CN116424579A - Two-phase fluid loop system for heat dissipation of spacecraft - Google Patents
Two-phase fluid loop system for heat dissipation of spacecraft Download PDFInfo
- Publication number
- CN116424579A CN116424579A CN202310382874.7A CN202310382874A CN116424579A CN 116424579 A CN116424579 A CN 116424579A CN 202310382874 A CN202310382874 A CN 202310382874A CN 116424579 A CN116424579 A CN 116424579A
- Authority
- CN
- China
- Prior art keywords
- vapor
- micro
- liquid
- phase
- cold plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 99
- 238000000926 separation method Methods 0.000 claims abstract description 53
- 239000012808 vapor phase Substances 0.000 claims abstract description 52
- 239000012071 phase Substances 0.000 claims abstract description 37
- 239000007791 liquid phase Substances 0.000 claims abstract description 30
- 238000012546 transfer Methods 0.000 claims abstract description 15
- 238000001704 evaporation Methods 0.000 claims abstract description 6
- 230000008020 evaporation Effects 0.000 claims abstract description 6
- 238000005191 phase separation Methods 0.000 claims description 35
- 239000012528 membrane Substances 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical group N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 238000011161 development Methods 0.000 description 4
- 238000009835 boiling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000013526 supercooled liquid Substances 0.000 description 1
- 230000005514 two-phase flow Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/503—Radiator panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biodiversity & Conservation Biology (AREA)
- Environmental & Geological Engineering (AREA)
- Environmental Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Remote Sensing (AREA)
- Aviation & Aerospace Engineering (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention relates to the technical field of spacecraft thermal control, and provides a two-phase fluid loop system for spacecraft heat dissipation, which comprises an evaporation unit, a pump drive two-phase fluid loop and a heat pump loop, wherein the evaporation unit is provided with a liquid reservoir for storing a heat transfer working medium and a micro-channel cold plate, and the micro-channel cold plate comprises a micro-channel cold plate inlet, a micro-channel cold plate liquid phase outlet and a micro-channel cold plate vapor phase outlet; the pump driving two-phase fluid loop is provided with a mechanical pump and a first radiator, and an outlet of the first radiator is connected with a liquid-phase fluid inlet of a liquid reservoir; the heat pump loop is provided with a compressor and a second radiator, and the second radiator is connected with the liquid storage device through a throttle valve. The invention can effectively reduce the weight of the system and the emission cost, and the micro-channel cold plate has the vapor-liquid separation function in the closed system, thereby reducing the internal flow instability, improving the heat exchange capacity and the critical heat flow density, and solving the problems of cavitation of the mechanical pump and liquid impact of the compressor.
Description
Technical Field
The invention relates to the technical field of spacecraft thermal control, in particular to a two-phase fluid loop system for heat dissipation of a spacecraft, and particularly relates to a two-phase fluid loop system for heat dissipation of a spacecraft with multiple heat sources, high power and high heat flux density.
Background
With the construction and development of manned aerospace, high-power communication satellites, space nuclear power and space power stations, the power level of the spacecraft has a trend of greatly increasing. If the total power of space stations in China reaches approximately 30kW, communication satellites break through 10kW, and the heat dissipation capacity is about 10 times of that of common satellites. The nuclear power spacecraft in the future can reach MW level, the space power station can reach GW level, which is almost millions times of the heat dissipation capacity of the conventional common satellite, the system power is one of the main factors influencing the heat design, and the high-power heat collection and transmission dissipation technology becomes an important development direction in the future.
As loads/devices evolve towards microminiature integration and modularity, high heat flux density is yet another important trend in future spacecraft development. Such as laser diode, high power sensing chip, GHz LSI/VLSI electronic chip, etc. for space communication system with heat flux up to hundreds of W/cm 2 The performance and reliability of these devices are directly related to the operating temperature, which not only requires a lower operating temperature, but also requires good temperature uniformity, and the traditional spacecraft thermal control technology is not applicable at all, so that the problems of heat dissipation and thermal management of high heat flux in space have become one of the bottlenecks for restricting the development of future spacecraft.
