CN116437629A

CN116437629A - Vapor chamber and preparation method thereof

Info

Publication number: CN116437629A
Application number: CN202310357786.1A
Authority: CN
Inventors: 周志文; 伍晓宇; 伍博; 汤勇; 唐恒; 雷建国
Original assignee: Shenzhen University
Current assignee: Shenzhen University
Priority date: 2023-03-30
Filing date: 2023-03-30
Publication date: 2023-07-14

Abstract

The application provides a soaking plate and a preparation method thereof, wherein the preparation method of the soaking plate comprises the following steps: and (3) template fixing: providing a first plate body and a molding template, wherein the molding template is provided with a plurality of filling holes, and the plurality of filling holes are arranged in an array; stacking the forming die plate on the first plate body; filling: filling metal powder into the filling hole; sintering: sintering the metal powder by adopting a pressure resistance welding process, so that the metal powder in each filling hole forms a liquid suction core, and the liquid suction cores are welded and fixed on the first plate body; welding: removing the molding template; providing a second plate body, superposing the second plate body on one side, far away from the first plate body, of the liquid suction core, and welding the second plate body with the liquid suction core and the first plate body. The soaking plate and the preparation method thereof provided by the application are high in preparation efficiency, and the prepared liquid absorption core is high in molding quality.

Description

Vapor chamber and preparation method thereof

Technical Field

The application belongs to the technical field of vapor chamber, and particularly relates to a vapor chamber and a preparation method thereof.

Background

With the advent and rapid development of fifth generation mobile communication technology, electronic products, especially smart phones, tablet computers, and the like, are increasingly being developed toward high performance, high integration, and miniaturization. The multiple increase in power consumption will lead to excessive heat flux density and operating temperature of the electronic chip in a narrow space, further causing serious thermal runaway problems. The soaking plate takes heat away by utilizing the phase change latent heat of the working medium, and is one of the most potential ways for solving the heat dissipation of the electronic equipment.

The soaking plate comprises a lower cover plate, a plurality of liquid suction cores and an upper cover plate, wherein the liquid suction cores are positioned in a cavity between the lower cover plate and the upper cover plate, and the liquid suction cores are arranged in an array. The core component in the vapor chamber is a liquid suction core which has the functions of driving the working medium to flow back, providing the phase change of the working medium gas and liquid, and the like. The existing preparation process of the liquid absorption core comprises the steps of forming supporting columns on a lower cover plate through etching or other processing modes, paving a layer of silk screen, then stacking metal powder on the silk screen, and sintering through an atmosphere furnace to form the columnar liquid absorption core. The preparation process has long time, high cost, low preparation efficiency and poor molding quality of the liquid absorption core.

Disclosure of Invention

The embodiment of the application aims to provide a soaking plate and a preparation method thereof, so as to solve the technical problem of low preparation efficiency of a liquid suction core in the prior art.

In order to achieve the above purpose, one of the technical schemes adopted in the application is to provide a preparation method of a vapor chamber, which comprises the following steps:

and (3) template fixing: providing a first plate body and a molding template, wherein the molding template is provided with a plurality of filling holes, and the plurality of filling holes are arranged in an array; stacking the forming die plate on the first plate body;

filling: filling metal powder into the filling hole;

sintering: sintering the metal powder by adopting a pressure resistance welding process, so that the metal powder in each filling hole forms a liquid suction core, and the liquid suction cores are welded and fixed on the first plate body;

welding: removing the molding template; providing a second plate body, superposing the second plate body on one side, far away from the first plate body, of the liquid suction core, and welding and fixing the second plate body, the liquid suction core and the first plate body.

The metal powder can be well filled in the filling holes by adopting the template fixing step, so that each liquid suction core is ensured to have the same or similar molding quality; and the pressure resistance welding process is adopted to sinter the metal powder, so that the liquid suction core welded and fixed on the first plate body is directly obtained, and the process has short operation time and high efficiency.

In one embodiment, the cross section of the filling hole is circular, and the aperture of the filling hole gradually decreases from one end of the filling hole near the first plate body to one end of the filling hole far away from the first plate body.

Through adopting above-mentioned technical scheme, after the metal powder is filled, sinter and obtain round platform shape or echelonment wick, owing to exist the hole between the metal powder, so the inside of the column wick that obtains has the hole, can effectively strengthen the inside capillary pressure of vapor chamber, has the promotion effect to vapor chamber inside working medium backward flow, improves gas-liquid conversion efficiency, does benefit to the heat dissipation.

In one embodiment, the filling hole is cylindrical.

Through adopting above-mentioned technical scheme, after the metal powder is filled, carry out the sintering and obtain cylindrical wick, owing to exist the hole between the metal powder, so the inside of the cylindrical wick that obtains has the hole, can effectively strengthen the inside capillary pressure of vapor chamber, has the promotion to vapor chamber inside working medium backward flow, improves gas-liquid conversion efficiency, does benefit to the heat dissipation.

In one embodiment, the molding template comprises a plurality of template layers which are sequentially stacked, a plurality of through holes are formed in each template layer, a plurality of through holes in each template layer are arranged in an array, and the through holes in the plurality of template layers are communicated in a one-to-one correspondence manner, and the filling holes are formed.

By adopting the technical scheme, the stepped filling holes or the truncated cone-shaped filling holes can be obtained, so that the subsequent formation of the liquid suction cores with corresponding shapes is facilitated.

Optionally, the step of fixing the template further includes the following steps after the step of providing the first plate body:

providing a plurality of template layers;

punching: sequentially manufacturing circular holes arranged in an array on each template layer by using a puncher, wherein the apertures of the circular holes on the same template layer are equal, and the apertures of the circular holes on different template layers are unequal;

overlapping: sequentially stacking the template layers on the first plate body according to the order of gradually decreasing the aperture of the round holes, wherein the through holes in the template layers correspond to each other; and stacking the templates to form the forming templates, and forming the filling holes by the round holes.

In one embodiment, from the template layer proximate to the first plate body to a template layer distal to the first plate body: the aperture of the through holes is sequentially increased.

By adopting the technical scheme, the formed filling holes are in a ladder shape, so that the contact area between the liquid suction core and working medium is enlarged, and the heat transfer capacity is improved.

Optionally, the filling step includes:

filling: filling the metal powder in each filling hole until the height of the metal powder in each filling hole is higher than one surface of the forming template, which is far away from the first plate body;

scraping: and scraping off excessive metal powder on the forming template, and enabling the metal powder in each filling hole to be pressed to be flush with the forming template.

By adopting the technical scheme, the metal powder is filled in each filling hole and is higher than the forming template, so that when the pressure resistance welding is used for sintering, the upper electrode of the resistance welding equipment can be contacted with the metal powder in each filling hole, and then the wick is formed by conducting and sintering.

In one embodiment, in the sintering step: and connecting and conducting the lower electrode of the resistance welding equipment with the first plate body, placing the upper electrode of the resistance welding equipment on the forming template, and enabling the metal powder in each filling hole to be in contact and conduction with the upper electrode.

By adopting the technical scheme, the upper electrode and the lower electrode of the resistance welding equipment can be ensured to be conducted with the metal powder and the first plate body.

Optionally, the sintering step further comprises: and placing a lower electrode of the resistance welding equipment under the first plate body, and placing an upper electrode of the resistance welding equipment on the forming template and contacting the metal powder in each filling hole.

By adopting the technical scheme, the two electrodes are communicated through the resistor of the metal to generate instant high temperature (resistance heat), the metal powder and the bottom foil are quickly welded together in a very short time, and the preparation efficiency of the vapor chamber is greatly improved.

Optionally, the sintering step further comprises: and before the filling step, the first plate body is arranged on a lower electrode of the resistance welding equipment in advance, and after the filling step is finished, an upper electrode of the resistance welding equipment is arranged on a forming template and is contacted with the metal powder in the filling hole.

Through adopting above-mentioned technical scheme, place first plate body on the bottom electrode earlier, be to avoid accomplishing after filling step and remove first plate body again, can lead to the shaping template to take place to remove, lead to metal powder to spill, influence the sintering quality of liquid absorption core.

