CN116314044A - Intelligent power module packaging structure of multilayer substrate - Google Patents
Intelligent power module packaging structure of multilayer substrate Download PDFInfo
- Publication number
- CN116314044A CN116314044A CN202211601812.2A CN202211601812A CN116314044A CN 116314044 A CN116314044 A CN 116314044A CN 202211601812 A CN202211601812 A CN 202211601812A CN 116314044 A CN116314044 A CN 116314044A
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- Prior art keywords
- base
- metal layer
- contact pin
- packaging structure
- power module
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- 239000000758 substrate Substances 0.000 title claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 238000005245 sintering Methods 0.000 claims abstract description 8
- 239000000919 ceramic Substances 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 description 5
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention relates to an intelligent power module packaging structure of a multilayer substrate, which comprises a substrate and a packaging structure arranged on the substrate, wherein the substrate is composed of a first metal layer, a ceramic insulating layer and a second metal layer which are arranged in a stacked manner from top to bottom, the first metal layer of the substrate is composed of metal printed circuits, the packaging structure is fixed on the surface of the metal printed circuits through sintering, the packaging structure is composed of a driving chip, a power chip and a contact terminal, the driving chip is connected with the power chip through a bonding wire, one end of the contact terminal, which is far away from the substrate, is led out outwards to be electrically connected with an external electronic device.
Description
Technical Field
The invention relates to the technical field of power semiconductors, in particular to an intelligent power module packaging structure of a multilayer substrate.
Background
As an advanced power switch device, an intelligent power module (IPM, intelligent Power Module) is internally integrated with logic, control, detection and protection circuits, and the on-state loss and the switching loss of the IPM are low, so that the intelligent power switch device is suitable for the development direction of the current power device, namely a modularized, compound and Power Integrated Circuit (PIC), and is widely and widely applied in the power electronics field.
IPM must be conductively connected to external electronics during application to function. There is therefore a need for a connecting element that is simple in construction, easy to manufacture, while maintaining a stable connection in the presence of mechanical stresses and vibrations. From the patent ZLCN200910126773.3 a contact element is known, which makes electrical connection with an external device by pushing a contact pin having an oversized dimension into the contact element and then protruding from the housing. However, such interference fit connections deform the contact pin and there is also the possibility that the contact pin will fall out of the contact element due to its own weight during prolonged use. Thus, there is a need for a more reliable connection that ameliorates the existing problems.
In addition to the need for reliable connection to external electronics, IPM requires robust electrical, mechanical, and thermal contact within the IPM. The conventional power module generally connects the contact terminal base with the substrate by adopting a soldering connection manner, which only provides effective electrical contact connection, does not play a good role in fixing, and requires an additional cleaning process in the welding step, so that the whole production and assembly process of the IPM is more complex, and the cost is increased.
Therefore, an intelligent power module packaging structure of a multi-layer substrate is designed to overcome the problems.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides an IPM packaging structure of a multilayer substrate, which improves the reliability of the IPM, prolongs the service life and reduces the failure risk.
In order to achieve the above purpose, the invention provides an intelligent power module packaging structure of a multilayer substrate, which comprises a substrate and a packaging structure arranged on the substrate, wherein the substrate is composed of a first metal layer, a ceramic insulating layer and a second metal layer which are arranged in a stacked manner from top to bottom, the first metal layer of the substrate is composed of metal printed circuits, the packaging structure is fixed on the surfaces of the metal printed circuits through sintering, the packaging structure is composed of a driving chip, a power chip and a contact terminal, the driving chip, the power chip and the contact terminal are all fixed on the first metal layer, the driving chip and the power chip are connected through bonding wires, and one end of the contact terminal, which is far away from the substrate, is led out outwards to be electrically connected with an external electronic device.
As preferable: the contact terminal consists of a base and a contact pin, wherein the base is fixed on the first metal layer through sintering, and a through hole for inserting the contact pin is formed in the base.
As preferable: the contact pin comprises an insertion head, a middle connecting part and a strip-shaped tail part, wherein the insertion head is in transitional connection with the strip-shaped tail part through the middle connecting part.
As preferable: the middle position of the contact pin insertion head is provided with two narrow oval through holes with the middle width, the inside of the base is provided with an axial stepped through hole, one side of the axial stepped through hole, which is close to the first metal layer, is large in aperture, and one side, which is far away from the first metal layer, is small in aperture, and when the contact pin is inserted into the mounting groove of the base, the oval through hole of the contact pin insertion head is extruded by the inner wall of the axial stepped through hole in the base, so that the contact pin is in close contact with the base.
As preferable: the middle connecting part of the contact pin is provided with a circle of flange part which is used for limiting when the contact pin head part is inserted into the axial stepped through hole of the base and ensuring the axial positioning of the contact pin and preventing other elements from being damaged.
