser ultrasonic phased array probe, an ultrasonic signal processor and a display; wherein,,
the clamp is used for clamping and fixing the epoxy insert to be tested; the mechanical arm is used for clamping and fixing the laser ultrasonic phased array probe;
the laser driver is used for converting an input voltage signal into a current signal and driving the laser ultrasonic phased array probe by utilizing the current signal;
the laser ultrasonic phased array probe is used for emitting multiple paths of laser beams to the interface area of the epoxy insert to be tested so as to enable the interface of the epoxy insert to generate ultrasonic waves; the laser ultrasonic phased array probe comprises a plurality of ultrasonic receiving probes, wherein the ultrasonic receiving probes are used for receiving ultrasonic signals of the ultrasonic waves;
the ultrasonic signal processor is used for acquiring amplitude information and phase information of the ultrasonic signal, and performing Fourier transform on the ultrasonic signal through a frequency domain imaging method to acquire corresponding frequency domain information; determining the size and the position of the interface defect of the tested epoxy insert based on the frequency domain information;
the display is used for visually displaying the interface defect of the tested epoxy insert according to the determined size and position of the interface defect of the tested epoxy insert.
2. The epoxy insert interface defect detection device based on the laser and ultrasonic phased array according to claim 1, further comprising a signal generator, wherein the signal generator comprises a two-way signal adder for generating the voltage signal and inputting the voltage signal to the laser driver.
3. The epoxy insert interface defect detection device based on the laser and ultrasonic phased array as claimed in claim 2, wherein the signal generator further comprises five adder output modules, and the voltage signal output by each adder output module is a superposition voltage signal of 10Hz sawtooth wave and 20kHz sine wave; the output voltage range of the voltage signal output by each adder output module is-5V to +5V.
4. The epoxy insert interface defect detection device based on laser and ultrasonic phased array according to claim 2, wherein the laser driver comprises five laser driving modules, each laser driving module converts a voltage signal input by the signal generator into a current signal of 10mA to 30 mA.
5. The epoxy insert interface defect detection device based on laser and ultrasonic phased array of claim 1, wherein the laser ultrasonic phased array probe comprises five lasers and five ultrasonic receiving probes, and each laser is provided with a collimating lens with adjustable focal length.
6. The epoxy-insert interface defect detection device of claim 5, wherein each ultrasonic receiving probe has a bandwidth of 50kHz and a quality factor of greater than 230.
7. The epoxy insert interface defect detection device based on laser and ultrasonic phased array of claim 1, wherein the ultrasonic signal processor comprises a lock-in amplifier module, the bandwidth of the lock-in amplifier module is 100kHz, and the noise level of the lock-in amplifier module is 5mV.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310432012.0A CN116448884A (en) | 2023-04-21 | 2023-04-21 | Epoxy insert interface defect detection device based on laser and ultrasonic phased array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310432012.0A CN116448884A (en) | 2023-04-21 | 2023-04-21 | Epoxy insert interface defect detection device based on laser and ultrasonic phased array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116448884A true CN116448884A (en) | 2023-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310432012.0A Pending CN116448884A (en) | 2023-04-21 | 2023-04-21 | Epoxy insert interface defect detection device based on laser and ultrasonic phased array |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116448884A (en) |
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2023
- 2023-04-21 CN CN202310432012.0A patent/CN116448884A/en active Pending
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