CN116329775A - Dual laser processing device - Google Patents

Dual laser processing device Download PDF

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Publication number
CN116329775A
CN116329775A CN202310162904.3A CN202310162904A CN116329775A CN 116329775 A CN116329775 A CN 116329775A CN 202310162904 A CN202310162904 A CN 202310162904A CN 116329775 A CN116329775 A CN 116329775A
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CN
China
Prior art keywords
driving
driving structure
laser unit
nut
workpiece
Prior art date
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Pending
Application number
CN202310162904.3A
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Chinese (zh)
Inventor
闵飞虎
杨东恒
钱代数
李亚强
陆家钿
曾超峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Original Point Intelligent Technology Co Ltd
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Guangdong Original Point Intelligent Technology Co Ltd
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Publication date
Application filed by Guangdong Original Point Intelligent Technology Co Ltd filed Critical Guangdong Original Point Intelligent Technology Co Ltd
Priority to CN202310162904.3A priority Critical patent/CN116329775A/en
Publication of CN116329775A publication Critical patent/CN116329775A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention relates to the technical field of laser processing, and particularly discloses a double-laser processing device. The application provides a pair of dual laser processingequipment only sets up first rotating structure and mount pad on first drive structure, when placing the work piece of big quality on the mount pad, the required load that bears of first drive structure reduces, and then makes the required volume of first drive structure reduce. Meanwhile, the motion of the workpiece in the X-axis direction is converted into the motion of the first laser unit and the second laser unit in the X-axis direction, and meanwhile, the third driving structure and the fourth driving structure move smoothly, and the integral load of the third driving structure and the fourth driving structure is smaller, so that the integral size of the device is greatly reduced.

Description

Dual laser processing device
Technical Field
The invention relates to the technical field of laser processing, in particular to a double-laser processing device.
Background
Laser processing apparatuses are widely used in various fields due to their own superior processing efficiency and processing accuracy. When the high-power density laser beam irradiates the processed material, the processed material is heated to vaporization temperature quickly, and is evaporated to form holes, and along with the movement of the beam to the material, the holes continuously form slits with very narrow width (such as about 0.1 mm), so that the processing of the material is completed.
When machining some more complex workpieces, two laser heads are typically required to machine the workpiece. One laser head is responsible for rough machining, and the laser of rough machining can move at a faster speed to guarantee machining efficiency. The other laser head is responsible for finish machining, and the laser of finish machining needs to move at a slower speed, so that the precision of laser machining is guaranteed.
All disclose a device that processes the work piece through two laser heads in the application files of patent number CN110883420B and application number CN215919426U, wherein through manipulator centre gripping work piece in one kind application file, the below of work piece is provided with two transmission rails in another application file, and foretell two kinds of devices are when the big quality work piece of centre gripping, or the dead weight of big quality work piece can't be born to the manipulator, or for the quality of bearing big quality work piece, the volume setting of self transmission rail is too big, leads to the holistic area of occupation of device too big.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
The invention discloses a double-laser processing device which is used for solving the problem that the existing laser processing equipment cannot process a large-quality workpiece conveniently.
In order to achieve the above purpose, the invention adopts the following technical scheme:
a dual laser processing apparatus comprising:
a bed body;
the first driving structure is arranged on the lathe bed and used for driving the workpiece to move along the Y axis;
the first rotating structure is arranged at the output end of the first driving structure and is used for driving the workpiece to rotate around the C axis;
the mounting seat is used for mounting a workpiece and is mounted on the output end of the first rotating structure;
the frame is arranged on the top surface of the lathe bed, the frame is a door-shaped frame, and the first driving structure is arranged at the lower opening of the frame;
a first laser unit and a second laser unit;
the beam is used for installing the first laser unit and the second laser unit;
the second driving structure is arranged on the frame and used for driving the cross beam to move along the Z axis;
the third driving structure is arranged on the cross beam and used for driving the first laser unit to move along the X axis;
and the fourth driving structure is arranged on the cross beam and used for driving the second laser unit to move along the X axis.
Preferably, the dual laser processing device further comprises a second rotating structure and a third rotating structure, wherein the second rotating structure is arranged at the output end of the third driving structure and is used for driving the first laser unit to rotate around the B1 axis; the third rotating structure is arranged at the output end of the fourth driving structure and is used for driving the second laser unit to rotate around the B2 shaft.
Preferably, the second driving structure is a screw rod structure.
Preferably, two second driving structures are provided, and the two second driving structures are provided at two sides of the first driving structure.
Preferably, the third driving structure and the fourth driving structure are both screw rod structures.
Preferably, the third driving structure is disposed at both ends of the cross beam opposite to the fourth driving structure.
Preferably, a first sliding rail is arranged on the lathe bed, a first sliding block is arranged at the bottom of the first driving structure, and the first sliding block is connected with the first sliding rail in a sliding manner;
the frame is provided with a second sliding rail, the cross beam is provided with a second sliding block, and the second sliding block is connected with the second sliding rail in a sliding way.
Preferably, a third sliding rail is arranged on the cross beam, a third sliding block is arranged on the second rotating structure, a fourth sliding block is arranged on the third rotating structure, and the third sliding block and the fourth sliding block are both in sliding connection with the third sliding rail.
Preferably, the device further comprises a nut, the nut is mounted on the cross beam, the nut is in threaded connection with the output end of the second driving structure, the nut is a long nut, a flow passage is formed in the nut in a hollow mode, a water inlet and a water outlet are formed in the flow passage on the nut, and the water inlet and the water outlet are both formed in the side wall of the nut.
Preferably, the flow passage surrounds the nut.
Compared with the prior art, the invention has the beneficial effects that:
according to the double-laser processing device provided by the invention, the second driving structure is arranged above the workpiece, so that the first driving structure only bears the load of the mounting seat, the first rotating structure and the weight of the workpiece, the load borne by the first driving structure is reduced, and the volume of the first driving structure is greatly reduced. Meanwhile, the motion of the workpiece in the X-axis direction is converted into the motion of the first laser unit and the second laser unit in the X-axis direction, and meanwhile, the third driving structure and the fourth driving structure move smoothly, and the integral load of the third driving structure and the fourth driving structure is smaller, so that the integral size of the device is greatly reduced. The first laser unit and the second laser unit are arranged on the same cross beam, so that the movement range of the first laser unit and the movement range of the second laser unit are enlarged, and the workpiece can be machined more conveniently.
Drawings
FIG. 1 is a schematic diagram of a dual laser processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a dual laser processing apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a second driving structure according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a beam provided with a first laser unit and a second laser unit according to an embodiment of the present invention;
FIG. 5 is an exploded view of FIG. 4;
FIG. 6 is a schematic structural view of a beam according to an embodiment of the present invention;
FIG. 7 is a schematic view of a beam according to an embodiment of the present invention;
FIG. 8 is an exploded view of FIG. 7;
fig. 9 is an enlarged view of the a portion structure of fig. 1;
FIG. 10 is a schematic diagram of a slider according to an embodiment of the present invention;
FIG. 11 is a schematic view of a nut according to an embodiment of the present invention;
FIG. 12 is a schematic view of a flow channel according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of a flow channel according to an embodiment of the present invention.
Description of main reference numerals: 1-mount, 2-workpiece, 3-laser generator, 4-first laser unit, 5-second laser unit, 10-lathe bed, 11-first slide rail, 20-frame, 21-mounting hole, 22-second slide rail, 30-crossbeam, 31-third slide rail, 40-first drive structure, 41-first motor, 42-first lead screw, 43-first placement seat, 44-first slider, 50-first rotating structure, 60-second drive structure, 61-second motor, 62-second lead screw, 63-nut, 631-water inlet, 632-water outlet, 633-runner, 64-stopper, 65-second slider, 70-third drive structure, 71-third motor, 72-third lead screw, 73-second placement seat, 74-third slider, 80-fourth drive structure, 81-fourth motor, 82-fourth lead screw, 83-third placement seat, 84-fourth slider, 90 a-second rotating structure, 90 b-third rotating structure.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present invention and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.
Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present invention will be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish between different devices, elements, or components (the particular species and configurations may be the same or different), and are not used to indicate or imply the relative importance and number of devices, elements, or components indicated. Unless otherwise indicated, the meaning of "a plurality" is two or more.
The technical scheme of the invention will be further described with reference to the examples and the accompanying drawings.
Examples
When some more complicated workpieces are machined, the laser machining device is usually required to machine the workpieces through two laser units, one laser unit is responsible for rough machining so that the workpiece machining efficiency is high, and the other laser unit is responsible for finish machining, so that the workpieces can be machined quickly and simultaneously with certain precision.
In the application documents of patent numbers CN110883420B and CN215919426U, a laser processing device for processing a workpiece by two laser units is disclosed, in which, in one application document, the workpiece is clamped by a manipulator, and in the other application document, two transmission rails are arranged below the workpiece, and when the workpiece with large mass is clamped by the two devices, the manipulator cannot bear the dead weight of the workpiece with large mass, or bear the mass of the workpiece with large mass, and the volume of the transmission rail is set too large, so that the whole occupation area of the device is too large.
The present application thus provides a dual laser processing apparatus that sets the first rotating structure 50 and the mount 1 only on the first driving structure 40, and when the large-mass workpiece 2 is placed on the mount 1, the load that the first driving structure 40 needs to bear is reduced, so that the volume that the first driving structure 40 needs is reduced. Meanwhile, the motion of the workpiece 2 in the X-axis direction is converted into the motion of the first laser unit 4 and the second laser unit 5 in the X-axis direction, and meanwhile, the third driving structure 70 and the fourth driving structure 80 move smoothly, and the whole load of the third driving structure 70 and the fourth driving structure 80 is smaller, so that the whole size of the device is greatly reduced.
Specifically, referring to fig. 1-2, the dual laser processing apparatus provided by the present invention includes a machine body 10, a first driving structure 40 is mounted on the top surface of the machine body 10, the first driving structure 40 is used for driving a workpiece 2 to move along a Y axis, a first rotating structure 50 is mounted at an output end of the first driving structure 40, the first rotating structure 50 is used for driving the workpiece 2 to rotate around a C axis, a mounting seat 1 is mounted at an output end of the first rotating structure 50, and the mounting seat 1 is used for mounting the workpiece 2. Only the mass of the autorotation and rotation structure of the large-mass workpiece 2 needs to be carried at the first driving structure 40, the load required by the first driving structure 40 is smaller, and the size of the first driving structure 40 is smaller.
The top surface of the machine body 10 is also provided with a frame 20, the frame 20 is a door-shaped frame 20, and a first drive is arranged at the lower opening of the frame 20, so that when the workpiece 2 is driven by the first drive structure 40, the workpiece 2 can pass through the lower opening of the frame 20.
The first laser unit 4 and the second laser unit 5 are mounted on a beam 30. The second driving structure 60 is mounted on the frame 20, and the second driving structure 60 is used to drive the beam 30 to move up and down so that the first laser unit 4 and the second laser unit 5 mounted on the beam 30 can move up and down along the Z-axis.
The beam 30 is provided with a third driving structure 70, and the third driving structure 70 is used for driving the first laser unit 4 to move along the X axis, so that the first laser unit 4 can process the workpiece 2 more comprehensively.
The beam 30 is further provided with a fourth driving structure 80, and the fourth driving structure 80 is used for driving the second laser unit 5 to move along the X axis, so that the second laser unit 5 can perform more comprehensive processing on the workpiece 2.
Compared with the application document with the application number of CN215919426U, the motion of the high-mass workpiece 2 in the X-axis direction is transferred to the laser unit, so that the loads of the third driving structure 70 and the fourth driving structure 80 are greatly reduced, and the whole volume of the device is further reduced.
It should be noted that the overall mass of the frame 20 and the structure mounted on the frame 20 is greater than the mass of the workpiece 2, so that it is not preferable to convert the motion of the workpiece 2 in the Y-axis direction into the motion of the frame 20 in the Y-axis direction, and the volume of the driving structure for driving the frame 20 to move in the Y-axis direction will be much greater than the volume of the first driving structure 40.
Further, referring to fig. 5, the dual laser processing apparatus further includes a second rotating structure 90a and a third rotating structure 90B, wherein the second rotating structure 90a is mounted at an output end of the third driving structure 70, and the second rotating structure 90a is used for driving the first laser unit 4 to rotate around the B1 axis.
The third rotating structure 90B is mounted at the output end of the fourth driving structure 80, and the third rotating structure 90B is used for driving the second laser unit 5 to rotate around the B2 axis.
After the second rotating structure 90a and the third rotating structure 90b are arranged, the two structures, the first driving structure 40, the second driving structure 60, the third driving structure 70, the fourth driving structure 80 and the first rotating structure 50 form a seven-axis laser processing device, so that the workpiece 2 can be processed by laser better.
As shown in fig. 1, the first driving structure 40 includes a first motor 41 and a first screw rod 42 mounted on the machine body 10, and a first placement seat 43 is screwed on the first screw rod 42, and when the first motor 41 drives the first screw rod 42 to rotate, the first placement seat 43 moves along the Y axis along with the rotation of the first screw rod 42.
The first rotating motor of the first rotating structure 50 is installed below the first placing seat 43, an output shaft of the first rotating motor passes through the first placing seat 43 to extend upwards, and an output end of the first rotating motor is installed with the installation seat 1, so that the first rotating structure 50 drives the workpiece 2 to rotate.
Of course, the first slide rail 11 is provided on the bed 10, and the first slider 44 is provided at the bottom of the first placement seat 43, and the first slider 44 is slidably connected to the first slide rail 11. The arrangement of the first slider 44 and the first slide rail 11 enables the first placing seat 43 to move more stably while preventing the first placing seat 43 from rotating relative to the first screw 42.
In one embodiment of the present invention, when the workpiece 2 moves along the Y axis, the workpiece 2 can rotate around the C axis, and the movement of the workpiece 2 in the Y axis and the C axis directions are independent from each other, that is, the workpiece 2 can move only along the Y axis, or the workpiece 2 can rotate only around the C axis, or the workpiece 2 can move along the Y axis and also rotate around the C axis.
As shown in fig. 1, the beam 30 is disposed directly above the first driving structure 40, and the workpiece 2 can be driven by the first driving structure 40 to move on both front and rear sides of the beam 30, at which time the workpiece 2 can be processed without dead angle. By disposing the cross beam 30 directly above the first drive structure 40 and disposing the frame 20 in a "gate" configuration, the frame 20 need not extend in the direction in which the first drive structure 40 is disposed.
The frame as set forth in the application CN215919426U even if a rotating structure is added to the laser unit, so that the laser unit can process the side surface of the workpiece. In order to enable the laser unit to process the top of the workpiece, it is often necessary to extend the upper portion of the frame in the Y-axis direction to avoid interference of the frame with the movement of the workpiece in the Y-axis direction. When the workpiece is larger, the length of the frame required to be extended is longer, so that the whole occupied area of the device is larger.
In contrast to the above-described application, the housing 20 in the present application is configured in a "door" configuration, and the first drive structure 40 is disposed within the lower opening of the housing 20, as shown in fig. 1. The frame 20 does not interfere with the movement of the workpiece 2 in the Y-axis, thereby making the overall footprint of the apparatus smaller.
Furthermore, the frame 20 is made of mineral castings, and the damping of the frame 20 is relatively large, so that vibration generated in the operation process of other devices in the workshop is greatly reduced when the vibration is transmitted to the frame 20, and the vibration hardly affects the laser unit when the vibration is transmitted to the laser unit.
The frame 20 is integrally formed by bonding mineral castings, so that the connection rigidity of the frame 20 is greatly enhanced, and the running structure on the frame 20 can be ensured to stably move.
At the same time, the heat transfer properties of the mineral castings are poor, and the heat generated by the transfer beam 30 at the second drive structure 60 is difficult to transfer through the frame 20 to other locations, affecting the accuracy of the laser machining. As shown in fig. 1 or 2, the second driving structure 60 is a screw rod structure, so that the beam 30 having a larger mass, on which the first laser unit 4 and the second laser unit 5 are mounted, can be more smoothly transferred.
Specifically, as shown in fig. 3, two second driving structures 60 are provided, the second driving structure 60 includes a second motor 61 and a second screw 62, the second motor 61 is mounted on the frame 20, and the second screw 62 is fixed at an output end of the second motor 61. And the two second driving structures 60 are symmetrically distributed at both sides of the first driving structure 40 so that the cross beam 30 can stably move up and down along the Z-axis.
More specifically, referring to fig. 7 and 8, a nut 63 is mounted on a side of the cross member 30 adjacent to the second screw 62, the nut 63 is screw-coupled to the second screw 62, and the cross member 30 fixedly coupled to the nut 63 moves up and down along with the nut 63 when the second screw 62 drives the nut 63 to move up and down.
Referring to fig. 11 to 13, a flow passage 633 is formed in the hollow interior of the nut 63, a water inlet 631 and a water outlet 632 are formed in the flow passage 633 on the nut 63, and the water inlet 631 and the water outlet 632 are both in communication with an external water pipe. The beam 30 provided with the first laser unit 4 and the second laser unit 5 has a large dead weight, and in the up-and-down movement process, large heat is generated between the nut 63 and the second screw rod 62 under the action of large gravity, so that the joint of the nut 63 and the second screw rod 62 is slightly deformed. When water flows in from the water inlet 631 and water flows out from the water outlet 632, the nut 63 can be continuously cooled by the water, so that the influence of deformation at the connection of the nut 63 and the second screw 62 on the laser unit is reduced.
Preferably, in an embodiment of the present invention, the nut 63 is a long nut 63, and the long nut 63 has a larger contact area with the second screw 62, so that the second screw 62 can more stably drive the long nut 63 to move up and down, thereby making the movement of the laser unit more stable.
In cooperation therewith, the flow passage 633 extends from above to below the long nut 63, so that the long nut 63 can be cooled more sufficiently.
Further, in an embodiment of the present invention, the flow channel 633 is spirally wound on the long nut 63, and the flowing water in the flow channel 633 can sufficiently absorb the heat generated by friction between the long nut 63 and the second screw 62.
Further, in an embodiment of the present invention, the flow channel 633 may be a serpentine annular flow channel 633, and the serpentine flow channel 633 is also disposed around the long nut 63 to fully absorb heat at the connection between the long nut 63 and the second screw 62.
Furthermore, the second screw rod 62 is hollow, the contact area between the second screw rod 62 and the air is increased, and the heat generated on the second screw rod 62 can be well dispersed into the air, so as to avoid heat accumulation on the second screw rod 62. After the second screw rod 62 is hollow, the strength still has enough strength, and after the second screw rod 62 is hollow, the expansion of the second screw rod 62 is reduced, so that the operation precision of the second screw rod 62 falls into an error range.
Likewise, in order to allow the cross beam 30 to be more stably transferred and not easily slipped off the second screw 62, as shown in fig. 3, the frame 20 is provided with a second slide rail 22; as shown in fig. 7 or 8, the cross member 30 is provided with a second slider 65, and the second slider 65 is provided on the same side of the cross member 30 as the nut 63. And second slider 65 is slidably coupled to second slide 22.
Preferably, in an embodiment of the present invention, the sliding blocks are shorter, at least two sliding blocks are provided, and the sliding blocks are arranged in parallel along the vertical direction, so that the sliding blocks and the sliding rail have enough contact area, and meanwhile, deformation of a single sliding block is prevented from affecting the overall movement of the cross beam 30.
Specifically, in one embodiment of the present invention, three sliders are selected, and the total length of the three sliders is adapted to the height of the beam 30, so that the sliders and the sliding rails have the largest contact area, and the beam 30 operates most stably.
Referring to fig. 6, a plurality of screw holes are provided in the nut 63, and the screw holes are bolted to the protruding portions of the cross beam 30, so that the nut 63 can drive the cross beam 30 to move up and down in the vertical direction.
Referring to fig. 7, the slider is similarly provided with a plurality of screw holes distributed at both sides of the slider.
Referring to fig. 1 and 2, the second driving structure 60 further includes a limiting block 64, the limiting block 64 is mounted on the frame 20, and the limiting block 64 is disposed at the bottom of the second screw 62, where the limiting block 64 is used to limit the movement range of the beam 30 in the Z-axis direction.
The limiting block 64 is generally provided with a bearing, an inner ring of the bearing is fixedly connected with the bottom of the second screw rod 62, an outer ring of the bearing is fixed relative to the frame 20, and the limiting block 64 does not interfere with normal rotation of the second screw rod 62 while stabilizing the position of the second screw rod 62.
As shown in fig. 5, the third drive structure 70 and the fourth drive structure 80 mounted on the cross beam 30 are disposed opposite to each other. The third driving structure 70 includes a third motor 71 and a third screw 72, the third screw 72 is fixed at an output end of the third motor 71, a second placing seat 73 is connected to the third screw 72 in a threaded manner, and the second placing seat 73 moves along the X axis along with the rotation of the third motor 71 driving the screw.
The fourth driving structure 80 comprises a fourth motor 81 and a fourth screw rod 82, the fourth screw rod 82 is fixed at the output end of the fourth motor 81, a third placing seat 83 is connected to the fourth screw rod 82 in a threaded mode, and the third placing seat 83 moves along the X axis along with the rotation of the screw rod driven by the fourth motor 81.
The second rotating structure 90a includes a second rotating motor, which is mounted on the second placement base 73, and an output end of which is connected to the first laser unit 4 for driving the first laser unit 4 to rotate around the B1 axis.
The third rotating structure 90B includes a third rotating motor, which is mounted on the third placement seat 83, and an output end of the third rotating motor is connected to the second laser unit 5, and is used for driving the second laser unit 5 to rotate around the B2 axis.
Of course, in order to enable the second placement base 73 not to rotate relative to the third screw rod 72, in order to enable the third placement base 83 not to rotate relative to the fourth screw rod 82, a third slide rail 31 is further provided on the cross beam 30, a third slide block 74 and a fourth slide block 84 are provided on the second placement base 73 and the third placement base 83, respectively, and the third slide block 74 and the fourth slide block 84 are both slidably connected with the third slide rail 31.
Specifically, referring to fig. 5 or 6, the third motor 71 and the fourth motor 81 are provided at both ends of the cross beam 30, respectively. Wherein the third motor 71 and the third screw 72 are disposed above the fourth motor 81 and the fourth screw 82. The lower part of the second placing seat 73 is in threaded connection with the third screw 72, and the upper part of the third placing seat 83 is in threaded connection with the fourth screw 82.
As shown in fig. 1 or 2, the second placing seat 73 and the third placing seat 83 can move on the same straight line, that is, the second placing seat 73 and the third placing seat 83 slide along the third slide rail 31.
When the workpiece 2 is machined, when the first laser unit 4 is required to be used, the fourth driving structure 80 drives the second laser to move to the rightmost side for avoiding, and the profile of the first laser unit 4 moving on the X axis can cover the whole workpiece 2.
Likewise, when the second laser unit 5 needs to be used, the third driving structure 70 drives the first laser unit 4 to move to the leftmost side for avoiding, and the profile of the second laser unit 5 moving on the X axis can cover the whole workpiece 2.
The first driving structure 40, the second driving structure 60, the third driving structure 70 and the fourth driving structure 80 all adopt a screw rod structure, and compared with the case of adopting an air cylinder to drive the workpiece 2 or the cross beam 30, the first laser unit 4 or the second laser unit 5, the screw rod structure does not need to consider the stroke required by the air cylinder, so that the volume of the device is reduced. If the second driving structure 60 is driven by a screw rod structure, the height of the second driving structure 60 is obviously reduced, and the dual laser processing device can be better suitable for workshops with limited heights.
Further, the first slide rail 11, the second slide rail 22 and the third slide rail 31 are identical in structure, and the first slider 44, the second slider 65 and the third slider 74 are identical in structure. Hereinafter, the slide rail and the slider are collectively referred to as a slide rail and a slider. Referring to fig. 9, the middle of the slide rail is concave, and in combination with fig. 10, the slider is provided with a protrusion combined with the concave of the slide rail, and at this time, the slider can be well combined with the slide rail, so as to avoid the first placing seat 43, the second placing seat 73 or the third placing seat 83 from being separated from the slide rail.
The top of the frame 20 is used for placing the laser generator 3, and the laser emitted by the laser generator 3 enters the first laser unit 4 and the second laser unit 5 through refraction.
Referring to fig. 1, a plurality of mounting holes 21 are further formed in the bottom of the frame 20, the mounting holes 21 are recessed in the frame 20, bolts are arranged in the mounting holes 21, extend from top to bottom through the bottom of the frame 20 to the bed 10, and are in threaded connection with the bed 10.
It will be understood that equivalents and modifications will occur to those skilled in the art based on the present invention and its spirit, and all such modifications and substitutions are intended to be included within the scope of the present invention.

Claims (10)

1. A dual laser processing apparatus, comprising:
a bed body;
the first driving structure is arranged on the lathe bed and used for driving the workpiece to move along the Y axis;
the first rotating structure is arranged at the output end of the first driving structure and is used for driving the workpiece to rotate around the C axis;
the mounting seat is used for mounting a workpiece and is mounted on the output end of the first rotating structure;
the frame is arranged on the top surface of the lathe bed, the frame is a door-shaped frame, and the first driving structure is arranged at the lower opening of the frame;
a first laser unit and a second laser unit;
the beam is used for installing the first laser unit and the second laser unit;
the second driving structure is arranged on the frame and used for driving the cross beam to move along the Z axis;
the third driving structure is arranged on the cross beam and used for driving the first laser unit to move along the X axis;
and the fourth driving structure is arranged on the cross beam and used for driving the second laser unit to move along the X axis.
2. The dual laser processing apparatus of claim 1, further comprising a second rotating structure and a third rotating structure, the second rotating structure being mounted at an output end of the third driving structure, the second rotating structure being configured to drive the first laser unit to rotate about a B1 axis; the third rotating structure is arranged at the output end of the fourth driving structure and is used for driving the second laser unit to rotate around the B2 shaft.
3. The dual laser processing apparatus of claim 1, wherein the second driving structure is a screw structure.
4. A dual laser processing apparatus as claimed in claim 3, wherein two of the second driving structures are provided, the two second driving structures being provided on both sides of the first driving structure.
5. The dual laser processing apparatus of claim 2, wherein the third and fourth drive structures are screw structures.
6. The dual laser processing device of claim 5, wherein the third driving structure is disposed at both ends of the beam opposite to the fourth driving structure.
7. The dual laser processing device according to claim 1, wherein a first slide rail is arranged on the lathe bed, a first slide block is arranged at the bottom of the first driving structure, and the first slide block is slidably connected to the first slide rail;
the frame is provided with a second sliding rail, the cross beam is provided with a second sliding block, and the second sliding block is connected with the second sliding rail in a sliding way.
8. The dual laser processing device according to claim 2, wherein a third sliding rail is provided on the cross beam, a third sliding block is provided on the second rotating structure, a fourth sliding block is provided on the third rotating structure, and the third sliding block and the fourth sliding block are both slidably connected with the third sliding rail.
9. The dual laser machining apparatus according to claim 3, further comprising a nut mounted on the cross beam, the nut being in threaded connection with the output end of the second driving structure, the nut being a long nut, a flow passage being formed in the nut, the flow passage being formed with a water inlet and a water outlet on the nut, both of the water inlet and the water outlet being provided on a side wall of the nut.
10. The dual laser machining device of claim 9, wherein the flow channel surrounds the nut.
CN202310162904.3A 2023-02-22 2023-02-22 Dual laser processing device Pending CN116329775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310162904.3A CN116329775A (en) 2023-02-22 2023-02-22 Dual laser processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310162904.3A CN116329775A (en) 2023-02-22 2023-02-22 Dual laser processing device

Publications (1)

Publication Number Publication Date
CN116329775A true CN116329775A (en) 2023-06-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310162904.3A Pending CN116329775A (en) 2023-02-22 2023-02-22 Dual laser processing device

Country Status (1)

Country Link
CN (1) CN116329775A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117644283A (en) * 2024-01-30 2024-03-05 广东原点智能技术有限公司 Laser processing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117644283A (en) * 2024-01-30 2024-03-05 广东原点智能技术有限公司 Laser processing device
CN117644283B (en) * 2024-01-30 2024-04-09 广东原点智能技术有限公司 Laser processing device

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