CN116388698A - Broadband frequency conversion module based on SIP - Google Patents

Broadband frequency conversion module based on SIP Download PDF

Info

Publication number
CN116388698A
CN116388698A CN202211708204.1A CN202211708204A CN116388698A CN 116388698 A CN116388698 A CN 116388698A CN 202211708204 A CN202211708204 A CN 202211708204A CN 116388698 A CN116388698 A CN 116388698A
Authority
CN
China
Prior art keywords
circuit
layer circuit
sip
attenuator
conversion module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211708204.1A
Other languages
Chinese (zh)
Inventor
赵海明
刘雨嘉
于涛
韩宇
李春宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Institute of Remote Sensing Equipment
Original Assignee
Beijing Institute of Remote Sensing Equipment
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Institute of Remote Sensing Equipment filed Critical Beijing Institute of Remote Sensing Equipment
Priority to CN202211708204.1A priority Critical patent/CN116388698A/en
Publication of CN116388698A publication Critical patent/CN116388698A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03D—DEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
    • H03D7/00—Transference of modulation from one carrier to another, e.g. frequency-changing
    • H03D7/16—Multiple-frequency-changing
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H03F3/195—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H11/00—Networks using active elements
    • H03H11/02—Multiple-port networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H11/00—Networks using active elements
    • H03H11/02—Multiple-port networks
    • H03H11/24—Frequency-independent attenuators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/451—Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Superheterodyne Receivers (AREA)

Abstract

The invention discloses a broadband variable frequency module based on SIP (session initiation protocol), which comprises a tube shell, wherein a bottom layer circuit and an upper layer circuit are arranged in the tube shell in a eutectic way, are stacked and fixed together in a vacuum reflow soldering way; the channel structures of the bottom layer circuit and the upper layer circuit are the same; the bottom layer circuit is provided with a first circuit module for mixing frequency and down-conversion, and the upper layer circuit is provided with a second circuit module for filtering; the shell, the bottom layer circuit, the upper layer circuit, the first circuit module and the second circuit module are packaged together in an SIP mode to form the broadband frequency conversion module. The invention aims to provide a broadband frequency conversion module based on SIP, which solves the problems of large volume, heavy weight and low integration density of the traditional broadband frequency conversion module.

Description

Broadband frequency conversion module based on SIP
Technical Field
The invention relates to the technical field of broadband frequency conversion modules, in particular to a broadband frequency conversion module based on SIP.
Background
The system-in-package (System in Package, SIP) has become an important advanced packaging and system integration technology, is an important technical route for miniaturization and multifunctionality of future electronic products, and has wide application prospect and development space in the fields of civil use, aerospace and the like. The SIP realizes the function of the component level by the package of the device level, greatly reduces the volume and weight of system equipment, and is beneficial to the improvement of the reliability of products and the miniaturization of the package. Three-dimensional integrated 3D-SIP technology is an important technological approach for electronic devices to develop toward microsystems.
The broadband frequency conversion module is used as an important component of the microwave detection device and has the functions of realizing secondary frequency conversion, amplification and filtering on the received microwave signals and carrying out attenuation treatment on large signals.
The traditional broadband frequency conversion module adopts multichannel to form, and every passageway includes multiple circuit module, and each circuit module adopts discrete device, and every discrete device is when processing the preparation, and it is difficult to guarantee unanimity to lead to multichannel uniformity relatively poor, has also increased the structure volume and the weight of combination moreover. In addition, the module has poor electromagnetic shielding performance and low isolation between channels.
Disclosure of Invention
The invention aims to provide a broadband frequency conversion module based on SIP, which solves the problems of large volume, heavy weight and low integration density of the traditional broadband frequency conversion module.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the invention provides a broadband variable frequency module based on SIP, which comprises a tube shell, wherein a bottom layer circuit and an upper layer circuit are arranged in the tube shell in a eutectic way, and the bottom layer circuit and the upper layer circuit are stacked and fixed together in a vacuum reflow soldering mode; the channel structures of the bottom layer circuit and the upper layer circuit are the same; the bottom layer circuit is internally provided with a first circuit module for mixing and down-conversion, and the upper layer circuit is internally provided with a second circuit module for filtering; the shell, the bottom layer circuit, the upper layer circuit, the first circuit module and the second circuit module are packaged together in an SIP mode to form the broadband frequency conversion module.
In some embodiments, the first circuit module includes a signal processing unit including a wideband mixer, a radio frequency amplifier, a first attenuator, a radio frequency filter, a first amplifier, a radio frequency mixer, arranged in that order; the first circuit module further comprises a first local oscillator signal processing unit connected with the broadband mixer and a second local oscillator signal processing unit connected with the radio frequency mixer.
In some embodiments, the first local oscillator signal processing unit includes a wideband power divider, a frequency multiplier, a first local oscillator amplifier, and a local oscillator attenuator, which are sequentially arranged; and the local oscillation attenuator is connected with a local oscillation port of the broadband mixer.
In some embodiments, the second local oscillator signal processing unit includes a radio frequency power divider and a second local oscillator amplifier, which are sequentially arranged, and the second local oscillator amplifier is connected with a local oscillator interface of the radio frequency mixer.
In some embodiments, the number of the signal processing units is two, and the signal processing units are arranged in the bottom layer circuit in parallel; the broadband power divider is provided with two paths of outputs, and is connected with the broadband mixers in the two groups of signal processing units after passing through the frequency multiplier, the first local oscillator amplifier and the local oscillator attenuator respectively; the radio frequency power divider is provided with two paths of outputs, and is connected with the radio frequency mixers in the two groups of signal processing units after passing through the second local oscillator amplifier respectively.
In some embodiments, the second circuit module includes an intermediate frequency filter, a second attenuator, a second amplifier, a wide-narrow band filter, a digitally controlled attenuator, and an intermediate frequency amplifier, which are sequentially disposed; the intermediate frequency filter is connected with the radio frequency mixer through a metal tin ball penetrating through the bottom layer circuit and the upper layer circuit.
In some embodiments, the number of the second circuit modules is two, the second circuit modules are arranged in the upper layer circuit in parallel, and the two groups of the second circuit modules are respectively connected with the two groups of the signal processing units in a one-to-one correspondence manner.
In some embodiments, the signal processing unit and the underlying circuit are connected by conductive glue or eutectic.
In some embodiments, the second circuit module is connected to the upper circuit by conductive adhesive.
In some embodiments, the first attenuator is a one-stage attenuator that can provide 15dB dynamic control; the second attenuator and the numerical control attenuator are controllable attenuators which can provide 31.5dB dynamic control.
Compared with the prior art, the invention has the following beneficial effects:
the SIP-based broadband frequency conversion module provided by the invention has the advantages that the board-level stacking is performed inside, the functional density of the module is improved, meanwhile, the signal transmission cavity is formed by the bottom layer circuit, the upper layer circuit and the solder balls, and the size of the cavity is reduced by more than 70% compared with that of the traditional two-dimensional multi-chip module; in addition, the SIP broadband frequency conversion module uses a tube shell to replace a traditional component box body, and the weight is reduced by more than 90% compared with a traditional two-dimensional multi-chip component; the invention discloses a broadband frequency conversion module which is miniaturized, light and integrated with high density based on SIP, and solves the problems of large volume, heavy weight and low integration density of the traditional broadband frequency conversion module.
Drawings
Fig. 1 is a circuit diagram of a wideband frequency conversion module based on SIP according to an embodiment of the present invention.
In the figure: 11. a bottom layer circuit; 12. an upper layer circuit; 13. a wideband mixer; 14. a radio frequency amplifier; 15. a first attenuator; 16. a radio frequency filter; 17. a first amplifier; 18. a radio frequency mixer; 19. an intermediate frequency filter; 20. a second attenuator; 21. a second amplifier; 22. a wide narrow band filter; 23. a digital control attenuator; 24. an intermediate frequency amplifier; 37. a broadband power divider; 38. a frequency multiplier; 39. a first local oscillator amplifier; 40. a local oscillator attenuator; 44. a radio frequency power divider; 45. and a second local oscillator amplifier.
Detailed Description
Example embodiments will be described more fully hereinafter with reference to the accompanying drawings, but may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The embodiments of the invention and the features of the embodiments may be combined with each other without conflict.
As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In order to achieve miniaturization, light weight and high density integration of the broadband frequency conversion module, the embodiment of the invention provides a broadband frequency conversion module based on SIP. In order to enable those skilled in the art to better understand the technical scheme, the following describes the SIP-based broadband frequency conversion module provided by the invention in detail with reference to the accompanying drawings.
As shown in fig. 1, the SIP-based broadband frequency conversion module provided by the invention comprises a tube shell, wherein a bottom layer circuit 11 and an upper layer circuit 12 are arranged in the tube shell in a eutectic manner, the bottom layer circuit 11 and the upper layer circuit 12 are stacked, are all made of Panasonic M6 plates and are fixed together in a vacuum reflow soldering manner, and the upper layer substrate is subjected to gold wire bonding. Finally, carrying out vacuum parallel seam welding on the dried tube shells, and prolonging the service life of the combination; the channel structures of the bottom layer circuit 11 and the upper layer circuit 12 are the same; and a metal tin ball is arranged between the bottom layer circuit 11 and the upper layer circuit 12 in a penetrating way, and the electric connection mode between the bottom layer circuit 11 and the upper layer circuit 12 is interconnected through the metal tin ball, so that the bottom layer circuit 11, the upper layer circuit 12 and the metal tin ball form a signal transmission cavity. The bottom layer circuit 11 is provided with a first circuit module for mixing and down-conversion, and the upper layer circuit 12 is provided with a second circuit module for filtering; the package, the bottom layer circuit 11, the upper layer circuit 12, the first circuit module and the second circuit module are packaged together in a SIP manner to form a wideband frequency conversion module.
Specifically, the metal solder balls are fixed on the upper circuit 12, and are planted on the back surface of the upper circuit 12 by adopting a reflow process.
In some embodiments, the first circuit module includes a signal processing unit including a wideband mixer 13, a radio frequency amplifier 14, a first attenuator 15, a radio frequency filter 16, a first amplifier 17, and a radio frequency mixer 18, which are disposed in order; the first circuit module further comprises a first local oscillator signal processing unit connected to the wideband mixer 13 and a second local oscillator signal processing unit connected to the radio frequency mixer 18.
Further, in this embodiment, the bottom layer circuit 11 adopts a eutectic on-package manner, and then adopts a conductive adhesive or eutectic connection manner to realize connection of the wideband mixer 13, the radio frequency amplifier 14, the first attenuator 15, the radio frequency filter 16, the first amplifier 17 and the radio frequency mixer 18 in the bottom layer circuit 11.
Specifically, the first local oscillator signal processing unit includes a wideband power divider 37, a frequency multiplier 38, a first local oscillator amplifier 39 and a local oscillator attenuator 40 that are sequentially arranged; the local oscillation attenuator 40 is connected to a local oscillation port of the broadband mixer 13.
Specifically, the second local oscillator signal processing unit includes a radio frequency power divider 44 and a second local oscillator amplifier 45 that are sequentially arranged, and the second local oscillator amplifier 45 is connected with a local oscillator interface of the radio frequency mixer 18.
In some embodiments, the number of the signal processing units is two, and the signal processing units are arranged in parallel in the bottom layer circuit 11; the broadband power divider 37 has two paths of outputs, and is connected with the broadband mixer 13 in the two groups of signal processing units after passing through the frequency multiplier 38, the first local oscillator amplifier 39 and the local oscillator attenuator 40 respectively; the rf power divider 44 has two outputs, and is connected to the rf mixer 18 in the two sets of signal processing units after passing through the second local oscillator amplifier 45.
The signal RF1 is obtained from the bottom circuit 11 and the first local oscillator signal in the broadband mixer 13, the high intermediate frequency signal passes through the radio frequency amplifier 14, the attenuator 15, the radio frequency filter 16, the first amplifier 17, and then is obtained from the second local oscillator signal in the radio frequency mixer 18, and the low intermediate frequency signal passes through the metal solder ball to the upper circuit 12.
As shown in fig. 1, the second circuit module includes an intermediate frequency filter 19, a second attenuator 20, a second amplifier 21, a wide-narrow band filter 22, a digitally controlled attenuator 23, and an intermediate frequency amplifier 24, which are sequentially arranged; the intermediate frequency filter 19 is connected with the radio frequency mixer 18 through metal solder balls penetrating the bottom layer circuit 11 and the upper layer circuit 12.
The low intermediate frequency signal sequentially passes through an intermediate frequency filter 19, a second attenuator 20, a second amplifier 21, a wide-narrow band filter 22, a numerical control attenuator 23 and an intermediate frequency amplifier 24, then passes through a metal solder ball to the bottom layer circuit 12, and finally outputs an IF1.
The +5V power supply signal passes through the upper and lower layers through the metal solder ball to provide power for the radio frequency amplifier, the first local oscillator amplifier, the frequency multiplier, the second local oscillator amplifier and the intermediate frequency amplifier of each channel, and the-5V power supply signal passes through the upper and lower layers through the metal solder ball to provide power for the attenuator, the wide and narrow band filter and the numerical control attenuator of each channel.
Further, the number of the second circuit modules is two, the two second circuit modules are arranged in the upper layer circuit 12 in parallel, and the two second circuit modules are respectively connected with the two signal processing units in a one-to-one correspondence manner.
In this embodiment, the signal processing unit is connected to the underlying circuit 11 by conductive adhesive or eutectic.
In this embodiment, the second circuit module is connected to the upper circuit 12 by conductive adhesive.
Specifically, the first attenuator 15 is a primary attenuator that can provide 15dB dynamic control; the second attenuator 20 and the digital attenuator 23 are each controllable attenuators that provide 31.5dB of dynamic control.
The SIP-based broadband frequency conversion module provided by the invention has the advantages that the board-level stacking is performed inside, the functional density of the module is improved, meanwhile, the signal transmission cavity is formed by the bottom layer circuit, the upper layer circuit and the solder balls, and the size of the cavity is reduced by more than 70% compared with that of the traditional two-dimensional multi-chip module; in addition, the SIP broadband frequency conversion module uses a tube shell to replace a traditional component box body, and the weight is reduced by more than 90% compared with a traditional two-dimensional multi-chip component; the invention discloses a broadband frequency conversion module which is miniaturized, light and integrated with high density based on SIP, solves the problems of large volume, heavy weight and low integrated density of the traditional broadband frequency conversion module, and has the characteristics of improving dynamic range, anti-interference performance and local oscillation suppression.
When the broadband frequency conversion module is particularly used, the frequency coverage range of the broadband frequency conversion module is 0.8-18 GHz, a signal to be converted is firstly mixed with a first local oscillation signal of 22.8-40 GHz to obtain a high intermediate frequency signal of 22GHz, and the high intermediate frequency signal generated after the mixing is then subjected to down-conversion with a second local oscillation signal to obtain a required low intermediate frequency signal. Because the two local oscillators can generate multiple combined interference after passing through the mixer and fall in the band, the high intermediate frequency and low intermediate frequency signals need to be filtered, so that clutter signals such as radio frequency, carrier signals and combined frequencies generated by the local oscillator signals after mixing can be filtered.
In the first mixing circuit, a first local oscillator port adopts a frequency doubler to double the input local oscillator source signal to obtain a first local oscillator signal of 22.8 GHz-40 GHz which is finally needed. The first local oscillation amplifier 39 is added with a first-stage local oscillation attenuator 40, so that the power of the broadband first local oscillation signal and the broadband fundamental oscillation signal can be controlled, and the first local oscillation signal, the fundamental oscillation signal and the harmonic power can be restrained.
A first attenuator 15 is cascaded between the two frequency conversions, providing 15dB of dynamic control. The low intermediate frequency part adopts two attenuators, namely a second attenuator and a numerical control attenuator, each chip is integrated with a 31.5dB controllable attenuator, and the first stage uses attenuation for amplitude equalization and temperature compensation, so that the stability of the signal gain of the whole receiver channel at high and low temperatures can be ensured. The three-stage attenuation control jointly realizes the attenuation control of more than 75dB, and realizes the high dynamic range of the broadband frequency conversion module.
In order to meet the different instantaneous bandwidth requirements of the output signals, intermediate frequency filters with two bandwidths are designed in the intermediate frequency circuit, and the intermediate frequency filters are selected through switch switching, namely a 1000MHz broadband intermediate frequency signal and a 50MHz narrowband intermediate frequency signal.
Example embodiments have been disclosed herein, and although specific terms are employed, they are used and should be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some embodiments, it will be apparent to one skilled in the art that features, characteristics, and/or elements described in connection with a particular embodiment may be used alone or in combination with other embodiments unless explicitly stated otherwise. It will therefore be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the scope of the present invention as set forth in the following claims.

