CN116417393A - Lead screw module, wafer bonding positioning device and operation method thereof - Google Patents

Lead screw module, wafer bonding positioning device and operation method thereof Download PDF

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Publication number
CN116417393A
CN116417393A CN202111639034.1A CN202111639034A CN116417393A CN 116417393 A CN116417393 A CN 116417393A CN 202111639034 A CN202111639034 A CN 202111639034A CN 116417393 A CN116417393 A CN 116417393A
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China
Prior art keywords
lead screw
carrier
rail
servo motor
disposed
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CN202111639034.1A
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Chinese (zh)
Inventor
周贤炳
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Tojingjianke Haining Semiconductor Equipment Co ltd
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Tojingjianke Haining Semiconductor Equipment Co ltd
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Priority to CN202111639034.1A priority Critical patent/CN116417393A/en
Publication of CN116417393A publication Critical patent/CN116417393A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/06—Means for converting reciprocating motion into rotary motion or vice versa

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application relates to a lead screw module, a wafer bonding positioning device and an operation method thereof. According to some embodiments, a lead screw module includes: a working platform; a servo motor arranged on the working platform; a screw rod having one end connected to the servo motor and the other end connected to the support bearing; a first guide rail disposed on the work platform; the carrier is arranged on the lead screw, the lower surface of the carrier is provided with a first sliding block component, and the first sliding block component is arranged on the first guide rail and can move along the first guide rail; and a first rail-slider compact disposed at least partially on one side of the carrier; one side of the first sliding block component abuts against a first leaning edge arranged on the carrier, and the other side of the first sliding block component abuts against the first guide rail sliding block pressing block.

Description

Lead screw module, wafer bonding positioning device and operation method thereof
Technical Field
The present application relates generally to the field of semiconductor devices, and more particularly, to a lead screw module suitable for use in a wafer bonding positioning device.
Background
When bonding wafers, the linear motion driving system is required to drive the optical imaging equipment to shoot and image the marks on the wafers, so that the wafer bonding positioning is finished. Such applications require high positioning accuracy for linear motion drive systems. In general, a relatively large number of linear motion driving systems are used in high positioning accuracy applications, and are expensive linear motor modules. However, there are several problems associated with using linear motor modules in wafer bonding and positioning devices.
For example, the current of the wafer bonding positioning device can affect the imaging precision during operation, so that the linear motor module needs to be powered off during the process of shooting the mark. But the linear motor of the linear motor module does not have band-type brake, and the linear motor is easy to drift when power is off, so that the positioning accuracy is affected. In addition, the power consumption and the heat generation amount of the linear motor are relatively large, which affects the micro-environment of the wafer bonding apparatus. In addition, the linear motor has poor rigidity, does not have a good damping effect, and cannot resist vibration well.
Compared with a linear motor module, the lead screw module with higher performance price can effectively avoid a series of problems. However, the conventional screw module cannot meet the requirement of the wafer bonding positioning device on the positioning precision; in addition, the long-term running parallelism of the traditional screw rod module cannot be guaranteed, and further long-term stable precision guarantee cannot be brought.
Disclosure of Invention
The embodiments of the present application provide at least an improved lead screw module, which is suitable for wafer bonding positioning or similar occasions with high requirements for positioning accuracy, long-term stability, and the like.
In one aspect, the present application provides a lead screw module comprising: a working platform; a servo motor disposed on the work platform; a lead screw having one end connected to the servo motor and the other end connected to a support bearing; a first guide rail disposed on the work platform; the carrier is mounted on the lead screw, the lower surface of the carrier is provided with a first sliding block component, and the first sliding block component is arranged on the first guide rail and can move along the first guide rail; and a first rail-slider compact disposed at least partially on one side of the carrier; one side of the first sliding block component abuts against a first leaning edge arranged on the carrier, and the other side of the first sliding block component abuts against the first guide rail sliding block pressing block.
In some embodiments, one side of the first rail abuts a second abutment provided on the work platform, and the other side of the first rail abuts a first wedge block that is partially embedded in a first groove provided on the work platform.
In some embodiments, the work platform is manufactured by high precision machining.
In some embodiments, the servo motor is a high resolution servo motor.
In some embodiments, the lead screw is a high precision ball screw.
In some embodiments, the first rail is a high precision linear rail.
In some embodiments, the servo motor has a band-type brake.
In some embodiments, the lead screw module further comprises a second guide rail disposed on the work platform, the second guide rail being parallel to the first guide rail, the lower surface of the carrier further having a second slider assembly disposed on and movable along the second guide rail, wherein one side of the second guide rail abuts a third abutment provided on the work platform, the other side of the second guide rail abuts a second wedge partially embedded in a second groove provided on the work platform, and wherein one side of the second slider assembly abuts a fourth abutment provided on the carrier.
In some embodiments, the lead screw module further includes a second rail-slider compact disposed at least partially on the one side of the carrier.
In some embodiments, the other side of the first rail further abuts a second wedge.
In some embodiments, the lead screw module further comprises a grating scale reading head disposed on one side of the carrier and a grating scale disposed on a respective side of the work platform, wherein the grating scale reading head and the grating scale are configured to generate a feedback signal based on a position of the carrier and send the feedback signal to a controller communicatively coupled to the servo motor.
In some embodiments, the support bearing comprises a support bearing seat mounted on the working platform, the servo motor comprises a motor seat mounted on the working platform, wherein at least one pin for positioning the support bearing seat is arranged on the support bearing seat, and at least one pin for positioning the motor seat is arranged on the motor seat.
In another aspect, the present application provides a lead screw module, comprising: a working platform; a servo motor disposed on the work platform; a lead screw having one end connected to the servo motor and the other end connected to a support bearing; a guide rail disposed on the work platform; the lower surface of the carrier is provided with a sliding block component which is arranged on the guide rail and can move along the guide rail; wherein one side of the guide rail abuts against an abutment edge arranged on the working platform, the other side of the guide rail abuts against a wedge block which is partially embedded in a groove arranged on the working platform.
In another aspect, the present application provides a lead screw module, comprising: a working platform; a servo motor disposed on the work platform; a lead screw having one end connected to the servo motor and the other end connected to a support bearing; a guide rail disposed on the work platform; the carrier is mounted on the lead screw, the lower surface of the carrier is provided with a sliding block assembly, and the sliding block assembly is arranged on the guide rail and can move along the guide rail; and a grating scale reading head disposed on one side of the carrier and a grating scale disposed on a corresponding side of the work platform, wherein the grating scale reading head and the grating scale are configured to generate a feedback signal based on a position of the carrier and send the feedback signal to a controller communicatively coupled to the servo motor.
In some embodiments, one side of the rail abuts against a rim provided on the work platform and the other side of the rail abuts against a wedge block which is partially embedded in a groove provided on the work platform.
In some embodiments, one side of the slider assembly abuts against a rim provided on the carrier and the other side of the slider assembly abuts against a rail slider compact disposed at least partially on one side of the carrier.
In some embodiments, the support bearing comprises a support bearing seat mounted on the working platform, the servo motor comprises a motor seat mounted on the working platform, wherein at least one pin for positioning the support bearing seat is arranged on the support bearing seat, and at least one pin for positioning the motor seat is arranged on the motor seat.
In another aspect, the present application provides a wafer bonding positioning device, comprising: according to the screw module provided by the embodiment of the application; and an imaging assembly disposed on the carrier in the lead screw module.
In another aspect, the present application provides a method of operating a lead screw module according to an embodiment of the present application, comprising: driving a screw by a servo motor in a screw module based on a control signal from a controller coupled to the servo motor to move a carrier; monitoring the position of the carrier via a grating scale reading head and a grating scale; generating a feedback signal by the grating ruler reading head based on the monitored position of the carrier, and sending the feedback signal to the controller; and driving, by the servo motor, the lead screw to move the carrier based on an adjusted control signal from the controller, the adjusted control signal based at least in part on the feedback signal.
In some embodiments, the method further comprises de-energizing the servo motor when the carrier reaches a predetermined position.
The details of one or more examples of the application are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the description and drawings, and from the claims.
Drawings
The disclosure in this specification refers to and includes the following figures:
fig. 1 is a perspective view of a wafer bonding positioning device according to some embodiments of the present application.
Fig. 2 is a top view of the wafer bonding positioning apparatus shown in fig. 1.
Fig. 3 is a right side view of the wafer bonding positioning apparatus shown in fig. 1.
In accordance with common practice, the various features illustrated in the drawings may not be drawn to scale. Accordingly, the dimensions of the various features may be arbitrarily expanded or reduced for clarity. The shapes of the various components illustrated in the figures are merely exemplary shapes and are not intended to limit the actual shapes of the components. In addition, the embodiments illustrated in the drawings may be simplified for clarity. Thus, the illustrations may not illustrate all of the components of a given device or apparatus. Finally, the same reference numerals may be used throughout the specification and drawings to refer to the same features.
Detailed Description
For a better understanding of the spirit of the present application, it is further described below in connection with some of the examples of the present application.
The appearances of the phrase "in one embodiment" or "in accordance with one embodiment" in various places in the specification are not necessarily all referring to the same specific embodiment, nor are "in other embodiment(s) or" in accordance with other embodiment(s) "in the specification. It is intended that, for example, claimed subject matter include all or a combination of portions of example embodiments. The meaning of "up" and "down" referred to herein is not limited to the relationship directly presented by the drawings, which shall include descriptions having explicit correspondence, such as "left" and "right", or vice versa. The term "connected" as used herein is understood to encompass "directly connected" as well as "connected via one or more intermediate components. The names of the various components used in the present specification are for illustration purposes only and are not limiting, and different manufacturers may use different names to refer to components having the same function.
Various embodiments of the present application are discussed in detail below. Although specific implementations are discussed, it should be understood that these implementations are for illustrative purposes only. One skilled in the relevant art will recognize that other components and configurations may be used without departing from the spirit and scope of the application. Implementations of the present application may not necessarily include all the components or steps in the embodiments described in the specification, and the order of execution of the steps may be adjusted according to the actual application.
A wafer bonding and positioning device using a lead screw module is described in detail below with reference to the accompanying drawings. It should be appreciated that the screw module provided in the present application may be applied not only to a wafer bonding positioning device, but also to other similar devices. In various specific applications, the lead screw module may have various modifications without departing from the spirit or scope of the present application.
Fig. 1 illustrates a perspective view of a wafer bonding positioning device 10 according to some embodiments of the present application. Fig. 2 and 3 show top and right views, respectively, of the wafer bonding positioning device 10 shown in fig. 1.
As shown in fig. 1, the wafer bonding positioning apparatus 10 includes an imaging assembly 106 and a lead screw module. The screw module comprises a working platform 107, a servo motor 101 arranged on the working platform 107, a screw 104, a carrier 114 and a linear guide rail 105. The work platform 107 may be manufactured by high precision machining processes to precisely fit the various components mounted thereon to match the high positioning accuracy requirements of the wafer bonding and positioning device. In some embodiments, to meet the positioning accuracy requirement, the servo motor 101 may be a high resolution servo motor, the screw 104 may be a high accuracy ball screw, and the linear guide 105 may be a high accuracy linear guide. The imaging assembly 106 is disposed on a carrier 114. The imaging assembly 106 may include a Charge Coupled Device (CCD) or other optical imaging device for capturing an identification on the wafer for wafer bond inspection.
The carrier 114 is mounted on the lead screw 104. The lead screw 104 is connected to a support bearing (e.g., ball bearing) at one end and to the servo motor 101 at the other end. The servo motor 101 may drive the screw 104 to rotate. As the screw 104 rotates, the carrier 114 may move linearly along the screw 104. The servo motor 101 has a band-type brake, and does not drift when power is off. Therefore, when power is off, the position of the carrier 114 can be locked, so that the positioning accuracy is ensured.
Referring to fig. 1 to 3, the linear guide 105 may include a guide 105-1 and a guide 105-2, which are disposed at both sides of the upper surface of the work platform 107, respectively. The guide rail 105-1 is parallel to the guide rail 105-2. The lower surface of the carrier 114 may be mounted with a slider assembly 113-1 and a slider assembly 113-2. The slider assemblies 113-1 and 113-2 are respectively disposed on the guide rail 105-1 and the guide rail 105-2, and can slide along the guide rail 105-1 and the guide rail 105-2, so that the carrier 114 can move along the guide rail 105 in a linear manner under the driving of the servo motor 101. The lower surfaces of the slider assemblies 113-1 and 113-2 may have shapes that match the guide rail 105-1 and the guide rail 105-2. In other embodiments, the lead screw module may include other numbers of rail and slider assemblies.