Optionally, the upper electrode and the lower electrode of the resistance welding device are graphite blocks.

By adopting the technical scheme, the contact area of the first plate body and the lower electrode is ensured to be large enough, and the contact area of the metal powder and the upper electrode is ensured to be large enough, so that the metal powder can be formed at one time.

Optionally, the pressure range of the piezoresistive process is: 0.8kN-1.2kN; the voltage range is: 250V-350V; the current range is: 80A-120A; the time is as follows: 5s-3min.

By applying pressure, the metal powder in each filling hole is compressed, so that no excessive gap exists between the metal powder, and the sintering is ensured to form the columnar liquid suction core.

In one embodiment, the second plate body comprises a plate body connected with the liquid suction core in a welding mode and a frame arranged along the edge of the plate body, the frame is located between the plate body and the first plate body, and two sides of the frame are connected with the first plate body and the plate body in a welding mode.

Through adopting above-mentioned technical scheme, guarantee that the both ends and the first plate body of imbibition core and plate body stable connection.

Optionally, in the welding step, a pressure resistance welding process is adopted to weld the first plate body, the liquid absorption core, the frame and the plate body into a whole.

The pressure resistance welding process is adopted to weld the first plate body, the liquid absorption core, the frame and the plate body into a whole, so that the preparation efficiency of the soaking plate is further improved.

In one embodiment, the first plate body and the plate body are formed with a cavity for storing working media at the inner side of the frame, and the frame is provided with a notch communicated with the cavity.

Through setting up the breach, be convenient for pour into working medium into in the cavity into.

Optionally, the preparation method further comprises the following steps after the welding step:

vacuumizing: vacuumizing the cavity through the notch of the frame;

and (3) liquid injection: injecting working medium into the cavity through the notch;

plugging: and (5) plugging the notch of the frame to obtain the vapor chamber.

By adopting the technical scheme, the vacuumizing is used for avoiding the air in the cavity from interfering the normal working of the working medium.

Optionally, in the welding step, the specific step of removing the molding template is: the forming template is destroyed first and then removed.

The removal is facilitated by destroying the forming die plate, thereby ensuring that the wick is not damaged.

In one embodiment, the molding die plate is an insulating plate; the first plate body and the second plate body are metal plates.

By adopting the technical scheme, the insulating plate is an insulator, so that the sintering of the metal powder is not affected; the first plate body and the second plate body are metal plates, and are sintered and welded by adopting a resistance welding process for conducting an upper electrode and a lower electrode of resistance welding equipment.

Optionally, the first plate body is one of copper foil, copper alloy foil, aluminum foil or aluminum alloy foil; the second plate body is one of copper foil, copper alloy foil, aluminum foil or aluminum alloy foil.

By adopting copper metal as the material of the first plate body, the copper plate vapor chamber occupies most of the market; aluminum or aluminum alloy is used because aluminum materials have the advantages of light weight and low cost, and because aluminum oxide has higher surface resistivity than aluminum at normal temperature, resistance heat is more easily generated, so that welding quality is ensured, and the preparation time is shortened.

Optionally, the forming template is an asbestos board.

By adopting the technical scheme, the asbestos board is an insulator, has softer texture and is convenient for subsequent damage and removal.

In one embodiment, the first plate body and the second plate body are metal plates.

By adopting the technical scheme, the first plate body and the second plate body are metal plates, and are used for conducting the upper electrode and the lower electrode of the resistance welding equipment for welding.

In one embodiment, the interior of the wick is a capillary porous structure.

By adopting the technical scheme, the capillary pressure in the soaking plate can be effectively enhanced, the backflow of working media in the soaking plate is promoted, and the gas-liquid conversion efficiency is improved.

Optionally, the wick is a stepped cylinder.

By adopting the technical scheme, the contact thermal resistance can be effectively reduced, the storage of working media in the vapor chamber is facilitated, the starting performance and the heat transfer performance of the vapor chamber are improved, and the service life of the vapor chamber is prolonged

In order to achieve the above purpose, a second technical scheme adopted in the application is that the soaking plate is provided and is prepared by adopting the preparation method.

