CN116367498A - Electronic equipment case with modularized heat dissipation design - Google Patents
Electronic equipment case with modularized heat dissipation design Download PDFInfo
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- CN116367498A CN116367498A CN202310248735.5A CN202310248735A CN116367498A CN 116367498 A CN116367498 A CN 116367498A CN 202310248735 A CN202310248735 A CN 202310248735A CN 116367498 A CN116367498 A CN 116367498A
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- chassis
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- circuit board
- heat dissipation
- sealing plate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 61
- 238000013461 design Methods 0.000 title claims abstract description 28
- 238000007789 sealing Methods 0.000 claims abstract description 39
- 238000006243 chemical reaction Methods 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 238000007664 blowing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an electronic equipment case with modularized heat dissipation design, which comprises a case structure component and a heat dissipation system component, wherein the main body of the case is a case skeleton, the front end of the case skeleton is provided with a front panel, and the front panel is provided with an external plug-in; the two sides of the chassis framework are respectively provided with a left outer sealing plate and a right outer sealing plate, and a right radiating plate is arranged inside the right outer sealing plate; the rear end of the chassis framework is provided with a fan frame; the inner side of the front panel in the case is provided with a front panel circuit board, the center position is provided with a control board circuit board, the inner side of the right outer sealing plate is provided with a treatment board circuit board, and the inner side of the left outer sealing plate is provided with a conversion circuit board; the inner side of the conversion circuit board is provided with a left radiator, and the inner side of the left radiator is provided with a heat radiation module; the inside front end position of right side outer shrouding sets up the right side fan, and the inside rear end position of right side outer shrouding sets up the right side radiator, installs back fan on the fan frame. The invention has the advantages of compact structure, high space utilization rate, flexible and changeable structure and strong applicability.
Description
Technical Field
The invention relates to the field of electronic equipment structural design, in particular to an electronic equipment cabinet with modularized heat dissipation design.
Background
Electronic equipment cabinets used in the electronic field are of a large variety, but the working principle of the electronic equipment cabinets is based on a structural frame and single or array-type arranged functional modules. The defects of the structure are obvious, on one hand, the structure is limited by the structural design, and the size of the structure cannot be flexibly expanded or reduced according to the functional module; on the other hand, the chassis with the design cannot realize good heat radiation performance while achieving high space utilization. Therefore, research on an electronic chassis which can adapt to the needs of diversified functional modules, has compact structure, large function expansion space and good heat dissipation is a problem to be solved.
In order to achieve high integration of the electronic device chassis, high space utilization, and a combined installation function of a plurality of functional modules, the following researches have been performed by related technicians.
Chinese patent application CN201910638567.4 discloses an electronic chassis with integrated structural functions and an assembling method thereof, the electronic chassis includes a lower bottom plate, an upper top plate, a left side structural function integrated side plate module, a right side structural function integrated side plate module, a rear bottom plate, a functional motherboard, a plurality of functional modules and a plurality of connectors, the left side structural function integrated side plate module and the right side structural function integrated side plate module are electrically and blindly interconnected with the functional motherboard through the connectors, the functional motherboard is disposed on the inner side of the rear bottom plate, and the functional module is disposed inside the electronic chassis. On the basis of the existing electronic chassis, the functional circuit is added in the pure structural board of the chassis to become a structural board module with integrated structural functions, which can bear the structural supporting function of the structural board of the chassis and can also provide certain circuit functions. Under the space size of the existing electronic chassis, the space utilization rate and the integration density can be improved, but the problem of heat dissipation of the chassis is not solved.
In addition, chinese patent application CN201811338496.8 provides an avionic chassis with a stack structure connected to the functional modules, the functional modules are connected in a stack structure, a micro rectangular connector is used between the adjacent functional modules, a double-head cable is used for communication between the functional modules and the rear printed boards of the socket of the front panel, the printed boards of the functional modules are arranged in parallel with the chassis cover plate, the printed boards of the functional modules are parallel to the micro rectangular connector opposite-inserting openings, the functional modules are fixed on the mounting boss of the chassis body, the functional modules are opposite-inserting rectangular connector space with the motherboard, and the locking device is mounted in a fixed space. The invention can realize the maximization of the area of the devices which are effectively distributed on the module printed board in the case, further realize the minimization of the outline dimension of the case, integrally form the case body of the case, set up the wire mesh damper to meet the vibration intensity requirement on the case, the window on the case body of the case can be externally connected with debugging equipment, realize the on-line debugging and the software upgrading, integrate the functions of the power supply function module and the cover plate, and has high heat dissipation efficiency, but the structure is not flexible enough, and the functional flexibility is to be improved.
