CN116313821A - Method and device for pressing cooling fin - Google Patents
Method and device for pressing cooling fin Download PDFInfo
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- CN116313821A CN116313821A CN202210118734.4A CN202210118734A CN116313821A CN 116313821 A CN116313821 A CN 116313821A CN 202210118734 A CN202210118734 A CN 202210118734A CN 116313821 A CN116313821 A CN 116313821A
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- die
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- 238000003825 pressing Methods 0.000 title claims abstract description 113
- 238000001816 cooling Methods 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 71
- 238000003475 lamination Methods 0.000 claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims description 48
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000006073 displacement reaction Methods 0.000 claims description 9
- 238000004378 air conditioning Methods 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 38
- 239000000758 substrate Substances 0.000 description 21
- 239000003292 glue Substances 0.000 description 10
- 238000007789 sealing Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000001144 aluminium sodium sulphate Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- PMZURENOXWZQFD-UHFFFAOYSA-L sodium sulphate Substances [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 4
- 239000001117 sulphuric acid Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000001063 aluminium ammonium sulphate Substances 0.000 description 3
- 239000001132 aluminium potassium sulphate Substances 0.000 description 3
- 239000001166 ammonium sulphate Substances 0.000 description 3
- 239000001175 calcium sulphate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L magnesium chloride Substances [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000001120 potassium sulphate Substances 0.000 description 3
- 239000001119 stannous chloride Substances 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/34—Heating or cooling presses or parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B9/00—Presses specially adapted for particular purposes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a cooling fin lamination method and a cooling fin lamination device, wherein the cooling fin lamination method comprises the following steps: a heating part is used for heating the lower pressing die, and the upper pressing die presses against a radiating fin on a wafer on the lower pressing die by a driving force; after stopping heating the lower pressing die, cooling the wafer under the condition that the upper pressing die and the lower pressing die still press against the wafer, opening the upper pressing die and the lower pressing die after the temperature is reduced to a preset press-fit curing temperature, and removing the wafer; thereby improving the packaging quality of the chip.
Description
Technical Field
The present invention relates to a bonding method and apparatus, and more particularly, to a bonding method and apparatus for bonding a heat sink to a die on a substrate during a wafer process.
Background
In a general chip packaging process, an adhesive is coated on a central portion above a substrate and a rectangular near peripheral edge, a die is adhered to the central portion of the substrate, a layer of heat dissipation adhesive solution is coated or a heat dissipation rubber pad is adhered to the upper portion of the die as a heat dissipation medium, a heat dissipation plate is adhered to the upper portion of the heat dissipation medium, a lower portion of the periphery of the heat dissipation plate is covered on the adhesive coated on the rectangular near peripheral edge of the substrate, and then a pressing device is used for pressing the upper and lower dies.
Disclosure of Invention
In the prior art, in order to maintain the viscosity of the heat dissipation glue solution or the heat dissipation rubber cushion to an expected effect during pressing, heating is usually applied to the upper pressing die and the lower pressing die during pressing, and after the pressing is completed, the upper pressing die and the lower pressing die are directly opened to remove the wafer, so that the wafer is naturally cooled to solidify the viscosity of the heat dissipation glue solution or the heat dissipation rubber cushion; however, the method has the advantages that on one hand, the natural cooling time is long, the time is wasted, on the other hand, the heat radiating fins, the substrate and the crystal grains are different in materials, the deformation degree caused by the temperature is also different, and in the natural cooling and curing process after leaving the upper pressing die and the lower pressing die, the deformation and the warpage of the wafer are easily caused, and the quality is unstable and needs to be further overcome.
Therefore, the present invention is directed to a heat spreader bonding method capable of improving the chip package quality.
Another objective of the present invention is to provide a heat sink pressing device capable of improving the quality of the chip package.
It is still another object of the present invention to provide an apparatus for performing the heat sink lamination method.
The heat sink lamination method according to the object of the invention comprises the following steps: a heating part is used for heating the lower pressing die, and the upper pressing die presses against a radiating fin on a wafer on the lower pressing die by a driving force; and after stopping heating the lower die, cooling the wafer under the condition that the upper die and the lower die still press against the wafer, opening the upper die and the lower die after the temperature of the wafer is reduced to a preset press-fit curing temperature, and removing the wafer.
According to another aspect of the invention, a heat spreader bonding apparatus is adapted for a chip, and includes: a lower pressing die on which the chip is arranged, the chip being provided with a heat sink; an upper pressing die arranged above the lower pressing die and capable of being driven to press the cooling fin; a heating part arranged below the lower pressing die and provided with a heater capable of heating the lower pressing die; and a cooling module arranged below the lower pressing die and provided with a cooling part capable of cooling the lower pressing die.
According to another aspect of the present invention, a heat sink pressing apparatus is provided for performing the heat sink pressing method.
According to the cooling fin pressing method and device, after the heating of the lower pressing die is stopped, the wafer is cooled to the preset pressing solidification temperature under the condition that the upper pressing die and the lower pressing die still press against the wafer, and then the upper pressing die and the lower pressing die are opened to remove the wafer; therefore, the heat sink and the substrate are still pressed by the upper and lower pressing dies in the cooling and solidifying process, and the shape of the heat sink and the substrate can be kept in an expected pressing state, so that the situation of buckling deformation of the wafer after the upper and lower pressing dies are removed can be avoided, and the quality of the wafer package is stabilized and improved.
Drawings
Other features and advantages of the present invention will become apparent from the following description of the embodiments with reference to the drawings, in which:
FIG. 1 is a schematic perspective view of a substrate carrying a die and a coating solution according to an embodiment of the present invention;
FIG. 2 is an exploded view of the cross section of FIG. 1 taken along line D-D;
FIG. 3 is a schematic cross-sectional view of the wafer suitable for use in embodiments of the present invention;
FIG. 4 is a schematic diagram of the upper and lower die mating enclosures according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of the enclosure of the present invention when the upper and lower dies are correspondingly pressed;
FIG. 6 is a schematic view of the enclosure and heating portion, and a movable base of the embodiment of the invention;
FIG. 7 is an exploded perspective view of the enclosure, heating portion, and moving seat according to the embodiment of the invention;
FIG. 8 is a schematic diagram of a variation of the upper die and a wafer in accordance with an embodiment of the present invention.
FIG. 9 is a schematic diagram of a wafer and yet another variation of the upper die in accordance with an embodiment of the present invention;
FIG. 10 is an exploded perspective view of the lower die and carrier module, cooling module, and mounting according to the embodiment of the present invention;
FIG. 11 is an exploded perspective view of the lower die and the carrier module according to the embodiment of the present invention;
FIG. 12 is an exploded perspective view of the carrier module, cooling module, and mounting according to the embodiment of the present invention;
FIG. 13 is a schematic perspective view of a compression device in accordance with an embodiment of the invention; a kind of electronic device with high-pressure air-conditioning system
Fig. 14 is a schematic front view of a press apparatus according to an embodiment of the present invention.
[ symbolic description ]
A: wafer with a plurality of wafers
A1: substrate board
A11: glue solution
A12: clearance of
A2: grain size
A3: heat dissipation medium
A4: heat sink
A41: accommodation section
B1: upper pressing die
B11: first part
B12: second part
B13: hollowed-out section
And B14: spacer layer
B2: lower pressing die
B21: bearing part
B22: heating part
B211: positioning section
B221: positioning part
And B222: heater
B23: suction hole
B24: air channel
B3: heating part
B4: movable seat
B41: fixing seat
And B42: compression bar
C1: enclosed space
C2: air extraction joint
And C3: upper sealing cover
C31: fixing surface
C311: hollow hole
C312: first fixing part
C313: second fixing part
C314: spacing of
C32: peripheral side surface
C33: fixing piece
C331: hollowed-out section
And C4: bottom cover
C41: sealing rubber strip
C42: hollowed-out section
E: bearing module
E1: transfer section
E2: fixing part
E21: heat dissipation section
E3: fixing piece
E4: bearing seat
E41: a first transfer section
E42: groove seat
E43: stop block
E5: heat dissipation assembly
E51: base seat
E511: rail part
E512: handle for holding
E513: first hollowed-out section
E514: first air passage
E515: input air tap
E516: output air tap
E517: first connecting air hole
E52: first cushion piece
E521: second engraved section
E522: second air passage
E523: second connecting air hole
E53: second pad
E531: third hollowed-out section
E532: third air passage
E533: third connecting air hole
E54: a second transfer section
F: cooling module
F1: cooling piece
F11: base seat
F12: cooling part
F13: contact portion
F14: joint
F2: refrigerating chip
F3: radiating fin
F31: contact part
F32: fin type fin
F4: side frame
F41: air supply space
G: seat frame
G1: carrier table
G11: hollowed-out section
And G2: rail seat
And G3: sliding rail
And G4: slide seat
And G5: driving piece
G51: screw rod
H: pressing device
H1: upper die holder
H2: lower die holder
And H3: support post
H31: pivot rod
H4: upper die device
H41: uploading seat
H42: downloading seat
H43: driving piece
H431: driving rod
H44: holding mechanism
And H5: driving piece
H6: load measuring unit
Detailed Description
Before the present invention is described in detail, it should be noted that in the following description, like elements are denoted by the same reference numerals.
Referring to fig. 1 to 3, an embodiment of the present invention is shown as an example of a wafer a, wherein one or more dies A2 (in the embodiment of one die in the drawing) are adhered to a central portion of a substrate A1, a glue solution a11 is coated on a near peripheral edge of the substrate A1 outside the dies A2, a sheet-shaped heat dissipation medium A3 is adhered above the dies A2, a heat dissipation plate A4 provided with a concave accommodating section a41 is covered on the heat dissipation medium A3, and the substrate A1 and the dies A2 are covered at the same time, and a near peripheral edge below the heat dissipation plate A4 is also pressed and adhered to a portion of the substrate A1 near peripheral edge coated with the glue solution a11 to form the wafer a; the heat dissipation medium A3 is made of a material having a metal component, and a preferred metal component is indium (In). The glue solution a11 coated near the periphery of the substrate A1 forms a rectangular frame shape surrounding the periphery of the die A2 by a certain distance, and one or more clearances a12 are provided on one side or two corresponding sides (in the figure, a clearance embodiment is provided on each corresponding side), and the accommodating section a41 accommodates the heat dissipation medium A3 and the die A2 therein and communicates with the outside through the clearances a 12.
Before the heat dissipation material A3 is attached to the upper surface of the die A2, a flux layer is sprayed and applied to the upper surface of the die A2 or the lower surface of the heat dissipation medium A3, and then the heat dissipation medium A3 is attached to the upper surface of the die A2, so that a first flux layer is formed between the upper surface of the die A2 and the lower surface of the heat dissipation medium A3; before the heat sink A4 is covered on the upper surface of the heat sink A3, a flux layer is sprayed on the upper surface of the heat sink A3 or the lower surface of the heat sink A4, and then the heat sink A4 is attached to the upper surface of the heat sink A3, so that a second flux layer is formed between the upper surface of the heat sink A3 and the lower surface of the heat sink A4; when the heat sink A4 is covered on the upper surface of the heat sink A3, air in the accommodation area a41 of the heat sink A4 accommodating the heat sink A3 and the die A2 is drawn from the clearance a12 formed by the rectangular frame-shaped glue solution a11 coated on the near periphery of the substrate A1 to form a negative pressure, and the vacuum forms a vacuum state between the upper surface of the die A2 and the lower surface of the heat sink A3 and between the upper surface of the heat sink A3 and the lower surface of the heat sink A4 to prevent the formation of an oxide film.
As shown in fig. 3 to 5, a closed space C1 formed by an enclosure C is formed on the periphery of the wafer a between an upper die B1 and a lower die B2 for performing lamination of the heat sink A4, and two air suction connectors C2 disposed on the enclosure C are used to suck air to form vacuum in the closed space C1, and air in the accommodating section a41 is further sucked from the air suction connectors C2 through the clearances a12, a13 (fig. 1) and the closed space C1 to form a vacuum state of negative pressure; wherein the cover C is composed of an upper cover C3 which is linked with the upper pressing die B1 in an up-and-down displacement way and a bottom cover C4 which is positioned below the lower pressing die B2 and is provided with a sealing rubber strip C41 (see figure 10) at the periphery. The sealing rubber strip C41 on the bottom cover C4 is abutted against the upper cover C3 by virtue of downward displacement to form the closed space C1, wherein the air extraction joint C2 is arranged on two corresponding sides of the upper cover C3 at intervals.
Referring to fig. 6 and 7, the upper cover C3 is provided with a fixing surface C31 which is horizontally rectangular and is made of heat insulation material and a peripheral side surface C32 which is vertically arranged below the periphery of the fixing surface C31, a rectangular hollowed-out hole C311 is arranged in the center of the fixing surface C31, a rectangular frame-shaped first fixing portion C312 and a rectangular frame-shaped second fixing portion C313 are arranged on the fixing surface C31 at the periphery of the hollowed-out hole C311, wherein the first fixing portion C312 is adjacent to the hollowed-out hole C311, a space C314 is reserved between the second fixing portion C313 and the first fixing portion C312, a rectangular frame-shaped fixing member C33 below the fixing surface C31 is fixedly arranged below the first fixing portion C312, and a rectangular frame-shaped fixing member C33 below the periphery of the fixing surface C31 is fixedly arranged below the second fixing portion C313; the center of the fixing piece C33 is provided with a rectangular hollowed-out section C331, the upper pressing die B1 is positioned in the hollowed-out section C331 and positioned below the fixed surface C31, a rectangular heating part B3 is arranged above the upper pressing die B1, a plurality of bar-shaped heaters B31 which are arranged in parallel at intervals are arranged in the heating part B3, the heating part B3 can be heated and conducted to the upper pressing die B1 to enable the upper pressing die B1 to have preset temperature, and a temperature sensor B32 is adopted for temperature detection, the periphery of the heating part B3 is fixedly arranged on the upper surface of the fixing piece C33 adjacent to the periphery of the hollowed-out section C331, and the temperature of the heating part B3 is conducted only to the upper pressing die B1 and the fixing piece C33 but not to the periphery C32 which is vertically arranged below the periphery of the upper sealing cover C3 by virtue of the design that the second fixing part C313 is separated from the first fixing part C312 by the space C314 and the fixed surface C31 made of heat insulation materials; a movable seat B4 capable of being driven to move up and down is arranged above the heating portion B3, the movable seat B4 is provided with a rectangular fixed seat B41 fixedly arranged above the heating portion B3, and a pressing rod B42 vertically arranged above the fixed seat B41.
