CN116397301A - Preparation method of novel tungsten wire matrix diamond wire saw - Google Patents
Preparation method of novel tungsten wire matrix diamond wire saw Download PDFInfo
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- CN116397301A CN116397301A CN202310391617.XA CN202310391617A CN116397301A CN 116397301 A CN116397301 A CN 116397301A CN 202310391617 A CN202310391617 A CN 202310391617A CN 116397301 A CN116397301 A CN 116397301A
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 95
- 239000010432 diamond Substances 0.000 title claims abstract description 95
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 title claims abstract description 82
- 239000011159 matrix material Substances 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 78
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 35
- 238000005238 degreasing Methods 0.000 claims abstract description 29
- 239000002253 acid Substances 0.000 claims abstract description 26
- 230000008719 thickening Effects 0.000 claims abstract description 17
- 238000001035 drying Methods 0.000 claims abstract description 16
- 238000009713 electroplating Methods 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 claims abstract description 12
- 238000004945 emulsification Methods 0.000 claims abstract description 9
- 238000005406 washing Methods 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 230000010287 polarization Effects 0.000 claims abstract description 6
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 5
- 239000010937 tungsten Substances 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 75
- 239000000758 substrate Substances 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 229910000831 Steel Inorganic materials 0.000 claims description 18
- 239000010959 steel Substances 0.000 claims description 18
- 230000009471 action Effects 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 16
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 15
- 229910052739 hydrogen Inorganic materials 0.000 claims description 15
- 239000001257 hydrogen Substances 0.000 claims description 15
- 238000004140 cleaning Methods 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 11
- 230000005684 electric field Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000004576 sand Substances 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 7
- 239000012670 alkaline solution Substances 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 5
- 238000004070 electrodeposition Methods 0.000 claims description 5
- 238000005868 electrolysis reaction Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 5
- 238000006722 reduction reaction Methods 0.000 claims description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 4
- 230000001804 emulsifying effect Effects 0.000 claims description 2
- 239000002585 base Substances 0.000 abstract description 13
- 229910000975 Carbon steel Inorganic materials 0.000 abstract description 10
- 239000010962 carbon steel Substances 0.000 abstract description 10
- 239000003513 alkali Substances 0.000 abstract description 2
- 239000003921 oil Substances 0.000 description 25
- 238000005554 pickling Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910000677 High-carbon steel Inorganic materials 0.000 description 1
- 241000221535 Pucciniales Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
- C25F1/04—Pickling; Descaling in solution
- C25F1/08—Refractory metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/36—Hydrogen production from non-carbon containing sources, e.g. by water electrolysis
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a preparation method of a novel tungsten wire matrix diamond wire saw, which comprises the steps of electrolytic degreasing, acid washing, preplating, sanding, thickening, drying and the like, wherein the electrolytic degreasing is to put tungsten wires into a solution for electrolytic degreasing, under the electrolytic condition, the polarization effect of an electrode reduces the interfacial tension of oil and the solution, the wettability of the solution to the surface of a base line is increased, the adhesion between an oil film and a metal is reduced, and oil stains are easy to peel off and disperse into the solution for emulsification and removal. The invention relates to a preparation method of a diamond wire saw, which is improved on the basis of a carbon steel diamond wire saw, original equipment and an electroplating formula are reserved, an electrolytic degreasing procedure is added in a pretreatment link, a tungsten wire has stronger breaking resistance and toughness compared with a traditional carbon steel base wire, the quality of a coating can enable the base wire to be combined with a nickel layer more tightly, and a tungsten wire matrix has strong acid and alkali resistance compared with the carbon steel wire.
Description
Technical Field
The invention relates to the technical field of diamond wire saw, in particular to a preparation method of a novel tungsten wire matrix diamond wire saw.
Background
The current diamond wire saw field basically adopts 92c or 100c wire rods as carriers to prepare diamond wire saw with different specifications, the breaking force requirements of the electroplated diamond wire with 35 mu m and 36 mu m are more than or equal to 5.3N and 5.8N, the limit wire diameter of the conventional high-carbon steel wire which can be used for cutting the photovoltaic silicon wafer is about 35 mu m in order to ensure the tension required by cutting and the tension fluctuation allowance in the cutting process, and the current steel wire used for cutting is very close to or even reaches 35 mu m, and further thinning is difficult.
Because of higher breaking force, tungsten wires are paid more attention to by manufacturers, and the excellent performance of tungsten wire steel wires is shown as follows:
1. the high breaking force value is 1.2-1.3 times of that of carbon steel with the same specification, the high torsion value is more than 10 times of that of the carbon steel with the same specification, the Young modulus of the alloy tungsten wire is 1.7 times of that of the steel wire, and the tensile rate is only about 60 percent of that of the carbon steel.
2. The tungsten belongs to a body-centered cubic lattice, the doped and modified alloy tungsten wire belongs to a microcrystalline structure, the grain size is about 100nm, so that the structure is uniform, no impurity particles are contained in the tungsten wire, the purity of the tungsten wire is as high as 99.95%, and the drawing of the superfine tungsten wire is facilitated.
3. The resistivity of the alloy tungsten wire is 5.4 multiplied by 10 to 6 omega/cm, which is only 55.7 percent of carbon steel, and can bear twice of current, and the nickel plating layer is deposited more uniformly and compactly.
4. The corrosion resistance is high, the corrosion is not generated in sulfuric acid or hydrochloric acid, and the defect wire breakage of a bus caused by the corrosion of acid in the production process is effectively avoided; therefore, the excellent index of the alloy tungsten wire is quite matched with the design requirement of the ultra-thin wire high-strength wire saw.
Disclosure of Invention
In order to solve the problems in the prior art, the invention aims to provide a preparation method of a novel tungsten wire matrix diamond wire saw.
In order to achieve the above purpose, the present invention provides the following technical solutions: the preparation method of the novel tungsten wire matrix diamond wire saw comprises the following steps:
s1: electrolytic degreasing: the tungsten wire is put into the solution for electrolytic degreasing, under the electrolytic condition, the interfacial tension of the oil and the solution is reduced by the polarization action of the electrode, the wettability of the solution to the surface of the base line is increased, the adhesion between the oil film and the metal is reduced, and the greasy dirt is easy to peel off and disperse into the solution for emulsification and removal;
s2: acid washing: immersing the tungsten wire subjected to electrolytic degreasing in the step S1 into an acid solution, and removing an oxide layer and rust matters on the surface of a substrate by etching in the acid solution;
s3: pre-plating: putting the tungsten wire treated in the step S1 and the step S2 into a nickel plating solution, and pre-plating the nickel, and depositing a nickel layer on the surface of a substrate by an electroplating method to increase the effect of the combination force of the product;
s4: and (3) sand feeding: placing diamond micro powder into a sand tank, depositing the diamond micro powder onto the surface of the substrate tungsten wire obtained in the step S3 under the action of an electric field by an electrochemical deposition method, fixedly connecting a diamond abrasive on the surface of the substrate, and simultaneously adjusting the density and distribution of deposited diamond according to the requirement;
s5: thickening: depositing a layer of solidified nickel coating on the surface of the diamond wire obtained in the step S4 under the action of current through a nickel coating solution, solidifying the bare diamond powder on the surface of the base steel wire, solidifying the diamond, preventing the diamond from falling off, and adjusting the embedding depth and the blade height of the diamond micro powder;
s6: and (3) drying: and (5) putting the thickened diamond wire obtained in the step (S5) into a heating device for heating and drying, removing water stains on the surface of the wire saw, and achieving the purpose of removing hydrogen through high temperature to obtain the finished diamond wire.
In the step S1, the preparation method preferably uses a cathode to remove oil, the surface of the cathode is subjected to reduction reaction, hydrogen is separated out, and the hydrogen released from the interface between the substrate and the solution during electrolysis plays an emulsifying role in the solution.
In the step S1, preferably, the tungsten wire is electrolytically degreased, and then the alkaline solution carried out by the electrolytic oil bath steel wire is washed with pure water.
As a preferred aspect of the present invention, in the step S2, the tungsten filament is washed with 40g/L sulfamic acid solution having a concentration of 45.+ -. 5 ℃ for 15 minutes.
In the step S2, preferably, the tungsten wire is washed with pure water after being subjected to pickling, and then the acid solution carried out by the steel wire in the pickling tank is washed with pure water.
In the step S3, preferably, the surface of the tungsten wire rope is electroplated with nickel by using the nickel plating watt solution as an electroplating solution under the action of an electric field of 2.25-7.55V.
As a preferable mode of the invention, in the step S4, the density of the diamond micro powder particles is 180-260 particles/mm.
In the step S5, the surface of the diamond wire is stained with dirt in the preplating/sanding/thickening process after being thickened, and the dirt on the surface of the wire saw in the preplating/sanding/thickening process is removed by cleaning with pure water.
As a preferable mode of the invention, the drying temperature of the nickel plating layer for thickening in the step S6 is 110-130 ℃.
Preferably, the tungsten wire has a wire diameter of 0.10 to 2.50mm.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention relates to a preparation method of a diamond wire saw, which is improved on the basis of a carbon steel diamond wire saw, original equipment and an electroplating formula are reserved, an electrolytic degreasing procedure is added in a pretreatment link, a tungsten wire has stronger breaking resistance and toughness compared with a traditional carbon steel base wire, the quality of a coating can enable the base wire to be combined with a nickel layer more tightly, and a tungsten wire matrix has strong acid and alkali resistance compared with the carbon steel wire.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The preparation method of the novel tungsten wire matrix diamond wire saw comprises the following steps:
s1: electrolytic degreasing: the method comprises the steps of putting a tungsten wire into a solution for electrolytic degreasing, wherein the wire diameter of the tungsten wire rope is 0.10-2.50 mm, under the electrolysis condition, the interfacial tension of oil and the solution is reduced by the polarization effect of an electrode, the wettability of the solution to the surface of a base wire is increased, the adhesion force between an oil film and metal is reduced, oil stains are easy to peel off and disperse into the solution for emulsification and removal, the preparation method adopts a cathode degreasing method, the surface of the tungsten wire is subjected to reduction reaction, hydrogen is separated, the hydrogen released by the interface between a substrate and the solution plays an emulsification role in the solution, because small bubbles are easy to adsorb on the surface of the oil film, the oil film is torn into small oil drops and brought to the liquid surface along with the increase and growth of bubbles, meanwhile, the stirring effect is played on the solution, the removal speed of the oil stains on the surface of the substrate is accelerated, and the tungsten wire is cleaned by pure water through alkaline solution brought by the electrolytic degreasing steel wire;
s2: acid washing: immersing the tungsten wire subjected to electrolytic degreasing in an acid solution, removing an oxide layer and rusts on the surface of a substrate by etching in the acid solution, cleaning the tungsten wire for 15min by using 40g/L sulfamic acid solution with the concentration of 45+/-5 ℃, and cleaning the acid solution carried out by a steel wire in a pickling tank by using pure water after the tungsten wire is subjected to pickling;
s3: pre-plating: putting the tungsten wire treated in the step S1 and the step S2 into a nickel plating solution, pre-plating the nickel, depositing a nickel layer on the surface of a substrate by an electroplating method, increasing the effect of product combination force, and electroplating nickel on the surface of the tungsten wire rope under the action of an electric field of 2.25-7.55V by taking the nickel plating watt solution as an electroplating solution;
s4: and (3) sand feeding: placing diamond micropowder into a sand tank, depositing the diamond micropowder onto the surface of the substrate tungsten wire obtained in the step S3 under the action of an electric field by an electrochemical deposition method, fixedly connecting a diamond abrasive on the surface of the substrate, and simultaneously adjusting the density and distribution of deposited diamond according to the requirement, wherein the density of diamond micropowder particles is 180-260 particles/mm;
s5: thickening: depositing a layer of solidified nickel coating on the surface of the diamond wire obtained in the step S4 under the action of current through a nickel coating solution, solidifying the bare diamond powder on the surface of a base steel wire, reinforcing the diamond, preventing the diamond from falling off, adjusting the embedding depth and the blade height of the diamond micro powder, and adhering dirt of a preplating/sanding/thickening process on the surface of the diamond wire after thickening, wherein the dirt of the surface of the diamond wire is removed by cleaning through pure water;
s6: and (3) drying: and (3) putting the thickened diamond wire obtained in the step (S5) into a heating device for heating and drying, wherein the drying temperature of the thickened nickel-plated layer is 110-130 ℃, removing water stains on the surface of the wire saw, and achieving the purpose of removing hydrogen through high temperature to obtain the finished diamond wire.
Example two
The preparation method of the novel tungsten wire matrix diamond wire saw comprises the following steps:
s1: electrolytic degreasing: the method comprises the steps of putting a tungsten wire into a solution for electrolytic degreasing, wherein the wire diameter of the tungsten wire rope is 0.10-1.50 mm, under the electrolysis condition, the interfacial tension of oil and the solution is reduced by the polarization effect of an electrode, the wettability of the solution to the surface of a base wire is increased, the adhesion force between an oil film and metal is reduced, oil stains are easy to peel off and disperse into the solution for emulsification and removal, the preparation method adopts a cathode degreasing method, the surface of the tungsten wire is subjected to reduction reaction, hydrogen is separated, the hydrogen released by the interface between a substrate and the solution plays an emulsification role in the solution, because small bubbles are easy to adsorb on the surface of the oil film, the oil film is torn into small oil drops and brought to the liquid surface along with the increase and growth of bubbles, meanwhile, the stirring effect is played on the solution, the removal speed of the oil stains on the surface of the substrate is accelerated, and the tungsten wire is cleaned by pure water through alkaline solution brought by the electrolytic degreasing steel wire;
s2: acid washing: immersing the tungsten wire subjected to electrolytic degreasing in an acid solution, removing an oxide layer and rust matters on the surface of a substrate by etching in the acid solution, cleaning the tungsten wire for 13min by using 40g/L sulfamic acid solution with the concentration of 45+/-5 ℃, and cleaning the acid solution carried out by a steel wire in a pickling tank by using pure water after the tungsten wire is subjected to pickling;
s3: pre-plating: putting the tungsten wire treated in the step S1 and the step S2 into a nickel plating solution, pre-plating the nickel, depositing a nickel layer on the surface of a substrate by an electroplating method, increasing the effect of product combination force, and electroplating nickel on the surface of the tungsten wire rope under the action of an electric field of 2.25-7.55V by taking the nickel plating watt solution as an electroplating solution;
s4: and (3) sand feeding: placing diamond micropowder into a sand tank, depositing the diamond micropowder onto the surface of the substrate tungsten wire obtained in the step S3 under the action of an electric field by an electrochemical deposition method, fixedly connecting a diamond abrasive on the surface of the substrate, and simultaneously adjusting the density and distribution of deposited diamond according to the requirement, wherein the density of diamond micropowder particles is 180-220 particles/mm;
s5: thickening: depositing a layer of solidified nickel coating on the surface of the diamond wire obtained in the step S4 under the action of current through a nickel coating solution, solidifying the bare diamond powder on the surface of a base steel wire, reinforcing the diamond, preventing the diamond from falling off, adjusting the embedding depth and the blade height of the diamond micro powder, and adhering dirt of a preplating/sanding/thickening process on the surface of the diamond wire after thickening, wherein the dirt of the surface of the diamond wire is removed by cleaning through pure water;
s6: and (3) drying: and (3) putting the thickened diamond wire obtained in the step (S5) into a heating device for heating and drying, wherein the drying temperature of the thickened nickel-plated layer is 110-120 ℃, removing water stains on the surface of the wire saw, and achieving the purpose of removing hydrogen through high temperature to obtain the finished diamond wire.
Example III
The preparation method of the novel tungsten wire matrix diamond wire saw comprises the following steps:
s1: electrolytic degreasing: the method comprises the steps of putting a tungsten wire into a solution for electrolytic degreasing, wherein the wire diameter of the tungsten wire rope is 1.50-2.50 mm, under the electrolysis condition, the interfacial tension of oil and the solution is reduced by the polarization effect of an electrode, the wettability of the solution to the surface of a base wire is increased, the adhesion force between an oil film and metal is reduced, oil stains are easy to peel off and disperse into the solution for emulsification and removal, the preparation method adopts a cathode degreasing method, the surface of the tungsten wire is subjected to reduction reaction, hydrogen is separated, the hydrogen released by the interface between a substrate and the solution plays an emulsification role in the solution, because small bubbles are easy to adsorb on the surface of the oil film, the oil film is torn into small oil drops and brought to the liquid surface along with the increase and growth of bubbles, meanwhile, the stirring effect is played on the solution, the removal speed of the oil stains on the surface of the substrate is accelerated, and the tungsten wire is cleaned by pure water through alkaline solution brought by the electrolytic degreasing steel wire;
s2: acid washing: immersing the tungsten wire subjected to electrolytic degreasing in an acid solution, removing an oxide layer and rust matters on the surface of a substrate by etching in the acid solution, cleaning the tungsten wire for 17min by using 40g/L sulfamic acid solution with the concentration of 45+/-5 ℃, and cleaning the acid solution carried out by a steel wire in a pickling tank by using pure water after the tungsten wire is subjected to pickling;
s3: pre-plating: putting the tungsten wire treated in the step S1 and the step S2 into a nickel plating solution, pre-plating the nickel, depositing a nickel layer on the surface of a substrate by an electroplating method, increasing the effect of product combination force, and electroplating nickel on the surface of the tungsten wire rope under the action of an electric field of 2.25-7.55V by taking the nickel plating watt solution as an electroplating solution;
s4: and (3) sand feeding: placing diamond micropowder into a sand tank, depositing the diamond micropowder onto the surface of the substrate tungsten wire obtained in the step S3 under the action of an electric field by an electrochemical deposition method, fixedly connecting a diamond abrasive on the surface of the substrate, and simultaneously adjusting the density and distribution of deposited diamond according to the requirement, wherein the density of diamond micropowder particles is 220-260 particles/mm;
s5: thickening: depositing a layer of solidified nickel coating on the surface of the diamond wire obtained in the step S4 under the action of current through a nickel coating solution, solidifying the bare diamond powder on the surface of a base steel wire, reinforcing the diamond, preventing the diamond from falling off, adjusting the embedding depth and the blade height of the diamond micro powder, and adhering dirt of a preplating/sanding/thickening process on the surface of the diamond wire after thickening, wherein the dirt of the surface of the diamond wire is removed by cleaning through pure water;
s6: and (3) drying: and (3) putting the thickened diamond wire obtained in the step (S5) into a heating device for heating and drying, wherein the drying temperature of the thickened nickel-plated layer is 120-130 ℃, removing water stains on the surface of the wire saw, and achieving the purpose of removing hydrogen through high temperature to obtain the finished diamond wire.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A preparation method of a novel tungsten wire matrix diamond wire saw is characterized by comprising the following steps: the method comprises the following steps:
s1: electrolytic degreasing: the tungsten wire is put into the solution for electrolytic degreasing, under the electrolytic condition, the interfacial tension of the oil and the solution is reduced by the polarization action of the electrode, the wettability of the solution to the surface of the base line is increased, the adhesion between the oil film and the metal is reduced, and the greasy dirt is easy to peel off and disperse into the solution for emulsification and removal;
s2: acid washing: immersing the tungsten wire subjected to electrolytic degreasing in the step S1 into an acid solution, and removing an oxide layer and rust matters on the surface of a substrate by etching in the acid solution;
s3: pre-plating: putting the tungsten wire treated in the step S1 and the step S2 into a nickel plating solution, and pre-plating the nickel, and depositing a nickel layer on the surface of a substrate by an electroplating method to increase the effect of the combination force of the product;
s4: and (3) sand feeding: placing diamond micro powder into a sand tank, depositing the diamond micro powder onto the surface of the substrate tungsten wire obtained in the step S3 under the action of an electric field by an electrochemical deposition method, fixedly connecting a diamond abrasive on the surface of the substrate, and simultaneously adjusting the density and distribution of deposited diamond according to the requirement;
s5: thickening: depositing a layer of solidified nickel coating on the surface of the diamond wire obtained in the step S4 under the action of current through a nickel coating solution, solidifying the bare diamond powder on the surface of the base steel wire, solidifying the diamond, preventing the diamond from falling off, and adjusting the embedding depth and the blade height of the diamond micro powder;
s6: and (3) drying: and (5) putting the thickened diamond wire obtained in the step (S5) into a heating device for heating and drying, removing water stains on the surface of the wire saw, and achieving the purpose of removing hydrogen through high temperature to obtain the finished diamond wire.
2. The method for preparing the novel tungsten wire matrix diamond wire saw according to claim 1, which is characterized in that: in the step S1, the preparation method adopts a cathode for degreasing, the surface of the cathode is subjected to reduction reaction, hydrogen is separated out, and the hydrogen released by the interface between the matrix and the solution during electrolysis plays an emulsifying role in the solution.
3. The method for preparing the novel tungsten wire matrix diamond wire saw according to claim 1, which is characterized in that: in the step S1, after the tungsten wire is subjected to electrolytic degreasing, pure water is used for cleaning alkaline solution carried out by an electrolytic degreasing tank steel wire.
4. The method for preparing the novel tungsten wire matrix diamond wire saw according to claim 1, which is characterized in that: in the step S2, 40g/L sulfamic acid solution with the concentration of 45+/-5 ℃ is used for cleaning the tungsten filament for 15min.
5. The method for preparing the novel tungsten wire matrix diamond wire saw according to claim 1, which is characterized in that: in the step S2, after the tungsten wire is subjected to acid washing, pure water is used for washing the acid solution carried out by the steel wire in the acid washing tank.
6. The method for preparing the novel tungsten wire matrix diamond wire saw according to claim 1, which is characterized in that: in the step S3, nickel is electroplated on the surface of the tungsten wire rope under the action of an electric field of 2.25-7.55V by taking the nickel-electroplating Watt solution as an electroplating solution.
7. The method for preparing the novel tungsten wire matrix diamond wire saw according to claim 1, which is characterized in that: in the step S4, the density of diamond micro powder particles is 180-260 particles/mm.
8. The method for preparing the novel tungsten wire matrix diamond wire saw according to claim 1, which is characterized in that: in the step S5, after the diamond wire is thickened, the surface is stained with dirt of the preplating/sanding/thickening process, and the dirt on the surface of the wire saw in the preplating/sanding/thickening process is removed by cleaning with pure water.
9. The method for preparing the novel tungsten wire matrix diamond wire saw according to claim 1, which is characterized in that: and in the step S6, the drying temperature of the thickened nickel plating layer is 110-130 ℃.
10. The method for preparing the novel tungsten wire matrix diamond wire saw according to claim 1, which is characterized in that: the wire diameter of the tungsten wire rope is 0.10-2.50 mm.
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| CN202310391617.XA CN116397301A (en) | 2023-04-13 | 2023-04-13 | Preparation method of novel tungsten wire matrix diamond wire saw |
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| CN202310391617.XA CN116397301A (en) | 2023-04-13 | 2023-04-13 | Preparation method of novel tungsten wire matrix diamond wire saw |
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