As preferable: the cross section of the strip-shaped tail part of the contact pin is of a non-fixed geometric shape and is used for ensuring that the insertion head part of the contact pin is inserted into the axial stepped through hole of the base, the strip-shaped tail part of the contact pin is connected with an external electronic device, and the two contacts are connected in a stable and reliable conductive mode.
As preferable: the contact pin is made of pure copper or copper alloy material, and the surface layer is bare copper or one of gold-plated, nickel, tin and other metal materials.
As preferable: the first metal layer and the second metal layer are made of copper.
The multi-layer substrate and the intelligent power module packaging structure using the multi-layer substrate cancel the traditional welding connection mode of the contact terminal base and the substrate, adopt the direct sintering connection of the contact terminal base and the copper layer on the substrate, ensure the electrical connection and greatly enhance the connection reliability of the contact terminal base and the copper layer on the substrate; the contact pin is connected with the contact terminal base in an elastic manner, stable contact fit and prolonged service life can be achieved under the condition that the element is not damaged, and the contact pin is effectively prevented from falling out of the contact terminal base due to self gravity in the application process due to the structural arrangement of the stepped through hole in the contact terminal base, so that failure risk in application is effectively reduced.
Drawings
Fig. 1 is a schematic view of the overall structure of a multilayer substrate according to the present invention.
Fig. 2 is a schematic view of a contact terminal base structure according to the present invention.
Fig. 3 is a schematic side view of an IPM package structure according to the present invention.
Fig. 4 is a perspective view of the interior of the IPM package structure of the present invention, including a portion of the component structure involved.
Fig. 5 is a schematic view of the connection of the pins and contact terminal bases according to the present invention.
Fig. 6 is a schematic view of a contact terminal base pin structure according to the present invention.
Detailed Description
To make the above objects, features and advantages of the present invention more comprehensible, the following embodiments are presented in order to illustrate the present invention, but the present invention can be practiced in other manners different from those described herein, and thus the present invention is not limited to the specific embodiments disclosed below.
In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," and the like are used as an orientation or positional relationship based on that shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
As shown in fig. 1, an intelligent power module packaging structure of a multi-layer substrate comprises a substrate 1 and a packaging structure arranged on the substrate 1, wherein the substrate 1 is formed by a first metal layer 102, a ceramic insulating layer 104 and a second metal layer 103 which are arranged in a stacked manner from top to bottom, the first metal layer 102 of the substrate 1 is formed by metal printed circuits, the packaging structure is fixed on the surface of the metal printed circuits through sintering, as shown in fig. 3-4, a driving chip 2, a power chip 4 and contact terminals are fixed on the first metal layer 102, the packaging structure is formed by the driving chip 2, the power chip 4 and the contact terminals, the driving chip 2 and the power chip 4 are connected through bonding wires 3, and one end of the contact terminal, which is far away from the substrate 1, is led out outwards to be electrically connected with external electronic devices. The contact terminals are connected to the driver chip 2 and the power chip 4 by means of bond wires or the conductive properties of the first metal layer.
The contact terminal is composed of a base 101 and a pin 5, the base 101 is fixed on the first metal layer 102 by sintering, and a through hole for inserting the pin 5 is arranged inside the base 101.
As shown in fig. 5, the contact terminal base 101 and the contact pin 5 are fixedly connected in an elastic compression joint manner, so that fatigue damage to the element caused by relative displacement generated by vibration in the use process can be effectively reduced while tight contact is maintained, and the service life is prolonged.
As shown in fig. 6, the pin 5 is composed of an insertion head 5a, an intermediate connection portion 5b and an elongated tail 5c, and the insertion head 5a and the elongated tail 5c are in transitional connection through the intermediate connection portion 5 b.
As shown in fig. 2, the middle position of the insertion head 5a of the contact pin 5 is provided with an elliptical through hole 5d with two narrow ends and a wide middle, an axial stepped through hole 7 is arranged in the base 101, the aperture of one side of the axial stepped through hole 7 close to the first metal layer 102 is large, and the aperture of one side far away from the first metal layer 102 is small.
A circle of flange part 6 is arranged on the middle connecting part 5b of the contact pin 5, and the flange part 6 is used for limiting when the contact pin inserting head part 5a is inserted into the axial stepped through hole of the base, ensuring the axial positioning of the contact pin 5 and preventing other elements from being damaged.
The cross section of the elongated tail 5c of the pin 5 is in a non-fixed geometric shape, and may be rectangular, square, diamond or circular, for ensuring that the insertion head 5a of the pin 5 is inserted into the axial stepped through hole of the base 101, and the elongated tail 5c is connected with an external electronic device, and both contacts are connected stably and reliably in a conductive manner.
The contact pin 5 is made of pure copper or copper alloy material, and the surface layer of the contact pin is bare copper or one of metal materials such as gold plating, nickel, tin and the like. The first metal layer 102 and the second metal layer 103 are made of copper.
In the multilayer substrate and the IPM packaging structure using the substrate, the traditional welding connection mode of the base of the contact terminal and the substrate is canceled, the base 101 of the contact terminal is directly sintered and connected with the first copper layer 102 of the substrate, and the connection reliability of the base 101 and the first copper layer is greatly enhanced while the electrical connection is ensured; the cooperation connection of contact pin 5 and base 101 is elasticity, can realize stable contact cooperation, increase of service life under the condition of not damaging component self, and the structure of ladder through-hole is provided with in contact terminal's base 101 effectively prevents that contact pin 5 from falling out from contact terminal's base 101 because of self gravity in the application process, effectively reduces the inefficacy risk in the application.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (8)
1. The utility model provides an intelligent power module packaging structure of multilayer substrate, includes base plate (1) and sets up the packaging structure on base plate (1), its characterized in that: the substrate (1) comprises a first metal layer (102), a ceramic insulating layer (104) and a second metal layer (103) which are arranged in a stacked manner from top to bottom, wherein the first metal layer (102) of the substrate (1) is formed by metal printed circuits, a packaging structure is fixed on the surface of the metal printed circuits through sintering, the packaging structure comprises a driving chip (2), a power chip (4) and a contact terminal, the driving chip (2), the power chip (4) and the contact terminal are fixed on the first metal layer (102), the driving chip (2) and the power chip (4) are connected through bonding wires (3), and one end of the contact terminal, which is far away from the substrate (1), is led out outwards to be electrically connected with an external electronic device.
2. The intelligent power module package structure of the multi-layered substrate according to claim 1, wherein: the contact terminal consists of a base (101) and a contact pin (5), wherein the base (101) is fixed on the first metal layer (102) through sintering, and a through hole for inserting the contact pin (5) is formed in the base (101).
3. The intelligent power module packaging structure of the multi-layered substrate according to claim 2, wherein: the contact pin (5) consists of an insertion head (5 a), a middle connecting part (5 b) and a strip-shaped tail (5 c), wherein the insertion head (5 a) is in transitional connection with the strip-shaped tail (5 c) through the middle connecting part (5 b).
4. The intelligent power module packaging structure of the multi-layered substrate according to claim 3, wherein: the middle position of the inserting head (5 a) of the inserting needle (5) is provided with an elliptical through hole (5 d) with two narrow ends and a wide middle, an axial stepped through hole (7) is formed in the base (101), one side, close to the first metal layer (102), of the axial stepped through hole (7) is large in aperture, one side, far away from the first metal layer (102) is small in aperture, and when the inserting needle is inserted into the axial stepped through hole (7) of the base, the elliptical through hole (5 d) of the inserting head is extruded by the inner wall of the axial stepped through hole in the base, so that the inserting needle (5) is in close contact with the base (101).
5. The multi-layer substrate intelligent power module package structure of claim 4, wherein: a circle of flange part (6) is arranged on the middle connecting part (5 b) of the contact pin (5), and the flange part (6) is used for limiting when the contact pin inserting head part (5 a) is inserted into the axial stepped through hole of the base and ensuring the axial positioning of the contact pin (5) and preventing other elements from being damaged.
6. The multi-layered substrate intelligent power module package structure of claim 5, wherein: the cross section of the strip-shaped tail part (5 c) of the contact pin (5) is in a geometric shape, so that the insertion head part (5 a) of the contact pin (5) is inserted into the axial stepped through hole of the base (101), and the strip-shaped tail part (5 c) is connected with an external electronic device.
7. The intelligent power module packaging structure of the multi-layered substrate according to claim 6, wherein: the contact pin (5) is made of pure copper or copper alloy material, and the surface layer of the contact pin is bare copper or one or more of gold plating, nickel and tin plating.
8. The intelligent power module package structure of the multi-layered substrate according to claim 1, wherein: the first metal layer (102) and the second metal layer (103) are made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211601812.2A CN116314044A (en) | 2022-12-14 | 2022-12-14 | Intelligent power module packaging structure of multilayer substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211601812.2A CN116314044A (en) | 2022-12-14 | 2022-12-14 | Intelligent power module packaging structure of multilayer substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116314044A true CN116314044A (en) | 2023-06-23 |
Family
ID=86824655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211601812.2A Pending CN116314044A (en) | 2022-12-14 | 2022-12-14 | Intelligent power module packaging structure of multilayer substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116314044A (en) |
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2022
- 2022-12-14 CN CN202211601812.2A patent/CN116314044A/en active Pending
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