CN116333498A - High-heat-conductivity wave-absorbing gasket and preparation method thereof - Google Patents
High-heat-conductivity wave-absorbing gasket and preparation method thereof Download PDFInfo
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- CN116333498A CN116333498A CN202211477615.4A CN202211477615A CN116333498A CN 116333498 A CN116333498 A CN 116333498A CN 202211477615 A CN202211477615 A CN 202211477615A CN 116333498 A CN116333498 A CN 116333498A
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 58
- 229920002545 silicone oil Polymers 0.000 claims abstract description 50
- 239000000835 fiber Substances 0.000 claims abstract description 44
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000001257 hydrogen Substances 0.000 claims abstract description 41
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 239000000741 silica gel Substances 0.000 claims abstract description 33
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 33
- 239000006247 magnetic powder Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 29
- 238000005520 cutting process Methods 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000003054 catalyst Substances 0.000 claims abstract description 17
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 17
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 17
- 239000011159 matrix material Substances 0.000 claims abstract description 16
- 239000003112 inhibitor Substances 0.000 claims abstract description 15
- 238000002156 mixing Methods 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 27
- 239000000843 powder Substances 0.000 claims description 16
- 239000011265 semifinished product Substances 0.000 claims description 16
- 239000003963 antioxidant agent Substances 0.000 claims description 11
- 230000003078 antioxidant effect Effects 0.000 claims description 11
- 239000006072 paste Substances 0.000 claims description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000002270 dispersing agent Substances 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 229910008423 Si—B Inorganic materials 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000004634 thermosetting polymer Substances 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 abstract description 11
- 239000003921 oil Substances 0.000 description 35
- 229920000049 Carbon (fiber) Polymers 0.000 description 27
- 239000004917 carbon fiber Substances 0.000 description 27
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- 238000007259 addition reaction Methods 0.000 description 20
- 229910052710 silicon Inorganic materials 0.000 description 20
- 239000010703 silicon Substances 0.000 description 20
- ARLJCLKHRZGWGL-UHFFFAOYSA-N ethenylsilicon Chemical compound [Si]C=C ARLJCLKHRZGWGL-UHFFFAOYSA-N 0.000 description 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 14
- 239000010426 asphalt Substances 0.000 description 10
- 239000011231 conductive filler Substances 0.000 description 7
- 229910052697 platinum Inorganic materials 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 238000011049 filling Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000005300 metallic glass Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004970 Chain extender Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical group C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- BSWXAWQTMPECAK-UHFFFAOYSA-N 6,6-diethyloctyl dihydrogen phosphate Chemical compound CCC(CC)(CC)CCCCCOP(O)(O)=O BSWXAWQTMPECAK-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GTVWRXDRKAHEAD-UHFFFAOYSA-N Tris(2-ethylhexyl) phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OCC(CC)CCCC GTVWRXDRKAHEAD-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- DSVRVHYFPPQFTI-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane;platinum Chemical group [Pt].C[Si](C)(C)O[Si](C)(C=C)C=C DSVRVHYFPPQFTI-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 238000006396 nitration reaction Methods 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 238000006277 sulfonation reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/05—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/01—Magnetic additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a high-heat-conductivity wave-absorbing gasket and a preparation method thereof, wherein the gasket comprises raw materials such as matrix resin, hydrogen-containing silicone oil, metal magnetic powder, fibrous heat-conducting filler, inhibitor, catalyst and the like; the preparation method comprises the following steps: mixing materials: uniformly mixing and stirring vinyl silicone oil, hydrogen-containing silicone oil, inhibitor, catalyst, fiber heat-conducting filler, inorganic heat-conducting filler, metal magnetic powder and other raw materials according to a proportion, and vacuumizing to obtain a mixed material; injecting the mixture into a hollow mold under high shear force, wherein the fibrous heat-conducting filler is oriented along the flowing direction along with the flowing of the matrix resin; and (3) placing the die into a baking oven at 130 ℃ for curing for 10min, and then cutting according to a direction perpendicular to the orientation of the heat conducting fibers to obtain the wave-absorbing high heat conducting silica gel gasket. The gasket prepared by the invention not only has strong electromagnetic wave absorption capacity, but also has high heat conductivity coefficient, and can meet the heat conduction requirement.
Description
Technical Field
The invention belongs to the technical field of preparation of heat-conducting wave-absorbing materials, and particularly relates to a high-heat-conducting wave-absorbing gasket and a preparation method thereof.
Background
In recent years, the design of electronic devices has gradually moved to be light, thin and small, and the functions of the devices have not been reduced. Because of different programming, the energy loss can not be changed too much, whether the equipment heat can be effectively emitted, the running efficiency of the program is directly affected, and the possibility of failure of the electronic element is increased. The heat dissipation method of the electronic device includes a heat sink, a heat dissipation tube, a heat sink or other high heat conduction metal devices such as copper and aluminum. To ensure heat dissipation efficiency, the heat sink is placed as close as possible to the heat generating source of the electronic device (e.g., semiconductor). The heat sink is directly connected to a triggering heat source such as a semiconductor, a gap is formed in the middle, and the semiconductor cannot work normally because air is a poor heat conductor and cannot emit heat. The heat conducting gasket is used as a bridge, has excellent heat conducting performance, and can directly transfer heat emitted by the semiconductor to the radiating fin, so that the heat can be well dissipated.
A heat generator in an electronic device is a semiconductor component having a large current density, and in practice, the large current density is considered to be large in the intensity of an electric field and the intensity of a magnetic field generated by the electronic device. The thermally conductive pad not only absorbs heat, but also receives and dissipates a resonant component emanating from the electronic device. Since the heat sink is made of metal, its function can be seen as an antenna with harmonic components or a path for harmonic noise to propagate. The electronic device will operate normally due to the interference of electromagnetic waves, so that this electromagnetic wave has to be suppressed. To solve this problem, magnetic materials are added to the thermally conductive pad to break the coupling of the magnetic field.
However, the conventional commercially available heat absorbing and conducting gasket has an electromagnetic wave absorbing function, but the heat conductivity in the thickness direction is only 1.5W/mK, and the heat conduction requirement cannot be satisfied.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a high-heat-conductivity wave-absorbing gasket and a preparation method thereof, so that the wave-absorbing heat-absorbing gasket not only has strong electromagnetic wave absorbing capacity, but also has high heat conductivity coefficient, and can meet the heat conduction requirement.
The aim of the invention is realized by the following technical scheme: the high-heat-conductivity wave-absorbing gasket comprises the following raw materials in parts by weight: 10-30% of matrix resin, 1-10% of hydrogen-containing silicone oil, 20-50% of metal magnetic powder, 12-30% of fiber heat-conducting filler, 0.001-0.002% of color paste, 10-30% of inorganic heat-conducting filler, 0-0.005% of antioxidant, 0-0.001% of dispersing agent, 0-0.008% of inhibitor and 0.05-0.1% of catalyst.
The color paste is prepared by grinding pigment powder and silicone oil (with the viscosity of about 100 mPa.s at normal temperature).
The antioxidant is 1010.
The dispersing agent is organic dispersing agent triethyl hexyl phosphate.
The catalyst is a platinum catalyst, and the catalyst is platinum-divinyl tetramethyl disiloxane 3000PPM.
The inhibitor is ethynyl cyclohexanol.
According to the invention, matrix resin is used as a carrier, and the matrix resin is subjected to addition reaction with hydrogen-containing silicone oil (low viscosity, and the addition amount is determined according to the hydrogen content) to obtain the silica gel heat-conducting gasket; in order to improve the heat conducting performance, the heat conducting filler is heated in the reaction process, wherein the heat conducting filler is electrodeless heat conducting filler and fiber heat conducting filler; in order to improve the electromagnetic wave absorption function, metal magnetic powder is added in the reaction process.
Further, an included angle between the orientation direction of the fiber heat conducting filler and the high heat conducting wave absorbing gasket is A, and the A is 0-90 degrees. The smaller the A value is, the higher the heat conductivity coefficient is, and the electromagnetic wave absorption capacity of the gasket is reduced, especially in a low frequency band. The change trend of the heat conductivity and the electromagnetic wave absorptivity caused by the change of the included angle between the orientation direction of the fiber heat conduction filler and the thickness direction of the gasket is as follows:
when the included angle a between the orientation direction of the dimensional heat conducting filler and the thickness direction of the gasket is 0-30 degrees, the heat conductivity coefficient of the heat conducting gasket in the thickness direction can reach more than 5W/(m.K), the electromagnetic wave absorption rate can reach 30% under the condition of 3GHz, and the electromagnetic wave absorption rate can reach 70% under the condition of 6 GHz.
When the included angle a between the orientation direction of the dimensional heat conducting filler and the thickness direction of the gasket is 30-60 degrees, the heat conductivity coefficient of the heat conducting gasket in the thickness direction can reach more than 2.5W/(m.K), the electromagnetic wave absorption rate under the condition of 3GHz can reach 39%, and the electromagnetic wave absorption rate under the condition of 6GHz can reach 70%.
When the included angle a between the orientation direction of the dimensional heat conducting filler and the thickness direction of the gasket is 60-90 degrees, the heat conductivity coefficient of the heat conducting gasket in the thickness direction can reach more than 1.5W/(m.K), the electromagnetic wave absorption rate under the condition of 3GHz can reach 68%, and the electromagnetic wave absorption rate under the condition of 6GHz can reach 70%.
Further, the fiber heat conducting filler is a fibrous or rod-shaped heat conducting filler, a granular heat conducting filler and a sheet heat conducting filler with high aspect ratio; the fibrous heat conductive filler may be any fiber having a heat conductive function. Such materials may be metallic materials such as silver, copper, aluminum, etc., non-metallic materials such as: alumina, aluminum nitride, silicon carbide, graphite, carbon fiber, and the like. Among the above materials, carbon fiber is preferable because it has excellent heat conductive properties. The thermally conductive filler may be a single component or a mixture of multiple components. The type of carbon fiber is selected according to the use, such as pitch carbon fiber, graphitized PBO fiber, polyacrylonitrile carbon fiber, pitch carbon fiber and graphitized PBO fiber are preferable because they have higher thermal conductivity. Before use, the carbon fiber needs to be subjected to surface treatment, wherein the surface treatment comprises oxidation, nitration, sulfonation, metal treatment, metal compound and organic compound treatment, and active groups are connected to the surface of the carbon fiber. Common reactive groups include hydroxyl, carboxyl, carbonyl, nitro and amino groups. The invention adopts a gas phase oxidation method: ozone is introduced into a tube furnace to oxidize at a high temperature of 600 ℃, and oxygen-containing groups are generated on the surface of the carbon fiber.
Further, the length of the fiber heat-conducting filler is 50-300 mu m; in order to ensure a high thermal conductivity, the filler length is preferably 90-250 μm; the diameter of the fiber heat conduction filler is 4-20 mu m; in order to ensure a high thermal conductivity, it is preferably 5 to 14. Mu.m. In order to ensure the thermal conductivity of the carbon fibers, the aspect ratio of the carbon fibers should be greater than 6, preferably between 7 and 30; while improving thermal conductivity is believed to require a small aspect ratio material, the small aspect ratio does not allow the thermally conductive silica gel to have higher characteristics, such as affecting orientation; on the other hand, carbon fibers with the length-diameter ratio higher than 30 are not easy to disperse in the polymer, and the heat conducting performance of the heat absorbing and conducting gasket is also affected, so that the length-diameter ratio of the fiber heat conducting filler is 7-30.
Further, the matrix resin is a thermosetting polymer, and the thermosetting polymer is any one or more of crosslinked rubber, epoxy resin, polyimide resin, bismaleimide resin and vinyl silicone oil; the cross-linked rubber can be any one or more of natural rubber, butadiene rubber, butyl rubber, styrene-butadiene rubber and nitrile rubber.
Further, the matrix resin is vinyl silicone oil, has excellent processability, weather resistance, adhesiveness and electronic element compliance, and has stronger filler absorption capacity, for example, the vinyl silicone oil with medium and low viscosity and the hydrogen-containing silicone oil with low viscosity undergo an addition reaction to obtain the silica gel heat-conducting gasket.
Further, the metal magnetic powder is any one or more of spherical, elliptic, flat and needle-shaped, preferably spherical and elliptic, and the electrodeless heat-conducting filler is any one or more of aluminum nitride, aluminum oxide, silicon dioxide and zinc oxide particles.
Further, the metal magnetic powder is amorphous metal powder and is any one of Fe-Si-B-Cr, fe-Si-B, co-Si-B, co-Zr, co-Nb and Co-Ta systems; the metal magnetic powder can improve the electromagnetic wave absorption function of the gasket, can be any metal powder with electromagnetic wave absorbability, and can be amorphous metal powder and crystal metal powder, and the amorphous metal powder (with Antai technology Co., ltd.) is preferable, and N, O, C, si and other elements are added in the crystallization process.
In order to increase the filling amount of the magnetic metal powder, a spherical metal powder of several micrometers to several tens micrometers is selected. The magnetic metal powder is obtained by atomizing or thermally decomposing metal carbonyl powder. The atomization method easily gives spherical powder, and when molten metal flows out from a nozzle, steam, air, water or inert gas is blown thereto, and the metal forms droplets, which solidify into spherical powder after cooling. The spherical powder is produced by the atomization method, and the cooling rate is required to be adjusted to 106 (K/s) to prevent crystallization of the metal. The amorphous alloy powder produced by the atomization method has smooth powder surface, less surface irregularity and small specific surface area, and can increase the filling amount in the silica gel. The metal magnetic powder is treated by a coupling agent, so that the filling amount of the metal magnetic powder in the silica gel is further increased.
Further, the diameter of the inorganic heat conducting filler is 1-10 mu m; preferably 4-5 μm. Fillers below 1 μm have a too great viscosity increase during processing and are difficult to mix and stir. The filler with the diameter higher than 10 mu m has obviously improved heat conduction performance and heat resistance; the metal magnetic powder can be any one or more of aluminum nitride, aluminum oxide, silicon dioxide and zinc oxide particles; aluminum oxide and aluminum nitride are preferred.
A preparation method of a high-heat-conductivity wave-absorbing gasket comprises the following steps:
s1, mixing materials: mixing and stirring matrix resin, hydrogen-containing silicone oil, metal magnetic powder, fiber heat-conducting filler, inorganic heat-conducting filler, color paste, antioxidant, dispersing agent, flame retardant, stabilizer, inhibitor and catalyst according to a proportion uniformly, and vacuumizing to obtain a mixed material, wherein the vacuum degree of the mixed material is 0.9MPa;
s2, orientation of heat conducting fiber
Injecting the mixture into a hollow mold by extrusion or injection molding under high shear force, wherein the fibrous heat-conducting filler is oriented along the flowing direction along with the flowing of the matrix resin; the die lip of the die is provided with a gap, so that the orientation effect is better;
s3, solidifying
Placing the die into an oven at 110-130 ℃ for curing for 10min to obtain a semi-finished product of the heat absorbing silica gel;
s4, cutting out
And cutting the wave-absorbing thermal silica gel semi-finished product according to a direction perpendicular to the orientation of the thermal conductive fibers to obtain the wave-absorbing high thermal conductive silica gel gasket.
According to the invention, vinyl silicone oil is used as matrix resin, hydrogen-containing silicone oil is used as a chain extender and a cross-linking agent, metal magnetic powder, fiber heat-conducting filler, inhibitor and catalyst are added for mixing, then heat-conducting fibers are oriented in a certain direction, and finally the high heat-conducting wave-absorbing gasket is obtained by solidification and cutting, wherein the thickness of the high heat-conducting wave-absorbing gasket is 0.5-5mm. In the curing process, the temperature reduction needs to prolong the curing time, the curing temperature in the invention is not lower than 110 ℃, the reaction of the heat conduction silica gel is incomplete below the curing temperature, and the heat conduction silica gel is cured above 130 ℃, so that the elasticity of the heat conduction silica gel is affected.
The beneficial effects of the invention are as follows: according to the invention, vinyl silicone oil is used as matrix resin, hydrogen-containing silicone oil is used as a chain extender and a cross-linking agent, metal magnetic powder, electrodeless heat conducting filler, fibrous heat conducting filler, inhibitor and catalyst are added for mixing, then heat conducting fibers are oriented in a certain direction, and finally the high heat conducting wave absorbing gasket is obtained by solidification and cutting, so that the prepared gasket has good heat conducting performance and good electromagnetic wave absorbing performance.
Detailed Description
The technical scheme of the present invention is described in further detail below with reference to examples, but the scope of the present invention is not limited to the following.
Example 1
A method for preparing the high thermal conductivity wave absorbing pad of claim 1, comprising the steps of:
s1, mixing materials:
dispersing Fe-Si-B-Cr amorphous soft metal magnetic powder and asphalt carbon fiber into double-component silicone oil capable of undergoing an addition reaction to obtain a mixed material, wherein the double-component silicone oil capable of undergoing an addition reaction comprises 20 percent (wherein, vinyl silicone oil is 18 percent, hydrogen-containing silicone oil is 2 percent), 45 percent of magnetic powder, 24.918 percent of carbon fiber, 10 percent of inorganic heat conducting filler, 0.07 percent of platinum catalyst, 0.005 percent of inhibitor, 0.002 percent of color paste and 0.005 percent of antioxidant; the average grain diameter of the Fe-Si-B-Cr amorphous soft magnetic powder is 5 mu m, and the fiber length of the asphalt carbon fiber is 200 mu m; the silicon oil capable of undergoing addition reaction in two components is vinyl silicon oil and hydrogen-containing silicon oil, the viscosity of the vinyl silicon oil is 1000 mPas, the hydrogen content of the hydrogen-containing silicon oil is 18%, the viscosity is 30 mPas, and the mass percentage of the vinyl silicon oil to the hydrogen-containing silicon oil is 9:1;
s2, orientation of the heat conducting fibers:
extruding the mixed material into a 30 x 30 cube mould, wherein the inner wall of the mould is covered with PET anti-sticking film; the fibrous thermally conductive filler is oriented along the direction of flow;
s3, curing:
placing the die into a baking oven at 130 ℃ for curing for 10min to obtain a semi-finished product of the heat absorbing silica gel;
s4, cutting:
cutting the semi-finished product of the wave-absorbing thermal silica gel by an ultrasonic cutting machine according to the direction perpendicular to the orientation direction to obtain a wave-absorbing high-thermal-conductivity silica gel gasket with the thickness of 1 mm; at this time, the angle between the orientation direction of the heat conducting fiber and the thickness direction of the heat pad is A:0 deg..
Example 2
A method for preparing the high thermal conductivity wave absorbing pad of claim 1, comprising the steps of:
s1, mixing materials:
dispersing Fe-Si-B-Cr amorphous soft metal magnetic powder and asphalt carbon fiber into double-component silicone oil capable of undergoing an addition reaction to obtain a mixed material, wherein the double-component silicone oil capable of undergoing an addition reaction comprises 20 percent (wherein 18 percent of vinyl silicone oil and 2 percent of hydrogen-containing silicone oil), 45 percent of magnetic powder, 24.918 percent of carbon fiber, 10 percent of inorganic heat conducting filler, 0.07 percent of platinum catalyst, 0.005 percent of inhibitor, 0.002 percent of color paste and 0.005 percent of antioxidant; the average grain diameter of the Fe-Si-B-Cr amorphous soft magnetic powder is 5 mu m, and the fiber length of the asphalt carbon fiber is 200 mu m; the silicon oil capable of undergoing addition reaction in two components is vinyl silicon oil and hydrogen-containing silicon oil, the viscosity of the vinyl silicon oil is 1000 mPas, the hydrogen content of the hydrogen-containing silicon oil is 18%, the viscosity is 30 mPas, and the mass percentage of the vinyl silicon oil to the hydrogen-containing silicon oil is 9:1;
s2, orientation of the heat conducting fibers:
extruding the mixed material into a 30 x 30 cube mould, wherein the inner wall of the mould is covered with PET anti-sticking film; the fibrous thermally conductive filler is oriented along the direction of flow;
s3, curing:
placing the die into a baking oven at 130 ℃ for curing for 10min to obtain a semi-finished product of the heat absorbing silica gel;
s4, cutting:
cutting the semi-finished product of the wave-absorbing high-heat-conductivity silica gel by using an ultrasonic cutting machine according to an angle of 60 degrees between a cutter and an orientation direction to obtain a wave-absorbing high-heat-conductivity silica gel gasket with the thickness of 1 mm; at this time, the angle between the orientation direction of the heat conducting fiber and the thickness direction of the heat pad is A:30 deg..
Example 3
A method for preparing the high thermal conductivity wave absorbing pad of claim 1, comprising the steps of:
s1, mixing materials:
dispersing Fe-Si-B-Cr amorphous soft metal magnetic powder and asphalt carbon fiber into double-component silicone oil capable of undergoing an addition reaction to obtain a mixed material, wherein the double-component silicone oil capable of undergoing an addition reaction comprises 20 percent (wherein 18 percent of vinyl silicone oil and 2 percent of hydrogen-containing silicone oil), 45 percent of magnetic powder, 24.918 percent of carbon fiber, 10 percent of inorganic heat conducting filler, 0.07 percent of platinum catalyst, 0.005 percent of inhibitor, 0.002 percent of color paste and 0.005 percent of antioxidant; the average grain diameter of the Fe-Si-B-Cr amorphous soft magnetic powder is 5 mu m, and the fiber length of the asphalt carbon fiber is 200 mu m; the silicon oil capable of undergoing addition reaction in two components is vinyl silicon oil and hydrogen-containing silicon oil, the viscosity of the vinyl silicon oil is 1000 mPas, the hydrogen content of the hydrogen-containing silicon oil is 18%, the viscosity is 30 mPas, and the mass percentage of the vinyl silicon oil to the hydrogen-containing silicon oil is 9:1;
s2, orientation of the heat conducting fibers:
extruding the mixed material into a 30 x 30 cube mould, wherein the inner wall of the mould is covered with PET anti-sticking film; the fibrous thermally conductive filler is oriented along the direction of flow;
s3, curing:
placing the die into a baking oven at 130 ℃ for curing for 10min to obtain a semi-finished product of the heat absorbing silica gel;
s4, cutting:
cutting the semi-finished product of the wave-absorbing high-heat-conductivity silica gel by using an ultrasonic cutting machine according to an angle of 45 degrees between a cutter and an orientation direction to obtain a wave-absorbing high-heat-conductivity silica gel gasket with the thickness of 1 mm; at this time, the angle between the orientation direction of the heat conducting fiber and the thickness direction of the heat pad is A:45 deg..
Example 4
A method for preparing the high thermal conductivity wave absorbing pad of claim 1, comprising the steps of:
s1, mixing materials:
dispersing Fe-Si-B-Cr amorphous soft metal magnetic powder and asphalt carbon fiber into double-component silicone oil capable of undergoing an addition reaction to obtain a mixed material, wherein the double-component silicone oil capable of undergoing an addition reaction comprises 20 percent (wherein 18 percent of vinyl silicone oil, 2 percent of hydrogen-containing silicone oil), 45 percent of magnetic powder, 24.918 percent of carbon fiber, 10 percent of inorganic heat conducting filler, 0.07 percent of platinum catalyst, 0.004 percent of inhibitor, 0.001 percent of triethylhexyl phosphoric acid, 0.002 percent of color paste and 0.005 percent of antioxidant; the average grain diameter of the Fe-Si-B-Cr amorphous soft magnetic powder is 5 mu m, and the fiber length of the asphalt carbon fiber is 200 mu m; the silicon oil capable of undergoing addition reaction in two components is vinyl silicon oil and hydrogen-containing silicon oil, the viscosity of the vinyl silicon oil is 1000 mPas, the hydrogen content of the hydrogen-containing silicon oil is 18%, the viscosity is 30 mPas, and the mass percentage of the vinyl silicon oil to the hydrogen-containing silicon oil is 9:1;
s2, orientation of the heat conducting fibers:
extruding the mixed material into a 30 x 30 cube mould, wherein the inner wall of the mould is covered with PET anti-sticking film; the fibrous thermally conductive filler is oriented along the direction of flow;
s3, curing:
placing the die into a baking oven at 130 ℃ for curing for 10min to obtain a semi-finished product of the heat absorbing silica gel;
s4, cutting:
cutting the semi-finished product of the wave-absorbing high-heat-conductivity silica gel by using an ultrasonic cutting machine according to an angle of 30 degrees between a cutter and an orientation direction to obtain a wave-absorbing high-heat-conductivity silica gel gasket with the thickness of 1 mm; at this time, the angle between the orientation direction of the heat conducting fiber and the thickness direction of the heat pad is A:60 deg..
Comparative example 1
A method for preparing the high thermal conductivity wave absorbing pad of claim 1, comprising the steps of:
s1, mixing materials:
dispersing inorganic heat-conducting filler and asphalt carbon fiber into double-component silicone oil capable of undergoing an addition reaction to obtain a mixed material, wherein the double-component silicone oil capable of undergoing an addition reaction comprises 20 percent (wherein 18 percent of vinyl silicone oil and 2 percent of hydrogen-containing silicone oil), 55 percent of inorganic heat-conducting filler, 24.918 percent of carbon fiber, 0.07 percent of platinum catalyst, 0.005 percent of inhibitor, 0.002 percent of color paste and 0.005 percent of antioxidant; the inorganic heat conduction filler is alumina with the average particle diameter of 20 mu m, and the fiber length of the asphalt carbon fiber is 200 mu m; the silicon oil capable of undergoing addition reaction in two components is vinyl silicon oil and hydrogen-containing silicon oil, the viscosity of the vinyl silicon oil is 1000 mPas, the hydrogen content of the hydrogen-containing silicon oil is 18%, the viscosity is 30 mPas, and the mass percentage of the vinyl silicon oil to the hydrogen-containing silicon oil is 9:1;
s2, orientation of the heat conducting fibers:
extruding the mixed material into a 30 x 30 cube mould, wherein the inner wall of the mould is covered with PET anti-sticking film; the fibrous thermally conductive filler is oriented along the direction of flow;
s3, curing:
placing the die into a baking oven at 130 ℃ for curing for 10min to obtain a semi-finished product of the heat absorbing silica gel;
s4, cutting:
cutting the semi-finished product of the wave-absorbing thermal silica gel by an ultrasonic cutting machine according to the direction perpendicular to the orientation direction to obtain a wave-absorbing high-thermal-conductivity silica gel gasket with the thickness of 1 mm; at this time, the angle between the orientation direction of the heat conducting fiber and the thickness direction of the heat pad is A:0 deg..
Comparative example 2
A method for preparing the high thermal conductivity wave absorbing pad of claim 1, comprising the steps of:
s1, mixing materials:
dispersing metal magnetic powder and inorganic heat-conducting filler into double-component silicone oil capable of undergoing an addition reaction to obtain a mixed material, wherein the double-component silicone oil capable of undergoing an addition reaction comprises 20 percent (wherein 18 percent of vinyl silicone oil, 2 percent of hydrogen-containing silicone oil), 45 percent of magnetic powder, 34.918 percent of inorganic heat-conducting filler, 0.07 percent of platinum catalyst, 0.005 percent of inhibitor, 0.002 percent of color paste and 0.005 percent of antioxidant; the metal magnetic powder is alumina with an average particle diameter of 20 mu m, the two-component addition-reaction silicone oil is vinyl silicone oil and hydrogen-containing silicone oil, the viscosity of the vinyl silicone oil is 1000 mPas, the hydrogen content of the hydrogen-containing silicone oil is 18%, the viscosity is 30 mPas, and the mass percentage of the vinyl silicone oil to the hydrogen-containing silicone oil is 9:1;
s2, filling the mixed materials:
extruding the mixed material into a 30 x 30 cube mould, wherein the inner wall of the mould is covered with PET anti-sticking film;
s3, curing:
placing the die into a baking oven at 130 ℃ for curing for 10min to obtain a semi-finished product of the heat absorbing silica gel;
s4, cutting:
cutting the semi-finished product of the wave-absorbing thermal silica gel by an ultrasonic cutting machine according to the direction perpendicular to the orientation direction to obtain a wave-absorbing high-thermal-conductivity silica gel gasket with the thickness of 1 mm; at this time, the angle between the orientation direction of the heat conducting fiber and the thickness direction of the heat pad is A:0 deg..
Performance tests were performed on the gaskets prepared in examples and comparative examples, and the test results are shown in table 1.
Table 1:
as can be seen from Table 1, the gasket prepared by the invention has higher heat conductivity, better heat conduction performance and good electromagnetic wave absorptivity.
The foregoing is merely a preferred embodiment of the invention, and it is to be understood that the invention is not limited to the form disclosed herein but is not to be construed as excluding other embodiments, but is capable of numerous other combinations, modifications and environments and is capable of modifications within the scope of the inventive concept, either as taught or as a matter of routine skill or knowledge in the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (10)
1. The high-heat-conductivity wave-absorbing gasket is characterized by comprising the following raw materials in percentage by mass: 10-30% of matrix resin, 1-10% of hydrogen-containing silicone oil, 20-50% of metal magnetic powder, 12-30% of fiber heat-conducting filler, 0.001-0.002% of color paste, 10-30% of inorganic heat-conducting filler, 0-0.005% of antioxidant, 0-0.001% of dispersing agent, 0-0.008% of inhibitor and 0.05-0.1% of catalyst.
2. The method for preparing the high-heat-conductivity wave-absorbing gasket according to claim 1, wherein the method comprises the following steps: the included angle between the orientation direction of the fiber heat conducting filler and the thickness direction of the high heat conducting wave absorbing gasket is A, and the A is 0-90 degrees.
3. The method for preparing the high-heat-conductivity wave-absorbing gasket according to claim 2, wherein the method comprises the following steps: the fiber heat conducting filler is fiber-shaped or bar-shaped heat conducting filler, granular heat conducting filler and sheet-shaped heat conducting filler with high aspect ratio.
4. The method for preparing the high-heat-conductivity wave-absorbing gasket according to claim 3, wherein the method comprises the following steps: the length of the fiber heat-conducting filler is 50-300 mu m; the diameter of the fiber heat conduction filler is 4-20 mu m; the length-diameter ratio of the fiber heat-conducting filler is 7-30.
5. The method for preparing the high-heat-conductivity wave-absorbing gasket according to claim 1, wherein the method comprises the following steps: the matrix resin is a thermosetting polymer, and the thermosetting polymer is any one or more of crosslinked rubber, epoxy resin, polyimide resin, bismaleimide resin and vinyl silicone oil.
6. The method for preparing the high-heat-conductivity wave-absorbing gasket according to claim 5, wherein the method comprises the following steps: the matrix resin is vinyl silicone oil.
7. The method for preparing the high-heat-conductivity wave-absorbing gasket according to claim 1, wherein the method comprises the following steps: any one or more of spherical, elliptic, flat and needle-shaped metal magnetic powder; any one or more of aluminum nitride, aluminum oxide, silicon dioxide and zinc oxide particles serving as the electrodeless heat-conducting filler.
8. The method for preparing the high-heat-conductivity wave-absorbing gasket according to claim 7, wherein the method comprises the following steps: the metal magnetic powder is microcrystalline metal powder and is any one of Fe-Si-B-Cr, fe-Si-B, co-Si-B, co-Zr, co-Nb and Co-Ta systems.
9. The method for preparing the high-heat-conductivity wave-absorbing gasket according to claim 8, wherein the method comprises the following steps: the diameter of the inorganic heat conducting filler is 1-10 mu m.
10. A method for preparing the high thermal conductivity wave absorbing pad according to claim 1, comprising the steps of:
s1, mixing materials: mixing and stirring matrix resin, hydrogen-containing silicone oil, metal magnetic powder, fiber heat-conducting filler, inorganic heat-conducting filler, color paste, antioxidant, dispersing agent, flame retardant, stabilizer, inhibitor and catalyst according to a proportion uniformly, and vacuumizing to obtain a mixed material;
s2, orientation of heat conducting fiber
Injecting the mixture into a hollow mold under high shear force, wherein the fibrous heat-conducting filler is oriented along the flowing direction along with the flowing of the matrix resin;
s3, solidifying
Placing the die into an oven at 110-130 ℃ for curing for 10min to obtain a semi-finished product of the heat absorbing silica gel;
s4, cutting out
And cutting the wave-absorbing thermal silica gel semi-finished product according to a direction perpendicular to the orientation of the thermal conductive fibers to obtain the wave-absorbing high thermal conductive silica gel gasket.
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Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1132739A (en) * | 1979-04-06 | 1982-09-28 | General Electric Company | Self-bonding silicone rubber compositions |
| WO2007121353A1 (en) * | 2006-04-13 | 2007-10-25 | The Regents Of The University Of California | Mesostructured inorganic materials prepared with controllable orientational ordering |
| US20100116527A1 (en) * | 2008-11-12 | 2010-05-13 | Khosla Ajit | Electrically conductive, thermosetting elastomeric material and uses therefor |
| WO2014092196A1 (en) * | 2012-12-11 | 2014-06-19 | 東レ・ダウコーニング株式会社 | High-refractive index heat-conductive composition of exceptional transparence, heat-conductive grease comprising same, cured heat-conductive material, thermal-softening heat-conductive composition, and applications for same |
| CN105647191A (en) * | 2016-04-01 | 2016-06-08 | 平湖阿莱德实业有限公司 | Flexible heat conduction interface material with wave absorbing function and preparation method thereof |
| CN110730607A (en) * | 2019-10-16 | 2020-01-24 | 深圳市飞鸿达科技有限公司 | Heat-conducting wave-absorbing insulating sheet with high heat-conducting performance and preparation method thereof |
| CN110740629A (en) * | 2019-10-16 | 2020-01-31 | 深圳市飞鸿达科技有限公司 | oriented heat conduction wave absorption plate and preparation method thereof |
| CN111303642A (en) * | 2019-11-26 | 2020-06-19 | 东莞市美庆电子科技有限公司 | Low-thermal-resistance phase-change heat conduction material and preparation method thereof |
| CN111423729A (en) * | 2020-05-13 | 2020-07-17 | 江苏雷兹盾材料科技有限公司 | Solvent-free high-thermal-conductivity wave-absorbing magnetic silicone rubber and preparation method thereof |
| CN112143239A (en) * | 2020-10-14 | 2020-12-29 | 深圳市飞荣达科技股份有限公司 | Broadband heat-conducting wave-absorbing gasket and preparation method thereof |
| CN112203487A (en) * | 2020-09-21 | 2021-01-08 | 深圳市鸿富诚屏蔽材料有限公司 | Heat-conducting wave-absorbing composite material and preparation method thereof |
| CN114106564A (en) * | 2021-11-17 | 2022-03-01 | 深圳市鸿富诚屏蔽材料有限公司 | Oriented heat-conducting gel, preparation method and application thereof |
| WO2022083110A1 (en) * | 2020-10-20 | 2022-04-28 | 南方科技大学 | Fabrication method for fabricating longitudinal high-thermal-conductivity gasket using controllable compression deformation-oriented carbon fiber |
| WO2022140877A1 (en) * | 2020-12-28 | 2022-07-07 | 广州市白云化工实业有限公司 | Addition-type silicone rubber having high adhesive strength and preparation method therefor |
| CN115073923A (en) * | 2022-08-02 | 2022-09-20 | 深圳联腾达科技有限公司 | Low-specific-gravity high-heat-conductivity wave-absorbing gasket and preparation method thereof |
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1132739A (en) * | 1979-04-06 | 1982-09-28 | General Electric Company | Self-bonding silicone rubber compositions |
| WO2007121353A1 (en) * | 2006-04-13 | 2007-10-25 | The Regents Of The University Of California | Mesostructured inorganic materials prepared with controllable orientational ordering |
| US20100116527A1 (en) * | 2008-11-12 | 2010-05-13 | Khosla Ajit | Electrically conductive, thermosetting elastomeric material and uses therefor |
| WO2014092196A1 (en) * | 2012-12-11 | 2014-06-19 | 東レ・ダウコーニング株式会社 | High-refractive index heat-conductive composition of exceptional transparence, heat-conductive grease comprising same, cured heat-conductive material, thermal-softening heat-conductive composition, and applications for same |
| CN105647191A (en) * | 2016-04-01 | 2016-06-08 | 平湖阿莱德实业有限公司 | Flexible heat conduction interface material with wave absorbing function and preparation method thereof |
| CN110740629A (en) * | 2019-10-16 | 2020-01-31 | 深圳市飞鸿达科技有限公司 | oriented heat conduction wave absorption plate and preparation method thereof |
| CN110730607A (en) * | 2019-10-16 | 2020-01-24 | 深圳市飞鸿达科技有限公司 | Heat-conducting wave-absorbing insulating sheet with high heat-conducting performance and preparation method thereof |
| CN111303642A (en) * | 2019-11-26 | 2020-06-19 | 东莞市美庆电子科技有限公司 | Low-thermal-resistance phase-change heat conduction material and preparation method thereof |
| CN111423729A (en) * | 2020-05-13 | 2020-07-17 | 江苏雷兹盾材料科技有限公司 | Solvent-free high-thermal-conductivity wave-absorbing magnetic silicone rubber and preparation method thereof |
| CN112203487A (en) * | 2020-09-21 | 2021-01-08 | 深圳市鸿富诚屏蔽材料有限公司 | Heat-conducting wave-absorbing composite material and preparation method thereof |
| CN112143239A (en) * | 2020-10-14 | 2020-12-29 | 深圳市飞荣达科技股份有限公司 | Broadband heat-conducting wave-absorbing gasket and preparation method thereof |
| WO2022083110A1 (en) * | 2020-10-20 | 2022-04-28 | 南方科技大学 | Fabrication method for fabricating longitudinal high-thermal-conductivity gasket using controllable compression deformation-oriented carbon fiber |
| WO2022140877A1 (en) * | 2020-12-28 | 2022-07-07 | 广州市白云化工实业有限公司 | Addition-type silicone rubber having high adhesive strength and preparation method therefor |
| CN114106564A (en) * | 2021-11-17 | 2022-03-01 | 深圳市鸿富诚屏蔽材料有限公司 | Oriented heat-conducting gel, preparation method and application thereof |
| CN115073923A (en) * | 2022-08-02 | 2022-09-20 | 深圳联腾达科技有限公司 | Low-specific-gravity high-heat-conductivity wave-absorbing gasket and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| LIU, WY，等: "The attenuation of poly(dimethylsiloxane) film to surface acoustic wave on a piezoelectric substrate", FERROELECTRICS, vol. 493, no. 01, 31 December 2016 (2016-12-31), pages 62 - 68 * |
| 王红玉，等: "高性能有机硅导热材料的制备与研究", 有机硅材料, no. 02, 25 March 2017 (2017-03-25), pages 82 - 85 * |
| 邹海仲，等: "复合粉体制备导热吸波材料及其表征", 高分子材料科学与工程, vol. 35, no. 02, 31 December 2019 (2019-12-31), pages 136 - 140 * |
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