The mechanical pump driving two-phase fluid loop technology integrating the large-length-diameter ratio micro-channel cold plate is one of important technical routes for solving heat dissipation of a plurality of high-power high-heat-flux density heat sources of a spacecraft. However, the high-power radiator based on the mechanical pump-driven two-phase fluid circuit technology is excessively heavy, so that the emission cost is greatly increased, and the bottleneck problems of two-phase flow instability, early-onset critical heat flux density and the like in the micro-channel cold plate obviously restrict the wide-range application of the space of the mechanical pump-driven two-phase fluid circuit technology.
Disclosure of Invention
In view of the drawbacks of the prior art, an object of the present invention is to provide a two-phase fluid circuit system for heat dissipation of a spacecraft.
According to the present invention, there is provided a two-phase fluid circuit system for heat dissipation of a spacecraft, comprising:
the evaporation unit is provided with a liquid reservoir for storing heat transfer working media and a micro-channel cold plate connected with an outlet of the liquid reservoir, wherein the micro-channel cold plate comprises a micro-channel cold plate inlet, a micro-channel cold plate liquid phase outlet and a micro-channel cold plate vapor phase outlet;
a pump-driven two-phase fluid loop, which is provided with a mechanical pump with an inlet connected with the liquid phase outlet of the micro-channel cold plate and a first radiator with an inlet connected with the mechanical pump outlet, wherein the outlet of the first radiator is connected with the liquid phase fluid inlet of the liquid reservoir;
the heat pump loop is provided with a compressor with an inlet connected with a vapor phase outlet of the micro-channel cold plate and a second radiator with an inlet connected with an outlet of the compressor, and the outlet of the second radiator is connected with a vapor-liquid two-phase fluid inlet of the liquid reservoir through a throttle valve.
Preferably, a heater is arranged on the liquid reservoir so as to adjust the saturation pressure of the heat transfer working medium in the liquid reservoir.
Preferably, the micro-channel cold plate further comprises a first micro-channel group, a first vapor-liquid separation cavity, a second micro-channel group, a second vapor-liquid separation cavity, a third micro-channel group and a third vapor-liquid separation cavity which are sequentially connected, wherein an inlet of the micro-channel cold plate is arranged on the first micro-channel group, the third vapor-liquid separation cavity is connected with the mechanical pump through a liquid phase outlet of the micro-channel cold plate, and the first vapor-liquid separation cavity, the second vapor-liquid separation cavity and the third vapor-liquid separation cavity are all connected with the compressor through vapor phase outlets of the micro-channel cold plate.
Preferably, the first vapor-liquid separation cavity comprises a first vapor-liquid collection cavity, a first nano porous membrane, a first micron porous plate, a first liquid phase separation micro-channel group, a first vapor-phase separation cavity outlet and a first vapor-phase transportation channel, wherein the first vapor-liquid collection cavity is adjacent to and communicated with the first micro-channel group;
when the heat transfer working medium in the first micro-channel group absorbs heat and then enters the first gas-liquid collection cavity, and the gas phase working medium subjected to heat absorption and boiling sequentially passes through the first nano porous membrane and the first micron porous plate and enters the first gas-phase separation cavity, and then enters the micro-channel cold plate gas phase outlet through the first gas-phase separation cavity outlet and the first gas-phase transportation channel, the liquid phase working medium in the first gas-liquid collection cavity enters the second micro-channel group through the first liquid-phase separation micro-channel group, wherein the first gas-phase separation cavity is not communicated with the second micro-channel group.
Preferably, the second vapor-liquid separation cavity and the third vapor-liquid separation cavity are the same as the first vapor-liquid separation cavity in structure.
Preferably, the first micro-channel group, the second micro-channel group and the third micro-channel group all comprise a plurality of micro-channels connected in parallel, and the cross section area of each micro-channel is in a structure gradually becoming larger along the fluid flow direction.
Preferably, the equivalent diameter of the plurality of parallel micro-channels is not more than 1 mm.
Preferably, the heater is a polyimide film heater;
the micro-channel cold plate is made of aluminum alloy or copper.
Preferably, the heater is adhered to the outer surface of the liquid reservoir by GD414C silicone rubber.
Preferably, the heat transfer working medium is liquid ammonia or R134a.
Compared with the prior art, the invention has the following beneficial effects:
the invention adopts the phase change heat transfer technology of the mechanical pump driving two-phase fluid loop coupling heat pump loop co-evaporator based on the large length-diameter ratio microchannel cold plate, can effectively reduce the weight of a high-power high-heat-flux heat dissipation system of a spacecraft under the condition of multiple heat sources, reduces the emission cost, and the microchannel cold plate has the vapor-liquid separation function in a closed system, thereby reducing the internal flow instability, improving the heat exchange capacity and critical heat flux density of the microchannel cold plate and solving the problems of cavitation of a mechanical pump and liquid impact of a compressor.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:
FIG. 1 is a schematic flow diagram of the present invention;
FIG. 2 is a schematic structural view of a large aspect ratio microchannel cold plate of the present invention;
FIG. 3 is a schematic diagram of the structure of a first vapor-liquid separation chamber of a large aspect ratio microchannel cold plate according to the present invention.
The figure shows:
mechanical pump 1
First radiator 2
Reservoir 3
Vapor-liquid two-phase fluid inlet 31
Reservoir liquid phase fluid inlet 32
Heater 4
Microchannel cold plate 5
Microchannel cold plate inlet 51
First vapor-liquid separation chamber 53
First vapor-liquid collection cavity 531
First nanoporous film 532
First micron porous plate 533
First liquid phase separation microchannel group 534
First vapor phase separation chamber 535
First vapor phase separation chamber outlet 536
First vapor phase transport channel 537
Second vapor-liquid separation chamber 55
Second vapor separation chamber outlet 556
Second vapor phase transport passage 557
Third microchannel group 56
Third vapor-liquid separation chamber 57
Third vapor separation chamber outlet 576
Third vapor phase transport channel 577
Microchannel cold plate liquid phase outlet 58
Microchannel cold plate vapor phase outlet 59
Compressor 6
A second radiator 7
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present invention.
Example 1:
the invention provides a two-phase fluid loop system for heat dissipation of a spacecraft, which is shown in fig. 1, and comprises an evaporation unit, a pump-driven two-phase fluid loop and a heat pump loop, wherein the evaporation unit is provided with a liquid reservoir 3 for storing a heat transfer working medium and a micro-channel cold plate 5 connected with an outlet of the liquid reservoir 3, the heat transfer working medium is liquid ammonia or R134a, and the micro-channel cold plate 5 comprises a micro-channel cold plate inlet 51, a micro-channel cold plate liquid phase outlet 58 and a micro-channel cold plate vapor phase outlet 59; the pump driving two-phase fluid loop is provided with a mechanical pump 1 with an inlet connected with a micro-channel cold plate liquid phase outlet 58 and a first radiator 2 with an inlet connected with the outlet of the mechanical pump 1, the liquid reservoir 3 is provided with a vapor-liquid two-phase fluid inlet 31 and a liquid reservoir liquid phase fluid inlet 32, and the outlet of the first radiator 2 is connected with the liquid reservoir liquid phase fluid inlet 32; the heat pump circuit is provided with a compressor 6 with an inlet connected to the vapor phase outlet 59 of the microchannel cold plate and a second radiator 7 with an inlet connected to the outlet of the compressor 6, the outlet of the second radiator 7 being connected to the vapor-liquid two-phase fluid inlet 31 via a throttle valve 8.
The heater 4 is arranged on the liquid reservoir 3, so that the saturation pressure of the heat transfer working medium in the liquid reservoir 3 can be adjusted, the working temperature in the whole micro-channel cold plate 5 can be adjusted, and the heat exchange effect is improved. The heater 4 is preferably disposed outside the reservoir 3.
As shown in fig. 2, the microchannel cold plate 5 includes a first microchannel group 52, a first vapor-liquid separation chamber 53, a second microchannel group 54, a second vapor-liquid separation chamber 55, a third microchannel group 56, and a third vapor-liquid separation chamber 57 which are sequentially connected, the microchannel cold plate inlet 51 is disposed on the first microchannel group 52, the third vapor-liquid separation chamber 57 is connected to the mechanical pump 1 through a microchannel cold plate liquid phase outlet 58, and the first vapor-liquid separation chamber 53, the second vapor-liquid separation chamber 55, and the third vapor-liquid separation chamber 57 are all connected to the compressor 6 through a microchannel cold plate vapor phase outlet 59.
As shown in fig. 3, the first vapor-liquid separation chamber 53 includes a first vapor-liquid collection chamber 531, a first nanoporous membrane 532, a first microporous plate 533, a first liquid-phase separation microchannel group 534, a first vapor-phase separation chamber 535, a first vapor-phase separation chamber outlet 536, and a first vapor-phase transport passage 537, the first vapor-liquid collection chamber 531 being adjacent to the end of the first microchannel group 52 and communicating with each other, a first nanoporous membrane 532 and a first microporous plate 533 being connected between the first vapor-liquid collection chamber 531 and the first vapor-phase separation chamber 535, the first nanoporous membrane 532 being adjacent to the first vapor-liquid collection chamber 531, the first microporous plate 533 being adjacent to the first vapor-phase separation chamber 535, the first vapor-phase separation chamber outlet 536 being in communication with the microchannel cold plate vapor-phase outlet 59 through the first vapor-phase transport passage 537.
Further, when the heat transfer working medium in the first micro-channel group 52 absorbs heat and then enters the first vapor-liquid collection cavity 531, and the vapor phase working medium after absorbing heat and boiling sequentially passes through the first nano porous membrane 532 and the first micro porous plate 533, and then enters the micro-channel cold plate vapor phase outlet 59 through the first vapor-phase separation cavity 535, the first vapor-phase separation cavity outlet 536 and the first vapor-phase transport channel 537, the liquid phase working medium in the first vapor-liquid collection cavity 531 enters the second micro-channel group 54 through the first liquid-phase separation micro-channel group 534, so that separation of the vapor phase and the liquid phase after absorbing heat of the heat transfer working medium is realized, wherein the first vapor-phase separation cavity 535 is not communicated with the second micro-channel group 54.
The second vapor-liquid separation cavity 55 and the third vapor-liquid separation cavity 57 have the same structure as the first vapor-liquid separation cavity 53, and the working principle of the second vapor-liquid separation cavity 55 and the third vapor-liquid separation cavity 57 is the same as that of the first vapor-liquid separation cavity 53.
Specifically, the supercooled liquid flowing out of the first radiator 2 may lower the temperature of the reservoir 3 to lower the saturation pressure thereof. The structures of the first radiator 2 and the second radiator 7 are all in the prior art, and are not described here again.
Example 2:
this embodiment is a preferable example of embodiment 1.
In this embodiment, the micro-channel cold plate 5 is made of aluminum alloy or copper, and the first micro-channel group 52, the second micro-channel group 54 and the third micro-channel group 56 each include a plurality of parallel micro-channels, and the cross-sectional area of each micro-channel is gradually increased along the fluid flow direction, so that the instability of the fluid flow is reduced. The equivalent diameter of the plurality of parallel microchannels is not greater than 1mm, for example, the equivalent diameter of the parallel microchannels is 0.5mm. The cross section of the parallel micro channel is rectangular, and four edges of the parallel micro channel gradually expand in flow direction, wherein in the embodiment, the inlet cross section of the parallel micro channel is preferably a square of 0.5mm×0.5mm, and the outlet cross section is preferably a square of 1mm×1 mm.
In this embodiment, the heater 4 is a polyimide film heater, and the heater 4 is stuck to the outer surface of the liquid reservoir 3 by GD414C silicone rubber.
In this embodiment, the first nanoporous membrane 532 is a graphene porous nanomembrane or an alumina porous nanomembrane, and the first microporous plate 533 is made of aluminum alloy or copper.
In this embodiment, the first liquid phase separation micro-channel group 534 includes a plurality of parallel micro-channels, the parallel micro-channels are circular, the equivalent diameter of the parallel micro-channels is not greater than 1mm, and the equivalent diameter of the parallel micro-channels is 0.5mm.
In the present embodiment, the second vapor-liquid separation chamber 55, the third vapor-liquid separation chamber 57 and the first vapor-liquid separation chamber 53 have the same structure, for example, the second vapor-phase separation chamber outlet 556 is arranged in the second vapor-liquid separation chamber 55, the third vapor-phase separation chamber outlet 576 is arranged in the third vapor-liquid separation chamber 57, the second vapor-phase separation chamber outlet 556, the third vapor-phase separation chamber outlet 576 each have the same structure and function as the first vapor-phase separation chamber outlet 536, and specifically, the second vapor-phase separation chamber outlet 556 and the microchannel cold plate vapor-phase outlet 59 communicate through the second vapor-phase transport passage 557. The third vapor-phase separation chamber outlet 576 communicates with the microchannel cold plate vapor-phase outlet 59 via a third vapor-phase transport channel 577. Other structures in the second vapor-liquid separation chamber 55 and the third vapor-liquid separation chamber 57 are the same as those in the first vapor-liquid separation chamber 53, and will not be described here again.
The working principle of the invention is as follows:
as shown in fig. 1, a plurality of high-power high-heat-flux heat sources are arranged on the surface of the micro-channel cold plate 5, fluid in the micro-channel cold plate 5 absorbs heat and then flows to boil, then a vaporous working medium passes through a nano porous membrane and a micro porous plate and enters a compressor 6 to be changed into high-temperature high-pressure steam, the high-temperature high-pressure steam is condensed into high-temperature high-pressure liquid in a second radiator 7, the high-temperature high-pressure liquid is changed into low-temperature low-pressure fluid with a small amount of gas through a throttle valve 8 and enters a liquid reservoir 3, and a liquid working medium in the micro-channel cold plate 5 finally flows into a mechanical pump 1 through a liquid phase separation micro-channel group and then flows into the liquid reservoir 3 after being supercooled by a first radiator 2.
In the description of the present application, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a specific orientation, be configured and operated in a specific orientation, and are not to be construed as limiting the present application.
The foregoing describes specific embodiments of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without affecting the spirit of the invention. The embodiments of the present application and features in the embodiments may be combined with each other arbitrarily without conflict.
Claims (10)
1. A two-phase fluid circuit system for heat dissipation in a spacecraft, comprising:
the evaporation unit is provided with a liquid reservoir (3) for storing heat transfer working media and a micro-channel cold plate (5) connected with an outlet of the liquid reservoir (3), wherein the micro-channel cold plate (5) comprises a micro-channel cold plate inlet (51), a micro-channel cold plate liquid phase outlet (58) and a micro-channel cold plate vapor phase outlet (59);
a pump-driven two-phase fluid loop, which is provided with a mechanical pump (1) with an inlet connected with a liquid phase outlet (58) of the micro-channel cold plate and a first radiator (2) with an inlet connected with the outlet of the mechanical pump (1), wherein the outlet of the first radiator (2) is connected with a liquid phase fluid inlet (32) of a liquid reservoir (3);
the heat pump loop is provided with a compressor (6) with an inlet connected with a vapor phase outlet (59) of the micro-channel cold plate and a second radiator (7) with an inlet connected with an outlet of the compressor (6), wherein the outlet of the second radiator (7) is connected with a vapor-liquid two-phase fluid inlet (31) of the liquid storage device (3) through a throttle valve (8).
2. The two-phase fluid circuit system for spacecraft heat dissipation according to claim 1, characterized in that the reservoir (3) is provided with a heater (4) to enable adjustment of the saturation pressure of the heat transfer medium in the reservoir (3).
3. The two-phase fluid circuit system for heat dissipation of a spacecraft according to claim 1, wherein the micro-channel cold plate (5) further comprises a first micro-channel group (52), a first vapor-liquid separation cavity (53), a second micro-channel group (54), a second vapor-liquid separation cavity (55), a third micro-channel group (56) and a third vapor-liquid separation cavity (57) which are sequentially connected, the micro-channel cold plate inlet (51) is arranged on the first micro-channel group (52), the third vapor-liquid separation cavity (57) is connected with the mechanical pump (1) through the micro-channel cold plate liquid phase outlet (58), and the first vapor-liquid separation cavity (53), the second vapor-liquid separation cavity (55) and the third vapor-liquid separation cavity (57) are all connected with the compressor (6) through the micro-channel cold plate vapor phase outlet (59).
4. A two-phase fluid circuit system for spacecraft heat dissipation according to claim 3, wherein said first vapor-liquid separation chamber (53) comprises a first vapor-liquid collection chamber (531), a first nanoporous membrane (532), a first microporous plate (533), a first population of liquid phase separation microchannels (534), a first vapor-phase separation chamber (535), a first vapor-phase separation chamber outlet (536) and a first vapor-phase transport channel (537), said first vapor-liquid collection chamber (531) being adjacent to and in communication with the first population of microchannels (52);
when the heat transfer working medium in the first micro-channel group (52) absorbs heat and then enters the first vapor-liquid collection cavity (531), and the heat-absorbed and boiled gas phase working medium sequentially passes through the first nano porous membrane (532) and the first micron porous plate (533) and enters the first vapor-phase separation cavity (535) and enters the micro-channel cold plate vapor phase outlet (59) through the first vapor-phase separation cavity outlet (536) and the first vapor-phase transport channel (537), the liquid phase working medium in the first vapor-liquid collection cavity (531) enters the second micro-channel group (54) through the first liquid phase separation micro-channel group (534), wherein the first vapor-phase separation cavity (535) is not communicated with the second micro-channel group (54).
5. A two-phase fluid circuit system for heat dissipation of a spacecraft according to claim 3, wherein the second vapor-liquid separation chamber (55) and the third vapor-liquid separation chamber (57) are all of the same structure as the first vapor-liquid separation chamber (53).
6. A two-phase fluid circuit system for heat dissipation of a spacecraft according to claim 3 wherein the first (52), second (54) and third (56) micro-channel groups each comprise a plurality of micro-channels connected in parallel, the micro-channels having a cross-sectional area that gradually increases in the fluid flow direction.
7. The two-phase fluid circuit system for heat dissipation of a spacecraft of claim 6, wherein the equivalent diameter of the plurality of parallel microchannels is no greater than 1 mm.
8. The two-phase fluid circuit system for spacecraft heat dissipation according to claim 1, characterized in that said heater (4) is a polyimide film heater;
the micro-channel cold plate (5) is made of aluminum alloy or copper.
9. The two-phase fluid circuit system for spacecraft heat dissipation according to claim 1, characterized in that the heater (4) is glued to the external surface of the reservoir (3) with GD414C silicone rubber.
10. The two-phase fluid circuit system for spacecraft heat dissipation of claim 1, wherein said heat transfer medium is liquid ammonia or R134a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310382874.7A CN116424579A (en) | 2023-04-11 | 2023-04-11 | Two-phase fluid loop system for heat dissipation of spacecraft |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310382874.7A CN116424579A (en) | 2023-04-11 | 2023-04-11 | Two-phase fluid loop system for heat dissipation of spacecraft |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116424579A true CN116424579A (en) | 2023-07-14 |
Family
ID=87092169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310382874.7A Pending CN116424579A (en) | 2023-04-11 | 2023-04-11 | Two-phase fluid loop system for heat dissipation of spacecraft |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116424579A (en) |
-
2023
- 2023-04-11 CN CN202310382874.7A patent/CN116424579A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4602679A (en) | Capillary-pumped heat transfer panel and system | |
| US4685512A (en) | Capillary-pumped heat transfer panel and system | |
| US4770238A (en) | Capillary heat transport and fluid management device | |
| US7174950B2 (en) | Heat transfer system for a satellite including an evaporator | |
| US6990816B1 (en) | Hybrid capillary cooling apparatus | |
| US7254957B2 (en) | Method and apparatus for cooling with coolant at a subambient pressure | |
| US6626231B2 (en) | Heat transfer device | |
| US6615912B2 (en) | Porous vapor valve for improved loop thermosiphon performance | |
| CN101026946B (en) | Loop heat-conducting device | |
| US4750543A (en) | Pumped two-phase heat transfer loop | |
| WO2019085090A1 (en) | Micropump-assisted loop heat pipe for heat dissipation from multiple heat sources | |
| WO2018047534A1 (en) | Instrument temperature adjustment device | |
| US4664177A (en) | Pumped two-phase heat transfer loop | |
| US20090008063A1 (en) | System and Method for Passive Cooling Using a Non-Metallic Wick | |
| US20110103018A1 (en) | Integrated antenna structure with an embedded cooling channel | |
| Park et al. | Advanced hybrid cooling loop technology for high performance thermal management | |
| CN116424579A (en) | Two-phase fluid loop system for heat dissipation of spacecraft | |
| JP2006057925A (en) | Two-phase flow loop type heat transport device | |
| Fourgeaud et al. | Experimental investigations of a Multi-Source Loop Heat Pipe for electronics cooling | |
| EP4195892B1 (en) | Cooling apparatus and space structure | |
| Chen et al. | A Robust Two-Phase Pumped Loop with Multiple Evaporators and Multiple Radiators for Spacecraft Applications | |
| US10352623B2 (en) | Diphasic cooling loop with satellite evaporators | |
| US6938679B1 (en) | Heat transport apparatus | |
| Homitz et al. | Evaluation of a vapor-compression thermal management system for reliability while operating under thermal transients | |
| Bugby et al. | Development and testing of a miniaturized multi‐evaporator hybrid loop heat pipe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |