CN116377436A - PET coating method and coating equipment compatible with chemical plating and electroplating processes - Google Patents
PET coating method and coating equipment compatible with chemical plating and electroplating processes Download PDFInfo
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- CN116377436A CN116377436A CN202310373245.8A CN202310373245A CN116377436A CN 116377436 A CN116377436 A CN 116377436A CN 202310373245 A CN202310373245 A CN 202310373245A CN 116377436 A CN116377436 A CN 116377436A
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- 238000007747 plating Methods 0.000 title claims abstract description 135
- 238000000034 method Methods 0.000 title claims abstract description 55
- 230000008569 process Effects 0.000 title claims abstract description 43
- 238000009713 electroplating Methods 0.000 title claims abstract description 36
- 238000000576 coating method Methods 0.000 title claims description 13
- 239000000126 substance Substances 0.000 title claims description 13
- 239000011248 coating agent Substances 0.000 title claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 147
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 76
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000011889 copper foil Substances 0.000 claims abstract description 35
- 238000005406 washing Methods 0.000 claims abstract description 19
- 238000007772 electroless plating Methods 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 7
- 229920002799 BoPET Polymers 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 4
- 239000007888 film coating Substances 0.000 claims abstract description 4
- 238000009501 film coating Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 33
- 238000003825 pressing Methods 0.000 claims description 20
- 239000007921 spray Substances 0.000 claims description 19
- 238000005520 cutting process Methods 0.000 claims description 13
- 238000007599 discharging Methods 0.000 claims description 7
- 239000003963 antioxidant agent Substances 0.000 claims description 6
- 230000003078 antioxidant effect Effects 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 2
- 239000002351 wastewater Substances 0.000 description 8
- 238000005507 spraying Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The application relates to the technical field of PET copper foil production and provides a PET film coating method: the method comprises the following steps: step one: plating a conductive copper layer: plating conductive copper layers on two sides of the PET base film through an electroless plating process; step two: plating a thickened copper layer: further plating thickened copper layers on the conductive copper layers on two sides of the PET base film through an electroplating process to form PET copper foil; step three: performing antioxidation treatment on the PET copper foil; step four: washing the PET copper foil with water; step five: and (5) drying the PET copper foil. The PET base film has the effect of making the PET base film not easy to damage.
Description
Technical Field
The application relates to the technical field of PET copper foil production, in particular to a PET film plating method and film plating equipment compatible with chemical plating and electroplating processes.
Background
The PET copper foil is a micron-sized composite copper foil with a sandwich structure. Wherein the middle layer is a PET base film with the thickness of 4.5 mu m, and copper film layers with the thickness of 1-1.5 mu m are respectively plated on two sides of the PET base film.
At present, a vacuum coating process or a vacuum magnetron sputtering process is generally adopted to coat a 30-50nm copper film on a PET base film to serve as a conductive copper layer, then a thickened copper layer is further coated on the conductive copper layer to 1-1.5 mu m by an electroplating method, the defect of the production process is that the vacuum coating process or the vacuum magnetron sputtering process is carried out in a high-temperature environment, the vacuum magnetron sputtering process is also required to carry out high-voltage discharge on the PET base film, the factors are easy to damage the PET base film, pinholes or damages are generated, the rejection rate of the PET base film is high, and the production efficiency of the PET composite copper foil is reduced.
Disclosure of Invention
In order to ensure that a PET base film is not easy to damage in the process of producing the PET copper foil and improve the qualification rate of the production of the PET copper foil, the application provides a PET film plating method and film plating equipment compatible with chemical plating and electroplating processes.
The PET coating method adopts the following technical scheme:
a PET film coating method comprises the following steps: the method comprises the following steps:
step one: plating a conductive copper layer: plating conductive copper layers on two sides of the PET base film through an electroless plating process;
step two: plating a thickened copper layer: further plating thickened copper layers on the conductive copper layers on two sides of the PET base film through an electroplating process to form PET copper foil;
step three: performing antioxidation treatment on the PET copper foil;
step four: washing the PET copper foil with water;
step five: and (5) drying the PET copper foil.
By adopting the technical scheme, the two sides of the PET base film are plated with a layer of conductive copper layer by using the chemical plating process, and then the thicker copper layer is further plated on the original conductive copper layer by using the electroplating process, so that the production of the PET copper foil is realized.
