CN116285608A - Surface protection liquid for laser cutting chip and preparation method thereof - Google Patents
Surface protection liquid for laser cutting chip and preparation method thereof Download PDFInfo
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- CN116285608A CN116285608A CN202310047130.XA CN202310047130A CN116285608A CN 116285608 A CN116285608 A CN 116285608A CN 202310047130 A CN202310047130 A CN 202310047130A CN 116285608 A CN116285608 A CN 116285608A
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- 239000007788 liquid Substances 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 238000003698 laser cutting Methods 0.000 title claims abstract description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 39
- 239000010703 silicon Substances 0.000 claims abstract description 39
- 239000004611 light stabiliser Substances 0.000 claims abstract description 35
- 239000002994 raw material Substances 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 17
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 17
- 239000003960 organic solvent Substances 0.000 claims abstract description 17
- 229920001225 polyester resin Polymers 0.000 claims abstract description 11
- 239000004645 polyester resin Substances 0.000 claims abstract description 11
- 239000006229 carbon black Substances 0.000 claims abstract description 8
- 230000001681 protective effect Effects 0.000 claims description 25
- 239000003795 chemical substances by application Substances 0.000 claims description 23
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 13
- 239000002250 absorbent Substances 0.000 claims description 13
- 230000002745 absorbent Effects 0.000 claims description 13
- 238000003756 stirring Methods 0.000 claims description 13
- 238000007599 discharging Methods 0.000 claims description 10
- 238000005303 weighing Methods 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 6
- -1 5-tertiary butyl-4-hydroxyphenyl Chemical group 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 6
- 239000011734 sodium Substances 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 5
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 4
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 4
- 229940124543 ultraviolet light absorber Drugs 0.000 claims description 4
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 3
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 claims description 3
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 claims description 3
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 claims description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 3
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 claims description 3
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- 239000004640 Melamine resin Substances 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 3
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 3
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 claims description 3
- 150000001565 benzotriazoles Chemical class 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000006184 cosolvent Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 150000002513 isocyanates Chemical class 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 3
- 150000003873 salicylate salts Chemical class 0.000 claims description 3
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims description 3
- 235000019260 propionic acid Nutrition 0.000 claims description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 17
- 239000006096 absorbing agent Substances 0.000 abstract description 12
- 238000004140 cleaning Methods 0.000 abstract description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 abstract description 4
- 230000003670 easy-to-clean Effects 0.000 abstract description 4
- 239000000945 filler Substances 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 52
- 235000012431 wafers Nutrition 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 238000009499 grossing Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/48—Stabilisers against degradation by oxygen, light or heat
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of chip cutting protection liquid, in particular to a surface protection liquid for laser cutting chips and a preparation method thereof. The preparation method comprises the following raw materials: water-soluble resin, a silicon absorber, a light stabilizer, an antioxidant, an organic solvent and the balance of water; according to the invention, the light stabilizer can effectively shield the irradiation influence of laser on the chip and absorb ultraviolet rays, wherein carbon black can be used as a filler of the aqueous polyester resin to reinforce the chip, so that the overall heat stability of the aqueous polyester resin is improved, and the silicon absorber can react with silicon in the air in the process of cutting the chip by the laser to generate silicate which is easy to clean in the later stage, so that the problem that cutting waste is remained on the surface of the chip in the later stage and the cleaning is inconvenient is solved.
Description
Technical Field
The invention relates to the technical field of chip cutting protection liquid, in particular to a surface protection liquid for laser cutting chips and a preparation method thereof.
Background
Chips are one way of miniaturizing circuits (mainly including semiconductor devices, as well as passive components, etc.) in electronics and are often manufactured on the surface of semiconductor wafers, which are the silicon dice used in the fabrication of silicon semiconductor integrated circuits, and dicing is a critical process for packaging integrated circuits. If the reliability of the wafer surface cannot be improved in the dicing process, the subsequent process will be greatly affected, thereby reducing the yield of chip production.
The chip is usually cut before manufacturing due to different sizes, the traditional chip cutting is changed from the original cutting by a simple blade to the cutting by laser and the plasma cutting, but when the laser irradiates and cuts along the cutting path of the chip, the generated heat energy is easily absorbed by a wafer, the heat energy is easily absorbed to cause silicon to be melted or thermally decomposed, silicon vapor is generated to be condensed and deposited on the chip, and the peripheral edge of the chip is generated with chips; with the development of plasma etching technology, etching is sometimes required at a higher working temperature; in addition, since the width of the dicing street of the chip is narrowed, and a high-precision semiconductor dicing apparatus or the like may cause some thermal effect problems at the time of use, such as chipping, direct bare chips due to thermal decomposition of the dicing street, and the like, which require a relatively high thermal stability of the protective film.
The existing laser cutting protection liquid can improve the cutting efficiency and stability of chips to a certain extent, avoid the problems of cutting chips or cracks and thermal stress, but has the problem that the existing laser cutting protection liquid cannot be applied to a plasma cutting environment under the condition of higher working temperature.
Disclosure of Invention
The invention aims to provide a surface protection liquid for laser cutting chips and a preparation method thereof, so as to solve the problems in the background art.
In order to achieve the above object, in one aspect, the present invention provides a surface protection liquid for a laser cutting chip, comprising the following raw materials in parts by weight: 30-40 parts of water-soluble resin, 2-7 parts of silicon absorbent, 3-15 parts of light stabilizer, 0.1-5 parts of antioxidant, 50-70 parts of organic solvent and the balance of water.
As a further improvement of the present technical solution, the silicon getter is selected from sodium hydroxide for silicon reaction generated when the chip is cut by laser.
As a further improvement of the technical scheme, the light stabilizer comprises an ultraviolet light absorber and a light shielding agent in a ratio of 1:3-5, wherein the light shielding agent is preferably carbon black, and the ultraviolet light absorber is preferably o-hydroxybenzophenones, benzotriazoles and salicylates.
As a further improvement of the technical scheme, the water-soluble resin is water-based polyester resin, which comprises the following raw materials: the preparation method of the aqueous polyester resin comprises the steps of adding the raw materials into a stirrer, and mixing under the condition of stirring speed of 300-700 r/min.
As a further improvement of the present technical scheme, the monomer is at least one selected from the group consisting of trimellitic anhydride, polyethylene glycol, sodium isophthalic acid-5-sulfonate, dimethylolpropionic acid, dimethylolbutyric acid, and sodium 1, 4-butanediol-2-sulfonate.
As a further improvement of the technical scheme, the cosolvent is at least one selected from ethylene glycol monoethyl ether, propylene glycol monobutyl ether, propylene glycol methyl ether acetate, isopropanol and isobutanol.
As a further improvement of the technical scheme, the curing agent is at least one selected from urea-formaldehyde resin, melamine resin, isocyanate and epoxy resin.
As a further improvement of the present technical solution, the organic solvent is at least one selected from the group consisting of absolute ethanol, isopropanol, ethylene glycol methyl ether, propylene glycol methyl ether, ketone, acetone and dioxane.
As a further improvement of the present technical scheme, the antioxidant preferably adopts at least one of 2, 6-tertiary butyl-4-methylphenol, bis (3, 5-tertiary butyl-4-hydroxyphenyl) sulfide and pentaerythritol tetra { beta- (3, 5-tertiary butyl-4-hydroxyphenyl) propionate }
In another aspect, the present invention provides a method for preparing the surface protecting liquid for laser cutting chips according to any one of the above, comprising the steps of:
s1, weighing water-soluble resin, a silicon absorbent, a light stabilizer, an antioxidant, an organic solvent and water for standby;
s2, sequentially adding the raw materials into a stirrer at normal temperature, mixing for 1-2h under the condition of stirring speed of 500-1000r/min, and discharging to obtain the protection liquid.
Compared with the prior art, the invention has the beneficial effects that:
according to the surface protection liquid for the laser cutting chip and the preparation method thereof, the light stabilizer can effectively shield the irradiation influence of laser on the chip and absorb ultraviolet rays, wherein carbon black can be used as a filler of the aqueous polyester resin to reinforce the chip, so that the overall heat stability of the aqueous polyester resin is improved, and the silicon absorber can react with silicon in the air in the process of cutting the chip by the laser to generate silicate which is easy to clean in the later stage, so that the problem that cutting waste remains on the surface of the chip in the later stage and the cleaning is inconvenient is solved.
Detailed Description
The technical solutions of the present invention will be clearly and completely described in the following in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides a surface protection liquid for laser cutting chips, which comprises the following raw materials in parts by weight: 30-40 parts of water-soluble resin, 2-7 parts of silicon absorbent, 3-15 parts of light stabilizer, 0.1-5 parts of antioxidant, 50-70 parts of organic solvent and the balance of water.
Specific:
the water-soluble resin is water-soluble polyester resin, which is compounded by adopting monomers, and water-based groups are introduced to improve water solubility and water dispersibility, so that the prepared resin has the advantages of high film forming speed, high wear resistance and good wetting effect, and comprises the following raw materials: monomers, co-solvents and curing agents; the preparation method comprises the steps of adding the raw materials into a stirrer, and mixing under the condition that the stirring speed is 300-700r/min, wherein:
the monomer is at least one of trimellitic anhydride, polyethylene glycol, isophthalic acid-5-sodium sulfonate, dimethylolpropionic acid, dimethylolbutyric acid and 1, 4-butanediol-2-sodium sulfonate;
the cosolvent is at least one selected from ethylene glycol monoethyl ether, propylene glycol monobutyl ether, propylene glycol methyl ether acetate, isopropanol and isobutanol;
the curing agent is at least one selected from urea formaldehyde resin, melamine resin, isocyanate and epoxy resin.
The silicon absorber is selected from sodium hydroxide, is used for generating silicon reaction when the chip is cut by laser to generate silicate, has a good cleaning effect, and avoids the influence of residual silicon on the surface of the chip in the later stage on the flatness of the chip.
The organic solvent is at least one selected from the group consisting of absolute ethyl alcohol, isopropyl alcohol, ethylene glycol methyl ether, propylene glycol methyl ether, ketone, acetone and dioxane, and is selected from the group consisting of water for the purpose of mixing, accelerating evaporation of water, accelerating film forming property of the protective liquid on the chip surface, and considering toxicity of the solvent during evaporation, it is preferable to use absolute ethyl alcohol having low toxicity, and the concentration thereof is 95%.
The light stabilizer comprises an ultraviolet absorber and a light shielding agent in a ratio of 1:3-5, wherein the light shielding agent is preferably carbon black, the main purpose of the light stabilizer is to facilitate shielding light during laser cutting, reduce damage of laser to a chip, and the carbon black has high temperature resistance, so that the high temperature resistance of a protective liquid film layer can be remarkably improved; the ultraviolet absorbent preferably adopts at least one of o-hydroxybenzophenones, benzotriazoles and salicylates, specifically at least one of o-hydroxybenzophenone, 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2, 4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone and 2- (2-hydroxy-3, 5-di-tert-phenyl) -5-chlorobenzotriazole, and can absorb ultraviolet light with the wavelength of 290-410nm, so that the chip is effectively protected.
The antioxidant preferably adopts at least one of 2, 6-tertiary butyl-4-methylphenol, bis (3, 5-tertiary butyl-4-hydroxyphenyl) sulfide and tetra { beta- (3, 5-tertiary butyl-4-hydroxyphenyl) propionic acid } pentaerythritol ester for improving the thermal oxidation resistance of the protective liquid.
The invention also provides a preparation method of the surface protection liquid for the laser cutting chip, which comprises the following steps:
(1) Weighing water-soluble resin, a silicon absorbent, a light stabilizer, an antioxidant, an organic solvent and water for standby;
(2) And (3) at normal temperature, sequentially adding the raw materials into a stirrer, mixing for 1-2h under the condition of stirring speed of 500-1000r/min, and discharging to obtain the protective liquid.
The invention adopts the light stabilizer to effectively shield the irradiation influence of laser on the chip and absorb ultraviolet rays, wherein carbon black can be used as a filler of the water-based polyester resin to reinforce the chip, so that the whole heat stability of the water-based polyester resin is improved, and then adopts the silicon absorber to react with silicon in the air in the process of cutting the chip by laser to generate silicate which is easy to clean in the later stage, thereby solving the problem that cutting waste is remained on the surface of the chip in the later stage and the cleaning is inconvenient.
The surface protection liquid for laser cutting chips provided by the invention is specifically described by the following specific examples according to different process conditions.
Example 1
(1) Weighing 30 parts of water-soluble resin, 2 parts of silicon absorbent, 3 parts of light stabilizer, 0.1 part of antioxidant, 50 parts of organic solvent and water for later use;
(2) And (3) adding the raw materials into a stirrer at normal temperature, mixing for 2 hours under the condition of stirring speed of 500r/min, and discharging to obtain the protection liquid.
Wherein the proportion of the ultraviolet absorber and the light shielding agent in the light stabilizer is 1:3.
example 2
(1) Weighing 35 parts of water-soluble resin, 5 parts of silicon absorbent, 10 parts of light stabilizer, 3 parts of antioxidant, 60 parts of organic solvent and water for later use;
(2) And (3) adding the raw materials into a stirrer at normal temperature, mixing for 1.5h under the condition of stirring speed of 750r/min, and discharging to obtain the protection liquid.
Wherein the proportion of the ultraviolet absorber and the light shielding agent in the light stabilizer is 1:4.
example 3
(1) Weighing 40 parts of water-soluble resin, 7 parts of silicon absorbent, 15 parts of light stabilizer, 5 parts of antioxidant, 70 parts of organic solvent and water for later use;
(2) And (3) adding the raw materials into a stirrer at normal temperature, mixing for 1h under the condition of stirring speed of 1000r/min, and discharging to obtain the protection liquid.
Wherein the proportion of the ultraviolet absorber and the light shielding agent in the light stabilizer is 1:5.
example 4
(1) Weighing 30 parts of water-soluble resin, 2 parts of silicon absorbent, 3 parts of light stabilizer, 1 part of antioxidant, 60 parts of organic solvent and water for later use;
(2) And (3) adding the raw materials into a stirrer at normal temperature, mixing for 1.5 hours under the condition of stirring speed of 800r/min, and discharging to obtain the protection liquid.
Wherein the proportion of the ultraviolet absorber and the light shielding agent in the light stabilizer is 1:3.
example 5
(1) Weighing 35 parts of water-soluble resin, 7 parts of silicon absorbent, 12 parts of light stabilizer, 2 parts of antioxidant, 60 parts of organic solvent and water for later use;
(2) And (3) at normal temperature, adding the raw materials into a stirrer, mixing for 1-2h under the condition of stirring speed of 500-1000r/min, and discharging to obtain the protective liquid.
Wherein the proportion of the ultraviolet absorber and the light shielding agent in the light stabilizer is 1:4.
table 1 raw material ratio (parts) of the protective liquid in examples 1 to 5
The invention is further illustrated by the following comparative examples.
Comparative example 1
The comparative example adopts the preparation method of the example 1, the addition of the silicon absorbing agent is removed, the other formulas and the process are unchanged, and the specific steps are as follows:
(1) Weighing 30 parts of water-soluble resin, 3 parts of light stabilizer, 0.1 part of antioxidant, 50 parts of organic solvent and water for later use;
(2) And (3) adding the raw materials into a stirrer at normal temperature, mixing for 2 hours under the condition of stirring speed of 500r/min, and discharging to obtain the protection liquid.
Wherein the proportion of the ultraviolet absorber and the light shielding agent in the light stabilizer is 1:3.
comparative example 2
The comparative example adopts the preparation method of example 2, the addition of the silicon absorbing agent is removed, the other formulas and the process are unchanged, the specific steps are similar to those of comparative example 1, and the comparative example is not repeated.
Comparative example 3
The comparative example adopts the preparation method of example 3, the addition of the silicon absorbing agent is removed, the other formulas and the process are unchanged, the specific steps are similar to those of comparative example 1, and the comparative example is not repeated.
Comparative example 4
The comparative example uses the preparation method of example 4, the silicon absorber addition is removed, the other formulas and processes are unchanged, the specific steps are similar to those of comparative example 1, and the comparative example is not repeated.
Comparative example 5
The comparative example uses the preparation method of example 5, the silicon absorber addition is removed, the other formulas and processes are unchanged, the specific steps are similar to those of comparative example 1, and the comparative example is not repeated
Table 2 proportion (parts) of protective liquid raw materials in comparative examples 1 to 5
Comparative example 6
The comparative example adopts the preparation method of the example 1, the proportion of the ultraviolet absorber and the light shielding agent in the light stabilizer is adjusted to be 3:1, and the other formulas and the process are unchanged, and the specific steps are as follows:
(1) Weighing 30 parts of water-soluble resin, 2 parts of silicon absorbent, 3 parts of light stabilizer, 0.1 part of antioxidant, 50 parts of organic solvent and water for later use;
(2) And (3) adding the raw materials into a stirrer at normal temperature, mixing for 2 hours under the condition of stirring speed of 500r/min, and discharging to obtain the protection liquid.
Wherein the proportion of the ultraviolet absorber and the light shielding agent in the light stabilizer is 3:1.
comparative example 7
The preparation method of the comparative example 2 is adopted, the ratio of the ultraviolet absorber to the light shielding agent in the light stabilizer is adjusted to be 4:1, the other formulas and processes are unchanged, the specific steps are similar to those of the comparative example 6, and the comparative example is not repeated.
Comparative example 8
The preparation method of the comparative example 3 is adopted, the proportion of the ultraviolet absorber and the light shielding agent in the light stabilizer is adjusted to be 5:1, the other formulas and processes are unchanged, the specific steps are similar to those of the comparative example 6, and the comparative example is not repeated.
Comparative example 9
The preparation method of the comparative example 4 is adopted, the ratio of the ultraviolet absorber to the light shielding agent in the light stabilizer is adjusted to be 3:1, the other formulas and processes are unchanged, the specific steps are similar to those of the comparative example 6, and the comparative example is not repeated.
Comparative example 10
The comparative example adopts the preparation method of example 5, the proportion of the ultraviolet absorber and the light shielding agent in the light stabilizer is adjusted to be 4:1, the other formulas and processes are unchanged, the specific steps are similar to those of comparative example 6, and the comparative example is not repeated here
Table 3 proportion (parts) of protective liquid raw materials in comparative examples 6 to 10
Test examples
Comparative examples of easy-to-clean property and heat resistance were conducted with the protective solutions provided in examples 1 to 5 and comparative examples 1 to 10 described above; (1) And respectively coating the protective solutions provided in examples 1-5 and comparative examples 1-5 on the surfaces of the silicon wafers to form films, then carrying out laser cutting on the silicon wafers from the middle part, cooling and flushing after cutting, and observing the states of the protective films. (2) After the protective solutions provided in examples 1 to 5 and comparative examples 6 to 10 were applied to the surface of the light-transmitting glass sheet to form a film, baking was performed at 200 ℃, 300 ℃ and 400 ℃ for 30 minutes, and the state of the protective film was observed.
TABLE 4 washing states of examples 1-5 and comparative examples 1-5
| Surface state | Surface state | ||
| Example 1 | Smoothing | Comparative example 1 | A plurality of small particle bulges |
| Example 2 | Smoothing | Comparative example 2 | A plurality of small particle bulges |
| Example 3 | Smoothing | Comparative example 3 | A plurality of small particle bulges |
| Example 4 | Smoothing | Comparative example 4 | A plurality of small particle bulges |
| Example 5 | Smoothing | Comparative example 5 | A plurality of small particle bulges |
As can be seen from Table 4, when the protective solution provided in examples 1 to 5 of the present invention was applied to the surface of the silicon wafer, a relatively excellent smooth surface could be maintained after the dicing operation, while the silicon-absorbing agent in comparative examples 1 to 5 was removed, and a plurality of small particle protrusions were present on the surface of the silicon wafer after cleaning, so that it could be demonstrated that the silicon-absorbing agent added to the protective solution of the present invention was an important factor affecting the cleaning efficiency of the chip at a later stage.
TABLE 5 Heat resistance of examples 1-5 and comparative examples 6-10
According to Table 5, when the protective liquid provided in examples 1 to 5 of the present invention was applied to the surface of the light-transmitting glass sheet, the film layer appeared black due to the addition of carbon black, and after baking, the surface of the light-transmitting glass sheet was not significantly changed, whereas in comparative examples 6 to 10, when the ratio of the ultraviolet absorber and the light shielding agent in the light stabilizer was changed, the surface of the light-transmitting glass sheet appeared dark yellow, which proves that discoloration phenomenon had occurred, and therefore, it can be demonstrated that the ratio of the components of the light stabilizer in the protective liquid of the present invention was an important factor affecting the heat resistance at the time of chip dicing.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present invention, and are not intended to limit the invention, and that various changes and modifications may be made therein without departing from the spirit and scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The surface protection liquid for the laser cutting chip is characterized by comprising the following raw materials in parts by weight: 30-40 parts of water-soluble resin, 2-7 parts of silicon absorbent, 3-15 parts of light stabilizer, 0.1-5 parts of antioxidant, 50-70 parts of organic solvent and the balance of water.
2. The surface protective liquid for laser dicing chip according to claim 1, wherein: the silicon getter is selected from sodium hydroxide for silicon reaction generated when the chip is cut by laser.
3. The surface protective liquid for laser dicing chip according to claim 1, wherein: the light stabilizer comprises an ultraviolet light absorber and a light shielding agent in a ratio of 1:3-5, wherein the light shielding agent adopts carbon black, and the ultraviolet light absorber adopts o-hydroxybenzophenones, benzotriazoles and salicylates.
4. The surface protective liquid for laser dicing chip according to claim 1, wherein: the water-soluble resin is water-based polyester resin, and comprises the following raw materials: the preparation method of the aqueous polyester resin comprises the steps of adding the raw materials into a stirrer, and mixing under the condition of stirring speed of 300-700 r/min.
5. The surface protective liquid for laser dicing die according to claim 4, wherein: the monomer is at least one selected from trimellitic anhydride, polyethylene glycol, isophthalic acid-5-sodium sulfonate, dimethylolpropionic acid, dimethylolbutyric acid and 1, 4-butanediol-2-sodium sulfonate.
6. The surface protective liquid for laser dicing die according to claim 4, wherein: the cosolvent is at least one selected from ethylene glycol monoethyl ether, propylene glycol monobutyl ether, propylene glycol methyl ether acetate, isopropanol and isobutanol.
7. The surface protective liquid for laser dicing die according to claim 4, wherein: the curing agent is at least one selected from urea formaldehyde resin, melamine resin, isocyanate and epoxy resin.
8. The method for preparing a surface protecting liquid for laser cutting chips according to claim 1, wherein: the organic solvent is at least one selected from absolute ethyl alcohol, isopropanol, ethylene glycol methyl ether, propylene glycol methyl ether, ketone, acetone and dioxane.
9. The method for preparing a surface protecting liquid for laser cutting chips according to claim 1, wherein: the antioxidant adopts at least one of 2, 6-tertiary butyl-4-methylphenol, bis (3, 5-tertiary butyl-4-hydroxyphenyl) sulfide and tetra { beta- (3, 5-tertiary butyl-4-hydroxyphenyl) propionic acid } pentaerythritol ester.
10. A method for preparing the surface protective liquid for laser cutting chips according to any one of claims 1 to 9, comprising the steps of:
s1, weighing water-soluble resin, a silicon absorbent, a light stabilizer, an antioxidant, an organic solvent and water for standby;
s2, sequentially adding the raw materials into a stirrer at normal temperature, mixing for 1-2h under the condition of stirring speed of 500-1000r/min, and discharging to obtain the protection liquid.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1363464A (en) * | 2001-11-03 | 2002-08-14 | 张超 | Water-proof coiled composite polyester material and its production method |
| CN113814575A (en) * | 2021-09-17 | 2021-12-21 | 深圳市化讯半导体材料有限公司 | Laser cutting protection liquid and preparation method and application thereof |
| CN114712991A (en) * | 2022-03-29 | 2022-07-08 | 内蒙古恒星化学有限公司 | Method for absorbing gaseous organic silicon in vacuum system in organic silicon cracking reaction |
| CN115011180A (en) * | 2022-06-24 | 2022-09-06 | 浙江奥首材料科技有限公司 | Double-component base liquid, cutting protection liquid, preparation method, application and cutting method |
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- 2023-01-31 CN CN202310047130.XA patent/CN116285608A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1363464A (en) * | 2001-11-03 | 2002-08-14 | 张超 | Water-proof coiled composite polyester material and its production method |
| CN113814575A (en) * | 2021-09-17 | 2021-12-21 | 深圳市化讯半导体材料有限公司 | Laser cutting protection liquid and preparation method and application thereof |
| CN114712991A (en) * | 2022-03-29 | 2022-07-08 | 内蒙古恒星化学有限公司 | Method for absorbing gaseous organic silicon in vacuum system in organic silicon cracking reaction |
| CN115011180A (en) * | 2022-06-24 | 2022-09-06 | 浙江奥首材料科技有限公司 | Double-component base liquid, cutting protection liquid, preparation method, application and cutting method |
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