In some embodiments of the present application, the working platform 107 may be provided with a leaning edge 112-1 and a leaning edge 112-2 as mounting location references for the rail 105-1 and the rail 105-2, respectively. The carrier 114 may further be provided with a leaning edge 112-3 and a leaning edge 112-4, which are used as installation positioning references of the slider assembly 113-1 and the slider assembly 113-2, respectively. The positions of these edges can be determined by accurate calculation. As shown in fig. 3, the run-on is an edge that protrudes from the corresponding reference plane. Depending on the application requirements, the side surfaces of the run-on edge may be perpendicular to the respective reference plane or at an oblique angle with respect to the respective reference plane.
In some embodiments, rail 105-1 may be secured between side edge 112-1 and wedge 110-1 by wedge 110-1, and rail 105-2 may be secured between side edge 112-2 and wedge 110-2 by wedge 110-2. As shown in FIG. 3, the two sides of the rail 105-1 abut the wedge block 110-1 and the abutment edge 112-1, respectively, and the two sides of the rail 105-2 abut the wedge block 110-2 and the abutment edge 112-2, respectively, with the wedge block 110-1 and the wedge block 110-2 partially embedded in a recess provided in the work platform 107. The position of the groove can be determined by precise calculation. In the cross section shown in FIG. 3, wedge 110-1 and wedge 110-2 generally exhibit a trapezoid shape with a wider upper portion and a narrower lower portion. In some embodiments, a plurality of wedge blocks 110-1 may be provided on one side of the rail 105-1 and a plurality of wedge blocks 110-2 may be provided on one side of the rail 105-2.
In some embodiments, the slider assembly 113-1 may be secured between the abutment edge 112-3 and the rail slider block 111 by the rail slider block 111 and stably seated on the rail 105-1. As shown in FIG. 3, both sides of the slider assembly 113-1 abut against the rail slider press 111 and the abutment edge 112-3, respectively. As shown in fig. 2, the lead screw module may include two rail slider compacts 111 disposed at least partially on one side of the carrier 114. In other embodiments, other numbers of rail slider compacts 111 may also be included. In the embodiment shown in fig. 2 and 3, one side of the slider assembly 113-2 abuts the edge 112-4 and the other side is not provided with a rail slider compact.
The above-described "abutting" relationship refers to the components contacting each other and limiting to some extent the slight displacement of the components. For example, the rail 105-1 is captured between the abutment 112-1 and the wedge block 110-1 to limit loosening or movement of the rail 105-1 after long term operation of the lead screw module. The same limitations are also imposed on the rail 105-2, the slider assembly 113-1, and the slider assembly 113-2 based on the discussion above. By using the side, the wedge block and the guide rail slider pressing block, the linear guide rail 105 can be completely fixed during installation, so that the parallelism between the guide rail 105-1 and the guide rail 105-2 can be kept stable for a long time, and the possibility of loosening or displacement of the linear guide rail 105 is greatly reduced during use.
As shown in fig. 2, the support bearing of the lead screw 104 may include a support bearing housing, and the servo motor 101 may include a motor housing. The support bearing housing and the motor housing may be mounted on the work platform 107 by fixing means such as screws for mounting the support bearing of the screw 104 and the servo motor 101, respectively, to the work platform 107. Pins 108-1 and 108-2 for their mounting and positioning may be provided on the support bearing housing, and pins 109-1 and 109-2 for their mounting and positioning may be provided on the motor housing. The pins 108-1 and 108-2 may be symmetrically disposed on both sides of the support bearing housing (e.g., symmetrically with respect to a center position of the support bearing housing), and the pins 109-1 and 109-2 may be symmetrically disposed on both sides of the motor housing (e.g., symmetrically with respect to a center position of the motor housing). The plurality of pins may be used to define the position of the support bearings of the screw 104 and the servo motor 101, thereby ensuring long-term parallelism between the linear guide 105 and the screw 104. In other embodiments, other numbers of pins may be provided.
Through limit, wedge, guide rail slider briquetting spacing and fastening effect and through the positioning action of pin, the lead screw module that this application provided can ensure that it remains higher precision level throughout in long-term operation in-process to guarantee the positioning accuracy of wafer bonding positioner 10 in operation and the stability of precision after long-term operation.
As shown in fig. 1 and 3, the lead screw module may include a grating scale 102 and a grating scale reading head 103. The grating scale 102 is positioned on one side of the table 107 and the grating scale reading heads 103 are positioned on the corresponding side of the carrier 114. As shown in fig. 2, a grating scale reading head 103 may be provided between two rail slider compacts 111 disposed on one side of a carrier 114. As the carriage 114 moves along the linear guide 105, the grating scale reading head 103 moves along the grating scale 102 as the carriage 114 moves, so that the position of the carriage 114, i.e., the imaging assembly 106 disposed on the carriage 114, can be determined from the reading of the grating scale 102.
During operation of wafer bonding positioning apparatus 10, grating scale 102 and grating scale reading head 103 may be configured to determine the position or distance of movement of carrier 114 and generate corresponding feedback signals that may be used to adjust control signals that control servo motor 101. Specifically, the grating scale reading head 103 may generate and send feedback signals to a controller (e.g., a host computer) communicatively coupled to the servo motor 101, based on which the controller adjusts control signals for controlling the servo motor 101 such that the servo motor 101 accurately positions the movement of the carrier 114. The control mode can effectively avoid positioning errors caused by lead errors of the lead screw and installation processing. Position feedback from the grating scale reading head 103 ensures the reliability of the displacement of the carrier 114, thereby ensuring the positioning accuracy of the wafer bonding positioning device 10 in operation.
According to some embodiments of the present application, the method of operating the lead screw module in the wafer bonding positioning apparatus 10 may include the following steps.
A control signal is generated by a controller (e.g., an upper computer) coupled to the servo motor 101 and transmitted to the servo motor 101. The servo motor 101 drives the screw 104 in response to the control signal, thereby moving the carrier 114 connected to the screw 104. During movement of the carrier 114, the position of the carrier 114 is monitored via the grating scale reading head 103 on the carrier 114 and the grating scale 102 on the work platform 107. The grating scale reading head 103 generates a feedback signal (e.g., an electrical signal) based on the monitored position of the carrier 114 and sends the feedback signal to the controller. The controller may adjust the control signal for driving the servo motor 101 based at least in part on the received feedback signal.
In some embodiments, when the carrier 114 reaches a predetermined position, the servo motor 101 may be de-energized. At this point, imaging assembly 106 may be utilized to take a photograph (e.g., a photograph of a logo on a wafer).
Although the above method is described in connection with a lead screw module in wafer bonding positioning apparatus 10, those skilled in the art will appreciate that the method may be applied to lead screw modules having similar structures or functions.
The screw module and the operation method thereof can at least solve the problems of low positioning precision, unstable positioning precision during long-term operation and the like of the traditional screw module. Compared with the linear motor module, the lead screw module provided by the application can eliminate the influence on the detection precision of the wafer bonding positioning device caused by drift, large power consumption, large heat productivity and insufficient rigidity due to power failure. The screw rod module provided by the application has the advantages of high cost performance, excellent positioning precision, stable precision after long-term operation, high rigidity, stable performance after power failure, small relative heating value and the like.
The description herein is presented to enable one of ordinary skill in the art to make and use the application. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the present application is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (20)

1. A lead screw module, comprising:
a working platform;
a servo motor disposed on the work platform;
a lead screw having one end connected to the servo motor and the other end connected to a support bearing;
a first guide rail disposed on the work platform;
the carrier is mounted on the lead screw, the lower surface of the carrier is provided with a first sliding block component, and the first sliding block component is arranged on the first guide rail and can move along the first guide rail; a kind of electronic device with high-pressure air-conditioning system
A first rail-slider compact disposed at least partially on one side of the carrier;
one side of the first sliding block component abuts against a first leaning edge arranged on the carrier, and the other side of the first sliding block component abuts against the first guide rail sliding block pressing block.
2. The lead screw module of claim 1, wherein one side of the first rail abuts a second abutment provided on the work platform and the other side of the first rail abuts a first wedge partially embedded in a first groove provided on the work platform.
3. The lead screw module of claim 1, wherein the work platform is manufactured by high precision machining.
4. The lead screw module of claim 1, wherein the servo motor is a high resolution servo motor.
5. The lead screw module of claim 1, wherein the lead screw is a high precision ball screw.
6. The lead screw module of claim 1, wherein the first rail is a high precision linear rail.
7. The lead screw module of claim 1, wherein the servo motor has a band-type brake.
8. The lead screw module of claim 1, further comprising a second rail disposed on the work platform, the second rail being parallel to the first rail, the lower surface of the carrier further having a second slider assembly disposed on and movable along the second rail, wherein one side of the second rail abuts a third abutment disposed on the work platform, the other side of the second rail abuts a second wedge, the second wedge is partially embedded in a second groove disposed on the work platform, and wherein one side of the second slider assembly abuts a fourth abutment disposed on the carrier.
9. The lead screw module of claim 1, further comprising a second rail-slider compact disposed at least partially on the one side of the carrier.
10. The lead screw module of claim 2, wherein the other side of the first rail further abuts a second wedge.
11. The lead screw module of claim 1, further comprising a grating scale reading head disposed on one side of the carrier and a grating scale disposed on a respective side of the work platform, wherein the grating scale reading head and the grating scale are configured to generate a feedback signal based on a position of the carrier and send the feedback signal to a controller communicatively coupled to the servo motor.
12. The screw module of claim 1, wherein the support bearing comprises a support bearing housing mounted on the work platform, the servo motor comprises a motor housing mounted on the work platform, wherein at least one pin for positioning the support bearing housing is provided on the support bearing housing, and at least one pin for positioning the motor housing is provided on the motor housing.
13. A lead screw module, comprising:
a working platform;
a servo motor disposed on the work platform;
a lead screw having one end connected to the servo motor and the other end connected to a support bearing;
a guide rail disposed on the work platform; a kind of electronic device with high-pressure air-conditioning system
The carrier is mounted on the lead screw, the lower surface of the carrier is provided with a sliding block assembly, and the sliding block assembly is arranged on the guide rail and can move along the guide rail;
wherein one side of the guide rail abuts against an abutment edge arranged on the working platform, the other side of the guide rail abuts against a wedge block which is partially embedded in a groove arranged on the working platform.
14. A lead screw module, comprising:
a working platform;
a servo motor disposed on the work platform;
a lead screw having one end connected to the servo motor and the other end connected to a support bearing;
a guide rail disposed on the work platform;
the carrier is mounted on the lead screw, the lower surface of the carrier is provided with a sliding block assembly, and the sliding block assembly is arranged on the guide rail and can move along the guide rail; a kind of electronic device with high-pressure air-conditioning system
A grating scale reading head disposed on one side of the carrier and a grating scale disposed on a corresponding side of the work platform, wherein the grating scale reading head and the grating scale are configured to generate a feedback signal based on a position of the carrier and send the feedback signal to a controller communicatively coupled to the servo motor.
15. The lead screw module of claim 14, wherein one side of the rail abuts against a rim provided on the work platform and the other side of the rail abuts against a wedge that is partially embedded in a groove provided on the work platform.
16. The lead screw module of claim 14, wherein one side of the slider assembly abuts against a rim provided on the carrier and the other side of the slider assembly abuts against a rail slider compact disposed at least partially on one side of the carrier.
17. The lead screw module of claim 14, wherein the support bearing comprises a support bearing housing mounted on the work platform, the servo motor comprises a motor housing mounted on the work platform, wherein at least one pin for positioning the support bearing housing is provided on the support bearing housing, and at least one pin for positioning the motor housing is provided on the motor housing.
18. A wafer bonding positioning device, comprising:
the lead screw module of any one of claims 1-17; a kind of electronic device with high-pressure air-conditioning system
An imaging assembly disposed on the carrier.
19. A method of operating the lead screw module of any one of claims 14-17, comprising:
driving, by the servo motor, the lead screw to move the carrier based on a control signal from a controller coupled to the servo motor;
monitoring the position of the carrier via the grating ruler reading head and the grating ruler;
generating a feedback signal by the grating ruler reading head based on the monitored position of the carrier, and sending the feedback signal to the controller; a kind of electronic device with high-pressure air-conditioning system
The lead screw is driven by the servo motor to move the carrier based on an adjusted control signal from the controller, the adjusted control signal based at least in part on the feedback signal.
20. The method of claim 19, further comprising de-energizing the servo motor when the carrier reaches a predetermined position.
CN202111639034.1A 2021-12-29 2021-12-29 Lead screw module, wafer bonding positioning device and operation method thereof Pending CN116417393A (en)

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CN116417393A true CN116417393A (en) 2023-07-11

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