The PET coating equipment compatible with the chemical plating and electroplating processes for implementing the PET coating method comprises a rack, wherein the rack is sequentially provided with an unreeling component, a plurality of plating tanks for chemical plating, a plurality of electroplating tanks for electroplating, an antioxidant tank, a water washing tank, an oven and a reeling component along the conveying direction of a PET base film; the two ends of the PET base film are respectively connected with the unreeling component and the reeling component, and the PET base film is sequentially conveyed to a plurality of plating tanks, a plurality of electroplating tanks, an antioxidant tank, a washing tank and an oven.
Through adopting above-mentioned technical scheme, when PET copper foil is produced, pass into a plurality of plating baths in proper order with PET base film and carry out the electroless plating, realize the plating of PET base film both sides conductive copper layer and establish, the conductive copper layer is plated and is established the back again with plating the PET base film of conductive copper layer and pass into the electroplating pond in carrying out the plating of thickening copper layer and establish, later pass into the antioxidation processing of PET copper foil in proper order again, pass into washing pond and oven in carrying out the cleanness and the stoving of PET copper foil at last, realize carrying out the production of PET copper foil on same equipment, make the production shaping of PET copper foil simpler and more convenient.
Preferably, the bottom of the inner cavity of the plating solution tank is provided with a submerged roller for winding the PET base film, the feeding end and the discharging end of the plating solution tank are provided with tensioning assemblies, and the PET base film is in a V shape and sequentially winds the tensioning assemblies at the feeding end, the submerged roller and the discharging end of the plating solution tank.
By adopting the technical scheme, the contact area between the PET base film and the plating solution in the plating solution tank is increased, so that the PET base film can be better contacted with the plating solution; the conductive copper layer is plated on the PET base film by the chemical plating process better.
Preferably, the tensioning assembly comprises a main connecting plate erected above the plating solution tank, the main connecting plate is sequentially connected with two groups of tensioning rollers in a rotating manner along the horizontal direction, and the PET base film is wound on the two groups of tensioning rollers of the main connecting plate; the main connecting plate is also provided with a main driving component for driving the two groups of tensioning rollers to rotate.
Through adopting above-mentioned technical scheme, in the PET base film conveying process, drive two sets of tensioning rollers along with the direction of delivery of PET base film rotation through main drive assembly, be favorable to reducing the frictional force between PET base film and the tensioning assembly, reduce the PET base film and take place the friction and then produce wearing and tearing with the tensioning roller in the conveying process.
Preferably, a liquid cutting assembly is arranged between the adjacent plating solution tanks, the liquid cutting assembly comprises an auxiliary connecting plate vertically erected between the adjacent plating solution tanks, and the auxiliary connecting plate is sequentially and horizontally connected with an upper press roller and a lower press roller in a rotating manner from top to bottom; the auxiliary connecting plate is also provided with an auxiliary driving assembly for driving the upper press roller and the lower press roller to rotate; the PET base film is wound on the lower pressing roller, and the upper pressing roller and the lower pressing roller are respectively abutted with two opposite sides of the PET base film.
Through adopting above-mentioned technical scheme, drive upper pressure roller and lower pressure roller along with the direction of transfer of PET base film through vice drive assembly and rotate, alright extrude the plating solution of last plating bath that carries on PET base film surface and separate in upper pressure roller and one side of lower pressure roller, reduce the plating solution of last plating bath that the PET base film carried and get into in the next plating bath, lead to the plating bath plating solution contaminated condition.
Preferably, the main connecting plate is further provided with a plurality of spraying pipes, the spraying pipes are located between two groups of tensioning rollers of the main connecting plate and are oppositely arranged on two sides of the PET base film, and one side, facing the PET base film, of each spraying pipe is communicated with a plurality of spray heads.
Through adopting above-mentioned technical scheme, in the PET base film conveying process, with shower and water source intercommunication, spray the plating solution that washs in order to get rid of most PET base film surface and carry towards PET base film surface through the shower nozzle on the shower, reduce the plating solution that carries preceding plating solution pond in the PET base film conveying process and carry into the circumstances that the plating solution in the follow-up plating solution pond was polluted in the follow-up plating solution pond.
Preferably, a collecting tank is further arranged between the adjacent plating solution tanks, the collecting tank is positioned below the lower press roller, and the projection of the collecting tank on the horizontal plane covers the projection of the lower press roller on the horizontal plane.
Through adopting above-mentioned technical scheme, through setting up the collecting vat for cut waste water and plating solution of liquid subassembly's last compression roller and lower compression roller filtering can fall into the collecting vat, realize the collection to waste water plating solution, reduce the condition that causes the pollution to waste water plating solution falls to ground.
Preferably, extension plates are arranged on two opposite sides of the top of the collecting tank, the plating solution tanks are obliquely upwards extended towards the direction away from the collecting tank, the two groups of extension plates are respectively in one-to-one correspondence with the main connecting plates at one ends, close to each other, of the adjacent plating solution tanks, the extension plates are located below the corresponding main connecting plates, and the projection of the extension plates on the horizontal plane covers the projection of the tensioning rollers and the spraying pipes on the corresponding main connecting plates on the horizontal plane.
Through adopting above-mentioned technical scheme, in the plating solution that the PET base film conveying in-process was fallen and the shower sprays the waste water that produces when wasing the PET base film in can all fall into the extension board, again in the extension board conflux to the collecting vat, just have the waste water that produces when collecting plating solution and shower washing copper foil better, reduce the plating solution that the PET base film was fallen and the waste water falls to the ground and cause the circumstances of pollution.
In summary, the present application includes at least one of the following beneficial technical effects:
1. after the conductive copper layer is plated on the PET base film by adopting the chemical plating process, the thickened copper layer is plated on the conductive copper layer by adopting the electroplating process so as to realize the production of the PET copper foil, and compared with the traditional mode of processing the conductive copper layer of the PET base film by adopting the vacuum plating process or the vacuum magnetron sputtering process, the damage to the PET base film in the production process is reduced.
2. The bottom of the inner cavity of the plating solution tank is provided with the submerged roller, the feeding end and the discharging end of the plating solution tank are respectively provided with the tensioning assembly, and the PET base film is sequentially wound on the tensioning assembly of the feeding end and the tensioning assembly of the discharging end of the submerged roller and the tensioning assembly of the discharging end of the plating solution tank in a V shape, so that the contact area between the PET base film and the plating solution in the plating solution tank is conveniently increased.
3. The PET base film is wound on the lower pressing roller, two sides of the PET base film are respectively abutted with the upper pressing roller and the lower pressing roller, the upper pressing roller and the lower pressing roller are driven to rotate along with the conveying direction of the PET base film through the auxiliary driving assembly, so that plating liquid brought out of the PET base film from the upper plating liquid tank can be extruded and isolated on one side of the upper pressing roller and one side of the lower pressing roller, and the condition that the plating liquid of the upper plating liquid tank carried by the PET base film pollutes the plating liquid of the lower plating liquid tank is reduced.
Drawings
Fig. 1 is a schematic overall structure of the first embodiment.
FIG. 2 is a schematic view showing a structure of a plating bath according to an embodiment.
Fig. 3 is an enlarged schematic view of a portion a in fig. 1.
FIG. 4 is a schematic diagram of a second embodiment for illustrating a plating bath.
Fig. 5 is an enlarged schematic view of the portion B in fig. 4.
Reference numerals illustrate:
1. a frame; 11. unreeling the assembly; 12. a plating liquid bath; 13. an electroplating pool; 14. an antioxidation pool; 15. a water washing pool; 16. an oven; 17. a winding assembly; 2. a PET base film; 3. a main connecting plate; 31. a tension roller; 32. a main driving motor; 4. a shower pipe; 5. an auxiliary connecting plate; 51. an upper press roll; 52. a lower press roll; 53. an auxiliary driving motor; 6. a collecting tank; 61. an extension plate.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-5.
Example 1
The embodiment of the application discloses a PET coating method and coating equipment compatible with chemical plating and electroplating processes.
Referring to fig. 1, a PET film coating method includes the steps of:
step one: plating a conductive copper layer: conductive copper layers are plated on two sides of the PET base film 2 through an electroless plating process.
Step two: plating a thickened copper layer: a thickened copper layer is further plated on the conductive copper layers on the two sides of the PET base film 2 through an electroplating process to form PET copper foil.
Step three: and (5) performing antioxidation treatment on the PET copper foil.
Step four: and (5) washing the PET copper foil with water.
Step five: and (5) drying the PET copper foil.
Referring to fig. 1, a PET coating apparatus compatible with electroless plating and electroplating processes for implementing a PET coating method includes a frame 1, the frame 1 is sequentially provided with an unreeling assembly 11, a plurality of plating tanks 12 for electroless plating, a plurality of electroplating tanks 13 for electroplating, an oxidation resisting tank 14, a water washing tank 15, an oven 16 and a reeling assembly 17 along a conveying direction of a PET base film 2; the two ends of the PET base film 2 are respectively connected with the unreeling component 11 and the reeling component 17, and the PET base film 2 is sequentially conveyed to a plurality of plating tanks 12, a plurality of electroplating tanks 13, an antioxidant tank 14, a water washing tank 15 and an oven 16.
In this embodiment, the unreeling device and the reeling device are both existing film reeling machines; submerged rollers for winding the PET base film 2 are rotatably connected in the plating tank 12, the electroplating tank 13, the antioxidation tank 14 and the washing tank 15. The two ends of the PET base film 2 are respectively connected with unreeling equipment and reeling equipment, and the PET base film 2 is sequentially wound on submerged rollers in a plating tank 12, an electroplating tank 13, an antioxidant tank 14 and a washing tank 15.
Referring to fig. 1 and 2, the number of plating baths 12 is three, and the three plating baths 12 are used as a pre-dipping bath, an activation bath and a chemical plating bath in the electroless plating process, respectively. The liquid inlet end and the liquid outlet end of the plating solution tank 12 are provided with tensioning assemblies. The PET base film 2 is in a V shape and sequentially winds the tensioning assembly arranged at the liquid inlet end of the plating liquid tank 12, the submerged roller of the plating liquid tank 12 and the tensioning assembly arranged at the discharge end of the plating liquid tank 12, so that the contact area between the PET base film 2 and liquid in the plating liquid tank 12 is conveniently increased, and further, a conductive copper layer is conveniently plated on the surface of the PET base film 2 through a chemical plating process.
Referring to fig. 2 and 3, the tensioning assembly includes a main connecting plate 3 vertically connected to the frame 1, the main connecting plate 3 is located above the plating bath 12, the main connecting plate 3 is sequentially connected with two groups of tensioning rollers 31 in a rotating manner along a horizontal direction, and the pet base film 2 is sequentially wound on the two groups of tensioning rollers 31. The main connecting plate 3 is further provided with a main driving assembly for driving the two groups of tensioning rollers 31 to rotate, the main driving assembly comprises two groups of main driving motors 32 arranged on the main connecting plate 3, the two groups of main driving motors 32 are respectively in one-to-one correspondence with the two groups of tensioning rollers 31, one end of each tensioning roller 31 is connected with the output end of the corresponding main driving motor 32, and the tensioning rollers 31 are driven to rotate along with the conveying direction of the PET base film 2 through the main driving motors 32, so that friction force between the PET base film 2 and the tensioning rollers 31 is reduced, and abrasion of the PET base film 2 is not easy to occur.
Referring to fig. 2 and 3, a liquid cutting assembly is further disposed between the adjacent plating baths 12, the liquid cutting assembly includes an auxiliary connection plate 5 vertically connected to the frame 1, the auxiliary connection plate 5 is sequentially rotatably connected to an upper press roller 51 and a lower press roller 52 from top to bottom, and in this embodiment, the upper press roller 51 and the lower press roller 52 are rubber covered rollers. The lower press roller 52 is located higher than the tension roller 31. The auxiliary driving assembly for driving the upper pressing roller 51 and the lower pressing roller 52 to rotate is further arranged on the auxiliary connecting plate 5, the auxiliary driving assembly comprises two groups of auxiliary driving motors 53 which are arranged on the auxiliary connecting plate 5, output shafts of the two groups of auxiliary driving motors 53 are respectively connected with the upper pressing roller 51 and the lower pressing roller 52, the upper pressing roller 51 and the lower pressing roller 52 are respectively driven by the two groups of auxiliary driving motors 53 to rotate along with the conveying direction of the PET base film 2, so that plating solution carried by the PET base film 2 can be extruded and blocked on one sides of the upper pressing roller 51 and the lower pressing roller 52, and the situation that the plating solution of the last plating solution pool 12 carried by the PET base film 2 enters the next plating solution pool 12 to cause the plating solution in the plating solution pool 12 to be polluted is reduced.
The connecting plate is also vertically connected with a plurality of spray pipes 4, the axial direction of the spray pipes 4 is parallel to the axial direction of the tensioning rollers 31, the spray pipes 4 are positioned between two groups of tensioning rollers 31 on the connecting plate, the spray pipes 4 are respectively and oppositely arranged on two opposite sides of the PET base film 2, and a plurality of spray heads are uniformly communicated along the axial direction towards one side of the PET base film 2 by the spray pipes 4. In the conveying process of the PET base film 2, the spray pipe 4 is communicated with a water source, and the spray pipe 4 is used for spraying towards the side face of the PET base film 2, so that before the PET base film 2 is conveyed to the liquid cutting assembly, the PET base film 2 can be sprayed and washed through the spray pipe 4 after the PET base film 2 is conveyed out of the liquid cutting assembly, and the plating solution of the last plating solution tank 12 is not easy to carry when the PET base film 2 is conveyed into the downward-moving plating solution tank 12.
The liquid cutting components are arranged between the plating solution tank 12 and the plating solution tank 13, between the plating solution tank 13 and the oxidation resisting tank 14, between the oxidation resisting tank 14 and the washing tank 15, and between the washing tank 15 and the baking equipment, and the specific structure and the action of the liquid cutting components are the same as those of the liquid cutting components between the adjacent plating solution tanks 12, so that the detailed description is omitted.
The implementation principle of the embodiment of the application is that the PET base film 2 is sequentially transferred into three groups of plating tanks 12 under the action of an unreeling component 11 and a reeling component 17, a conductive copper layer is plated on the surface of the PET base film 2 through an electroless plating process, the PET base film 2 plated with the conductive copper layer is transferred from the plating tank 12 and then transferred into an electroplating tank 13 to be plated with a thickened copper layer to form a PET copper foil, the PET copper foil is sequentially transferred into an oxidation resisting tank 14 and a washing tank 15 for washing and cleaning after being transferred from the electroplating tank 13, and finally the PET copper foil is transferred into an oven 16 to remove moisture carried on the surface of the PET copper foil.
Example two
The second embodiment differs from the first embodiment in that: referring to fig. 4 and 5, a collecting tank 6 is further disposed between the adjacent plating tanks 12, the collecting tank 6 is located below the lower press roller 52, and the projection of the collecting tank 6 on the horizontal plane covers the projection of the lower press roller 52 on the horizontal plane, so that plating solution extruded by the liquid cutting component is conveniently collected by the collecting tank 6, and the situation that plating solution drops to the ground to cause pollution is reduced.
The opposite two sides of the top of the collecting tank 6 are respectively connected with an extension plate 61, the extension plates 61 on the two sides of the collecting tank 6 are obliquely upwards towards the direction away from the collecting tank 6, the extension plates 61 on the two sides of the collecting box are respectively in one-to-one correspondence with the main connecting plates 3 of which the plating baths 12 on the two sides of the collecting tank 6 are close to one another, the extension plates 61 are positioned below the corresponding main connecting plates 3, and the projection of the extension plates 61 on the horizontal plane covers the projection of the tensioning roller 31 and the spray pipes 4 on the main connecting plates 3 on the horizontal plane.
Through two sets of tensioning rollers 31 along the horizontal direction setting on main connecting plate 3 and lower compression roller 52 is higher than tensioning roller 31, realize that PET base film 2 is the reverse V shape and winds to establish on lower compression roller 52 the time realize that PET base film 2 is N shape and falls N shape and wind respectively on two sets of tensioning rollers 31 of establishing the connecting plate of cutting liquid mechanism both sides for the plating bath that cuts liquid subassembly extrusion and the waste water that produces when shower 4 sprays can finally fall into extension board 61 and converge to the collection box.
Baffle plates are vertically connected to two adjacent sides of the extension plate 61 and the collecting tank 6, so that the condition that waste water and plating solution falling onto the extension plate 61 overflow out of the extension plate 61 is reduced.
The second embodiment is similar to the first embodiment in terms of implementation principle, so that a detailed description thereof will be omitted.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (8)
1. A PET film coating method comprises the following steps: the method is characterized in that: the method comprises the following steps:
step one: plating a conductive copper layer: plating conductive copper layers on two sides of the PET base film (2) through an electroless plating process;
step two: plating a thickened copper layer: further plating thickened copper layers on the conductive copper layers on two sides of the PET base film (2) through an electroplating process to form PET copper foil;
step three: performing antioxidation treatment on the PET copper foil;
step four: washing the PET copper foil with water;
step five: and (5) drying the PET copper foil.
2. A PET coating apparatus compatible with electroless plating and electroplating processes for carrying out the PET coating method of claim 1, characterized in that: the PET base film packaging machine comprises a frame (1), wherein the frame (1) is sequentially provided with an unreeling component (11), a plurality of plating solution tanks (12) for chemical plating, a plurality of electroplating tanks (13) for electroplating, an antioxidant tank (14), a washing tank (15), an oven (16) and a reeling component (17) along the conveying direction of the PET base film (2); two ends of the PET base film (2) are respectively connected with the unreeling component (11) and the reeling component (17), and the PET base film (2) is sequentially conveyed to a plurality of plating tanks (12), a plurality of electroplating tanks (13), an antioxidant tank (14), a washing tank (15) and an oven (16).
3. A PET plating apparatus compatible with electroless plating and electroplating processes according to claim 2, wherein: the bottom of the inner cavity of the plating solution tank (12) is provided with submerged rollers for winding the PET base film (2), the feeding end and the discharging end of the plating solution tank (12) are provided with tensioning assemblies, and the PET base film (2) is in a V shape and sequentially winds the tensioning assemblies arranged at the feeding end of the plating solution tank (12), the submerged rollers and the tensioning assemblies arranged at the discharging end of the plating solution tank (12).
4. A PET plating apparatus compatible with electroless plating and electroplating processes according to claim 3, wherein: the tensioning assembly comprises a main connecting plate (3) erected above a plating solution tank (12), the main connecting plate (3) is sequentially connected with two groups of tensioning rollers (31) in a rotating manner along the horizontal direction, and the PET base film (2) is wound on the two groups of tensioning rollers (31) of the main connecting plate (3); the main connecting plate (3) is also provided with a main driving component for driving the two groups of tensioning rollers (31) to rotate.
5. The PET plating apparatus compatible with electroless plating and electroplating processes according to claim 4, wherein: a liquid cutting assembly is arranged between the adjacent plating liquid tanks (12), the liquid cutting assembly comprises an auxiliary connecting plate (5) vertically erected between the adjacent plating liquid tanks (12), and the auxiliary connecting plate (5) is sequentially and horizontally connected with an upper press roller (51) and a lower press roller (52) in a rotating manner from top to bottom; the auxiliary connecting plate (5) is also provided with an auxiliary driving component for driving the upper pressing roller (51) and the lower pressing roller (52) to rotate; the PET base film (2) is wound on the lower press roller (52), and the upper press roller (51) and the lower press roller (52) are respectively abutted against two opposite surfaces of the PET base film (2).
6. The PET plating apparatus compatible with electroless plating and electroplating processes according to claim 5, wherein: the PET base film is characterized in that a plurality of spray pipes (4) are further arranged on the main connecting plate (3), the spray pipes (4) are located between two groups of tensioning rollers (31) of the main connecting plate (3) and are oppositely arranged on two sides of the spray pipes (4) and the PET base film (2), and one sides of the spray pipes (4) facing the PET base film (2) are communicated with a plurality of spray heads.
7. The PET plating apparatus compatible with electroless plating and electroplating processes according to claim 6, wherein: and a collecting tank (6) is further arranged between the adjacent plating liquid tanks (12), the collecting tank (6) is positioned below the lower press roller (52) and the projection of the collecting tank (6) on the horizontal plane covers the projection of the lower press roller (52) on the horizontal plane.
8. The PET plating apparatus compatible with electroless plating and electroplating processes according to claim 7, wherein: the utility model discloses a collecting tank, including collecting tank (6), extension board (61) are all provided with in the opposite both sides in collecting tank (6) top, plating bath (12) all upwards extend towards the direction slope of keeping away from collecting tank (6), two sets of extension board (61) respectively with main connecting plate (3) one-to-one of the mutual one that is close to of adjacent plating bath (12), extension board (61) are located main connecting plate (3) below that corresponds, extension board (61) cover the projection of tensioning roller (31) and shower (4) on main connecting plate (3) of correspondence on the horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310373245.8A CN116377436A (en) | 2023-04-07 | 2023-04-07 | PET coating method and coating equipment compatible with chemical plating and electroplating processes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310373245.8A CN116377436A (en) | 2023-04-07 | 2023-04-07 | PET coating method and coating equipment compatible with chemical plating and electroplating processes |
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| CN116377436A true CN116377436A (en) | 2023-07-04 |
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| CN202310373245.8A Pending CN116377436A (en) | 2023-04-07 | 2023-04-07 | PET coating method and coating equipment compatible with chemical plating and electroplating processes |
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| CN113755917A (en) * | 2021-08-02 | 2021-12-07 | 重庆金美新材料科技有限公司 | Electroplating system |
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| CN113755917A (en) * | 2021-08-02 | 2021-12-07 | 重庆金美新材料科技有限公司 | Electroplating system |
| CN216585218U (en) * | 2021-12-10 | 2022-05-24 | 重庆金美新材料科技有限公司 | Production line of superconducting metal film |
| CN114540802A (en) * | 2022-01-27 | 2022-05-27 | 江阴纳力新材料科技有限公司 | Method for preparing composite current collector with low energy consumption |
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