CN116344315A - Focusing ring lifting mechanism and device for improving cavity etching uniformity - Google Patents

Focusing ring lifting mechanism and device for improving cavity etching uniformity Download PDF

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Publication number
CN116344315A
CN116344315A CN202310339825.5A CN202310339825A CN116344315A CN 116344315 A CN116344315 A CN 116344315A CN 202310339825 A CN202310339825 A CN 202310339825A CN 116344315 A CN116344315 A CN 116344315A
Authority
CN
China
Prior art keywords
focus ring
ring
outer sleeve
focusing ring
lifting rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310339825.5A
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Chinese (zh)
Inventor
叶璘珂
沈吉
汤介峰
荆泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Huali Microelectronics Corp
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Shanghai Huali Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Huali Microelectronics Corp filed Critical Shanghai Huali Microelectronics Corp
Priority to CN202310339825.5A priority Critical patent/CN116344315A/en
Publication of CN116344315A publication Critical patent/CN116344315A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
    • B66F7/00—Lifting frames, e.g. for lifting vehicles; Platform lifts
    • B66F7/10—Lifting frames, e.g. for lifting vehicles; Platform lifts with platforms supported directly by jacks
    • B66F7/12—Lifting frames, e.g. for lifting vehicles; Platform lifts with platforms supported directly by jacks by mechanical jacks
    • B66F7/14—Lifting frames, e.g. for lifting vehicles; Platform lifts with platforms supported directly by jacks by mechanical jacks screw operated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
    • B66F7/00—Lifting frames, e.g. for lifting vehicles; Platform lifts
    • B66F7/28—Constructional details, e.g. end stops, pivoting supporting members, sliding runners adjustable to load dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Structural Engineering (AREA)
  • Geology (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

The invention provides a focusing ring lifting mechanism and a device for improving cavity etching uniformity, wherein the focusing ring lifting mechanism is used for lifting a focusing ring in a vacuum reaction cavity, a base is arranged in the vacuum reaction cavity, an electrostatic chuck is arranged on the base, the focusing ring is arranged around the periphery of the electrostatic chuck, the focusing ring lifting mechanism comprises a lifting rod and an outer sleeve sleeved outside the lifting rod, the outer sleeve penetrates through the base and is abutted to the bottom of the focusing ring, the lifting rod is in threaded connection with the outer sleeve, and the lifting rod can vertically lift the outer sleeve relative to the lifting rod by rotating the lifting rod, so that the focusing ring is driven to lift. After the focusing ring is etched for a period of time, the lifting rod can be rotated to enable the lifting rod to vertically ascend relative to the outer sleeve, so that the focusing ring is driven to ascend, the upper surface of the focusing ring is kept not lower than the upper surface of the wafer, and therefore the uniformity of wafer etching is guaranteed.

Description

Focusing ring lifting mechanism and device for improving cavity etching uniformity
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a focusing ring lifting mechanism and a device for improving cavity etching uniformity.
Background
In the prior art, when plasma etching is performed on a wafer by using plasma etching equipment, a focusing ring is generally arranged around a pedestal bearing the processed wafer, and the focusing ring can improve the uniformity of plasma distribution near the edge of the wafer to be processed and improve the etching uniformity.
However, during plasma etching of the wafer, the focus ring is also worn, resulting in the upper surface of the focus ring being slowly lower in height than the upper surface of the processed wafer, resulting in uneven plasma distribution at the edge of the processed wafer. The conventional practice is to stop the machine for timely replacement when the focusing ring is worn to a certain extent, and the replacement of the focusing ring usually needs to disassemble the vacuum reaction cavity for direct replacement, but the mode increases labor cost and replacement time, and the production efficiency is easily affected.
Disclosure of Invention
The invention aims to provide a focusing ring lifting mechanism and a device for improving cavity etching uniformity, which solve various problems caused by the fact that a focusing ring is worn and needs to be replaced when a wafer is etched by using existing plasmas.
In order to achieve the above purpose, the invention provides a focusing ring lifting mechanism, which is used for lifting a focusing ring in a vacuum reaction cavity, wherein a base is arranged in the vacuum reaction cavity, an electrostatic chuck is arranged on the base, the focusing ring is arranged around the periphery of the electrostatic chuck, the focusing ring lifting mechanism comprises a lifting rod and an outer sleeve sleeved outside the lifting rod, the outer sleeve penetrates through the base and then abuts against the bottom of the focusing ring, the lifting rod is in threaded connection with the outer sleeve, and the lifting rod can vertically lift relative to the outer sleeve by rotating the lifting rod, so that the focusing ring is driven to lift.
Optionally, the outer sleeve has an internal thread, and the lifting rod has an external thread adapted to the internal thread.
Optionally, a sealing sleeve is arranged between the outer sleeve and the base.
Optionally, a knob is arranged at the bottom end of the lifting rod.
Optionally, an encoder is further disposed on the knob.
Optionally, a flexible pad is arranged at the top end of the lifting rod.
Optionally, an aluminum ring is fixed at the bottom of the focusing ring, and the lifting rod is abutted to the focusing ring through the aluminum ring.
Based on the above, the invention also provides a device for improving the etching uniformity of the cavity, which comprises a vacuum reaction cavity, a base, an electrostatic chuck, a focusing ring and a plurality of focusing ring lifting mechanisms.
Optionally, the plurality of focus ring lifting mechanisms are uniformly distributed along the circumference of the focus ring.
Optionally, an isolating ring is further arranged around the periphery of the focusing ring, and the isolating ring is located on the base.
According to the focusing ring lifting mechanism and the device for improving cavity etching uniformity, after the focusing ring is etched for a period of time, the lifting rod is rotated to enable the lifting rod to vertically lift relative to the outer sleeve, so that the focusing ring is driven to lift, the upper surface of the focusing ring is kept not lower than the upper surface of a wafer, and the wafer etching uniformity is further guaranteed.
Drawings
Those of ordinary skill in the art will appreciate that the figures are provided for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention. Wherein:
fig. 1 is a schematic structural diagram of an apparatus for improving cavity etching uniformity according to an embodiment of the present invention.
In the accompanying drawings:
1-a vacuum reaction chamber; 2-focusing ring; 3-a base; 4-an electrostatic chuck; 5-lifting rod; 6-an outer sleeve; 7-a knob; an 8-encoder; a 9-aluminum ring; 10-isolating rings; 11-wafer.
Detailed Description
The invention will be described in further detail with reference to the drawings and the specific embodiments thereof in order to make the objects, advantages and features of the invention more apparent. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for the purpose of facilitating and clearly aiding in the description of embodiments of the invention. For a better understanding of the invention with objects, features and advantages, refer to the drawings. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure for the understanding and reading of the present disclosure, and are not intended to limit the scope of the invention, which is defined by the appended claims, and any structural modifications, proportional changes, or dimensional adjustments, which may be made by the present disclosure, should fall within the scope of the present disclosure under the same or similar circumstances as the effects and objectives attained by the present invention.
As used in this disclosure, the singular forms "a," "an," and "the" include plural referents unless the content clearly dictates otherwise. As used in this disclosure, the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise. As used in this disclosure, the term "plurality" is generally employed in its sense including "at least one" unless the content clearly dictates otherwise. As used in this disclosure, the term "at least two" is generally employed in its sense including "two or more", unless the content clearly dictates otherwise. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", "a third" may include one or at least two such features, either explicitly or implicitly.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "secured" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a device for improving cavity etching uniformity provided by an embodiment of the present invention, the embodiment of the present invention provides a focus ring lifting mechanism, which is used for lifting a focus ring 2 in a vacuum reaction chamber 1, a base 3 is disposed in the vacuum reaction chamber 1, an electrostatic chuck 4 is disposed on the base 3, the focus ring 2 is disposed around the periphery of the electrostatic chuck 4, the focus ring lifting mechanism includes a lifting rod 5 and an outer sleeve 6 sleeved outside the lifting rod 5, the outer sleeve 6 abuts against the bottom of the focus ring 2 after penetrating through the base 3, the lifting rod 5 is in threaded connection with the outer sleeve 6, and the lifting rod 5 can vertically lift relative to the outer sleeve 6 by rotating the lifting rod 5, so as to drive the focus ring 2 to lift.
After the focus ring 2 is etched for a period of time, the lifting rod 5 can be rotated (e.g. rotated clockwise) to vertically lift the lifting rod 5 relative to the outer sleeve 6, so as to drive the focus ring 2 to lift, so that the upper surface of the focus ring 2 is kept not lower than the upper surface of the wafer 11, and the uniformity of the etching of the wafer 11 is further ensured.
Specifically, the focus ring lifting mechanism comprises a lifting rod 5 and an outer sleeve 6 sleeved outside the lifting rod 5, the outer sleeve 6 is relatively fixed with the base 3, and the lifting rod 5 can vertically lift and jack the focus ring 2 relative to the outer sleeve 6.
Preferably, a sealing sleeve (not shown) is arranged between the outer sleeve 6 and the base 3. Because the base 3 is positioned in the vacuum reaction cavity 1, the sealing performance between the outer sleeve 6 and the base 3 can be ensured by arranging the sealing sleeve. The material of the sealing sleeve is, for example, rubber, which is not limited in this application.
In this embodiment, the outer sleeve 6 has an internal thread, the lifting rod 5 has an external thread matched with the internal thread, and the lifting rod 5 can vertically lift and lower relative to the outer sleeve 6 by rotating (clockwise or counterclockwise) the lifting rod 5.
Preferably, a knob 7 is arranged at the bottom end of the lifting rod 5. By providing the knob 7, the operation by a human hand is facilitated. Of course, other means of driving than the setting knob 7 may be employed, such as a motor, etc. The present application is not limited in this regard.
Further preferably, the knob 7 is further provided with an encoder 8. The encoder 8 can detect the rotation number of the knob 7, and then output the lifting displacement of the lifting rod 5, so as to more accurately adjust the height of the focusing ring 2. Of course, in addition to the encoder 8, other components such as an angular displacement sensor may be used to detect the lifting displacement of the lifting rod 5, which is not limited in this application.
In this embodiment, an aluminum ring 9 is further fixed at the bottom of the focusing ring 2, and the lifting rod 5 abuts against the focusing ring 2 through the aluminum ring 9. The focusing ring 2 is usually fixed on the aluminum ring 9 by a pasting mode, the lifting rod 5 is in direct contact with the aluminum ring 9, and the aluminum ring 9 and the focusing ring 2 on the aluminum ring 9 can be driven to ascend or descend by driving the lifting rod 5 to ascend or descend.
Preferably, a flexible pad is arranged at the top end of the lifting rod 5. By arranging the flexible pad to avoid contact between the lifting rod 5 and the aluminum ring 9 below the focusing ring 2, extrusion deformation is caused on the aluminum ring 9, and meanwhile, the contact area between the lifting rod 5 and the aluminum ring 9 can be increased. The flexible pad may be circular or square, as is not limited in this application. In addition, the material and size of the flexible pad are not limited in this application.
Based on this, please continue to refer to fig. 1, the embodiment of the present invention further provides a device for improving the uniformity of cavity etching, which includes a vacuum reaction chamber 1, a base 3, an electrostatic chuck 4, a focus ring 2, and a plurality of focus ring lifting mechanisms as described above.
In this embodiment, the base 3 is disposed in the vacuum reaction chamber 1, the electrostatic chuck 4 is disposed on the base 3, the focusing ring 2 is disposed around the periphery of the electrostatic chuck 4, the focusing ring lifting mechanism includes a lifting rod 5 and an outer sleeve 6 sleeved outside the lifting rod 5, the outer sleeve 6 penetrates through the base 3 and then abuts against the bottom of the focusing ring 2, the lifting rod 5 is in threaded connection with the outer sleeve 6, and the lifting rod 5 can vertically lift relative to the outer sleeve 6 through rotating the lifting rod 5, so as to drive the focusing ring 2 to lift.
After the focus ring 2 is etched for a period of time, the lifting rod 5 can be rotated (e.g. rotated clockwise) to vertically lift the lifting rod 5 relative to the outer sleeve 6, so as to drive the focus ring 2 to lift, so that the upper surface of the focus ring 2 is kept not lower than the upper surface of the wafer 11, and the uniformity of the etching of the wafer 11 is further ensured.
Preferably, a plurality of the focus ring lifting mechanisms are uniformly distributed along the circumferential direction of the focus ring 2. In this embodiment, the number of the focusing ring lifting mechanisms is 6, and 6 focusing ring lifting mechanisms are uniformly distributed along the circumferential direction of the focusing ring 2. Of course, the number and the distribution manner of the focusing ring lifting mechanisms are not particularly limited, and can be adjusted according to actual requirements.
In this embodiment, the vacuum reaction chamber 1 may be a reaction chamber of a capacitively coupled plasma etching apparatus, an inductively coupled plasma etching apparatus, or the like.
In this embodiment, an electrostatic electrode is disposed inside the electrostatic chuck 4 for generating electrostatic attraction force to support and fix the wafer 11 during the process.
In this embodiment, a spacer ring 10 is further disposed around the outer circumference of the focusing ring 2, and the spacer ring 10 is located on the base 3.
In summary, the embodiment of the invention provides a focus ring lifting mechanism and a device for improving cavity etching uniformity, after a focus ring 2 is etched for a period of time, the lifting rod 5 can be vertically lifted relative to the outer sleeve 6 by rotating (e.g. clockwise rotating) the lifting rod 5, so as to drive the focus ring 2 to lift, so that the upper surface of the focus ring 2 is kept not lower than the upper surface of a wafer 11, and the etching uniformity of the wafer 11 is further ensured.
The above description is only illustrative of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention, and any alterations and modifications made by those skilled in the art based on the above disclosure shall fall within the scope of the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, the present invention is intended to include such modifications and alterations insofar as they come within the scope of the invention or the equivalents thereof.

Claims (10)

1. The utility model provides a focus ring elevating system for go up and down to the focus ring in the vacuum reaction chamber, the vacuum reaction intracavity sets up a base, be provided with an electrostatic chuck on the base, focus ring encircle set up in electrostatic chuck's periphery, its characterized in that, focus ring elevating system includes lifter and cover establish outer sleeve outside the lifter, the outer sleeve runs through the butt behind the base focus ring's bottom, lifter and outer sleeve threaded connection can make through the rotation the lifter can the lifter is relative the outer sleeve is along vertical lift, and then drives focus ring goes up and down.
2. The focus ring lift mechanism of claim 1 wherein said outer sleeve has internal threads and said lift rod has external threads that mate with said internal threads.
3. The focus ring lift mechanism of claim 1 wherein a sealing sleeve is disposed between the outer sleeve and the base.
4. The focus ring lift mechanism of claim 1, wherein a bottom end of the lift rod is provided with a knob.
5. The focus ring lift mechanism of claim 4 wherein said knob is further provided with an encoder.
6. The focus ring lift mechanism of claim 1 wherein a flexible pad is provided at a top end of the lift rod.
7. The focus ring lifting mechanism of claim 1, wherein an aluminum ring is further fixed to the bottom of the focus ring, and the lifting rod is abutted to the focus ring through the aluminum ring.
8. An apparatus for improving chamber etch uniformity comprising a vacuum reaction chamber, a susceptor, an electrostatic chuck, a focus ring, and a plurality of focus ring lift mechanisms according to any one of claims 1-7.
9. The apparatus for improving chamber etch uniformity of claim 8, wherein a plurality of said focus ring lifts are uniformly distributed along a circumference of said focus ring.
10. The apparatus of claim 8, wherein the focus ring is further circumferentially provided with a spacer ring, the spacer ring being located on the susceptor.
CN202310339825.5A 2023-03-31 2023-03-31 Focusing ring lifting mechanism and device for improving cavity etching uniformity Pending CN116344315A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310339825.5A CN116344315A (en) 2023-03-31 2023-03-31 Focusing ring lifting mechanism and device for improving cavity etching uniformity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310339825.5A CN116344315A (en) 2023-03-31 2023-03-31 Focusing ring lifting mechanism and device for improving cavity etching uniformity

Publications (1)

Publication Number Publication Date
CN116344315A true CN116344315A (en) 2023-06-27

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ID=86892861

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310339825.5A Pending CN116344315A (en) 2023-03-31 2023-03-31 Focusing ring lifting mechanism and device for improving cavity etching uniformity

Country Status (1)

Country Link
CN (1) CN116344315A (en)

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