The vapor chamber prepared by the method has better starting performance and heat transfer performance and prolonged service life.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a partial flow chart of a method for preparing a vapor chamber according to an embodiment of the present application;

FIG. 2 is a partial step flow chart of the step S1 in FIG. 1;

FIG. 3 is a flow chart of step S2 in FIG. 1;

fig. 4 is a complete flowchart of a method for preparing a vapor chamber according to an embodiment of the present application;

FIG. 5 is a schematic view of a molding plate structure according to an embodiment of the present disclosure;

FIG. 6 is a schematic view of a vapor chamber precursor made using the molding die provided in FIG. 5;

FIG. 7 is a partial exploded view of FIG. 6;

FIG. 8 is a schematic structural view of a molding die plate according to another embodiment of the present disclosure;

FIG. 9 is a schematic view of a vapor chamber precursor formed using the molding die provided in FIG. 8;

FIG. 10 is a partial exploded view of FIG. 9;

fig. 11 is a schematic view of the structure of the first plate and the wick in fig. 10.

Wherein, the reference numerals illustrate:

10. a first plate body; 100. a cavity;

20. a wick;

30. a second plate body; 31. a board body; 32. a frame; 320. a notch;

40. forming a template; 400. filling the hole.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

It should be understood that the sequence number of each step in the embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic, and should not limit the implementation process of the embodiment of the present application.

Referring to fig. 1 and fig. 5 to fig. 7, a method for preparing a vapor chamber according to an embodiment of the present application will now be described. The preparation method of the vapor chamber comprises the following steps:

s1, fixing a template: providing a first plate body 10 and a molding template 40, wherein the molding template 40 is provided with a plurality of filling holes 400, and the plurality of filling holes 400 are arranged in an array; stacking the molding die 40 on the first plate body 10;

s2 filling: filling the filling hole 400 with metal powder;

s3, sintering: sintering the metal powder by using a pressure resistance welding process, so that the metal powder in each filling hole 400 forms a wick 20, and the wick 20 is welded and fixed on the first plate body 10;

s4, welding: removing the forming die plate 40; a second plate 30 is provided, the second plate 30 is stacked on one side of the liquid suction core 20 away from the first plate 10, and the second plate 30 is welded and fixed with the liquid suction core 20 and the first plate 10.

The step of S1 template fixing is adopted, a traditional mode of arranging the support columns is replaced, metal powder is supported and fixed through the filling holes 400 on the molding template 40, the operation steps are simplified, and the preparation efficiency is improved; then, the metal powder in the filling hole 400 is sintered by adopting a pressure resistance welding process, the resistance between metals is utilized, the two poles of resistance welding equipment are communicated to generate instant high temperature (resistance heat), the metal powder is sintered into the columnar liquid absorption core 20 in a very short time, the metal powder and the first plate body 10 are quickly welded together, and the preparation efficiency of the vapor chamber is greatly improved.

Optionally, in the step of S4 welding, the specific step of removing the forming template 40 includes: the forming die plate 40 is broken, and the entire forming die plate 40 is cut into pieces and then removed from the first plate body 10. In this way, it is ensured that the sintered wick 20 is not damaged, and the molding quality of the wick 20 is ensured. The means of breaking include, but are not limited to, cutting, tearing, etc.

In one embodiment of the present application, referring to fig. 5, the filling hole 400 of the molding die 40 has a cylindrical shape. The circular holes are easy and convenient to manufacture, and the cylindrical liquid suction cores 20 formed by the cylindrical filling holes 400 are convenient to take down the forming templates 40 without damaging the liquid suction cores 20; thereby facilitating the quality of the shaping of the wick 20.

In another embodiment of the present application, referring to fig. 8 to 11, the cross section of the filling hole 400 on the molding template 40 is circular, and the aperture of the filling hole 400 gradually decreases from one end of the filling hole 400 near the first plate 10 to one end far from the first plate 10. Thus, the filling hole 400 is integrally in a truncated cone shape or a step shape, so that the wick 20 formed by sintering is in a truncated cone shape structure or a step-shaped columnar structure, contact thermal resistance can be effectively reduced, storage of liquid working media in the vapor chamber is facilitated, starting performance and heat transfer performance of the vapor chamber are improved, and service life of the vapor chamber is prolonged.

Optionally, the filling hole 400 on the molding die plate 40 has a cylindrical shape, a truncated cone shape, or a stepped shape.

In one embodiment of the present application, the molding template 40 includes a plurality of template layers stacked in sequence, a plurality of through holes are formed in each template layer, the plurality of through holes in each template layer are arranged in an array, and the through holes in the plurality of template layers are communicated in a one-to-one correspondence manner, and the filling holes 400 are formed.

In one embodiment of the present application, please refer to fig. 8 and 9, from the template layer close to the first board 10 to the template layer far from the first board 10: the aperture of the through holes is sequentially increased. To form a frustoconical or stepped fill aperture 400 to form a frustoconical or stepped wick.

Optionally, referring to fig. 2 and 8, the step of providing the first board 10 in the step of S1 fixing further includes the following steps:

s11, providing a plurality of template layers;

s12, punching: adopting the puncher to make the round hole that the array set up on each template layer in proper order, the aperture of each round hole that is located same template layer equals, from the template layer that is close to first plate body 10 to the template layer that keeps away from first plate body: the aperture of the through hole is sequentially increased; (refer to fig. 8, i.e., the aperture of the round holes gradually decreases from top to bottom);

s13, superposition: sequentially stacking the template layers on the first plate body 10 according to the order of gradually decreasing the aperture of the round holes, wherein the through holes in the template layers are communicated in a one-to-one correspondence manner; the mold plates are stacked to form a molding die 40, and the round holes form filling holes 400. The forming die plate 40 is made to facilitate filling with metal powder.

Optionally, the number of the template layers is 3, and a plurality of round holes are sequentially formed in the 3 template layers by using a puncher, wherein the round holes are arranged in an array; the pore diameters of the round holes in the same template layer are equal, and the template layer with the largest pore diameter is positioned at the lowest layer and is used for being superposed on the first plate body 10; the template layer with the smallest hole diameter is positioned at the uppermost layer, and the template layer with the middle hole diameter is positioned at the middle layer; the circular holes on each template layer are communicated in a one-to-one correspondence manner, three template layers are laminated to form a molding template 40, and the circular holes on the three template layers form stepped filling holes 400. Optionally, the template layer is an asbestos plate, and the asbestos plate is high-temperature resistant and can be prevented from deforming during resistance welding and sintering; and the insulating property is good, and the sintering welding of the metal powder is not affected.

Optionally, referring to fig. 1 to 4, the S2 filling step includes:

s21 filling: filling metal powder into each filling hole 400 until the height of the metal powder in each filling hole 400 is higher than that of one surface of the forming template 40, which is far away from the first plate body 10, because when sintering welding is carried out by a pressure resistance welding process adopted subsequently, firstly, the upper electrode of the resistance welding can be ensured to be contacted with the metal powder in each filling hole 400; secondly, the metal powder is tightly pressed by applying pressure, so that larger pores are avoided in the filling holes 400, and defects on the wick 20 formed by sintering are avoided;

s22, scraping: the excess metal powder on the form 40 is scraped off so that the metal powder in each fill hole 400 is pressed to be flush with the form 40. This prevents the excess metal powder from being sintered and welded, thereby affecting the molding quality of the wick 20.

In one embodiment of the present application, the lower electrode of the resistance welding apparatus is connected to the first plate body 10, the upper electrode of the resistance welding apparatus is placed on the molding die 40, and the metal powder in each filling hole 400 is brought into contact with the upper electrode. The subsequent electrifying is convenient for sintering and welding.

Optionally, referring to fig. 1, the step of S3 sintering further includes: the lower electrode of the resistance welding apparatus is placed under the first plate body 10, and the upper electrode of the resistance welding apparatus is placed on the molding die plate 40 and is in contact with the metal powder in each of the filling holes 400. The contact between the first plate body 10 and the metal powder and the lower electrode and the upper electrode of the resistance welding equipment can be fully ensured, so that the sintering quality is ensured.

In another embodiment of the present application, the first plate body 10 is placed on the lower electrode of the resistance welding apparatus in advance before the filling step, and after the completion of the filling step, the upper electrode of the resistance welding apparatus is placed on the forming die plate 40 and is brought into contact with the metal powder in the filling hole 400. In this way, after the filling step is completed, the first plate body 10 and the molding template 40 do not need to be moved, so that the metal powder in the filling holes 400 is prevented from flowing out to affect the sintering quality of the liquid suction core 20.

Optionally, the upper electrode and the lower electrode of the resistance welding device are graphite blocks. When the upper electrode is placed on the forming template, the plane formed by the metal powder at one end of each filling hole far away from the first plate body is tightly attached to the surface of the upper electrode, so that the contact area between the first plate body 10 and the lower electrode is ensured to be large enough, and the contact area between the metal powder and the upper electrode is ensured to be large enough, so that the metal powder can be formed by sintering at one time.

Alternatively, the pressure of the pressure resistance welding process is in the range of 0.8kN to 1.2kN; the voltage range is 250V-350V; the current range is 80A-120A; the time is 5s-3min. Alternatively, the pressure resistance welding process has a pressure of 1kN, a voltage of 300V, a current of 100A, and a time of 2min. In other embodiments, the resistance welding time is between 5s and 10s, and the welding sintering is very rapid. The primary sintering of the wick 20 can be ensured, and the molding quality is good.

In one embodiment of the present application, referring to fig. 6, 7, 9 and 10, the second plate 30 includes a plate body 31 and a frame 32; the frame 32 is circumferentially arranged at the edge of the plate body 31, the frame 32 is positioned at one side of the plate body 31 close to the first plate body 10, and the other side of the frame 32 is arranged on the first plate body 10 and corresponds to the edge of the first plate body 10; in the step S4 of welding, the first plate body 10, the wick 20, the frame 32 and the plate body 31 are welded as one body by using a pressure resistance welding process. Further improving the preparation efficiency of the soaking plate.

Alternatively, only the upper electrode of the resistance welding device is required to be placed on the plate body 31, and the first plate body 10, the liquid suction core 20, the frame 32 and the plate body 31 can be welded by electrifying and pressurizing, so that the welding efficiency and the welding strength are high.

Optionally, the thickness of the rim 32 is equal to the height of the wick 20, ensuring that the wick 20 can be welded to the plate body 31.

In one embodiment of the present application, referring to fig. 6, 7, 9 and 10, the frame 32 has a notch 320, a cavity 100 is formed between the first plate body 10 and the second plate body 30, the cavity 100 is connected with the notch 320, and the cavity 100 is used for storing a liquid working medium;

optionally, the preparation method further comprises the following steps after the step of S4 welding:

s5, vacuumizing: vacuum is drawn through the gap 320 of the rim 32 from the cavity 100;

s6, liquid injection: injecting liquid working medium into the cavity 100 through the notch 320;

s7, plugging: and plugging the notch 320 of the frame 32 to obtain the vapor chamber. The presence of the notch 320 facilitates the injection of the working fluid into the cavity 100, and the evacuation is performed to avoid the presence of air in the cavity 100 interfering with the proper operation of the liquid working fluid.

In one embodiment of the present application, referring to fig. 5, the molding die 40 is an insulating plate; the first plate body 10 and the second plate body 30 are metal plates. The asbestos board is an insulator, so that the sintering of metal powder is not affected; the first plate body 10 and the second plate body 30 are metal plates, and are sintered and welded by a resistance welding process to turn on the upper electrode and the lower electrode of the resistance welding apparatus. Optionally, the forming die plate is an asbestos plate.

Optionally, the first plate body 10 is one of copper foil, copper alloy foil, aluminum foil or aluminum alloy foil; the second plate 30 is one of copper foil, copper alloy foil, aluminum foil or aluminum alloy foil.

By adopting copper metal as the material of the first plate body 10, the market share of the copper vapor chamber is high; aluminum or aluminum alloy is used because aluminum materials have the advantages of light weight and low cost, and because aluminum oxide has higher surface resistivity than aluminum at normal temperature, resistance heat is more easily generated, so that welding quality is ensured, and the preparation time is shortened.

Alternatively, the metal powder is copper powder or aluminum powder, and the wick 20 made of copper metal material is widely used, and is made of aluminum metal material, low in cost and light in weight.

In one embodiment of the present application, the interior of the wick 20 is a capillary porous structure. Because the metal powder has a certain particle size, gaps are directly formed in the metal powder, a capillary porous structure can be formed after sintering, the capillary pressure in the vapor chamber can be effectively enhanced, the reflux of working media in the vapor chamber is promoted, and the gas-liquid conversion efficiency is improved.

In one embodiment of the present application, referring to fig. 5 to 7, the molding die 40 is an asbestos board having a thickness of 1mm, a plurality of filling holes 400 having a diameter of 2mm are formed in the asbestos board using a puncher, and the plurality of filling holes 400 are arranged in an array; the first plate body 10 is an aluminum foil having a thickness of 100 μm; the metal powder is aluminum powder with the average diameter of about 100 mu m; the frame 32 is an aluminum foil having a thickness of 1mm, and the plate body 31 is an aluminum foil having a thickness of 100 μm.

In another embodiment of the present application, referring to fig. 8 to 11, the forming die plate 40 is formed by stacking three asbestos plates having a thickness of 1mm, a plurality of circular holes having a diameter of 3.5mm are formed in a first asbestos plate using a hole puncher, a plurality of circular holes having a diameter of 2.5mm are formed in a second asbestos plate, and a plurality of circular holes having a diameter of 1.5mm are formed in a third asbestos plate; the round holes on the three asbestos plates are in one-to-one correspondence to form an array arrangement filling hole 400; the first plate body 10 is a copper foil having a thickness of 100 μm; the metal powder is copper powder with the average diameter of about 100 mu m; the frame 32 is a copper foil having a thickness of 3mm, and the board body 31 is a copper foil having a thickness of 100. Mu.m.

The application also provides a soaking plate which is prepared by adopting the preparation method. The prepared vapor chamber has better starting performance and heat transfer performance and longer service life.

The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.

Claims

1. The preparation method of the vapor chamber is characterized by comprising the following steps of:

filling: filling metal powder into the filling hole;

2. The manufacturing method according to claim 1, wherein the cross section of the filling hole is circular, and the aperture of the filling hole gradually decreases from one end of the filling hole near the first plate body to one end of the filling hole far from the first plate body;

and/or the filling hole is cylindrical.

3. The method of claim 1, wherein the molding die comprises a plurality of die layers stacked in sequence, a plurality of through holes are formed in each die layer, the plurality of through holes in each die layer are arranged in an array, and the through holes in the plurality of die layers are communicated in one-to-one correspondence, and the filling holes are formed.

4. A method of manufacturing as claimed in claim 3, wherein from the template layer closer to the first plate body to the template layer farther from the first plate body: the aperture of the through holes is sequentially increased.

5. The method of manufacturing according to claim 1, wherein in the sintering step: and connecting and conducting the lower electrode of the resistance welding equipment with the first plate body, placing the upper electrode of the resistance welding equipment on the forming template, and enabling the metal powder in each filling hole to be in contact and conduction with the upper electrode.

6. The method of manufacturing as defined in claim 1, wherein the second plate includes a plate body welded to the wick and a frame disposed along an edge of the plate body, the frame being located between the plate body and the first plate, both sides of the frame being welded to the first plate and the plate body.

7. The method of claim 6, wherein the first plate and the plate body form a cavity for storing working medium inside the frame, and the frame is provided with a notch communicated with the cavity.

8. The method of any one of claims 1-7, wherein the shaped template is an insulating plate; and/or the first plate body and the second plate body are metal plates.

9. The method of any one of claims 1-7, wherein the interior of the wick is a capillary porous structure.

10. A soaking plate, characterized in that the soaking plate is prepared by the preparation method of any one of claims 1-9.