CN116334770A - Cleaning method of spinneret plate module - Google Patents
Cleaning method of spinneret plate module Download PDFInfo
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- CN116334770A CN116334770A CN202310330643.1A CN202310330643A CN116334770A CN 116334770 A CN116334770 A CN 116334770A CN 202310330643 A CN202310330643 A CN 202310330643A CN 116334770 A CN116334770 A CN 116334770A
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- Prior art keywords
- cleaning
- spinneret
- spinneret plate
- main body
- plate main
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- 238000004140 cleaning Methods 0.000 title claims abstract description 122
- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 238000005498 polishing Methods 0.000 claims abstract description 35
- 238000001035 drying Methods 0.000 claims abstract description 32
- 239000012530 fluid Substances 0.000 claims abstract description 32
- 238000010926 purge Methods 0.000 claims abstract description 15
- 239000008367 deionised water Substances 0.000 claims abstract description 14
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 230000008569 process Effects 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims abstract description 7
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 30
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 23
- 239000000243 solution Substances 0.000 claims description 18
- 239000007864 aqueous solution Substances 0.000 claims description 17
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 15
- 239000007789 gas Substances 0.000 claims description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000002585 base Substances 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- 239000003513 alkali Substances 0.000 claims description 9
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 8
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 4
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004115 Sodium Silicate Substances 0.000 claims description 3
- 235000019795 sodium metasilicate Nutrition 0.000 claims description 3
- 239000001488 sodium phosphate Substances 0.000 claims description 3
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 3
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000009987 spinning Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 abstract description 2
- 238000005266 casting Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 4
- 239000012459 cleaning agent Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003837 high-temperature calcination Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Classifications
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01D—MECHANICAL METHODS OR APPARATUS IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS
- D01D4/00—Spinnerette packs; Cleaning thereof
- D01D4/04—Cleaning spinnerettes or other parts of the spinnerette packs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
- Y02P70/62—Manufacturing or production processes characterised by the final manufactured product related technologies for production or treatment of textile or flexible materials or products thereof, including footwear
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Textile Engineering (AREA)
- Spinning Methods And Devices For Manufacturing Artificial Fibers (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses a cleaning method of a spinneret plate module, and belongs to the technical field of cleaning and maintenance of spinning equipment. The spinneret plate module is firstly split, and then the base and the cover plate are washed by flowing deionized water and then dried for standby. Simultaneously cleaning the spinneret plate body, wherein the cleaning process comprises the following steps of (1) pretreatment: removing skinning solids on the surface of the spinneret plate main body; (2) cleaning: immersing the spinneret plate main body in a cleaning liquid, and cleaning under ultrasonic conditions; (3) drying: purging the cleaned spinneret plate main body with gas, and then drying; (4) fluid polishing treatment: placing the dried spinneret plate main body into fluid polishing equipment for polishing treatment; (5) post-treatment: and (3) carrying out gas purging on the spinneret plate main body subjected to the fluid polishing treatment. The cleaning method can ensure the cleaning effect of the spinneret plate module, greatly reduce the cleaning time, and has mild cleaning conditions without corrosion or damage to the spinneret plate main body.
Description
Technical Field
The invention belongs to the technical field of cleaning and maintenance of spinning equipment, and particularly relates to a cleaning method of a spinneret plate module.
Background
The spinneret plate module is an important part in spinning equipment, and after passing through spinneret holes in a spinneret plate main body, liquid polymer solution or melt forms fluid with the same cross section as the shape of the spinneret holes and is solidified to form filaments after passing through a solidification medium. The diameter of the spinneret hole on the spinneret body is in a micron order, the size is very small, the detailed structure of the spinneret hole cannot be observed by naked eyes, and in the process of circulating a casting film liquid through a pipeline, even though the casting film liquid passes through a filter screen, particles which influence the passage of the casting film liquid through the spinneret body can exist, and the particles can cause blockage of the spinneret. Once the spinneret holes on the spinneret plate body are blocked, the spinneret effect is affected, membrane holes of the membrane filaments are possibly deviated, the membrane filaments are broken and cannot be formed, and the membrane liquid pipeline is leaked more seriously. Under the condition that the spinneret holes are completely blocked, the spinneret efficiency is reduced, under the condition that the spinneret holes are partially blocked, filaments with smaller diameters are sprayed out to generate defective products, and therefore, the spinneret holes on the spinneret plate main body are in an unblocked state to meet production requirements.
The technical problem of blockage of spinneret holes can be solved by cleaning a spinneret plate module, the conventional cleaning method comprises high-temperature calcination, solution soaking and the like, for example, in Chinese patent application No. CN103469318A (a calcination cleaning method of a spinneret plate), the spinneret plate is placed in a muffle furnace for calcination, a cathode wire and an anode wire are arranged in a hearth of the muffle furnace, the two sides of the spinneret plate are respectively connected with the cathode wire and the anode wire, oxidation or sulfuration corrosion of the spinneret plate generated under the high-temperature calcination can be restrained under the action of an external power supply, and the structural integrity of the spinneret plate is ensured; however, the method has the disadvantages of complex operation, high equipment investment cost and high implementation difficulty. In another example, in chinese patent application CN101182648A (cleaning process for fine denier filament spinneret), ethylene glycol is used as a cleaning agent, the fine denier filament spinneret is placed in a furnace body containing the ethylene glycol cleaning agent, the ethylene glycol cleaning agent is heated to 230-240 ℃ and the pressure is 0.36-0.43MPa, the heating is maintained for 3-4 hours, then the heating is stopped, the fine denier filament spinneret is taken out and is cleaned by 5% concentration alkali liquor in an ultrasonic manner, and compared with triethylene glycol cleaning, a certain time can be saved, but the method has high operation temperature and pressure, so that the safety is lower.
Disclosure of Invention
The invention aims to provide a cleaning method of a spinneret plate module aiming at the defects in the prior art so as to solve the technical problems in the background art.
In order to achieve the above purpose, the invention discloses a cleaning method of a spinneret plate module, which is characterized by comprising the following steps: the spinneret module comprises a spinneret body, and the cleaning method of the spinneret body comprises the following steps:
(1) Pretreatment: removing skinning solids on the surface of the spinneret plate main body;
(2) Cleaning: immersing the spinneret plate main body in a cleaning liquid, and cleaning under ultrasonic conditions;
(3) And (3) drying: purging the cleaned spinneret plate main body with gas, and then drying;
(4) Fluid polishing treatment: placing the dried spinneret plate main body into fluid polishing equipment for polishing treatment;
(5) Post-treatment: and (3) carrying out gas purging on the spinneret plate main body subjected to the fluid polishing treatment.
Further, the cleaning liquid comprises a first cleaning liquid and a second cleaning liquid; in the step (2), the spinneret plate main body is alternately immersed in the first cleaning liquid and the second cleaning liquid for ultrasonic cleaning, drying treatment is carried out after each ultrasonic cleaning, and the ultrasonic cleaning process is circularly carried out for a plurality of times.
Further, the first cleaning solution comprises a mixed solution of alcohol and alkali, wherein the alcohol is selected from one or more of ethylene glycol, ethanol, triglycol and propylene glycol, and the alkali is selected from one or more of sodium hydroxide aqueous solution, sodium carbonate aqueous solution, sodium phosphate trinna aqueous solution, sodium metasilicate aqueous solution and sodium tripolyphosphate aqueous solution.
Further, the second cleaning liquid comprises an organic solvent; the organic solvent is selected from one or more of N, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone and dimethyl sulfoxide.
Further, in the step (2), the temperature of the ultrasonic cleaning is 45-75 ℃, and the time of the ultrasonic cleaning is 1-25min.
Further, the cleaning solution further comprises a third cleaning solution, the third cleaning solution is deionized water, and the spinneret plate main body subjected to circulating multi-cleaning ultrasonic cleaning and drying in the first cleaning solution and the second cleaning solution is immersed in the third cleaning solution for ultrasonic cleaning.
Further, in the step (3), the drying is carried out under the protection of vacuum or nitrogen, the drying temperature is 55-120 ℃, and the drying time is 20-50min.
Further, in the step (4), the abrasive particles with the particle size of 5500-7000 meshes are adopted for carrying out fluid polishing treatment, and the pressure of the fluid polishing equipment is 110-145MPa.
Further, in the step (3) and the step (5), nitrogen or inert gas after precise filtration is adopted for gas purging.
Further, the spinneret plate module further comprises a base and a cover plate which are detachably connected with the spinneret plate main body, when the spinneret plate module is cleaned, the spinneret plate module is detached, and then the base and the cover plate are washed by flowing deionized water and then dried.
Compared with the prior art, the cleaning method of the spinneret plate module has the following effects:
(1) According to the invention, the spinneret plate module is split and cleaned, the base and the cover plate which do not affect the precision are washed by flowing deionized water and then dried in the air, and the spinneret plate main body which determines the precision of the spinneret plate module is cleaned by combining multiple ultrasonic cleaning and fluid polishing treatment, so that the spinneret plate main body is treated differently, the cleaning time is shortened, and the cleaning cost is also reduced.
(2) In the invention, when the spinneret plate main body is cleaned, the ultrasonic cleaning method for circulating multiple times of cleaning liquid is adopted, and the ultrasonic cleaning method is matched with fluid polishing treatment, so that the cleaning effect is good, the cleaning condition is mild, the spinneret plate main body is not corroded or damaged, the cleanliness is ensured, and the service life of the spinneret plate main body is prolonged.
(3) In the invention, the spinneret plate modules are separated and then are respectively cleaned, so that the cleaning time is greatly saved, the cleaning efficiency is improved, the performance loss caused by the fact that the casting solution is kept for too long is also reduced, and the stability of the formed spinneret is improved.
Detailed Description
The technical scheme of the present invention will be clearly and completely described in the following in connection with specific embodiments.
In the spinning technical field, the spinneret module comprises a base, a spinneret body, a cover plate and the like, and the structure of the spinneret module is common knowledge well known to those skilled in the art, and is not described herein again.
The base and the cover plate have little influence on the precision of the spinneret plate module, and when the spinneret plate module is cleaned, the spinneret plate module can be detached first, and the base and the cover plate are washed by flowing deionized water and then dried for later use.
And for the spinneret main body, because the precision of the spinneret module is directly influenced, the method is an important part of the spinneret during the cleaning of the spinneret, and comprises the following steps:
(1) Pretreatment: removing the skinned solid matter on the surface of the spinneret plate main body.
The blocked spinneret plate main body surface can remain casting film liquid, the main component of the casting film liquid is polymer, cooling and solidifying skinning are carried out after precooling, skinning solid matters are taken out first before the spinneret plate main body is cleaned, and therefore, the blocking matters can be removed, subsequent cleaning treatment is facilitated, and the cleaning treatment efficiency and the cleaning effect can be improved.
(2) Cleaning:
firstly, immersing a spinneret plate main body in a first cleaning liquid, and cleaning under ultrasonic conditions;
wherein the first cleaning liquid is a mixed liquid of alcohol and alkali, wherein the alcohol is selected from one or more of ethylene glycol, ethanol, triglycol and propylene glycol, and the alkali is selected from one or more of sodium hydroxide aqueous solution, sodium carbonate aqueous solution, sodium phosphate trinna aqueous solution, sodium metasilicate aqueous solution and sodium tripolyphosphate aqueous solution; specifically, the concentration of the alkali is 3-8wt%, and the mass ratio of the alkali to the alcohol is 1:10-100; the ultrasonic cleaning temperature is 45-75deg.C, and the ultrasonic cleaning time is 1-25min.
Then, immersing the spinneret plate main body subjected to ultrasonic cleaning by the first cleaning liquid in the second cleaning liquid, and cleaning under the ultrasonic condition;
the second cleaning solution comprises an organic solvent, wherein the organic solvent is selected from one or more of N, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone and dimethyl sulfoxide; the ultrasonic cleaning temperature is 45-75deg.C, and the ultrasonic cleaning time is 1-25min.
Then, immersing the spinneret plate main body subjected to ultrasonic cleaning by the second cleaning liquid in the first cleaning liquid, and cleaning under the ultrasonic condition;
repeatedly circulating for a plurality of times to alternately ultrasonically clean the spinneret plate main body in the first cleaning liquid and the second cleaning liquid, before the ultrasonic cleaning is alternately performed, the spinneret plate main body needs to be washed by deionized water in advance, the first cleaning liquid or the second cleaning liquid on the surface is removed, and the spinneret plate main body is dried and then placed in the first cleaning liquid or the second cleaning liquid for the next ultrasonic cleaning;
then, immersing the spinneret plate main body subjected to ultrasonic cleaning by the first cleaning liquid and the second cleaning liquid in a third cleaning liquid, and cleaning under the ultrasonic condition, wherein the ultrasonic cleaning temperature is 45-75 ℃, and the ultrasonic cleaning time is 1-25min;
the third cleaning liquid is deionized water, so that the first cleaning liquid and/or the second cleaning liquid remained on the surface of the spinneret plate main body can be thoroughly removed.
(3) And (3) drying: purging the cleaned spinneret plate main body with gas, and then drying;
the method comprises the steps of carrying out gas purging by adopting nitrogen or inert gas after precise filtration, so as to ensure that a spinneret plate main body is not polluted by impurities in the gas; after purging, drying is carried out under the protection of vacuum or nitrogen, the drying temperature is 55-120 ℃, and the drying time is 20-50min.
(4) Fluid polishing treatment: placing the dried spinneret plate main body into fluid polishing equipment for polishing treatment;
wherein, the abrasive particles with the particle size of 5500-7000 meshes are adopted for carrying out fluid polishing treatment, and the pressure of the fluid polishing equipment is 110-145MPa. The fluid polishing treatment can thoroughly clean the spinneret holes in the spinneret plate main body, so that a small amount of plugs remained in the spinneret holes are further removed, and the cleaning effect is further improved.
(5) Post-treatment: and (3) carrying out gas purging on the spinneret plate main body subjected to the fluid polishing treatment.
The nitrogen or inert gas after precise filtration is adopted for gas purging, so that the residual plugs or abrasive particles on the spinneret plate main body are removed, and the spinneret plate main body is ensured to be clean.
After the spinneret plate main body is cleaned by adopting the method, all plugs in the spinneret plate main body can be eliminated, and in the method, the spinneret plate main body is not corroded or damaged by adopting vacuum atmosphere or nitrogen gas for protection in the drying process, so that the accuracy of the spinneret plate main body can be ensured.
After the cleaning is finished, the spinneret plate main body, the base and the cover plate are assembled to form a spinneret plate module, and the spinneret plate module can be put into use again.
Example 1
Splitting the spinneret plate module, flushing the base and the cover plate with flowing deionized water, airing for later use, and then cleaning the spinneret plate main body, wherein the method specifically comprises the following steps of:
(1) Pretreatment: removing the skinned solid matter on the surface of the spinneret plate main body.
(2) Cleaning: firstly, immersing a spinneret plate main body in a first cleaning solution (a mixture of 5% sodium hydroxide aqueous solution and ethylene glycol in a mass ratio of 1:20), and cleaning under ultrasonic conditions (the temperature is 55 ℃ C., the time is 3 min);
then washing the spinneret plate main body with deionized water, drying, immersing the spinneret plate main body in a second cleaning solution (N, N-dimethylformamide), and cleaning under ultrasonic conditions (the temperature is 65 ℃ for 2 min);
the ultrasonic cleaning process of the first cleaning liquid and the second cleaning liquid is repeated for a plurality of times, and then the spinneret plate main body is immersed in the third cleaning liquid (deionized water) and cleaned under the ultrasonic condition (the temperature is 60 ℃ for 5 min).
(3) And (3) drying: purging the cleaned spinneret plate main body with gas (nitrogen after precise filtration), and then drying (the drying temperature is 60 ℃ and the drying time is 25 min);
(4) Fluid polishing treatment: the dried spinneret body was placed in a fluid polishing apparatus (fluid polishing treatment was performed using abrasive grains having a grain size of 6000 mesh, and the pressure of the fluid polishing apparatus was 120 MPa).
(5) Post-treatment: and (3) blowing gas (nitrogen after precise filtration) into the spinneret body after the fluid polishing treatment.
Example 2
Splitting the spinneret plate module, flushing the base and the cover plate with flowing deionized water, airing for later use, and then cleaning the spinneret plate main body, wherein the method specifically comprises the following steps of:
(1) Pretreatment: removing the skinned solid matter on the surface of the spinneret plate main body.
(2) Cleaning: firstly, immersing a spinneret plate main body in a first cleaning solution (a mixture of 6% sodium carbonate aqueous solution and ethylene glycol in a mass ratio of 1:15), and cleaning under ultrasonic conditions (the temperature is 50 ℃ C., the time is 4 min);
then washing the spinneret plate main body by deionized water, drying, immersing the spinneret plate main body in a second cleaning solution (a mixed solution of N, N-dimethylformamide and N, N-dimethylacetamide in a volume ratio of 1:2), and cleaning under ultrasonic conditions (the temperature is 55 ℃ for 3 min);
the ultrasonic cleaning process of the first cleaning liquid and the second cleaning liquid is repeated for a plurality of times, and then the spinneret plate main body is immersed in the third cleaning liquid (deionized water) and cleaned under the ultrasonic condition (the temperature is 65 ℃ and the time is 4 min).
(3) And (3) drying: purging the cleaned spinneret plate main body with gas (nitrogen after precise filtration), and then drying (the drying temperature is 65 ℃ and the drying time is 20 min);
(4) Fluid polishing treatment: the dried spinneret body was placed in a fluid polishing apparatus (the fluid polishing treatment was performed using abrasive grains having a particle size of 6500 mesh, the pressure of the fluid polishing apparatus was 110 MPa).
(5) Post-treatment: and (3) blowing gas (nitrogen after precise filtration) into the spinneret body after the fluid polishing treatment.
The present invention has been illustrated by the above-described embodiments, but it should be understood that the above-described embodiments are for purposes of illustration and description only and are not intended to limit the invention to the embodiments described. Various modifications and changes of the invention will occur to those skilled in the art, including combinations and rearrangements of the features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method of cleaning a spinneret module, characterized by: the spinneret module comprises a spinneret body, and the cleaning method of the spinneret body comprises the following steps:
(1) Pretreatment: removing skinning solids on the surface of the spinneret plate main body;
(2) Cleaning: immersing the spinneret plate main body in a cleaning liquid, and cleaning under ultrasonic conditions;
(3) And (3) drying: purging the cleaned spinneret plate main body with gas, and then drying;
(4) Fluid polishing treatment: placing the dried spinneret plate main body into fluid polishing equipment for polishing treatment;
(5) Post-treatment: and (3) carrying out gas purging on the spinneret plate main body subjected to the fluid polishing treatment.
2. The method of cleaning a spinneret module as claimed in claim 1, wherein: the cleaning solution comprises a first cleaning solution and a second cleaning solution; in the step (2), the spinneret plate main body is alternately immersed in the first cleaning liquid and the second cleaning liquid for ultrasonic cleaning, drying treatment is carried out after each ultrasonic cleaning, and the ultrasonic cleaning process is circularly carried out for a plurality of times.
3. The method of cleaning a spinneret module as claimed in claim 2, wherein: the first cleaning liquid comprises a mixed liquid of alcohol and alkali, wherein the alcohol is selected from one or more of ethylene glycol, ethanol, triglycol and propylene glycol, and the alkali is selected from one or more of sodium hydroxide aqueous solution, sodium carbonate aqueous solution, sodium phosphate trinna aqueous solution, sodium metasilicate aqueous solution and sodium tripolyphosphate aqueous solution.
4. The method of cleaning a spinneret module as claimed in claim 2, wherein: the second cleaning liquid comprises an organic solvent; the organic solvent is selected from one or more of N, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone and dimethyl sulfoxide.
5. The method of cleaning a spinneret module as claimed in claim 2, wherein: in the step (2), the temperature of the ultrasonic cleaning is 45-75 ℃, and the time of the ultrasonic cleaning is 1-25min.
6. The method of cleaning a spinneret module as claimed in claim 2, wherein: the spinneret plate body is immersed in the third cleaning liquid for ultrasonic cleaning after circulating multi-cleaning ultrasonic cleaning and drying in the first cleaning liquid and the second cleaning liquid.
7. The method of cleaning a spinneret module as claimed in claim 1, wherein: in the step (3), the drying is carried out under the protection of vacuum or nitrogen, the drying temperature is 55-120 ℃, and the drying time is 20-50min.
8. The method of cleaning a spinneret module as claimed in claim 1, wherein: in the step (4), abrasive particles with the particle size of 5500-7000 meshes are adopted for carrying out fluid polishing treatment, and the pressure of fluid polishing equipment is 110-145MPa.
9. The method of cleaning a spinneret module as claimed in claim 1, wherein: in the step (3) and the step (5), nitrogen or inert gas after precise filtration is adopted for gas purging.
10. The method of cleaning a spinneret module as claimed in claim 1, wherein: the spinneret module further comprises a base and a cover plate which are detachably connected with the spinneret body, the spinneret module is detached during cleaning, and then the base and the cover plate are washed with flowing deionized water and then dried.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310330643.1A CN116334770A (en) | 2023-03-30 | 2023-03-30 | Cleaning method of spinneret plate module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310330643.1A CN116334770A (en) | 2023-03-30 | 2023-03-30 | Cleaning method of spinneret plate module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116334770A true CN116334770A (en) | 2023-06-27 |
Family
ID=86892758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310330643.1A Pending CN116334770A (en) | 2023-03-30 | 2023-03-30 | Cleaning method of spinneret plate module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116334770A (en) |
-
2023
- 2023-03-30 CN CN202310330643.1A patent/CN116334770A/en active Pending
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