CN116314056A - Package and method for manufacturing the same - Google Patents

Package and method for manufacturing the same Download PDF

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Publication number
CN116314056A
CN116314056A CN202310129095.6A CN202310129095A CN116314056A CN 116314056 A CN116314056 A CN 116314056A CN 202310129095 A CN202310129095 A CN 202310129095A CN 116314056 A CN116314056 A CN 116314056A
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CN
China
Prior art keywords
conductive part
package
insulating layer
blocking wall
conductive
Prior art date
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Pending
Application number
CN202310129095.6A
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Chinese (zh)
Inventor
杨泽华
熊佳
魏炜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Guangxin Packaging Substrate Co ltd
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Guangzhou Guangxin Packaging Substrate Co ltd
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Application filed by Guangzhou Guangxin Packaging Substrate Co ltd filed Critical Guangzhou Guangxin Packaging Substrate Co ltd
Priority to CN202310129095.6A priority Critical patent/CN116314056A/en
Publication of CN116314056A publication Critical patent/CN116314056A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The application discloses a packaging body and a manufacturing method thereof, wherein the packaging body comprises a carrier plate, an insulating layer, a blocking wall and filling glue; the surface of the carrier plate is provided with a conductive circuit layer, and the conductive circuit layer comprises a first conductive part and a second conductive part; the insulating layer is arranged on the carrier plate and surrounds the first conductive part; the blocking wall is arranged on the insulating layer and surrounds the first conductive part, the first conductive part is further coated by the filling glue, and the blocking wall is used for preventing the filling glue from overflowing to the second conductive part. Above-mentioned packaging body, first electrically conductive portion is used for fixed components and parts, and the second electrically conductive portion is used for welding the wiring, has additionally set up the wall structure that blocks on the insulating layer between first electrically conductive portion and the second electrically conductive portion, blocks that the wall can block that the packing is glued and spread to the second electrically conductive portion, effectively prevents the packing and glues the unusual unable normal problem that switches on of wiring that the regional gold-plated of second electrically conductive portion caused.

Description

Package and method for manufacturing the same
Technical Field
The present disclosure relates to the field of device packaging technology, and in particular, to a package and a method for manufacturing the same.
Background
The package plays roles in mounting, fixing, sealing, protecting components, enhancing electrothermal performance and the like.
The conductive circuit on the packaging carrier plate is not only provided with a region for fixing components, but also provided with a region for welding and routing, the components are required to be fixed on the packaging carrier plate through glue reinforcement, in the processing process, the diffusion of the glue is uncontrollable, and the glue easily spreads from the region for fixing the components to the region for welding and routing, so that the region for welding and routing is covered by the glue, and the region for welding and routing cannot be normally conducted and routed.
Disclosure of Invention
An objective of the embodiments of the present application is to provide a package and a method for manufacturing the same, so as to prevent glue from spreading to a soldering and wire bonding area on a carrier.
In order to solve the above technical problems, in a first aspect, an embodiment of the present application provides a package, where the package includes a carrier, an insulating layer, a blocking wall, and a filling glue; the surface of the carrier plate is provided with a conductive circuit layer, and the conductive circuit layer comprises a first conductive part and a second conductive part; the insulating layer is arranged on the carrier plate and surrounds the first conductive part; the blocking wall is arranged on the insulating layer and surrounds the first conductive part, the first conductive part is further coated by filling glue, and the blocking wall is used for preventing the filling glue from overflowing to the second conductive part.
In one possible embodiment, the method further comprises: the component is fixed on the first conductive part and is also connected with the second conductive part through a conductive piece; and the filling glue fills a gap between the component and the first conductive part.
In one possible implementation manner, the surface of the blocking wall away from the carrier plate is higher than the filling glue, and the area of the blocking wall is smaller than the area of the insulating layer.
In one possible embodiment, a side of the blocking wall adjacent to the first conductive portion is flush with a side of the insulating layer adjacent to the first conductive portion.
In one possible embodiment, the blocking wall is disposed obliquely near a side surface of the first conductive portion, and the oblique surface faces the first conductive portion and a direction away from the carrier plate.
In one possible implementation manner, the side surface of the blocking wall, which is close to the first conductive portion, is a bending surface, and the distance between the bending surface and the first conductive portion gradually increases along the direction away from the carrier plate.
In one possible embodiment, the insulating layer is ink, and the barrier wall is ink or molding compound.
In order to solve the above technical problem, in a second aspect, an embodiment of the present application provides a method for manufacturing a package, including: obtaining a carrier plate, wherein a conductive circuit layer is arranged on the surface of the carrier plate, and the conductive circuit layer comprises a first conductive part and a second conductive part; manufacturing an insulating layer on the carrier plate, and enabling the insulating layer to surround the first conductive part; and manufacturing a blocking wall on the insulating layer, so that the blocking wall surrounds the first conductive part.
In one possible embodiment, the insulating layer and the barrier wall are both ink; the step of manufacturing the insulating layer comprises the following steps: coating ink on the surface of the carrier plate, exposing and developing a set area of the ink, and curing the set area of the ink to enable the area of the ink surrounding the first conductive part to be cured and reserved to form an insulating layer; the step of manufacturing the blocking wall comprises the following steps: and (3) carrying out a second ink coating on the carrier plate, carrying out a second exposure and development on the set area of the ink, and curing the set area of the ink so that the area of the ink surrounding the first conductive part is cured and reserved to form a blocking wall.
In one possible embodiment, after the step of manufacturing the blocking wall, the method further includes: and fixing a component on the first conductive part, and filling glue in a gap between the component and the first conductive part, wherein the blocking wall is used for preventing the filling glue from overflowing to the second conductive part.
The beneficial effects of this application are: different from the prior art, the application provides a package and a manufacturing method thereof, wherein the package comprises a carrier plate, an insulating layer, a blocking wall and filling glue; the surface of the carrier plate is provided with a conductive circuit layer, and the conductive circuit layer comprises a first conductive part and a second conductive part; the insulating layer is arranged on the carrier plate and surrounds the first conductive part; the blocking wall is arranged on the insulating layer and surrounds the first conductive part, the first conductive part is further coated by the filling glue, and the blocking wall is used for preventing the filling glue from overflowing to the second conductive part. Above-mentioned packaging body, first electrically conductive portion is used for fixed components and parts, and the second electrically conductive portion is used for welding the wiring, has additionally set up the wall structure that blocks on the insulating layer between first electrically conductive portion and the second electrically conductive portion, blocks that the wall can block that the packing is glued and spread to the second electrically conductive portion, effectively prevents the packing and glues the unusual unable normal problem that switches on of wiring that the regional gold-plated of second electrically conductive portion caused.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
FIG. 1 is a schematic view of a first embodiment of a package of the present application;
FIG. 2 is a schematic view of a second embodiment of the package of the present application;
FIG. 3 is a schematic view of a third embodiment of a package of the present application;
FIG. 4 is a schematic flow chart of a first embodiment of a method for fabricating a package of the present application;
FIG. 5 is a flow chart of a second embodiment of a method for fabricating a package of the present application;
fig. 6a to 6f are schematic structural flow diagrams corresponding to the packaging method of fig. 4.
Reference numerals: 100/200/300, package; 110/210/310, carrier plate; 121/221/321, a first conductive portion; 122/222/322, a second conductive portion; 130/230/330, insulating layer; 140/240/340, barrier wall; 150/250/350, and filling glue; 160. a conductive member; 170/270/370, components.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two, but does not exclude the case of at least one.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
The conductive circuit on the packaging loading board has the area for fixing the components and the area for welding and wire bonding, and in the processing process, the glue for fixing the components and the area is easy to spread to the area for welding and wire bonding, so that normal conduction and wire bonding cannot be realized.
The application provides a package and a manufacturing method thereof. The blocking wall is arranged on the insulating layer between the fixed component area and the welding wire bonding area on the conductive circuit, so that the problems are effectively solved, and the package and the manufacturing method thereof provided by the application are described in detail below with reference to the drawings and the embodiment.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a first embodiment of a package of the present application; in one embodiment, the package 100 of the present application includes a carrier 110, an insulating layer 130, a blocking wall 140, and a filling compound 150.
The surface of the carrier plate 110 is provided with a conductive circuit layer, and the conductive circuit layer comprises a first conductive part 121 and a second conductive part 122; the insulating layer 130 is disposed on the carrier 110 and surrounds the first conductive portion 121; the blocking wall 140 is disposed on the insulating layer 130, surrounding the first conductive portion 121, and the first conductive portion 121 is further covered by the filling compound 150, and the blocking wall 140 is used for preventing the filling compound 150 from overflowing to the second conductive portion 122. Specifically, one surface of the carrier plate 110 is provided with a conductive circuit layer, or both surfaces of the carrier plate 110 are provided with conductive circuit layers. In this embodiment, conductive circuit layers are disposed on both sides of the carrier 110, and the carrier 110 is formed with metal vias, and the conductive circuit layers on both sides are connected through the metal vias. The conductive circuit layer on the first surface is used for connecting the device and wire bonding, and the metal through hole is used for leading out pins of the device to the conductive circuit layer on the second surface. The conductive circuit layer on the first surface includes a first conductive portion 121 and a second conductive portion 122, where the number of the first conductive portions 121 is at least one, for example, 1, 3, or 4, and is not specifically limited, and the number of the devices to be packaged and fixed is set according to actual needs. The first conductive portion 121 is used for welding and fixing devices, the fixed devices are further connected with the second conductive portion 122 in a wire bonding mode, wherein the first conductive portion 121 is further covered with the filling glue 150 to reinforce the devices, in the processing process, the diffusion of the filling glue 150 is uncontrollable, if the filling glue spreads to cover the second conductive portion 122, the second conductive portion 122 can be affected to conduct and wire bonding normally, in the embodiment, the blocking wall 140 is additionally manufactured on the insulating layer 130, the insulating layer 130 is arranged in the area of the carrier plate 110 where no conducting wire is arranged, the first conductive portion 121 is surrounded by the insulating layer 130, and the insulating layer 130 plays roles in isolation and protection. The insulating layer 130 is provided with a blocking wall 140 on a region surrounding the first conductive portion 121, the blocking wall 140 also surrounds the first conductive portion 121, the blocking wall 140 is arranged to enable the first conductive portion 121 to be fully surrounded, and in a processing process, when the filling glue 150 is injected into the region of the first conductive portion 121, the blocking wall 140 can block the filling glue 150 from spreading to the second conductive portion 122.
In contrast to the prior art, the present application proposes a package 100, the insulating layer 130 of the package 100 is additionally provided with a blocking wall 140 surrounding the first conductive portion 121, the blocking wall 140 surrounds the first conductive portion 121, the blocking wall 140 enables the first conductive portion 121 to be fully surrounded, during the processing, when the filling glue 150 is injected into the first conductive portion 121, the blocking wall 140 can block the filling glue 150 from spreading to the second conductive portion 122, and the problem that the bonding abnormality caused by the pollution of the filling glue 150 to the gold-plated area of the second conductive portion 122 cannot be normally conducted is effectively prevented.
With continued reference to fig. 1, in the present embodiment, the package 100 further includes a component 170, the component 170 is fixed on the first conductive portion 121, and the component 170 is further connected to the second conductive portion 122 through the conductive member 160; wherein the filling compound 150 fills the gap between the component 170 and the first conductive portion 121. Specifically, the component 170 is fixed on the first conductive portion 121 by means of welding, copper columns, conductive leads, and the like, and the filling glue 150 between the component 170 and the first conductive portion 121 is used for reinforcing the component 170 and protecting the first conductive portion 121, and due to the arrangement of the blocking wall 140, the filling glue 150 is effectively blocked from spreading to the second conductive portion 122. In this embodiment, the conductive member 160 is a conductive lead, and in some other embodiments, the component 170 can be connected to the second conductive portion 122 through other conductive members 160 such as a metal pillar, which is not limited in particular.
In the present embodiment, the surface of the blocking wall 140 away from the carrier 110 is higher than the filling glue 150, and the area of the blocking wall 140 is smaller than the area of the insulating layer 130. Specifically, the design that the height of the blocking wall 140 is higher than that of the filling glue 150 can effectively block the filling glue 150 from overflowing to the second conductive portion 122 area, and effectively prevent the problem that the bonding wire is abnormal and cannot be normally conducted due to the pollution of the filling glue 150 to the gold-plated area of the second conductive portion 122.
In the present embodiment, the side surface of the blocking wall 140 adjacent to the first conductive portion 121 is flush with the side surface of the insulating layer 130 adjacent to the first conductive portion 121. In other preferred embodiments, the side of the blocking wall 140 away from the first conductive portion 121 is flush with the side of the insulating layer 130 away from the first conductive portion 121, which has the advantage that a space capable of containing the excessive filling compound 150 is formed on the insulating layer 130 in the direction of the blocking wall 140 close to the first conductive portion 121, and the excessive filling compound 150 overflows in the space and is blocked by the blocking wall 140 from flowing into the second conductive portion 122, so that the effect of improving the blocking wall 140 to block the filling compound 150 from flowing into the second conductive portion 122 is better.
In this embodiment, the insulating layer 130 and the blocking wall 140 are both made of ink, and the ink has good insulation effect, and plays roles of protecting and preventing oxidation. The insulating layer 130 is formed by coating ink on the surface of the carrier plate 110, exposing and developing the coated ink specific area, and then curing the coated ink specific area, and after forming the insulating layer 130, coating ink on the surface of the carrier plate 110 for the second time, exposing and developing the coated ink specific area again, and then curing the coated ink specific area for the second time, so that the ink blocking wall 140 surrounding the first conductive part 121 is formed on the insulating layer 130. In some other embodiments, the blocking wall 140 can also be one or more of plastic molding compound including, for example, epoxy, polyimide, bismaleimide triazine, and the plastic molding compound is deposited on the insulating layer 130 to form the blocking wall 140 around the first conductive portion 121.
In contrast to the prior art, the present application proposes a package 100, the insulating layer 130 of the package 100 is additionally provided with a blocking wall 140 surrounding the first conductive portion 121, the blocking wall 140 surrounds the first conductive portion 121, the blocking wall 140 enables the first conductive portion 121 to be fully surrounded, during the processing, when the filling glue 150 is injected into the first conductive portion 121, the blocking wall 140 can block the filling glue 150 from spreading to the second conductive portion 122, and the problem that the bonding abnormality caused by the pollution of the filling glue 150 to the gold-plated area of the second conductive portion 122 cannot be normally conducted is effectively prevented.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a second embodiment of a package body of the present application, in which a package body 200 includes a carrier 210, an insulating layer 230, a barrier wall 240 and a filling compound 250.
The surface of the carrier 210 is provided with a conductive circuit layer, and the conductive circuit layer comprises a first conductive part 221 and a second conductive part 222; the insulating layer 230 is disposed on the carrier 210 and surrounds the first conductive portion 221; the blocking wall 240 is disposed on the insulating layer 230, surrounding the first conductive portion 221, where the first conductive portion 221 is further covered by the filling compound 250, and the blocking wall 240 is used for preventing the filling compound 250 from overflowing to the second conductive portion 222. The component 270 is fixed to the first conductive portion 221
Unlike the first embodiment, in the present embodiment, the blocking wall 240 is disposed obliquely to the side surface of the first conductive portion 221, and the oblique surface faces the first conductive portion 221 and the direction away from the carrier 210. Specifically, by the structural design, the surface of the blocking wall 240 surrounding the first conductive portion 221 is an inclined surface, the inclined surface forms a slope surface facing away from the first conductive portion 221, when the filling glue 250 is injected into the first conductive portion 221 in the processing process, the excessive filling glue 250 overflows gradually and slowly releasing when the inclined surface flows, the effect of blocking the filling glue 250 from overflowing to the second conductive portion 222 is improved, and the problem that abnormal wire bonding caused by pollution of the filling glue 250 to the gold-plated area of the second conductive portion 222 cannot be conducted normally is effectively prevented.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a third embodiment of a package body of the present application, in which a package body 300 includes a carrier 310, an insulating layer 330, a barrier wall 340 and a filling compound 350.
The surface of the carrier 310 is provided with a conductive circuit layer, and the conductive circuit layer comprises a first conductive part 321 and a second conductive part 322; the insulating layer 330 is disposed on the carrier 310 and surrounds the first conductive portion 321; the blocking wall 340 is disposed on the insulating layer 330, surrounding the first conductive portion 321, and the first conductive portion 321 is further covered by the filling compound 350, and the blocking wall 340 is used for preventing the filling compound 350 from overflowing to the second conductive portion 322. The first conductive portion 321 has the component 370 fixed thereon.
Unlike the first embodiment and the second embodiment, in the present embodiment, the side surface of the blocking wall 340 close to the first conductive portion 321 is a bending surface, and the distance between the bending surface and the first conductive portion 321 gradually increases along the direction away from the carrier 310. Specifically, by the structural design, the surface of the blocking wall 340, which is close to the first conductive portion 321, forms a slope surface facing away from the first conductive portion 321, and when the filling glue 350 is injected into the first conductive portion 321 in the processing process, the excessive filling glue 350 overflows gradually and slowly releasing when the slope surface flows, so that the effect of blocking the filling glue 350 from overflowing to the second conductive portion 322 is improved, and the problem that abnormal wire bonding caused by pollution of the filling glue 350 to the second conductive portion 322 in a gold-plated area cannot be conducted normally is effectively prevented.
Correspondingly, the present application further proposes a method for manufacturing a package, referring to fig. 4, fig. 4 is a schematic flow chart of a first embodiment of a method for manufacturing a package of the present application, and in a specific embodiment, the method includes:
s11: the method comprises the steps of obtaining a carrier plate, wherein a conductive circuit layer is arranged on the surface of the carrier plate and comprises a first conductive part and a second conductive part.
Specifically, a conductive circuit layer is manufactured on one surface of the carrier plate, or conductive circuit layers are manufactured on both surfaces of the carrier plate. In this embodiment, the carrier plate is fabricated with conductive circuit layers on both sides, and the carrier plate is fabricated with metal through holes, and the conductive circuit layers on both sides are connected through the metal through holes. The conductive circuit layer on the first surface is used for connecting the device and wire bonding, and the metal through hole is used for leading out pins of the device to the conductive circuit layer on the second surface. The conductive circuit layer on the first surface includes a first conductive portion and a second conductive portion, where the number of the first conductive portions is at least one, for example, 1, 3 or 4, and is not specifically limited, and the number of the devices to be packaged and fixed is set according to actual needs. The first conductive part is used for welding and fixing a device, and the fixed device is also connected with the second conductive part in a wire bonding mode. The conductive circuit layer can be formed by plating a metal layer on the surface of the carrier plate, pasting a film and exposing and developing patterns. The metal through holes can be formed on the carrier plate by hole metallization of the through holes after laser drilling or etching.
S12: an insulating layer is formed on the carrier plate, so that the insulating layer surrounds the first conductive portion.
The insulating layer sets up the region that does not set up the wire on the support plate, and the insulating layer encircles first conductive part, and the insulating layer plays isolated and protection's effect, and the insulating layer still plays preliminary separation filling glue's effect in addition. The insulating layer is specifically an ink layer, and may be manufactured by coating ink on the surface of the carrier plate, exposing and developing a set region of the ink, and curing the set region of the ink to enable the region of the ink surrounding the first conductive portion to be cured, thereby forming the first conductive portion.
S13: and manufacturing a blocking wall on the insulating layer, so that the blocking wall surrounds the first conductive part.
In some embodiments, after step S13, further comprising: and fixing the component on the first conductive part, and filling the filling glue in a gap between the component and the first conductive part, wherein the blocking wall is used for preventing the filling glue from overflowing to the second conductive part. The blocking wall can be specifically ink or plastic packaging material, and the height of the blocking wall is controlled to be larger than the height of the filling glue after the filling glue is filled.
According to the manufacturing method of the packaging body, the blocking wall surrounding the first conductive part is additionally manufactured on the insulating layer, and in the processing process, when filling glue is injected into the first conductive part, the blocking wall can block the filling glue from spreading to the second conductive part, so that the problem that the wire bonding abnormality caused by the fact that the filling glue pollutes the gold-plated area of the second conductive part cannot be conducted is effectively solved.
Referring to fig. 5, fig. 5 is a flow chart of a second embodiment of a method for manufacturing a package of the present application, in another specific embodiment, the insulating layer and the barrier wall are both ink, and in this embodiment, the method includes:
s21: the method comprises the steps of obtaining a carrier plate, wherein a conductive circuit layer is arranged on the surface of the carrier plate and comprises a first conductive part and a second conductive part.
This step is specifically referred to S11, and will not be described in detail.
This step is specifically referred to in connection with fig. 6a.
S22: and (3) coating ink on the surface of the carrier plate, exposing and developing a set area of the ink, and curing to enable the area of the ink surrounding the first conductive part to be cured and reserved to form an insulating layer.
Referring to fig. 6b and 6c in combination, fig. 6b is a view of applying ink to the surface of the carrier plate, and fig. 6c is a view of developing and resolidifying the applied ink after exposing the designated areas.
Specifically, the insulating layer is specifically a first ink layer, and the manufacturing process is as follows: and coating ink on the carrier plate with the conductive circuit layer, and irradiating the designed pattern on the carrier plate in a projection mode, so that the area, which needs to be reserved and cured, of the coated ink is irradiated by light, and the ink irradiated by the light is subjected to cross-linking polymerization, so that the ink is primarily cured. And then soaking the exposed carrier plate in a developing solution, dissolving the ink in the unexposed area in the developing solution, and baking the developed ink for full curing to finally form a first ink layer surrounding the first conductive part.
S23: and (3) carrying out a second ink coating on the carrier plate, and carrying out a second exposure and development post-curing on the set area of the ink, so that the area of the ink surrounding the first conductive part is cured and reserved to form a blocking wall.
Referring to fig. 6d and 6e in combination, fig. 6d shows a second application of ink to the surface of the carrier plate, and fig. 6e shows a subsequent development and resolidification of the applied ink after exposure to the designated areas.
Specifically, in this embodiment, the solder resist ink is fabricated on the carrier plate twice in total. The first solder resist ink is used for manufacturing an insulating layer, and the second solder resist ink is used for manufacturing a barrier wall. The blocking wall is a second ink layer, and the manufacturing process of the blocking wall is as follows: and (3) coating ink for the second time on the carrier plate after the insulating layer is manufactured, irradiating a designed pattern on the carrier plate in a projection mode, enabling the area of the ink which is coated for the second time and surrounds the first conductive part to be subjected to cross-linking polymerization and primary curing by light irradiation, soaking the carrier plate in a developing solution again, dissolving the area which does not surround the first conductive part in the ink which is coated for the second time, and then baking the ink which is developed for full curing to form a second ink layer which surrounds the first conductive part.
S24: and fixing the component on the first conductive part, and filling the filling glue in a gap between the component and the first conductive part, wherein the blocking wall is used for preventing the filling glue from overflowing to the second conductive part.
This step is combined with reference to fig. 6f. The component is also connected with the second conductive part through the conductive piece.
According to the manufacturing method of the packaging body, the blocking wall surrounding the first conductive part is additionally manufactured on the insulating layer, and in the processing process, when filling glue is injected into the first conductive part, the blocking wall can block the filling glue from spreading to the second conductive part, so that the problem that the wire bonding abnormality caused by the fact that the filling glue pollutes the gold-plated area of the second conductive part cannot be conducted is effectively solved.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent principle changes made by the specification and the drawings of the present application, or direct or indirect application in other related technical fields, are included in the scope of the patent protection of the present application.

Claims (10)

1. A package, comprising:
the surface of the carrier plate is provided with a conductive circuit layer, and the conductive circuit layer comprises a first conductive part and a second conductive part;
the insulating layer is arranged on the carrier plate and surrounds the first conductive part;
the blocking wall is arranged on the insulating layer and surrounds the first conductive part, the first conductive part is further coated by filling glue, and the blocking wall is used for preventing the filling glue from overflowing to the second conductive part.
2. The package of claim 1, further comprising:
the component is fixed on the first conductive part and is also connected with the second conductive part through a conductive piece; and the filling glue fills a gap between the component and the first conductive part.
3. The package of claim 2, wherein the package is configured to hold the package,
the one side that keeps away from the support plate is higher than the setting of packing glue, the area of blocking the wall is less than the area of insulating layer.
4. The package of claim 2, wherein the package is configured to hold the package,
the side surface of the blocking wall, which is close to the first conductive part, is flush with the side surface of the insulating layer, which is close to the first conductive part.
5. The package of claim 2, wherein the package is configured to hold the package,
the blocking wall is obliquely arranged close to the side face of the first conductive part, and the inclined face faces the first conductive part and the direction away from the carrier plate.
6. The package of claim 2, wherein the package is configured to hold the package,
the side surface of the blocking wall, which is close to the first conductive part, is a bending surface, and the distance between the bending surface and the first conductive part is gradually increased along the direction away from the carrier plate.
7. The package of claim 2, wherein the package is configured to hold the package,
the insulating layer is ink, and the blocking wall is ink or plastic packaging material.
8. The manufacturing method of the package body is characterized by comprising the following steps:
obtaining a carrier plate, wherein a conductive circuit layer is arranged on the surface of the carrier plate, and the conductive circuit layer comprises a first conductive part and a second conductive part;
manufacturing an insulating layer on the carrier plate, and enabling the insulating layer to surround the first conductive part;
and manufacturing a blocking wall on the insulating layer, so that the blocking wall surrounds the first conductive part.
9. The method of claim 8, wherein,
the insulating layer and the blocking wall are both ink;
the step of manufacturing the insulating layer comprises the following steps:
coating ink on the surface of the carrier plate, exposing and developing a set area of the ink, and curing the set area of the ink to enable the area of the ink surrounding the first conductive part to be cured and reserved to form an insulating layer;
the step of manufacturing the blocking wall comprises the following steps:
and (3) carrying out a second ink coating on the carrier plate, carrying out a second exposure and development on the set area of the ink, and curing the set area of the ink so that the area of the ink surrounding the first conductive part is cured and reserved to form a blocking wall.
10. The method of manufacturing a retaining wall according to claim 8, further comprising, after the step of manufacturing a retaining wall:
and fixing a component on the first conductive part, and filling glue in a gap between the component and the first conductive part, wherein the blocking wall is used for preventing the filling glue from overflowing to the second conductive part.
CN202310129095.6A 2023-02-15 2023-02-15 Package and method for manufacturing the same Pending CN116314056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310129095.6A CN116314056A (en) 2023-02-15 2023-02-15 Package and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310129095.6A CN116314056A (en) 2023-02-15 2023-02-15 Package and method for manufacturing the same

Publications (1)

Publication Number Publication Date
CN116314056A true CN116314056A (en) 2023-06-23

Family

ID=86793336

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310129095.6A Pending CN116314056A (en) 2023-02-15 2023-02-15 Package and method for manufacturing the same

Country Status (1)

Country Link
CN (1) CN116314056A (en)

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