The electronic equipment cabinet structure design is one of important components in the electronic equipment design, and achieves the functions of installation and positioning, heat dissipation, corrosion resistance, salt fog resistance and the like of the electronic equipment. However, the current design of the electronic equipment chassis is limited by the design of the heat dissipation system, and in the design of the complex circuit, it is difficult to simultaneously consider the structural design, the heat dissipation design, the shock absorption and corrosion prevention requirements of the complex circuit system, and the like. Therefore, developing a new modular heat dissipation module design to meet the needs of various application scenarios and to match with various complex circuit functions is a subject to be studied urgently, and has a very important role.
Disclosure of Invention
The invention aims to provide the electronic equipment cabinet which has the advantages of compact structure, high space utilization rate, excellent vibration resistance, flexible and changeable structure, capability of meeting the heat dissipation requirements of different functional modules and strong applicability.
The technical solution for realizing the purpose of the invention is as follows: an electronic equipment cabinet with modularized heat dissipation design comprises a cabinet structure component and a heat dissipation system component;
the chassis structure assembly comprises an external plug-in, a front panel, a chassis framework, a right side radiating plate, a right side outer sealing plate, a fan frame, a left side outer sealing plate, a front panel circuit board, a control board circuit board, a processing board circuit board and a conversion circuit board;
the heat dissipation system component comprises a left radiator, a heat dissipation module, a right radiator, a back fan and a right fan;
the chassis framework is a main body of the chassis, a front panel is arranged at the front end of the chassis framework, and an external plug-in unit is arranged on the front panel; the two sides of the chassis framework are respectively provided with a left outer sealing plate and a right outer sealing plate, and a right radiating plate is arranged inside the right outer sealing plate; the rear end of the chassis framework is provided with a fan frame; the inner side of the front panel in the case is provided with a front panel circuit board, the center position is provided with a control board circuit board, the inner side of the right outer sealing plate is provided with a treatment board circuit board, and the inner side of the left outer sealing plate is provided with a conversion circuit board;
the inner side of the conversion circuit board is provided with a left radiator, and the inner side of the left radiator is provided with a heat radiation module; the inside front end position of right side outer shrouding sets up the right side fan, and the inside rear end position of right side outer shrouding sets up the right side radiator, installs back fan on the fan frame.
Further, the chassis structure component is used for realizing positioning, mounting and assembling of the circuit board, and the heat dissipation system component is used for realizing thermal management of equipment.
Furthermore, the heat dissipation system component adopts a modularized design and installation, and meets the heat dissipation requirements of different functional modules.
Further, the number of the heat dissipation system components in the chassis structure components is configured according to the number of the functional modules.
Further, the left radiator, the heat radiation module and the right radiator of the heat radiation system component are made of aluminum alloy, or copper alloy and silver.
Further, the back fan and the right fan adopt an axial flow fan or a centrifugal fan.
Further, the axial flow fan and the centrifugal fan adopt an air draft or blowing type forced heat dissipation mode.
Further, the left radiator, the heat radiation module, the right radiator, the back fan and the right fan are arranged in a transverse array multi-group arrangement mode.
Further, the heat dissipation system component is fixedly connected with the chassis structure component in a welding, riveting or bolt fixing mode.
Further, the chassis structure component adopts a closed, semi-closed or open chassis structure.
Compared with the prior art, the invention has the remarkable advantages that: (1) The electronic case structure, the system heat dissipation, the function module and the shock absorption integrated design concept are adopted, and the electronic case has the advantages of compact structure, high space utilization rate and excellent shock resistance; (2) The heat dissipation modularized design concept is adopted, the structure is flexible and changeable, the heat dissipation requirements of different functional modules can be met, and the excellent integral integrity of the chassis is achieved; (3) The functional module is arranged in the closed cabin, has a certain sand-proof and dust-proof function, and meets the application requirements of different working conditions; (4) The applicability is strong, and the method can be suitable for working environments such as airborne, vehicle-mounted, carrier-borne and the like.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device chassis with a modularized heat dissipation design according to the present invention.
Fig. 2 is a schematic diagram of an internal structure of an electronic device chassis according to an embodiment of the present invention.
FIG. 3 is a schematic diagram of a modular development in an embodiment of the invention.
Detailed Description
The invention relates to an electronic equipment cabinet with modularized heat dissipation design, which is characterized by comprising a cabinet structure component and a heat dissipation system component;
the chassis structure assembly comprises an external plug-in 1, a front panel 2, a chassis framework 3, a right side radiating plate 4, a right side outer sealing plate 5, a fan frame 6, a left side outer sealing plate 7, a front panel circuit board 8, a control board circuit board 9, a processing board circuit board 10 and a conversion circuit board 11;
the heat dissipation system assembly comprises a left radiator 12, a heat dissipation module 13, a right radiator 14, a back fan 15 and a right fan 16;
the chassis framework 3 is a main body of the chassis, the front end of the chassis framework 3 is provided with a front panel 2, and the front panel 2 is provided with an external plug-in 1; the two sides of the chassis framework 3 are respectively provided with a left outer sealing plate 7 and a right outer sealing plate 5, and a right radiating plate 4 is arranged inside the right outer sealing plate 5; the rear end of the chassis framework 3 is provided with a fan frame 6; the inner side of the front panel 2 in the case is provided with a front panel circuit board 8, the center position is provided with a control panel circuit board 9, the inner side of the right outer sealing plate 5 is provided with a treatment panel circuit board 10, and the inner side of the left outer sealing plate 7 is provided with a conversion circuit board 11;
the inside of the conversion circuit board 11 is provided with a left radiator 12, and the inside of the left radiator 12 is provided with a heat radiation module 13; the front end position inside the right outer sealing plate 5 is provided with a right fan 16, the rear end position inside the right outer sealing plate 5 is provided with a right radiator 14, and the fan frame 6 is provided with a back fan 15.
As a specific example, the chassis structure assembly is used to implement a positioning, mounting and assembling of a circuit board, and the heat dissipation system assembly is used to implement thermal management of a device.
As a specific example, the heat dissipation system component adopts a modularized design and installation, so as to meet the heat dissipation requirements of different functional modules.
As a specific example, the number of heat dissipation system components in the chassis structure component 3 is configured according to the number of functional modules.
As a specific example, the left radiator 12, the heat dissipation module 13, and the right radiator 14 of the heat dissipation system assembly are made of aluminum alloy, or copper alloy, or silver.
As a specific example, the back fan 15 and the right fan 16 employ an axial fan or a centrifugal fan.
As a specific example, the axial flow fan and the centrifugal fan both adopt an air draft or blowing type forced heat dissipation mode.
As a specific example, the left radiator 12, the heat dissipation module 13, the right radiator 14, the back fan 15, and the right fan 16 are arranged in a plurality of groups of the transverse arrays.
As a specific example, the heat dissipation system component is fixedly connected with the chassis structural component by adopting a welding, riveting or bolting mode.
As a specific example, the chassis structure component adopts a closed, semi-closed or open chassis structure.
The invention will be described in further detail with reference to the drawings and the specific examples.
Examples
Referring to fig. 1, an electronic device chassis of the present invention includes a chassis structure assembly and a heat dissipation system assembly;
the chassis structure assembly comprises an external plug-in 1, a front panel 2, a chassis framework 3, a right side radiating plate 4, a right side outer sealing plate 5, a fan frame 6, a left side outer sealing plate 7, a front panel circuit board 8, a control board circuit board 9, a processing board circuit board 10 and a conversion circuit board 11;
the heat dissipation system assembly comprises a left radiator 12, a heat dissipation module 13, a right radiator 14, a back fan 15 and a right fan 16;
the chassis framework 3 is a main body of the chassis, the front end of the chassis framework 3 is provided with a front panel 2, and the front panel 2 is provided with an external plug-in 1; the two sides of the chassis framework 3 are respectively provided with a left outer sealing plate 7 and a right outer sealing plate 5, and a right radiating plate 4 is arranged inside the right outer sealing plate 5; the rear end of the chassis framework 3 is provided with a fan frame 6; the inner side of the front panel 2 in the case is provided with a front panel circuit board 8, the center position is provided with a control panel circuit board 9, the inner side of the right outer sealing plate 5 is provided with a treatment panel circuit board 10, and the inner side of the left outer sealing plate 7 is provided with a conversion circuit board 11;
the inside of the conversion circuit board 11 is provided with a left radiator 12, and the inside of the left radiator 12 is provided with a heat radiation module 13; the front end position inside the right outer sealing plate 5 is provided with a right fan 16, the rear end position inside the right outer sealing plate 5 is provided with a right radiator 14, and the fan frame 6 is provided with a back fan 15.
Further, the chassis structure component is used for realizing positioning, mounting and assembling of the circuit board, and the heat dissipation system component is used for realizing thermal management of equipment.
Furthermore, the chassis adopts a modularized design idea, and the heat dissipation system component adopts modularized design and installation, so that the heat dissipation requirements of different functional modules are met.
Further, the number of heat dissipation system components in the chassis structure component 3 is configured according to the number of functional modules.
Further, the left radiator 12, the heat dissipation module 13 and the right radiator 14 of the heat dissipation system component are made of aluminum alloy, copper alloy, silver or other metal alloy materials.
Further, the back fan 15 and the right fan 16 are axial fans or centrifugal fans.
Further, the axial flow fan or the centrifugal fan adopts an air draft or blowing type forced heat dissipation mode.
Further, the left radiator 12, the heat dissipation module 13, the right radiator 14, the back fan 15 and the right fan 16 are arranged in a plurality of groups of transverse arrays.
Further, the heat dissipation system component is fixedly connected with the chassis structure component in a welding, riveting or bolt fixing mode.
Further, the chassis structure component adopts a closed, semi-closed and open chassis structure.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (10)
1. The electronic equipment cabinet with the modularized heat dissipation design is characterized by comprising a cabinet structure component and a heat dissipation system component;
the chassis structure assembly comprises an external plug-in unit (1), a front panel (2), a chassis framework (3), a right side radiating plate (4), a right side outer sealing plate (5), a fan frame (6), a left side outer sealing plate (7), a front panel circuit board (8), a control panel circuit board (9), a processing board circuit board (10) and a conversion circuit board (11);
the heat dissipation system component comprises a left radiator (12), a heat dissipation module (13), a right radiator (14), a back fan (15) and a right fan (16);
the chassis framework (3) is a main body of the chassis, the front end of the chassis framework (3) is provided with a front panel (2), and the front panel (2) is provided with an external plug-in unit (1); a left outer sealing plate (7) and a right outer sealing plate (5) are respectively arranged at two sides of the chassis framework (3), and a right radiating plate (4) is arranged inside the right outer sealing plate (5); the rear end of the chassis framework (3) is provided with a fan frame (6); a front panel circuit board (8) is arranged on the inner side of a front panel (2) in the case, a control board circuit board (9) is arranged in the center position, a treatment board circuit board (10) is arranged on the inner side of a right outer sealing plate (5), and a conversion circuit board (11) is arranged on the inner side of a left outer sealing plate (7);
a left radiator (12) is arranged on the inner side of the conversion circuit board (11), and a heat radiation module (13) is arranged on the inner side of the left radiator (12); a right fan (16) is arranged at the front end position inside the right outer sealing plate (5), a right radiator (14) is arranged at the rear end position inside the right outer sealing plate (5), and a back fan (15) is arranged on the fan frame (6).
2. The modular heat sink designed electronics chassis of claim 1, wherein the chassis structural assembly is configured to enable a positional mounting assembly of a circuit board and the heat dissipation system assembly is configured to enable thermal management of the device.
3. The modular heat-dissipating design electronics chassis of claim 1, wherein the heat-dissipating system assembly is modular in design and installation to meet heat dissipation requirements of different functional modules.
4. The modular heat sink designed electronics chassis of claim 1, wherein the number of heat sink system components within the chassis structural assembly (3) is configured according to the number of functional modules.
5. The modular heat-dissipating electronics chassis of claim 1, wherein the left side heat sink (12), heat-dissipating module (13), right side heat sink (14) of the heat-dissipating system assembly is aluminum alloy, or copper alloy, silver.
6. The electronic equipment cabinet of modular heat dissipation design according to claim 1, characterized in that the back fan (15) and the right side fan (16) employ an axial fan or a centrifugal fan.
7. The modular heat dissipation electronics chassis of claim 6, wherein the axial flow fan and the centrifugal fan are configured to dissipate heat in a forced air or air-blown manner.
8. The modular heat-dissipating electronics chassis of claim 1, wherein the left side heat sink (12), heat-dissipating module (13), right side heat sink (14), back fan (15), and right side fan (16) are arranged in a transverse array multi-bank arrangement.
9. The modular heat sink designed electronics chassis of claim 1, wherein the heat dissipation system assembly is fixedly connected to the chassis structural assembly by welding, riveting or bolting.
10. The modular heat sink designed electronics chassis of claim 1, wherein the chassis structural assembly employs a closed, semi-closed, or open chassis structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310248735.5A CN116367498A (en) | 2023-03-15 | 2023-03-15 | Electronic equipment case with modularized heat dissipation design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310248735.5A CN116367498A (en) | 2023-03-15 | 2023-03-15 | Electronic equipment case with modularized heat dissipation design |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116367498A true CN116367498A (en) | 2023-06-30 |
Family
ID=86913240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310248735.5A Pending CN116367498A (en) | 2023-03-15 | 2023-03-15 | Electronic equipment case with modularized heat dissipation design |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116367498A (en) |
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2023
- 2023-03-15 CN CN202310248735.5A patent/CN116367498A/en active Pending
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