Claims (10)

1. The SIP-based broadband frequency conversion module is characterized by comprising a tube shell, wherein a bottom layer circuit and an upper layer circuit are arranged in the tube shell in a eutectic mode, and the bottom layer circuit and the upper layer circuit are stacked and fixed together in a vacuum reflow soldering mode; the channel structures of the bottom layer circuit and the upper layer circuit are the same; the bottom layer circuit is internally provided with a first circuit module for mixing and down-conversion, and the upper layer circuit is internally provided with a second circuit module for filtering; the shell, the bottom layer circuit, the upper layer circuit, the first circuit module and the second circuit module are packaged together in an SIP mode to form the broadband frequency conversion module.
2. The SIP-based wideband frequency conversion module of claim 1, wherein the first circuit module comprises a signal processing unit comprising a wideband mixer, a radio frequency amplifier, a first attenuator, a radio frequency filter, a first amplifier, a radio frequency mixer, and a second attenuator, all of which are arranged in sequence; the first circuit module further comprises a first local oscillator signal processing unit connected with the broadband mixer and a second local oscillator signal processing unit connected with the radio frequency mixer.
3. The SIP-based broadband frequency conversion module according to claim 2, wherein the first local oscillator signal processing unit comprises a broadband power divider, a frequency multiplier, a first local oscillator amplifier and a local oscillator attenuator, which are sequentially arranged; and the local oscillation attenuator is connected with a local oscillation port of the broadband mixer.
4. The SIP-based broadband frequency conversion module according to claim 3, wherein the second local oscillation signal processing unit comprises a radio frequency power divider and a second local oscillation amplifier which are sequentially arranged, and the second local oscillation amplifier is connected with a local oscillation interface of the radio frequency mixer.
5. The SIP-based broadband frequency conversion module according to claim 4, wherein the number of the signal processing units is two, and the signal processing units are arranged in parallel in the bottom layer circuit; the broadband power divider is provided with two paths of outputs, and is connected with the broadband mixers in the two groups of signal processing units after passing through the frequency multiplier, the first local oscillator amplifier and the local oscillator attenuator respectively; the radio frequency power divider is provided with two paths of outputs, and is connected with the radio frequency mixers in the two groups of signal processing units after passing through the second local oscillator amplifier respectively.
6. The SIP-based broadband frequency conversion module according to claim 5, wherein the second circuit module comprises an intermediate frequency filter, a second attenuator, a second amplifier, a wide-narrow band filter, a digitally controlled attenuator, and an intermediate frequency amplifier, which are sequentially arranged; the intermediate frequency filter is connected with the radio frequency mixer through a metal tin ball penetrating through the bottom layer circuit and the upper layer circuit.
7. The SIP-based broadband frequency conversion module according to claim 6, wherein the number of the second circuit modules is two, the second circuit modules are arranged in the upper layer circuit in parallel, and the two second circuit modules are respectively connected with the two signal processing units in a one-to-one correspondence.
8. The SIP-based broadband frequency conversion module according to claim 2, wherein the signal processing unit is connected to the underlying circuit by means of conductive glue or eutectic.
9. The SIP-based broadband frequency conversion module according to claim 1, wherein the second circuit module is connected to the upper circuit by means of conductive adhesive.
10. The SIP-based broadband frequency conversion module according to claim 6, wherein the first attenuator is a primary attenuator that provides 15dB dynamic control; the second attenuator and the numerical control attenuator are controllable attenuators which can provide 31.5dB dynamic control.
CN202211708204.1A 2022-12-29 2022-12-29 Broadband frequency conversion module based on SIP Pending CN116388698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211708204.1A CN116388698A (en) 2022-12-29 2022-12-29 Broadband frequency conversion module based on SIP

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211708204.1A CN116388698A (en) 2022-12-29 2022-12-29 Broadband frequency conversion module based on SIP

Publications (1)

Publication Number Publication Date
CN116388698A true CN116388698A (en) 2023-07-04

Family

ID=86979380

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211708204.1A Pending CN116388698A (en) 2022-12-29 2022-12-29 Broadband frequency conversion module based on SIP

Country Status (1)

Country Link
CN (1) CN116388698A (en)

Similar Documents

Publication Publication Date Title
Visweswaran et al. 9.4 A 145GHz FMCW-radar transceiver in 28nm CMOS
US8116676B2 (en) Method and system for inter IC communications utilizing a spatial multi-link repeater
US11043983B2 (en) Radio frequency module and communication device including the same
CN105281675B (en) A kind of big instant bandwidth down conversion module of ultra wide band and its conversion method
US20100014610A1 (en) Spaceflight high data rate radiation hard ka-band modulator
US20220278703A1 (en) Radio frequency module and communication device
JP2020125927A (en) High-frequency module
WO2005084288A2 (en) Diode ring configuration for harmonic diode mixers
CN106603090B (en) 12-channel receiving-transmitting frequency conversion channel device
CN109257057B (en) Ultra-wideband superheterodyne receiving system
CN107171681A (en) A kind of highly sensitive receiving circuit of Ku wave bands
Jeon et al. Front-end module of 18–40 GHz ultra-wideband receiver for electronic warfare system
CN112701048A (en) Method for realizing ultra-wideband hybrid integrated circuit for satellite based on copper-lined printed board technology
CN116388698A (en) Broadband frequency conversion module based on SIP
US20230163803A1 (en) Radio-frequency circuit and communication apparatus
CN112087229A (en) Miniaturized low-cost multichannel low-phase-noise low-spurious point frequency source
US10382083B2 (en) BICMOS-based transceiver for millimeter wave frequency applications
CN205142138U (en) Frequency conversion module under big instant bandwidth of ultra wide band
WO2022124262A1 (en) High frequency module and communication apparatus
CN112636774B (en) Ultra-wideband eight-channel miniaturized receiver
Müller et al. 60 GHz ultrawideband front-ends with gain control, phase shifter, and wave guide transition in LTCC technology
Xu et al. An Integrated K-Band Receiving Front-End Module for Satellite Communication
CN109004933A (en) A kind of broadband frequency source
US20240048173A1 (en) High frequency module and communication apparatus
US20230253999A1 (en) High-frequency module and communication device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination