CN116313417A - Aerospace power filter based on common-differential mode three-dimensional integrated inductor and manufacturing method - Google Patents
Aerospace power filter based on common-differential mode three-dimensional integrated inductor and manufacturing method Download PDFInfo
- Publication number
- CN116313417A CN116313417A CN202310213442.3A CN202310213442A CN116313417A CN 116313417 A CN116313417 A CN 116313417A CN 202310213442 A CN202310213442 A CN 202310213442A CN 116313417 A CN116313417 A CN 116313417A
- Authority
- CN
- China
- Prior art keywords
- magnetic core
- ltcc substrate
- mode
- common
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 239000003990 capacitor Substances 0.000 claims abstract description 51
- 229910000679 solder Inorganic materials 0.000 claims abstract description 50
- 238000004804 winding Methods 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims description 51
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 48
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- 229910002804 graphite Inorganic materials 0.000 claims description 13
- 239000010439 graphite Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000013461 design Methods 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 7
- 229910000833 kovar Inorganic materials 0.000 claims description 6
- 239000003985 ceramic capacitor Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 238000005336 cracking Methods 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000005201 scrubbing Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 2
- 230000035699 permeability Effects 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 239000011162 core material Substances 0.000 description 66
- 238000010586 diagram Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
- H01F27/266—Fastening or mounting the core on casing or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/40—Arrangements for reducing harmonics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Filters And Equalizers (AREA)
Abstract
The invention relates to an aerospace power filter based on a common-differential-mode three-dimensional integrated inductor and a manufacturing method thereof, wherein the common-differential-mode three-dimensional integrated inductor consists of a double-center-column magnetic core, a matched magnetic core and an LTCC substrate; the LTCC substrate is provided with four hollow areas, the double-center-column magnetic core is provided with two center columns and two side columns, the double-center-column magnetic core and the matched magnetic core are inserted into the hollow areas of the LTCC substrate and fixed, the two center columns, the LTCC substrate and the matched magnetic core form a common-mode inductor, and the two side columns, the LTCC substrate and the matched magnetic core form a differential-mode inductor; the common mode capacitor and the multi-layer inductance winding are printed in the LTCC substrate, and the front face of the LTCC substrate is welded with the differential mode capacitor and then is matched with the double-center-column magnetic core to realize all functions of the power filter; BGA solder balls/PGA solder pins are welded on the back surface of the LTCC substrate; the LTCC substrate, the enclosure frame and the cover plate form a sealed power filter cavity structure.
Description
Technical Field
The invention relates to a high-density aerospace power filter based on common-differential mode three-dimensional integrated inductance and a manufacturing method thereof, which are suitable for power input filter products which are required to have high reliability and miniaturization characteristics under high input bus current in the field of aerospace secondary power supply, and can be popularized and applied to high-density filters and secondary power supply products with high current characteristics in the field of military and civil use.
Background
In order to solve the problem of EMC interference of a secondary power supply in satellites and spacecraft to load equipment, a power supply filter must be equipped on the input side of the secondary power supply. Along with the long-term development of communication and navigation satellite technologies, the power and current level of a secondary power supply of a spacecraft serving as an energy source are gradually improved, so that the size of a power supply filter matched with the secondary power supply is increased, and the size of the power supply filter is close to that of a secondary power supply body. Meanwhile, the heat consumption of devices such as an internal inductor of the filter is increased due to the improvement of the power level, and the reliability of the filter and even the whole power supply system is affected due to the heat dissipation problem. Therefore, there is an urgent need to study and design power filters that are smaller and accommodate higher power levels.
The traditional power filter is low in space utilization rate by welding two inductors and multiple groups of capacitors on a printed circuit board in a planar mode. Part of the filter adopts a steel structure shell for enhancing heat dissipation capacity, so that the filter can only be installed through a flange structure, and the area of the filter is further occupied. The space power filter cannot adopt miniaturized integrated process methods such as plastic package substrate integrated process and the like, and in addition, heat dissipation can be carried out only in a conduction mode in a vacuum environment, so that process means for enhancing radiation heat dissipation such as encapsulation cannot be used. The high-density aerospace power filter based on the common-differential mode integrated inductor and the manufacturing method thereof are not found through searching related documents at home and abroad.
Disclosure of Invention
The invention solves the technical problems that: the high-density aerospace power filter based on the common-differential mode three-dimensional integrated inductor and the manufacturing method thereof are provided, the heat dissipation performance of the power filter under the working condition of high current is enhanced, the space utilization rate of the power filter is improved, and the high-density assembly of the power filter is realized.
The solution of the invention is as follows: an aerospace power filter based on a common-differential mode three-dimensional integrated inductor comprises a common-differential mode three-dimensional integrated inductor, a capacitor, BGA solder balls/PGA welding pins, a cover plate and an enclosure frame;
the common-differential mode three-dimensional integrated inductor consists of the LTCC substrate, a double-center-column magnetic core and a matched magnetic core; the LTCC substrate is a multilayer printed ceramic substrate with an integrated capacitor inside, and four hollow areas are arranged; the double-center-column magnetic core is provided with two center columns and two side columns; the double-center-column magnetic core and the matched magnetic core are inserted into a hollow area of the LTCC substrate and fixed, a common-mode inductor is formed by two center columns of the double-center-column magnetic core, the LTCC substrate and the matched magnetic core, and a differential-mode inductor is formed by two side columns of the double-center-column magnetic core, the LTCC substrate and the matched magnetic core;
the front lead-out bonding pad of the LTCC substrate is used for welding a differential mode capacitor, and the back lead-out bonding pad is used for welding BGA solder balls/PGA solder pins; the common-differential mode three-dimensional integrated inductor, the enclosure frame and the cover plate form a sealed power filter structure, the top of the inductor is in filling contact with the cover plate through heat dissipation materials, and the inductor extends out of the bottom of the substrate to enhance heat dissipation capacity.
Preferably, the heights of two side posts of the double-center-post magnetic core are designed to be h lower than the height of the center post, and the units are as follows: m; h= (N) 2 ×μ 0 ×A h )/L 2 ；
Wherein L2 is differential mode inductance, unit: h is formed; n is the number of turns of common mode inductance, unit: a turn; a is that h Mu, the effective cross-sectional area of the magnetic core 0 Is air permeability.
Preferably, the four differential mode capacitors are ceramic capacitors, the withstand voltage value is more than or equal to 100V, the capacity is more than or equal to 6.8 mu F in a serial connection mode, and the differential mode capacitors are welded on the LTCC substrate in a surface-mount mode.
Preferably, the main material of the LTCC substrate is AL 2 O 3 The ceramic is internally embedded with a common-mode capacitor, a winding coil of an inductor is formed through a multilayer vertical spiral structure wiring structure, the current carrying capacity of a conductor in an LTCC substrate is more than 10A, and the power consumption of the substrate is less than or equal to 0.1W; the brazing area is reserved around the front side of the LTCC substrate and used for welding a metal surrounding frame, the BGA/PGA bonding pad is led out from the back side of the ceramic substrate, and the BGA bonding pad comprises 4 potentials of primary bus input positive, primary bus input negative, secondary power input positive, secondary power input negative and shell ground in electrical property design.
Preferably, the common mode capacitor adopts a VIC structure, and the inductance windings are interconnected by adopting a three-dimensional spiral structure.
Preferably, the metal surrounding frame material is kovar alloy with Ni/Au plated on the surface, and is brazed on the LTCC substrate by adopting high-temperature solder, and the surrounding frame has equipotential with the shell ground in electrical property; the metal cover plate material is kovar alloy with Ni/Au plated on the surface, the cover plate is interconnected with the surrounding frame by adopting a parallel seam welding process, the metal cover plate is equipotential with the shell ground in electric characteristics, the cover plate and the magnetic core are filled with heat dissipation materials, and when the metal cover plate is used, the heat of the magnetic core is conducted out from the top by compacting the heat dissipation pressing block and the metal cover plate.
Preferably, the power density of the aerospace power filter is more than or equal to 5000W/in 3 。
The manufacturing method of the aerospace power filter based on the common-differential-mode three-dimensional integrated inductor comprises the following steps:
processing and manufacturing an LTCC substrate, wherein an inner layer conductor of the LTCC substrate is a gold conductor, a surface layer conductor is a platinum palladium silver or copper conductor, the surface layer and the inner layer are interconnected through a screen printing medium conductor, the printing area of the medium conductor is more than or equal to 0.3mm multiplied by 0.3mm, a common mode capacitor is embedded in a VIC structure, and an inductance winding is printed in a three-dimensional spiral structure;
welding the metal surrounding frame and the BGA ball/PGA welding pin, wherein the melting point of the high Wen Xigao used in welding is higher than that of the low-temperature solder paste used in the subsequent processing step;
welding differential mode capacitance: placing an LTCC substrate on the front side, smearing a low Wen Xigao on the front side of the LTCC substrate through a U-shaped screen plate, placing a capacitor on a corresponding bonding pad through a chip mounter, and welding the capacitor on the LTCC substrate through a reflow soldering furnace;
and (3) dispensing and fixing the welded differential mode capacitor;
placing the double-center-column magnetic core, the matched magnetic core and the LTCC substrate on the same vertical line through a tool, testing the common-mode inductance value and the differential-mode inductance value at the moment, compacting the double-center-column magnetic core and the matched magnetic core by using the tool when the differential-mode inductance value meets the requirement, and dispensing fixed glue at the joint of the double-center-column magnetic core and the matched magnetic core through a glue dispenser; maintaining the double middle column magnetic core and the matched magnetic core in a compacted state, and solidifying the aggregate of the double middle column magnetic core, the matched magnetic core and the LTCC substrate in an environment required by fixed glue;
cleaning the LTCC substrate with the adhered magnetic core, adhering a heat-conducting insulating gasket on the inner surface of a metal cover plate, scrubbing the metal cover plate and a metal surrounding frame on the LTCC substrate, and welding the cover plate on the LTCC surrounding frame through a parallel seam welder after baking in an inert gas environment.
Preferably, the solder metal enclosure and the BGA ball/PGA pin include:
cleaning the metal surrounding frame and the LTCC substrate which is processed and manufactured; inverting the LTCC substrate after cleaning, and smearing high-temperature solder paste on the BGA/PGA bonding pad at the bottom of the LTCC substrate through the screen; placing BGA solder balls on a grooved graphite tool, turning the LTCC substrate to be right side up, accurately aligning the BGA bonding pads of the LTCC substrate with the solder balls on the graphite tool through positioning marks, and stacking the LTCC substrate on the graphite tool;
placing square frame-shaped alloy solder in welding areas of four peripheral frames of the LTCC substrate, stacking a metal surrounding frame, and finally placing a copper pressing block on the metal surrounding frame, so that the LTCC substrate, the BGA welding balls and the metal surrounding frame are firmly fixed with the copper pressing block by a high-temperature-resistant graphite tool, and the welding balls or the surrounding frame are prevented from being shifted in position during high-temperature welding;
sintering by using a vacuum welding furnace.
Preferably, the differential mode capacitor after welding is fixed by dispensing, the positions of the fixing glue are on two sides of the body of the capacitor non-welding pad, the fixing glue has good cementation characteristic at high temperature, and the temperature change is not easy to cause cracking, and the cementation height is smaller than or equal to the height of the differential mode capacitor.
Compared with the prior art, the invention has the beneficial effects that:
(1) The common-differential mode three-dimensional integrated inductor provided by the invention utilizes the characteristic that the LTCC substrate can print a plurality of layers of spiral wires to manufacture the inductor coil, so that the inductor coil is three-dimensional, and the space utilization rate is improved. Secondly, the common-mode and differential-mode three-dimensional integrated inductor integrates common-mode inductance and differential-mode inductance by controlling the height difference between the middle column and the side column of the double middle column magnetic cores, and the functions of two inductors can be realized by one group of magnetic cores, so that the plane size of the filter is saved. And finally, the top of the magnetic core of the common-differential mode three-dimensional integrated inductor is contacted with the cover plate for heat dissipation, the bottom of the magnetic core is exposed on the bottom surface of the filter, the heat dissipation contact capacity of the inductor serving as a core heat source is increased, and meanwhile, the double-center-column magnetic core and the high-temperature solder balls serving as a mechanical mounting interface of the power filter can greatly buffer the problem that the thermal expansion coefficients of the LTCC ceramic substrate of the filter and the PCB substrate of a user are not matched.
(2) The high-density aerospace power filter based on the common-differential mode three-dimensional integrated inductor realizes the integration of all four elements of common-mode inductor, differential-mode inductor, common-mode capacitor and differential-mode capacitor, the common-mode capacitor with small heating value and small capacitance is arranged in an LTCC substrate, the differential-mode capacitor with large heating value and large capacitance is attached to the LTCC substrate, and the top and bottom of the inductor are in double-sided contact heat dissipation, so that the high-density aerospace power filter can be more suitable for the working condition of high-current aerospace power;
(3) According to the manufacturing method of the high-density aerospace power filter based on the common-differential mode three-dimensional integrated inductor, disclosed by the invention, the welding of different devices is performed step by step through the solders with different melting points, so that secondary melting of the welding devices such as BGA solder balls and capacitors in the manufacturing or using process of the filter can be effectively prevented. In addition, the inductance of the common-differential mode three-dimensional integrated inductor is manually controlled in the manufacturing process, so that the adjustment of the parameters of the filter can be realized to meet the requirements of different power supply products.
