CN116417552A - Display panel and manufacturing method thereof - Google Patents

Display panel and manufacturing method thereof Download PDF

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Publication number
CN116417552A
CN116417552A CN202111656305.4A CN202111656305A CN116417552A CN 116417552 A CN116417552 A CN 116417552A CN 202111656305 A CN202111656305 A CN 202111656305A CN 116417552 A CN116417552 A CN 116417552A
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China
Prior art keywords
light emitting
substrate
color
display panel
metal foil
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CN202111656305.4A
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Chinese (zh)
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徐宸科
樊勇
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Xiamen Xinying Display Technology Co ltd
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Xiamen Xinying Display Technology Co ltd
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Priority to CN202111656305.4A priority Critical patent/CN116417552A/en
Publication of CN116417552A publication Critical patent/CN116417552A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/508Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0058Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The embodiment of the application provides a display panel and a manufacturing method thereof. The display panel provided by the embodiment of the application, through laminating a plurality of light emitting devices and a plurality of color conversion layers respectively in a plurality of through holes of metal foil layer, light crosstalk between the light emitting devices and light crosstalk between the color conversion layers can be avoided, and the inner wall reflectivity of the through holes on the metal foil layer is high, light absorption is low, reflection of side view angle light rays emitted by the light emitting devices and the color conversion layers is increased, light rays emitted from the light emitting surface of the display panel are further increased, light emitting efficiency is improved, and power consumption is further reduced.

Description

Display panel and manufacturing method thereof
[ field of technology ]
The application relates to the technical field of display, in particular to a display panel and a manufacturing method thereof.
[ background Art ]
Micro light emitting diode (Micro-Light Emitting Diode, micro-LED) display technology refers to a technology of implementing light emitting display by using a high-density integrated Micro light emitting diode array as pixels on a back plate. At present, micro-LED display technology is gradually becoming a popular research, and the industry expects high-quality Micro-LED display products to enter the market. High quality Micro-LED display products have a great impact on display products such as Liquid crystal displays (Liquid CrystalDisplay, LCD), organic Light-Emitting Diode (OLED) displays, and the like, which are already on the market.
However, the conventional Micro-LED display has a problem of low light extraction efficiency.
[ invention ]
The embodiment of the application provides a display panel and a manufacturing method thereof, so as to improve the light emitting efficiency of a Micro-LED display and further reduce the power consumption of the Micro-LED display.
In order to solve the above-described problems, an embodiment of the present application provides a display panel including: the color filter substrate comprises a first substrate, a plurality of color filters, a black matrix, a metal foil layer and a plurality of color conversion layers, wherein the plurality of color filters, the black matrix, the metal foil layer and the plurality of color conversion layers are arranged on one side of the first substrate; the display substrate is arranged opposite to the color filter substrate and comprises a driving substrate and a plurality of light emitting devices arranged on one side of the driving substrate; the side, provided with a plurality of light emitting devices, of the display substrate is arranged towards the side, provided with the metal foil layer, of the color filter substrate, the plurality of light emitting devices are respectively located in the plurality of through holes, and the plurality of color conversion layers respectively cover the surface, far away from the driving substrate, of the plurality of light emitting devices.
Wherein the material of the metal foil layer comprises silver or aluminum.
Wherein the thickness of the metal foil layer is in the range of 20-200 μm.
The material of the color conversion layer comprises a quantum dot material, a fluorescent powder material, a phosphorescent photoluminescent material or an organic photoluminescent material.
Wherein the cross-sectional area of the through hole is not larger than the cross-sectional area of the color filter.
The driving substrate comprises a plurality of pixel areas which are arranged in rows and columns, each row of pixel areas comprises a red pixel area, a green pixel area, a blue pixel area and a compensation color pixel area which are arranged periodically in the row direction, and each column of pixel areas comprises a red pixel area, a green pixel area, a blue pixel area and a compensation color pixel area which are arranged periodically in the column direction.
Wherein, the side of the display substrate provided with a plurality of light emitting devices is connected with the side of the color filter substrate provided with the metal foil layer through an adhesive layer.
In order to solve the above problems, the embodiments of the present application further provide a method for manufacturing a display panel, where the method for manufacturing a display panel includes: providing a first substrate, and forming a plurality of color filters and a black matrix on the first substrate, wherein the black matrix is provided with a plurality of hollowed-out areas, and the color filters are respectively positioned in the hollowed-out areas; forming a metal foil layer on the plurality of color filters and the black matrix; forming a plurality of through holes on the metal foil layer, wherein the through holes are respectively arranged corresponding to the plurality of color filters; forming a plurality of color conversion layers in the plurality of through holes, respectively; providing a driving substrate, and forming a plurality of light emitting devices on the driving substrate; and fixing the driving substrate on one side of the metal foil layer, which is away from the first substrate, and enabling the plurality of light emitting devices to be respectively positioned in the plurality of through holes, so that the plurality of color conversion layers respectively cover the surface of one side of the plurality of light emitting devices, which is away from the driving substrate.
Wherein, a plurality of color conversion layers are respectively formed in a plurality of through holes, specifically comprising: a plurality of color conversion layers are formed in the plurality of through holes, respectively, by a doctor blade process.
The step of forming a metal foil layer on the plurality of color filters and the black matrix specifically comprises the following steps: a metal foil layer is provided and secured to the plurality of color filters and the side of the black matrix facing away from the first substrate by an adhesive layer.
The beneficial effects of this application are: according to the display panel and the manufacturing method thereof, the plurality of light emitting devices and the plurality of color conversion layers are respectively stacked in the plurality of through holes of the metal foil layer, so that light crosstalk between the light emitting devices and light crosstalk between the color conversion layers can be avoided, the inner wall reflectivity of the through holes on the metal foil layer is high, light absorption is low, reflection of side view angle light rays emitted by the light emitting devices and the color conversion layers is increased, light rays emitted from the light emitting surface of the display panel are increased, light emitting efficiency is improved, power consumption is reduced, full-color display can be realized only by using light emitting diodes (such as blue light Micro-LEDs with high light emitting efficiency) with one light emitting color, red light Micro-LEDs with low light emitting efficiency and green light Micro-LEDs with low light emitting efficiency can be avoided in the display panel, and therefore the light emitting efficiency of the Micro-LEDs in the Micro-LED display panel can be improved, and the power consumption of the Micro-LED display panel is reduced.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic top view of a driving substrate according to an embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure;
fig. 4 is another schematic top view of a driving substrate according to an embodiment of the present disclosure;
FIG. 5 is a schematic top view of a driving substrate according to an embodiment of the present disclosure;
FIG. 6 is a schematic top view of a driving substrate according to an embodiment of the present disclosure;
fig. 7 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 8 is a schematic cross-sectional structure of the step S11 provided in the embodiment of the present application;
fig. 9 is a schematic cross-sectional structure of the step S12 provided in the embodiment of the present application;
fig. 10 is a schematic cross-sectional structure of the step S13 provided in the embodiment of the present application;
FIG. 11 is a schematic cross-sectional view of the step S14 according to the embodiment of the present application;
fig. 12 is a schematic cross-sectional structure after step S15 provided in the embodiment of the present application is completed.
[ detailed description ] of the invention
The present application is described in further detail below with reference to the drawings and examples. It is specifically noted that the following examples are only for illustration of the present application, but do not limit the scope of the present application. Likewise, the following embodiments are only some, but not all, of the embodiments of the present application, and all other embodiments obtained by one of ordinary skill in the art without inventive effort are within the scope of the present application.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure of a display panel according to an embodiment of the disclosure. As shown in fig. 1, the display panel includes a display substrate 10 and a color filter substrate 20 disposed opposite to each other.
The color filter substrate 20 includes a first substrate 23, a plurality of color filters 21 disposed on one side of the first substrate 23, a black matrix 22, a metal foil layer 11 and a plurality of color conversion layers 12, wherein the black matrix 22 is provided with a plurality of hollow areas, the color filters 21 are respectively disposed in the hollow areas, the metal foil layer 11 is disposed on one side of the black matrix 22 away from the first substrate 23, the metal foil layer 11 is provided with a plurality of through holes 111, the through holes 111 are respectively disposed corresponding to the color filters 21, and the color conversion layers 12 are respectively disposed in the through holes 111. Specifically, the cross-sectional area of the through-hole 111 is not larger than the cross-sectional area of the color filter 21, and the orthographic projection of the through-hole 111 on the first substrate 23 may be located within the orthographic projection of the corresponding color filter 21 on the first substrate 23.
The display substrate 10 includes a driving substrate 14 and a plurality of light emitting devices 13 provided on one side of the driving substrate 14.
The side of the display substrate 10 on which the plurality of light emitting devices 13 are disposed faces the side of the color filter substrate 20 on which the metal foil layer 11 is disposed.
Specifically, one side of the plurality of light emitting devices 13 on the display substrate 10 and one side of the color filter substrate 20 on which the metal foil layer 11 is provided may be joined together by an adhesive layer. The adhesive layer may be specifically a light-transmitting adhesive layer.
It is to be understood that in the display panel provided in the embodiment of the present application, it may be defined that one light emitting device 13, one color conversion layer 12, and one color filter 21, which are disposed correspondingly in the vertical direction, constitute one pixel. When the display panel is displaying a picture and needs to be lighted up by a certain pixel, the light emitted by the light emitting device 13 in the pixel is converted into white light through the color conversion layer 12 in the pixel, and then is converted into light for realizing full-color display through the color filter 21 in the pixel.
Specifically, the metal foil layer 11 may be fixed to the side of the black matrix 22 facing away from the first substrate 23 by an adhesive layer 30. The through hole 111 may vertically penetrate the metal foil layer 11, and may have a rectangular or inverted trapezoidal geometric shape in its longitudinal cross-section. The light emitted from the plurality of light emitting devices 13 may have the same color, and the plurality of color conversion layers 12 may be capable of converting the light emitted from the plurality of light emitting devices 13 into white light, respectively.
In the present embodiment, the plurality of color conversion layers 12 and the plurality of light emitting devices 13 may be in one-to-one correspondence, that is, the number of color conversion layers 12 and the number of light emitting devices 13 in the display panel may be equal. Also, each color conversion layer 12 may be covered on the light emitting side of its corresponding light emitting device 13 to be able to convert light emitted by the light emitting device 13 into white light when the light emitting device 13 emits light.
Specifically, the plurality of light emitting devices 13 and the plurality of through holes 111 may also be in one-to-one correspondence, that is, the number of light emitting devices 13 and the number of through holes 111 in the display panel may also be equal. Accordingly, one color conversion layer 12 and one light emitting device 13 may be provided in each through hole 111, and the color conversion layer 12 and the light emitting device 13 in the through hole 111 may be stacked in the depth direction of the through hole 111 (i.e., the thickness direction of the metal foil layer 11 described above).
In this way, the metal foil layer 11 with the through holes 111 not only can separate each light emitting device 13 from other light emitting devices 13 located at the periphery thereof, so as to effectively avoid optical crosstalk between adjacent light emitting devices 13 and optical crosstalk between adjacent color conversion layers 12, thereby improving the display effect of the display panel.
In a specific embodiment, the color conversion layer 12 may cover the corresponding light emitting device 13, so that the light emitted from the light emitting device 13 can be incident into the corresponding color conversion layer 12 as much as possible, thereby improving the utilization rate of the light emitted from the light emitting device 13.
Specifically, the plurality of light emitting devices 13 may be arranged in an array to constitute a light emitting device array, and the plurality of color conversion layers 12 may be arranged in the same manner as the plurality of light emitting devices 13, that is, the plurality of color conversion layers 12 may also be arranged in an array to constitute a color conversion layer array.
In one embodiment, as shown in fig. 1, the inner wall of the through hole 111 may be in contact with the peripheral side surface of the light emitting device 13, that is, there may be no gap between the inner wall of the through hole 111 and the light emitting device 13. In other embodiments, a gap may exist between the inner wall of the through hole 111 and the light emitting device 13, and the color conversion layer 12 may fill the gap to improve the performance of the display panel.
In this embodiment, the light emitted from the plurality of light emitting devices 13 may be the same color, and the color conversion layer 12 may convert the light emitted from the light emitting devices 13 into white light. The light emitted by the light emitting device 13 may be primary color light (e.g., blue light), or may be light of other colors such as violet light, colorless ultraviolet light, and the like. Specifically, the light emitting device 13 may be a light emitting diode (Light Emitting Diode, LED), such as a blue LED.
In a specific embodiment, the light emitting device 13 may be embodied as a Micro light emitting diode (Micro-Light Emitting Diode, micro-LED), for example, a blue light Micro-LED. The Micro-LED has the advantages of low power consumption, high brightness, long service life, quick response time and the like, and is beneficial to improving the display performance of the display panel.
In this embodiment, the metal foil layer 11 has a high reflectivity, that is, the inner wall of the through hole 111 on the metal foil layer 11 has a high reflectivity to light, which is favorable to increase the reflection of the side view light emitted by the light emitting device 13 and the color conversion layer 12 in the through hole 111, and further increase the light emitted from the light emitting device 13 to the color conversion layer 12 and the white light emitted from the color conversion layer 13 to the outside of the color conversion layer 12, thereby improving the light emitting efficiency of the display panel and reducing the power consumption.
In one embodiment, the material of the metal foil layer 11 can include, but is not limited to, a high reflectivity metal including silver or aluminum. For example, the metal foil layer 11 may be a silver foil layer or an aluminum foil layer.
It can be understood that, compared with a black retaining wall or a gray retaining wall, the retaining wall of this embodiment has the problems of high light absorption and serious damage to light energy, and is formed by punching a metal foil with high reflectivity, and has high reflectivity of the hole wall and low light absorption, so that the utilization rate of the light emitted by the light emitting device 13 can be improved, further the light emitting efficiency is improved, and the power consumption is reduced.
In some embodiments, as shown in fig. 1, a surface of the light emitting device 13 facing away from the color conversion layer 12 and a surface of the color conversion layer 12 facing away from the light emitting device 13 may be aligned with opposite surfaces of the metal foil layer 11 in a depth direction of the through hole 111, respectively. That is, the total thickness of the light emitting device 13 and the color conversion layer 12, which are stacked in the through hole 111 in the depth direction of the through hole 111, may be equal to the thickness of the metal foil layer 11 in the depth direction of the through hole 111.
In other embodiments, the total thickness of the light emitting device 13 and the color conversion layer 12, which are disposed in the through hole 111 in the depth direction of the through hole 111, may be smaller than the thickness of the metal foil layer 11. Specifically, a surface of the light emitting device 13 facing away from the color conversion layer 12 may be aligned with an end surface of the through hole 111 near the light emitting device 13, and a height of the surface of the color conversion layer 12 facing away from the light emitting device 13 with respect to the end surface may be smaller than a depth of the through hole 111. Thus, it is advantageous to reduce the light emitting angle of the white light emitted from the color conversion layer 12 and increase the brightness of the display panel in the depth direction (i.e., the vertical direction) of the through hole 111, so as to further improve the light emitting efficiency.
Specifically, when the thickness of the light emitting device 13 in the depth direction of the through hole 111 is a fixed value, the greater the thickness of the metal foil layer 11, the greater the depth corresponding to the through hole 111, so that a thicker color conversion layer 12 can be provided in the through hole 111. In one embodiment, the thickness of the metal foil layer 11 can range from 20 to 200 μm, such as 20 μm, 50 μm, 80 μm, 110 μm, 140 μm, 170 μm, 200 μm, etc. Moreover, it can be appreciated that, compared to the conventional retaining wall, the retaining wall of this embodiment is formed by punching a metal foil, and the thickness can be larger, which is beneficial to widening the selection range of the color conversion material for forming the color conversion layer 12, improving the color conversion efficiency of the color conversion layer 12, and reducing the concentration of the color conversion material in the color conversion layer 12.
In this embodiment, when the light (such as blue light) emitted by the light emitting device 13 passes through the color conversion layer 12 disposed thereon, part of the light is absorbed by the color conversion layer 12, and the rest of the light is mixed with the light emitted by the color conversion layer 12, so that white light can be obtained, so as to ensure that the light emitted from the color conversion layer 12 is white light.
Specifically, after the color conversion layer 12 absorbs light emitted from the light emitting device 13, the wavelength of the emitted light may be in the range of 500nm to 660nm. The light emitted from the color conversion layer 12 may be monochromatic light or polychromatic light.
For example, taking the light emitted by the light emitting device 13 as blue light (G) as an example, the light emitted by the color conversion layer 12 may be yellow light (Y), two-color light (g+r) including green light and red light, two-color light (y+r) including yellow light and red light, or two-color light (g+o) including green light and orange light, or the like.
In a specific embodiment, the material of the color conversion layer 12 may include a photoluminescent material such as a quantum dot material, a fluorescent powder material, a phosphorescent photoluminescent material, or an organic photoluminescent material. Among them, quantum dot materials may include, but are not limited to, cdS/CdSe, inP, perovskite quantum dots, and the like. The phosphor material may include, but is not limited to, yttrium Aluminum Garnet (YAG), silicate phosphors, nitride phosphors, and the like. Phosphorescent photoluminescent materials may include, but are not limited to, fluoride phosphors (KSF). The organic photoluminescent material may include, but is not limited to, a fluorescent pigment (pigment) or a fluorescent colorant (die). In particular, the color conversion layer 12 may be formed by mixing a photoluminescent material and a binder.
Specifically, the photoluminescent material contained in the color conversion layer 12 may absorb light (such as blue light) emitted by the light emitting device 13, that is, may be effectively excited by light emitted by the light emitting device 13, and may further emit light mixed with light emitted by the light emitting device 13 to obtain white light.
Also, it is understood that any other material having the same effect may be used as the photoluminescent material in the color conversion layer 12, in addition to the photoluminescent material that converts the light emitted by the light emitting device 13 into white light, as described above.
In one possible application scenario, the light emitting device 13 may be specifically a blue light Micro-LED, where the color conversion layer 12 can be excited by blue light, and light emitted after excitation is mixed with the blue light to obtain white light, so as to ensure that the light emitted from the color conversion layer 12 is white light. Therefore, compared with a display panel which needs to use Micro-LED chips with three luminescent colors (namely, a blue Micro-LED chip, a green Micro-LED chip and a red Micro-LED chip) to realize full-color display, the full-color display of the display panel can be realized by only using the Micro-LED chip with one luminescent color of the blue Micro-LED chip, so that the use of the red Micro-LED chip with low luminescent efficiency and high power consumption is avoided, the luminescent efficiency of the display panel is improved, and the power consumption of the display panel is reduced.
In addition, the display panel in the embodiment only needs to transfer blue light Micro-LED chips, so that the transfer efficiency can be improved by three times, and the transfer cost is reduced. Meanwhile, the usage amount of the blue light Micro-LED chip is increased by 3 times, and the blue light Micro-LED chip is easier to achieve scale efficiency, so that the chip cost is reduced.
In this embodiment, the driving substrate 14 may include a second substrate 141 and a TFT device layer 142 that are stacked, the light emitting devices 13 may be disposed on a side of the TFT device layer 142 away from the second substrate 141, and the light emitting devices 13 may be electrically connected to the TFT device layer 142. Wherein the TFT device layer 142 is capable of controlling the plurality of light emitting devices 13 described above.
Specifically, as shown in fig. 2, the TFT device layer 142 may include a plurality of gate lines, a plurality of data lines, and a plurality of pixel regions defined by the plurality of gate lines and the plurality of data lines, which may include the red pixel region 31, the green pixel region 32, the blue pixel region 33, and the like, disposed on the second substrate 141. The light emitting devices 13 may be fixed to corresponding pixel regions in the driving substrate 14 by soldering, and the plurality of light emitting devices 13 may be in one-to-one correspondence with the plurality of pixel regions.
In this embodiment, after the light emitted by the light emitting devices 13 is converted into white light by the color conversion layers 12, the white light obtained by the conversion is filtered out by the color filters 21 to obtain a plurality of primary colors (e.g., red light, green light, and blue light).
In some embodiments, the pixel structure of the display panel may be designed for a pixel structure such as RGB, RGBW, RGBC, RGBY, RGBC, RGBYC, RGBYM, RGBCM, RGBYC, WYCM. Wherein R is red, G is green, B is blue, W is white, M is magenta (including both B and R), Y is yellow (including both G and R), and C is cyan (including both B and G).
When the pixel structure of the display panel is RGBW, since the white pixel can increase the brightness of the display screen, the light emission intensity of the RGB pixel can be appropriately reduced, thereby reducing the power consumption. It is understood that, assuming that the luminance of white light emitted from a white pixel is substantially equal to the luminance of white light formed by mixing light emitted from three RGB pixels, when the display panel displays a full white picture, the luminance of a micro led display panel with a pixel structure of RGBW is about 1.5 times that of a micro led display panel with a pixel structure of RGB.
In one embodiment, as shown in fig. 1, the color filters 21 may include a red filter R (for forming a red pixel), a green filter G (for forming a green pixel), and a blue filter B (for forming a blue pixel), where the white light emitted from the color conversion layer 12 may be filtered out of the red light, the green light, or the blue light after passing through the corresponding red filter R, the green filter G, or the blue filter B, so as to realize full-color display of the display panel.
In another embodiment, as shown in fig. 3, the plurality of color filters 21 may include not only the red filter R, the green filter G, and the blue filter B, but also the compensation color filter X. Accordingly, the pixel structure of the display panel is RGBX, and as shown in fig. 4, the plurality of pixel regions in the driving substrate 14 may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a compensation color pixel region 34. Specifically, the plurality of pixel regions in the driving substrate 14 may be arranged in rows and columns, and each row of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a compensation color pixel region 34 that are periodically arranged in the row direction, and each pixel region located in the same row of pixel regions may be the same pixel region, for example, each of the red pixel region 31, the green pixel region 32, the blue pixel region 33, or the compensation color pixel region 34. In addition, in some embodiments in which the pixel regions are the same instead of being located in the same column of pixel regions, each column of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a compensation color pixel region 34, which are periodically arranged in the column direction.
The compensation color filter X may be a white filter W (for forming a white pixel), a yellow filter Y (for forming a yellow pixel), a cyan filter C (for forming a cyan pixel), a magenta filter M (for forming a magenta pixel), or the like. The white light emitted from the color conversion layer 12 passes through the compensation color filter X, thereby effectively improving the display brightness of the display panel.
In one possible application scenario, the color filters 21 may include red, green, and blue filters R, G, and B, and white filters W, the pixel structure corresponding to the display panel is RGBW, and, as shown in fig. 5, the pixel regions in the driving substrate 14 may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a white pixel region 34. Specifically, the plurality of pixel regions in the driving substrate 14 may be arranged in rows and columns, and each row of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a white pixel region 34, which are periodically arranged in the row direction, and each column of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a white pixel region 34, which are periodically arranged in the column direction.
In another possible application scenario, the color filters 21 may include a red filter R, a green filter G, a blue filter B and a yellow filter Y, the pixel structure corresponding to the display panel is RGBY, and as shown in fig. 6, the pixel regions in the driving substrate 14 may include a red pixel region 31, a green pixel region 32, a blue pixel region 33 and a yellow pixel region 35. Specifically, the plurality of pixel regions in the driving substrate 14 may be arranged in rows and columns, and each row of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a yellow pixel region 35, which are periodically arranged in the row direction, and each column of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a yellow pixel region 35, which are periodically arranged in the column direction.
Thus, compared with a display panel designed by adopting an RGB pixel structure, the display panel in the embodiment not only includes red pixels, green pixels and blue pixels, but also includes compensation pixels, so that the luminous intensity of the RGB pixels in the display panel can be reduced, and the display brightness and luminous efficiency can be improved.
According to the display panel, the plurality of light emitting devices and the plurality of color conversion layers are respectively stacked in the plurality of through holes of the metal foil layer, so that light crosstalk between the light emitting devices and light crosstalk between the color conversion layers can be avoided, the inner wall of the through holes on the metal foil layer is high in reflectivity and low in light absorption, reflection of side view angle light emitted by the light emitting devices and the color conversion layers is facilitated to be increased, light emitted from the light emitting surface of the display panel is further increased, light emitting efficiency is improved, power consumption is further reduced, full-color display can be realized only by using a light emitting diode (such as a blue light Micro-LED with high light emitting efficiency) with one light emitting color, and red light Micro-LED and green light Micro-LED with low light emitting efficiency can be avoided in the display panel, so that light emitting efficiency of Micro-LED in the Micro-LED display panel can be improved, power consumption of the Micro-LED display panel is reduced, and manufacturing efficiency of the Micro-LED display panel is improved.
Referring to fig. 7, fig. 7 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present application, and referring to fig. 1 to fig. 6, fig. 1 to fig. 6 are schematic structural diagrams during the manufacturing process of the display panel according to an embodiment of the present application. The specific flow of the manufacturing method of the display panel provided in this embodiment may be as follows:
step S11: a first substrate 23 is provided, and a plurality of color filters 21 and a black matrix 22 are formed on the first substrate 23, wherein a plurality of hollowed-out areas are formed on the black matrix 22, and the plurality of color filters 21 are respectively located in the plurality of hollowed-out areas.
The schematic cross-sectional structure after the completion of step S11 may be as shown in fig. 8.
Specifically, the specific structure and the forming method of the color filter 21 and the black matrix 22 may refer to the specific embodiments of the color filter and the black matrix in the prior art, so that the description thereof is omitted herein.
Step S12: a metal foil layer 11 is formed on the plurality of color filters 21 and the black matrix 22.
The schematic cross-sectional structure after the completion of step S12 may be as shown in fig. 9.
Specifically, the step S12 may specifically include: a metal foil layer 11 is provided and the metal foil layer 11 is secured to the plurality of color filters 21 and the side of the black matrix 22 facing away from the first substrate 23 by an adhesive layer 30. The adhesive layer 30 may be specifically a light-transmitting adhesive layer.
Step S13: a plurality of through holes 111 are formed in the metal foil layer 11, and the plurality of through holes 111 are provided corresponding to the plurality of color filters 21, respectively.
The schematic cross-sectional structure after the completion of step S13 may be as shown in fig. 10.
Specifically, a plurality of through holes 111 may be formed on the metal foil layer 11 by a through hole etching process or a laser drilling process.
Step S14: a plurality of color conversion layers 12 are formed in the plurality of through holes 111, respectively.
The schematic cross-sectional structure after the completion of step S14 may be as shown in fig. 11.
Specifically, a plurality of color conversion layers 12 may be formed in the plurality of through holes 111, respectively, by a blade coating process. Here, the color conversion layer 12 may not fill the through hole 111, that is, after the color conversion layer 12 is formed in the through hole 111, a residual space 111A exists at an end of the through hole 111 away from the color filter substrate 20, and the residual space 111A can be used to accommodate the corresponding light emitting device 13 in a subsequent process. Further, after the plurality of color conversion layers 12 are formed by a doctor blade process, the color conversion layer material remaining on the surface of the metal foil layer 11 may be wiped off to avoid contamination.
It should be noted that, compared with the scheme of forming the color conversion layer by using the yellow light process and the inkjet printing process in some manufacturing methods of the display panel, the color conversion layer is formed by using the doctor blade process with low cost, so that the manufacturing cost is reduced, and the glue for forming the color conversion layer has the advantages of wide selection range and low material cost. In addition, the metal foil layer material and the color conversion layer material used in the embodiment are produced in batches, new materials do not need to be developed, the material cost is low, and the production cost can be further reduced.
Step S15: a driving substrate 14 is provided, and a plurality of light emitting devices are formed on the driving substrate 14.
The schematic cross-sectional structure after the completion of step S15 may be as shown in fig. 12.
Specifically, a massive transfer of the plurality of light emitting devices 13 onto the driving substrate 14 may be performed to form the plurality of light emitting devices 13 on the driving substrate 14.
In one embodiment, the light emitting device 13 may be embodied as a Micro-LED (e.g., blue Micro-LED). In particular, a plurality of Micro-LEDs may be formed on a monocrystalline silicon substrate, and then the plurality of Micro-LEDs on the monocrystalline silicon substrate may be cut to obtain a plurality of independent Micro-LEDs, and then each Micro-LED may be transferred to a corresponding region (i.e., a corresponding pixel region) on the driving substrate 14 by soldering.
In this embodiment, the structure obtained by sequentially performing the steps S11, S12, S13, and S14 is the color filter substrate 20, and the structure obtained by performing the step S15 is the display substrate 10.
In addition, the color filter substrate 20 and the display substrate 10 are prepared in no sequence. That is, the steps S11 to S14 for preparing the color filter substrate 20 may be performed in parallel with the step S15 for preparing the display substrate 10, may be performed prior to the step S15, or may be performed later than the step S15.
Step S16: the driving substrate 14 is fixed on a side of the metal foil layer 11 facing away from the first substrate 23, and the plurality of light emitting devices 13 are respectively located in the plurality of through holes 111 such that the plurality of color conversion layers 12 respectively cover a side surface of the plurality of light emitting devices 13 facing away from the driving substrate 14.
The schematic cross-sectional structure after the completion of step S16 may be as shown in fig. 1.
Specifically, the driving substrate 14 on which the plurality of light emitting devices 13 are formed may be fixed to the side of the metal foil layer 11 facing away from the color filter substrate 20 in such an orientation that the plurality of light emitting devices 13 face the plurality of through holes 111 one by one, and the plurality of light emitting devices 13 may be located in the plurality of through holes 111, respectively. Wherein the light emitting side of each light emitting device 13 is directed towards its corresponding color conversion layer 12, so that the color conversion layer 12 is capable of converting light emitted by its corresponding light emitting device 13 into white light. The plurality of color filters 21 of the color filter substrate 20 can convert the white light emitted from the plurality of color conversion layers 12 into a plurality of primary colors of light, respectively, thereby realizing full-color display of the display panel.
It should be noted that, the specific structure of the display panel in this embodiment may refer to the specific implementation manner in the embodiment of the display panel, so that the description is omitted here.
According to the manufacturing method of the display panel, the first substrate is provided, the plurality of color filters and the black matrix are formed on the first substrate, the plurality of hollow areas are formed on the black matrix, the plurality of color filters are respectively located in the plurality of hollow areas, then the metal foil layer is formed on the plurality of color filters and the black matrix, the plurality of through holes are respectively formed on the metal foil layer and correspond to the plurality of color filters, then the plurality of color conversion layers are respectively formed in the plurality of through holes, the driving substrate is provided, the plurality of light emitting devices are formed on the driving substrate, the driving substrate is then fixed on one side of the metal foil layer, which is far away from the first substrate, and the plurality of light emitting devices are respectively located in the plurality of through holes, so that light crosstalk between the light emitting devices and light crosstalk between the color conversion layers can be avoided, the inner wall reflectivity of the through holes on the metal foil layer is high, light absorption is low, the reflection efficiency of the light emitting devices and the angle conversion layers is increased, and the light emitting efficiency of the light emitting diode can be further improved, and the light emitting efficiency of the Micro-emitting diode can be further improved, and the light emitting efficiency of the Micro LED can be further reduced, and the light emitting diode can be further reduced, and the light emitting efficiency of the Micro LED can be further reduced, and the light emitting diode can be used for displaying light.
The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.

Claims (10)

1. A display panel, comprising:
the color filter substrate comprises a first substrate, a plurality of color filters, a black matrix, a metal foil layer and a plurality of color conversion layers, wherein the plurality of color filters, the black matrix, the metal foil layer and the plurality of color conversion layers are arranged on one side of the first substrate;
the display substrate is arranged opposite to the color filter substrate and comprises a driving substrate and a plurality of light emitting devices arranged on one side of the driving substrate;
the color filter substrate is characterized in that one side of the display substrate, which is provided with a plurality of light emitting devices, is arranged towards one side of the color filter substrate, which is provided with the metal foil layer, the light emitting devices are respectively located in the through holes, and the color conversion layers respectively cover one side surface of the light emitting devices, which is far away from the driving substrate.
2. The display panel of claim 1, wherein the material of the metal foil layer comprises silver or aluminum.
3. The display panel of claim 1, wherein the metal foil layer has a thickness in the range of 20 to 200 μm.
4. The display panel of claim 1, wherein the material of the color conversion layer comprises a quantum dot material, a phosphor material, a phosphorescent photoluminescent material, or an organic photoluminescent material.
5. The display panel according to claim 1, wherein a cross-sectional area of the through hole is not larger than a cross-sectional area of the color filter.
6. The display panel according to claim 1, wherein the driving substrate includes a plurality of pixel regions arranged in rows and columns, and each row of pixel regions includes a red pixel region, a green pixel region, a blue pixel region, and a compensation color pixel region that are periodically arranged in a row direction, and each column of pixel regions includes the red pixel region, the green pixel region, the blue pixel region, and the compensation color pixel region that are periodically arranged in a column direction.
7. The display panel of claim 1, wherein the side of the display substrate on which the plurality of light emitting devices are disposed and the side of the color filter substrate on which the metal foil layer is disposed are connected together by an adhesive layer.
8. A method for manufacturing a display panel, comprising:
providing a first substrate, and forming a plurality of color filters and a black matrix on the first substrate, wherein the black matrix is provided with a plurality of hollowed-out areas, and the color filters are respectively positioned in the hollowed-out areas;
forming a metal foil layer on the plurality of color filters and the black matrix;
forming a plurality of through holes on the metal foil layer, wherein the through holes are respectively arranged corresponding to the color filters;
forming a plurality of color conversion layers in the plurality of through holes, respectively;
providing a driving substrate, and forming a plurality of light emitting devices on the driving substrate;
and fixing the driving substrate on one side of the metal foil layer, which is away from the first substrate, and enabling the light emitting devices to be respectively located in the through holes, so that the color conversion layers respectively cover the surfaces of one side, away from the driving substrate, of the light emitting devices.
9. The method for manufacturing a display panel according to claim 8, wherein forming a plurality of color conversion layers in the plurality of through holes, respectively, specifically comprises:
and forming a plurality of color conversion layers in the plurality of through holes respectively through a doctor blade process.
10. The method of claim 8, wherein the step of forming a metal foil layer on the plurality of color filters and the black matrix, comprises:
a metal foil layer is provided and secured to a plurality of the color filters and a side of the black matrix facing away from the first substrate by an adhesive layer.
CN202111656305.4A 2021-12-30 2021-12-30 Display panel and manufacturing method thereof Pending CN116417552A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111656305.4A CN116417552A (en) 2021-12-30 2021-12-30 Display panel and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111656305.4A CN116417552A (en) 2021-12-30 2021-12-30 Display panel and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN116417552A true CN116417552A (en) 2023-07-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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