CN116288197A - Electrode, high-voltage pulse electric field processing chamber and high-voltage pulse electric field processing equipment - Google Patents

Electrode, high-voltage pulse electric field processing chamber and high-voltage pulse electric field processing equipment Download PDF

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Publication number
CN116288197A
CN116288197A CN202310020581.4A CN202310020581A CN116288197A CN 116288197 A CN116288197 A CN 116288197A CN 202310020581 A CN202310020581 A CN 202310020581A CN 116288197 A CN116288197 A CN 116288197A
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alloy
electrode
substrate
electric field
alloy coating
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唐忠盛
曾新安
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Construction Office Of Yangjiang Campus Of Guangdong Ocean University
Guangdong Ocean University
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Construction Office Of Yangjiang Campus Of Guangdong Ocean University
Guangdong Ocean University
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    • AHUMAN NECESSITIES
    • A23FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23LFOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
    • A23L5/00Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
    • A23L5/20Removal of unwanted matter, e.g. deodorisation or detoxification
    • AHUMAN NECESSITIES
    • A23FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23LFOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
    • A23L5/00Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
    • A23L5/30Physical treatment, e.g. electrical or magnetic means, wave energy or irradiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/18Metallic material, boron or silicon on other inorganic substrates
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/18Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]

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  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Food Science & Technology (AREA)
  • Nutrition Science (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The embodiment of the application discloses an electrode, a high-voltage pulse electric field treatment chamber and high-voltage pulse electric field treatment equipment. The electrode comprises a substrate and an alloy coating covered on the substrate, wherein the alloy coating is composed of at least one of aluminum alloy, titanium alloy and vanadium alloy. According to the electrode, the alloy coating formed by at least one of the aluminum alloy, the titanium alloy and the vanadium alloy is formed on the substrate, so that the corrosion resistance of the electrode is greatly improved, the service life of the electrode is prolonged, meanwhile, the occurrence of breakdown discharge can be effectively avoided, and the manufacturing cost of the electrode can be effectively reduced through the combination of the substrate and the alloy coating.

Description

Electrode, high-voltage pulse electric field processing chamber and high-voltage pulse electric field processing equipment
Technical Field
The invention relates to the technical field of high-voltage pulse electric fields, in particular to an electrode, a high-voltage pulse electric field treatment chamber and high-voltage pulse electric field treatment equipment.
Background
The high-voltage pulse electric field (pulsed electric field, PEF) treatment technology is a relatively hot non-thermal sterilization technology for liquid food processing at present, and by connecting high-voltage pulses to electrodes, a high-voltage pulse electric field is generated in a treatment chamber and acts on microorganisms, so that the cells of the microorganisms are irreversibly perforated to inactivate the cells. The existing high-voltage pulse electric field treatment chamber mostly adopts stainless steel electrodes or titanium electrodes, under the action of a strong pulse electric field, an electrode-liquid interface in the treatment chamber inevitably generates electrochemical reaction, on one hand, electrochemical corrosion can lead to stainless steel or titanium dissolution, not only influencing the service life of the electrode, but also leading metal particles to enter food, on the other hand, the electrode can lead to uneven surface due to corrosion, which can lead to uneven local electric field distribution, and concentrated current formed by local field intensity distortion at a microtip end leads to local heating and gasification of liquid food in treatment to form bubbles, finally resulting in insulation breakdown and influencing the normal operation of equipment. Therefore, the problem of corrosion of the high-voltage electrode under the action of PEF has become a key issue affecting the industrial application of PEF technology.
In view of this, the present application is specifically proposed.
Disclosure of Invention
An object of the present application is to provide an electrode suitable for use in a high-voltage pulsed electric field treatment apparatus, which has good corrosion resistance and is inexpensive. The above object of the present application is at least achieved by a targeted selection of the materials from which the electrodes are made.
The objects of the present application are not limited to the above objects, and other objects and advantages of the present application not mentioned above can be understood from the following description and more clearly understood through embodiments of the present application. Furthermore, it is readily understood that the objects and advantages of the present application may be achieved by the features disclosed in the claims and combinations thereof.
In order to achieve the above purpose of the present application, the present application provides the following technical solutions:
an electrode comprising a substrate and an alloy coating overlying the substrate, the alloy coating being comprised of at least one of an aluminum alloy, a titanium alloy, and a vanadium alloy.
In one embodiment, the alloy coating is comprised of 30-50 wt% aluminum alloy, 20-40 wt% titanium alloy, and 10-40 wt% vanadium alloy, based on the total weight of the alloy coating.
In one embodiment, the aluminum alloy is a 2-series aluminum alloy selected from at least one of Al-Mg, al-Zn, al-Ca and Al-Sn;
and/or, the titanium alloy is selected from at least one of TA1, TA2, TA3, ti-32Mo and Ti-6 Al-4V;
and/or the vanadium alloy is selected from at least one of V-Al, V-Fe, V-Sn and V-Fe-Al.
In one embodiment, the alloy coating has a thickness of 10 to 30% of the thickness of the substrate.
In one embodiment, the substrate has a thickness of 0.1-0.5cm.
In one embodiment, the alloy coating is physically or chemically coated on the substrate;
the physical method comprises at least one of rolling, melt pouring, spraying, extrusion coating, magnetron sputtering, thermal evaporation, atomic layer deposition and pulse laser deposition;
the chemical method comprises at least one of electroplating, chemical plating, ion plating and chemical vapor deposition.
In one embodiment, the substrate is made of a conductive material, and the conductive material is stainless steel, titanium simple substance or graphite.
The present application also provides a high voltage pulsed electric field treatment chamber comprising an electrode as described above.
The present application also provides a high voltage pulsed electric field treatment apparatus comprising a treatment chamber as described above.
The technical scheme provided by the embodiment of the application can comprise the following beneficial effects:
according to the electrode, the alloy coating formed by at least one of the aluminum alloy, the titanium alloy and the vanadium alloy is formed on the substrate, so that the corrosion resistance of the electrode is greatly improved, the service life of the electrode is prolonged, meanwhile, the occurrence of breakdown discharge can be effectively avoided, and the manufacturing cost of the electrode can be effectively reduced through the combination of the substrate and the alloy coating.
Drawings
Fig. 1 is a schematic structural view of an electrode according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a high-voltage pulsed electric field processing chamber according to an embodiment of the present application.
Detailed Description
The present application is described in further detail below with reference to examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.
It should be noted that endpoints and any values of the ranges disclosed herein are not limited to the precise range or value, and that such range or value should be understood to include values approaching such range or value. For numerical ranges, one or more new numerical ranges may be found between the endpoints of each range, between the endpoint of each range and the individual point value, and between the individual point value, in combination with each other, and are to be considered as specifically disclosed herein.
The examples are not to be construed as limiting the specific techniques or conditions described in the literature in this field or as per the specifications of the product. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
The PEF process chamber is generally composed of at least two electrodes made of metal, which are in direct contact with the dielectric solution and connected to a high voltage pulse generator, functioning as an electrolyzer. When a current is passed through the PEF chamber, a charged bilayer is caused to form at each electrode-solution interface, which appears capacitive. Once the capacitive bilayer voltage exceeds the electrochemical reaction threshold voltage, adverse electrochemical reactions occur, causing dissolution of the electrode metal particles. The dissolution of the metal particles can cause corrosion to the electrode, the service life of the electrode is shortened, meanwhile, the local electric field on the surface of the electrode is distorted and arched, air bubbles can be generated at the electrode-liquid interface, the possibility of medium breakdown in the PEF treatment chamber is increased, the service life of the electrode is greatly shortened, and the normal operation of equipment is influenced. In addition, the metal particles are introduced into the treatment liquid to generate other toxic reactive chemical substances such as hydrogen peroxide, so that the food quality is influenced, and the metal taste is introduced.
In view of this, the inventors of the present application have made extensive studies on materials from which electrodes can be fabricated. The inventors of the present application have unexpectedly found that aluminum alloys, titanium alloys, and vanadium alloys do not undergo adverse electrochemical reactions when the capacitance bilayer voltage exceeds the electrochemical reaction threshold voltage, and exhibit good corrosion resistance, and have completed the present application based on the above findings.
Referring to fig. 1, the present application provides an electrode, which includes a substrate 1 and an alloy coating 2 covering the substrate 1, wherein the alloy coating 2 is composed of at least one of an aluminum alloy, a titanium alloy, and a vanadium alloy.
In this embodiment, the substrate 1 may be made of a conductive material commonly used in the art, which is used as a main material of an electrode for constituting an electrode body structure and carrying the alloy coating 2. The alloy coating 2 covers at least the surface of the substrate 1 intended to be in contact with the liquid, so that when PEF treatment is performed with the electrode, the alloy coating 2 is in direct contact with the liquid. In some embodiments, the substrate 1 is a rectangular parallelepiped plate-like structure such that the electrodes are formed as a flat plate electrode structure, and the alloy coating 2 may cover all surfaces of the substrate or only the surface of the substrate for contact with liquid. In other embodiments, the substrate 1 is a hollow tubular structure such that the electrodes are formed as a coaxial electrode structure, and the alloy coating 2 may cover all surfaces of the substrate or only the outer or inner surfaces of the substrate for contact with a liquid. The substrate may also be of other regular or irregular shape, which is not specifically recited herein.
The cladding of the alloy coating 2 enables the formed electrode to have good corrosion resistance, thereby improving the service life of the electrode and the running stability of equipment, and reducing the adverse effect of PEF treatment on the quality of food. In addition, the main structure of the electrode is molded by the substrate 1 and the alloy coating 2, so that the use amount of alloy can be reduced, and the manufacturing cost of the electrode can be reduced.
Further, in some preferred embodiments, the alloy coating is comprised of 30-50 wt% aluminum alloy, 20-40 wt% titanium alloy, and 10-40 wt% vanadium alloy, based on the total weight of the alloy coating.
By optimizing the composition of the alloy coating, the electrode with better corrosion resistance can be obtained, and the treatment performance of a treatment chamber adopting the electrode can be improved, so that the electric field distribution is uniform.
Further, in one embodiment, the aluminum alloy is a 2-series aluminum alloy selected from at least one of Al-Mg, al-Zn, al-Ca, and Al-Sn;
and/or, the titanium alloy is selected from at least one of TA1, TA2, TA3, ti-32Mo and Ti-6 Al-4V;
and/or the vanadium alloy is selected from at least one of V-Al, V-Fe, V-Sn and V-Fe-Al.
The electrode with better corrosion resistance can be obtained by optimizing the alloy types forming the alloy coating, and the treatment performance of a treatment chamber adopting the electrode can be improved, so that the electric field distribution is uniform.
Further, in some preferred embodiments, the thickness of the alloy coating is 10 to 30% of the thickness of the substrate.
Too thin a thickness of the alloy coating is insufficient to improve electrode performance, but a thickness exceeding 30% of the thickness of the substrate may conversely reduce electrode performance and result in increased costs.
Further, in some preferred embodiments, the thickness of the substrate is 0.1-0.5cm.
Further, in some preferred embodiments, the alloy coating is physically or chemically coated on the substrate;
the physical method comprises at least one of rolling, melt pouring, spraying, extrusion coating, magnetron sputtering, thermal evaporation, atomic layer deposition and pulse laser deposition;
the chemical method comprises at least one of electroplating, chemical plating, ion plating and chemical vapor deposition.
Further, in some preferred embodiments, the substrate is made of a conductive material, which is stainless steel, elemental titanium, or graphite.
Based on the same inventive concept, the present application also provides a high voltage pulsed electric field treatment chamber comprising an electrode as described above.
In some preferred embodiments, as shown in fig. 2, the high-voltage pulse electric field treatment chamber comprises two electrodes, which are symmetrically arranged and separated by an insulating material, the electrodes and the insulating material enclose a space for containing the liquid to be treated, the space has a material inlet and a material outlet, one electrode is connected with the high-voltage pulse, the other electrode is grounded, i.e. a flat plate type treatment chamber is formed, and the treatment chamber can be a static treatment chamber or a dynamic treatment chamber, wherein at least opposite surfaces of the electrodes are provided with alloy coatings. In some preferred embodiments, the high-voltage pulse electric field treatment chamber comprises three electrodes, which are separated by an insulating material and are enclosed to form a space for containing the liquid to be treated, wherein two electrodes are located on the outer side for grounding, and one electrode is located in the middle for receiving the high-voltage pulse, i.e. forming the coaxial treatment chamber.
Based on the same inventive concept, the present application also provides a high-voltage pulsed electric field treatment apparatus comprising the treatment chamber as described above.
The high-voltage pulse battery processing equipment also comprises a high-voltage pulse generator and a controller, wherein the high-voltage pulse generator converts alternating pulse voltage into alternating pulse voltage, the alternating pulse voltage is boosted by the high-frequency transformer and then is output to the electrode, and a high-voltage pulse electric field is formed in the processing chamber. The controller is used for operation and monitoring of the equipment.
The technical effects provided by the present invention will be described in detail with reference to examples, but they should not be construed as limiting the scope of the present invention.
Example 1
The high-voltage pulsed electric field treatment chamber was assembled in the manner shown in fig. 2, in which the electrodes comprised a substrate and an alloy coating, the opposite surfaces of the two electrodes were provided with the alloy coating, in which the substrate was made of elemental titanium to a thickness of 0.2cm, the alloy coating was made of an almag to a thickness of 0.06cm, and the almag contained 60% aluminum and 40% magnesium (mass%).
Example 2
A high-voltage pulsed electric field treatment chamber was assembled with reference to example 1, except that the electrodes were made of 304 stainless steel, all of which were the same as example 1.
Example 3
A high-voltage pulsed electric field treatment chamber was assembled with reference to example 1, except that the electrodes were made of 316 stainless steel, all of which were the same as example 1.
Example 4
A high-voltage pulsed electric field treatment chamber was assembled with reference to example 1, except that the alloy coating of the electrode was made of Ti-32Mo, and the thickness was 0.06cm, all of which were the same as in example 1.
Example 5
A high-voltage pulsed electric field treatment chamber was assembled with reference to example 1, except that the alloy coating of the electrode was made of a vanadium iron alloy having a thickness of 0.06cm, the vanadium iron alloy containing 60% vanadium and 40% iron (mass%) and the other were the same as in example 1.
Example 6
A high voltage pulsed electric field treatment chamber was assembled with reference to example 1, except that the alloy coating of the electrode was made of 30% almag, 40% Ti-32Mo and 30% ferrovanadium, with a thickness of 0.06cm, wherein the almag alloy contained 60% al and 40% mg, the magnesium ferrovanadium alloy contained 60% v and 40% fe (mass%) and the other was identical to example 1.
Example 7
A high-voltage pulsed electric field treatment chamber was assembled with reference to example 1, in which the electrodes included a substrate and an alloy coating layer, the opposite surfaces of the two electrodes were provided with the alloy coating layer, in which the substrate was made of elemental titanium and had a thickness of 0.2cm, the alloy coating layer was made of an aluminum magnesium alloy having a thickness of 0.02cm, and the aluminum magnesium alloy contained 60% aluminum and 40% magnesium (mass percent).
Example 8
A high-voltage pulsed electric field treatment chamber was assembled with reference to example 1, in which the electrodes comprised a substrate and an alloy coating layer, the opposite surfaces of the two electrodes were provided with the alloy coating layer, in which the substrate was made of elemental titanium and had a thickness of 0.2cm, the alloy coating layer was made of an aluminum magnesium alloy having a thickness of 0.01cm, and the aluminum magnesium alloy contained 60% aluminum and 40% magnesium (mass percent).
Example 9
A high-voltage pulsed electric field treatment chamber was assembled with reference to example 1, in which the electrodes comprised a substrate and an alloy coating layer, the opposite surfaces of the two electrodes were provided with the alloy coating layer, in which the substrate was made of elemental titanium and had a thickness of 0.2cm, the alloy coating layer was made of an aluminum magnesium alloy having a thickness of 0.08cm, and the aluminum magnesium alloy contained 60% aluminum and 40% magnesium (mass percent).
Comparative example 1
The high-voltage pulsed electric field treatment chamber was assembled with reference to example 1, except that the electrode was made of elemental titanium and had a thickness of 0.26cm, which was the same as in example 1, without the alloy coating.
Comparative example 2
The high-voltage pulsed electric field treatment chamber was assembled with reference to example 1, except that the electrode was made of 304 stainless steel, having a thickness of 0.26cm, without the alloy coating, and the other was the same as in example 1.
The electrodes of the above examples and comparative examples were connected to a high voltage pulse generator and tested. A sodium chloride solution with a conductivity of 200. Mu.S/cm was prepared as a sample and injected into the treatment chamber. And (3) keeping the power frequency at 50Hz and the pulse width at 20 mu s, and detecting the mass concentration of metal ions in the sample after continuously treating the sample for 120min under the condition of 20kV voltage.
The results showed that no metal ions were detected in the samples of examples 1 to 7, and that trace amounts of titanium ions were detected in the sample of example 8, with a titanium ion mass concentration of less than 0.3. Mu.g/L, whereas the sample of comparative example 1 had a titanium ion mass concentration of 25. Mu.g/L, and the sample of comparative example 2 had an iron ion mass concentration of 32. Mu.g/L, and a chromium ion mass concentration of 5. Mu.g/L, indicating that significant corrosion occurred. And examples 1-7 have significantly higher electric field distribution uniformity than examples 8 and 9, indicating that the thickness of the alloy coating also affects the electric field distribution uniformity.
The foregoing description is only of the preferred embodiments of the present application and is presented as a description of the principles of the technology being utilized. It will be appreciated by persons skilled in the art that the scope of the disclosure referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the disclosure. Such as the above-described features and technical features having similar functions (but not limited to) disclosed in the present application are replaced with each other.

Claims (9)

1. An electrode, characterized in that the electrode comprises a substrate and an alloy coating covered on the substrate, wherein the alloy coating is composed of at least one of aluminum alloy, titanium alloy and vanadium alloy.
2. The electrode of claim 1, wherein the alloy coating is comprised of 30-50 wt.% aluminum alloy, 20-40 wt.% titanium alloy, and 10-40 wt.% vanadium alloy, based on the total weight of the alloy coating.
3. The electrode according to claim 1, wherein,
the aluminum alloy is a 2-series aluminum alloy and is selected from at least one of Al-Mg, al-Zn, al-Ca and Al-Sn;
and/or, the titanium alloy is selected from at least one of TA1, TA2, TA3, ti-32Mo and Ti-6 Al-4V;
and/or the vanadium alloy is selected from at least one of V-Al, V-Fe, V-Sn and V-Fe-Al.
4. The electrode of claim 1, wherein the alloy coating has a thickness of 10 to 30% of the thickness of the substrate.
5. The electrode of claim 4, wherein the substrate has a thickness of 0.1-0.5cm.
6. The electrode of claim 1, wherein the alloy coating is physically or chemically coated on the substrate;
the physical method comprises at least one of rolling, melt pouring, spraying, extrusion coating, magnetron sputtering, thermal evaporation, atomic layer deposition and pulse laser deposition;
the chemical method comprises at least one of electroplating, chemical plating, ion plating and chemical vapor deposition.
7. The electrode of any one of claims 1-6, wherein the substrate is a conductive material, the conductive material being stainless steel, elemental titanium, or graphite.
8. A high voltage pulsed electric field treatment chamber comprising an electrode according to any one of claims 1 to 7.
9. A high-voltage pulsed electric field treatment apparatus comprising the treatment chamber of claim 8.
CN202310020581.4A 2023-01-06 2023-01-06 Electrode, high-voltage pulse electric field processing chamber and high-voltage pulse electric field processing equipment Pending CN116288197A (en)

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CN1354018A (en) * 2001-12-12 2002-06-19 华南理工大学 High-voltage pulse electric field sterilization method and its equipment
CN104981434A (en) * 2012-11-21 2015-10-14 香港科技大学 Pulsed electric field for drinking water disinfection
CN109679844A (en) * 2017-10-19 2019-04-26 苏州壹达生物科技有限公司 A kind of flow electroporation device

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