CN116366986A - Method for determining received light intensity of photosensitive chip and related equipment - Google Patents
Method for determining received light intensity of photosensitive chip and related equipment Download PDFInfo
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Abstract
The embodiment of the disclosure provides a method, a device, computer equipment, a readable storage medium and a program for determining the received light intensity of a photosensitive chip, and relates to the technical field of information security. The method comprises the following steps: acquiring first light power of light reaching a first coordinate point on a photosensitive chip; acquiring exposure time; acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time; acquiring a first photon number collected by the photosensitive chip at the first coordinate point according to the first energy and the single photon energy; acquiring a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency; and acquiring the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full trap capacity of the photosensitive chip. The method provided by the embodiment of the disclosure can realize the determination of the received light intensity of the photosensitive chip.
Description
Technical Field
The present disclosure relates to the field of depth cameras, and in particular, to a method and apparatus for determining received light intensity of a photosensitive chip, a computer device, a readable storage medium, and a program.
Background
Along with the improvement of the living standard of people, a 3D perception system based on structured light gradually enters the life of people and is widely applied to the fields of SLAM (Simultaneous Localization and Mapping, instant positioning and map construction), obstacle avoidance, face recognition, three-dimensional modeling, gesture recognition and the like. In recent years, with the application of depth cameras in various fields, the measurement accuracy of depth cameras has also been attracting more and more attention.
Disclosure of Invention
The embodiment of the disclosure provides a method, a device, computer equipment, a readable storage medium and a program for determining the received light intensity of a photosensitive chip, and relates to the technical field of depth cameras.
The embodiment of the disclosure provides a method for determining the received light intensity of a photosensitive chip, which comprises the following steps: acquiring first light power of light reaching a first coordinate point on a photosensitive chip; acquiring exposure time; acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time; acquiring a first photon number collected by the photosensitive chip at the first coordinate point according to the first energy and the single photon energy; acquiring a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency; and acquiring the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full trap capacity of the photosensitive chip.
In one embodiment, obtaining a first optical power of light reaching a first coordinate point on a photosensitive chip includes: acquiring a first light transmission power; acquiring a first refraction angle of the first coordinate point; the first light power is determined from the first light transmission power and the first refraction angle.
In one embodiment, obtaining the first refraction angle of the first coordinate point includes: acquiring the center coordinates of the photosensitive chip and the coordinates of the first coordinate point; acquiring a first effective focal length of a lens of a camera where the photosensitive chip is located; and determining a first refraction angle of the first coordinate point according to the central coordinate of the photosensitive chip, the coordinate of the first coordinate point and the first effective focal length.
In one embodiment, obtaining the first light transmission power includes: acquiring first reflected light power; acquiring first light transmittance of a lens of a camera where the photosensitive chip is located; and determining the first light transmission power according to the first reflected light power and the first light transmittance.
In one embodiment, obtaining the first reflected optical power includes: acquiring second reflected light power of the first reflection point; acquiring a clear aperture of a lens of a camera where the photosensitive chip is located; acquiring a first distance from the first reflection point to a lens of a camera where the photosensitive chip is located; and acquiring the first reflected light power according to the second reflected light power, the clear aperture and the first distance.
In one embodiment, obtaining the second reflected optical power of the first reflection point comprises: obtaining the output power of a light source; acquiring a first reflectivity of the first reflection point; and acquiring the second reflected light power according to the output power of the light source and the first reflectivity.
The embodiment of the disclosure provides a determination device for light intensity received by a photosensitive chip, which comprises: the first acquisition unit is used for acquiring first light power of light reaching a first coordinate point on the photosensitive chip; a second acquisition unit configured to acquire an exposure time; a third acquisition unit for acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time; a fourth obtaining unit, configured to obtain, according to the first energy and the single photon energy, a first photon number collected by the photosensitive chip at the first coordinate point; a fifth obtaining unit, configured to obtain a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency; and a sixth acquisition unit, configured to acquire the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full-trap capacity of the photosensitive chip.
The embodiment of the disclosure provides a computer device, which comprises a processor, a memory and an input-output interface; the processor is respectively connected with the memory and the input/output interface, wherein the input/output interface is used for receiving data and outputting data, the memory is used for storing a computer program, and the processor is used for calling the computer program so that the computer device executes the method according to any one of the embodiments.
Embodiments of the present disclosure provide a computer readable storage medium storing a computer program adapted to be loaded and executed by a processor to cause a computer device having the processor to perform the method of any one of the above embodiments.
The disclosed embodiments provide a computer program product comprising a computer program which, when executed by a processor, implements the method according to any of the above embodiments.
According to the method for determining the received light intensity of the photosensitive chip, the first light power of the light reaching the first coordinate point on the photosensitive chip is obtained; acquiring exposure time; acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time; acquiring a first photon number collected by the photosensitive chip at the first coordinate point according to the first energy and the single photon energy; acquiring a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency; and acquiring the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full trap capacity of the photosensitive chip, so that the calculation of the light intensity received by the photosensitive chip can be realized and the calculation is used for subsequent product design.
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In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 illustrates a schematic diagram of an exemplary system architecture to which a method for determining received light intensity of a photosensitive chip of an embodiment of the present disclosure may be applied;
FIG. 2 is a flowchart of a method for determining received light intensity of a photosensitive chip according to an embodiment of the disclosure;
FIG. 3 is a flowchart of a method for obtaining a first optical power of a light beam reaching a first coordinate point on a photosensitive chip according to an embodiment of the disclosure;
FIG. 4 is a flowchart of a method for obtaining a first refraction angle of the first coordinate point according to an embodiment of the present disclosure;
fig. 5 is a flowchart of a method for obtaining a first light transmission power according to an embodiment of the disclosure;
FIG. 6 is a flow chart of a method for obtaining a first reflected light power provided by an embodiment of the present disclosure;
FIG. 7 is a flow chart of a method for obtaining a second reflected light power of a first reflection point according to an embodiment of the present disclosure;
FIG. 8 is a schematic view of an optical path of light received by a photosensitive chip according to an embodiment of the disclosure;
fig. 9 is a schematic structural diagram of a device for determining received light intensity of a photosensitive chip according to an embodiment of the disclosure;
fig. 10 is a schematic structural diagram of a computer device for implementing a method for determining received light intensity of a photosensitive chip according to an embodiment of the present disclosure.
Detailed Description
The following description of the technical solutions in the embodiments of the present disclosure will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are only some embodiments of the present disclosure, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without inventive effort, based on the embodiments in this disclosure are intended to be within the scope of this disclosure.
In the embodiment of the disclosure, the first optical power of the light reaching the first coordinate point on the photosensitive chip can be obtained; acquiring exposure time; acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time; acquiring a first photon number collected by the photosensitive chip at the first coordinate point according to the first energy and the single photon energy; acquiring a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency; and acquiring the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full trap capacity of the photosensitive chip, so that the calculation of the light intensity received by the photosensitive chip can be realized and the calculation is used for subsequent product design.
The following first describes some terms of the present disclosure:
a depth camera (3D camera) is a camera that can detect distance information of a photographing space, which is the greatest difference from a general camera. The pictures taken by a common color camera can see all objects within the camera's view angle and record, but the data recorded does not contain the distance of these objects from the camera. Only by the semantic analysis of the image can it be determined which objects are far and which are near, there is no exact data. The 3D camera can solve the problem, and the distance between each point in the image and the camera can be accurately known through the data acquired by the 3D camera, so that the three-dimensional space coordinate of each point in the image can be acquired by adding the two-dimensional coordinate of the point in the 2D image. The real scene can be restored through the three-dimensional coordinates, and the application of scene modeling and the like is realized.
Structured light is a set of system structures consisting of projectors and cameras. The projector projects specific light information to the surface of the object and the background, and the specific light information is collected by the camera. And calculating information such as the position, the depth and the like of the object according to the change of the optical signal caused by the object, and further restoring the whole three-dimensional space.
The scheme provided by the embodiment of the disclosure relates to the technologies of depth cameras, structured light and the like.
Fig. 1 shows a schematic diagram of an exemplary system architecture 100 to which a method for determining received light intensity of a photosensitive chip according to an embodiment of the present disclosure may be applied.
As shown in fig. 1, the system architecture 100 may include one or more of terminals 101, 102, 103, a network 104, and a server 105. The network 104 is a medium used to provide communication links between the terminals 101, 102, 103 and the server 105. The network 104 may include various connection types, such as wired, wireless communication links, or fiber optic cables, among others.
It should be understood that the number of terminals, networks and servers in fig. 1 is merely illustrative. There may be any number of terminals, networks, and servers, as desired for implementation. For example, the server 105 may be a server cluster formed by a plurality of servers.
The server 105 may be a server providing various services. For example, after the terminal 103 (or the terminal 101 or 102) sends a request for determining the light intensity received by the photosensitive chip to the server 105, the server 105 may obtain a first light power of the light reaching a first coordinate point on the photosensitive chip; acquiring exposure time; acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time; acquiring a first photon number collected by the photosensitive chip at the first coordinate point according to the first energy and the single photon energy; acquiring a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency; and acquiring the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full trap capacity of the photosensitive chip, so that the calculation of the light intensity received by the photosensitive chip can be realized and the calculation is used for subsequent product design.
The terminal may be a mobile phone (such as terminal 101) or a tablet computer (such as terminal 102), or may be a desktop computer (such as terminal 101), which is not limited herein. The terminal can display an application program, and the application program can be an application program for determining the light intensity received by the photosensitive chip. The terminal in fig. 1 is only an exemplary part of the devices, and the terminal in the present disclosure is not limited to only the devices illustrated in fig. 1.
In the related art, a method for determining the received light intensity of the photosensitive chip has not been proposed yet. The intensity of the projection light source is closely related to the depth performance, and particularly when a remote object is detected, the energy of the projection light source directly determines the depth quality. The intensity of the projection light source received by the camera directly influences the measurement precision of the depth camera, but how to simulate the light intensity of the laser received by the receiving camera in the initial stage of product design is a key for improving the quality of the depth camera.
Fig. 2 is a flowchart of a method for determining received light intensity of a photosensitive chip according to an embodiment of the disclosure. The method provided by the embodiment of the present disclosure may be performed by the terminal or the server in the embodiment of fig. 1, or performed interactively by the terminal and the server. The present disclosure is not limited in this regard and the methods of the present disclosure may be performed by any processor with computing capabilities.
As shown in fig. 2, the method provided by the embodiment of the present disclosure may include the following steps.
In step S210, a first optical power of the light reaching a first coordinate point on the photosensitive chip is obtained.
In this step, the terminal or server obtains a first optical power at which the light reaches a first coordinate point on the photosensitive chip. In this step, the first coordinate point is a converging point of light refracted by the lens on the photosensitive chip, for example, (x, y); the first optical power may be, for example, the power of the light refracted by the lens, and may be represented as P β 。
In step S220, an exposure time is acquired.
In this step, the terminal or the server acquires the exposure time. The exposure time is, for example, the exposure time of the camera in which the photosensitive chip is located, and may be denoted by t, for example.
In step S230, a first energy accumulated by the photosensitive chip during the exposure time is acquired according to the first light power and the exposure time.
In this step, the terminal or the server acquires the first energy accumulated by the photosensitive chip during the exposure time according to the first light power and the exposure time. The first energy may be expressed, for example, as E, and may be obtained, for example, by the following formula (1):
E＝P β *t (1)
Wherein P is β Is the first optical power; t is the exposure time.
In step S240, a first photon number collected by the photosensitive chip at the first coordinate point is obtained according to the first energy and the single photon energy.
In this step, a terminal or a server acquires a first photon number collected by the photosensitive chip at the first coordinate point according to the first energy and the single photon energy. The energy of a single photon can be e.g. E photon The energy of a single photon can be represented, for example, by equation (2):
where λ is the wavelength of the light, h is the planck coefficient h= 6.62607015 ×10 -34 J.s; c is the speed of light c=3×10 8 m/s。
The first photon number may be, for example, N photon Expressed, the first photon number can be obtained from equation (3):
wherein E is a first energy; e (E) photon Is the energy of a single photon; lambda is the wavelength of the light, h is the planck coefficient h= 6.62607015 ×10 -34 J.s; c is the speed of light c=3×10 8 m/s。
In step S250, a first electron number of the photosensitive chip at the first coordinate point is obtained according to the first photon number and the quantum efficiency.
In this step, the terminal or the server obtains a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency. The first electron number may be represented as N, for example e . The first electron number canIs represented by the following formula (4):
N e ＝N photon *QE (4)
wherein N is photon Representing a first photon number; QE represents the conversion coefficient of photons into electrons, called quantum efficiency (quantum efficiency), abbreviated QE.
In step S260, the light intensity of the photosensitive chip at the first coordinate point is obtained according to the first electron number and the full-well capacity of the photosensitive chip.
In this step, the terminal or the server obtains the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full trap capacity of the photosensitive chip. The light intensity of the photosensitive chip at the first coordinate point may be represented as G, for example, and may be obtained according to the following formula (5):
wherein N is e Is a first electron number; FW is expressed as the full well capacity of the photosensitive chip.
The method for determining the received light intensity of the photosensitive chip of fig. 2 includes obtaining a first light power of light reaching a first coordinate point on the photosensitive chip; acquiring exposure time; acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time; acquiring a first photon number collected by the photosensitive chip at the first coordinate point according to the first energy and the single photon energy; acquiring a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency; and acquiring the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full trap capacity of the photosensitive chip, so that the calculation of the light intensity received by the photosensitive chip can be realized and the calculation is used for subsequent product design.
Fig. 3 is a flowchart of a method for obtaining a first optical power of a light reaching a first coordinate point on a photosensitive chip according to an embodiment of the disclosure. The method provided by the embodiment of the present disclosure may be performed by the terminal or the server in the embodiment of fig. 1, or performed interactively by the terminal and the server.
As shown in fig. 3, the method provided by the embodiment of the present disclosure may include the following steps.
In step S310, a first light transmission power is acquired.
In this step, the terminal or the server acquires the first light transmission power. The first light transmission power is, for example, the light transmission power after passing through the lens of the camera where the photosensitive chip is located, P afte_lens And (3) representing.
In step S320, a first refraction angle of the first coordinate point is acquired.
In this step, the terminal or the server acquires the first refraction angle of the first coordinate point. The first refraction angle may be an included angle between an optical path and an axis of the lens when the light reaches the first coordinate point after being refracted by the lens of the camera where the photosensitive chip is located. The first angle of refraction may be represented by β, for example.
In step S330, the first light power is determined according to the first light transmission power and the first refraction angle.
In this step, the terminal or the server determines the first optical power according to the first light transmission power and the first refraction angle. The first optical power may be obtained, for example, from the following equation (6):
P β ＝P after_lens *cos 4 β (6)
Wherein β is the first angle of refraction; p (P) afte_lens Is the first light transmission power.
Fig. 4 is a flowchart of a method for obtaining a first refraction angle of the first coordinate point according to an embodiment of the disclosure. The method provided by the embodiment of the present disclosure may be performed by the terminal or the server in the embodiment of fig. 1, or performed interactively by the terminal and the server.
As shown in fig. 4, the method provided by the embodiment of the present disclosure may include the following steps.
In step S410, the center coordinates of the photosensitive chip and the coordinates of the first coordinate point are acquired.
In this step, a terminal or a server acquires the center coordinates of the photosensitive chip and the coordinates of the first coordinate point. The center coordinates of the photosensitive chip are, for example, the geometric center of the photosensitive chip, and may be expressed by (xo, yo). The first coordinate point coordinates may be represented by (x, y), for example.
In step S420, a first effective focal length of a lens of the camera where the photosensitive chip is located is obtained.
In the step, a terminal or a server obtains a first effective focal length of a lens of a camera where the photosensitive chip is located. The first effective focal length of the lens of the camera where the photosensitive chip is located can be denoted by f, for example.
In step S430, a first refraction angle of the first coordinate point is determined according to the center coordinate of the photosensitive chip, the coordinate of the first coordinate point, and the first effective focal length.
In this step, the terminal or the server determines a first refraction angle of the first coordinate point according to the center coordinates of the photosensitive chip, the coordinates of the first coordinate point, and the first effective focal length. The first refractive angle β can be obtained, for example, according to the following formula (7):
wherein, (xo, yo) is the center coordinates of the photosensitive chip; (x, y) is the coordinates of the first coordinate point; f represents a first effective focal length example.
Fig. 5 is a flowchart of a method for obtaining a first light transmission power according to an embodiment of the disclosure. The method provided by the embodiment of the present disclosure may be performed by the terminal or the server in the embodiment of fig. 1, or performed interactively by the terminal and the server.
As shown in fig. 5, the method provided by the embodiment of the present disclosure may include the following steps.
In step S510, a first reflected light power is acquired.
In this step, the terminal or the server acquires a first reflected optical power. The first reflected light power may be, for example, P lens And (3) representing.
In step S520, a first light transmittance of a lens of the camera where the photosensitive chip is located is obtained.
In the step, the terminal or the server obtains the first light transmittance of the lens of the camera where the photosensitive chip is located. The first light transmittance may be expressed as ρ.
In step S530, the first light transmission power is determined according to the first reflected light power and the first light transmittance.
In this step, the terminal or the server determines the first light transmission power from the first reflected light power and the first light transmittance. First light transmission power P afte_lens For example, can be obtained from the following formula (8):
P afte_lens ＝P lens *ρ (8)
wherein P is lens Representing a first reflected optical power; ρ represents the first light transmittance.
Fig. 6 is a flowchart of a method for obtaining a first reflected light power according to an embodiment of the present disclosure. The method provided by the embodiment of the present disclosure may be performed by the terminal or the server in the embodiment of fig. 1, or performed interactively by the terminal and the server.
As shown in fig. 6, the method provided by the embodiment of the present disclosure may include the following steps.
In step S610, a second reflected light power of the first reflection point is acquired.
In this step, the terminal or the server acquires the second reflected light power of the first reflection point. The first reflection point being denoted by a, for example, and the second reflected light power being denoted by P, for example A And (3) representing.
In step S620, a clear aperture of a lens of the camera where the photosensitive chip is located is obtained.
In the step, the terminal or the server acquires the clear aperture of the lens of the camera where the photosensitive chip is located. The clear aperture of the lens of the camera where the photosensitive chip is located can be represented by D, for example.
In step S630, a first distance from the first reflection point to a lens of the camera where the photosensitive chip is located is obtained.
In this step, the terminal or the server obtains a first distance from the first reflection point to the lens of the camera where the photosensitive chip is located. The first distance, for example, the distance from the first reflection point a to the center of the lens arc surface, is denoted by r.
In step S640, the first reflected light power is obtained according to the second reflected light power, the clear aperture, and the first distance.
In this step, the terminal or the server acquires the first reflected light power based on the second reflected light power, the clear aperture, and the first distance. First reflected optical power P lens Can be obtained from the following formula (9):
wherein P is A Representing a second reflected optical power; θ represents the light angle from the first reflection point a to the lens of the camera where the photosensitive chip is located; phi represents a sphere integral variable; d represents the clear aperture of the lens of the camera where the photosensitive chip is located; r represents a first distance.
Fig. 7 is a flowchart of a method for obtaining a second reflected light power of a first reflection point according to an embodiment of the present disclosure. The method provided by the embodiment of the present disclosure may be performed by the terminal or the server in the embodiment of fig. 1, or performed interactively by the terminal and the server.
As shown in fig. 7, the method provided by the embodiment of the present disclosure may include the following steps.
In step S710, the output power of the light source is acquired.
In this step, the terminal or the server acquires the output power of the light source. The light source may be, for example, a laser light source; the output power of the light source can be P 0 And (3) representing.
In step S720, a first reflectivity of the first reflection point is obtained.
In this step, the terminal or the server acquires a first reflectivity of the first reflection point. The first reflectivity of the first reflection point a may be denoted by R, for example.
In step S730, the second reflected light power is obtained according to the output power of the light source and the first reflectivity.
In this step, the terminal or the server acquires the second reflected light power based on the output power of the light source and the first reflectance. Second reflected optical power P A For example, can be obtained from the following formula (10):
P A ＝P 0 *R (10)
wherein P is 0 Representing the output power of the light source; r represents the first reflectivity of the first reflection point a.
The method for determining the received light intensity of the photosensitive chip of the present application will be described below with reference to specific examples.
Fig. 8 is a schematic diagram of an optical path of light intensity received by a photosensitive chip according to an embodiment of the disclosure. As shown in figure 8 of the drawings,
The light emitted by the laser light source 801, for example, structured light, reaches the reflection plane 802 after a certain distance d, assuming that the light source output power of the laser light source 801 is P 0 The first reflectivity of the reflection plane 802 is R, the second reflected light power at the first reflection point A is PA, and the second reflected light power P A For example, can be obtained from the following formula (10):
P A ＝P 0 *R (10)
the reflected light at the first reflection point a can be regarded as a point light source illuminant, and it is assumed that the incident energy is uniformly reflected in all directions, that is, the incident energy is diffused in the hemispherical space isotropically around the incident point.
Obviously, the spatial distribution of the luminous intensity of the diffuse reflection phenomenon accords with the luminous body (whether self-luminous or reflected light) of the cosine law, and the radiation intensity of the diffuse reflection phenomenon at different angles can be changed according to the cosine formula. Then the power of the reflected light (first reflected light power) P for lens 804 at distance r from the first reflection point a lens Can be obtained from the following formula (9):
in the above formula (9), θ represents the light angle from the first reflection point a to the lens 804 of the camera where the photo-sensing chip 803 is located; d is the clear aperture of the lens 804, usually within 5mm, and r is the first distance between the first reflection point A and the center of the cambered surface of the lens 804, usually greater than 1m, r > > D, so sin θ is approximated, i.e., sin (θ/2) ≡D/(2 r).
Since the lens 804 is generally assembled from a plurality of glass or plastic lenses, assuming that the first transmittance of the lens 804 is ρ, the light passes through the lens 804 and then has a first light transmission power P afte_lens Expressed as formula (8):
P afte_lens ＝P lens *ρ (8)
after passing through the lens 804, the light is incident on the photo-sensing chip 803, and if the first refraction angle between the light incident on the photo-sensing chip 803 and the axis of the lens 804 is beta, the reflected light at the point A has a first light power P at a first coordinate point (x, y) β Can be obtained from the following formula (6):
P β ＝P after_lens *cos 4 β (6)
the first refractive angle β can be obtained, for example, according to the following formula (7):
where, (xo, yo) is the center coordinate of the photosensitive chip 803; (x, y) is the coordinates of the first coordinate point; f represents the first effective focal length of the lens 804.
Assuming that the exposure time of the camera is t, the pixel at the first coordinate point (x, y) and the first energy E accumulated in the exposure time t can be obtained by, for example, the following equation (1):
E＝P β *t (1)
for light of wavelength λ, the energy of a single photon can be represented, for example, by equation (2):
by combining equations (1) and (2), we can know the first number N of photons collected during time t photon Can be obtained from equation (3):
as is clear from the light characteristics, when the photon number of the formula (3) reaches the photo-sensitive chip 803, it cannot be converted into the electron number entirely, and the conversion coefficient thereof is called quantum efficiency (quantum efficiency), which is simply called QE. Then the first electron number at the first coordinate of the photosensitive chip at this time can be expressed by the following formula (4):
N e ＝N photon *QE (4)
The light intensity of the first coordinate point (x, y) may be expressed as G, for example, and may be obtained according to the following equation (5):
formula (5) FW is expressed as the full well capacity of the photosensitive chip 803, and represents the capacity of the chip to accommodate electrons, and the light source output power of the laser light source 801 is P as obtained by combining the above formulas (1-10) 0 After being reflected by the first reflection point a on the reflection plane 802 having the distance d, the luminance of the first coordinate point (x, y) on the photo-sensing chip 803 is expressed as formula (11):
in equation (11), the first effective focal length f, the clear aperture D, and the first light transmittance ρ of the lens 804 are known parameters after the lens 804 is shaped, the quantum efficiency QE, and the full-well capacity FW are also known parameters after the chip 803 is shaped, and the reflectance is substantially between 50% and 80% for the plane 802 of diffuse reflection. Therefore, in the case where the lens 804 and the photosensitive chip 803 are determined, the relationship between the brightness value G of the chip imaging and the exposure time t, the laser power P0, and the transmission distance r can be obtained.
In addition, the depth calculation formula (12) of the indirect light flight time (ToF) of the 4-phase method is:
wherein d is the maximum depth of the object to be measured, fm is the modulation frequency of the optical signal, c is the speed of light, A1, A2, A3, A4 are the light intensities acquired when the phase delays are 0 °,90 °,180 ° and 270 °. Delta represents the phase difference, assuming the initial phase is C0, the phase measured by the intensities of A1, A2, A3, A4 is C1, and Delta is C1-C0.
From equation (12), the amplitude value G required to meet the minimum threshold of accuracy can be obtained, then it is clear that at a particular first distance r and exposure time t, the output power P required by the laser light 0 Is the minimum of (2); or at the laser output power P 0 In the case of determination, the accuracy cannot meet the requirements except for the distance. The formula (11) can guide the model selection and system verification of the product devices at the beginning of the design of the product, improve the design efficiency of the product, and verify whether the design requirement of the product is met or not with the fastest design efficiency.
Fig. 9 is a schematic structural diagram of a device for determining received light intensity of a photosensitive chip according to an embodiment of the disclosure.
As shown in fig. 9, a determination device 500 for receiving light intensity by a photosensitive chip according to an embodiment of the disclosure may include:
a first obtaining unit 910, configured to obtain a first optical power of the light reaching a first coordinate point on the photosensitive chip;
a second acquisition unit 920 for acquiring an exposure time;
a third acquiring unit 930 configured to acquire a first energy accumulated by the photosensitive chip during the exposure time according to the first light power and the exposure time;
a fourth obtaining unit 940, configured to obtain, according to the first energy and the single photon energy, a first photon number collected by the photosensitive chip at the first coordinate point;
A fifth obtaining unit 950, configured to obtain a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency;
a sixth obtaining unit 960 is configured to obtain the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full-trap capacity of the photosensitive chip.
The determining device of the light intensity received by the light sensing chip of fig. 9 is used for obtaining the first light power of the light reaching the first coordinate point on the light sensing chip through the first obtaining unit; a second acquisition unit configured to acquire an exposure time; a third acquisition unit for acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time; a fourth obtaining unit, configured to obtain, according to the first energy and the single photon energy, a first photon number collected by the photosensitive chip at the first coordinate point; a fifth obtaining unit, configured to obtain a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency; and the sixth acquisition unit is used for acquiring the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full trap capacity of the photosensitive chip, so that the calculation of the received light intensity of the photosensitive chip can be realized and the calculation is used for subsequent product design.
In one embodiment, the first obtaining unit 910 is further configured to obtain a first light transmission power; acquiring a first refraction angle of the first coordinate point; the first light power is determined from the first light transmission power and the first refraction angle.
In one embodiment, the first obtaining unit 910 is further configured to obtain a center coordinate of the photosensitive chip and a coordinate of the first coordinate point; acquiring a first effective focal length of a lens of a camera where the photosensitive chip is located; and determining a first refraction angle of the first coordinate point according to the central coordinate of the photosensitive chip, the coordinate of the first coordinate point and the first effective focal length.
In one embodiment, the first obtaining unit 910 is further configured to obtain a first reflected light power; acquiring first light transmittance of a lens of a camera where the photosensitive chip is located; and determining the first light transmission power according to the first reflected light power and the first light transmittance.
In one embodiment, the first obtaining unit 910 is further configured to obtain a second reflected light power of the first reflection point; acquiring a clear aperture of a lens of a camera where the photosensitive chip is located; acquiring a first distance from the first reflection point to a lens of a camera where the photosensitive chip is located; and acquiring the first reflected light power according to the second reflected light power, the clear aperture and the first distance.
In one embodiment, the first obtaining unit 910 is further configured to obtain an output power of the light source; acquiring a first reflectivity of the first reflection point; and acquiring the second reflected light power according to the output power of the light source and the first reflectivity.
Referring to fig. 10, fig. 10 is a schematic structural diagram of a computer device implementing a method for determining received light intensity of a photosensitive chip according to an embodiment of the present disclosure.
As shown in fig. 10, a computer device in an embodiment of the present disclosure may include: one or more processors 1001, memory 1002, and an input-output interface 1003. The processor 1001, memory 1002, and input/output interface 1003 are connected by a bus 1004. The memory 1002 is used for storing a computer program including program instructions, and the input-output interface 1003 is used for receiving data and outputting data, such as for data interaction between a host and a computer device, or for data interaction between respective virtual machines in the host; the processor 1001 is configured to execute program instructions stored in the memory 1002.
The processor 1001 may perform the following operations, among others:
acquiring first light power of light reaching a first coordinate point on a photosensitive chip; acquiring exposure time; acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time; acquiring a first photon number collected by the photosensitive chip at the first coordinate point according to the first energy and the single photon energy; acquiring a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency; and acquiring the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full trap capacity of the photosensitive chip.
In some possible implementations, the processor 1001 may be a central processing unit (central processing unit, CPU), which may also be other general purpose processors, digital signal processors (digital signal processor, DSP), application specific integrated circuits (application specific integrated circuit, ASIC), off-the-shelf programmable gate arrays (field-programmable gate array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 1002 may include read only memory and random access memory, and provides instructions and data to the processor 1001 and input output interface 1003. A portion of memory 1002 may also include non-volatile random access memory. For example, the memory 1002 may also store information of a device type.
In a specific implementation, the computer device may execute, through each functional module built in the computer device, an implementation manner provided by each step in the foregoing embodiment, and specifically may refer to an implementation manner provided by each step in the foregoing embodiment, which is not described herein again.
Embodiments of the present disclosure provide a computer device comprising: the processor, the input/output interface and the memory acquire the computer program in the memory through the processor, execute the steps of the method shown in the above embodiment, and perform the transmission operation.
The embodiments of the present disclosure further provide a computer readable storage medium, where the computer readable storage medium stores a computer program, where the computer program is adapted to be loaded by the processor and execute the method provided by each step in the foregoing embodiments, and specifically refer to an implementation manner provided by each step in the foregoing embodiments, which is not described herein in detail. In addition, the description of the beneficial effects of the same method is omitted. For technical details not disclosed in the embodiments of the computer-readable storage medium according to the present disclosure, please refer to the description of the embodiments of the method according to the present disclosure. As an example, a computer program may be deployed to be executed on one computer device or on multiple computer devices at one site or distributed across multiple sites and interconnected by a communication network.
The computer readable storage medium may be an apparatus provided in any of the foregoing embodiments or an internal storage unit of the computer device, for example, a hard disk or a memory of the computer device. The computer readable storage medium may also be an external storage device of the computer device, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) card, a flash card (flash card) or the like, which are provided on the computer device. Further, the computer-readable storage medium may also include both internal storage units and external storage devices of the computer device. The computer-readable storage medium is used to store the computer program and other programs and data required by the computer device. The computer-readable storage medium may also be used to temporarily store data that has been output or is to be output.
The disclosed embodiments also provide a computer program product or computer program comprising computer instructions stored in a computer readable storage medium. The processor of the computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device performs the methods provided in the various alternatives in the above embodiments.
The terms first, second and the like in the description and in the claims and drawings of the embodiments of the disclosure are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the term "include" and any variations thereof is intended to cover a non-exclusive inclusion. For example, a process, method, apparatus, article, or device that comprises a list of steps or elements is not limited to the list of steps or modules but may, in the alternative, include other steps or modules not listed or inherent to such process, method, apparatus, article, or device.
Those of ordinary skill in the art will appreciate that the elements and algorithm steps described in connection with the embodiments disclosed herein may be embodied in electronic hardware, in computer software, or in a combination of the two, and that the elements and steps of the examples have been generally described in terms of function in this description to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
The methods and related devices provided by the embodiments of the present disclosure are described with reference to the method flowcharts and/or structure diagrams provided by the embodiments of the present disclosure, and each flowchart and/or block of the method flowcharts and/or structure diagrams may be implemented by computer program instructions, and combinations of flowcharts and/or block diagrams. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable transmission device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable transmission device, create means for implementing the functions specified in the flowchart flow or flows and/or block or blocks. These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable transmission apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or structural diagram block or blocks. These computer program instructions may also be loaded onto a computer or other programmable transmission device to cause a series of operational steps to be performed on the computer or other programmable device to produce a computer implemented process such that the instructions which execute on the computer or other programmable device provide steps for implementing the functions specified in the flowchart flow or flows and/or structures.
The foregoing disclosure is merely illustrative of the presently preferred embodiments of the present disclosure, and it is not intended to limit the scope of the claims hereof, as defined by the appended claims.
Claims (10)
1. The method for determining the received light intensity of the photosensitive chip is characterized by comprising the following steps of:
acquiring first light power of light reaching a first coordinate point on a photosensitive chip;
acquiring exposure time;
acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time;
acquiring a first photon number collected by the photosensitive chip at the first coordinate point according to the first energy and the single photon energy;
acquiring a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency;
and acquiring the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full trap capacity of the photosensitive chip.
2. The method of claim 1, wherein obtaining a first optical power of the light reaching a first coordinate point on the photo-sensing chip comprises:
acquiring a first light transmission power;
acquiring a first refraction angle of the first coordinate point;
The first light power is determined from the first light transmission power and the first refraction angle.
3. The method of claim 2, wherein obtaining the first angle of refraction of the first coordinate point comprises:
acquiring the center coordinates of the photosensitive chip and the coordinates of the first coordinate point;
acquiring a first effective focal length of a lens of a camera where the photosensitive chip is located;
and determining a first refraction angle of the first coordinate point according to the central coordinate of the photosensitive chip, the coordinate of the first coordinate point and the first effective focal length.
4. The method of claim 2, wherein obtaining the first light transmission power comprises:
acquiring first reflected light power;
acquiring first light transmittance of a lens of a camera where the photosensitive chip is located;
and determining the first light transmission power according to the first reflected light power and the first light transmittance.
5. The method of claim 4, wherein obtaining the first reflected optical power comprises:
acquiring second reflected light power of the first reflection point;
acquiring a clear aperture of a lens of a camera where the photosensitive chip is located;
acquiring a first distance from the first reflection point to a lens of a camera where the photosensitive chip is located;
And acquiring the first reflected light power according to the second reflected light power, the clear aperture and the first distance.
6. The method of claim 5, wherein obtaining the second reflected optical power of the first reflection point comprises:
obtaining the output power of a light source;
acquiring a first reflectivity of the first reflection point;
and acquiring the second reflected light power according to the output power of the light source and the first reflectivity.
7. A device for determining intensity of received light of a photosensitive chip, comprising:
the first acquisition unit is used for acquiring first light power of light reaching a first coordinate point on the photosensitive chip;
a second acquisition unit configured to acquire an exposure time;
a third acquisition unit for acquiring first energy accumulated by the photosensitive chip in the exposure time according to the first light power and the exposure time;
a fourth obtaining unit, configured to obtain, according to the first energy and the single photon energy, a first photon number collected by the photosensitive chip at the first coordinate point;
a fifth obtaining unit, configured to obtain a first electron number of the photosensitive chip at the first coordinate point according to the first photon number and the quantum efficiency;
And a sixth acquisition unit, configured to acquire the light intensity of the photosensitive chip at the first coordinate point according to the first electron number and the full-trap capacity of the photosensitive chip.
8. A computer device, comprising a processor, a memory, and an input-output interface;
the processor is respectively connected with the memory and the input/output interface, wherein the input/output interface is used for receiving data and outputting data, the memory is used for storing a computer program, and the processor is used for calling the computer program to enable the computer device to execute the method of any one of claims 1-6.
9. A computer readable storage medium, characterized in that the computer readable storage medium stores a computer program adapted to be loaded and executed by a processor to cause a computer device having the processor to perform the method of any of claims 1-6.
10. A computer program product comprising a computer program, characterized in that the computer program, when executed by a processor, implements the method of any of claims 1-6.
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