CN116344526A - LED display device with pixel arrangement - Google Patents

LED display device with pixel arrangement Download PDF

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Publication number
CN116344526A
CN116344526A CN202310332961.1A CN202310332961A CN116344526A CN 116344526 A CN116344526 A CN 116344526A CN 202310332961 A CN202310332961 A CN 202310332961A CN 116344526 A CN116344526 A CN 116344526A
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pixel
sub
light source
pixel unit
color light
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Granted
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CN202310332961.1A
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CN116344526B (en
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袁楚卓
陈都
邝燕权
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Shenzhen Meixi Micro Semiconductor Co ltd
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Shenzhen Meixi Micro Semiconductor Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses an LED display device with pixel arrangement, which comprises an LED carrier plate and a plurality of pixel groups arranged on the LED carrier plate, wherein through holes are arranged on the LED carrier plate, at least three through holes Kong Weilong form an island-shaped area, the pixel groups comprise a first pixel unit and a second pixel unit, the first pixel unit and the second pixel unit comprise sub-pixels, the sub-pixels comprise a first sub-pixel, a second sub-pixel and a third sub-pixel, and the sub-pixels are arranged in the island-shaped area of the LED carrier plate. Compared with the prior art, the display effect of the invention is finer and more natural, and especially, the display effect is more stereoscopic and lifelike when displaying holographic 3D images.

Description

LED display device with pixel arrangement
Technical Field
The present invention relates to the field of LED display technologies, and in particular, to an LED display device with pixel arrangement.
Background
Today, LED display technology has been very mature, and LED display technology mostly adopts RGB color mode to perform color matching, that is, various colors are obtained by changing three color light beads of red (R), green (G) and blue (B) and overlapping them with each other.
Conventional LED display technology has failed to meet the increasing demands of people. For example, patent CN114863868A discloses an LED carrier board and a display device thereof, which can achieve a transparent or semitransparent display effect. However, each real pixel in the above patent is an LED luminary, each LED luminary is an integral lamp bead, and the lamp bead contains a R, G, B tri-color lamp bead and an LED driving chip. As can be seen from this, a large amount of LED driving chips and lamp beads are required to achieve high-resolution display, which increases the cost drastically and also increases the heat generation amount of the LED display device.
Disclosure of Invention
Aiming at the defects of the prior art, the invention discloses an LED display device with pixel arrangement, the technical scheme adopts a method of combining real pixels with virtual pixels, and particularly discloses a brand-new arrangement method of R, G, B three-color sub-pixels, which can improve the resolution on one hand and greatly reduce the input quantity of LED driving chips on the other hand.
The LED display device formed by combining the arrangement method with the LED carrier plate with the holes has the characteristics of finer and more natural display images and more stereoscopic and vivid display of holographic 3D images.
The technical scheme of the invention is as follows:
an LED display device with pixel arrangement comprises an LED carrier plate and a plurality of pixel groups arranged on the LED carrier plate.
The LED carrier plate includes a front surface, a back surface, and through holes penetrating the front surface and the back surface of the LED carrier plate and regularly arranged, and at least three through holes Kong Weilong form an island region.
In the technical scheme, the pixel group comprises a first pixel unit and a second pixel unit, and the first pixel unit and the second pixel unit are adjacently arranged on the left side or the right side.
In a more preferable technical scheme, the first pixel unit is a triangle, a sub-pixel is arranged at the vertex of the triangle, the sub-pixel comprises a first sub-pixel, a second sub-pixel and a third sub-pixel, and the arrangement mode of the sub-pixel at the vertex of the triangle is as follows: the first sub-pixel, the second sub-pixel and the third sub-pixel are arranged from the left top point of the bottom side of the triangle in a counter-clockwise direction.
The second pixel unit is an inverted triangle, a sub-pixel is arranged at the vertex of the inverted triangle, and the arrangement mode of the sub-pixel at the vertex of the inverted triangle is as follows: the third sub-pixel, the second sub-pixel and the first sub-pixel are arranged from the top point at the bottom of the inverted triangle in turn in the anticlockwise direction.
In this technical scheme, the sub-pixels are disposed in island-shaped regions on the front surface of the LED carrier.
In the technical scheme, the through holes are arranged at equal intervals.
In a preferred scheme, the triangle of the first pixel unit and the inverted triangle of the second pixel unit are equilateral triangles.
The island-shaped area in the technical scheme is provided with a bonding pad, and the bonding pad is used for welding the sub-pixels.
Further, the bonding pad comprises a first bonding pad and a second bonding pad, wherein the first bonding pad is provided with two electrode pins, and the second bonding pad is provided with five electrode pins.
In the technical scheme, the first pixel unit and the second pixel unit both comprise an LED driving chip.
The LED driving chip can be integrally arranged with one sub-pixel, and the LED driving chip is directly welded on the second bonding pad.
The LED driver chip may also be provided separately, and the LED driver chip may be soldered to the second pad together with an external sub-pixel.
In the technical scheme, the specific setting positions of the LED driving chip are as follows:
when the LED driving chip in the first pixel unit is arranged with the first sub-pixel in the first pixel unit, the LED driving chip in the second pixel unit is also arranged with the first sub-pixel in the second pixel unit.
Or when the LED driving chip in the first pixel unit is arranged with the second sub-pixel in the first pixel unit, the LED driving chip in the second pixel unit is also arranged with the second sub-pixel in the second pixel unit.
Or when the LED driving chip in the first pixel unit is arranged with the third sub-pixel in the first pixel unit, the LED driving chip in the second pixel unit is also arranged with the third sub-pixel in the second pixel unit.
In a preferred technical solution, the two electrode pins on the first pad are:
the VDD pin is used for being electrically connected with the positive electrode end of the sub-pixel;
the first control pin is used for being electrically connected with the negative electrode end of the sub-pixel.
In a preferred technical solution, the five electrode pins on the second bonding pad are:
a VDD pin electrically connected with the positive electrode terminal of the LED driving chip or/and the positive electrode terminal of the connection sub-pixel;
a GND pin electrically connected with the negative electrode end of the LED driving chip or/and the negative electrode end of the sub-pixel;
a DATA pin electrically connected with a DATA signal input DIN end of the LED driving chip;
the second control pin is electrically connected with the first control pin and controls the luminous state of the sub-pixel on the first bonding pad;
and the third control pin is electrically connected with the first control pin and controls the luminous state of the sub-pixel on the first bonding pad.
It should be noted that, in this embodiment, the LED carrier 1 is provided with a wiring structure, which includes a VDD line, a GND line, and a DATA line, wherein:
the VDD line is electrically connected with the VDD pin;
the GND line is electrically connected with the GND pin;
the DATA line is electrically connected to the DATA pin.
In the technical scheme, virtual pixel points can be formed at the adjacent positions of the first pixel unit and the second pixel unit.
In the technical scheme, virtual pixel points can be formed at adjacent positions of the two pixel groups which are adjacent left and right and the pixel groups which are adjacent up and down.
In a more preferable technical scheme, the first sub-pixel, the second sub-pixel and the third sub-pixel have the same size and shape, and have no shielding to the through hole.
In the technical scheme, the first sub-pixel, the second sub-pixel and the third sub-pixel are respectively any one of the following six combinations in sequence:
an R color light source, a G color light source and a B color light source;
or a G color light source, an R color light source and a B color light source;
or a B color light source, a G color light source and an R color light source;
or an R color light source, a B color light source and a G color light source;
or a G-color light source, a B-color light source and an R-color light source;
or a B color light source, an R color light source and a G color light source.
The invention relates to an LED display device with pixel arrangement, which is formed by combining a transparent LED carrier plate with holes with a novel R, G, B three-color sub-pixel arrangement method.
Compared with the prior art, the display effect of the technical scheme is finer and more natural, and particularly, the display effect is more stereoscopic and lifelike when the holographic 3D image is displayed.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a through hole and an island region on an LED carrier in an LED display device with pixel arrangement according to the present invention.
Fig. 2 is a schematic structural diagram of another embodiment of a through hole and island region on an LED carrier in an LED display device with pixel arrangement according to the present invention.
FIG. 3 is a schematic diagram showing an arrangement structure of a pixel group in an LED display device with pixel arrangement according to an embodiment of the present invention.
FIG. 4 is a schematic diagram showing an arrangement structure of a pixel group in an LED display device with pixel arrangement according to another embodiment of the present invention.
Fig. 5 is a schematic structural diagram of an embodiment of a combination of an LED carrier and a pixel group in an LED display device with pixel arrangement according to the present invention.
Fig. 6 is a schematic structural diagram of another embodiment of combining an LED carrier with a pixel group in an LED display device with pixel arrangement according to the present invention.
Fig. 7 is a schematic view showing an embodiment of a pad provided at an island region in an LED display device having a pixel arrangement according to the present invention.
Fig. 8 is a schematic diagram showing the overall structure of the combination of the LED carrier and the pixel group in the LED display device with pixel arrangement according to the present invention.
Fig. 9 is a schematic structural diagram of an embodiment of a subpixel in an LED display device with pixel arrangement according to the present invention, which is specifically configured as an RGB pixel.
Description of the embodiments
The invention is described in further detail below with reference to the accompanying drawings.
For the purpose of better illustrating the embodiments, certain elements of the drawings may be omitted, enlarged or reduced and do not represent the actual product dimensions; some well known structures in the drawings and omission of the description thereof will be understood by those skilled in the art. The same or similar reference numerals correspond to the same or similar components.
The existing LED display technology cannot meet the increasing demands of people, and in particular, the large-screen LED display device or LED display equipment needs to achieve high resolution under the condition of greatly increasing power consumption, so that the resolution is improved and the power consumption is reduced, and the compatibility is difficult to achieve in the field.
Patent CN114863868A discloses an LED carrier and a display device thereof, in which the LED emitters in the present patent are all a real pixel, and each LED emitter comprises R, G, B three-color beads and an LED driving chip. According to the description of the patent, in order to improve the resolution, the number of pixels is increased, each pixel comprises R, G, B three-color lamp beads and one LED driving chip, so that the cost is greatly increased, and the heating value of the LED display device is also huge.
In view of the defects of the prior art, the invention discloses an LED display device with pixel arrangement, which is a brand new LED display device formed by combining a transparent LED carrier plate with holes with a novel R, G, B three-color sub-pixel arrangement method. The technical scheme adopts a technical route of combining the real pixels and the virtual pixels, and can realize the aim of greatly increasing the pixel points. According to the technical scheme, the resolution can be improved, the investment of the LED driving chip and the R, G, B three-color lamp beads is greatly reduced, and a large amount of cost is saved for enterprises.
Compared with the prior art, the technical scheme has the advantages that the display effect is finer and more natural, and particularly, the holographic 3D image is displayed in a more stereoscopic manner.
The specific embodiment of the technical scheme is as follows:
the present embodiment is an LED display device with pixel arrangement, which includes an LED carrier 1 and a plurality of pixel groups 2 disposed on the LED carrier, as shown in fig. 8.
The structure of the LED display device described in this embodiment is that a plurality of pixel groups 2 are regularly arranged on the LED carrier 1, and the adjacent pixel groups 2 can be coupled to form virtual pixel points.
As shown in fig. 1 and 2, the LED carrier 1 in this embodiment includes a front surface and a back surface, and through holes 11 penetrating the front surface and the back surface of the LED carrier 1 and regularly arranged, and at least three through holes 11 are enclosed into an island-shaped region 12.
It should be noted that the through hole 11 not only has a light-transmitting function, but also has ventilation and heat dissipation functions. The invention is based on a technical scheme formed by the transparent or semitransparent LED carrier plate 1, which can display images and also can show transparent visual effects, and the regularly arranged through holes 11 play a role in transparent visual effects. Because the technical scheme adopts a large number of LED lamp beads (the first sub-pixel, the second sub-pixel and the third sub-pixel which will be mentioned later), the heating of the LED lamp beads is a technical difficulty which is difficult to overcome in the whole industry, and the regularly arranged through holes 11 just solve the problems of ventilation and heat dissipation.
The through holes 11 in the present embodiment are preferably circular in shape of uniform size. The through-holes 11 may have other shapes besides a circular shape, such as a square shape, a triangular shape, or a variety of shapes alternately arranged, etc.
The through holes 11 may have uniform specifications, or may be arranged in order of different specifications, such as alternating circular holes with two diameters.
In this embodiment, the pixel group 2 includes a first pixel unit 21 and a second pixel unit 22, where the first pixel unit 21 and the second pixel unit 22 are disposed adjacent to each other on the left or right, as shown in fig. 3.
In this embodiment, the first pixel unit 21 is a triangle, as shown in fig. 3, a sub-pixel 20 is disposed at a vertex of the triangle, the sub-pixel 20 includes a first sub-pixel 201, a second sub-pixel 202 and a third sub-pixel 203, and the arrangement manner of the sub-pixels 20 at the vertex of the triangle is as follows: from the left top point of the triangle base, the first sub-pixel 201, the second sub-pixel 202 and the third sub-pixel 203 are sequentially arranged in the anticlockwise direction.
In this embodiment, the second pixel unit 22 is an inverted triangle, as shown in fig. 3, a sub-pixel 20 is disposed at a vertex of the inverted triangle, and the arrangement manner of the sub-pixel 20 at the vertex of the inverted triangle is as follows: from the top point at the bottom of the inverted triangle and in a counter-clockwise direction, is a third sub-pixel 203, a second sub-pixel 202 and a first sub-pixel 201.
It should be noted that the first sub-pixel 201, the second sub-pixel 202 and the third sub-pixel 203 are monochromatic light sources. Common monochromatic light sources in the LED light sources include a red light source (R color light source), a green light source (G color light source) and a blue light source (B color light source), and various colors can be obtained by changing the three color light sources and overlapping the three color light sources with each other.
In this embodiment, the first sub-pixel 201, the second sub-pixel 202 and the third sub-pixel 203 are also defined from three color light sources of red light source (R color light source), green light source (G color light source) and blue light source (B color light source). Specifically, the first sub-pixel 201, the second sub-pixel 202 and the third sub-pixel 203 are any one of the following six combinations in sequence:
an R color light source, a G color light source and a B color light source;
or a G color light source, an R color light source and a B color light source;
or a B color light source, a G color light source and an R color light source;
or an R color light source, a B color light source and a G color light source;
or a G-color light source, a B-color light source and an R-color light source;
or a B color light source, an R color light source and a G color light source.
Fig. 9 in this embodiment is a schematic diagram of an embodiment of R color light source, G color light source and B color light source in order of the first sub-pixel 201, the second sub-pixel 202 and the third sub-pixel 203.
In this embodiment, the sub-pixels 20 are disposed in the island-shaped regions 12 on the front surface of the LED carrier 1.
It should be noted that the island-like region 12 is a region enclosed by at least three of the through holes 11. It can be said that the region on the LED carrier 1 which is not penetrated except the penetration hole 11. From the overall perspective of the LED carrier 1, the rest of the carrier area, except for all the through holes 11, corresponds to a group of islands, which are formed by connecting n island-like areas 12, as shown in fig. 1 and 2.
The through hole 11 is used for transmitting light, and presents a transparent or semitransparent visual effect. When the LED display device described in this embodiment is not in operation, natural light can pass through the plurality of through holes 11 to form a screen having a certain light transmittance. The amount of transmitted light is related to the aperture size and density of the through-holes 11 under the condition of natural light transmission. The larger the diameter of the through hole 11, the higher the density, and the more the light transmission amount, the closer to the transparent visual effect. The farther the viewing distance, the better the transparent visual effect.
In this embodiment, the through holes 11 are arranged at equal intervals. The rows of through holes 11 and island areas 12 form a complete LED carrier 1.
Specifically, the rows of through holes 11 may be arranged in a staggered manner (as shown in fig. 1) or aligned (as shown in fig. 2). When the rows of through holes 11 are arranged in a staggered manner, the island-shaped region 12 is formed by enclosing three through holes 11 (as shown in fig. 1); when the plurality of rows of through holes 11 are aligned, the island region 12 is surrounded by four through holes 11 (as shown in fig. 2).
In this embodiment, the triangle of the first pixel unit 21 and the inverted triangle of the second pixel unit 22 are equilateral triangles, as shown in fig. 3 and 5. At this time, when the plurality of rows of through holes 11 are arranged in a staggered manner, the island-shaped region 12 is formed by enclosing three through holes 11, and the adjacent through holes 11 are arranged at equal intervals, so that the triangle of the first pixel unit 21 and the inverted triangle of the second pixel unit 22 are equilateral triangles.
It should be noted that, in this embodiment, the triangle of the first pixel unit 21 and the inverted triangle of the second pixel unit 22 are equilateral triangles, which is a preferred scheme of the present invention. In other alternative solutions (similar technical effects can be achieved in the solution described in the present invention), the triangle of the first pixel unit 21 and the inverted triangle of the second pixel unit 22 may also have other triangle shapes, such as isosceles right triangles described in fig. 4 and fig. 6, which are not described in detail in this embodiment.
In this embodiment, as shown in fig. 7, a pad 13 is disposed at the island region 12, and the pad 13 is used for soldering the sub-pixel 20.
In a more preferable solution of this embodiment, the bonding pad 13 includes a first bonding pad 131 and a second bonding pad 132, the first bonding pad 131 is provided with two electrode pins 130, and the second bonding pad 132 is provided with five electrode pins 130, as shown in fig. 7.
In this embodiment, the first pixel unit 21 and the second pixel unit 22 each include an LED driving chip.
In a preferred embodiment, the LED driving chip is integrally disposed with one sub-pixel 20, and the LED driving chip is soldered on the second pad 132.
In this embodiment, the LED driving chip may be separately disposed, and then the LED driving chip is soldered to the second pad 132 together with an external sub-pixel 20.
In this embodiment, the first pixel unit 21 and the second pixel unit 22 respectively include an LED driving chip, and the first pixel unit 21 and the second pixel unit 22 respectively form a real pixel point. A virtual pixel is formed between the first pixel unit 21 and the second pixel unit 22, and it should be noted that each virtual pixel is also formed by the first sub-pixel 201, the second sub-pixel 202 and the third sub-pixel 203.
In this embodiment, the real pixel includes an LED driving chip, that is, any one of the first sub-pixel 201, the second sub-pixel 202, and the third sub-pixel 203 forming the real pixel includes the LED driving chip. However, the virtual pixel may or may not include an LED driving chip, i.e., any one of the first sub-pixel 201, the second sub-pixel 202, and the third sub-pixel 203 in the virtual pixel may or may not include an LED driving chip. In this embodiment, the virtual pixel point preferably includes an LED driving chip.
Specifically, as shown in fig. 3 and 4, 4 sub-pixels 20 are adjacent to the first pixel unit 21 and the second pixel unit 22, respectively, the second sub-pixel 202 and the third sub-pixel 203 in the first pixel unit 21, and the first sub-pixel 201 and the third sub-pixel 203 in the second pixel unit 22.
The 4 sub-pixels 20 adjacent to the first pixel unit 21 and the second pixel unit 22 may form 2 virtual pixel points, and a virtual pixel point is formed by the second sub-pixel 202, the third sub-pixel 203 and the first sub-pixel 201 in the first pixel unit 21 and the second pixel unit 22 respectively; the second sub-pixel 202 in the first pixel unit 21 and the first sub-pixel 201 and the third sub-pixel 203 in the second pixel unit 22 form another virtual pixel point.
In the same embodiment, a virtual pixel point may be formed between the pixel groups 2, and the "between the pixel groups 2" includes between the left and right pixel groups 2 and between the pixel groups 2 adjacent to each other vertically.
When the pixel group 2 is disposed between the left and right, the distribution of virtual pixels adjacent to the first pixel unit 21 and the second pixel unit 22 is the same as that of the first pixel unit, and will not be described in detail.
When the pixel groups 2 are arranged adjacently one above the other, the virtual pixel points formed between the pixel groups 2 are also formed by the first sub-pixel 201, the second sub-pixel 202 and the third sub-pixel 203. The virtual pixel points formed between the pixel groups 2 may or may not include an LED driving chip, i.e., any one of the first sub-pixel 201, the second sub-pixel 202, and the third sub-pixel 203 in the virtual pixel points formed between the pixel groups 2 may or may not include an LED driving chip. In particular, in this embodiment, the virtual pixel point formed between the pixel groups 2 preferably includes an LED driving chip.
When the pixel groups 2 are adjacently arranged up and down, 4 virtual pixel points are formed between the pixel groups 2, namely:
a first virtual pixel point: formed of a first sub-pixel 201 in the first pixel unit 21 of the upper pixel group 2, a second sub-pixel 202, and a third sub-pixel 203 in the first pixel unit 21 of the lower pixel group 2;
and a second virtual pixel point: formed by the third sub-pixel 203 in the first pixel unit 21 of the lower pixel group 2, the first sub-pixel 201 in the second pixel unit 22 of the lower pixel group 2, and the second sub-pixel 202 in the first pixel unit 21 of the upper pixel group 2;
third virtual pixel: formed of the second sub-pixel 202 in the first pixel unit 21 of the upper pixel group 2, the third sub-pixel 203 in the second pixel unit 22 of the upper pixel group 2, and the first sub-pixel 201 in the second pixel unit 22 of the lower pixel group 2;
fourth virtual pixel point: is formed by a first sub-pixel 201 in the second pixel cell 22 of the lower pixel group 2, a second sub-pixel 202, and a third sub-pixel 203 in the second pixel cell 22 of the upper pixel group 2.
In this embodiment, virtual pixel points can be formed between a plurality of (more than 3) adjacent pixel groups 2 as well, and the description thereof will be omitted.
From this, it can be seen that the pixel setting method described in the present technical solution is more scientific than that described in the prior art (patent CN 114863868A), and under the same area, the pixel density of the present technical solution is higher, and the sub-pixels and the LED driving chips are further saved, so that the present technical solution can achieve the purposes of greatly reducing the investment of hardware cost and reducing the heat generation of the LED display device.
In the prior art, the pixel points of the transparent screen are not covered with the through holes, the through holes are independent of the pixel points, the visual effect appears to be somewhat hard when the image is displayed in a transparent state, and the display image is affected by light rays transmitted through the through holes.
In the technical scheme, the real pixel points and the virtual pixel points, particularly the virtual pixel points span or cover the through holes 11, the through holes 11 are also part of the pixel points when the LED display device displays images in a transparent state, and under the working condition, the visual effect when displaying the images is very real, vivid and full, particularly when displaying holographic 3D images, more stereoscopic reality is achieved.
It should be noted that the specific arrangement manner of the LED driving chips in the first pixel unit 21 and the second pixel unit 22 may be randomly arranged, for example, the LED driving chips in the first pixel unit 21 and the second pixel unit 22 may randomly select one sub-pixel from the first sub-pixel 201, the second sub-pixel 202 and the third sub-pixel 203 to be arranged together.
However, this random arrangement of the LED driving chips is not beneficial to control of the program, so the preferred arrangement scheme of the LED driving chips in this embodiment is:
when the LED driving chip in the first pixel unit 21 is disposed with the first sub-pixel 201 in the first pixel unit 21, the LED driving chip in the second pixel unit 22 is also disposed with the first sub-pixel 201 in the second pixel unit 22.
Or when the LED driving chip in the first pixel unit 21 is disposed with the second sub-pixel 202 in the first pixel unit 21, the LED driving chip in the second pixel unit 22 is also disposed with the second sub-pixel 202 in the second pixel unit 22.
Or when the LED driving chip in the first pixel unit 21 is disposed with the third sub-pixel 203 in the first pixel unit 21, the LED driving chip in the second pixel unit 22 is also disposed with the third sub-pixel 203 in the second pixel unit 22.
In this embodiment, the first sub-pixel 201, the second sub-pixel 202, and the third sub-pixel 203 do not cover the through hole 11. In this embodiment, the shapes, specifications, and uniformity of the first sub-pixel 201, the second sub-pixel 202, and the third sub-pixel 203 are not limited, but in this embodiment, the sizes and shapes of the first sub-pixel 201, the second sub-pixel 202, and the third sub-pixel 203 are the same, such as circular or square, etc. with the same size.
In a preferred technical solution of this embodiment, as shown in fig. 7, the two electrode pins 130 on the first pad 131 are:
the VDD pin is used for being electrically connected with the positive electrode end of the sub-pixel;
the first control pin is electrically connected to the negative terminal of the sub-pixel 20.
In a preferred technical solution of this embodiment, as shown in fig. 7, the five electrode pins 130 on the second pad 132 are:
VDD pin electrically connected to the positive terminal of the LED driving chip or/and the positive terminal of the sub-pixel 20;
a GND pin electrically connected to the negative terminal of the LED driving chip or/and the negative terminal of the sub-pixel 20;
a DATA pin electrically connected with a DATA signal input DIN end of the LED driving chip;
the second control pin is electrically connected with the first control pin and controls the light emitting state of the sub-pixel 20 on the first bonding pad 131;
the third control pin is electrically connected to the first control pin and controls the light emitting state of the sub-pixel 20 on the first pad 131.
It should be noted that the first pixel unit 21 and the second pixel unit 22 each include three sub-pixels 20 (i.e., a first sub-pixel 201, a second sub-pixel 202 and a third sub-pixel 203). One sub-pixel 20 is soldered to each pad 13, so that the first pixel unit 21 and the second pixel unit 22 each include three pads 13. Specifically, the first pixel unit 21 and the second pixel unit 22 each include two first pads 131 and one second pad 132.
The second bonding pad 132 is provided with sub-pixels 20 with LED driving chips, and the second control pin and the third control pin in the second bonding pad 132 are respectively connected with one first bonding pad 131 (specifically connected with the first control pin in the first bonding pad 131), so that the LED driving chip controls the two sub-pixels 20 on the first bonding pad 131 through the second control pin and the third control pin.
It is to be understood that the above examples of the present invention are provided by way of illustration only and not by way of limitation of the embodiments of the present invention. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.

Claims (10)

1. An LED display device with pixel arrangement is characterized by comprising an LED carrier plate and a plurality of pixel groups arranged on the LED carrier plate;
the LED carrier plate comprises a front surface, a back surface and through holes which penetrate through the front surface and the back surface of the LED carrier plate and are regularly arranged, and at least three through holes Kong Weilong form an island-shaped area;
the pixel group comprises a first pixel unit and a second pixel unit, and the first pixel unit and the second pixel unit are arranged adjacently to the left or the right;
the first pixel unit is triangular, a sub-pixel is arranged at the vertex of the triangle, the sub-pixel comprises a first sub-pixel, a second sub-pixel and a third sub-pixel, and the arrangement mode of the sub-pixel at the vertex of the triangle is as follows: the first sub-pixel, the second sub-pixel and the third sub-pixel are arranged from the left top point of the bottom edge of the triangle in a counter-clockwise direction;
the second pixel unit is an inverted triangle, a sub-pixel is arranged at the vertex of the inverted triangle, and the arrangement mode of the sub-pixel at the vertex of the inverted triangle is as follows: a third sub-pixel, a second sub-pixel and a first sub-pixel are arranged from the top point at the bottom of the inverted triangle in turn in the anticlockwise direction;
the sub-pixels are arranged in island-shaped areas on the front face of the LED carrier plate.
2. The LED display device with pixel arrangement according to claim 1, wherein adjacent through holes are arranged at equal intervals;
the triangle of the first pixel unit and the inverted triangle of the second pixel unit are equilateral triangles.
3. The LED display device with pixel arrangement according to claim 1 or 2, wherein the island region is provided with a pad for soldering the sub-pixels;
the bonding pad comprises a first bonding pad and a second bonding pad, wherein the first bonding pad is provided with two electrode pins, and the second bonding pad is provided with five electrode pins.
4. The LED display device of claim 3, wherein the first pixel unit and the second pixel unit each comprise an LED driving chip;
the LED driving chip and one sub-pixel are integrally arranged, and the LED driving chip is welded on the second bonding pad at the moment;
or the LED driving chip is arranged independently and welded on the second bonding pad together with an external sub-pixel.
5. The LED display device with pixel arrangement of claim 4, wherein the specific placement positions of the LED driving chips are:
when the LED driving chip in the first pixel unit is arranged with the first sub-pixel in the first pixel unit, the LED driving chip in the second pixel unit is also arranged with the first sub-pixel in the second pixel unit;
or when the LED driving chip in the first pixel unit is arranged with the second sub-pixel in the first pixel unit, the LED driving chip in the second pixel unit is also arranged with the second sub-pixel in the second pixel unit;
or when the LED driving chip in the first pixel unit is arranged with the third sub-pixel in the first pixel unit, the LED driving chip in the second pixel unit is also arranged with the third sub-pixel in the second pixel unit.
6. The LED display device with pixel arrangement according to claim 4,
the two electrode pins on the first bonding pad are as follows:
the VDD pin is used for being electrically connected with the positive electrode end of the sub-pixel;
the first control pin is used for being electrically connected with the negative electrode end of the sub-pixel;
the five electrode pins on the second bonding pad are as follows:
a VDD pin electrically connected with the positive electrode terminal of the LED driving chip or/and the positive electrode terminal of the connection sub-pixel;
a GND pin electrically connected with the negative electrode end of the LED driving chip or/and the negative electrode end of the sub-pixel;
a DATA pin electrically connected with a DATA signal input DIN end of the LED driving chip;
the second control pin is electrically connected with the first control pin and controls the luminous state of the sub-pixel on the first bonding pad;
and the third control pin is electrically connected with the first control pin and controls the luminous state of the sub-pixel on the first bonding pad.
7. The LED display device of claim 1, wherein the first pixel unit and the second pixel unit are adjacent to each other to form a virtual pixel.
8. The LED display device according to claim 1, wherein virtual pixel points are formed in adjacent positions of the two pixel groups adjacent to each other in the left-right direction and the pixel groups adjacent to each other in the up-down direction.
9. The LED display device of claim 1, wherein the first, second and third sub-pixels have the same size and shape and do not cover the through-hole.
10. The LED display device of claim 1 or 9, wherein the first, second and third sub-pixels are each any one of the following six combinations in order:
an R color light source, a G color light source and a B color light source;
or a G color light source, an R color light source and a B color light source;
or a B color light source, a G color light source and an R color light source;
or an R color light source, a B color light source and a G color light source;
or a G-color light source, a B-color light source and an R-color light source;
or a B color light source, an R color light source and a G color light source.
CN202310332961.1A 2023-03-24 2023-03-24 LED display device with pixel arrangement Active CN116344526B (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150103103A1 (en) * 2013-10-14 2015-04-16 Samsung Display Co., Ltd. Organic light-emitting display apparatus
CN204391118U (en) * 2015-03-11 2015-06-10 京东方科技集团股份有限公司 Pixel arrangement structure and display unit
CN110277436A (en) * 2019-06-28 2019-09-24 云谷(固安)科技有限公司 Pixel arrangement structure and display panel
CN110335892A (en) * 2019-07-15 2019-10-15 云谷(固安)科技有限公司 Pixel arrangement structure, display panel and display device
CN114863868A (en) * 2022-03-27 2022-08-05 深圳市美矽微半导体有限公司 LED support plate and display device thereof
CN219457624U (en) * 2023-03-24 2023-08-01 深圳市美矽微半导体有限公司 LED display device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150103103A1 (en) * 2013-10-14 2015-04-16 Samsung Display Co., Ltd. Organic light-emitting display apparatus
CN204391118U (en) * 2015-03-11 2015-06-10 京东方科技集团股份有限公司 Pixel arrangement structure and display unit
CN110277436A (en) * 2019-06-28 2019-09-24 云谷(固安)科技有限公司 Pixel arrangement structure and display panel
CN110335892A (en) * 2019-07-15 2019-10-15 云谷(固安)科技有限公司 Pixel arrangement structure, display panel and display device
CN114863868A (en) * 2022-03-27 2022-08-05 深圳市美矽微半导体有限公司 LED support plate and display device thereof
CN219457624U (en) * 2023-03-24 2023-08-01 深圳市美矽微半导体有限公司 LED display device

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