Referring to fig. 8, in a variation of the upper die of the embodiment of the present invention, based on the glue solution a11 coated on the adjacent peripheral area of the substrate A1 located outside the die A2 of the wafer a, and the heat dissipation medium A3 attached above the die A2 may have different heating requirements, the upper die B1 may be configured to have a first portion B11 and a second portion B12 made of different heat conductivity materials, so that when the upper die B1 presses the wafer a, the first portion B11 corresponds to the glue solution a11 coated on the adjacent peripheral area of the substrate A1, the second portion B12 corresponds to the heat dissipation medium A3 attached above the die A2, in this embodiment, the first portion B11 forms a frame shape with a hollowed-out portion B13 in the center, and the second portion B12 is embedded in the hollowed-out portion B13 in the frame shape center of the first portion B11.
Referring to fig. 9, in still another variation of the upper die according to the embodiment of the present invention, a spacer layer B14 made of a heat insulating material and having a frame shape may be disposed between the first portion B11 and the second portion B12 of the upper die B1, so that the temperatures conducted by the first portion B11 and the second portion B12 do not interfere with each other.
Referring to fig. 10 to 12, the lower die B2 is rectangular and integrally provided with a bearing portion B21 located relatively above and a heating portion B22 located relatively below the bearing portion B21; the bearing part B21 is provided with four concave locating sections B211 on four sides, a locating part B221 is formed on the upper surface of the heating part B22 exposed from each locating section B211, and a plurality of heaters B222 are arranged in the heating part B22 to heat the bearing part B21; the lower pressing die B2 is arranged on a bearing module E, the bearing module E is provided with two adjacent transferring sections E1 which are hollowed out from top to bottom, the lower pressing die B2 is correspondingly arranged above the two adjacent transferring sections E1 by the heating part B22, four side edges of the lower pressing die B2 form a concave positioning section B211 which is respectively fixed on four fixing parts E3 which are surrounded by four fixing parts E2 on the peripheral side of the transferring section E1 by screws so as to be embedded between the four fixing parts E3, and further the positioning part B221 is subjected to pressing and positioning, and a plurality of hollowed-out heat dissipation sections E21 which can be used for heat dissipation are formed below the fixing parts E2; the lower die B2 is further provided with a suction hole B23 through which negative pressure can be introduced in a central region of the upper surface of the bearing portion B21, and four fine groove-like air grooves B24 extending from the suction hole B22 to the peripheral side.
A cooling module F is arranged below the lower die B2, the cooling module F is arranged on a carrier G1 which can be selectively driven to move up and down, and a rectangular hollowed-out section G11 is arranged on the carrier G1; the seat frame G is provided with a rail seat G2, the rail seat G2 is provided with a Z-axis sliding rail G3, the sliding rail G3 is provided with a sliding seat G4, the carrying platform G1 is arranged on the sliding seat G4, and the sliding seat G4 is driven by a driving piece G5 through a screw rod G51 to move up and down on the sliding rail G3; the cooling module F is provided with a cooling member F1, wherein the cooling member F1 is provided with two cooling portions F12 (in other variations, the cooling portion F12 can also be one) protruding above a flat base F11 and being arranged adjacently and at a distance, the upper surface of each cooling portion F12 is a planar contact portion F13, the cooling member F1 is provided with a joint F14, and cold air can be introduced into the cooling portion F12; a cooling wafer F2 is arranged under the base F11 of the cooling member F1 in an abutting manner, the cooling wafer F2 is arranged on a heat dissipation fin member F3, the heat dissipation fin member F3 is provided with a flat plate-shaped abutting portion F31 for the abutting arrangement of the cooling wafer F2, and a plurality of fins F32 which are arranged under the abutting portion F31 at intervals and are vertically arranged; the heat dissipation fin F3 is supported by two side frames F4 spaced apart from each other on both sides of the abutting portion F31, such that an air supply space F41 is provided between the lower side of the fin F32 and the carrier G1, and a fan F5 is provided in the air supply space F41 and located at the hollowed-out portion G11 on the carrier and capable of blowing cool air to the heat dissipation fin F3; when the cooling module F is selectively operated to move upwards, the two cooling portions F12 of the cooling member F1 are moved into the transferring section E1, and the contact portion F13 on the upper surface of the cooling portion F12 contacts the lower surface of the heating portion B22 of the lower die B2, so that the heating portion B22 is cooled, and the upper surface of the bearing portion B21 above is cooled.
The bearing module E is provided with a bearing seat E4, the bearing seat E4 is provided with a hollowed first transferring section E41, two opposite sides of the first transferring section E41 are provided with a long-strip-shaped groove seat E42 respectively, and one end of a straight sliding flow path provided by each groove seat E42 is provided with a stop part E43; the bearing module E is provided with a heat dissipation component E5, the heat dissipation component E5 is provided with a base E51, two sides of the base E51 are respectively provided with a rail part E511, the rail parts E511 can be embedded in the groove seat E42 of the bearing seat E4, and the linear sliding flow path is subjected to drawing displacement by means of a handle E512, and on the linear sliding flow path, the axial direction of the displacement of the heat dissipation component E5 is vertical to the axial direction of the up-and-down displacement of the driven action of the cooling module F; the base E51 is provided with two hollowed-out first hollowed-out sections E513 which are arranged adjacently at intervals, a first air channel E514 surrounding the outer periphery of the first hollowed-out sections E513 is arranged in the base E51, an input air tap E515 for air inflow and an output air tap E516 for air outflow are arranged on the other side of the first air channel E514 opposite to the grip E512, and a first connecting air hole E517 is arranged on the upper surface of the base E51; the upper surface of the base E51 is overlapped with a first cushion E52, the first cushion E52 is provided with two hollowed-out second hollowed-out sections E521 which are arranged adjacently at intervals, a second air passage E522 surrounding the outer periphery side of the second hollowed-out sections E521 is arranged, and second connecting air holes E523 are arranged on the upper surface and the lower surface of the first cushion E52; a second cushion E53 is stacked on the upper surface of the first cushion E52, two hollowed third hollowed-out sections E531 are arranged on the second cushion E53 at intervals and adjacent to each other, a third air passage E532 surrounding the outer peripheral side of the third hollowed-out sections E531 is arranged on the second cushion E53, and third connecting air holes E533 are arranged on the upper and lower surfaces of the third cushion E532; when the base E51, the first cushion E52 and the second cushion E53 are stacked, the upper surface of the second cushion E53 abuts against the bottom surface of the heating portion B22 of the pressing die B2, the first hollowed section E513, the second hollowed section E521 and the third hollowed section E531 are communicated to form a second transferring section E54, the first air passage E514, the second air passage E522 and the third air passage E532 are communicated by the first connecting air hole E517, the second connecting air hole E523 and the third connecting air hole E533, the heat dissipation air is uniformly input by the input air tap E515 of the base E51 of the heat dissipation component E5, and after the air flows through the base E51, the first cushion E52 and the second cushion E53, the air flows out of the heat dissipation component E5 by the output air tap E516 of the base E51, and then forms a multi-level circulating air passage, and the circulating air passage surrounds the outer periphery of the second multi-level transferring section E54.
The rectangular area of the first cushion E52 is larger than the area of the second cushion E53, the bottom cover C4 forms a rectangular frame, and surrounds the upper surface of the first cushion E52 outside the second cushion E53, and forms a rectangular surrounding sealing adhesive tape C41 on the periphery of the bottom cover C4, and a rectangular hollowed-out section C42 inside.
The transfer section E1 is formed by connecting the first transfer section E41 and the second transfer section E54, after the heating section B22 below the lower die B2 stops heating, the cooling module F will be driven to move upwards along with the carrier G1, so that the two cooling sections F12 of the cooling member F1 are moved into the first transfer section E41, then pass through the second transfer section E54, and contact the lower surface of the heating section B22 below the lower die B2 with the contact portion F13 of the upper surface of the cooling section F12, because the cooling section F12 is made of a material (for example, aluminum) with a higher heat conductivity coefficient, when contacting the lower surface of the heating section B22, the heating section B22 can be quickly cooled, and the upper surface of the upper carrying section B21 is cooled down, and the heat dissipation element E5 also has a heat dissipation effect on the peripheral air circulating around the second peripheral cooling section B12 by the upper surface of the second pad E53 and the lower surface of the lower die B22, and also has a heat dissipation effect on the peripheral air circulating around the peripheral cooling section F54.
Referring to fig. 13 to 14, an embodiment of the present invention may use a pressing device H, where the pressing device H is provided with an upper die holder H1 and a lower die holder H2 separated by a space, four rod-shaped pillars H3 distributed at four corners are supported between the upper die holder H1 and the lower die holder H2, and an upper die device H4 is pivotally mounted on the pillars H3 and is driven by a driving member H5 above the upper die holder H1 to move up and down; the lower die B2 and the bearing module E for bearing the lower die B2 are arranged on the lower die holder H2, the cooling module F and the seat frame G for bearing the cooling module F are arranged below the lower die holder H2, the lower die holder H2 is provided with a hollowed-out section (not shown in the figure), and when the cooling module F moves in, a part of the cooling module F is positioned in the hollowed-out section; the upper die device H4 is provided with an upper carrier H41 and a lower carrier H42 which are separated by a certain interval, a pivot rod H31 which is linked with the upper carrier H41 and can move up and down is arranged between the upper carrier H41 and the upper die holder H1, a driving piece H43 which is positioned between the upper carrier H41 and the lower carrier H42 and has a driving displacement stroke smaller than that of the driving piece H5 is arranged at the bottom side of the upper carrier H41, and the driving piece H43 is provided with a driving rod H431 which can be driven to push down; the top of the downloading seat H42 is provided with a holding mechanism H44 between the uploading seat H41 and the downloading seat H42, the holding mechanism H44 is used for holding the pressing rod B42 on the moving seat B4 which is linked with the upper pressing die B1, the heating part B3 and the fixing seat B41 are positioned below the downloading seat H42, the upper sealing cover C3 is downwards opened and corresponds to the bottom cover C4, and the upper end of the pressing rod B42 which is positioned below the driving rod H431 of the driving piece H43 is provided with a load measuring unit H6 which can measure the driving force of the driving rod H431.
Referring to fig. 3 to 5 and fig. 13 to 14, in the method for pressing the heat sink according to the embodiment of the present invention, the driving member H5 above the upper die holder H1 in the pressing device H drives the upper die device H4 to link the upper cover C3 to abut against the bottom cover C4 to form the enclosed space C1; air is extracted from the air extraction joint C2, so that the air in the accommodating section A41 in the radiating fin A4 is extracted through the enclosed space C1 by the clearances A12 and A13 reserved by the glue solution A11 coated on the near periphery of the substrate A1 and is extracted from the air extraction joint C2, and a negative pressure vacuum state is formed in the accommodating section A41 in the radiating fin A4; referring to fig. 7 and 11, the heater B31 in the heating portion B3 is then used to heat the upper die B1 to a predetermined temperature, and the heater B222 in the heating portion B22 is used to heat the bearing portion B21 of the lower die B2; then, the driving force of the driving member H43 to drive the driving rod H431 to move downward acts on the load measuring unit H6, and then indirectly drives the upper die B1 under the pressing rod B42 to press the heat sink A4 on the wafer a through the load measuring unit H6, so that the heat sink A4 is pressed with the heat sink A3 and the substrate A1, the heater B31 in the heating portion B3 stops heating the upper die B1, and the heater B222 in the heating portion B22 stops heating the bearing portion B21 of the lower die B2. After reaching the desired degree of press fit and stopping heating, and under the condition that the upper and lower pressing dies B1, B2 still press against the wafer a, the cooling module F is driven by the carrier G1 to displace upwards, so that the two cooling portions F12 of the cooling member F1 are displaced into the transferring section E1, and the cooling portion F12 contacts with the lower surface of the heating portion B22, so that the heating portion B22 is rapidly cooled, and the upper surface of the upper carrying portion B21 is also cooled. In the cooling process, introducing a cooling gas into the base E51 of the heat dissipating component E5 to cool the heating portion B22, and cooling the upper surface of the bearing portion B21 above, so as to cool the wafer a to a preset press-fit curing temperature; the preset press-fit curing temperature is one of the three values according to (1) the temperature detected by the heating portion B22 for heating the lower press-die B1, (2) the temperature detected by the heating portion B3 for heating the upper press-die B2, and (3) the average temperature detected by the heating portions B3 and B22 for heating the upper and lower press-dies B1 and B2; then, the driving member H43 drives the driving rod H431 to move upward to return, and the driving member H5 drives the upper die device H4 to drive the upper cover C3 to move upward to separate from the cover of the bottom cover C4, and then the upper and lower dies B1 and B2 are opened to move the wafer a out, so as to complete the lamination operation of the heat sink A4.
According to the cooling fin pressing method and device, after the heating of the lower pressing die is stopped, the temperature of the wafer A is reduced under the condition that the upper pressing die B1 and the lower pressing die B2 still press against the wafer A, and the upper pressing die B1 and the lower pressing die B2 are started to enable the wafer A to be removed after the temperature is reduced to the preset pressing curing temperature; therefore, by utilizing the viscosity of the heat dissipation medium A3, the heat dissipation plate A4 and the substrate A1 are still pressed by the upper pressing die B1 and the lower pressing die B2 in the cooling solidification process, and the shape of the heat dissipation plate A4 and the substrate A1 can be kept in an expected pressing state, so that after the wafer A is moved out of the upper pressing die B1 and the lower pressing die B2, the buckling deformation condition of the wafer A can be avoided, the packaging quality of the wafer A is further improved, and the packaging quality of the wafer A is stable.
The foregoing is illustrative of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims and their equivalents.
Claims (16)
1. A heat sink lamination method includes:
a heating part is used for heating the lower pressing die, and an upper pressing die is used for pressing a cooling fin on a chip on the lower pressing die with a driving force; a kind of electronic device with high-pressure air-conditioning system
After the heating of the lower die is stopped, the temperature of the wafer is reduced under the condition that the upper die and the lower die still press against the wafer, the upper die and the lower die are opened after the temperature of the wafer is reduced to a preset press-fit curing temperature, and the wafer is removed.
2. The method of claim 1, wherein the pressing die is provided with a bearing part located relatively above and a heating part located relatively below the bearing part; a cooling module is contacted with the heating part by the upward displacement of a cooling part in a selective operation way, so that the heating part is cooled, and the upper surface of the bearing part above the heating part is cooled; the lower pressing die is provided with a suction hole which is positioned on the upper surface of the bearing part and can be communicated with negative pressure, and a plurality of air grooves which extend from the suction hole to the circumferential side.
3. The method of claim 1, wherein the lower die is disposed on a carrier module, the carrier module has a transferring section hollowed out from top to bottom, and the cooling module is selectively operated to be driven to move upwards, and a cooling section is moved into the transferring section to cool the lower die.
4. The method of claim 1, wherein the pressing die is disposed on a carrier module, the carrier module is provided with a heat dissipating component, and a heat dissipating gas is introduced into the heat dissipating component to cool the pressing die.
5. The method of claim 4, wherein the carrier module has a carrier seat with a linear sliding channel, and the heat dissipating component is capable of moving in the linear sliding channel; the axial direction of the displacement of the heat dissipation component on the linear sliding flow path is perpendicular to the axial direction of the up and down displacement of the driven action of the cooling module.
6. The heat sink pressing method as claimed in claim 1, wherein the preset press-fit curing temperature is a temperature detected by (1) the heating portion for heating the lower die; (2) A temperature detected by a heating portion for heating the upper die; and (3) a temperature average value detected by each heating part for heating the upper die and the lower die; one of them.
7. A heat sink lamination device is applicable to a wafer and comprises:
a lower pressing die on which the chip is arranged, the chip being provided with a heat sink;
an upper pressing die arranged above the lower pressing die and capable of being driven to press the cooling fin;
a heating part arranged below the lower pressing die and provided with a heater capable of heating the lower pressing die; a kind of electronic device with high-pressure air-conditioning system
The cooling module is arranged below the lower pressing die and is provided with a cooling part capable of cooling the lower pressing die.
8. The heat spreader pressing apparatus as recited in claim 7, wherein the pressing die is integrally provided with a supporting portion disposed above the pressing die and the heating portion disposed below the supporting portion; the bearing part forms a concave locating section on four sides respectively, and a locating part is formed on the upper surface of the heating part exposed from each locating section.
9. The heat sink pressing device as claimed in claim 7, wherein the cooling module is disposed on a carrier of a seat frame capable of being driven to move up and down, and the carrier is provided with a hollow section; the seat frame is provided with a rail seat, a slide rail is arranged on the rail seat, the slide rail is provided with a slide seat, the carrying platform is arranged on the slide seat, and the slide seat is driven by a driving piece through a screw rod and can move up and down on the slide rail.
10. The heat sink pressing device as defined in claim 7, wherein the cooling module is provided with a cooling member, at least one cooling portion is provided above a base, a contact portion is provided on an upper surface of the at least one cooling portion, a cooling wafer is provided under the base of the cooling member in an abutting manner, the cooling wafer is provided on a heat sink fin member, the heat sink fin member is provided with an abutting portion for the cooling wafer to be arranged in an abutting manner, and a plurality of fins spaced apart from each other and positioned under the abutting portion, the heat sink fin member is supported by two side frames spaced apart from each other by two sides of the abutting portion, an air supply space is provided between the lower portion of the fins and a carrier, and a fan is provided in the air supply space at a hollowed-out portion of the carrier, and cold air can be blown to the heat sink fin member; the cooling element is provided with a joint for introducing cold air into the cooling portion.
