CN116314432A - Solar cell preparation method - Google Patents

Solar cell preparation method Download PDF

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Publication number
CN116314432A
CN116314432A CN202111574009.XA CN202111574009A CN116314432A CN 116314432 A CN116314432 A CN 116314432A CN 202111574009 A CN202111574009 A CN 202111574009A CN 116314432 A CN116314432 A CN 116314432A
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China
Prior art keywords
solar cell
mask
carrier
frame
manufacturing
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CN202111574009.XA
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Chinese (zh)
Inventor
何秉轩
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Longi Green Energy Technology Co Ltd
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Longi Green Energy Technology Co Ltd
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Priority to CN202111574009.XA priority Critical patent/CN116314432A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention discloses a solar cell preparation method, and relates to the field of solar cell preparation. The method is used for solving the problem of low bearing rate of the solar cell. The preparation method of the solar cell comprises the following steps: providing a carrier and a mask, wherein the carrier comprises a frame, the frame comprises a containing area capable of containing at least one solar cell, and the outer contour dimension of the mask is larger than or equal to the outer contour dimension of the carrier; and pasting and fixing the frame of the carrier and the solar cell positioned in the accommodating area with the same side face of the mask, and positioning and fixing the carrier and the solar cell through the mask. Because the solar cell is very light, the strength of the mask can play a supporting role. The solar cell is supported through the mask, so that a supporting structure between adjacent hollow holes in the original carrier is omitted, and the solar cell can be arranged tightly, so that the bearing efficiency of the solar cell is improved.

Description

Solar cell preparation method
Technical Field
The invention relates to the technical field of solar cell manufacturing, in particular to a solar cell manufacturing method.
Background
In the manufacturing process of the solar cell, the cell needs to be placed on a carrier for electrode manufacturing, and the carrier is used for carrying and positioning the cell. The existing battery piece carrier is of a hollowed-out frame structure, namely, the carrier is provided with a plurality of hollowed-out holes, the edges of the periphery of each hollowed-out hole correspondingly support the edges of one battery piece, the structural strength of the carrier is guaranteed through a supporting structure between adjacent hollowed-out holes, but the supporting structure occupies the bearing area of the carrier, so that the bearing efficiency of the carrier is low.
Disclosure of Invention
The invention aims to provide a solar cell preparation method for improving the bearing efficiency of a solar cell.
The invention provides a solar cell preparation method, which comprises the following steps:
providing a carrier and a mask, wherein the carrier comprises a frame, the frame comprises a containing area capable of containing at least one solar cell, and the outer contour dimension of the mask is larger than or equal to the outer contour dimension of the carrier;
and pasting and fixing the frame of the carrier and the solar cell positioned in the accommodating area with the same side face of the mask, and positioning and fixing the carrier and the solar cell through the mask.
Under the condition of adopting the technical scheme, the mask is stuck and fixed on the frame, meanwhile, the solar cell is stuck and fixed on the mask and is distributed in the accommodating area inside the frame, and the solar cell is supported and fixed only by the mask. The solar cell is supported through the mask, so that a supporting structure between adjacent hollow holes in the original carrier is omitted, and only one large accommodating area is arranged in the frame of the carrier, so that the solar cell can be closely arranged, the distance between the solar cells is reduced, more solar cells can be accommodated and borne under the condition that the sizes of the frames of the carrier are the same, and the bearing efficiency of the solar cell is improved.
In some possible embodiments, the frame of the carrier and the solar cell located in the accommodating area are adhered and fixed to the same side face of the mask, specifically:
flattening and placing the mask, wherein the pasting surface of the mask faces upwards;
the solar cell and the carrier are placed on the pasting surface of the mask for pasting and fixing, and the solar cell is located in the accommodating area of the carrier.
Under the condition of adopting the technical scheme, the mask can be spread firstly, the pasting surface of the mask faces upwards, then the solar cell and the carrier are placed on the pasting surface of the mask in a divided mode or simultaneously, positioning and fixing of the solar cell on the mask are completed, and the solar cell is positioned and fixed on the carrier through the mask.
In some possible embodiments, the frame of the carrier and the solar cell located in the accommodating area are adhered and fixed to the same side face of the mask, specifically:
placing the solar cell and the carrier on a platform, wherein the adhered surface of the solar cell and the carrier faces upwards, and the solar cell is arranged in a containing area of the carrier;
and pasting the mask to cover the pasted surface of the carrier and the solar cell.
Under the condition of adopting the technical scheme, the solar cell and the carrier can be placed on the platform firstly, the solar cell is arranged in the accommodating area of the carrier, then the mask is stuck and covered on the carrier and the stuck surface of the solar cell upwards, positioning and fixing of the solar cell on the mask are completed, and the solar cell is positioned and fixed on the carrier through the mask.
In some possible embodiments, the solar cells are arranged in a regular array within the containment area. By the arrangement, compact and uniform arrangement of solar cells is realized, the bearing capacity of the mask is more uniform, and the bearing efficiency is improved.
In some possible embodiments, the solar cells are arranged in a row in the receiving area. The arrangement is that at least two side edges of the solar cell can be close to the inner edge of the frame, so that the pasting fixing strength of the mask and the frame and the supporting strength of the mask can meet the required bearing capacity of the solar cell.
In some possible embodiments, the gap width between adjacent solar cells is less than or equal to 2mm;
and/or the width of the gap between the solar cell and the inner edge of the frame is less than or equal to 5mm.
Under the condition of adopting the technical scheme, as the support structure is not required to be arranged in the frame and the solar cell is supported and positioned only through the mask, the gap width between the adjacent solar cell can be as small as possible and can be smaller than or equal to 2mm, and similarly, the gap width between the solar cell and the inner edge of the frame can be as small as possible, so that the layout of the solar cell in the carrier is more compact, and the carrying efficiency of the carrier is improved.
In some possible embodiments, when the frame of the carrier and the solar cell located in the accommodating area are adhered and fixed to the same side face of the mask, the carrier and the solar cell are positioned and fixed by the mask, and then the method further includes the steps of:
adjusting the posture of the carrier so that the side, covered with the mask, of the carrier faces downwards;
and depositing under the mask, and forming an electrode on the solar cell through the hollowed-out pattern on the mask.
Under the condition of adopting the technical scheme, the deposition is carried out from the lower part of the mask, so that the coating process is convenient, for example, when physical vapor deposition is adopted, the evaporation source is positioned below the solar cell, and the formed vapor is conveniently moved upwards to be deposited on the lower surface of the solar cell.
In some possible embodiments, the mask has a base film and an adhesive layer, wherein the base film is made of a high molecular polymer, and comprises one or more of polyethylene terephthalate, polyolefin film, polyimide, polyvinyl chloride and biaxially oriented polypropylene;
the material of the adhesive layer comprises one or more of silica gel, acrylic gel, polyurethane, rubber and polyisobutylene.
Under the condition of adopting the technical scheme, the mask adopts the materials, so that the mask has toughness and flexibility, can conveniently realize the stripping of the mask from the solar cell, and can support the solar cell with lighter mass through the strength of the mask.
In some possible embodiments, the thickness of the mask is 10 μm to 100 μm. Wherein the thickness of the base film is 1 μm-100 μm, and the thickness of the adhesive layer is 1 μm-30 μm. The mask with the thickness can provide enough supporting strength, and the thickness can form a structural shaping effect for the subsequent coating.
In some possible embodiments, the thickness of the mask is 10 μm to 50 μm. The thickness of the base film is 5 μm to 40. Mu.m, more preferably 10 μm to 25. Mu.m, and the thickness of the adhesive layer is 2 μm to 15. Mu.m, still more preferably 3 μm to 10. Mu.m.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
fig. 1 is a schematic structural diagram of a carrier used in a solar cell manufacturing method according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an operation principle of a solar cell manufacturing method according to an embodiment of the present invention;
fig. 3 shows the light absorption performance of a mask according to an embodiment of the present invention.
Reference numerals: 1-frame, 101-accommodation area, 2-solar cell piece, 4-mask.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one unless specifically defined otherwise.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the manufacturing process of the solar cell, the solar cell is required to be placed on a carrier for electrode manufacturing, and the carrier is used for carrying and positioning the solar cell. The existing battery piece carrier is of a hollowed-out frame structure, namely, the carrier is provided with a plurality of hollowed-out holes, the edges of the periphery of each hollowed-out hole correspondingly support the edges of one solar battery piece, the structural strength of the carrier is guaranteed through a supporting structure between adjacent hollowed-out holes, but the supporting structure occupies the bearing area of the carrier, so that the bearing efficiency of the carrier is low.
In view of the above, referring to fig. 1-2, an embodiment of the present invention provides a method for manufacturing a solar cell, which includes the following steps:
step S100, providing a carrier and a mask 4, wherein the carrier comprises a frame 1, and the frame 1 comprises a receiving area 101 capable of receiving at least one solar cell, i.e. the frame 1 comprises a whole receiving area 101; the outer dimension of the mask 4 is greater than or equal to the outer dimension of the carrier, so that the mask 4 can completely cover the entire frame 1, and fig. 2 is a cross-sectional view of section A-A in fig. 1.
In step S200, the frame 1 of the carrier and the solar cell 2 located in the accommodating area 101 are adhered and fixed to the same side surface of the mask 4, and the carrier and the solar cell 2 are positioned and fixed through the mask 4.
When the method is adopted, the mask 4 completely covers the whole frame 1, so that the accommodating area 101 of the frame 1 is also covered by the mask 4, the mask 4 is fixedly adhered to the frame 1, meanwhile, the solar cells 2 are fixedly adhered to the mask 4 and are arranged in the accommodating area 101 in the frame 1, and only the mask 4 is used for supporting and fixing the solar cells 2, and the strength of the mask 4 can play a supporting role due to the fact that the solar cells 2 are very light. The solar cell 2 is supported and positioned in the frame 1 through the mask 4, so that a supporting structure between adjacent hollow holes in the original carrier is omitted, and only one large accommodating area 101 is arranged in the frame 1 of the carrier, so that the arrangement of the solar cell 2 can be tightly arranged, the spacing between the solar cell 2 is reduced, more solar cell 2 can be accommodated and borne under the condition that the sizes of the frames 1 of the carrier are the same, and the bearing efficiency of the solar cell 2 is improved.
Further, the embodiment provides a specific adhering and fixing manner of the carrier, the solar cell 2 and the mask 4, in the step S200, the frame 1 of the carrier and the solar cell 2 located in the accommodating area 101 are adhered and fixed to the same side surface of the mask 4, which specifically includes the following steps:
in step S211, the mask 4 is laid flat, specifically, may be placed on a platform, and the adhesive surface of the mask 4 faces upward.
In step S212, the solar cell 2 and the carrier are placed on the adhering surface of the mask 4 for adhering and fixing, and the solar cell 2 is located in the accommodating area 101 of the carrier.
In specific operation, the solar cells 2 can be placed on the pasting surface of the mask 4 one by one or simultaneously, arranged according to the set layout and arrangement interval and pasted and fixed with the mask 4, and then the carrier is sleeved around the arranged solar cells 2, and the carrier is fixed with the pasting surface of the mask 4.
Or, the carrier may be placed on the adhesive surface of the mask 4 first, so that the entire frame 1 is located in the area of the mask 4, and then the solar cells 2 are placed on the mask located in the accommodating area 101 of the frame 1 one by one or simultaneously, and are arranged according to the set layout and arrangement interval and adhered and fixed with the mask 4.
Alternatively, the carrier and the solar cell 2 may be simultaneously placed on the adhesive surface of the mask 4 and fixed by adhesion.
Under the condition of adopting the technical scheme, the mask 4 can be spread firstly, the pasting surface of the mask 4 faces upwards, then the solar cell 2 and the carrier are placed on the pasting surface of the mask 4 in a separated mode or simultaneously, positioning and fixing of the solar cell 2 on the mask 4 are completed, and the solar cell 2 is positioned and fixed on the carrier through the mask 4.
In addition, the embodiment provides another specific adhering and fixing method for the carrier, the solar cell 2 and the mask 4, in the step S200, the frame 1 of the carrier and the solar cell 2 located in the accommodating area 101 are adhered and fixed to the same side surface of the mask 4, which specifically includes the following steps:
step S221, placing the solar cell 2 and the carrier on a platform, wherein the adhered surfaces of the solar cell 2 and the carrier face upwards, and the solar cell 2 is arranged in the accommodating area 101 of the carrier;
in step S222, the mask 4 is adhered and covered on the carrier and the adhered surface of the solar cell 2.
During specific operation, the solar cells 2 can be placed on the platform one by one or simultaneously, and are arranged according to the set layout and arrangement intervals, then the carrier is sleeved around the arranged solar cells 2, and finally the mask 4 is integrally adhered and covered on the carrier and the adhered surface of the solar cells 2.
Or, the carrier may be placed on the platform first, then the solar cells 2 are placed on the platform in the accommodating area 101 of the frame 1 one by one or simultaneously, and arranged according to the set layout and arrangement interval, and finally the mask 4 is integrally adhered and covered on the carrier and the adhered surface of the solar cells 2.
Alternatively, the carrier and the solar cell 2 may be placed on the platform at the same time, and then the mask 4 may be integrally adhered to and covered on the adhered surface of the carrier and the solar cell 2.
Under the condition of adopting the technical scheme, the solar cell 2 and the carrier can be placed on the platform firstly, the solar cell 2 is arranged in the accommodating area 101 of the carrier, then the mask 4 is stuck and covered on the carrier and the stuck surface of the solar cell 2 upwards, the positioning and fixing of the solar cell 2 on the mask 4 are completed, and the solar cell 2 is positioned and fixed on the carrier through the mask 4.
As shown in fig. 1, in the present embodiment, the solar cells 2 are arranged in a regular array in the accommodation area 101. The regular array may be a rectangular array, a central radiating array, a circular array, etc., with the appropriate arrangement being determined by the shape of the carrier and the receiving area 101. By the arrangement, the compact and uniform arrangement of the solar cells 2 is realized, the bearing capacity of the mask 4 is more uniform, the bearing efficiency is improved, and the mask pattern is convenient to correspond to the solar cells 2.
Taking a rectangular array as an example, the solar cells 2 may be arranged in a 4×4 array, a 3×4 array, a 5×5 array, or the like. Preferably, the solar cells 2 are distributed at equal intervals, so that the arrangement is more neat and convenient. Of course, the substrates may be arranged at unequal intervals.
Of course, the solar cells 2 may be irregularly arranged in the accommodation region 101 as long as a compact arrangement between adjacent solar cells 2 is enabled.
Further, in the present embodiment, the solar cells 2 are arranged in a straight line shape in the accommodating area 101. The number of the solar cells 2 may be two, three, four, five, or the like, or more, as long as the structural strength of the mask 4 can support the weight of the solar cells 2, and the number is not particularly limited. The solar cell pieces 2 are arranged in a straight line, so that at least two side edges of the solar cell pieces 2 can be close to the inner edge of the frame 1, the adhesive fixing strength of the mask 4 and the frame 1 and the supporting strength of the mask 4 can meet the required bearing capacity of the solar cell pieces 2, and the mask 4 is not easy to deform.
In this embodiment, the width of the gap between adjacent solar cells 2 is less than or equal to 2mm, specifically may be 0.5mm, 1mm, 1.5mm, 2mm, etc.;
and/or the width of the gap between the solar cell 2 and the inner edge of the frame 1 is less than or equal to 5mm, and specifically may be 0.5mm, 1mm, 1.5mm, 2mm, 3mm, 4mm, 5mm, etc.
Under the condition of adopting the technical scheme, as the support structure is not required to be arranged in the frame 1, the solar cell 2 is supported and positioned only through the mask 4, the gap width between the adjacent solar cells 2 can be as small as possible and can be smaller than or equal to 2mm, and similarly, the gap width between the solar cell 2 and the inner edge of the frame 1 can be as small as possible, so that the layout of the solar cell 2 in the carrier is more compact, and the carrying efficiency of the carrier is improved.
In this embodiment, in step S200, the frame 1 of the carrier and the solar cell 2 located in the accommodating area 101 are adhered and fixed to the same side surface of the mask 4, and the carrier and the solar cell 2 are positioned and fixed by the mask 4, and then the method further includes the steps of:
step S300, adjusting the posture of the carrier so that the side of the carrier covered with the mask 4 faces downwards, as shown in FIG. 2;
in step S400, deposition is performed under the mask 4, and an electrode is formed on the solar cell 2 through the hollowed-out pattern on the mask 4. Wherein the deposition method can be one or more of a Physical Vapor Deposition (PVD) method and a Chemical Vapor Deposition (CVD) method, and the physical vapor deposition process can be one or more of a combination of vacuum evaporation, sputter coating, ion plating and the like.
Under the condition of adopting the technical scheme, the deposition is carried out from the lower part of the mask 4, so that the coating process is convenient, for example, when physical vapor deposition is adopted, the evaporation source is positioned below the solar cell 2, and the formed vapor is conveniently moved upwards to be deposited on the lower surface of the solar cell 2.
Of course, the posture of the carrier can be adjusted, so that the side of the carrier covered with the mask 4 faces upwards, and a reasonable coating process is adopted.
Further, in this embodiment, the mask 4 has a base film and an adhesive layer, and the base film is made of a high molecular polymer, including one or more of polyethylene terephthalate (PET), polyolefin film (PO), polyimide (PI), polyvinyl chloride (PVC), and biaxially oriented polypropylene; the material of the adhesive layer comprises one or more of silica gel, acrylic gel, polyurethane, rubber and polyisobutylene.
By adopting the materials, the base film has toughness and flexibility, and the mask 4 can be conveniently peeled off from the solar cell 2, wherein the peeling mode can be one or more of pyrolysis separation, ultraviolet irradiation separation and mechanical separation. The solar cell 2 having a light weight can be supported by the strength of the mask 4 itself. The mask 4 is fixed with the pasting of frame 1 and solar wafer 2 through the glue film of self, regard as the glue film part of mask 4, the glue film is the solid state, so, makes things convenient for the preparation of the fretwork pattern before mask 4 pastes, and the shape and the size of fretwork pattern are more accurate, and can not cause the damage to solar wafer 2.
Of course, the mask 4 may be bonded by an external independent glue coating method without setting a glue layer, and the hollowed pattern on the mask 4 may be manufactured after the mask 4 is adhered to the solar cell 2.
In some possible embodiments, the overall thickness of the mask 4 is 10 μm-100 μm. Wherein the thickness of the base film is 1 μm-100 μm, and the thickness of the adhesive layer is 1 μm-30 μm. The thickness of the mask 4 can provide enough supporting strength, and the thickness can form a structural shaping effect for the subsequent coating film.
Preferably, in the present embodiment, the overall thickness of the mask 4 is 10 μm to 50 μm, wherein the thickness of the base film is 5 μm to 40 μm, and further preferably 10 μm to 25 μm; the thickness of the adhesive layer is 2 μm to 15 μm, and a further preferable thickness is 3 μm to 10 μm.
By way of example, the overall thickness of the mask is 10 μm, then the thickness of the base film is 6 μm and the thickness of the glue layer is 4 μm; the overall thickness of the mask is 20 mu m, the thickness of the base film is 12 mu m, and the thickness of the adhesive layer is 8 mu m; the overall thickness of the mask is 30 mu m, the thickness of the base film is 20 mu m, and the thickness of the adhesive layer is 10 mu m; the overall thickness of the mask is 40 mu m, the thickness of the base film is 28 mu m, and the thickness of the adhesive layer is 12 mu m; the overall thickness of the mask was 50. Mu.m, the thickness of the base film was 35. Mu.m, and the thickness of the glue layer was 15. Mu.m.
By adopting the mask 4 with the material and the thickness, the tensile strength of the mask 4 is 80 Mpa-400 Mpa, and the requirement of the supporting strength of the solar cell 2 can be met.
In this embodiment, the mask 4 is used, and the characteristics of the base film are as follows: the absorption coefficient of the base film under the irradiation of an ultraviolet light source with the thickness below 200 mu m is more than or equal to 20 percent, preferably more than or equal to 50 percent, more preferably more than or equal to 80 percent, wherein the wavelength of the ultraviolet light source is 355+/-15 nm; or, the absorption coefficient of the base film under the irradiation of a green light source with the thickness below 200 μm is more than or equal to 20%, preferably more than or equal to 50%, more preferably more than or equal to 80%, wherein the wavelength of the green light source is 530+/-15 nm; or, the absorption coefficient of the base film under the irradiation of an infrared light source with the thickness below 200 μm is more than or equal to 20%, preferably more than or equal to 50%, more preferably more than or equal to 80%, wherein the wavelength of the infrared light source is 1045+/-20 nm; the visible light transmittance of the base film is less than or equal to 90 percent.
The adhesive layer has the characteristics that: the absorption coefficient of the adhesive layer under the irradiation of an ultraviolet light source is more than or equal to 5 percent, preferably more than or equal to 50 percent, more preferably more than or equal to 80 percent, and the thickness of the adhesive layer is less than or equal to 200 mu m, wherein the wavelength of the ultraviolet light source is 355+/-15 nm; or, the absorption coefficient of the adhesive layer under the irradiation of a green light source with the thickness below 200 μm is more than or equal to 5%, preferably, the absorption coefficient is more than or equal to 50%, more preferably, the absorption coefficient is more than or equal to 80%, wherein the wavelength of the green light source is 530+/-15 nm; or, the absorption coefficient of the adhesive layer under the irradiation of an infrared light source with the thickness of less than 200 mu m is more than or equal to 5 percent, preferably more than or equal to 50 percent, more preferably more than or equal to 80 percent, wherein the wavelength of the infrared light source is 1045+/-20 nm.
Specific scene embodiment: the mask 4 is composed of a laminate of a polymer film (base film) and an adhesive film (glue layer). The polymer film uses a blue PET film material with the thickness of 5 mu m, and the specific parameters of the blue PET film material are as follows: the visible light transmittance is less than or equal to 90 percent, and the 355nm ultraviolet wavelength energy absorption coefficient is more than or equal to 50 percent. Fig. 3 is a schematic diagram of wavelengths and absorption coefficients of a blue PET film material used for a polymer film according to an embodiment of the present invention. As shown in fig. 3, the abscissa represents the wavelength range in nm, and the ordinate represents the absorption coefficient in%. In the figure 31 represents the absorption coefficient of the polymer film using blue PET film material in different wavelength ranges. In the figure, 32 represents the absorption coefficient of the polymer film in different wavelength ranges using transparent PET film material. As can be seen, the energy absorption coefficient of the polymer film using the blue PET film material at the wavelength of 355nm ultraviolet light is 53%, as shown in fig. 33.
By adopting the mask 4, when the hollowed-out pattern of the mask 4 is manufactured by using laser, the mask 4 can absorb laser energy well, and rapid patterning of the mask 4 is realized.
In this embodiment, the frame may be made of one or more of invar, ceramic, quartz, and stainless steel. The invar alloy can maintain its dimensions over a wide temperature range due to its extremely low coefficient of thermal expansion. In addition, the ceramic, quartz and stainless steel have larger heat conductivity coefficient and small heat expansion coefficient,can dispel the heat fast and reduce thermal expansion deformation to reduce the frame because of the expansion deformation that high temperature produced, reduce the frame and drag the mask, reduce the high temperature simultaneously and melt the influence to the high temperature of mask glue film. Wherein the magnetic stainless steel has a thermal expansion coefficient of 12×10 in the range of 0-100deg.C -6 a/DEG C; si has a thermal expansion coefficient of 2.5X10 -6 and/C. Wherein, the heat conductivity of Si is 150W/(m.cndot.C.), the heat conductivity of quartz is 1.3W/(m.cndot.C.), and the heat conductivity of invar alloy is 13.8W/(m.cndot.C).
In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A method of manufacturing a solar cell, comprising the steps of:
providing a carrier and a mask, wherein the carrier comprises a frame, the frame comprises a containing area capable of containing at least one solar cell, and the outer contour dimension of the mask is larger than or equal to that of the carrier;
and pasting and fixing the frame of the carrier and the solar cell positioned in the accommodating area with the same side face of the mask, and positioning and fixing the carrier and the solar cell through the mask.
2. The method for manufacturing a solar cell according to claim 1, wherein the attaching and fixing the frame of the carrier and the solar cell located in the accommodating area to the same side of the mask specifically includes:
flattening and placing the mask, wherein the pasting surface of the mask faces upwards;
and placing the solar cell and the carrier on the pasting surface of the mask for pasting and fixing, and enabling the solar cell to be located in the accommodating area of the carrier.
3. The method for manufacturing a solar cell according to claim 1, wherein the attaching and fixing the frame of the carrier and the solar cell located in the accommodating area to the same side of the mask specifically includes:
placing the solar cell and the carrier on a platform, wherein the adhered surfaces of the solar cell and the carrier face upwards, and the solar cell is arranged in a containing area of the carrier;
and pasting the mask to cover the pasted surfaces of the carrier and the solar cell.
4. The method for manufacturing a solar cell according to any one of claims 1 to 3, wherein the solar cells are arranged in a regular array in the accommodation area.
5. The method of claim 4, wherein the solar cells are arranged in a row in the receiving area.
6. A method of manufacturing a solar cell according to any one of claims 1 to 3, wherein the gap width between adjacent solar cells is less than or equal to 2mm;
and/or, the width of the gap between the solar cell and the inner edge of the frame is less than or equal to 5mm.
7. A method of manufacturing a solar cell according to any one of claims 1 to 3, wherein the frame of the carrier and the solar cell located in the accommodating area are adhered and fixed to the same side of the mask, and the carrier and the solar cell are positioned and fixed by the mask, and further comprising the steps of:
adjusting the posture of the carrier so that one side of the carrier covered with the mask faces downwards;
and depositing under the mask, and forming an electrode on the solar cell through the hollowed-out pattern on the mask.
8. The method for manufacturing a solar cell according to claim 1, wherein the mask has a base film and an adhesive layer, and the base film is made of a high molecular polymer including one or more of polyethylene terephthalate, a polyolefin film, polyimide, polyvinyl chloride, and biaxially oriented polypropylene;
the material of the adhesive layer comprises one or more of silica gel, acrylic gel, polyurethane, rubber and polyisobutylene.
9. The method of claim 1, wherein the mask has a thickness of 10 μm to 100 μm.
10. The method of claim 1, wherein the mask has a thickness of 10 μm to 50 μm.
CN202111574009.XA 2021-12-21 2021-12-21 Solar cell preparation method Pending CN116314432A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111574009.XA CN116314432A (en) 2021-12-21 2021-12-21 Solar cell preparation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111574009.XA CN116314432A (en) 2021-12-21 2021-12-21 Solar cell preparation method

Publications (1)

Publication Number Publication Date
CN116314432A true CN116314432A (en) 2023-06-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111574009.XA Pending CN116314432A (en) 2021-12-21 2021-12-21 Solar cell preparation method

Country Status (1)

Country Link
CN (1) CN116314432A (en)

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