CN116406242A - Imaging method for reducing feature impact in imaging system - Google Patents
Imaging method for reducing feature impact in imaging system Download PDFInfo
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- CN116406242A CN116406242A CN202180063097.9A CN202180063097A CN116406242A CN 116406242 A CN116406242 A CN 116406242A CN 202180063097 A CN202180063097 A CN 202180063097A CN 116406242 A CN116406242 A CN 116406242A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
- A61B6/52—Devices using data or image processing specially adapted for radiation diagnosis
- A61B6/5211—Devices using data or image processing specially adapted for radiation diagnosis involving processing of medical diagnostic data
- A61B6/5229—Devices using data or image processing specially adapted for radiation diagnosis involving processing of medical diagnostic data combining image data of a patient, e.g. combining a functional image with an anatomical image
- A61B6/5235—Devices using data or image processing specially adapted for radiation diagnosis involving processing of medical diagnostic data combining image data of a patient, e.g. combining a functional image with an anatomical image combining images from the same or different ionising radiation imaging techniques, e.g. PET and CT
- A61B6/5241—Devices using data or image processing specially adapted for radiation diagnosis involving processing of medical diagnostic data combining image data of a patient, e.g. combining a functional image with an anatomical image combining images from the same or different ionising radiation imaging techniques, e.g. PET and CT combining overlapping images of the same imaging modality, e.g. by stitching
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
- A61B6/58—Testing, adjusting or calibrating apparatus or devices for radiation diagnosis
- A61B6/582—Calibration
- A61B6/585—Calibration of detector units
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
- A61B6/58—Testing, adjusting or calibrating apparatus or devices for radiation diagnosis
- A61B6/586—Detection of faults or malfunction of the device
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/29—Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
- G01T1/2914—Measurement of spatial distribution of radiation
- G01T1/2992—Radioisotope data or image processing not related to a particular imaging system; Off-line processing of pictures, e.g. rescanners
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
- A61B6/42—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment with arrangements for detecting radiation specially adapted for radiation diagnosis
- A61B6/4208—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment with arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector
- A61B6/4258—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment with arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector for detecting non x-ray radiation, e.g. gamma radiation
Abstract
Disclosed herein is a method comprising: capturing M partial images of a scene one by one, wherein the scene comprises an object, a marker, and a feature, wherein the feature is not part of the object, wherein the marker and the feature are stationary relative to the object, wherein the marked image is in a marked partial image of the M partial images, wherein the image of the feature is in a feature partial image of the M partial images, and wherein M is an integer greater than 1; locating the image of the feature based on (a) the location of the image of the marker and (B) the location of the feature relative to the marker; and altering the image of the feature to reduce the effect of the feature.
Description
[ background Art ]
A radiation detector is a device that measures radiation properties. Examples of properties may include the spatial distribution of intensity, phase and polarization of the radiation. The radiation may be radiation that has interacted with the object. For example, the radiation measured by the radiation detector may be radiation that has penetrated the object. The radiation may be electromagnetic radiation, such as infrared light, visible light, ultraviolet light, X-rays or gamma rays. The radiation may also be of other types, such as alpha rays and beta rays. The imaging system may include one or more image sensors, each of which may have a plurality of radiation detectors.
[ invention ]
Disclosed herein is a method comprising: capturing M partial images of a scene one by one, wherein the scene comprises an object, a marker, and a feature, wherein the feature is not part of the object, wherein the marker and the feature are stationary relative to the object, wherein the marked image is in a marked partial image of the M partial images, wherein the image of the feature is in a feature partial image of the M partial images, and wherein M is an integer greater than 1; locating the image of the feature based on (a) the location of the image of the marker and (B) the location of the feature relative to the marker; and altering the image of the feature to reduce the effect of the feature.
In one aspect, the locating the image of the feature comprises: locating the image of the feature in the feature partial image based on (a) a position of the image of the marker in the marker partial image, (B) the position of the feature relative to the marker, and (C) a position of the radiation detector when the radiation detector captured the feature partial image relative to a position of the radiation detector when the radiation detector captured the marker partial image.
In one aspect, the method further comprises stitching the M partial images, thereby obtaining a stitched image of the scene.
In one aspect, the locating the image of the feature comprises: locating the image of the feature in the stitched image based on (a) the position of the image of the marker in the stitched image, and (B) the position of the feature relative to the marker.
In an aspect, the marked partial image is a first partial image to be captured among the M partial images.
In an aspect, the marked partial image is a second partial image to be captured among the M partial images.
In an aspect, the capturing the M partial images one by one includes capturing the M partial images using a radiation detector.
In one aspect, capturing the M partial images one by one further comprises: the radiation detector is translated through M positions at which the radiation detector captures the M partial images, respectively, in a straight line without foldback.
In one aspect, the marker and the feature are between the object and the radiation detector.
In one aspect, the feature is a portion of a plate between the object and the radiation detector, and wherein the plate is transparent to radiation used for imaging in the radiation detector.
In one aspect, the changing the image of the feature comprises: the intensity value of each image element of the image of the feature is changed to a pre-specified amount or factor for said each image element.
In an aspect, the capturing the M partial images one by one includes imaging each partial image of the M partial images using X-ray photons.
In one aspect, the marked partial image is different from the characteristic partial image.
In one aspect, the marked partial image is identical to the characteristic partial image.
Disclosed herein is an imaging system comprising a radiation detector configured to: capturing M partial images of a scene one by one, wherein the scene comprises an object, a marker, and a feature, wherein the feature is not part of the object, wherein the marker and the feature are stationary relative to the object, wherein the marked image is in a marked partial image of the M partial images, wherein the image of the feature is in a feature partial image of the M partial images, and wherein M is an integer greater than 1; locating the image of the feature based on (a) the location of the image of the marker and (B) the location of the feature relative to the marker; and altering the image of the feature to reduce the effect of the feature.
In an aspect, the radiation detector is further configured to locate the image of the feature in the feature partial image based on (a) the location of the image of the marker in the marker partial image, (B) the location of the feature relative to the marker, and (C) the location of the radiation detector when the radiation detector captured the feature partial image relative to the location of the radiation detector when the radiation detector captured the marker partial image.
In an aspect, the radiation detector is further configured to stitch the M partial images to obtain a stitched image of the scene.
In an aspect, the radiation detector is further configured to locate the image of the feature in the stitched image based on (a) the position of the image of the marker in the stitched image, and (B) the position of the feature relative to the marker.
In an aspect, the marked partial image is a first partial image to be captured among the M partial images.
In an aspect, the marked partial image is a second partial image to be captured among the M partial images.
In an aspect, the radiation detector is configured to translate through M positions at which the radiation detector captures the M partial images, respectively, without foldback along a straight line.
In one aspect, the marker and the feature are between the object and the radiation detector.
In one aspect, the feature is a portion of a plate between the object and the radiation detector, and wherein the plate is transparent to radiation used for imaging in the radiation detector.
In an aspect, the radiation detector is configured to change an intensity value of each image element of the image of the feature to a pre-specified amount or factor for the each image element.
In one aspect, the imaging system further comprises a radiation source configured to generate X-ray photons for use by the radiation detector in capturing the M partial images.
In one aspect, the marked partial image is different from the characteristic partial image.
In one aspect, the marked partial image is identical to the characteristic partial image.
Disclosed herein is a computer program product comprising a non-transitory computer readable medium having instructions recorded thereon, which when executed by a computer, implement any of the methods described above.
[ description of the drawings ]
Fig. 1 schematically shows a radiation detector according to an embodiment.
Fig. 2 schematically shows a simplified cross-sectional view of a radiation detector according to an embodiment.
Fig. 3 schematically shows a detailed cross-sectional view of a radiation detector according to an embodiment.
Fig. 4 schematically shows a detailed cross-sectional view of a radiation detector according to an alternative embodiment.
Fig. 5 schematically shows a perspective view of an imaging system according to an embodiment.
Fig. 6A to 9 schematically show top views of an imaging system in operation according to an embodiment.
Fig. 10 is a flow chart summarizing the operation of an imaging system.
[ detailed description ] of the invention
Radiation detector
As an example, fig. 1 schematically shows a radiation detector 100. The radiation detector 100 may include an array of pixels 150 (also referred to as sensing elements 150). The array may be a rectangular array (as shown in fig. 1), a cellular array, a hexagonal array, or any other suitable array. The array of pixels 150 in the example of fig. 1 has 4 rows and 7 columns; in general, however, an array of pixels 150 may have any number of rows and any number of columns.
Each pixel 150 may be configured to detect radiation incident thereon from a radiation source (not shown) and may be configured to measure characteristics of the radiation (e.g., energy, wavelength, and frequency of the particles). The radiation may include particles, such as photons and subatomic particles. Each pixel 150 may be configured to count the number of radiation particles over a period of time for which energy incident thereon falls in a plurality of energy intervals. All pixels 150 may be configured to count the number of radiation particles incident thereon over a plurality of energy intervals over the same period of time. When the incident radiation particles have similar energies, the pixel 150 may simply be configured to count the number of radiation particles incident thereon over a period of time without measuring the energies of the individual radiation particles.
Each pixel 150 may have its own analog-to-digital converter (ADC) configured to digitize an analog signal representing the energy of the incident radiation particle into a digital signal, or to digitize an analog signal representing the total energy of a plurality of incident radiation particles into a digital signal. The pixels 150 may be configured to operate in parallel. For example, while one pixel 150 is measuring an incident radiation particle, another pixel 150 may be waiting for the radiation particle to arrive. The pixels 150 may not necessarily be individually addressable.
The radiation detector 100 described herein may be applied to, for example, an X-ray telescope, X-ray mammography, industrial X-ray feature detection, X-ray microscope or micro-radiography, X-ray casting inspection, X-ray nondestructive testing, X-ray weld inspection, X-ray digital subtraction angiography, and the like. It may also be suitable to use the radiation detector 100 instead of a photographic plate, photographic film, PSP plate, X-ray image intensifier, scintillator or other semiconductor X-ray detector.
Fig. 2 schematically illustrates a simplified cross-sectional view of the radiation detector 100 of fig. 1 along line 2-2, in accordance with an embodiment. In particular, radiation detector 100 may include a radiation absorbing layer 110 and an electronics layer 120 (which may include one or more ASICs or application specific integrated circuits) for processing or analyzing electrical signals generated by incident radiation in radiation absorbing layer 110. The radiation detector 100 may or may not include a scintillator (not shown). The radiation absorbing layer 110 may comprise a semiconductor material, such as silicon, germanium, gaAs, cdTe, cdZnTe, or a combination thereof. The semiconductor material may have a high mass attenuation coefficient for the radiation of interest.
Fig. 3 schematically shows a detailed cross-sectional view of the radiation detector 100 of fig. 1 along line 2-2 as an example. In particular, the radiation absorbing layer 110 can include one or more diodes (e.g., p-i-n or p-n) formed from one or more discrete regions 114 of the first doped region 111, the second doped region 113. The second doped region 113 may be separated from the first doped region 111 by an optional intrinsic region 112. The discrete regions 114 may be separated from each other by the first doped region 111 or the intrinsic region 112. The first doped region 111 and the second doped region 113 may have opposite types of doping (e.g., region 111 is p-type, region 113 is n-type, or region 111 is n-type, region 113 is p-type). In the example of fig. 3, each discrete region 114 of the second doped region 113 forms a diode with the first doped region 111 and the optional intrinsic region 112. That is, in the example of fig. 3, the radiation absorbing layer 110 has a plurality of diodes (more specifically, 7 diodes correspond to 7 pixels 150 of a row in the array of fig. 1, of which only two 150 are labeled in fig. 3 for simplicity). The plurality of diodes may have an electrode 119A as a common (common) electrode. The first doped region 111 may also have discrete portions.
The electronics layer 120 may include an electronic system 121 adapted to process or interpret signals generated by radiation incident on the radiation absorbing layer 110. The electronic system 121 may include analog circuits such as a filter network, amplifiers, integrators, and comparators, or digital circuits such as a microprocessor and memory. The electronics 121 may include one or more ADCs (analog to digital converters). The electronics 121 may include components that are shared by the pixels 150 or components that are dedicated to a single pixel 150. For example, the electronic system 121 may include an amplifier dedicated to each pixel 150 and a microprocessor shared among all pixels 150. The electronic system 121 may be electrically connected to the pixel 150 through the via 131. The space between the vias may be filled with a filler material 130, which may increase the mechanical stability of the connection of the electronic device layer 120 with the radiation absorbing layer 110. Other bonding techniques may connect the electronics 121 to the pixel 150 without the use of a via 131.
When radiation from a radiation source (not shown) impinges on the radiation absorbing layer 110, which includes a diode, the radiation particles may be absorbed and generate one or more charge carriers (e.g., electrons, holes) through a variety of mechanisms. Charge carriers may drift under an electric field to an electrode of one of the diodes. The electric field may be an external electric field. The electrical contact 119B can include discrete portions, each of which is in electrical contact with the discrete region 114. The term "electrical contact" may be used interchangeably with the word "electrode". In embodiments, the charge carriers may drift in directions such that charge carriers generated by a single radiation particle are not substantially shared by two different discrete regions 114 (herein, "substantially not shared" means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to one different discrete region 114 as compared to the remaining charge carriers). Charge carriers generated by radiation particles incident around the footprint of one of the discrete regions 114 are not substantially shared with the other of the discrete regions 114. The pixels 150 associated with the discrete regions 114 may be areas surrounding the discrete regions 114 in which substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers generated by the radiation particles incident therein flow to the discrete regions 114. That is, less than 2%, less than 1%, less than 0.1%, or less than 0.01% of these charge carriers flow through the pixel 150.
Fig. 4 schematically illustrates a detailed cross-sectional view of the radiation detector 100 of fig. 1 along line 2-2, in accordance with an alternative embodiment. More specifically, the radiation absorbing layer 110 may include a resistor of semiconductor material, such as silicon, germanium, gaAs, cdTe, cdZnTe, or a combination thereof, but not include a diode. The semiconductor material may have a high mass attenuation coefficient for the radiation of interest. In an embodiment, the electronic device layer 120 of fig. 4 is similar in structure and function to the electronic device layer 120 of fig. 3.
When radiation strikes radiation absorbing layer 110, which includes a resistor rather than a diode, it can be absorbed and one or more charge carriers are generated by a variety of mechanisms. The radiating particles may generate 10 to 100,000 charge carriers. Charge carriers may drift under an electric field to electrical contacts 119A and 119B. The electric field may be an external electric field. The electrical contact 119B may include discrete portions. In embodiments, the charge carriers may drift in directions such that charge carriers generated by a single radiation particle are not substantially shared by two different discrete portions of the electrical contact 119B (herein, "substantially not shared" means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of the charge carriers flow to a different discrete portion as compared to the remaining charge carriers). Charge carriers generated by radiation particles incident around the footprint of one of these discrete portions of electrical contact 119B are not substantially shared with the other of these discrete portions of electrical contact 119B. The pixels 150 associated with the discrete portions of the electrical contacts 119B may be areas surrounding the discrete portions in which substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers generated by the radiation particles incident therein flow to the discrete portions of the electrical contacts 119B. That is, less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow through the pixel associated with one discrete portion of electrical contact 119B.
Imaging system
Fig. 5 schematically shows a perspective view of an imaging system 500 according to an embodiment. In an embodiment, the imaging system 500 may include a radiation source 510, a protective plate 520, and a radiation detector 100. As shown in fig. 5, a protective plate 520 may be located between the radiation source 510 and the radiation detector 100. In an embodiment, the protective plate 520 may be transmissive or transparent to the radiation used for imaging in the imaging system 500. In an embodiment, the protective plate 520 may be made of carbon fiber.
In an embodiment, as shown in fig. 5, an object 532 (e.g., a sword) may be positioned between the radiation source 510 and the protective plate 520. The object 532 and the protective plate 520 may be considered as part of the scene 530 between the radiation source 510 and the radiation detector 100.
In an embodiment, the radiation source 510 may generate radiation (e.g., X-rays) toward the scene 530 (including the object 532 and the protective plate 520) and the radiation detector 100.
In an embodiment, the protective plate 520 may be stationary relative to the object 532 as the radiation detector 100 moves along the protective plate 520 (i.e., to the right) in order to scan the scene 530. Scanning the scene 530 means capturing images of the scene 530 one by one using radiation from the radiation source 510.
First partial image
Fig. 6A-9 schematically illustrate top views of the imaging system 500 of fig. 5 in operation according to an embodiment. For simplicity, the radiation source 510 of fig. 5 is not shown in fig. 6A-9.
In an embodiment, referring to fig. 5, 6A and 6B, when radiation detector 100 is in a first imaging position relative to scene 530 as shown in fig. 6A, radiation detector 100 may capture a first partial image 530i1 (fig. 6B) of scene 530. Specifically, in an embodiment, when radiation detector 100 is in the first imaging position, radiation source 510 may generate radiation toward scene 530 and radiation detector 100. Using radiation from the radiation source 510 that has traversed and interacted with the scene 530, the radiation detector 100 may capture a first partial image 530i1. The first partial image 530i1 includes a partial image 532i1 of the object 532.
Second partial image
In an embodiment, after the radiation detector 100 captures a first partial image 530i1 of the scene 530, the radiation detector 100 may be moved to the right to a second imaging position relative to the scene 530, as shown in fig. 7A.
In an embodiment, referring to fig. 5, 7A and 7B, when radiation detector 100 is in a second imaging position relative to scene 530 as shown in fig. 7A, radiation detector 100 may capture a second partial image 530i2 of scene 530 (fig. 7B). Specifically, in an embodiment, when radiation detector 100 is in the second imaging position, radiation source 510 may generate radiation toward scene 530 and radiation detector 100. Using radiation from the radiation source 510 that has traversed and interacted with the scene 530, the radiation detector 100 may capture a second partial image 530i2. The second partial image 530i2 includes a partial image 532i2 of the object 532.
Third partial image
In an embodiment, after the radiation detector 100 captures a second partial image 530i2 of the scene 530, the radiation detector 100 may be moved further to the right to a third imaging position relative to the scene 530, as shown in fig. 8A.
In an embodiment, referring to fig. 5, 8A and 8B, when radiation detector 100 is in a third imaging position relative to scene 530 as shown in fig. 8A, radiation detector 100 may capture a third partial image 530i3 of scene 530 (fig. 8B). Specifically, in an embodiment, when radiation detector 100 is in the third imaging position, radiation source 510 may generate radiation toward scene 530 and radiation detector 100. Using radiation from the radiation source 510 that has traversed and interacted with the scene 530, the radiation detector 100 may capture a third partial image 530i3. The third partial image 530i3 includes a partial image 532i3 of the object 532.
Stitching of partial images
In an embodiment, after radiation detector 100 captures partial images 530i1, 530i2, and 530i3 of scene 530, radiation detector 100 may stitch partial images 530i1, 530i2, and 530i3, resulting in stitched image 530i of scene 530 (FIG. 9). Stitched image 530i of scene 530 includes stitched image 532i of object 532.
Marking and features
In an embodiment, referring to fig. 5, the protective plate 520 may include a mark 522, a first feature 524a, and a second feature 524b. In an embodiment, the indicia 522 may have a cross shape as shown in fig. 5. In an embodiment, each of the features 524a and 524b may have a size and shape corresponding to the size and shape of the pixels 150 of the radiation detector 100 (i.e., each of the features 524a and 524b has the same size and shape as the pixels 150 of the radiation detector 100 relative to the shadow of the radiation source 510 on the radiation detector 100).
In an embodiment, referring to fig. 6A-9, the marker 522 may have an image 522i in a first partial image 530i1 (fig. 6B). The first feature 524a may have an image 524ai in a first partial image 530i1 (fig. 6B). The second feature 524B may have an image 524bi in a second partial image 530i2 (fig. 7B).
In an embodiment, referring to fig. 9, after the stitched image 530i of the scene 530 is generated by the radiation detector 100, the radiation detector 100 may analyze the stitched image 530i to locate the image 522i of the marker 522 in the stitched image 530 i.
It is assumed that the radiation detector 100 has 1000 x 1000 pixels (instead of the 4 x 7 pixels shown in fig. 1). As a result, each partial image of the scene 530 captured by the radiation detector 100 has 1000×1000 image elements.
It is assumed that the radiation detector 100, after analyzing the stitched image 530i, determines that the position of the image 522i of the marker 522 is at the image element (50, 60) of the stitched image 530i as shown in fig. 9.
Position of image of first feature in stitched image
It is further assumed that the manufacturer of the imaging system 500 has determined that the location of the first feature 524a relative to the marker 522 is in terms of image elements (730, 740) prior to shipping the imaging system 500. As a result, the position of the image 524ai of the first feature 524a in the stitched image 530i is at the image element (50+730, 60+740), which is the image element (780, 800) of the stitched image 530i, as shown in fig. 9.
Position of image of second feature in stitched image
Further assume that the manufacturer of imaging system 500 has determined that the location of second feature 524b relative to marker 522 is in terms of image elements (1600, 150) prior to shipping imaging system 500. As a result, the position of the image 524bi of the second feature 524b in the stitched image 530i is at the image element (50+1600, 60+150), which is the image element (1650, 210) of the stitched image 530i, as shown in fig. 9.
Reducing the impact of the first feature
It is further assumed that the manufacturer of the imaging system 500 has determined that the first feature 524a resulted in an undesirable increase in the intensity value of the corresponding image element in the partial image captured by the radiation detector 100 by 10 units prior to shipping the imaging system 500. As a result, in an embodiment, to reduce the impact of the first feature 524a on the stitched image 530i, the radiation detector 100 may reduce the intensity value of the image element (780, 800) of the stitched image 530i by 10 units.
Reducing the effect of the second feature
It is further assumed that the manufacturer of the imaging system 500 has determined that the second feature 524b results in an undesirable 20 units reduction in intensity values of corresponding image elements in the partial image captured by the radiation detector 100 prior to shipping the imaging system 500. As a result, in an embodiment, to reduce the effect of the second feature 524b on the stitched image 530i, the radiation detector 100 may increase the intensity value of the image element (1650, 210) of the stitched image 530i by 20 units.
Generalized flow chart
Fig. 10 shows a flowchart 1000 outlining the operation of the imaging system 500 described above. Specifically, in step 1010, M partial images of a scene may be captured one by one. For example, in the above-described embodiment, referring to fig. 6A to 8B, 3 partial images 530i1, 530i2, and 530i3 of the scene 530 (here, m=3) are captured one by one.
Additionally, in step 1010, the scene may include objects, markers, and features. For example, in the above-described embodiment, the object 532, the marker 522, and the feature 524a (or the feature 524 b) are part of the scene 530.
In addition, at step 1010, the feature is not part of the object. For example, in the above-described embodiments, the feature 524a (or the feature 524 b) is not part of the object 532.
Additionally, in step 1010, the markers and features are stationary relative to the object. For example, in the above-described embodiment, the mark 522 and the features 524a and 524b are stationary relative to the object 532.
In addition, in step 1010, the marked image is among marked partial images of the M partial images. For example, in the above-described embodiment, the image 522i of the marker 522 is in the marker partial image 53ii 1 of the 3 partial images 530i1, 530i2, and 530i3. In other words, the partial image of the image 522i having the mark 522 is referred to as a mark partial image.
In addition, in step 1010, the image of the feature is among the feature partial images of the M partial images. For example, in the above-described embodiment, the image 524ai of the first feature 524a is in the corresponding feature partial image 530i1 of the 3 partial images 530i1, 530i2, and 530i3. In other words, a partial image of an image having a feature is referred to as a feature partial image.
In step 1020, an image of the feature may be located based on (a) the location of the image of the mark and (B) the location of the feature relative to the mark. For example, in the above-described embodiment, the image 524ai of the first feature 524a is located in the stitched image 530i based on (a) the position of the image 522i of the marker 522 in the stitched image 530i (i.e., the image element (50, 60)) and (B) the position of the first feature 524a relative to the marker 522 (i.e., the (730, 740)). Specifically, the image 524ai of the first feature 524a in the stitched image 530i is positioned at an image element (50+730, 60+740), which is the image element (780, 800) of the stitched image 530i, as shown in fig. 9.
In step 1030, the image of the feature may be changed to reduce the effect of the feature. For example, in the above-described embodiment, the radiation detector 100 reduces the intensity values of the image elements (780, 800) of the stitched image 530i by 10 units to reduce the impact of the first feature 524 a.
Location of an image of a feature in a feature partial image
In the above embodiment, after stitching, the images of the features in the stitched image 530i (524 ai or 524 bi) are located, and then the images of the features in the stitched image 530i are changed to reduce the influence of the features on the stitched image 530 i. For example, the image 524ai of the first feature 524a in the stitched image 530i is positioned at the image element (780,800), and then the image 524ai of the first feature 524a in the stitched image 530i (i.e., the image element (780,800) of the stitched image 530 i)) is changed (intensity value) to reduce the effect of the first feature 524a on the stitched image 530 i.
In an alternative embodiment, the images of the features in the corresponding feature partial images may be located before stitching, and then the images of the features in the feature partial images may be changed to reduce the effect of the features on the corresponding feature partial images. For example, before stitching, the image 524bi of the second feature 524b in the corresponding feature partial image 530i2 may be located, and then the image 524bi of the second feature 524b in the corresponding feature partial image 530i2 may be changed to reduce the effect of the second feature 524b on the corresponding feature partial image 530i2.
Specifically, in an embodiment, an image of a feature in a corresponding feature partial image may be located based on (a) the position of the image of the mark in the mark partial image, (B) the position of the feature relative to the mark, and (C) the position of the radiation detector 100 when the radiation detector 100 captures the feature partial image relative to the position of the radiation detector 100 when the radiation detector 100 captures the mark partial image.
For example, in the above-described embodiment, the image 524bi of the second feature 524B in the corresponding feature partial image 530i2 is positioned based on (a) the position of the image 522i of the mark in the mark partial image 530i1 (which may be determined by the radiation detector 100 as being at the image element (50, 60)), (B) the position of the second feature 524B relative to the mark 522 (in terms of the image element, i.e., (1600, 150)), and (C) the distance between the second imaging position and the first imaging position, which is, for example, 900 image elements (in the embodiment, the distance between the first imaging position and the second imaging position, and the distance between the second imaging position and the third imaging position are pre-specified by the manufacturer). As a result, as shown in fig. 9, the image 524bi of the second feature 524b in the corresponding feature partial image 530i2 is positioned at the image element (50+1600-900, 60+150), i.e., the image element (750, 210) of the corresponding feature partial image 530i2.
Next, in an embodiment, the radiation detector 100 may change the intensity values of the image elements (750, 210) of the corresponding feature partial image 530i2 to reduce the effect of the second feature 524b on the corresponding feature partial image 530i2.
For another example, as shown in fig. 9, the image 524ai of the first feature 524a in the corresponding feature partial image 530i1 may be positioned at the image element (50+730-0, 60+740), i.e., the image element (750, 800) of the corresponding feature partial image 530i1. The radiation detector 100 may then change the intensity values of the image elements (750, 800) of the corresponding feature partial image 530i1 to reduce the effect of the first feature 524a on the corresponding feature partial image 530i1.
Additional embodiments
In the above-described embodiment, referring to fig. 9 to 10, the marker partial image (i.e., the partial image of the image with the marker 522) is the partial image 530i1, which is the first partial image to be captured among the 3 partial images 530i1, 530i2, and 530i3. In general, the marker partial image does not have to be the first partial image to be captured among the 3 partial images 530i1, 530i2, and 530i3. For example, the marker local image may be a second local image to be captured among the 3 local images (i.e., the marker 522 has its image in the second local image 530i2 but not the first local image 530i 1).
In an embodiment, while scanning the scene 530, the radiation detector 100 may translate along a straight line through the first imaging location without foldback, then through the second imaging location, and then through the third imaging location, where the radiation detector 100 captures three partial images 530i1, 530i2, and 530i3, respectively.
In an embodiment, as shown in fig. 5, the marker 522, the first feature 524a, and the second feature 524b may be between the object 532 and the radiation detector 100.
In an embodiment, referring to fig. 5, a protective plate 520 of which features 524a and 524b are a part may be between the object 532 and the radiation detector 100. In an embodiment, the protective plate 520 may be transparent to the radiation used for imaging in the radiation detector 100. For example, assuming that an X-ray photon is used to capture 3 partial images 530i1, 530i2, and 530i3, the protective plate 520 may be transparent to the X-ray photon. For example, the protective plate 520 may be made of carbon fiber.
In the above-described embodiment, referring to step 1030 of flowchart 1000 of fig. 10, the value of each image element of the image of the feature is changed by a certain amount (e.g., reduced by 10 units, as described above) to reduce the effect of the feature. Alternatively, the value of each image element of the image of the feature may change by a certain factor (rather than a certain amount). For example, the value of the image element of the image of the feature may be changed by a factor of 0.8, which means that if the original value is 30 units, the changed value should be 0.8x30=24 units.
In the above embodiment, referring to fig. 5, the mark 522 is a portion of the protection plate 520. In general, the indicia 522 need not be part of the protective plate 520.
In the above-described embodiments, each of the features 524a and 524b has a size and shape corresponding to the size and shape of the pixels 150 of the radiation detector 100. In general, each of the features 524a and 524b may have any size and shape.
While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and not limitation, with the true scope and spirit being indicated by the following claims.
Claims (28)
1. A method, comprising:
m partial images of the scene are captured one by one,
wherein the scene includes objects, markers and features,
wherein the feature is not part of the object,
wherein the marker and the feature are stationary relative to the object,
wherein the marked image is in marked partial images of the M partial images,
wherein the image of the feature is in the feature partial images of the M partial images, and
wherein M is an integer greater than 1;
locating the image of the feature based on (a) the location of the image of the marker and (B) the location of the feature relative to the marker; and
the image of the feature is altered to reduce the effect of the feature.
2. The method of claim 1, wherein the locating the image of the feature comprises: locating the image of the feature in the feature partial image based on (a) the location of the image of the marker in the marker partial image, (B) the location of the feature relative to the marker, and (C) the location of the radiation detector when the radiation detector captured the feature partial image relative to the location of the radiation detector when the radiation detector captured the marker partial image.
3. The method of claim 1, further comprising stitching the M partial images to obtain a stitched image of the scene.
4. A method according to claim 3, wherein said locating said image of said feature comprises: locating the image of the feature in the stitched image based on (a) the position of the image of the marker in the stitched image, and (B) the position of the feature relative to the marker.
5. The method of claim 1, wherein the marked partial image is a first partial image to be captured among the M partial images.
6. The method of claim 1, wherein the marked partial image is a second partial image to be captured among the M partial images.
7. The method of claim 1, wherein the capturing the M partial images one by one comprises capturing the M partial images using a radiation detector.
8. The method of claim 7, wherein capturing M partial images one by one further comprises: the radiation detector is translated through M positions at which the radiation detector captures the M partial images, respectively, in a straight line without foldback.
9. The method of claim 7, wherein the marker and the feature are between the object and the radiation detector.
10. The method according to claim 9, wherein the method comprises,
wherein the feature is a portion of a plate between the object and the radiation detector, an
Wherein the plate is transparent to the radiation used for imaging in the radiation detector.
11. The method of claim 1, wherein the changing the image of the feature comprises: the intensity value of each image element of the image of the feature is changed to a pre-specified amount or factor for said each image element.
12. The method of claim 1, wherein the capturing the M partial images one by one comprises imaging each partial image of the M partial images using X-ray photons.
13. The method of claim 1, wherein the marker partial image is different from the feature partial image.
14. The method of claim 1, wherein the marked partial image is the same as the characteristic partial image.
15. An imaging system comprising a radiation detector configured to:
m partial images of the scene are captured one by one,
wherein the scene includes objects, markers and features,
wherein the feature is not part of the object,
wherein the marker and the feature are stationary relative to the object,
wherein the marked image is in marked partial images of the M partial images,
wherein the image of the feature is in the feature partial images of the M partial images, and
wherein M is an integer greater than 1;
locating the image of the feature based on (a) the location of the image of the marker and (B) the location of the feature relative to the marker; and is also provided with
The image of the feature is altered to reduce the effect of the feature.
16. The imaging system of claim 15, wherein the radiation detector is further configured to: locating the image of the feature in the feature partial image based on (a) a position of the image of the marker in the marker partial image, (B) the position of the feature relative to the marker, and (C) a position of the radiation detector when the radiation detector captured the feature partial image relative to a position of the radiation detector when the radiation detector captured the marker partial image.
17. The imaging system of claim 15, wherein the radiation detector is further configured to stitch the M partial images to obtain a stitched image of the scene.
18. The imaging system of claim 17, wherein the radiation detector is further configured to: locating the image of the feature in the stitched image based on (a) the position of the marked image in the stitched image, and (B) the position of the feature relative to the mark.
19. The imaging system of claim 15, wherein the marker partial image is a first partial image to be captured among the M partial images.
20. The imaging system of claim 15, wherein the marker partial image is a second partial image to be captured among the M partial images.
21. The imaging system of claim 15, wherein the radiation detector is configured to translate along a straight line through M positions at which the radiation detector captures the M partial images, respectively, without foldback.
22. The imaging system of claim 15, wherein the marker and the feature are between the object and the radiation detector.
23. The imaging system of claim 22,
wherein the feature is a portion of a plate between the object and the radiation detector, an
Wherein the plate is transparent to the radiation used for imaging in the radiation detector.
24. The imaging system of claim 15, wherein the radiation detector is configured to change an intensity value of each image element of the image of the feature to a pre-specified amount or factor for the each image element.
25. The imaging system of claim 15, further comprising a radiation source configured to generate X-ray photons for use by the radiation detector in capturing the M partial images.
26. The imaging system of claim 15, wherein the marker partial image is different from the feature partial image.
27. The imaging system of claim 15, wherein the marker partial image is the same as the feature partial image.
28. A computer program product comprising a non-transitory computer readable medium having instructions recorded thereon, which when executed by a computer, implement the method of any one of claims 1 to 14.
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| PCT/CN2021/128744 WO2023077367A1 (en) | 2021-11-04 | 2021-11-04 | Imaging methods with reduction of effects of features in an imaging system |
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|---|---|
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Family Cites Families (5)
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| WO2009153789A1 (en) * | 2008-06-18 | 2009-12-23 | Surgix Ltd. | A method and system for stitching multiple images into a panoramic image |
| CN208990252U (en) * | 2015-05-25 | 2019-06-18 | 皇家飞利浦有限公司 | System for acquiring the radioscopic image of object of interest |
| WO2019012520A1 (en) * | 2017-07-08 | 2019-01-17 | Vuze Medical Ltd. | Apparatus and methods for use with image-guided skeletal procedures |
| WO2019175865A1 (en) * | 2018-03-11 | 2019-09-19 | Mazor Robotics Ltd. | Large area orthopaedic imaging method |
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2021
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| Publication number | Publication date |
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| WO2023077367A1 (en) | 2023-05-11 |
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