CN116313342A - Local plastic-packaged antioxidant high-power alloy resistor and preparation method thereof - Google Patents
Local plastic-packaged antioxidant high-power alloy resistor and preparation method thereof Download PDFInfo
- Publication number
- CN116313342A CN116313342A CN202310037710.0A CN202310037710A CN116313342A CN 116313342 A CN116313342 A CN 116313342A CN 202310037710 A CN202310037710 A CN 202310037710A CN 116313342 A CN116313342 A CN 116313342A
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- alloy resistor
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- 239000000956 alloy Substances 0.000 title claims abstract description 105
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 104
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000003963 antioxidant agent Substances 0.000 title claims description 11
- 230000003078 antioxidant effect Effects 0.000 title claims description 11
- 239000000463 material Substances 0.000 claims abstract description 60
- 239000004033 plastic Substances 0.000 claims abstract description 55
- 238000003466 welding Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000005022 packaging material Substances 0.000 claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- 238000004080 punching Methods 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000010894 electron beam technology Methods 0.000 claims description 4
- 239000012778 molding material Substances 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 10
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 8
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000005096 rolling process Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 230000009194 climbing Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a preparation method of a local plastic-packaged high-power alloy resistor, which comprises the following steps: welding the electrode strip and the alloy strip to obtain a material strip; punching the material belt to form a plurality of alloy resistor bodies on the material belt; performing plastic packaging operation on the whole material belt to ensure that the outer surface of the alloy resistor body is completely covered with plastic packaging materials; removing the plastic packaging material on the area of the electrode on the alloy resistor body corresponding to the subsequent welding; separating the alloy resistor body from the material belt to form the high-power alloy resistor with the local plastic package; and carrying out nickel tin plating by rolling on the locally plastic-packaged high-power alloy resistor. According to the preparation method of the local plastic-packaged high-power alloy resistor, the material strips are adopted for welding, punching and plastic packaging, and then the material strips are subjected to grading and plastic packaging, so that the preparation is convenient, and the dependence on a die is eliminated; the whole product is packaged in a plastic way, and the end of the product and the welding area are electroplated with nickel tin to realize the oxidation resistance in the reflow soldering process of the product.
Description
Technical Field
The invention belongs to the technical field of alloy resistors, and particularly relates to a preparation method of a local plastic-packaged antioxidant high-power (at least 7W) alloy resistor and the antioxidant high-power alloy resistor prepared by the preparation method.
Background
Compared with the traditional plastic package resistor, the high-power alloy resistor has the advantages of high power and low resistance accuracy, and in view of the fact that the high-power alloy resistor is made of pure alloy materials, products and processes for plastic package of the high-power alloy resistor are not available in the prior art, and the structural defect is that a client cannot perform wave soldering, and tin climbing in the soldering process can have a certain influence on the resistance and temperature drift. However, the traditional plastic package resistor has larger dependence on the die, is complicated to debug for different product equipment and has large power consumption, in addition, the traditional high-power alloy resistor is bent into an arch shape by stamping, and the temperature coefficient of resistance of copper is far greater than that of the alloy, so that the temperature coefficient of the product is greatly increased by the duty ratio of copper in an arch bridge.
When the existing high-power alloy resistor product is subjected to short test overload, the heating temperature of the product reaches 500-700 ℃, and the existing plastic packaging material cannot meet the requirement of the test condition, so that the existing high-power current divider solves the problem of oxidization resistance before use by forming a passivation layer on the surface.
The invention patent application with the application number of CN109102973A discloses a resistor and a manufacturing method of the resistor, but only the position below the resistor body is coated with paint or epoxy resin by adopting a common method of spraying, printing, roller coating or other similar coating materials, so that the coating area is not limited clearly, the accuracy of the spraying area is difficult to control, and the resistance of the product is affected, in particular to a low-resistance resistor product sensitive to the resistance. And the antioxidation layer of the product prepared by the method can be cracked in the reflow soldering process, so that the product loses the protection effect.
Disclosure of Invention
In view of the above, in order to overcome the defects of the prior art, the invention aims to provide a local plastic-packaged antioxidant high-power alloy resistor, which realizes the sufficient protection of the high-power alloy resistor.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a preparation method of a local plastic-packaged high-power alloy resistor comprises the following steps:
welding the electrode strip and the alloy strip to obtain a material strip;
punching the material belt to form a plurality of alloy resistor bodies on the material belt;
performing plastic packaging operation on the whole material belt to ensure that the outer surface of the alloy resistor body is completely covered with plastic packaging materials;
removing the plastic packaging material on the area of the electrode on the alloy resistor body corresponding to the subsequent welding;
separating the alloy resistor body from the material belt to form the high-power alloy resistor with the local plastic package;
and carrying out nickel tin plating by rolling on the high-power alloy resistor which is partially molded, so that plating layers are formed on the end surfaces of the two ends of the alloy resistor and the welding area.
According to some preferred embodiments of the present invention, the electrode strip and the alloy strip have the same length extending direction when welded, and the welding is to weld the electrode strip to the side surface of the alloy strip in the width direction by using electron beam welding.
According to some preferred embodiments of the invention, the electrode strip is used to form an electrode of a high-power alloy resistor, the alloy strip is used to form a resistor body of the high-power alloy resistor; the thickness of the electrode strip is greater than the thickness of the alloy strip.
According to some preferred embodiments of the invention, one side of the strip in the thickness direction is flush with the electrode strip; and the other side of the material belt in the thickness direction is higher than the surface of the alloy belt, so that a welding area is formed.
According to some preferred embodiments of the present invention, the plastic packaging is to soak the whole material strip in the plastic packaging material or spray the plastic packaging material onto the whole material strip, and dry and solidify the whole material strip to completely plastic package. The material belt product is soaked in the high-temperature resistant polyimide material, and the method is simple and easy to operate and has low cost.
According to some preferred embodiments of the invention, the removing is removing the plastic package material on the welding area by using a laser. The laser can be used for selectively removing the electrode polymer to realize a plastic package product with low cost, high efficiency and high yield.
According to some preferred embodiments of the present invention, the molding material is a polyimide material, preferably a high temperature resistant polyimide material, and the thermal decomposition temperature thereof is 500-600 ℃.
According to some preferred embodiments of the invention, the width of the electrode is greater than the width of the resistive body.
According to some preferred implementation aspects of the invention, the working power of the high-power alloy resistor is more than or equal to 7W, and the power of the product with the same specification is higher than that of the traditional plastic package resistor.
According to some preferred embodiments of the invention, the separation is a longitudinal cut along the thickness direction of the strip to form individual bridge-like partial plastic package resistances.
The invention also provides the local plastic-packaged high-power alloy resistor prepared by the preparation method.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages: according to the preparation method of the local plastic-packaged high-power alloy resistor, the material strips are adopted for welding, punching and plastic packaging, and then the material strips are subjected to grading and plastic packaging, so that the preparation is convenient, and the dependence on a die is eliminated; the whole product is packaged in a plastic way, and the end of the product and the welding area are electroplated with nickel tin to realize the oxidation resistance in the reflow soldering process of the product.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view of a partially encapsulated antioxidant high power alloy resistor in an embodiment of the invention;
FIG. 2 is a schematic top view of a partially encapsulated antioxidant high power alloy resistor in an embodiment of the invention;
FIG. 3 is a schematic diagram of a material strip structure for preparing an antioxidant high-power alloy resistor according to an embodiment of the present invention
In the accompanying drawings, 1: an antioxidant high-power alloy resistor with local plastic package; 2: a strip; 3: an alloy resistor; 4: a spacing region; 5: a junction; 8: a plastic packaging material; 9: a resistor main body; 10: an electrode; 11: plating a Ni layer; 12: and plating a Sn layer.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
Example 1 high Power alloy resistance
As shown in fig. 1-3, the partially plastic-sealed high-power alloy resistor 1 in the present embodiment includes a resistor main body 9, electrodes 10 located on both sides of the resistor main body 9, a plastic sealing material 8 covering a partial surface of the alloy resistor, nickel tin layers 11, 12 covering the remaining surfaces, and the electrodes 10 are welded on both sides of the resistor main body 9 in the length direction by electron beam welding. The width of the electrode 10 is larger than the width of the resistor main body 9, and the width direction here refers to the width direction of the high-power alloy resistor 1.
The thickness of the electrode 10 is larger than that of the resistor main body 9, specifically, one surface of the high-power alloy resistor 1 in the thickness direction is flush with the resistor main body 9; on the other side of the high-power alloy resistor 1 in the thickness direction, the surface of the electrode 10 is higher than the surface of the resistor main body 9 and extends outwards.
In this embodiment, the plastic sealing material 8 is covered on the remaining surfaces of the two end surfaces in the length direction and the part (welding area) of the electrode 10 for subsequent welding, and the nickel plating layer 11 and the tin plating layer 12 are covered on the remaining surfaces, so that oxidation resistance in the product reflow soldering process can be effectively realized.
The high-power alloy resistor 1 with the local plastic package in the embodiment has the advantages of high power, high resistance value precision, low temperature drift, wave soldering, low manufacturing cost and the like.
Example 2 preparation method
The embodiment provides a preparation method of a high-power alloy resistor 1 based on local plastic package in embodiment 1, which specifically comprises the following steps:
step 1, preparing a material belt
Selecting a proper alloy strip and a proper electrode strip according to the required resistance, wherein the alloy strip is usually Mn-Cu alloy and the like; the electrode strip is made of red copper material with small resistivity. And welding the electrode strip and the alloy strip by adopting an electron beam welding mode to obtain an arc-shaped material strip of the electrode + alloy + electrode. The middle of the material belt is provided with an electrode, an alloy and an electrode, and two sides of the material belt are provided with belt materials 2 connected with the electrodes.
During welding, the length extension directions of the electrode strips and the alloy strips are the same, and the two electrode strips are welded on the lateral surfaces of the alloy strips in the width direction. Wherein the thickness of the electrode strip is greater than the thickness of the alloy strip, the electrode strip is used for forming the electrode 10 of the high-power alloy resistor 1, and the alloy strip is used for forming the resistor main body 9 of the high-power alloy resistor 1. The width of the finally formed electrode 10 is larger than the width of the resistor body 9.
One surface of the material belt in the thickness direction is flush with the electrode belt material and the alloy belt material; on the other side of the thickness direction of the material strip, the surface of the electrode strip is higher than the surface of the alloy strip so as to form a welding area.
Step 2, punching
The strip is die cut according to the required resistance value and the predetermined size, so that a plurality of alloy resistor bodies 3 are formed on the strip, and the tail end connection parts 5 of the two end electrodes 10 of each resistor alloy body are connected to the strip 2 to form the strip. The plurality of alloy resistors 3 are arranged in sequence along the length direction of the material strip, and a spacing area 4 formed by punching is arranged between the adjacent alloy resistors 3.
And (3) carrying out plastic packaging operation on the whole material belt, soaking the whole material belt in the plastic packaging material 8 or spraying the plastic packaging material 8 on the whole material belt, and drying and curing to completely plastic-package the whole material belt so that the outer surface of the alloy resistor body 3 is completely covered with the plastic packaging material 8.
The plastic package material 8 is a high temperature resistant polyimide material with a tensile strength of 250-500MPa, a thermal decomposition temperature of 500-600 ℃ and a thermal expansion coefficient of 1X 10 -6 The smoke generation rate is extremely low, and the carbon residue rate after high-temperature combustion is more than 50 percent.
Step 4, laser
And the plastic packaging material 8 corresponding to the welding area (namely the bottom of the electrode 10) on the alloy resistor body 3 is removed in a laser mode, so that the red copper base material is exposed, and the subsequent welding with the welding pad is facilitated. The precision of the laser can be controlled to be +/-0.2 mm.
Step 5, classification
The connection position 5 between the electrode 10 and the strip 2 on the material strip after plastic packaging is classified, longitudinal cutting is carried out along the thickness direction of the material strip, and the alloy resistor body 3 is separated from the material strip, so that the high-power alloy resistor 1 with the local plastic packaging is formed, and the working power is more than or equal to 7W.
The obtained high-power alloy resistor 1 with partial plastic package has a resistor main body 9 and two welding electrodes 10, and the high-power alloy resistor 1 has plastic packages except the surface (welding area) of the bottom of the electrode 10 and the two end surfaces in the length direction.
Step 6, electroplating
And (3) carrying out nickel-tin plating on the product, so that nickel-tin plating layers 11 and 12 are formed on two end surfaces and a welding area of the product, and the local plastic package oxidation-resistant high-power alloy resistor 1 is obtained. The welding areas of the two end faces of the obtained high-power alloy resistor 1 and the electrode are provided with a nickel plating layer 11 and an outer tinning layer 12, and the surfaces of the rest parts are provided with plastic sealing layers 8.
The electrical properties of the product prepared by the method are as follows: the power is 7-9 w, the resistance accuracy is 0.5%, and the short-time overload test is 5 times of rated power.
According to the preparation method of the local plastic-packaged high-power alloy resistor, the traditional high-power alloy resistor stamping and bending process is changed, materials with electrode thickness larger than alloy thickness are selected to be directly welded into arch materials, the ratio of copper in an arch bridge is greatly reduced, and then the temperature coefficient of resistance of a product is reduced. In addition, the high-power alloy resistor is selectively subjected to plastic package, so that the manufacturing cost is reduced, and the specifications of plastic package products are diversified. Finally, the copper exposure position is electroplated, so that a better antioxidation effect is achieved, and the prepared local plastic-packaged high-power alloy resistor not only has high power characteristics and low resistance temperature coefficient, but also avoids the influence on resistance and temperature drift caused by tin climbing to the main body part of the resistor in the welding process, and can be welded by a wave crest welding process. Compared with the prior art, the low-temperature floating product is realized by adopting a step welding mode; the product is soaked in the high-temperature resistant polyimide material, and the method is simple and easy to operate and has low cost. The electrode polymer can be selectively removed by precisely controlled (+ -0.2 mm) laser, so that a plastic package product with low cost, high efficiency and high yield is realized; the applicable product size has larger flexibility and does not depend on a die; the high-temperature resistant polyimide material of the resistor main body can realize the high-power resistance of the product; the resistance end and the welding area are electroplated with nickel tin to realize oxidation resistance in the product reflow soldering process; the product is integrally packaged and electroplated to realize better oxidation resistance.
The above embodiments of the present invention are only for illustrating the technical concept and features of the present invention, and are not intended to limit the scope of the present invention to those skilled in the art to understand the present invention and implement the same. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (8)
1. The preparation method of the local plastic-packaged antioxidant high-power alloy resistor is characterized by comprising the following steps of:
welding the electrode strip and the alloy strip to obtain a material strip;
punching the material belt to form a plurality of alloy resistor bodies on the material belt;
performing plastic packaging operation on the whole material belt to ensure that the outer surface of the alloy resistor body is completely covered with plastic packaging materials;
removing the plastic packaging material on the electrode on the alloy resistor body corresponding to the subsequent welding area;
separating the alloy resistor body from the material belt to form a high-power alloy resistor with local plastic package;
and tinning the local plastic-packaged high-power alloy resistor to form electroplated layers on the welding area and the end surfaces of the two ends of the alloy resistor, so as to form the local plastic-packaged antioxidant high-power alloy resistor.
2. The method according to claim 1, wherein the electrode strip and the alloy strip are welded in the same direction of length extension, and the welding is performed by welding the electrode strip to the side surface of the alloy strip in the width direction by electron beam welding.
3. The method of manufacturing according to claim 1, wherein the electrode strip is used to form an electrode of a high-power alloy resistor, and the alloy strip is used to form a resistor body of the high-power alloy resistor; the thickness of the electrode strip is greater than the thickness of the alloy strip.
4. A production method according to claim 3, wherein the electrode strip is flush with the alloy strip on one surface in the thickness direction of the strip; and the other side of the material belt in the thickness direction is higher than the surface of the alloy belt, so that a welding area is formed.
5. The method according to claim 4, wherein the plastic packaging is to soak the whole material strip in the plastic packaging material or spray the plastic packaging material onto the whole material strip, and then oven-dry and cure the material strip to completely plastic-package the whole material strip.
6. The method of claim 5, wherein the removing is removing the molding material on the welding area by laser.
7. The method of claim 1, wherein the high-power alloy resistor has an operating power of 7W or more.
8. A locally encapsulated high power alloy resistor prepared according to the method of any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310037710.0A CN116313342A (en) | 2023-01-10 | 2023-01-10 | Local plastic-packaged antioxidant high-power alloy resistor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310037710.0A CN116313342A (en) | 2023-01-10 | 2023-01-10 | Local plastic-packaged antioxidant high-power alloy resistor and preparation method thereof |
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| CN116313342A true CN116313342A (en) | 2023-06-23 |
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| CN202310037710.0A Pending CN116313342A (en) | 2023-01-10 | 2023-01-10 | Local plastic-packaged antioxidant high-power alloy resistor and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117095886A (en) * | 2023-08-11 | 2023-11-21 | 钧崴电子科技股份有限公司 | Method for processing shunt and shunt |
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| CN106356168A (en) * | 2016-10-31 | 2017-01-25 | 佛山好运电器配件有限公司 | Precise electric current sensing resistor and manufacturing method thereof |
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| CN109192412A (en) * | 2018-08-02 | 2019-01-11 | 南京萨特科技发展有限公司 | A kind of resistor and its manufacturing method with radiator |
| CN208444687U (en) * | 2018-06-12 | 2019-01-29 | 深圳市业展电子有限公司 | A kind of high-power paster type resistor of high-precision |
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2023
- 2023-01-10 CN CN202310037710.0A patent/CN116313342A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105244130A (en) * | 2015-11-03 | 2016-01-13 | 深圳市美隆电子有限公司 | Manufacturing method of super-micro alloy resistor |
| CN106356168A (en) * | 2016-10-31 | 2017-01-25 | 佛山好运电器配件有限公司 | Precise electric current sensing resistor and manufacturing method thereof |
| CN106952702A (en) * | 2016-11-11 | 2017-07-14 | 东莞华恒电子有限公司 | A kind of metal plate structure high power high value precision Chip-R manufacture craft and Chip-R |
| CN108806906A (en) * | 2018-06-12 | 2018-11-13 | 深圳市业展电子有限公司 | The method and its Chip-R of alloy Chip-R are made for rectangular metal composite material strip for a kind of section |
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| CN117095886A (en) * | 2023-08-11 | 2023-11-21 | 钧崴电子科技股份有限公司 | Method for processing shunt and shunt |
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