CN116390387A - Operation method of leadless golden finger board - Google Patents
Operation method of leadless golden finger board Download PDFInfo
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- CN116390387A CN116390387A CN202310220833.8A CN202310220833A CN116390387A CN 116390387 A CN116390387 A CN 116390387A CN 202310220833 A CN202310220833 A CN 202310220833A CN 116390387 A CN116390387 A CN 116390387A
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- golden finger
- circuit
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- drilling
- plate
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000005553 drilling Methods 0.000 claims abstract description 41
- 238000007639 printing Methods 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011888 foil Substances 0.000 claims abstract description 7
- 238000005457 optimization Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 30
- 239000010408 film Substances 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000011010 flushing procedure Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 230000000295 complement effect Effects 0.000 claims description 3
- 239000013039 cover film Substances 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 238000007790 scraping Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a leadless golden finger board operation method, relates to the technical field of golden finger boards, and aims to solve the problems that the existing lead is usually directly arranged on a golden finger board, the outside of the lead is protected by means of circuit oil printing and green oil printing, the protection effect is poor, and the lead protection layer on the surface of the lead is easily separated and separated no matter the lead touches a metal piece or is impacted and bumped, so that the normal use of the golden finger board is affected. The method comprises the following steps: step one: cutting and drilling, wherein the cutting is performed according to the size of the design optimization, only the golden finger plate is drilled according to the required specification and direction, the drilling equipment manually selects a single-shaft drilling machine for drilling, a numerical control drilling machine for drilling and a laser drilling machine for drilling, an upper backing plate and a lower backing plate are used for improving the quality of finished golden finger plate products when the circuit board is drilled, and the upper backing plate and the lower backing plate adopt aluminum foil plates with the specification of 0.2-0.6 mm.
Description
Technical Field
The invention relates to the technical field of golden finger plates, in particular to a method for operating a leadless golden finger plate.
Background
The golden finger board, namely the printed circuit board with golden fingers, is called a printed board for short, and is one of important parts of the electronic industry. Almost every electronic device, as small as an electronic watch, a calculator, as large as a computer, a communication electronic device, a military weapon system, has only electronic components such as an integrated circuit, and a printed board is used for electrically interconnecting the respective components.
The existing lead is usually directly arranged on the golden finger board, the external part of the existing lead is protected by means of circuit oil printing and green printing, the protection effect is poor, no matter the existing lead touches a metal piece or is impacted and collided, the protection layer on the surface of the existing lead is easily separated, and therefore the golden finger board is influenced to be normally used, and therefore, the golden finger board operation method without leads is provided.
Disclosure of Invention
The invention aims to provide a wire-free golden finger board operation method, which aims to solve the problems that the existing lead wire proposed in the background art is usually directly arranged on a golden finger board, the lead wire is protected by means of circuit oil printing and green-printed oil, the protection effect is poor, and the lead wire protection layer on the surface of the lead wire is easily separated and separated no matter the lead wire touches a metal piece or is impacted and bumped, so that the normal use of the golden finger board is influenced.
In order to achieve the above purpose, the present invention provides the following technical solutions: a leadless gold finger board comprising the steps of:
step one: cutting and drilling, namely cutting according to the size of design optimization, only drilling the golden finger plate according to the required specification and direction, manually selecting a single-shaft drilling machine for drilling, a numerical control drilling machine for drilling and a laser for drilling by drilling equipment, using an upper backing plate and a lower backing plate to improve the quality of finished golden finger plate products when the circuit board is drilled, and using an aluminum foil plate with the specification of 0.2-0.6mm for the upper backing plate and the lower backing plate, wherein the aluminum foil has good heat conductivity, has a certain heat dissipation effect on a drill bit, and can reduce the drilling temperature;
step two: polishing, namely polishing the surface of the golden finger plate in a machining mode, removing Kong Bianpi edges, drilling dirt in holes and impurities and oxides on the surface of the plate by a polishing method, providing a clean surface for a chemical copper deposition process, and controlling the roughness required to be qualified after the surface is polished, namely controlling the roughness to be 2.5-4 mu m;
step three: welding, namely, the columnar parts are obtained by drilling and polishing in advance, and the columnar parts which are the same as the golden finger plate are welded in the formed groove in a spot welding mode, wherein the columnar parts are hollow cavities, and a large number of holes for the inner circuit to pass through are formed in the outer wall of the columnar parts;
step four: an inner layer circuit is made, and the inner layer circuit extends to the upper end of the columnar piece;
step five: printing circuit oil, pressing an ink wet film on a substrate, putting the substrate into an oven for drying, exposing the substrate, wherein the equipment is an exposure machine with a UV light source, aligning a film prepared in advance with the substrate and fixing the film with the substrate during exposure, putting the substrate on a platform of the exposure machine for exposure, flushing the exposed substrate in a developing solution, developing to form a pattern, putting the substrate in an etching solution for etching, and etching the film according to the etching resistance, wherein the position of a cover film protects underlying copper, and copper exposed on the outer surface is etched, so that patterns with the film and copper are formed, putting the substrate in a film removing solution for flushing, the film is soluble in the liquid, and finally the substrate is a copper pattern with the complementary film pattern;
step six: the green printing oil is used for transferring the pattern of the green printing oil film onto the board, playing the roles of protecting the circuit and preventing the circuit from being tin-plated when the part is welded, and then carrying out the character marking and gold-plating finger process of the gold finger board;
step six: baking the golden finger board after green oil printing to cover the golden finger board with green oil;
step seven: coating, namely coating a layer of insulating glue between two plates, and pressing the outer layer plate on the inner layer plate;
step eight: performing edge sealing treatment on the pressed golden finger plates;
and step nine, an outer layer board circuit is made, the circuit at the upper end of the columnar piece is connected with and extends to the outer layer board, the circuit board printing operation is carried out on the outer layer board again, and corresponding devices are installed above the circuit after the circuit is finished, so that most of the circuit is hidden to the inner layer.
Preferably, the golden finger board comprises a golden finger board inner layer, a golden finger board outer layer is arranged above the golden finger board inner layer, and an inner circuit groove is formed in the golden finger board inner layer.
Preferably, a plurality of first mounting grooves are formed between the inner circuit grooves, a plurality of second mounting grooves are formed in the outer layer of the golden finger plate, and the second mounting grooves are aligned with the first mounting grooves in position.
Preferably, a hollow columnar member is provided in the first mounting groove, and the upper end of the hollow columnar member extends into the second mounting groove.
Preferably, the two sides of the lower surface of the second mounting groove are respectively provided with an inserting rod, and the two sides of the upper surface of the first mounting groove are respectively provided with a slot.
Preferably, the two ends of the first mounting groove are respectively provided with a first through hole, the inside of the first mounting groove is provided with a wire body, and the wire body extends into the inner circuit groove.
Preferably, the outer wall of the hollow columnar member is provided with a plurality of second through holes.
Preferably, the outer wall of the inner circuit groove is provided with an edge sealing plate, and the inside of the edge sealing plate is provided with a plate groove.
Preferably, a plurality of third through holes are formed in the inner wall of the plate groove, and bevel edge blocks are integrally formed at the upper end and the lower end of the plate groove.
Preferably, the bottom layer is arranged below the inner layer of the golden finger plate, and reserved screw holes are formed in four corners of the inner layer of the golden finger plate, the outer layer of the golden finger plate and the outer wall of the bottom layer.
Compared with the prior art, the invention has the beneficial effects that:
1. the circuit groove is used for internally arranging the wire body, so that the wire body is placed in the inner layer of the golden finger plate, compared with the outer layer of the golden finger plate, the circuit groove is safer, in the process, the inner layer of the golden finger plate is processed firstly, then the film is coated and pressed, and finally the inner layer of the golden finger plate is processed, so that the outer part of the golden finger plate presents a wire-free structure, most of wires are hidden in the inner part, the wires are communicated with the outer layer of the golden finger plate through the welded hollow columnar piece, the corresponding devices are conveniently installed and connected on the outer layer of the golden finger plate, the device installation position is close to the port of the second installation groove, and the device installation position can be directly installed above the port of the second installation groove in a gland manner, so that the exposed range of the wires of the outer layer is reduced, and the outer layer which is easy to damage can not be damaged due to scraping.
2. The first mounting groove is used for aligning with the second mounting groove, make things convenient for the cavity column spare to be followed to in the second mounting groove, simultaneously also make things convenient for the wire of cavity column spare department upwards to extend, the wire extends to in the first mounting groove from interior circuit groove department, the cavity column spare is the cavity, the wire is upwards laid along its outer wall or inner wall, finally assemble the upper port department and outer device connection at the second mounting groove, first through-hole makes things convenient for the wire to pass, the wire accessible pastes the mode of diapire or inner wall and lays, also the mode that the accessible passed cavity column spare makes the wire directly run through and extends, make the wire can follow one end to the other end, can divide the upward extension to lay in a plurality of first mounting groove departments, finally be connected with the outer wire of the upper port department scope of whole second mounting groove, third through-hole 16 is used for dispelling the heat and make things convenient for inside wire outwards to do the extension along third through-hole 16.
Drawings
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic view of the overall structure of the golden finger board of the present invention;
FIG. 3 is a schematic view of a partial structure of a first mounting groove according to the present invention;
FIG. 4 is a schematic view of a partial structure of an edge banding panel according to the invention;
in the figure: 1. an inner layer of the golden finger plate; 2. an outer layer of the golden finger plate; 3. reserving a screw hole; 4. an inner line slot; 5. edge sealing plates; 6. a first mounting groove; 7. a hollow column; 8. a second mounting groove; 9. a rod; 10. a slot; 11. a bottom layer; 12. a first through hole; 13. a wire body; 14. a second through hole; 15. a plate groove; 16. a third through hole; 17. hypotenuse blocks.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-4, an embodiment of the present invention is provided: a leadless gold finger board comprising the steps of:
step one: cutting and drilling, namely cutting according to the size of design optimization, only drilling the golden finger plate according to the required specification and direction, manually selecting a single-shaft drilling machine for drilling, a numerical control drilling machine for drilling and a laser for drilling by drilling equipment, using an upper backing plate and a lower backing plate to improve the quality of finished golden finger plate products when the circuit board is drilled, and using an aluminum foil plate with the specification of 0.2-0.6mm for the upper backing plate and the lower backing plate, wherein the aluminum foil has good heat conductivity, has a certain heat dissipation effect on a drill bit, and can reduce the drilling temperature;
step two: polishing, namely polishing the surface of the golden finger plate in a machining mode, removing Kong Bianpi edges, drilling dirt in holes and impurities and oxides on the surface of the plate by a polishing method, providing a clean surface for a chemical copper deposition process, and controlling the roughness required to be qualified after the surface is polished, namely controlling the roughness to be 2.5-4 mu m;
step three: welding, namely, the columnar parts are obtained by drilling and polishing in advance, and the columnar parts which are the same as the golden finger plate are welded in the formed groove in a spot welding mode, wherein the columnar parts are hollow cavities, and a large number of holes for the inner circuit to pass through are formed in the outer wall of the columnar parts;
step four: an inner layer circuit is made, and the inner layer circuit extends to the upper end of the columnar piece;
step five: printing circuit oil, pressing an ink wet film on a substrate, putting the substrate into an oven for drying, exposing the substrate, wherein the equipment is an exposure machine with a UV light source, aligning a film prepared in advance with the substrate and fixing the film with the substrate during exposure, putting the substrate on a platform of the exposure machine for exposure, flushing the exposed substrate in a developing solution, developing to form a pattern, putting the substrate in an etching solution for etching, and etching the film according to the etching resistance, wherein the position of a cover film protects underlying copper, and copper exposed on the outer surface is etched, so that patterns with the film and copper are formed, putting the substrate in a film removing solution for flushing, the film is soluble in the liquid, and finally the substrate is a copper pattern with the complementary film pattern;
step six: the green printing oil is used for transferring the pattern of the green printing oil film onto the board, playing the roles of protecting the circuit and preventing the circuit from being tin-plated when the part is welded, and then carrying out the character marking and gold-plating finger process of the gold finger board;
step six: baking the golden finger board after green oil printing to cover the golden finger board with green oil;
step seven: coating, namely coating a layer of insulating glue between two plates, and pressing the outer layer plate on the inner layer plate;
step eight: performing edge sealing treatment on the pressed golden finger plates;
and step nine, an outer layer board circuit is made, the circuit at the upper end of the columnar piece is connected with and extends to the outer layer board, the circuit board printing operation is carried out on the outer layer board again, and corresponding devices are installed above the circuit after the circuit is finished, so that most of the circuit is hidden to the inner layer.
Referring to fig. 2 and 3, the golden finger board includes a golden finger board inner layer 1, a golden finger board outer layer 2 is disposed above the golden finger board inner layer 1, an inner circuit groove 4 is disposed inside the golden finger board inner layer 1, the inner circuit groove 4 is used for disposing a wire body 13 inside, so that the wire body 13 is disposed inside the golden finger board inner layer 1, compared with the golden finger board outer layer 2, the golden finger board is safer, in the process, the golden finger board inner layer 1 is processed first and then laminated, and finally the golden finger board outer layer 2 is processed to combine the golden finger board inner layer 1 and the golden finger board outer layer 2, so that the golden finger board is in a non-wire structure, most of wires are hidden inside, and the wires are communicated with the golden finger board outer layer 2 through a welded hollow columnar member 7, so that the golden finger board outer layer 2 is conveniently mounted and connected with corresponding devices, the device mounting positions are close to the port of the second mounting groove 8, the exposed range of the wires of the outer layer is reduced, the outer layer is ensured to be damaged easily, the wires are not to be damaged due to scraping, and the safety of the outer layer of the golden finger board is improved.
Referring to fig. 2 and 3, a plurality of first mounting grooves 6 are disposed between the inner circuit grooves 4, a plurality of second mounting grooves 8 are disposed in the outer layer 2 of the golden finger board, the second mounting grooves 8 are aligned with the first mounting grooves 6, the first mounting grooves 6 are aligned with the second mounting grooves 8, the hollow column-shaped member 7 can be conveniently extended into the second mounting grooves 8, and meanwhile, wires at the hollow column-shaped member 7 can be conveniently extended upwards.
Referring to fig. 2 and 3, a hollow column member 7 is disposed in the first mounting groove 6, and an upper end of the hollow column member 7 extends into the second mounting groove 8, a wire extends from the inner circuit groove 4 into the first mounting groove 6, the hollow column member 7 is a hollow cavity, and the wire is laid up along an outer wall or an inner wall thereof, and finally gathered at an upper port of the second mounting groove 8 to be connected with an outer device.
Referring to fig. 2, the two sides of the lower surface of the second mounting groove 8 are respectively provided with a plug rod 9, the two sides of the upper surface of the first mounting groove 6 are respectively provided with a slot 10, and the plug rods 9 and the slots 10 have auxiliary alignment effect.
Referring to fig. 2 and 3, the two ends of the first mounting groove 6 are respectively provided with a first through hole 12, the inside of the first mounting groove 6 is provided with a wire body 13, the wire body 13 extends into the inner circuit groove 4, the first through holes 12 facilitate the wires to pass through, the wires can be laid by attaching to the bottom wall or the inner wall, and the wires can directly pass through and extend in a manner of passing through the hollow columnar piece 7, so that the wires can be smoothly extended from one end to the other end, and can be split at the positions of the first mounting grooves 6 to be upwards extended and laid, and finally be connected with the outer wires in the upper port range of the whole second mounting groove 8.
Referring to fig. 2 and 3, the outer wall of the hollow column 7 is provided with a plurality of second through holes 14, and the second through holes 14 have the effect of facilitating the wire passing through.
Referring to fig. 2 and 4, an edge sealing plate 5 is disposed on an outer wall of the inner circuit groove 4, a plate groove 15 is disposed in the edge sealing plate 5, and the edge sealing plate 5 is used for sealing edges.
Referring to fig. 2 and 4, a plurality of third through holes 16 are formed in the inner wall of the board slot 15, oblique side blocks 17 are integrally formed at the upper and lower ends of the board slot 15, and the third through holes 16 are used for heat dissipation and facilitate the internal wires to extend outwards along the third through holes 16.
Referring to fig. 2, a bottom layer 11 is disposed below the inner layer 1 of the golden finger plate, and reserved screw holes 3 are disposed at four corners of the inner layer 1 of the golden finger plate, the outer layer 2 of the golden finger plate, and the outer wall of the bottom layer 11, wherein the reserved screw holes 3 are used for fixing the golden finger plate in a combined manner.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. A method for operating a leadless golden finger board is characterized in that; the method comprises the following steps:
step one: cutting and drilling, namely cutting according to the size of design optimization, only drilling the golden finger plate according to the required specification and direction, manually selecting a single-shaft drilling machine for drilling, a numerical control drilling machine for drilling and a laser for drilling by drilling equipment, using an upper backing plate and a lower backing plate to improve the quality of finished golden finger plate products when the circuit board is drilled, and using an aluminum foil plate with the specification of 0.2-0.6mm for the upper backing plate and the lower backing plate, wherein the aluminum foil has good heat conductivity, has a certain heat dissipation effect on a drill bit, and can reduce the drilling temperature;
step two: polishing, namely polishing the surface of the golden finger plate in a machining mode, removing Kong Bianpi edges, drilling dirt in holes and impurities and oxides on the surface of the plate by a polishing method, providing a clean surface for a chemical copper deposition process, and controlling the roughness required to be qualified after the surface is polished, namely controlling the roughness to be 2.5-4 mu m;
step three: welding, namely, the columnar parts are obtained by drilling and polishing in advance, and the columnar parts which are the same as the golden finger plate are welded in the formed groove in a spot welding mode, wherein the columnar parts are hollow cavities, and a large number of holes for the inner circuit to pass through are formed in the outer wall of the columnar parts;
step four: an inner layer circuit is made, and the inner layer circuit extends to the upper end of the columnar piece;
step five: printing circuit oil, pressing an ink wet film on a substrate, putting the substrate into an oven for drying, exposing the substrate, wherein the equipment is an exposure machine with a UV light source, aligning a film prepared in advance with the substrate and fixing the film with the substrate during exposure, putting the substrate on a platform of the exposure machine for exposure, flushing the exposed substrate in a developing solution, developing to form a pattern, putting the substrate in an etching solution for etching, and etching the film according to the etching resistance, wherein the position of a cover film protects underlying copper, and copper exposed on the outer surface is etched, so that patterns with the film and copper are formed, putting the substrate in a film removing solution for flushing, the film is soluble in the liquid, and finally the substrate is a copper pattern with the complementary film pattern;
step six: the green printing oil is used for transferring the pattern of the green printing oil film onto the board, playing the roles of protecting the circuit and preventing the circuit from being tin-plated when the part is welded, and then carrying out the character marking and gold-plating finger process of the gold finger board;
step six: baking the golden finger board after green oil printing to cover the golden finger board with green oil;
step seven: coating, namely coating a layer of insulating glue between two plates, and pressing the outer layer plate on the inner layer plate;
step eight: performing edge sealing treatment on the pressed golden finger plates;
and step nine, an outer layer board circuit is made, the circuit at the upper end of the columnar piece is connected with and extends to the outer layer board, the circuit board printing operation is carried out on the outer layer board again, and corresponding devices are installed above the circuit after the circuit is finished, so that most of the circuit is hidden to the inner layer.
2. A leadless gold finger board according to claim 1, wherein: the golden finger board comprises a golden finger board inner layer (1), a golden finger board outer layer (2) is arranged above the golden finger board inner layer (1), and an inner circuit groove (4) is formed in the golden finger board inner layer (1).
3. A leadless gold finger board according to claim 2, wherein: a plurality of first mounting grooves (6) are formed between the inner circuit grooves (4), a plurality of second mounting grooves (8) are formed in the outer layer (2) of the golden finger plate, and the second mounting grooves (8) are aligned with the first mounting grooves (6).
4. A leadless gold finger board according to claim 3, wherein: the first mounting groove (6) is internally provided with a hollow columnar member (7), and the upper end of the hollow columnar member (7) extends into the second mounting groove (8).
5. A leadless gold finger board according to claim 4, wherein: the two sides of the lower surface of the second mounting groove (8) are provided with inserting rods (9), and the two sides of the upper surface of the first mounting groove (6) are provided with inserting grooves (10).
6. A leadless gold finger board according to claim 5, wherein: the two ends of the first mounting groove (6) are respectively provided with a first through hole (12), a wire body (13) is arranged in the first mounting groove (6), and the wire body (13) extends into the inner circuit groove (4).
7. A leadless gold finger board according to claim 6, wherein: the outer wall of the hollow column (7) is provided with a plurality of second through holes (14).
8. A leadless gold finger board according to claim 7, wherein: the outer wall of the inner circuit groove (4) is provided with an edge sealing plate (5), and the inside of the edge sealing plate (5) is provided with a plate groove (15).
9. A leadless gold finger board according to claim 8, wherein: the inner wall of board groove (15) is provided with a plurality of third through-holes (16), the upper and lower both ends of board groove (15) all are provided with hypotenuse piece (17) in an organic whole.
10. A leadless gold finger board according to claim 9, wherein: the lower part of the golden finger board inner layer (1) is provided with a bottom layer (11), and four corners of the outer walls of the golden finger board inner layer (1), the golden finger board outer layer (2) and the bottom layer (11) are respectively provided with reserved screw holes (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310220833.8A CN116390387A (en) | 2023-03-09 | 2023-03-09 | Operation method of leadless golden finger board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310220833.8A CN116390387A (en) | 2023-03-09 | 2023-03-09 | Operation method of leadless golden finger board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116390387A true CN116390387A (en) | 2023-07-04 |
Family
ID=86979766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310220833.8A Pending CN116390387A (en) | 2023-03-09 | 2023-03-09 | Operation method of leadless golden finger board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116390387A (en) |
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2023
- 2023-03-09 CN CN202310220833.8A patent/CN116390387A/en active Pending
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