11. The heat spreader pressing apparatus as recited in claim 7, wherein the pressing die is disposed on a carrier module, the carrier module has a transferring section hollowed out from top to bottom, and the pressing die is disposed above the transferring section with the heating portion.
12. The heat sink pressing device as claimed in claim 11, wherein the carrier module has a carrier seat and a heat sink assembly, wherein the carrier seat has a hollowed first transferring section, two sides of the first transferring section are respectively provided with a slot seat, and one end of a linear sliding flow path provided by each slot seat is provided with a stop part; the heat dissipation component is provided with a base which is displaced in the flow path of the linear sliding.
13. The heat sink pressing device as claimed in claim 12, wherein the base has a hollowed-out first hollowed-out section, a first air passage surrounding an outer periphery of the first hollowed-out section is provided in the base, the first air passage is further provided with an input air tap for air inflow and an output air tap for air outflow, and the base has a first connecting air hole; the upper surface of the base is overlapped with a first cushion, a hollowed second hollowed section is arranged on the first cushion, a second air passage surrounding the outer periphery of the second hollowed section is arranged on the first cushion, and second connecting air holes are arranged on the upper surface and the lower surface of the first cushion; the upper surface of the first cushion piece is overlapped with a second cushion piece, a hollowed third hollowed-out section is arranged on the second cushion piece, a third air passage surrounding the peripheral side of the third hollowed-out section is arranged on the second cushion piece, and third connecting air holes are arranged on the upper surface and the lower surface of the second cushion piece; when the base, the first cushion and the second cushion are mutually overlapped, the upper surface of the second cushion is abutted against the bottom surface of the heating part of the lower pressing die, the first hollowed-out section, the second hollowed-out section and the third hollowed-out section are communicated to form a second transferring section, the air for heat dissipation is input by the input air tap of the base of the heat dissipation assembly, and after the air flows through the base, the first cushion and the second cushion, the air flows out of the heat dissipation assembly from the output air tap of the base to form a circulating air flow path, and the circulating air flow path surrounds the periphery of the second transferring section; the transfer section is composed of the first transfer section and the second transfer section which are connected in a communicating manner.
14. The heat spreader pressing apparatus as recited in claim 7, wherein a closed space is formed between the upper die and the lower die along the periphery of the die, the closed space being formed by an enclosure, and an air-extracting connector for extracting air to form a vacuum in the closed space is provided on the enclosure; the cover is composed of an upper cover which is linked with the upper pressing mold and moves up and down, and a bottom cover which is positioned on the lower circumference of the lower pressing mold.
15. The heat sink pressing device as recited in claim 14 wherein the pressing die is disposed on a carrier module, the carrier module has a carrier seat and a heat sink assembly, the heat sink assembly has a base, a first pad is stacked on an upper surface of the base, and a second pad is stacked on an upper surface of the first pad; the first cushion is larger than the second cushion, and the bottom cover forms a frame shape and surrounds the periphery of the upper surface of the first cushion outside the second cushion.
16. A heat sink bonding apparatus for performing the heat sink bonding method according to any one of claims 1 to 6.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110147683A TWI790865B (en) | 2021-12-20 | 2021-12-20 | Heat sink pressing method and device |
| TW110147683 | 2021-12-20 | ||
| TW111100265 | 2022-01-04 | ||
| TW111100265A TWI787036B (en) | 2022-01-04 | 2022-01-04 | Heat sink pressing method and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116313821A true CN116313821A (en) | 2023-06-23 |
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ID=86792870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210118734.4A Pending CN116313821A (en) | 2021-12-20 | 2022-02-08 | Method and device for pressing cooling fin |
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| Country | Link |
|---|---|
| CN (1) | CN116313821A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116887531A (en) * | 2023-07-28 | 2023-10-13 | 湖南中科存储科技有限公司 | Method for implementing temperature control hot-press shaping on sealing glue PCB substrate |
-
2022
- 2022-02-08 CN CN202210118734.4A patent/CN116313821A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116887531A (en) * | 2023-07-28 | 2023-10-13 | 湖南中科存储科技有限公司 | Method for implementing temperature control hot-press shaping on sealing glue PCB substrate |
| CN116887531B (en) * | 2023-07-28 | 2024-02-06 | 湖南中科存储科技有限公司 | Method for implementing temperature control hot-press shaping on sealing glue PCB substrate |
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