CN116399895A - Heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property - Google Patents
Heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property Download PDFInfo
- Publication number
- CN116399895A CN116399895A CN202310378139.9A CN202310378139A CN116399895A CN 116399895 A CN116399895 A CN 116399895A CN 202310378139 A CN202310378139 A CN 202310378139A CN 116399895 A CN116399895 A CN 116399895A
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- China
- Prior art keywords
- heat pipe
- heat
- working medium
- device capable
- vacuum degree
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- 239000004065 semiconductor Substances 0.000 claims abstract description 21
- 238000001704 evaporation Methods 0.000 claims abstract description 13
- 230000008020 evaporation Effects 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 description 16
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
Abstract
A heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property comprises a two-way valve, radiating fins, a heat pipe, a fan, a semiconductor sheet, a transformer, a digital display thermometer, a vacuumizing valve, a vacuumizing connecting pipe, a buffer tank and a vacuum pump, wherein the heat pipe is a condensing section and an evaporating section from top to bottom in a cooling manner, the bottom of the heat pipe is sealed, a pipe body is inserted with the radiating fins, and the heat is radiated in an auxiliary way of a fan of 12V 3A. The vacuumizing valve is connected with the buffer tank through a vacuumizing connecting pipe, and the buffer tank is also connected with the vacuum pump through a pipeline. The semiconductor chip is arranged at the bottom of the heat pipe, and the thermometer is positioned near the semiconductor chip. The transformer is respectively connected with the fan and the semiconductor chip.
Description
Technical Field
The device can adjust the type and the liquid filling rate of the working medium of the heat pipe, and realizes the optimal heat transfer efficiency by changing the vacuum degree by utilizing the vacuum pump (the patent of the invention relates to a heat pipe experimental research device).
Technical Field
The heat pipe is a novel efficient heat transfer element, and a typical heat pipe consists of a pipe shell, a liquid suction core and an end cover. The tube is pumped into high vacuum and then filled with proper working liquid, so that the capillary porous material of the heat absorption core, which is closely attached to the inner wall of the tube, is filled with the liquid and then sealed. One end of the pipe is an evaporation section, also called a heating section, and the other end is a condensation section, also called a cooling section, and a heat insulation section can be arranged between the two ends according to application requirements. When one section of the heat pipe is heated, the liquid in the capillary core is evaporated and vaporized, the vapor flows to the other end under a tiny pressure difference to give off heat to condense into liquid, and the liquid flows back to the evaporation section along the porous material by the action of capillary force. The circulation is not completed, and heat is transferred from one end of the heat pipe to the other end. In the process of realizing the heat transfer, the heat pipe comprises the following six main processes related to each other: (1) heat is transferred from the heat source through the heat pipe walls and wick filled with working liquid to the liquid-vapor interface; (2) evaporating the liquid at a liquid-vapor interface in the evaporation section; (3) the steam in the steam cavity flows from the evaporation section to the condensation section; (4) condensing the steam at a vapor-liquid interface within the condensing section; (5) heat is transferred from the vapor-liquid interface to the cold source through the wick, liquid and tube wall; (6) the condensed working liquid is returned to the evaporation section by capillary action in the wick.
Therefore, the heat transfer property of the heat pipe is mainly determined by various factors such as the type of working medium, the liquid filling rate of the working medium, the vacuum degree of the heat pipe, the length and the proportion of the condensing end of the evaporation section and the like. How to intuitively measure the heat transfer property of the heat pipe so as to research and optimize the structure of the heat pipe becomes a problem to be solved in the prior art.
Disclosure of Invention
In view of this, the present invention aims to provide a heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property, so as to enable the heat pipe experimental device to be used for intuitively observing heat transfer properties of heat pipes under different working media and vacuum degrees.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the heat pipe experimental device capable of adjusting working medium and measuring heat exchange property by vacuum degree comprises a two-way valve, a radiating fin, a fan, a heat pipe, a semiconductor, a digital display thermometer, a buffer tank, a vacuum pump and a transformer. The heat pipe from top to bottom be condensation segment and evaporation segment in proper order, the heat pipe bottom end seals, and the semiconductor is installed to heat pipe bottom end face, is connected with the numerical control thermometer, the heat pipe top is connected with the bi-pass valve, the one way of bi-pass valve is used for the flourishing of working medium, and another way is used for the emission of working medium for the two-sided valve accessible evacuation takeover that flourishing goes into the working medium is connected with the buffer tank, the buffer tank is still connected through the pipeline with the vacuum pump, the fin is installed in the surface of heat pipe and is perpendicular to the evaporation segment of heat pipe evenly discharges, the fan is fixed with the surface bonding of fin to be connected with the transformer.
The heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property is characterized in that the diameter of the heat pipe is 3mm, and the semiconductor size is 3X 3cm.
The heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property is characterized in that the capacity and power of the transformer and the numerical control thermometer are 12V/3A.
The heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property is characterized in that the connection mode of the top end of the heat pipe and one path of the two-way valve is as follows: the top end of the heat pipe is provided with a detachable sealing end cover, the sealing end cover is provided with a vacuum connection opening, and the vacuum connection opening is connected with one path of the double-way valve through a pipeline.
Drawings
FIG. 1 shows a heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property.
Detailed Description
Example 1
A heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property comprises a liquid inlet 1, a liquid outlet 2, a two-way valve 3, a heat pipe 4, a fan 5, a semiconductor 6, a thermometer 7, a transformer 8, cooling fins 9, a buffer tank 10 and a vacuum pump 11. The heat pipe is sequentially provided with a condensing section and an evaporating section from top to bottom, the bottom of the heat pipe is closed, a pipe body is inserted with cooling fins, and then a 12V3A fan is used for assisting in cooling. The top end of the heat pipe is connected with one path of the two-way valve, and the other path of the heat pipe is connected with the vacuumizing valve. The vacuumizing valve is connected with the buffer tank through a vacuumizing connecting pipe, and the buffer tank is also connected with the vacuum pump through a pipeline. The semiconductor chip is arranged at the bottom of the heat pipe, and the thermometer is positioned near the semiconductor chip. The transformer is respectively connected with the fan and the semiconductor chip.
In the device, all the connection modes are sealed connection.
The specification of the heat pipe is 6mm in diameter and 10cm in length.
In this embodiment, the pressure detecting device is a vacuum pump, and the vacuum pump is directly connected to one path of outlet of the two-way valve.
The overall structure schematic diagram of the heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property is shown in figure 1.
The working principle of the heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property provided by the embodiment is as follows:
1) And under the condition of room temperature (20-25 ℃), after the device is assembled and the two-way valve is connected with the heat pipe, opening the inlet end and the outlet end to add water serving as working medium into the heat pipe, and adding the working medium into the evaporation section.
2) The vacuum tube is connected with the two-way valve, the vacuum pump is opened, and when the required vacuum degree is reached, the two-way valve is closed. And (3) a power supply is switched on to enable the semiconductor to enter a working state, and meanwhile, a self-quantitative working medium is added and the heat pipe with the self-quantitative vacuum degree starts to work. The fan is turned on, so that the working medium can rapidly release heat and cool down to the condensing section, and condensate and reflux. And simultaneously, the semiconductor starts to be cooled, the cooling rate of the semiconductor is observed, and the semiconductor is observed for a period of time until the semiconductor is stable. The heat transfer properties of the heat pipe were measured.
Claims (3)
1. The utility model provides a can adjust heat transfer property's heat pipe experimental apparatus is measured to working medium and vacuum, its characterized in that the device includes two-way valve, fin, heat pipe, fan, semiconductor fin, transformer, digital display thermometer, evacuation valve, evacuation takeover, buffer tank, vacuum pump, the heat pipe from top to bottom be condensing zone and evaporation zone in proper order, the heat pipe bottom seals, the pipe shaft alternates the fin, and with 12V 3A's fan auxiliary heat dissipation again, the heat pipe top link to each other with two-way valve's one way, another way is connected with the evacuation valve, the evacuation valve is connected with the buffer tank through the evacuation takeover, the buffer tank is connected with the vacuum pump through the pipeline still, the semiconductor fin install in the heat pipe bottom, the thermometer is located near the semiconductor fin, the transformer connect fan and semiconductor fin respectively.
2. The heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property according to claim 1, wherein the diameter of the heat pipe is 6mm, and the length of the heat pipe is 10cm.
3. The heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property according to claim 1, wherein the specification of the semiconductor wafer is 3cm x 3cm.
A heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property according to any one of claims 1-3, wherein the top end of the heat pipe is connected with one path of a two-way valve, and the other path is used as a feed inlet and a discharge outlet and is connected with a vacuumizing valve.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310378139.9A CN116399895A (en) | 2023-04-11 | 2023-04-11 | Heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310378139.9A CN116399895A (en) | 2023-04-11 | 2023-04-11 | Heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property |
Publications (1)
Publication Number | Publication Date |
---|---|
CN116399895A true CN116399895A (en) | 2023-07-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310378139.9A Pending CN116399895A (en) | 2023-04-11 | 2023-04-11 | Heat pipe experimental device capable of adjusting working medium and vacuum degree to measure heat exchange property |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN116399895A (en) |
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2023
- 2023-04-11 CN CN202310378139.9A patent/CN116399895A/en active Pending
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