CN116417551A - Display panel and manufacturing method thereof - Google Patents

Display panel and manufacturing method thereof Download PDF

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Publication number
CN116417551A
CN116417551A CN202111656291.6A CN202111656291A CN116417551A CN 116417551 A CN116417551 A CN 116417551A CN 202111656291 A CN202111656291 A CN 202111656291A CN 116417551 A CN116417551 A CN 116417551A
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light emitting
emitting devices
substrate
conversion layer
color
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樊勇
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Xiamen Xinying Display Technology Co ltd
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Xiamen Xinying Display Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
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Abstract

The embodiment of the application provides a display panel and a manufacturing method thereof. The display panel provided by the embodiment of the application converts light emitted by a plurality of light emitting devices into white light through the whole color conversion layer, and the retaining wall is arranged between the light emitting devices, so that the light crosstalk between the light emitting devices can be effectively reduced, the whole color conversion layer is not needed to be patterned, the full-color display of the display panel can be realized through the whole color conversion layer, the manufacturing process cost of the color conversion layer is reduced, the production cost of the display panel is reduced, and the product competitiveness is improved.

Description

Display panel and manufacturing method thereof
[ field of technology ]
The application relates to the technical field of display, in particular to a display panel and a manufacturing method thereof.
[ background Art ]
Micro light emitting diode (Micro-Light Emitting Diode, micro-LED) display technology refers to a technology of implementing light emitting display by using a high-density integrated Micro light emitting diode array as pixels on a back plate. At present, micro-LED display technology is gradually becoming a popular research, and the industry expects high-quality Micro-LED display products to enter the market. High quality Micro-LED display products have a great impact on display products such as liquid crystal displays (Liquid Crystal Display, LCDs), organic Light-Emitting Diode (OLED) displays, and the like, which are already on the market.
However, the conventional Micro-LED display applied to full-color display has a problem of high production cost.
[ invention ]
The embodiment of the application provides a display panel, a manufacturing method thereof and a display device, so as to reduce the production cost of a Micro-LED display applied to full-color display.
In order to solve the above problems, an embodiment of the present application provides a display panel, including a driving substrate, a plurality of light emitting devices, a retaining wall, and a color conversion layer, where the plurality of light emitting devices and the retaining wall are all disposed on one side of the driving substrate, the retaining wall is disposed in a spacing region between the plurality of light emitting devices and on a periphery of the plurality of light emitting devices, the color conversion layer covers a surface of the plurality of light emitting devices and the retaining wall away from the driving substrate, and the color conversion layer is capable of converting light emitted by the plurality of light emitting devices into white light; the color filter substrate is arranged opposite to the display substrate, and comprises a first substrate, a plurality of color filters and a black matrix, wherein the plurality of color filters and the black matrix are arranged on one side of the first substrate; the side of the display substrate provided with the color conversion layer is arranged towards the side of the color filter substrate provided with the plurality of color filters and the black matrix.
Wherein, the barricade is the white glue film.
Wherein the material of the white glue layer comprises BT resin, silica gel, acrylic resin or polyimide; alternatively, the material of the white glue layer is an organic material containing titanium oxide and/or tantalum oxide.
Wherein the height of the retaining wall is greater than the height of the light emitting device.
Wherein the height difference between the barrier wall and the light emitting device is between 1/10 and 1/2 of the height of the light emitting device.
Wherein the height of the retaining wall is 10-20 μm.
The material of the color conversion layer comprises a quantum dot material, a fluorescent powder material, a phosphorescent photoluminescent material or an organic photoluminescent material.
The driving substrate comprises a plurality of pixel areas which are arranged in rows and columns, each row of pixel areas comprises a red pixel area, a green pixel area, a blue pixel area and a compensation color pixel area which are arranged periodically in the row direction, and each column of pixel areas comprises a red pixel area, a green pixel area, a blue pixel area and a compensation color pixel area which are arranged periodically in the column direction.
The side of the display substrate provided with the color conversion layer is connected with the side of the color filter substrate provided with the plurality of color filters and the black matrix through the adhesive layer.
In order to solve the above problems, the embodiments of the present application further provide a method for manufacturing a display panel, where the method for manufacturing a display panel includes: forming a driving substrate; forming a plurality of light emitting devices and retaining walls on the driving substrate, wherein the retaining walls are arranged in the interval areas among the light emitting devices and at the periphery of the light emitting devices; forming a color conversion layer covering the plurality of light emitting devices and a surface of the retaining wall on a side away from the driving substrate, wherein the color conversion layer is capable of converting light emitted by the plurality of light emitting devices into white light; forming a color filter substrate, wherein the color filter substrate comprises a first substrate, a plurality of color filters and a black matrix, the plurality of color filters and the black matrix are arranged on one side of the first substrate, a plurality of hollowed-out areas are formed on the black matrix, and the plurality of color filters are respectively positioned in the plurality of hollowed-out areas; and connecting one side of the display substrate provided with the color conversion layer with one side of the color filter substrate provided with a plurality of color filters and the black matrix together, and enabling the plurality of color filters to be respectively arranged corresponding to the plurality of light emitting devices.
Wherein, the step of forming a plurality of light emitting devices and retaining walls on the driving substrate specifically comprises: performing transfer of the plurality of light emitting devices onto the driving substrate; a barrier rib is formed on the driving substrate in a space region between the plurality of light emitting devices and at the periphery of the plurality of light emitting devices.
Wherein the step of forming the color conversion layer covering the plurality of light emitting devices and the side surface of the barrier wall away from the driving substrate specifically includes: and forming a color conversion layer by adopting a whole-surface coating process.
The beneficial effects of this application are: according to the display panel and the manufacturing method thereof, light emitted by the light emitting devices is converted into white light through the whole color conversion layer, and the retaining wall is arranged between the light emitting devices, so that light crosstalk between the light emitting devices can be effectively reduced, the whole color conversion layer is not needed to be patterned, full-color display of the display panel can be realized through the whole color conversion layer, the manufacturing process cost of the color conversion layer is reduced, the production cost of the display panel is reduced, and the product competitiveness is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic top view of a driving substrate according to an embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure;
fig. 4 is another schematic top view of a driving substrate according to an embodiment of the present disclosure;
FIG. 5 is a schematic top view of a driving substrate according to an embodiment of the present disclosure;
FIG. 6 is a schematic top view of a driving substrate according to an embodiment of the present disclosure;
fig. 7 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 8 is a schematic cross-sectional structure of the step S11 provided in the embodiment of the present application;
fig. 9 is a schematic cross-sectional structure of the step S121 provided in the embodiment of the present application after completion;
fig. 10 is a schematic cross-sectional structure of the step S122 provided in the embodiment of the present application;
fig. 11 is a schematic cross-sectional structure of the embodiment of the present application after step S13 is completed.
[ detailed description ] of the invention
The present application is described in further detail below with reference to the drawings and examples. It is specifically noted that the following examples are only for illustration of the present application, but do not limit the scope of the present application. Likewise, the following embodiments are only some, but not all, of the embodiments of the present application, and all other embodiments obtained by one of ordinary skill in the art without inventive effort are within the scope of the present application.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure of a display panel according to an embodiment of the disclosure. As shown in fig. 1, the display panel includes a display substrate 10 and a color filter substrate 20 disposed opposite to each other.
The display substrate 10 includes a bank 11, a color conversion layer 12, a plurality of light emitting devices 13, and a driving substrate 14. Wherein, the retaining wall 11 and the light emitting devices 13 are all disposed on one side of the driving substrate 14, and the retaining wall 11 is disposed in the interval region between the light emitting devices 13 and the periphery of the light emitting devices 13, so as to separate each light emitting device 13 from other light emitting devices 13 disposed on the periphery thereof, thereby reducing optical crosstalk between adjacent light emitting devices 13. The color conversion layer 12 covers the plurality of light emitting devices 13 and a side surface of the barrier wall 11 remote from the driving substrate 14, and the color conversion layer 12 is capable of converting light emitted from the plurality of light emitting devices 13 into white light. In some embodiments, the light emitted by the plurality of light emitting devices 13 may be the same color.
The color filter substrate 20 includes a first substrate 23, a plurality of color filters 21 and a black matrix 22 disposed on one side of the first substrate 23, a plurality of hollow areas are disposed on the black matrix 22, the plurality of color filters 21 are respectively disposed in the plurality of hollow areas, and the plurality of color filters 21 are respectively disposed corresponding to the plurality of light emitting devices 13.
The side of the display substrate 10 on which the color conversion layer 12 is disposed faces the side of the color filter substrate 20 on which the plurality of color filters 21 and the black matrix 22 are disposed.
Specifically, the side of the display substrate 10 on which the color conversion layer 12 is provided and the side of the color filter substrate 20 on which the plurality of color filters 21 and the black matrix 22 are provided may be connected together by an adhesive layer 30. The adhesive layer 30 may be specifically a light-transmitting adhesive layer.
It is to be understood that, in the display panel provided in the embodiment of the present application, it may be defined that one light emitting device 13 and one color filter 21, which are disposed correspondingly in the vertical direction, and the color conversion layer 12 located therebetween form one pixel. When the display panel is displaying a picture and needs to be lighted up by a certain pixel, the light emitted by the light emitting device 13 in the pixel is converted into white light through the color conversion layer 12 in the pixel, and then is converted into light for realizing full-color display through the color filter 21 in the pixel.
In the present embodiment, the color conversion layer 12 is entirely planar, and the color conversion layer 12 is located on the light emitting side of the plurality of light emitting devices 13 and covers the barrier wall 11 and the plurality of light emitting devices 13. Compared with the scheme that the full-color display of the display panel is realized by the patterning color conversion layer, the embodiment does not need the patterning color conversion layer, the full-color display of the display panel can be realized by using the whole color conversion layer, and the manufacturing process cost of the color conversion layer is reduced, so that the production cost of the display panel is reduced, and the product competitiveness is improved.
Specifically, the plurality of light emitting devices 13 may be arranged in an array to form a light emitting device array, and the color conversion layer 12 may be located on a light emitting side of the light emitting device array and cover the barrier wall 11.
In one embodiment, as shown in fig. 1, the above-mentioned retaining wall 11 may be in contact with the peripheral side surface of the light emitting device 13, that is, there may be no gap between the light emitting device 13 and the retaining wall 11. In other embodiments, a gap may exist between the light emitting device 13 and the barrier wall 11, and the color conversion layer 12 may fill the gap to improve the performance of the display panel.
In this embodiment, the light emitted from the plurality of light emitting devices 13 may be the same color light, and the color conversion layer 12 may convert the light emitted from the plurality of light emitting devices 13 into white light. The light emitted by the light emitting device 13 may be primary color light (e.g., blue light), or may be light of other colors such as violet light, colorless ultraviolet light, and the like. Specifically, the light emitting device 13 may be a light emitting diode (Light Emitting Diode, LED), such as a blue LED.
In a specific embodiment, the light emitting device 13 may be embodied as a Micro light emitting diode (Micro-Light Emitting Diode, micro-LED), for example, a blue light Micro-LED. The Micro-LED has the advantages of low power consumption, high brightness, long service life, quick response time and the like, and is beneficial to improving the display performance of the display panel.
In this embodiment, the retaining wall 11 may be a white retaining wall, and the white retaining wall may be a white glue layer. The white glue layer has high reflectivity, which is beneficial to increasing the reflection of side view angle light rays emitted by the light emitting device 13, and further increasing the light rays incident into the color conversion layer 12, so as to improve the light utilization rate and further reduce the power consumption.
In a specific embodiment, the material of the white glue layer may include at least one of BT resin, silica gel, acrylic resin, and polyimide.
In another specific embodiment, the material of the white glue layer may also be a material formed by mixing an organic material and inorganic nanoparticles with a high refractive index, where the inorganic nanoparticles may include titanium oxide and/or tantalum oxide, etc. For example, the material of the white glue layer may be an organic material containing titanium oxide and/or tantalum oxide.
It can be understood that, compared with the black retaining wall or the gray retaining wall, the problems of high light absorption and serious damage to light energy exist, and the white glue layer used as the retaining wall in this embodiment has high reflectivity (greater than 85%), low light absorption, and can improve the utilization rate of the light emitted by the light emitting device 13, thereby improving the light emitting efficiency and reducing the power consumption.
In some embodiments, the material of the retaining wall 11 may be a hydrophobic material. When the light emitting device 13 is an LED chip, since the epitaxial layer (e.g., gaN/AlN epitaxial layer) of the LED chip has hydrophilicity, that is, the polarity between the surface of the light emitting device 13 and the material of the barrier wall 11 is repulsive (e.g., the contact angle is greater than 90 degrees), the barrier wall 11 may be manufactured by a coating method (e.g., spin coating, knife coating, spray coating, etc.), and in the case that the polarities of the materials are repulsive, the material of the barrier wall 11 is not adsorbed on the light emitting device 13, which causes pollution, and in addition, the cost of the coating process is low, so the cost of manufacturing the barrier wall 11 in the embodiment of the present application is low.
In other embodiments, the material of the color conversion layer 12 may be a hydrophobic material. Moreover, as the principle that the material of the retaining wall 11 is a hydrophobic material may reduce the formation of the retaining wall 11 in the embodiment of the present application, the material of the color conversion layer 12 is a hydrophobic material, which may reduce the cost of preparing the color conversion layer 12 in the embodiment of the present application.
In some embodiments, as shown in fig. 1, the height H2 of the retaining wall 11 is greater than the height H1 of the light emitting device 13.
Accordingly, one side of the color conversion layer 12 facing the barrier 11 and the light emitting devices 13 may respectively form a boss 12A at a position relative to each light emitting device 13, the boss 12A may be in contact with the corresponding light emitting device 13, and the barrier 11 may separate the boss 12A from other bosses 12A, thereby reducing optical crosstalk entering between the bosses 12A.
It is understood that the larger the difference between the height H2 of the wall 11 and the height H1 of the light emitting device 13, the larger the volume of the boss 12A, and the thicker the thickness of the color conversion layer 12 covered on the light emitting side of each light emitting device 13. In this way, it is advantageous to widen the selection range of the color conversion material for forming the color conversion layer 12, improve the color conversion efficiency of the color conversion layer 12, and reduce the concentration of the color conversion material in the color conversion layer 12.
Specifically, the height difference (H2-H1) between the above-mentioned retaining wall 11 and the above-mentioned light emitting device 13 may be between 1/10 and 1/2 (e.g., 1/10, 1/9, 1/8, 1/7, 1/6, 1/5, 1/4, 1/3, 1/2, etc.) of the height H1 of the light emitting device 13.
In one embodiment, the height H2 of the retaining wall 11 may be 10 μm to 20 μm, for example, 10 μm, 12 μm, 15 μm, 17 μm, 20 μm, etc.
In this embodiment, when the light (such as blue light) emitted by the light emitting device 13 passes through the color conversion layer 12, a part of the light is absorbed by the color conversion layer 12, and the rest of the light is mixed with the light emitted by the color conversion layer 12, so that white light can be obtained, so as to ensure that the light emitted from the color conversion layer 12 is white light.
Specifically, after the color conversion layer 12 absorbs light emitted from the light emitting device 13, the wavelength of the emitted light may be in the range of 500nm to 660nm. The light emitted from the color conversion layer 12 may be monochromatic light or polychromatic light.
For example, taking the light emitted from the light emitting device 13 as blue light (G) as an example, the light emitted from the color conversion layer 12 may be yellow light (Y), two-color light (g+r) including green light and red light, two-color light (y+r) including yellow light and red light, or two-color light (g+o) including green light and orange light.
In a specific embodiment, the material of the color conversion layer 12 may include a photoluminescent material such as a quantum dot material, a fluorescent powder material, a phosphorescent photoluminescent material, or an organic photoluminescent material. Among them, quantum dot materials may include, but are not limited to, cdS/CdSe, inP, perovskite quantum dots, and the like. The phosphor material may include, but is not limited to, yttrium Aluminum Garnet (YAG), silicate phosphors, nitride phosphors, and the like. Phosphorescent photoluminescent materials may include, but are not limited to, fluoride phosphors (KSF). The organic photoluminescent material may include, but is not limited to, a fluorescent pigment (pigment) or a fluorescent colorant (die). In particular, the color conversion layer 12 may be formed by mixing a photoluminescent material and a binder.
Specifically, the photoluminescent material contained in the color conversion layer 12 may absorb light (such as blue light) emitted by the light emitting device 13, that is, may be effectively excited by light emitted by the light emitting device 13, and may further emit light mixed with light emitted by the light emitting device 13 to obtain white light.
Also, it is understood that any other material having the same effect may be used as the photoluminescent material in the color conversion layer 12, in addition to the photoluminescent material that converts the light emitted by the light emitting device 13 into white light, as described above.
In one possible application scenario, the light emitting device 13 may be specifically a blue light Micro-LED, where the color conversion layer 12 can be excited by blue light, and light emitted after excitation is mixed with the blue light to obtain white light, so as to ensure that the light emitted from the color conversion layer 12 is white light. Therefore, compared with a display panel which needs to use Micro-LED chips with three luminescent colors (namely, a blue Micro-LED chip, a green Micro-LED chip and a red Micro-LED chip) to realize full-color display, the full-color display of the display panel can be realized by only using the Micro-LED chip with one luminescent color of the blue Micro-LED chip, so that the use of the red Micro-LED chip with low luminescent efficiency and high power consumption is avoided, the luminescent efficiency of the display panel is improved, and the power consumption of the display panel is reduced.
In addition, the display panel in the embodiment only needs to transfer blue light Micro-LED chips, so that the transfer efficiency can be improved by three times, and the transfer cost is reduced. Meanwhile, the usage amount of the blue light Micro-LED chip is increased by 3 times, and the blue light Micro-LED chip is easier to achieve scale efficiency, so that the chip cost is reduced.
In this embodiment, the driving substrate 14 may include a second substrate 141 and a TFT device layer 142 that are stacked, the light emitting devices 13 and the barrier wall 11 may be disposed on a side of the TFT device layer 142 away from the second substrate 141, and the light emitting devices 13 may be electrically connected to the TFT device layer 142. Wherein the TFT device layer 142 is capable of controlling the light emission of the plurality of light emitting devices 13.
Specifically, as shown in fig. 2, the TFT device layer 142 may include a plurality of gate lines, a plurality of data lines, and a plurality of pixel regions defined by the plurality of gate lines and the plurality of data lines, which may include the red pixel region 31, the green pixel region 32, the blue pixel region 33, and the like, disposed on the second substrate 141. The light emitting devices 13 may be fixed to corresponding pixel regions in the driving substrate 14 by soldering, and the plurality of light emitting devices 13 may be in one-to-one correspondence with the plurality of pixel regions.
In this embodiment, after the light emitted by the light emitting devices 13 is converted into white light by the color conversion layer 12, the white light obtained by the conversion passes through the color filters 21 of the color filter substrate 20, and then various primary colors (e.g., red light, green light, and blue light) can be filtered out.
In some embodiments, the pixel structure of the display panel may be designed for a pixel structure such as RGB, RGBW, RGBC, RGBY, RGBC, RGBYC, RGBYM, RGBCM, RGBYC, WYCM. Wherein R is red, G is green, B is blue, W is white, M is magenta (including both B and R), Y is yellow (including both G and R), and C is cyan (including both B and G).
When the pixel structure of the display panel is RGBW, since the white pixel can increase the brightness of the display screen, the light emission intensity of the RGB pixel can be appropriately reduced, thereby reducing the power consumption. It is understood that, assuming that the luminance of white light emitted from a white pixel is substantially equal to the luminance of white light formed by mixing light emitted from three RGB pixels, when the display panel displays a full white picture, the luminance of a micro led display panel with a pixel structure of RGBW is about 1.5 times that of a micro led display panel with a pixel structure of RGB.
In one embodiment, as shown in fig. 1, the color filters 21 may include a red filter R (for forming a red pixel), a green filter G (for forming a green pixel), and a blue filter B (for forming a blue pixel), wherein the white light emitted from the color conversion layer 12 may filter out red light, green light, and blue light after passing through the red filter R, the green filter G, and the blue filter B, respectively, so as to implement full-color display of the display panel.
In another embodiment, as shown in fig. 3, the plurality of color filters 21 may include not only the red filter R, the green filter G, and the blue filter B, but also the compensation color filter X. Accordingly, the pixel structure of the display panel is RGBX, and as shown in fig. 4, the plurality of pixel regions in the driving substrate 14 may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a compensation color pixel region 34. Specifically, the plurality of pixel regions in the driving substrate 14 may be arranged in rows and columns, and each row of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a compensation color pixel region 34 that are periodically arranged in the row direction, and each pixel region located in the same row of pixel regions may be the same pixel region, for example, each of the red pixel region 31, the green pixel region 32, the blue pixel region 33, or the compensation color pixel region 34. In addition, in some embodiments in which the pixel regions are the same instead of being located in the same column of pixel regions, each column of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a compensation color pixel region 34, which are periodically arranged in the column direction.
Among them, the compensation color filter X may be a white filter W (for forming a white pixel), a yellow filter Y (for forming a yellow pixel), a cyan filter C (for forming a cyan pixel), a magenta filter M (for forming a magenta pixel), and the like. The white light emitted from the color conversion layer 12 passes through the compensation color filter X, thereby effectively improving the display brightness of the display panel.
In one possible application scenario, the color filters 21 may include a red filter R, a green filter G, a blue filter B and a white filter W, the pixel structure corresponding to the display panel is RGBW, and, as shown in fig. 5, the pixel regions in the driving substrate 14 may include a red pixel region 31, a green pixel region 32, a blue pixel region 33 and a white pixel region 34. Specifically, the plurality of pixel regions in the driving substrate 14 may be arranged in rows and columns, and each row of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a white pixel region 34, which are periodically arranged in the row direction, and each column of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a white pixel region 34, which are periodically arranged in the column direction.
In another possible application scenario, the color filters 21 may include a red filter R, a green filter G, a blue filter B and a yellow filter Y, the pixel structure corresponding to the display panel is RGBY, and as shown in fig. 6, the pixel regions in the driving substrate 14 may include a red pixel region 31, a green pixel region 32, a blue pixel region 33 and a yellow pixel region 35. Specifically, the plurality of pixel regions in the driving substrate 14 may be arranged in rows and columns, and each row of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a yellow pixel region 35, which are periodically arranged in the row direction, and each column of pixel regions may include a red pixel region 31, a green pixel region 32, a blue pixel region 33, and a yellow pixel region 35, which are periodically arranged in the column direction.
Thus, compared with a display panel designed by adopting an RGB pixel structure, the display panel in the embodiment not only includes red pixels, green pixels and blue pixels, but also includes compensation pixels, so that the luminous intensity of the RGB pixels in the display panel can be reduced, and the display brightness and luminous efficiency can be improved.
The display panel of this embodiment converts the light emitted by a plurality of light emitting devices into white light by utilizing the whole color conversion layer, and sets up the barricade between the light emitting devices, can effectively reduce the light crosstalk between the light emitting devices, and need not the patterning color conversion layer, can realize the full-color display of display panel by using the whole color conversion layer, has reduced the manufacturing cost of color conversion layer, thereby is favorable to reducing the manufacturing cost of display panel, in order to improve the product competitiveness.
Referring to fig. 7, fig. 7 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present application, and referring to fig. 1 to fig. 6, fig. 1 to fig. 6 are schematic structural diagrams during the manufacturing process of the display panel according to an embodiment of the present application. The specific flow of the manufacturing method of the display panel provided in this embodiment may be as follows:
step S11: the driving substrate 14 is formed.
The schematic cross-sectional structure after the completion of step S11 may be as shown in fig. 8.
In particular, the specific structure and the forming method of the driving substrate 14 may refer to the specific embodiment of the driving substrate in the prior art, so that the description is omitted herein.
Step S12: a plurality of light emitting devices 13 and a barrier wall 11 are formed on a driving substrate 14, the barrier wall 11 being provided in a space region between the plurality of light emitting devices 13 and at an outer periphery of the plurality of light emitting devices 13.
In one embodiment, the step S12 may specifically include:
step S121: the transfer of the plurality of light emitting devices 13 onto the driving substrate 14 is performed.
The schematic cross-sectional structure after the completion of step S121 may be as shown in fig. 9.
In one embodiment, the light emitting device 13 may be embodied as a Micro-LED (e.g., blue Micro-LED). In particular, a plurality of Micro-LEDs may be formed on a monocrystalline silicon substrate, and then the plurality of Micro-LEDs on the monocrystalline silicon substrate may be cut to obtain a plurality of independent Micro-LEDs, and then each Micro-LED may be transferred to a corresponding region (i.e., a corresponding pixel region) on the driving substrate 14 by soldering.
Step S122: the barrier wall 11 is formed on the driving substrate 14 in a space region between the plurality of light emitting devices 13 and at the periphery of the plurality of light emitting devices 13.