Drawings
FIG. 1 is a schematic diagram of a power filter circuit of the present invention;
FIG. 2 is a block diagram of a high density aerospace power filter based on common-differential mode three-dimensional integrated inductance of the present invention;
FIG. 3 is a schematic diagram illustrating the assembly of the inductor and the substrate in the filter;
FIG. 4 is an assembled structure of a common-differential mode three-dimensional integrated inductor;
FIG. 5 is a flow chart of a method of manufacturing a high density aerospace power filter based on common-differential mode three-dimensional integrated inductance according to the present invention;
fig. 6 is a schematic diagram of step 2 in the method for manufacturing a high-density aerospace power filter based on common-differential mode three-dimensional integrated inductance according to the present invention.
Detailed Description
The invention is further illustrated below with reference to examples.
High density aerospace power filter embodiments based on common-differential mode three-dimensional integrated inductors are described.
The aerospace power filter can realize that the power density index is more than or equal to 5000W/in 3 In the embodiment, the rated power of the aerospace power filter is 300W, the size is less than or equal to 16mm multiplied by 3.5mm, and the power density is more than or equal to 5357W/in 3 。
Fig. 1 and fig. 2 are schematic circuit diagrams and structural diagrams of a high-density aerospace power filter based on a common-differential-mode three-dimensional integrated inductor, which comprises a double-center-column magnetic core 1, a single LTCC substrate 2 integrated with common-mode capacitors C3, C4, C5, C6 and an inductor winding, four differential-mode capacitors 3 (C1, C2, C7, C8), 24 BGA solder balls 4, a matched magnetic core 5, a metal cover plate 6 and a metal surrounding frame 7.
The double-center-post magnetic core material is ferrite magnetic material with high magnetic conductivity, in the embodiment, the double-center-post magnetic core material is 3E6 material, and the double-center-post magnetic core is provided with two center posts and two side posts. The height of the two side posts is designed to be lower than the height of the middle post by H (unit: m), the height difference is determined by the value (unit: H) of the differential mode inductance L2 required by the filter, and the calculation is carried out according to the number of turns N (unit: turns) of the common mode inductance and the effective cross-sectional area Ah of the double middle post magnetic core after the common mode inductance is designed, wherein the calculation formula is as follows: h= (N) 2 ×μ 0 ×A h )/L 2 . The double leg core dimensions used in the examples were 14mm x 5mm x 2mm, the two leg heights were designed to be 0.1mm lower than the leg height, the two leg dimensions were: the dimensions of two center posts are 5mm multiplied by 1mm multiplied by 1.9mm, the inductance of the common mode inductor is designed to be 560 mu H, and the inductance of the differential mode inductor is designed to be 10 mu H.
The main material of the LTCC substrate is AL 2 O 3 And the ceramic, the internal integrated common-mode capacitor, the inductance winding coil and the lead are printed by adopting a screen printing process. According to the type selection guarantee requirement of the aerospace ceramic capacitor, the capacity of the common-mode capacitor is 100pF, and the withstand voltage value is more than or equal to 100V. In the embodiment, the embedded common mode capacitor adopts a VIC structure, the electrode material of the capacitor is a silver electrode, the dielectric material is a ceramic material with a dielectric constant of 7.8 and a dielectric loss of 0.0047, and the thickness is 35 mu m. The inductance windings inside the LTCC substrate are interconnected by adopting the three-dimensional spiral structure shown in fig. 3, the number of turns of the coil is calculated according to the inductance AL value of the used magnetic core material, and in the embodiment, the number of turns of the inductance windings inside the LTCC substrate is 10.
The inner metal layer of the LTCC substrate adopts a gold conductor, the outer metal layer adopts a platinum-palladium-silver conductor to increase the current carrying capacity, and the conductor is increased or decreased according to the difference of the currentThe conductor current density should be 10A/mm or less 2 The communication via hole between the inner and outer conductors is filled with silver paste, and the size of the via hole is designed to be 0.3mm multiplied by 0.3mm. 24 BGA/PGA bonding pads are led out from the back of the LTCC substrate, the number of the bonding pads is calculated according to the current, and the current density is less than or equal to 10A/mm 2 The BGA bonding pad comprises 4 potentials including primary bus input positive, primary bus input negative, secondary power input positive, secondary power input negative and shell ground on the electrical property design, the bonding pad is circular in shape, and the design standard of the bonding pad size is as follows: when a solder ball with the diameter of 0.89mm is adopted, the size of the solder pad is designed to be 0.86mm, and the pitch is 1.27mm; when solder balls with a diameter of 0.76mm are used, the size of the solder pads should be designed to be 0.76mm and the pitch 1mm.
The four differential mode capacitors are ceramic capacitors, the derating standard and the reliability design criterion of an aerospace power supply are considered, the capacitors are in a series connection mode, the withstand voltage value is more than or equal to 100V, the capacity is more than or equal to 6.8 mu F, the filter is guaranteed to have a good differential mode interference suppression effect, and the ceramic capacitors are welded on the LTCC substrate in a reflow soldering mode.
The BGA solder balls are high-temperature solder balls made of Pb90Sn10 material, the diameter is 0.89mm, the pitch of each solder ball is 1.27mm, and the BGA solder balls play roles in electric connection and mechanical connection.
The matched magnetic core is the same as the double middle column magnetic core in material, the same as the double middle column magnetic core in length and width, and the height is consistent with the height of the BGA solder balls, in the embodiment, the double middle column magnetic core is made of 3E6 material, and the matched magnetic core is 14mm multiplied by 5mm multiplied by 1mm in size.
The metal surrounding frame is made of 4J29 kovar alloy, ni/Au is plated on the surface of the metal surrounding frame, the surrounding frame is designed to have the same potential with the shell ground of the filter in terms of electric performance, and the thickness of the surrounding frame is 0.6mm.
The metal cover plate is made of 4J29 kovar alloy, ni/Au is plated on the surface of the metal cover plate, the cover plate is designed to have the same electric potential with the shell of the filter in terms of electric performance, the cover plate is a step-shaped cover plate, the thickness of the cover plate is 0.25mm, the thickness of the cover plate at the sealing part where the cover plate is contacted with the surrounding frame is 0.1mm, and the radius of a round angle of the cover plate and the welding ring is 0.8mm.
As shown in fig. 4, the common-differential mode three-dimensional integrated inductor is formed by bonding a double-center-post magnetic core, a matched magnetic core and an LTCC substrate together, wherein four hollow areas are formed in the middle of the LTCC substrate and used for penetrating the double-center-post magnetic core, and the double-center-post magnetic core is bonded with the matched magnetic core after penetrating the LTCC substrate to form a common-mode inductor L1 and a differential-mode inductor L2. The double middle column of the double middle column magnetic core, the LTCC substrate and the matched magnetic core form a common mode inductance L1, and the inductance of the common mode inductance is 560 mu H; the side columns of the double-center-column magnetic core, the LTCC substrate and the matched magnetic core form a differential mode inductance, and the inductance of the differential mode inductance is 10 mu H. The top of the magnetic core is contacted with the cover plate for heat dissipation, the bottom of the magnetic core is exposed on the bottom surface of the filter to increase the heat dissipation contact area, and meanwhile, the bottom of the magnetic core is coplanar with the BGA solder balls and is used as a mechanical mounting interface together with the BGA solder balls.
Embodiments of a method for manufacturing a high-density aerospace power filter based on common-differential mode three-dimensional integrated inductance are described.
As shown in fig. 5, the method for manufacturing the high-density aerospace power filter based on the common-differential mode three-dimensional integrated inductor includes the following steps.
Step 1:
and processing to manufacture the LTCC multilayer ceramic substrate. And processing the LTCC multilayer substrate according to the previous electric design, mechanical mechanism design and layout design, wherein the common-mode inductance winding is printed by adopting a three-dimensional spiral structure.
Step 2:
and welding the metal surrounding frame and the BGA ball. As shown in fig. 6, the high temperature welding tool assembly for the metal enclosure frame and the BGA solder balls comprises a copper press block 8 and a graphite tool 9.
Step 2-1. And cleaning the metal surrounding frame integrating the common-mode capacitor and the inductance winding coil and the LTCC substrate in trichloroethane liquid. After cleaning, the LTCC substrate is inverted, high temperature solder paste is smeared on the bottom BGA/PGA bonding pad of the LTCC substrate through a screen, and the melting point of the high Wen Xigao solder paste used in welding is higher than that of the low temperature solder paste used in the subsequent processing steps. In example step 2-1, a solder paste with a height Wen Xigao specification of 5087 and a solder paste thickness of 80-100 μm is used. And placing the BGA solder balls of Pb90Sn10 on a grooved graphite tool, turning the LTCC substrate to be right-side-up, accurately aligning the BGA bonding pads of the LTCC substrate with the solder balls on the graphite tool through a positioning mark, and stacking the LTCC substrate on the graphite tool.
Step 2-2. Placing square frame-shaped alloy solder in the welding area of the four peripheral frames of the LTCC substrate, stacking the metal surrounding frames, and finally placing a copper pressing block on the metal surrounding frames, so that the LTCC substrate, the BGA welding balls and the metal surrounding frames are firmly fixed with the copper pressing block by a high-temperature-resistant graphite tool, and the welding balls or the surrounding frames are prevented from being shifted in position during high-temperature welding.
Step 2-3. And sintering the high-temperature welding tool assembly of the metal surrounding frame and the BGA solder balls by using a vacuum welding furnace, wherein the sintering period is 30min, and the sintering peak temperature is 360-400 ℃.
Step 3:
and welding a differential mode capacitor. And placing the LTCC substrate on the front side, smearing Pb63Sn37 solder paste on the front side of the LTCC substrate through a U-shaped screen plate, wherein the thickness of the solder paste is 80-100 mu m, placing the capacitor on a corresponding bonding pad through a chip mounter, and welding the capacitor and the LTCC substrate through a reflow soldering furnace.
Step 4:
and manufacturing the common-differential mode three-dimensional integrated inductor and adhering the device.
Step 4-1. And (3) manually dispensing and fixing the welded differential mode capacitor, wherein the fixed glue is arranged on two sides of a body of the capacitor, which is not a bonding pad, and the bonding height is smaller than or equal to the height of the differential mode capacitor. The fixing glue should be good in cementation property at high temperature as much as possible, and cracking is not easy to occur due to temperature change, and the model of the fixing glue in the embodiment is EMS400-36.
Step 4-2.
Placing the double-center-column magnetic core, the matched magnetic core and the LTCC substrate on the same vertical line through a tool, testing the common-mode inductance value and the differential-mode inductance value at the moment, compacting the double-center-column magnetic core and the matched magnetic core when the differential-mode inductance value meets the requirement, and dispensing the fixed glue at the joint of the double-center-column magnetic core and the matched magnetic core through a glue dispenser. The fixing glue should be good in cementation property at high temperature as much as possible, and cracking is not easy to occur due to temperature change, and the model of the fixing glue in the embodiment is EMS400-36. The double middle column magnetic core and the matched magnetic core are kept in a compacted state, and the aggregate of the double middle column magnetic core, the matched magnetic core and the LTCC substrate is stored in an environment of 120 ℃ and kept stand for 45 minutes for solidification.
Step 5:
and (5) welding the cover plate. Cleaning the LTCC substrate with the adhered magnetic core, adhering a heat-conducting insulating gasket on the inner surface of a metal cover plate, scrubbing the metal cover plate and a metal surrounding frame on the LTCC substrate, and welding the cover plate on the LTCC surrounding frame through a parallel seam welder after baking in an inert gas environment.
The invention greatly improves the space utilization rate through the three-dimensional integration of the common-differential mode inductor, reduces the size of the power filter by more than 50 percent, simultaneously reduces the line loss through the double-sided interconnection of the LTCC substrate, and enhances the heat dissipation capacity through the contact heat dissipation of the top and the cover plate of the inductor and the extension of the bottom of the inductor from the substrate, so that the power filter can adapt to the application occasions with larger current and high power.
Although the present invention has been described in terms of the preferred embodiments, it is not intended to be limited to the embodiments, and any person skilled in the art can make any possible variations and modifications to the technical solution of the present invention by using the methods and technical matters disclosed above without departing from the spirit and scope of the present invention, so any simple modifications, equivalent variations and modifications to the embodiments described above according to the technical matters of the present invention are within the scope of the technical matters of the present invention.
Claims (10)
1. An aerospace power filter based on a common-differential mode three-dimensional integrated inductor is characterized by comprising the common-differential mode three-dimensional integrated inductor, a capacitor, BGA solder balls/PGA solder pins, a cover plate and a surrounding frame;
the common-differential mode three-dimensional integrated inductor consists of the LTCC substrate, a double-center-column magnetic core and a matched magnetic core; the LTCC substrate is a multilayer printed ceramic substrate with an integrated capacitor inside, and four hollow areas are arranged; the double-center-column magnetic core is provided with two center columns and two side columns; the double-center-column magnetic core and the matched magnetic core are inserted into a hollow area of the LTCC substrate and fixed, a common-mode inductor is formed by two center columns of the double-center-column magnetic core, the LTCC substrate and the matched magnetic core, and a differential-mode inductor is formed by two side columns of the double-center-column magnetic core, the LTCC substrate and the matched magnetic core;
the front lead-out bonding pad of the LTCC substrate is used for welding a differential mode capacitor, and the back lead-out bonding pad is used for welding BGA solder balls/PGA solder pins; the common-differential mode three-dimensional integrated inductor, the enclosure frame and the cover plate form a sealed power filter structure, the top of the inductor is in filling contact with the cover plate through heat dissipation materials, and the inductor extends out of the bottom of the substrate to enhance heat dissipation capacity.
2. The power filter of claim 1, wherein: the two side column heights of the double-center column magnetic core are designed to be h lower than the center column height, and the units are as follows: m; h= (N) 2 ×μ 0 ×A h )/L 2 ；
Wherein L2 is differential mode inductance, unit: h is formed; n is the number of turns of common mode inductance, unit: a turn; a is that h Mu, the effective cross-sectional area of the magnetic core 0 Is air permeability.
3. The power filter of claim 1, wherein: the four differential mode capacitors are ceramic capacitors, the withstand voltage value is more than or equal to 100V, the capacity is more than or equal to 6.8 mu F in a serial connection mode, and the differential mode capacitors are welded on the LTCC substrate in a surface-mount mode.
4. The power filter of claim 1, wherein: the main material of the LTCC substrate is AL 2 O 3 The ceramic is internally embedded with a common-mode capacitor, a winding coil of an inductor is formed through a multilayer vertical spiral structure wiring structure, the current carrying capacity of a conductor in an LTCC substrate is more than 10A, and the power consumption of the substrate is less than or equal to 0.1W; the brazing area is reserved around the front side of the LTCC substrate and used for welding a metal surrounding frame, the BGA/PGA bonding pad is led out from the back side of the ceramic substrate, and the BGA bonding pad comprises 4 potentials of primary bus input positive, primary bus input negative, secondary power input positive, secondary power input negative and shell ground in electrical property design.
5. The power filter of claim 4, wherein: the common mode capacitor adopts a VIC structure, and the inductance windings are interconnected by adopting a three-dimensional spiral structure.
6. The power filter of claim 1, wherein: the metal surrounding frame material is kovar alloy with Ni/Au plated on the surface, and is brazed on the LTCC substrate by adopting high-temperature solder, and the surrounding frame has equipotential with the shell ground in the electrical characteristic; the metal cover plate material is kovar alloy with Ni/Au plated on the surface, the cover plate is interconnected with the surrounding frame by adopting a parallel seam welding process, the metal cover plate is equipotential with the shell ground in electric characteristics, the cover plate and the magnetic core are filled with heat dissipation materials, and when the metal cover plate is used, the heat of the magnetic core is conducted out from the top by compacting the heat dissipation pressing block and the metal cover plate.
7. A power filter according to any one of claims 1-6, characterized in that: the power filter is suitable for high power density, and the power density of the power filter is more than or equal to 5000W/in 3 。
8. A method of manufacturing an aerospace power filter based on common-mode three-dimensional integrated inductors as set forth in claim 1, comprising:
processing and manufacturing an LTCC substrate, wherein an inner layer conductor of the LTCC substrate is a gold conductor, a surface layer conductor is a platinum palladium silver or copper conductor, the surface layer and the inner layer are interconnected through a screen printing medium conductor, the printing area of the medium conductor is more than or equal to 0.3mm multiplied by 0.3mm, a common mode capacitor is embedded in a VIC structure, and an inductance winding is printed in a three-dimensional spiral structure;
welding the metal surrounding frame and the BGA ball/PGA welding pin, wherein the melting point of the high Wen Xigao used in welding is higher than that of the low-temperature solder paste used in the subsequent processing step;
welding differential mode capacitance: placing an LTCC substrate on the front side, smearing a low Wen Xigao on the front side of the LTCC substrate through a U-shaped screen plate, placing a capacitor on a corresponding bonding pad through a chip mounter, and welding the capacitor on the LTCC substrate through a reflow soldering furnace;
and (3) dispensing and fixing the welded differential mode capacitor;
placing the double-center-column magnetic core, the matched magnetic core and the LTCC substrate on the same vertical line through a tool, testing the common-mode inductance value and the differential-mode inductance value at the moment, compacting the double-center-column magnetic core and the matched magnetic core by using the tool when the differential-mode inductance value meets the requirement, and dispensing fixed glue at the joint of the double-center-column magnetic core and the matched magnetic core through a glue dispenser; maintaining the double middle column magnetic core and the matched magnetic core in a compacted state, and solidifying the aggregate of the double middle column magnetic core, the matched magnetic core and the LTCC substrate in an environment required by fixed glue;
cleaning the LTCC substrate with the adhered magnetic core, adhering a heat-conducting insulating gasket on the inner surface of a metal cover plate, scrubbing the metal cover plate and a metal surrounding frame on the LTCC substrate, and welding the cover plate on the LTCC surrounding frame through a parallel seam welder after baking in an inert gas environment.
9. The manufacturing method according to claim 8, characterized in that: the solder metal enclosure and BGA ball/PGA pin includes:
cleaning the metal surrounding frame and the LTCC substrate which is processed and manufactured; inverting the LTCC substrate after cleaning, and smearing high-temperature solder paste on the BGA/PGA bonding pad at the bottom of the LTCC substrate through the screen; placing BGA solder balls on a grooved graphite tool, turning the LTCC substrate to be right side up, accurately aligning the BGA bonding pads of the LTCC substrate with the solder balls on the graphite tool through positioning marks, and stacking the LTCC substrate on the graphite tool;
placing square frame-shaped alloy solder in welding areas of four peripheral frames of the LTCC substrate, stacking a metal surrounding frame, and finally placing a copper pressing block on the metal surrounding frame, so that the LTCC substrate, the BGA welding balls and the metal surrounding frame are firmly fixed with the copper pressing block by a high-temperature-resistant graphite tool, and the welding balls or the surrounding frame are prevented from being shifted in position during high-temperature welding;
sintering by using a vacuum welding furnace.
10. The manufacturing method according to claim 8, characterized in that: and (3) dispensing and fixing the differential-mode capacitor after welding, wherein the positions of the fixing glue are on two sides of a body of the capacitor, the fixing glue has good cementation characteristics when the fixing glue is at high temperature, cracking is not easy to occur due to temperature change, and the cementation height is smaller than or equal to the height of the differential-mode capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310213442.3A CN116313417A (en) | 2023-03-01 | 2023-03-01 | Aerospace power filter based on common-differential mode three-dimensional integrated inductor and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310213442.3A CN116313417A (en) | 2023-03-01 | 2023-03-01 | Aerospace power filter based on common-differential mode three-dimensional integrated inductor and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116313417A true CN116313417A (en) | 2023-06-23 |
Family
ID=86799016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310213442.3A Pending CN116313417A (en) | 2023-03-01 | 2023-03-01 | Aerospace power filter based on common-differential mode three-dimensional integrated inductor and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116313417A (en) |
-
2023
- 2023-03-01 CN CN202310213442.3A patent/CN116313417A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211879369U (en) | Chip packaging structure and electronic equipment | |
| JP5352437B2 (en) | Manufacturing method of semiconductor device | |
| US7594316B2 (en) | Method of manufacturing composite electronic component | |
| CN205428912U (en) | Module and module components and parts | |
| CN1729731B (en) | Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board | |
| JP4265607B2 (en) | Laminated electronic component and mounting structure of laminated electronic component | |
| TW201405726A (en) | Module, and production method therefor | |
| CN104485324A (en) | Lead-less ball foot surface adhesion type microwave film hybrid integrated circuit and integration method thereof | |
| CN114050130A (en) | CSOP type ceramic shell, amplifying filter and manufacturing method | |
| US20190014655A1 (en) | Composite component-embedded circuit board and composite component | |
| JP2005209881A (en) | Ceramic laminated substrate and high frequency electronic component | |
| TW201546841A (en) | An electrode structure and the corresponding electrical component using the same and the fabrication method thereof | |
| JP2004040001A (en) | Coil component and circuit device | |
| CN103871724B (en) | Power inductance and manufacture method thereof | |
| CN102169872B (en) | Power module of integrated inductor | |
| CN116313417A (en) | Aerospace power filter based on common-differential mode three-dimensional integrated inductor and manufacturing method | |
| JP4342790B2 (en) | Magnetic component for surface mounting and surface mounting circuit device using the same | |
| CN115732450A (en) | Novel high-density packaging structure of power module and manufacturing method thereof | |
| JP2004111552A (en) | Flat magnetic element, its manufacturing method, and small power supply module | |
| JP3472523B2 (en) | Wiring board with built-in electric element | |
| JP2003163559A (en) | Circuit board with filter | |
| CN202034888U (en) | Power supply module of integrated inductor | |
| CN219018781U (en) | Filter | |
| CN104465607A (en) | Leadless plane surface-mounted type microwave thin film hybrid integrated circuit and integration method thereof | |
| JPH11329845A (en) | Electronic component and manufacture thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |