CN116285749B - Composite high-conductivity heat dissipation material and processing technology thereof - Google Patents
Composite high-conductivity heat dissipation material and processing technology thereof Download PDFInfo
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- 239000002131 composite material Substances 0.000 title claims abstract description 65
- 239000000463 material Substances 0.000 title claims abstract description 53
- 238000005516 engineering process Methods 0.000 title claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 title claims description 54
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 60
- 230000005291 magnetic effect Effects 0.000 claims abstract description 32
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 30
- 239000010439 graphite Substances 0.000 claims abstract description 30
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 18
- 239000010432 diamond Substances 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 37
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 28
- 239000012792 core layer Substances 0.000 claims description 24
- 239000012790 adhesive layer Substances 0.000 claims description 23
- 229910052799 carbon Inorganic materials 0.000 claims description 19
- 239000004642 Polyimide Substances 0.000 claims description 17
- 229920001721 polyimide Polymers 0.000 claims description 17
- 229920006267 polyester film Polymers 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 12
- 229920002799 BoPET Polymers 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- 239000003522 acrylic cement Substances 0.000 claims description 3
- 239000002041 carbon nanotube Chemical group 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000006247 magnetic powder Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 4
- 230000007704 transition Effects 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000002071 nanotube Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 21
- 238000002791 soaking Methods 0.000 abstract description 6
- 230000009466 transformation Effects 0.000 abstract description 6
- 230000002776 aggregation Effects 0.000 abstract description 4
- 238000004220 aggregation Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 4
- 238000005338 heat storage Methods 0.000 abstract description 4
- 239000007769 metal material Substances 0.000 abstract description 4
- 229910052755 nonmetal Inorganic materials 0.000 abstract description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 13
- 229910021389 graphene Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910021383 artificial graphite Inorganic materials 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
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- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- 229910021385 hard carbon Inorganic materials 0.000 description 2
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- 238000010438 heat treatment Methods 0.000 description 1
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- 239000011810 insulating material Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application provides a composite high-conductivity heat-dissipating material and a processing technology thereof, which are applied to the field of heat-dissipating materials, metal atoms are planted in a graphite lamellar structure, the defect of heat conduction between graphite layers is overcome through metal heat conduction, so that the heat conduction mechanism of the composite high-conductivity heat-dissipating material is between a metal material and a nonmetal material, namely phonon heat conduction and electronic heat conduction are realized, the longitudinal heat conduction of the material is greatly increased, the heat-dissipating effect is better than that of a soaking plate in the prior art, the heat-dissipating material has very good heat conductivity and electric conductivity, and the characteristics of high strength, oversized heat storage, heat conduction and the like are realized, in addition, through the arrangement of a pressure-sensitive heat-conducting net consisting of diamond pressure-sensitive units and magnetic transformation double strips, a through air guide gap can be formed in the composite high-conductivity heat-dissipating material, a certain exhaust effect is realized, the heat is conveniently discharged, and the aggregation of the internal heat is reduced.
Description
Technical Field
The application relates to the field of heat dissipation materials, in particular to a composite high-conductivity heat dissipation material and a processing technology thereof.
Background
The heat conducting material is a novel industrial material. These materials have been designed in recent years for the thermal conduction requirements of the devices, and are excellent and reliable in performance. They are suitable for various environments and requirements, have proper countermeasures against possible heat conduction problems, provide powerful assistance for high integration of devices, and ultra-small and ultra-thin, and the heat conduction products have been increasingly applied to many products, thereby improving the reliability of the products. The main novel industrial heat conducting materials mainly comprise graphene, heat conducting adhesive graphene preparation equipment, a heat conducting tester, a heating element, a heat conducting silica gel sheet, a heat conducting insulating material, a heat conducting interface material, a heat conducting silica gel sheet, a heat conducting adhesive tape, heat conducting silica gel, heat conducting paste, heat radiating silica gel, heat radiating oil, a heat radiating film, a heat conducting film and the like.
In the prior art, electronic products are lighter and thinner, the integration level is higher, so that the requirement on heat radiation is higher, however, the heat radiation effect of the existing heat radiation material is difficult to meet the higher and higher heat radiation requirement, mainly, graphite sheets are easy to generate heat for deposition and difficult to be discharged out in time, and therefore, the composite high-conductivity heat radiation material with better heat radiation effect and the processing technology thereof are needed to be provided.
Disclosure of Invention
The application aims to improve the heat dissipation effect of a graphite material, compared with the prior art, the composite high-conductivity heat dissipation material comprises a core layer and two release PET (polyethylene terephthalate) layers respectively positioned at the upper side and the lower side of the core layer, and is characterized in that the release PET layers of the core layer and the upper layer are connected with a single-sided adhesive layer, a double-sided adhesive layer is connected between the release PET layers of the core layer and the lower layer, the core layer comprises a composite substrate layer and polyimide graphite layers respectively connected to the upper surface and the lower surface of the composite substrate layer, the single-sided adhesive layer comprises a transparent PET film, a transparent PET release film and a black acrylic acid adhesive layer coated between the transparent PET film and the transparent PET release film, the double-sided adhesive layer sequentially comprises an upper release film, a polyester film and a lower release film from top to bottom, the upper release film is connected with the polyester film through an acrylic acid pressure-sensitive adhesive, and the polyester film is connected with the lower release film through a diamond pressure-sensitive adhesive.
The heat conduction mechanism of the composite high-conductivity heat dissipation material is between the metal material and the nonmetal material through planting metal atoms in the graphite lamellar structure and overcoming the defect of heat conduction among graphite layers by metal heat conduction, namely phonon heat conduction and electronic heat conduction are realized, the longitudinal heat conduction of the material is greatly increased, the heat dissipation effect is better than that of a soaking plate in the prior art, the heat dissipation effect is very good in heat conduction and conductivity, the heat dissipation effect is high in strength and extremely high in heat storage and conduction, and the like.
Further, the upper release PET is blue in color, and the lower release PET is transparent in color.
Further, the thickness of the polyimide graphite layer is not less than 10um, and the thickness of the composite substrate layer is not less than 30um.
Further, the thickness of the lower release film is larger than that of the upper release film, and the thickness difference of the lower release film and the upper release film is not smaller than 10um.
Optionally, the diamond-shaped point pressure-sensitive adhesive between the polyester film and the lower release film is composed of a plurality of diamond-shaped pressure-sensitive units which are arranged in a rectangular array, magnetic double strips are fixedly penetrated between the diamond-shaped pressure-sensitive units in the same row and the diamond-shaped pressure-sensitive units in the same row, and the pressure-sensitive heat-conducting net is composed of the diamond-shaped pressure-sensitive units and the magnetic double strips, so that when the pressure-sensitive heat-conducting net is adhered to the polyester film and the lower release film, a certain air guide gap can be formed between the polyester film and the lower release film, the air guide gap can be used as an exhaust gas, and can be used as a heat dissipation channel, so that part of heat can overflow along with gas, and heat aggregation is effectively avoided.
Further, two adjacent diamond pressure sensitive units are not contacted with each other, so that the formation of air guide gaps between the two adjacent diamond pressure sensitive units is facilitated, the thickness of the magnetic transformation double strips is smaller than that of the diamond pressure sensitive units, the blocking of gaps between the two adjacent diamond pressure sensitive units is effectively guaranteed, the smoothness of the air guide gaps is guaranteed, the distance between the two adjacent diamond pressure sensitive units is between the distances between two groups of diagonal vertexes of a diamond, the overall cohesive force of the diamond point-shaped pressure sensitive adhesive is easily affected due to the overlarge distance, the stability of the whole high-conductivity material is affected, the air guide gaps are easily caused to be too small due to the overlarge distance, and the effect of air exhaust and heat dissipation is deteriorated.
Further, the magnetic transformation double strip comprises carbon strips and self-guiding strips which are mutually adsorbed in parallel, the carbon strips are of a hard carbon nano tube structure with ferromagnetic metal atoms, the self-guiding strips are of a high-temperature-resistant fold flexible structure filled with nano magnetic powder, the self-guiding strips are made to be magnetic, the self-guiding strips can be mutually adsorbed with the carbon strips, the stability between the self-guiding strips is effectively ensured, and meanwhile, the self-guiding strips are provided with flexibility and can deform under the guidance of a magnetic field.
A processing technology of a composite high-conductivity heat-dissipating material comprises the following steps:
s1, preparation of a core layer:
s11, firstly, crushing the composite material by an air crusher, and then grinding the crushed composite material to obtain graphite composite powder with uniform particle size;
s12, dissolving the obtained powder in a heat-conducting solvent, uniformly stirring to obtain composite slurry, spraying the composite slurry on a modified polyimide graphite film with transverse heat conduction to form a composite substrate, and attaching a modified polyimide graphite film with vertical heat conduction to the upper surface of the substrate;
s13, finally sintering at a high temperature, and cooling to form a film after sintering to obtain a core layer;
s2, adhering blue and transparent release PET on the upper surface and the lower surface of the core layer through the single-sided adhesive layer and the double-sided adhesive layer respectively, and extruding and shaping to obtain the composite high-conductivity heat dissipation material.
Further, the composite material comprises graphite, carbon nano tubes and metal atoms, wherein the metal atoms comprise but are not limited to metal iron, cobalt and nickel, and the heat conduction solvent is one or two of heat conduction oil and silicone oil in any proportion.
Optionally, in step S2, before extrusion shaping, a magnetic guiding operation is performed, which specifically includes the following steps: the magnetic field is externally applied above the release PET, then the magnetic field is controlled to move along the X axis, so that the carbon strips on the X axis and the Y axis are partially separated from the self-guiding strips, and meanwhile, when the self-guiding strips positioned between the two diamond-shaped pressure-sensitive units are guided by the magnetic field, the self-guiding strips can deform and move towards the direction of the magnetic field and are separated from the carbon strips, and subsequently, when the release PET is extruded and shaped, the deformed carbon strips can play a certain supporting role on an air guide gap, so that the air guide gap is not easy to deform due to extrusion, and the smoothness of the air guide gap is effectively ensured.
Compared with the prior art, the application has the advantages that:
the heat conduction mechanism of the composite high-conductivity heat dissipation material is between the metal material and the nonmetal material through planting metal atoms in the graphite lamellar structure and overcoming the defect of heat conduction among graphite layers by metal heat conduction, namely phonon heat conduction and electronic heat conduction are realized, the longitudinal heat conduction of the material is greatly increased, the heat dissipation effect is better than that of a soaking plate in the prior art, the heat dissipation effect is very good in heat conduction and conductivity, the heat dissipation effect is high in strength and extremely high in heat storage and conduction, and the like.
Drawings
FIG. 1 is a schematic diagram of the main structure of the present application;
FIG. 2 is a schematic diagram of a cross section of a single sided adhesive layer of the present application;
FIG. 3 is a schematic illustration of a double sided adhesive layer of the present application;
FIG. 4 is a perspective view of a pressure sensitive heat conductive mesh of the present application;
FIG. 5 is a schematic view showing a variation of the inner support bar under magnetic guidance according to the present application;
FIG. 6 is a top view of the pressure sensitive heat conductive mesh of the present application;
fig. 7 is a table of performance comparison data of the composite high-conductivity heat dissipation material of the present application and materials such as artificial graphite flakes, graphene, etc.
Fig. 8 is a table of heat dissipation comparison results of a mobile phone vapor chamber according to the present application.
The reference numerals in the figures illustrate:
the composite material comprises a composite substrate layer 1, a polyimide graphite layer 102, a single-sided adhesive layer 2, a transparent PET film 201, a black acrylic adhesive layer 202, a transparent PET release film 203, a double-sided adhesive layer 3, an upper release film 301, a polyester film 302, a lower release film 303, a release PET4, a magnetic transformation double-strip 5, a carbon strip 51 and a self-guiding strip 52.
Detailed Description
The embodiments of the present application will be described in detail and fully with reference to the accompanying drawings, and it is intended that all other embodiments of the application, which are apparent to one skilled in the art without the inventive faculty, are included in the scope of the present application.
Example 1:
the application provides a composite high-conductivity heat dissipation material, referring to fig. 1, which comprises a core layer and two release PET4 respectively positioned on the upper side and the lower side of the core layer, wherein the upper release PET4 is blue, the lower release PET4 is transparent, the release PET4 on the core layer and the upper layer is connected with a single-sided adhesive layer 2, a double-sided adhesive layer 3 is connected between the core layer and the release PET4 on the lower layer, the core layer comprises a composite substrate layer 101 and polyimide graphite layers 102 respectively connected on the upper surface and the lower surface of the composite substrate layer 101, the thickness of the polyimide graphite layers 102 is not less than 10um, the thickness of the composite substrate layer 101 is not less than 30um, the upper polyimide graphite layers 102 can conduct transverse heat conduction through modified polyimide, and the lower polyimide graphite layers 102 can conduct vertical heat conduction through modified polyimide.
Referring to fig. 2-3, a shows an acrylic pressure-sensitive adhesive, b shows a diamond-shaped point-shaped pressure-sensitive adhesive, a single-sided adhesive layer 2 comprises a transparent PET film 201, a transparent PET release film 203 and a black acrylic adhesive layer 202 coated between the two, the double-sided adhesive layer 3 sequentially comprises an upper release film 301, a polyester film 302 and a lower release film 303 from top to bottom, the upper release film 301 and the polyester film 302 are connected through the acrylic pressure-sensitive adhesive, the polyester film 302 and the lower release film 303 are connected through the diamond-shaped point-shaped pressure-sensitive adhesive, the lower release film 303 is thicker than the upper release film 301, and the thickness difference between the two is not less than 10um.
A processing technology of a composite high-conductivity heat-dissipating material comprises the following steps:
s1, preparation of a core layer:
s11, firstly, crushing the composite material by an air crusher, and then grinding the crushed composite material to obtain graphite composite powder with uniform particle size;
s12, dissolving the obtained powder in a heat-conducting solvent, uniformly stirring to obtain composite slurry, spraying the composite slurry on a modified polyimide graphite film with transverse heat conduction to form a composite substrate, and attaching a modified polyimide graphite film with vertical heat conduction to the upper surface of the substrate;
s13, finally sintering at a high temperature, and cooling to form a film after sintering to obtain a core layer;
s2, respectively adhering blue and transparent release PET4 on the upper surface and the lower surface of the core layer through the single-sided adhesive layer 2 and the double-sided adhesive layer 3, and extruding and shaping to obtain the composite high-conductivity heat dissipation material.
The composite material comprises graphite, carbon nano tubes and metal atoms, wherein the metal atoms comprise but are not limited to metallic iron, cobalt and nickel, and the heat conduction solvent is one or two of heat conduction oil and silicone oil in any proportion.
In addition, referring to fig. 7, the composite high-conductivity heat dissipation material is abbreviated as AFG, and the performance data of the composite high-conductivity heat dissipation material compared with the traditional artificial graphite sheet and the graphene heat dissipation material is compared, so that it can be clearly seen in the table that the high-thermal coefficient of the composite high-conductivity heat dissipation material in the Z direction is significantly higher than that of the artificial graphite sheet and the graphene, which indicates that the heat dissipation effect of the composite high-conductivity heat dissipation material is significantly better than that of the traditional artificial graphite sheet and the graphene heat dissipation material.
As shown in fig. 8, which is a table of the comparison result of the heat dissipation of the composite high-conductivity heat dissipation material and the heat dissipation of a certain mobile phone soaking plate, it can be clearly seen from the data that the heat dissipation stability of the composite high-conductivity heat dissipation material is higher, the highest temperature of the mobile phone cpu using the composite high-conductivity heat dissipation material is always lower than the heat dissipation temperature using vc, the difference between the scores of the heat dissipation effects of the composite high-conductivity heat dissipation material and the heat dissipation material is not large under the condition of lower temperature, the decrease amplitude of the score of the heat dissipation effect of the composite high-conductivity heat dissipation material is smaller along with the increase of the temperature, and the decrease amplitude of the score of the heat dissipation effect of vc is larger, so that the heat dissipation effect of the composite high-conductivity heat dissipation material is obviously better than that of the heat dissipation effect of a soaking plate used by a certain mobile phone brand.
The metal atoms are planted in the graphite lamellar structure, the defect of heat conduction between graphite layers is overcome through metal heat conduction, the heat conduction mechanism of the composite high-conductivity heat dissipation material is between the metal material and the nonmetal material, namely phonon heat conduction and electronic heat conduction are realized, the longitudinal heat conduction of the material is greatly increased, the heat dissipation effect is better than that of a soaking plate in the prior art, the heat dissipation effect is very good in heat conduction and conductivity, the heat dissipation effect has the characteristics of high strength, super-large heat storage, heat conduction and the like, and in addition, through the arrangement of the pressure-sensitive heat conduction net consisting of the diamond pressure-sensitive units and the magneto-rheological double strips 5, a through air conduction gap can be formed in the composite high-conductivity heat dissipation material, a certain air exhaust effect can be realized, the heat is convenient to be discharged outwards, and the aggregation of the internal heat is reduced.
Example 2:
referring to fig. 4, the diamond-shaped point pressure-sensitive adhesive between the polyester film 302 and the lower release film 303 is composed of a plurality of diamond-shaped pressure-sensitive units arranged in a rectangular array, magnetic double strips 5 are fixedly penetrated between the plurality of diamond-shaped pressure-sensitive units in the same row and the plurality of diamond-shaped pressure-sensitive units in the same column, and the plurality of diamond-shaped pressure-sensitive units and the plurality of magnetic double strips 5 form a pressure-sensitive heat conducting net, so that when the pressure-sensitive heat conducting net is adhered to the polyester film 302 and the lower release film 303, a certain air guide gap can be formed between the polyester film 302 and the lower release film 303, and can be used as an exhaust air, and can be used as a heat dissipation channel, so that part of heat can overflow along with air, and heat aggregation is effectively avoided.
The adjacent two diamond pressure-sensitive units are not contacted with each other, so that the formation of air guide gaps between the two diamond pressure-sensitive units is facilitated, the thickness of the magnetic transformation double strips 5 is smaller than that of the diamond pressure-sensitive units, the situation that gaps between the two adjacent diamond pressure-sensitive units are blocked by the magnetic transformation double strips 5 is effectively guaranteed, the smooth performance of the air guide gaps is guaranteed, the distance between the two adjacent diamond pressure-sensitive units is between the distances between two groups of diagonal vertexes of the diamond, the overall cohesive force of the diamond point-shaped pressure-sensitive adhesive is easily affected due to the overlarge distance, the stability of the whole high-conductivity material is affected, the air guide gaps are easily reduced due to the overlarge distance, and the effect of air discharge and heat dissipation is poor.
Referring to fig. 5, the magnetic double-strip 5 includes a carbon strip 51 and a self-guiding strip 52 that are adsorbed in parallel, the carbon strip 51 is a hard carbon nanotube structure with ferromagnetic metal atoms, the self-guiding strip 52 is a high temperature resistant corrugated flexible structure filled with nano magnetic powder, so that the self-guiding strip 52 has magnetism, can be adsorbed with the carbon strip 51, effectively ensures stability between the carbon strip and the self-guiding strip, and meanwhile, the self-guiding strip 52 has flexibility and is deformable under the guidance of a magnetic field.
As shown in fig. 6, in step S2, before extrusion shaping, a magnetic guiding operation is performed, which specifically includes the following steps: the magnetic field is externally applied above the release PET4, then the magnetic field is controlled to move along the X axis, so that the carbon strips 51 and the self-guiding strips 52 on the X axis and the Y axis are partially separated from each other, meanwhile, when being guided by the magnetic field, the self-guiding strips 52 between the two diamond-shaped pressure-sensitive units can deform and move towards the direction of the magnetic field and are separated from the carbon strips 51, and subsequently, during extrusion shaping, the deformed carbon strips 51 can play a certain supporting role on an air guide gap, so that the gap is not easy to deform due to extrusion, and the smoothness of the gap is effectively ensured.
This scheme illustrates only the above-described differences from embodiment 1, and the rest remains the same as embodiment 1, and the description is not repeated here.
The foregoing is merely illustrative of the best modes of carrying out the application in connection with the actual requirements, and the scope of the application is not limited thereto.
Claims (4)
1. The composite high-conductivity heat dissipation material comprises a core layer and two release PET (4) layers respectively positioned on the upper side and the lower side of the core layer, and is characterized in that the release PET (4) layers of the core layer and the upper layer are connected with a single-sided adhesive layer (2), a double-sided adhesive layer (3) is connected between the release PET (4) layers of the core layer and the lower layer, the core layer comprises a composite substrate layer (101) and polyimide graphite layers (102) respectively connected to the upper surface and the lower surface of the composite substrate layer (101), the single-sided adhesive layer (2) comprises a transparent PET film (201), a transparent PET release film (203) and a black acrylic adhesive layer (202) coated between the transparent PET film and the transparent PET release film, the double-sided adhesive layer (3) sequentially comprises an upper release film (301), a polyester film (302) and a lower release film (303) from top to bottom, the polyester film (302) is connected through acrylic acid, and the polyester film (302) is connected through diamond pressure-sensitive adhesive;
the upper PET (4) is blue, the lower PET (4) is transparent, the thickness of the polyimide graphite layer (102) is not less than 10um, the thickness of the composite substrate layer (101) is not less than 30um, the lower PET (303) is thicker than the upper PET (301), the thickness difference between the lower PET and the lower PET is not less than 10um, the diamond-shaped point pressure sensitive adhesive between the PET (302) and the lower PET (303) is composed of a plurality of diamond-shaped pressure sensitive units distributed in a rectangular array, a plurality of diamond-shaped pressure sensitive units in the same row and a plurality of diamond-shaped pressure sensitive units in the same column are all fixed and penetrated with magnetic transition double strips (5), two adjacent diamond-shaped pressure sensitive units are not contacted with each other, the thickness of the magnetic transition double strips (5) is less than the thickness of the diamond-shaped pressure sensitive units, the distance between two adjacent diamond-shaped pressure sensitive units is between the two diagonal corners, the magnetic transition double strips (5) comprise carbon strips (51) which are mutually adsorbed and carbon strips (52) which are mutually parallel, and the carbon strips (52) are in a flexible nano-magnetic powder structure, and the carbon strips (52) are in the flexible nano-tube structure.
2. The process for manufacturing the composite high-conductivity heat dissipation material according to claim 1, wherein the process comprises the following steps: the method comprises the following steps:
s1, preparation of a core layer:
s11, firstly, crushing the composite material by an air crusher, and then grinding the crushed composite material to obtain graphite composite powder with uniform particle size;
s12, dissolving the obtained powder in a heat-conducting solvent, uniformly stirring to obtain composite slurry, spraying the composite slurry on a modified polyimide graphite film with transverse heat conduction to form a composite substrate, and attaching a modified polyimide graphite film with vertical heat conduction to the upper surface of the substrate;
s13, finally sintering at a high temperature, and cooling to form a film after sintering to obtain a core layer;
s2, adhering blue and transparent release PET (4) on the upper surface and the lower surface of the core layer through the single-sided adhesive layer (2) and the double-sided adhesive layer (3) respectively, and extruding and shaping to obtain the composite high-conductivity heat dissipation material.
3. The processing technology of the composite high-conductivity heat-dissipating material according to claim 2, wherein the composite material comprises graphite, carbon nanotubes and metal atoms, the metal atoms comprise but are not limited to metallic iron, cobalt and nickel, and the heat-conductivity solvent is one or two of heat-conducting oil and silicone oil in any proportion.
4. The process for manufacturing a composite high-conductivity heat dissipating material according to claim 2, wherein the step S2 is performed with a magnetic guiding operation prior to the extrusion molding, and comprises the following steps: a magnetic field is externally applied above the release PET (4), then the magnetic field is controlled to move along an X axis, and then the magnetic field is controlled to move along a Y axis, so that carbon strips (51) and self-guiding strips (52) on the X axis and the Y axis are partially separated from each other.
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| CN113999657A (en) * | 2021-11-23 | 2022-02-01 | 安徽碳华新材料科技有限公司 | Processing technology of alkene-carbon composite material |
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| CN101712217A (en) * | 2009-05-12 | 2010-05-26 | 大连丽昌新材料有限公司 | Thermally-conductive graphite interface material and production process thereof |
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