The schematic cross-sectional structure after the completion of step S122 may be as shown in fig. 10.
Specifically, the above-described retaining wall 11 may be formed using a spray process.
Step S13: a color conversion layer 12 is formed to cover the plurality of light emitting devices 13 and a side surface of the barrier wall 11 remote from the driving substrate 14, wherein the color conversion layer 12 is capable of converting light emitted from the plurality of light emitting devices 13 into white light.
The schematic cross-sectional structure after the completion of step S13 may be as shown in fig. 11.
Specifically, the color conversion layer 12 covering the barrier wall 11 and the plurality of light emitting devices 13 may be formed by whole surface coating on the light emitting side of the plurality of light emitting devices 13. That is, the color conversion layer 12 may be formed by using a whole surface coating process, and in particular, the whole surface coating process may include a spin coating, a blade coating, or a spray coating. Therefore, compared with the scheme of forming the color conversion layer by using a yellow light process and an inkjet printing process in some manufacturing methods of display panels, the color conversion layer is formed by using a coating process with low cost, so that the production cost is reduced, and the glue for forming the color conversion layer has the advantages of large selection range and low material cost.
Step S14: a color filter substrate 20 is formed, the color filter substrate 20 includes a first substrate 23, a plurality of color filters 21 and a black matrix 22 disposed on one side of the first substrate 23, a plurality of hollow areas are disposed on the black matrix 22, and the plurality of color filters 21 are respectively disposed in the plurality of hollow areas.
In particular, the specific structure and the forming method of the color filter substrate 20 may refer to the specific embodiment of the color filter substrate in the prior art, so that the description is omitted herein.
In this embodiment, the structure obtained by sequentially performing the steps S11, S12, and S13 is the display substrate 10, and the structure obtained by performing the step S14 is the color filter substrate 20.
In addition, there is no sequence in preparing the display substrate 10 and the color filter substrate 20. That is, the steps S11 to S13 for preparing the display substrate 10 may be performed in parallel with the step S14 for preparing the color filter substrate 20, may be performed prior to the step S14, or may be performed later than the step S14.
Step S15: the side of the display substrate 10 on which the color conversion layer 12 is provided is connected to the side of the color filter substrate 20 on which the plurality of color filters 21 and the black matrix 22 are provided, and the plurality of color filters 21 are provided so as to correspond to the plurality of light emitting devices 13, respectively.
The schematic cross-sectional structure after the completion of step S15 may be as shown in fig. 1.
Specifically, the display substrate 10 is a structure obtained by sequentially performing the above steps S11, S12, and S13. The side of the display substrate 10 on which the color conversion layer 12 is provided and the side of the color filter substrate 20 on which the plurality of color filters 21 and the black matrix 22 are provided may be connected together by an adhesive layer 30.
It should be noted that, the specific structure of the display panel in this embodiment may refer to the specific implementation manner in the embodiment of the display panel, so that the description is omitted here.
According to the manufacturing method of the display panel, the driving substrate is formed, the plurality of light emitting devices and the retaining wall are formed on the driving substrate, the retaining wall is arranged in the interval area between the plurality of light emitting devices and the periphery of the plurality of light emitting devices, then the color conversion layer covering the plurality of light emitting devices and the retaining wall and far away from the surface of one side of the driving substrate is formed, the color conversion layer can convert light emitted by the plurality of light emitting devices into white light, then the color filter substrate is formed, the color filter substrate comprises a first substrate, a plurality of color filters and a black matrix, the plurality of hollow areas are arranged on the black matrix, the plurality of color filters are respectively located in the plurality of hollow areas, then one side of the display substrate, which is provided with the color conversion layer, is connected with one side of the color filter substrate, which is provided with the plurality of color filters and the black matrix, and the plurality of color filters are respectively arranged corresponding to the plurality of light emitting devices, so that light between the light emitting devices can be effectively reduced, the whole color conversion layer is not needed, display of the display panel can be realized, the whole color conversion layer is not needed, the production cost of the whole color conversion layer is reduced, the full-color conversion layer is beneficial to the manufacturing cost of the display panel, and the production cost is reduced.
The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.

Claims (12)

1. A display panel, comprising:
the display substrate comprises a driving substrate, a plurality of light emitting devices, a retaining wall and a color conversion layer, wherein the light emitting devices and the retaining wall are arranged on one side of the driving substrate, the retaining wall is arranged in a spacing area among the light emitting devices and on the periphery of the light emitting devices, the color conversion layer covers the surfaces of the light emitting devices and the retaining wall, which are far away from the driving substrate, and the color conversion layer can convert light emitted by the light emitting devices into white light;
the color filter substrate is arranged opposite to the display substrate and comprises a first substrate, a plurality of color filters and a black matrix, wherein the plurality of color filters and the black matrix are arranged on one side of the first substrate, a plurality of hollowed-out areas are formed in the black matrix, the plurality of color filters are respectively positioned in the hollowed-out areas, and the plurality of color filters are respectively arranged corresponding to the plurality of light emitting devices;
the side, provided with the color conversion layer, of the display substrate is arranged towards one side, provided with the color filters and the black matrix, of the color filter substrate.
2. The display panel of claim 1, wherein the retaining wall is a white glue layer.
3. The display panel according to claim 2, wherein the material of the white glue layer comprises BT resin, silicone, acrylic resin or polyimide; or the material of the white glue layer is an organic material containing titanium oxide and/or tantalum oxide.
4. The display panel of claim 1, wherein the height of the barrier wall is greater than the height of the light emitting device.
5. The display panel of claim 4, wherein a height difference between the barrier wall and the light emitting device is between 1/10 and 1/2 of a height of the light emitting device.
6. The display panel of claim 1, wherein the height of the barrier wall is 10 μm to 20 μm.
7. The display panel of claim 1, wherein the material of the color conversion layer comprises a quantum dot material, a phosphor material, a phosphorescent photoluminescent material, or an organic photoluminescent material.
8. The display panel according to claim 1, wherein the driving substrate includes a plurality of pixel regions arranged in rows and columns, and each row of pixel regions includes a red pixel region, a green pixel region, a blue pixel region, and a compensation color pixel region that are periodically arranged in a row direction, and each column of pixel regions includes the red pixel region, the green pixel region, the blue pixel region, and the compensation color pixel region that are periodically arranged in a column direction.
9. The display panel according to claim 1, wherein a side of the display substrate on which the color conversion layer is provided and a side of the color filter substrate on which the plurality of color filters and the black matrix are provided are connected together by an adhesive layer.
10. A method for manufacturing a display panel, comprising:
forming a driving substrate;
forming a plurality of light emitting devices and retaining walls on the driving substrate, wherein the retaining walls are arranged in interval areas among the light emitting devices and at the periphery of the light emitting devices;
forming a color conversion layer covering a plurality of the light emitting devices and a side surface of the barrier wall away from the driving substrate, wherein the color conversion layer is capable of converting light emitted from the plurality of the light emitting devices into white light;
forming a color filter substrate, wherein the color filter substrate comprises a first substrate, a plurality of color filters and a black matrix, the plurality of color filters and the black matrix are arranged on one side of the first substrate, a plurality of hollowed-out areas are formed on the black matrix, and the plurality of color filters are respectively positioned in the hollowed-out areas;
and connecting one side of the display substrate provided with the color conversion layer with one side of the color filter substrate provided with a plurality of color filters and the black matrix together, and enabling the plurality of color filters to be respectively arranged corresponding to the plurality of light emitting devices.
11. The method of manufacturing a display panel according to claim 10, wherein the step of forming a plurality of light emitting devices and barrier ribs on the driving substrate comprises:
performing transfer of a plurality of light emitting devices onto the driving substrate;
forming a retaining wall located in a spacing region between the plurality of light emitting devices and at the periphery of the plurality of light emitting devices on the driving substrate.
12. The method of manufacturing a display panel according to claim 10, wherein the step of forming a color conversion layer covering a plurality of the light emitting devices and a surface of the barrier wall on a side away from the driving substrate, specifically comprises:
and forming the color conversion layer by adopting a whole-surface coating process.
CN202111656291.6A 2021-12-30 2021-12-30 Display panel and manufacturing method thereof Pending CN116417551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111656291.6A CN116417551A (en) 2021-12-30 2021-12-30 Display panel and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111656291.6A CN116417551A (en) 2021-12-30 2021-12-30 Display panel and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN116417551A true CN116417551A (en) 2023-07-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
CN (1) CN116417551A (en)

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