CN116321694A - Circuit board assembly and manufacturing method thereof - Google Patents
Circuit board assembly and manufacturing method thereof Download PDFInfo
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- CN116321694A CN116321694A CN202310386786.4A CN202310386786A CN116321694A CN 116321694 A CN116321694 A CN 116321694A CN 202310386786 A CN202310386786 A CN 202310386786A CN 116321694 A CN116321694 A CN 116321694A
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- circuit board
- speed connector
- buried groove
- pins
- connector
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a circuit board assembly and a manufacturing method of the circuit board assembly, wherein the circuit board assembly comprises the following components: the circuit board is internally provided with at least one wiring layer, and signal wires are arranged in the wiring layer; the buried groove is formed on the circuit board; the buried groove is communicated with the wiring layer, and a welding section of the signal wire is exposed in the buried groove; the high-speed connector is arranged on the circuit board, and pins of the high-speed connector extend into the buried groove to be connected with the welding section. In this embodiment, no additional layer-changing via hole is needed, so that impedance discontinuity caused by the layer-changing via hole is avoided. Meanwhile, in the embodiment of the invention, the pins of the high-speed connector are directly connected with the signal wires in the wiring layer in the buried groove, so that the wiring is not required to be carried out on the surface layer of the circuit board, the increase of the design laminated layer surface caused by the wiring on the surface layer of the circuit board can be avoided, the wiring length can be reduced, and the link loss is reduced.
Description
Technical Field
The invention relates to the technical field of electronic circuits, in particular to a circuit board assembly and a manufacturing method of the circuit board assembly.
Background
Crosstalk problems continue to exist in the design of an includ server, particularly in high-speed signal interconnect topology links. Currently, in a high-speed interconnection architecture, for a high-speed signal connector, a surface-mounted connector is generally adopted, and the surface-mounted connector has better signal integrity than a through-hole welding connector.
In the prior art, because the high-speed signals tend to be routed on the inner layer, when the inner layer routing is connected to the surface layer pins of the surface mount connector, layer-changing via holes are added on the circuit board, as shown in fig. 1, and the problem of discontinuous impedance is caused by adding the interlayer via holes.
Disclosure of Invention
Therefore, the invention aims to solve the technical problem that the addition of the layer-changing via hole on the circuit board in the prior art causes discontinuous impedance, thereby providing a circuit board assembly and a manufacturing method of the circuit board assembly.
To achieve the above object, an embodiment of the present invention provides a circuit board assembly, including: the circuit board is internally provided with at least one wiring layer, and signal wires are arranged in the wiring layer;
the buried groove is formed on the circuit board; the buried groove is communicated with the wiring layer, and a welding section of the signal wire is exposed in the buried groove;
the high-speed connector is arranged on the circuit board, and pins of the high-speed connector extend into the buried groove to be connected with the welding section.
Optionally, the circuit board assembly further comprises:
and the fixing piece is used for fixing the high-speed connector on the circuit board.
Optionally, the fixing member is made of an insulating material.
Optionally, the insulating material is resin, and the resin is filled in the buried groove and fixes the high-speed connector on the circuit board.
Optionally, the buried groove is formed on two sides of the high-speed connector and is located below the pin.
Optionally, a plurality of routing layers are arranged inside the circuit board.
Optionally, two rows of conductive members are disposed in the high-speed connector, and portions of the two rows of conductive members exposing the high-speed connector are formed into two rows of pins.
Optionally, the length of the pin matches the depth of the buried groove.
Optionally, the high-speed connector is any one or more of a crimp connector, a surface mount connector, and a through hole solder connector.
The embodiment of the invention also provides a manufacturing method of the circuit board assembly, which is applied to the circuit board assembly of any one of the embodiments, and comprises the following steps:
when designing a circuit board drawing, presetting pin symbols of a high-speed connector in a wiring layer inside the circuit board;
processing the circuit board according to a circuit board drawing;
after the circuit board is processed, a buried groove is formed in the pin symbol, so that the buried groove is communicated with the wiring layer, and a welding section of the signal wire is exposed in the buried groove;
and welding the pins of the high-speed connector with the welding sections of the signal wires.
Optionally, after the soldering the pins of the high-speed connector and the soldering sections of the signal wires, the method further includes:
filling resin into the buried groove for burying, and waiting for solidification of the resin to finish manufacturing.
Optionally, the manufacturing method further comprises: acquiring the distance between the pin symbol and the surface layer of the circuit board, namely the depth of the buried groove;
and determining the pin length of the high-speed connector based on the depth of the buried groove, so that the length of the pin is matched with the depth of the buried groove.
Compared with the prior art, the technical scheme of the invention has the following advantages:
1. the embodiment of the invention provides a circuit board assembly, which comprises: the circuit board is internally provided with at least one wiring layer, and signal wires are arranged in the wiring layer; the buried groove is formed on the circuit board; the buried groove is communicated with the wiring layer, and a welding section of the signal wire is exposed in the buried groove; the high-speed connector is arranged on the circuit board, and pins of the high-speed connector extend into the buried groove to be connected with the welding section.
When the high-speed signal wiring is designed, the pins of the high-speed connector are buried in the wiring layer in the circuit board, so that the wiring is carried out on the internal wiring layer of the circuit board, and the signal wires can be directly connected to the pins of the high-speed connector. Compared with the prior art that the signal wires are changed from the inner wiring layer of the circuit board to the surface layer of the circuit board, the design of the layer-changing via holes is added, and the layer-changing via holes are not required to be additionally added, so that impedance discontinuity caused by the layer-changing via holes is avoided. Meanwhile, in the embodiment of the invention, the pins of the high-speed connector are directly connected with the signal wires in the wiring layer in the buried groove, so that the wiring is not required to be carried out on the surface layer of the circuit board, the increase of the design laminated layer surface caused by the wiring on the surface layer of the circuit board can be avoided, the wiring length can be reduced, and the link loss is reduced. In addition, in the wiring process, because the punching is needed to change the layer to the surface layer in the prior art, when the high-density board card is designed and the high-speed connector is placed close to the board edge, the wiring space is more limited. In the embodiment of the invention, the pins of the high-speed connector are directly connected with the signal wires in the wiring layer in the buried groove, so that the external space on the surface layer of the circuit board is not occupied, the space between the buried groove and the wiring layer is fully utilized, and the external wiring space can be saved. Furthermore, the circuit board assembly is simpler and more efficient in manufacturing, easy to realize, and capable of saving cost and improving the design reliability of the system.
2. According to the embodiment of the invention, the high-speed connector is fixed on the circuit board by adopting the fixing piece, so that the stability of the integral structure between the high-speed connector and the circuit board can be ensured, normal communication between the high-speed connector and the circuit board can be realized, the problem that the circuit board assembly cannot be used due to the separation of the high-speed connector and the circuit board in the use process is avoided, and the damage probability of the circuit board assembly is reduced.
3. According to the embodiment of the invention, the fixing piece is made of an insulating material, so that the stability of the integral structure between the high-speed connector and the circuit board can be ensured, the high-speed connector and the circuit board can be normally communicated, meanwhile, the phenomenon of connection between the high-speed connector and the circuit board and other electrical components can be prevented, a certain insulating effect can be achieved on the surrounding ring, the short circuit discharge of the high-speed connector and the circuit board in the using process is avoided, the high-speed connector and the circuit board cannot be used, and the damage probability of the circuit board assembly can be reduced.
4. According to the embodiment of the invention, the resin is filled in the buried groove, and the high-speed connector is fixed on the circuit board, so that the high-speed connector and the circuit board can be truly formed into an integral structure after the resin is solidified, the stability of the integral structure between the high-speed connector and the circuit board can be ensured, normal communication between the high-speed connector and the circuit board can be realized, the situation that the circuit board assembly cannot be used due to the separation of the high-speed connector and the circuit board in the use process is avoided, and the damage probability of the circuit board assembly is reduced. Meanwhile, as the resin is poured into the buried groove, the resin can well insulate and wrap the pins and the communication wires, and can also generate a continuous electric phenomenon of the pins, the communication wires and other electric components, so that a certain insulating effect can be achieved on the surrounding ring, the pins and the communication wires are prevented from being discharged in a short way after being stained with dust in the use process, the high-speed connector and the circuit board cannot be used, and the damage probability of the circuit board assembly can be reduced.
5. According to the embodiment of the invention, the buried grooves are formed on two sides of the high-speed connector and below the pins, so that the length of the pins can be reduced, and meanwhile, the overall length of the pins and the signal wires can be reduced, namely the wiring length can be reduced, and the link loss is reduced.
6. By arranging the plurality of wiring layers, the embodiment of the invention can enable a designer to have more layout ideas when initially designing the wiring layout on the multi-layer circuit board, does not need to be displayed by the layout space of a single wiring layer, and enables the signal line to have more board layers to be selectively passed. At the same time, a suitable routing path can be selected for complex, noise-sensitive electronic circuits, providing more degrees of freedom.
7. According to the embodiment of the invention, the two rows of conductive pieces are arranged in the high-speed connector, and the parts of the two rows of conductive pieces, which are exposed out of the high-speed connector, are formed into the two rows of pins, so that the pins and the conductive pieces are integrally formed, and compared with the split arrangement of the pins and the conductive pieces, the pins and the conductive pieces are welded, the signal integrity of a link in the signal transmission process can be obviously ensured, and signal interference caused by welding parts in the split arrangement is avoided.
8. The distance between the position of the pin symbol and the surface layer is the buried depth of the high-speed connector and the pin length of the high-speed connector, so that the pin can be just connected with the signal wire in the buried groove by matching the length of the pin with the depth of the buried groove, the wiring length can be reduced, and the link loss is reduced. If the length of the pin is not matched with the depth of the buried groove, there is a problem in that the length of the pin is smaller than the depth of the buried groove, and the pin cannot be connected with the signal line in the buried groove. The length of the pin is larger than the depth of the buried groove, so that the overall length of the pin and the signal line is longer, namely the wiring length is longer, and the link loss is improved.
9. According to the embodiment of the invention, the high-speed connectors are arranged in a plurality of types, so that a person skilled in the art can adopt different types of high-speed connectors according to actual conditions, and select a proper wiring path according to the different types of high-speed connectors, so that the circuit board assembly can meet different application scenes and provide more degrees of freedom when in actual application.
10. The embodiment of the invention also provides a manufacturing method of the circuit board assembly, which is applied to the circuit board assembly of any one of the embodiments, and comprises the following steps: when designing a circuit board drawing, presetting pin symbols of a high-speed connector in a wiring layer inside the circuit board; processing the circuit board according to a circuit board drawing; after the circuit board is processed, a buried groove is formed in the pin symbol, so that the buried groove is communicated with the wiring layer, and a welding section of the signal wire is exposed in the buried groove; and welding the pins of the high-speed connector with the welding sections of the signal wires.
When the high-speed signal wiring is designed, the pins of the high-speed connector are buried in the wiring layer in the circuit board, so that the wiring is carried out on the internal wiring layer of the circuit board, and the signal wires can be directly connected to the pins of the high-speed connector. Compared with the prior art that the signal wires are changed from the inner wiring layer of the circuit board to the surface layer of the circuit board, the design of the layer-changing via holes is added, and the layer-changing via holes are not required to be additionally added, so that impedance discontinuity caused by the layer-changing via holes is avoided. Meanwhile, in the embodiment of the invention, the pins of the high-speed connector are directly connected with the signal wires in the wiring layer in the buried groove, so that the wiring is not required to be carried out on the surface layer of the circuit board, the increase of the design laminated layer surface caused by the wiring on the surface layer of the circuit board can be avoided, the wiring length can be reduced, and the link loss is reduced. In addition, in the wiring process, because the punching is needed to change the layer to the surface layer in the prior art, when the high-density board card is designed and the high-speed connector is placed close to the board edge, the wiring space is more limited. In the embodiment of the invention, the pins of the high-speed connector are directly connected with the signal wires in the wiring layer in the buried groove, so that the external space on the surface layer of the circuit board is not occupied, the space between the buried groove and the wiring layer is fully utilized, and the external wiring space can be saved. Furthermore, the circuit board assembly is simpler and more efficient in manufacturing, easy to realize, and capable of saving cost and improving the design reliability of the system.
11. According to the embodiment of the invention, the buried groove is filled with resin for burying, and the resin is solidified, namely the manufacturing is completed. Because the resin can truly form an integral structure between the high-speed connector and the circuit board after solidification, the stability of the integral structure between the high-speed connector and the circuit board can be ensured, normal communication between the high-speed connector and the circuit board can be realized, the situation that the circuit board assembly cannot be used due to separation of the high-speed connector and the circuit board in the use process is avoided, and the damage probability of the circuit board assembly is reduced. Meanwhile, as the resin is poured into the buried groove, the resin can well insulate and wrap the pins and the communication wires, and can also generate a continuous electric phenomenon of the pins, the communication wires and other electric components, so that a certain insulating effect can be achieved on the surrounding ring, the pins and the communication wires are prevented from being discharged in a short way after being stained with dust in the use process, the high-speed connector and the circuit board cannot be used, and the damage probability of the circuit board assembly can be reduced.
12. According to the embodiment of the invention, the distance between the pin symbol and the surface layer of the circuit board, namely the depth of the buried groove, is acquired; the pin length of the high-speed connector is determined based on the depth of the buried groove, so that the length of the pin is matched with the depth of the buried groove, the pin can be just connected with a signal wire in the buried groove, the wiring length can be reduced, and the link loss is reduced. If the length of the pin is not matched with the depth of the buried groove, there is a problem in that the length of the pin is smaller than the depth of the buried groove, and the pin cannot be connected with the signal line in the buried groove. The length of the pin is larger than the depth of the buried groove, so that the overall length of the pin and the signal line is longer, namely the wiring length is longer, and the link loss is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of a circuit board in the prior art;
fig. 2 is a schematic diagram of the overall structure of the circuit board assembly according to the present embodiment.
Reference numerals:
10. a circuit board; 20. a high-speed connector; 30. an insulating material; 40. burying a groove; 50. pins; 60. a signal line.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by a worker of ordinary skill in the art without making any inventive effort, are intended to be within the scope of this invention based on the embodiments of this invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the above terms in the present invention can be understood in a specific case by a worker of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
Crosstalk problems continue to exist in the design of an includ server, particularly in high-speed signal interconnect topology links. Currently, in a high-speed interconnection architecture, for a high-speed signal connector, a surface-mounted connector is generally adopted, and the surface-mounted connector has better signal integrity than a through-hole welding connector.
In the prior art, because the high-speed signals tend to be routed on the inner layer, when the inner layer routing is connected to the surface layer pins of the surface mount connector, layer-changing via holes are added on the circuit board, as shown in fig. 1, and the problem of discontinuous impedance is caused by adding the interlayer via holes.
Therefore, the invention aims to solve the technical problem that the addition of the layer-changing via hole on the circuit board in the prior art causes discontinuous impedance, thereby providing a circuit board assembly and a manufacturing method of the circuit board assembly.
Example 1
As shown in fig. 2, an embodiment of the present invention provides a circuit board assembly, including: a circuit board 10, buried slots 40, and a high-speed connector 20.
Specifically, in the embodiment of the present invention, at least one routing layer is disposed inside the circuit board 10. Typically, the trace layers may be divided into three major categories, i.e., a single layer circuit board, a double layer circuit board, and a multi-layer circuit board, depending on the number of layers of the circuit board 10. First, a single-layer circuit board is provided, and on the most basic circuit board 10, the components are concentrated on one side, and the signal lines 60 are concentrated on the other side. For a double-layer circuit board, copper-clad wiring is arranged on both sides of the double-layer circuit board, and a circuit between the two layers can be conducted through a via hole in general so as to form a required network connection. The multi-layer board is a printed board having three or more conductive pattern layers laminated with insulating materials therebetween at intervals, and conductive patterns therebetween being interconnected as required. Multilayer circuit boards are products of electronic information technology that are evolving into high-speed, multifunctional, large-capacity, small-volume, thin, lightweight applications.
Further, a signal line 60 is disposed in the wiring layer. The signal line 60 may be a microstrip line or a strip line. Specifically, the microstrip line is relatively difficult to control impedance, the equivalent dielectric constant of the whole microstrip line is low, and the transmission rate of signals on the microstrip line is high. Since the microstrip lines are distributed on the surface of the circuit board 10, the number of layers can be saved for high-density wiring, but the microstrip lines are more easily disturbed. And the strip line is a line provided in the inner layer of the circuit board 10. The electric field of the strip line is only in the range of the circuit board 10, so that the impedance is relatively easy to control. The dielectric constant of the medium surrounding the strip line is high, but the signal transmission speed is relatively slow, and the strip line is not easily disturbed because it is inside the circuit board 10. Of course, the present embodiment is merely illustrative of the type of the signal line 60, but is not limited thereto, and those skilled in the art can vary according to the actual situation, and can achieve the same technical effects.
Further, a buried groove 40 is formed on the circuit board 10, and the buried groove 40 is disposed corresponding to the high-speed connector 20. After slotting, the buried groove 40 communicates with the wiring layer such that the soldered section of the signal line 60 is exposed in the buried groove 40. The solder segments may be conductive lines that are individually connected to the signal lines 60, or may be portions of the signal lines 60 themselves that are exposed in the buried trenches 40. Of course, the present embodiment is merely illustrative of the connection relation of the welding segments, but is not limited thereto, and those skilled in the art may change the connection relation according to actual situations, and may achieve the same technical effects.
Further, a high-speed connector 20 is disposed on the circuit board 10, and pins 50 of the high-speed connector 20 extend into the buried grooves 40 to be connected with the soldering section. In an embodiment of the present invention, the high-speed connector 20 may be fixedly connected to the circuit board 10, and may be detachably connected to the circuit board 10 for easy replacement and maintenance of the high-speed connector 20.
For the fixing connection, bonding, welding and other conventional fixing connection methods can be adopted. For the detachable connection mode, the fixing can be performed by adopting a screw hole mode. For example, a fixing plate may be additionally disposed around the edge of the high-speed connector 20, and a person skilled in the art may change the number of fixing plates, 1, 2, 3, 4, etc. according to the actual situation, and then open a screw hole on the fixing plate, then open another screw hole on the circuit board 10 corresponding to the position of the screw hole, and then sequentially pass a screw through the screw hole on the fixing plate and the screw hole on the circuit board 10 to connect the high-speed connector 20 with the circuit board 10. When the high-speed connector 20 is replaced and maintained, the screw can be reversely screwed, so that the screw is separated from the screw hole on the fixing plate and the screw hole on the circuit board 10, the high-speed connector 20 is separated from the circuit board 10, and the high-speed connector 20 can be replaced and maintained conveniently. Of course, the fixing can also be performed by adopting a mode of a buckle and a clamping groove. For example, the periphery of the edge of the high-speed connector 20 may be additionally provided with a buckle, and a person skilled in the art can change the number of the buckles, 1, 2, 3, 4, etc. according to the actual situation, and then open a slot on the circuit board 10 corresponding to the position of the buckle, which can work with the buckle, and then the buckle on the high-speed connector 20 is directly embedded into the slot on the circuit board 10, so as to connect the high-speed connector 20 with the circuit board 10. When the high-speed connector 20 is replaced and maintained, the buckle can be reversely stirred, so that the buckle on the high-speed connector 20 is separated from the clamping groove on the circuit board 10, the high-speed connector 20 is separated from the circuit board 10, and the high-speed connector 20 can be replaced and maintained conveniently. Of course, the fixing can also be performed by adopting a magnetic attraction mode. For example, magnetic sheets may be additionally disposed around the edge of the high-speed connector 20, and a person skilled in the art may change the number of the magnetic sheets, 1, 2, 3, 4, etc. according to the actual situation, and then open a different magnetic sheet capable of attracting with the magnetic sheet at a position on the circuit board 10 corresponding to the magnetic sheet, and then directly align the magnetic sheet on the high-speed connector 20 with the different magnetic sheet embedded in the circuit board 10, thereby magnetically connecting the high-speed connector 20 with the circuit board 10. When the high-speed connector 20 is replaced and maintained, the high-speed connector 20 can be pulled in the opposite direction so that the magnetic sheet on the high-speed connector 20 is separated from the anisotropic magnetic sheet on the circuit board 10, thereby facilitating the replacement and maintenance of the high-speed connector 20.
Of course, the present embodiment is merely illustrative of the manner of fixing connection and the manner of detachable connection, but is not limited thereto, and those skilled in the art can vary according to actual circumstances, and can achieve the same technical effects.
So arranged, in the present invention, the pins 50 of the high-speed connector 20 are buried in the routing layer in the circuit board 10 during the high-speed signal wiring design, and thus, the signal wires 60 can be directly connected to the pins 50 of the high-speed connector 20 by routing in the internal routing layer of the circuit board 10. Compared with the prior art in which the signal wires 60 are replaced from the inner wiring layer of the circuit board 10 to the surface layer of the circuit board 10, the design of the replacing via holes is increased, and the replacing via holes are not required to be additionally added, so that the impedance discontinuity caused by the replacing via holes is avoided. Meanwhile, in the embodiment of the invention, the pins 50 of the high-speed connector 20 are directly connected with the signal wires 60 in the wiring layer in the buried groove 40, so that the wiring is not required to be performed on the surface layer of the circuit board 10, the increase of the design laminated layer caused by wiring on the surface layer of the circuit board 10 can be avoided, the wiring length can be reduced, and the link loss can be reduced. In addition, in the routing process, because the punching is required to change the layer to the surface layer in the prior art, when the high-density board card is designed and the high-speed connector 20 is placed close to the board edge, the routing space is more limited. In the embodiment of the invention, the pins 50 of the high-speed connector 20 are directly connected with the signal wires 60 in the wiring layer in the buried groove 40, so that the external space on the surface layer of the circuit board 10 is not occupied, the space between the buried groove 40 and the wiring layer is fully utilized, and the external wiring space can be saved. Furthermore, the circuit board assembly is simpler and more efficient in manufacturing, easy to realize, and capable of saving cost and improving the design reliability of the system.
Further, in an alternative embodiment of the present invention, the circuit board assembly further includes a fixing member for fixing the high-speed connector 20 to the circuit board 10. The fixing member may be a screw, and the high-speed connector 20 may be fixed to the circuit board 10 by the screw. The fixing piece can also be a buckle and a clamping groove, the periphery of the edge of the high-speed connector 20 is additionally provided with the buckle, the clamping groove which can work with the buckle in a matching way is formed in the position, corresponding to the buckle, of the circuit board 10, and then the buckle on the high-speed connector 20 is directly embedded into the clamping groove on the circuit board 10, so that the high-speed connector 20 is connected with the circuit board 10. The fixing member may also be a magnetic member, for example, a magnetic sheet is additionally disposed around the edge of the high-speed connector 20, and a magnetic sheet with opposite polarity is disposed on the circuit board 10 corresponding to the magnetic sheet, and then the magnetic sheet on the high-speed connector 20 is directly aligned with the magnetic sheet with opposite polarity embedded in the circuit board 10, so as to magnetically connect the high-speed connector 20 with the circuit board 10.
Of course, the present embodiment is merely illustrative of the type of the fixing member, but is not limited thereto, and those skilled in the art can vary according to actual situations, and can achieve the same technical effects.
According to the embodiment of the invention, the high-speed connector 20 is fixed on the circuit board 10 by adopting the fixing piece, so that the stability of the whole structure between the high-speed connector 20 and the circuit board 10 can be ensured, normal communication between the high-speed connector 20 and the circuit board 10 can be realized, the situation that the circuit board assembly cannot be used due to the separation of the high-speed connector 20 and the circuit board 10 in the use process is avoided, and the damage probability of the circuit board assembly is reduced.
Further, in an alternative embodiment of the present invention, the securing member is comprised of an insulating material 30. For example, the insulating material 30 may be a fibrous product; rubber, plastic and products thereof; glass, ceramic articles; mica, asbestos, and products thereof, and the like. When the fixing member is a screw, the screw is typically made of a metal material, and in this embodiment, the screw is made of an insulating material 30. When the fixing member is a buckle and a clamping groove, the buckle and the clamping groove are also made of an insulating material 30.
According to the embodiment of the invention, the fixing piece is made of the insulating material 30, so that the stability of the integral structure between the high-speed connector 20 and the circuit board 10 can be ensured, normal communication between the high-speed connector 20 and the circuit board 10 can be ensured, meanwhile, the phenomenon of connection between the high-speed connector 20 and the circuit board 10 and other electrical components can be prevented, a certain insulating effect can be realized on the surrounding ring, the short-circuit discharge between the high-speed connector 20 and the circuit board 10 in the using process is avoided, and the high-speed connector 20 and the circuit board 10 cannot be used, so that the damage probability of the circuit board assembly can be reduced.
Further, in an alternative embodiment of the present invention, the insulating material 30 is a resin, which fills the buried groove 40 and fixes the high-speed connector 20 to the circuit board 10.
The resins are classified into natural resins and synthetic resins according to the source of the resins. Natural resins refer to amorphous organic materials derived from animal and plant secretions in nature, such as rosin, amber, shellac, and the like. Synthetic resin refers to resin products such as phenol resin, polyvinyl chloride resin, etc. obtained by chemical synthesis of simple organic substances or chemical reaction of some natural products, wherein the synthetic resin is a main component of plastics.
Resins are classified into addition polymers and condensation polymers when classified according to the synthesis reaction. The addition polymer is a polymer obtained by addition polymerization, and the chemical formula of the chain structure is the same as the molecular formula of the monomer, such as polyethylene, polystyrene, polytetrafluoroethylene and the like. Polycondensates refer to polymers produced by condensation polymerization, whose structural units have a chemical formula different from that of the monomers, such as phenolic resins, polyester resins, polyamide resins, etc.
Resins can be classified into carbon chain polymers, hybrid chain polymers and elemental organic polymers if classified by molecular backbone composition. Carbon chain polymers refer to polymers having backbones entirely composed of carbon atoms, such as polyethylene, polystyrene, and the like. The hetero-chain polymer is a polymer whose main chain is composed of carbon and atoms of two or more elements such as oxygen, nitrogen, sulfur, etc., such as polyoxymethylene, polyamide, polysulfone, polyether, etc. The organic polymer is an organic polymer which does not necessarily contain carbon atoms in the main chain and is mainly composed of atoms of elements such as silicon, oxygen, aluminum, titanium, boron, sulfur, phosphorus and the like, such as organic silicon.
Classified by nature, they can be classified into thermosetting resins, thermoplastic resins, and synthetic resins. Specifically, thermosetting resins (glass fiber reinforced plastics are generally used as such resins) include: unsaturated polyester/vinyl ester/epoxy/phenolic/Bismaleimide (BMI)/polyimide resins, and the like. The thermoplastic resin includes: polypropylene (PP)/Polycarbonate (PC)/NYLON (NYLON)/Polyetheretherketone (PEEK)/Polyethersulfone (PES), and the like. Synthetic resins are a class of high molecular polymers that are artificially synthesized. The most important application of synthetic resins is the manufacture of plastics. For convenience in processing and performance improvement, additives are often added, and sometimes are also used directly in processing and forming, so are often synonymous with plastics. Synthetic resins are also the basic raw materials for the production of synthetic fibers, paints, adhesives, insulating materials, and the like. Synthetic resins are of various kinds, and among them, polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polypropylene (PP) and ABS resins are five general-purpose resins, which are the most widely used synthetic resin materials.
According to the embodiment of the invention, the resin is filled in the buried groove 40 and the high-speed connector 20 is fixed on the circuit board 10, and the resin can truly form an integral structure between the high-speed connector 20 and the circuit board 10 after solidification, so that the stability of the integral structure between the high-speed connector 20 and the circuit board 10 can be ensured, normal communication between the high-speed connector 20 and the circuit board 10 can be ensured, and the problem that the circuit board assembly cannot be used due to separation of the high-speed connector 20 and the circuit board 10 in the use process is avoided, and the damage probability of the circuit board assembly is reduced. Meanwhile, since the resin is poured into the buried groove 40, the resin can well insulate and wrap the pins 50 and the communication wires, and can also generate a power connection phenomenon of the pins 50, the communication wires and other electrical components, so that a certain insulation effect can be achieved on the surrounding ring, and the short-circuit discharge of the pins 50 and the communication wires after dust contamination in the use process is avoided, so that the high-speed connector 20 and the circuit board 10 cannot be used, and the damage probability of the circuit board assembly can be reduced.
Further, in an alternative embodiment of the present invention, the buried grooves 40 are formed on both sides of the high-speed connector 20 and are located below the pins 50. According to the embodiment of the invention, the buried grooves 40 are formed on two sides of the high-speed connector 20 and below the pins 50, so that the length of the pins 50 can be reduced, and meanwhile, the overall length of the pins 50 and the signal wires 60 can be reduced, namely, the wiring length can be reduced, and the link loss can be reduced.
Further, in an alternative embodiment of the present invention, a plurality of trace layers are disposed inside the circuit board 10. By arranging a plurality of wiring layers, the embodiment of the invention can enable a designer to have more layout ideas when initially designing the wiring layout on the multi-layer circuit board 10, and does not need to be displayed by the layout space of a single wiring layer, so that the signal line 60 has more layers to be selectively passed. At the same time, a suitable routing path can be selected for complex, noise-sensitive electronic circuits, providing more degrees of freedom.
Of course, the number of the routing layers can be changed by those skilled in the art according to the actual situation, and the present embodiment is merely illustrative, and for example, three layers, four layers and five layers can be used, but the present invention is not limited thereto, and the same technical effects can be achieved.
Further, in an alternative embodiment of the present invention, two rows of conductive members are provided in the high-speed connector 20, and portions of the two rows of conductive members exposing the high-speed connector 20 are formed as two rows of the pins 50. For the material of the conductive member, the conductive member may be made of a metal material, for example, gold, silver, copper, iron, tin, or aluminum. Of course, the material of the conductive member can be changed by those skilled in the art according to the actual situation, and the present embodiment is merely illustrative, but the present invention is not limited thereto, and the same technical effects can be achieved.
According to the embodiment of the invention, the two rows of conductive pieces are arranged in the high-speed connector 20, and the parts of the two rows of conductive pieces, which are exposed out of the high-speed connector 20, are formed into the two rows of pins 50, so that the pins 50 and the conductive pieces are integrally formed, and compared with the split arrangement of the pins 50 and the conductive pieces, the pins 50 and the conductive pieces are welded, the signal integrity of a link in the signal transmission process can be obviously ensured, and signal interference caused by welding parts in the split arrangement is avoided.
Further, in an alternative embodiment of the present invention, the length of the pins 50 matches the depth of the buried slots 40. Since the distance between the positions of the pin symbols and the surface layer is the buried depth of the high-speed connector 20 and the pin length of the high-speed connector 20, the length of the pin 50 is matched with the depth of the buried groove 40, so that the pin 50 can be just connected with the signal line 60 in the buried groove 40, the wiring length can be reduced, and the link loss can be reduced. If the length of the pin 50 is not matched with the depth of the buried groove 40, there is a problem in that the length of the pin 50 is smaller than the depth of the buried groove 40, and the pin 50 cannot be connected with the signal line 60 in the buried groove 40. It may also occur that the length of the pin 50 is greater than the depth of the buried groove 40, so that the overall length of the pin 50 and the signal line 60 is longer, i.e., the routing length is longer, and the link loss is increased.
Further, in an alternative embodiment of the present invention, the high-speed connector 20 is any one or more of a crimp connector, a surface mount connector, and a through-hole solder connector. According to the embodiment of the invention, the high-speed connectors 20 are arranged into a plurality of types, so that a person skilled in the art can adopt different types of high-speed connectors 20 according to actual conditions, and select a proper wiring path according to different types of high-speed connectors 20, so that the circuit board assembly can meet different application scenes and provide more degrees of freedom when in actual application.
Of course, the type of the high-speed connector 200 can be changed by those skilled in the art according to the actual situation, and the present embodiment is merely illustrative, but the present embodiment is not limited thereto, and the same technical effects can be achieved.
Example 2
The embodiment of the invention also provides a manufacturing method of the circuit board assembly, which is applied to the circuit board assembly of any one of the embodiments, and comprises the following steps:
s1, when designing a drawing of a circuit board 10, presetting pin symbols of a high-speed connector 20 on a wiring layer inside the circuit board 10; then the signal line 60 in the wiring layer is led on the pin symbol by the chip;
s2, processing the circuit board 10 according to the drawing of the circuit board 10; normally, a designed drawing of the circuit board 10 is sent to a circuit board factory, so that the circuit board factory can process the drawing;
s3, after the circuit board 10 is processed, a buried groove 40 is formed in the pin symbol, so that the buried groove 40 is communicated with the wiring layer, and a welding section of the signal wire 60 is exposed in the buried groove 40;
and S4, welding the pin 50 of the high-speed connector 20 and the welding section of the signal wire 60.
So arranged, in the present invention, the pins 50 of the high-speed connector 20 are buried in the routing layer in the circuit board 10 during the high-speed signal wiring design, and thus, the signal wires 60 can be directly connected to the pins 50 of the high-speed connector 20 by routing in the internal routing layer of the circuit board 10. Compared with the prior art in which the signal wires 60 are replaced from the inner wiring layer of the circuit board 10 to the surface layer of the circuit board 10, the design of the replacing via holes is increased, and the replacing via holes are not required to be additionally added, so that the impedance discontinuity caused by the replacing via holes is avoided. Meanwhile, in the embodiment of the invention, the pins 50 of the high-speed connector 20 are directly connected with the signal wires 60 in the wiring layer in the buried groove 40, so that the wiring is not required to be performed on the surface layer of the circuit board 10, the increase of the design laminated layer caused by wiring on the surface layer of the circuit board 10 can be avoided, the wiring length can be reduced, and the link loss can be reduced. In addition, in the routing process, because the punching is required to change the layer to the surface layer in the prior art, when the high-density board card is designed and the high-speed connector 20 is placed close to the board edge, the routing space is more limited. In the embodiment of the invention, the pins 50 of the high-speed connector 20 are directly connected with the signal wires 60 in the wiring layer in the buried groove 40, so that the external space on the surface layer of the circuit board 10 is not occupied, the space between the buried groove 40 and the wiring layer is fully utilized, and the external wiring space can be saved. Furthermore, the circuit board assembly is simpler and more efficient in manufacturing, easy to realize, and capable of saving cost and improving the design reliability of the system.
Further, in an alternative embodiment of the present invention, after the step S4, the method further includes:
and S5, filling resin into the buried groove 40 for burying, and waiting for the solidification of the resin, namely finishing the manufacture.
The embodiment of the invention fills the resin into the buried groove 40 to perform burying, and waits for the solidification of the resin, namely, the manufacturing is completed. Because the resin can truly form an integral structure between the high-speed connector 20 and the circuit board 10 after solidification, the stability of the integral structure between the high-speed connector 20 and the circuit board 10 can be ensured, normal communication between the high-speed connector 20 and the circuit board 10 can be realized, and the problem that the high-speed connector 20 is separated from the circuit board 10 in the use process, so that the circuit board assembly cannot be used is avoided, and the damage probability of the circuit board assembly is reduced. Meanwhile, since the resin is poured into the buried groove 40, the resin can well insulate and wrap the pins 50 and the communication wires, and can also generate a power connection phenomenon of the pins 50, the communication wires and other electrical components, so that a certain insulation effect can be achieved on the surrounding ring, and the short-circuit discharge of the pins 50 and the communication wires after dust contamination in the use process is avoided, so that the high-speed connector 20 and the circuit board 10 cannot be used, and the damage probability of the circuit board assembly can be reduced.
Further, in an alternative embodiment of the present invention, the manufacturing method further includes:
s6, obtaining the distance between the pin symbol and the surface layer of the circuit board 10, namely the depth of the buried groove 40;
and S7, determining the length of the pin 50 of the high-speed connector 20 based on the depth of the buried groove 40, so that the length of the pin 50 is matched with the depth of the buried groove 40. In this embodiment, the depth of the buried groove 40 is also the length of the pin 50 of the high-speed connector 20, and after the depth of the buried groove 40 is determined, the length of the pin 50 of the connector is determined by the connector manufacturer, so that the length of the pin 50 matches the depth of the buried groove 40.
The embodiment of the invention obtains the distance between the pin symbol and the surface layer of the circuit board 10, namely the depth of the buried groove 40; the length of the pin 50 of the high-speed connector 20 is determined based on the depth of the buried groove 40, so that the length of the pin 50 is matched with the depth of the buried groove 40, and the pin 50 can be just connected with the signal line 60 in the buried groove 40, thereby reducing the wiring length and the link loss. If the length of the pin 50 is not matched with the depth of the buried groove 40, there is a problem in that the length of the pin 50 is smaller than the depth of the buried groove 40, and the pin 50 cannot be connected with the signal line 60 in the buried groove 40. It may also occur that the length of the pin 50 is greater than the depth of the buried groove 40, so that the overall length of the pin 50 and the signal line 60 is longer, i.e., the routing length is longer, and the link loss is increased.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the various aspects of the invention will be apparent to persons of ordinary skill in the art upon reading the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (12)
1. A circuit board assembly, comprising:
a circuit board (10) provided with at least one wiring layer inside, wherein a signal line (60) is arranged in the wiring layer;
a buried groove (40) formed in the circuit board (10); the buried groove (40) is communicated with the wiring layer, and a welding section of the signal wire (60) is exposed in the buried groove (40);
and the high-speed connector (20) is arranged on the circuit board (10), and pins (50) of the high-speed connector (20) extend into the buried grooves (40) to be connected with the welding sections.
2. The circuit board assembly of claim 1, further comprising:
and a fixing member for fixing the high-speed connector (20) to the circuit board (10).
3. The circuit board assembly according to claim 2, wherein the fixing member is composed of an insulating material (30).
4. A circuit board assembly according to claim 3, wherein the insulating material (30) is a resin which fills the buried groove (40) and fixes the high-speed connector (20) to the circuit board (10).
5. The circuit board assembly according to any one of claims 1 to 4, wherein the buried slots (40) are open on both sides of the high-speed connector (20) and are located below the pins (50).
6. Circuit board assembly according to any of claims 1 to 4, characterized in that the circuit board (10) is internally provided with a plurality of trace layers.
7. Circuit board assembly according to any of claims 1 to 4, wherein two rows of conductive elements are provided in the high-speed connector (20), the portions of the two rows of conductive elements exposing the high-speed connector (20) being formed as two rows of pins (50).
8. The circuit board assembly according to claim 7, wherein the length of the pins (50) matches the depth of the buried slots (40).
9. The circuit board assembly according to any one of claims 1 to 4, wherein the high-speed connector (20) is any one or more of a crimp connector, a surface mount connector, and a through-hole solder connector.
10. A method of manufacturing a circuit board assembly according to any one of claims 1 to 9, the method comprising:
when designing a drawing of the circuit board (10), presetting pin symbols of the high-speed connector (20) on a wiring layer inside the circuit board (10);
processing the circuit board (10) according to the drawing of the circuit board (10);
after the circuit board (10) is processed, a buried groove (40) is formed in the pin symbol, the buried groove (40) is communicated with the wiring layer, and a welding section of the signal wire (60) is exposed in the buried groove (40);
and welding the pins (50) of the high-speed connector (20) with the welding sections of the signal wires (60).
11. The method of manufacturing according to claim 10, further comprising, after said soldering of the pins (50) of the high-speed connector (20) to the soldered portions of the signal wires (60):
filling resin into the buried groove (40) for burying, and waiting for the solidification of the resin, namely finishing the manufacture.
12. The method of manufacturing according to claim 10 or 11, further comprising:
acquiring the distance between the pin symbol and the surface layer of the circuit board (10), namely the depth of the buried groove (40);
-determining a pin (50) length of the high speed connector (20) based on the depth of the buried groove (40), such that the length of the pin (50) matches the depth of the buried groove (40).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310386786.4A CN116321694A (en) | 2023-04-12 | 2023-04-12 | Circuit board assembly and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310386786.4A CN116321694A (en) | 2023-04-12 | 2023-04-12 | Circuit board assembly and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116321694A true CN116321694A (en) | 2023-06-23 |
Family
ID=86788813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310386786.4A Pending CN116321694A (en) | 2023-04-12 | 2023-04-12 | Circuit board assembly and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116321694A (en) |
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2023
- 2023-04-12 CN CN202310386786.4A patent/CN116321694A/en active Pending
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