CN116285564A - Coating, preparation method thereof and electronic device - Google Patents
Coating, preparation method thereof and electronic device Download PDFInfo
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- CN116285564A CN116285564A CN202211683673.2A CN202211683673A CN116285564A CN 116285564 A CN116285564 A CN 116285564A CN 202211683673 A CN202211683673 A CN 202211683673A CN 116285564 A CN116285564 A CN 116285564A
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- Prior art keywords
- coating
- conducting filler
- heat
- heat conducting
- sized
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- 238000000576 coating method Methods 0.000 title claims abstract description 145
- 239000011248 coating agent Substances 0.000 title claims abstract description 141
- 238000002360 preparation method Methods 0.000 title abstract description 33
- 239000002245 particle Substances 0.000 claims abstract description 181
- 239000000945 filler Substances 0.000 claims abstract description 144
- 229920005989 resin Polymers 0.000 claims abstract description 55
- 239000011347 resin Substances 0.000 claims abstract description 55
- 239000002131 composite material Substances 0.000 claims abstract description 52
- 239000007822 coupling agent Substances 0.000 claims abstract description 41
- 239000002105 nanoparticle Substances 0.000 claims abstract description 38
- 239000011159 matrix material Substances 0.000 claims abstract description 34
- 239000002904 solvent Substances 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- 239000003085 diluting agent Substances 0.000 claims abstract description 18
- 239000004014 plasticizer Substances 0.000 claims abstract description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 110
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 52
- 239000011231 conductive filler Substances 0.000 claims description 34
- 239000003822 epoxy resin Substances 0.000 claims description 31
- 229920000647 polyepoxide Polymers 0.000 claims description 31
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 27
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 239000000835 fiber Substances 0.000 claims description 15
- 239000000395 magnesium oxide Substances 0.000 claims description 15
- 229920005749 polyurethane resin Polymers 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 238000000498 ball milling Methods 0.000 claims description 13
- 239000004593 Epoxy Substances 0.000 claims description 12
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical group [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- 230000004048 modification Effects 0.000 claims description 9
- 238000012986 modification Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 238000009472 formulation Methods 0.000 claims description 8
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims description 8
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 5
- 239000000194 fatty acid Substances 0.000 claims description 5
- 229930195729 fatty acid Natural products 0.000 claims description 5
- 150000004665 fatty acids Chemical class 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 239000008096 xylene Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 claims description 2
- 239000004695 Polyether sulfone Substances 0.000 claims description 2
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 claims description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 2
- 229920006393 polyether sulfone Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 230000001965 increasing effect Effects 0.000 abstract description 10
- 239000011258 core-shell material Substances 0.000 abstract description 6
- 239000002861 polymer material Substances 0.000 abstract description 2
- 238000003756 stirring Methods 0.000 description 33
- 239000000243 solution Substances 0.000 description 27
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 16
- 230000017525 heat dissipation Effects 0.000 description 12
- 238000009413 insulation Methods 0.000 description 10
- 239000011259 mixed solution Substances 0.000 description 9
- 238000004090 dissolution Methods 0.000 description 7
- GOBKHNHHHSPHEX-UHFFFAOYSA-N bis[2-(2-butoxyethoxy)ethyl] benzene-1,2-dicarboxylate Chemical compound CCCCOCCOCCOC(=O)C1=CC=CC=C1C(=O)OCCOCCOCCCC GOBKHNHHHSPHEX-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910052593 corundum Inorganic materials 0.000 description 5
- 239000010431 corundum Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000000935 solvent evaporation Methods 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Paints Or Removers (AREA)
Abstract
The application relates to the technical field of high polymer materials, and provides a coating, a preparation method thereof and an electronic device, wherein the coating comprises the following components in percentage by weight based on 100% of the total weight of the coating: 40-60% of a resin matrix, 20-50% of a heat conducting filler, 0.5-1% of a coupling agent, 5-10% of a diluent, 0.5-5% of a plasticizer, 2-5% of a curing agent and the balance of a solvent, wherein the heat conducting filler comprises a granular heat conducting filler, and the granular heat conducting filler consists of micron-sized heat conducting filler particles and nano-sized heat conducting filler particles combined on the surfaces of the micron-sized heat conducting filler particles. According to the coating, as the heat conducting filler contains the composite granular heat conducting filler with the core-shell structure, the number of contact points is increased, more heat conducting passages can be formed, so that good heat conducting passages can be formed by mutually overlapping in a resin matrix, and the heat conductivity of a coating film formed by the coating can be effectively improved.
Description
Technical Field
The application belongs to the technical field of high polymer materials, and particularly relates to a coating, a preparation method thereof and an electronic device.
Background
Along with the rapid development of electronic integration technology, electronic equipment is developed towards miniaturization and frivolity, the integration degree of electronic components is higher and higher, and in addition, the application of high-power devices in the electronic equipment enables electronic products to generate more heat in the operation process, and if the generated heat is not enough to be emitted, the efficacy of the products can be reduced, and the service life of the products is shortened.
At present, metal or graphite powder is mainly filled in the powder coating to improve the heat dissipation effect of the powder coating, and when the coating filled with the metal or graphite powder is coated on the surface of an electronic component or a product to be subjected to heat dissipation to form a coating, although the heat dissipation of the electronic component or the product can be accelerated, the electronic component or the product containing the metal or graphite coating has certain conductivity, and is easy to be electrically connected with an electronic component or a PCB (printed circuit board) in the use process to cause the disconnection of the electronic component or the short circuit of the circuit board, so that the normal work of the electronic product is influenced, and the requirement of the electronic product on the insulation performance cannot be met.
Therefore, it is necessary to develop a coating material having high thermal conductivity and good insulation.
Disclosure of Invention
The application aims to provide a coating, a preparation method thereof and an electronic device, and aims to solve the problem that the existing coating cannot meet the requirements of heat dissipation performance and insulating performance at the same time.
In order to achieve the purposes of the application, the technical scheme adopted by the application is as follows:
in a first aspect, the present application provides a coating comprising the following components in weight percent, based on 100% total weight of the coating:
the balance being solvent;
the heat conducting filler comprises composite granular heat conducting filler, wherein the composite granular heat conducting filler consists of micron-sized heat conducting filler particles and nano-sized heat conducting filler particles combined on the surfaces of the micron-sized heat conducting filler particles.
In a second aspect, the present application provides a method of preparing a coating comprising the steps of:
the formula of the paint provided by the application is characterized by weighing the components respectively;
carrying out surface modification treatment on the heat-conducting filler by using a coupling agent to obtain the coupling agent modified heat-conducting filler;
dispersing a resin matrix in a diluent to obtain a resin solution;
and mixing the coupling agent modified heat-conducting filler, the resin solution, the plasticizer, the curing agent and the solvent to obtain the coating.
In a second aspect, the present application provides an electronic device comprising a coating film formed from the coating provided herein or the coating prepared by the preparation method provided herein.
Compared with the prior art, the application has the following beneficial effects:
the coating provided by the first aspect of the application takes 40-60% of resin matrix as main raw material, and also comprises 20-50% of heat conducting filler, 0.5-1% of coupling agent, 5-10% of diluent, 0.5-5% of plasticizer, 2-5% of curing agent and the balance of solvent. Because the heat conducting filler contains the composite granular heat conducting filler with a core-shell structure, namely nano-scale heat conducting filler particles are combined on the surfaces of micron-scale heat conducting filler particles, the number of contact points is increased, more heat conducting passages are formed, and therefore the heat conductivity of the coating film can be effectively improved. The surface of the heat-conducting filler is modified by the coupling agent by adding the heat-conducting filler and the coupling agent with specific percentage, so that the surface polarity of the heat-conducting filler can be reduced, the compatibility with a resin matrix is improved, the heat-conducting filler is fully and uniformly dispersed in the resin matrix, and the heat conductivity of a coating film can be further improved. The resin matrix itself has good insulation properties, and the added heat conductive filler has good insulation properties, so the coating film has good insulation properties. The viscosity of the resin can be reduced, the plasticity of the coating film can be increased, and the film forming performance can be improved by adding a specific percentage of diluent, plasticizer, curing agent and the like. Therefore, the coating containing the formula has high heat conductivity and good insulativity through the synergistic effect of the components, can be directly coated on the surface of an electronic component or an electronic product needing heat dissipation, can timely transfer the generated heat to a coating film and quickly dissipate the generated heat into a space, plays a role in accelerating heat dissipation, and can avoid the problems of performance reduction, instability, service life shortening and the like of the electronic component or the electronic product caused by insufficient heat dissipation.
According to the preparation method of the coating, the coupling agent is used for carrying out surface modification treatment on the heat conducting filler to obtain the heat conducting filler modified by the coupling agent, compatibility of the heat conducting filler and the resin matrix is enhanced, the heat conducting filler is fully and uniformly dispersed in the resin matrix, then the resin matrix is dispersed in the diluent to obtain the resin solution, the viscosity of the resin is reduced, and finally the heat conducting filler modified by the coupling agent, the resin solution, the plasticizer, the curing agent and the solvent are uniformly mixed to obtain the coating.
The electronic device provided in the third aspect of the application has the advantages of high heat conductivity and good insulativity because the electronic device comprises a coating film formed by the coating provided by the application or the coating prepared by the preparation method provided by the application, and can rapidly emit heat generated by the electronic device into a space, so that the stability of the electronic device can be improved, and the service life of the electronic device is long.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
In this application, the term "and/or" describes an association relationship of an association object, which means that there may be three relationships, for example, a and/or B may mean: a alone, a and B together, and B alone. Wherein A, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship.
In the present application, "at least one" means one or more, and "a plurality" means two or more. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, "at least one (individual) of a, b, or c," or "at least one (individual) of a, b, and c," may each represent: a, b, c, a-b (i.e., a and b), a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple, respectively.
It should be understood that, in various embodiments of the present application, the sequence number of each process does not mean that the sequence of execution is sequential, and some or all of the steps may be executed in parallel or sequentially, where the execution sequence of each process should be determined by its functions and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The weights of the relevant components mentioned in the embodiments of the present application may refer not only to specific contents of the components, but also to the proportional relationship between the weights of the components, and thus, any ratio of the contents of the relevant components according to the embodiments of the present application may be enlarged or reduced within the scope disclosed in the embodiments of the present application. Specifically, the mass described in the specification of the examples of the present application may be a mass unit known in the chemical industry such as μ g, mg, g, kg.
The terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated for distinguishing between objects such as substances from each other. For example, a first XX may also be referred to as a second XX, and similarly, a second XX may also be referred to as a first XX, without departing from the scope of embodiments of the present application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
The first aspect of the embodiment of the application provides a coating, which comprises the following components in percentage by weight, based on 100% of the total weight of the coating:
the balance being solvent;
the heat conducting filler comprises composite granular heat conducting filler, wherein the composite granular heat conducting filler consists of micron-sized heat conducting filler particles and nano-sized heat conducting filler particles combined on the surfaces of the micron-sized heat conducting filler particles.
The coating provided by the embodiment of the application takes 40-60% of resin matrix as main raw material, and also comprises 20-50% of heat conducting filler, 0.5-1% of coupling agent, 5-10% of diluent, 0.5-5% of plasticizer, 2-5% of curing agent and the balance of solvent. Because the heat conducting filler contains the composite granular heat conducting filler with a core-shell structure, namely nano-scale heat conducting filler particles are combined on the surfaces of micron-scale heat conducting filler particles, the number of contact points is increased, more heat conducting passages are formed, and therefore the heat conductivity of the coating film can be effectively improved. The surface of the heat-conducting filler is modified by the coupling agent by adding the heat-conducting filler and the coupling agent with specific percentage, so that the surface polarity of the heat-conducting filler can be reduced, the compatibility with a resin matrix is improved, the heat-conducting filler is fully and uniformly dispersed in the resin matrix, and the heat conductivity of a coating film can be further improved. The resin matrix itself has good insulation properties, and the added heat conductive filler has good insulation properties, so the coating film has good insulation properties. The viscosity of the resin can be reduced, the plasticity of the coating film can be increased, and the film forming performance can be improved by adding a specific percentage of diluent, plasticizer, curing agent and the like. Therefore, the coating containing the formula has high heat conductivity and good insulativity through the synergistic effect of the components, can be directly coated on the surface of an electronic component or an electronic product needing heat dissipation, can timely transfer the generated heat to a coating film and quickly dissipate the generated heat into a space, plays a role in accelerating heat dissipation, and can avoid the problems of performance reduction, instability, service life shortening and the like of the electronic component or the electronic product caused by insufficient heat dissipation.
In an embodiment, the weight ratio of the nano-sized thermally conductive filler particles to the micro-sized thermally conductive filler particles is 1: (4-8), for example 1:4. 1: 5. 1:6. 1: 7. 1:8, etc. In the weight ratio range, the nano-scale heat-conducting filler particles are combined on the surfaces of the micron-scale heat-conducting filler particles to form the composite granular heat-conducting filler with a core-shell structure, so that the high heat conductivity of the filler can be fully exerted. In an embodiment, the particle size of the nano-sized thermally conductive filler particles is 20 to 60nm, e.g., 20nm, 30nm, 40nm, 50nm, 60nm, etc., and the particle size of the micro-sized thermally conductive filler particles is 0.5 to 50 μm, e.g., 0.5 μm, 1 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm. In the particle size range of the nano-scale heat conducting filler particles and the micron-scale heat conducting filler particles, the nano-scale heat conducting filler particles are combined on the surfaces of the micron-scale heat conducting filler particles to form the composite granular heat conducting filler with a core-shell structure, so that the high heat conductivity of the filler can be fully exerted.
In an embodiment, the material of the nano-scale heat conductive filler is at least one selected from aluminum oxide, aluminum nitride, silicon dioxide, boron nitride and silicon carbide. The micron-sized heat conducting filler is at least one selected from aluminum oxide, aluminum nitride, silicon dioxide, boron nitride and silicon carbide. Specifically, the materials of the nano-scale heat conductive filler and the micro-scale heat conductive filler may be the same. For example, the nano-scale heat-conducting filler and the micro-scale heat-conducting filler are both made of alumina, namely, the nano-scale heat-conducting filler particles are nano-scale alumina particles, and the micro-scale heat-conducting filler particles are micro-scale alumina particles. The aluminum oxide has good heat conduction and insulation properties, so the materials of the nano-scale heat conduction filler and the micro-scale heat conduction filler are selected from aluminum oxide, and the coating film formed by the coating has high heat conductivity on the premise of ensuring good insulation property.
In the embodiment, the heat conducting filler further comprises a fibrous heat conducting filler, namely the heat conducting filler comprises a composite granular heat conducting filler and a fibrous heat conducting filler, the fibrous heat conducting filler has a higher length-diameter ratio, the heat conducting fillers are easy to contact with each other, and a continuous heat conducting passage can be formed in the resin matrix, so that the heat conductivity of the coating film is improved. The weight ratio of the fibrous heat conducting filler to the granular heat conducting filler is (5-25): (15 to 25), for example, 5: 15. 5: 25. 10: 20. 25: 15. 25:25, etc.
In an embodiment, the fibrous heat conductive filler is selected from magnesium oxide fibers having a high aspect ratio, and the magnesium oxide fibers or the magnesium oxide fibers and the composite particulate heat conductive filler are more easily contacted with each other to form a continuous heat conductive path, so that the heat conductivity of the coating film can be improved. And the magnesium oxide fiber has good insulativity, so the coating film formed by the coating has the advantages of high heat conductivity and good insulativity.
In an embodiment, the resin matrix may be selected from at least one of epoxy, epoxy modified silicone, phenolic epoxy. For example, the resin matrix may be selected from epoxy resins, phenolic epoxy resins, and the like, which may be the host material for the coating of the embodiments of the present application.
In an embodiment, the coupling agent may be selected from at least one of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (β -methoxyethoxy) silane. For example, the coupling agent may be selected from vinyltriethoxysilane, vinyltrimethoxysilane, and the like. The coupling agents can carry out surface modification on the heat conducting filler, so that the surface of the heat conducting filler is organized, the surface polarity of the heat conducting filler can be reduced, the compatibility of the heat conducting filler and a resin matrix is improved, and therefore the heat conducting filler can be fully and uniformly dispersed in the resin matrix, and the heat conductivity of a coating film can be improved.
In an embodiment, the diluent is selected from at least one of acetone, toluene, xylene, ethanol, for example, the diluent may be selected from ethanol, acetone, and the like. The diluents can fully dissolve the resin matrix, reduce the viscosity of the resin, and improve the technological properties of the coating so as to facilitate the coating construction.
In an embodiment, the plasticizer is selected from at least one of phthalate, polyethersulfone, epoxy fatty acid monoester, epoxy tetrahydrophthalate. For example, the plasticizer may be selected from phthalates, epoxy fatty acid monoesters, and the like. These plasticizers can be inserted between the molecular chains of the resin to weaken the stress between the molecular chains of the resin, increase the mobility of the molecular chains of the resin, and reduce the crystallinity of the molecular chains of the resin, thereby increasing the plasticity of the resin matrix. In an embodiment, the curing agent is selected from at least one of polyurethane resin, ethylenediamine, 1, 2-dimethylimidazole. For example, the curing agent may be selected from polyurethane resins, ethylenediamine, and the like. The curing agent can accelerate the drying speed of the coating after construction, and can increase the hardness, the adhesiveness and the like of the coating film.
In an embodiment, the solvent is selected from at least one of ethanol, xylene, isopropanol, deionized water. For example, the solvent may be selected from ethanol, deionized water, and the like.
In a specific embodiment, the coating comprises 40-60% of a resin matrix, 5-25% of magnesia fibers, 15-25% of composite alumina particles, 0.5-1% of a coupling agent, 5-10% of a diluent, 0.5-5% of a plasticizer, 2-5% of a curing agent and the balance of a solvent; wherein the composite alumina particles consist of micron-sized alumina particles and nano-sized alumina particles combined on the surfaces of the micron-sized alumina particles, and the weight ratio of the micron-sized alumina particles to the nano-sized alumina particles is (5-25): (15-25).
The paint provided by the embodiment of the application can be prepared by the following method.
A second aspect of the embodiments of the present application provides a method for preparing a coating, including the steps of:
s01: the formula of the coating provided by the embodiment of the application is characterized by weighing the components respectively;
s02: carrying out surface modification treatment on the heat-conducting filler by using a coupling agent to obtain the coupling agent modified heat-conducting filler;
s03: dispersing a resin matrix in a diluent to obtain a resin solution;
s04: and mixing the coupling agent modified heat-conducting filler, the resin solution, the plasticizer, the curing agent and the solvent to obtain the coating.
According to the preparation method of the coating, the coupling agent is used for carrying out surface modification treatment on the heat conducting filler to obtain the heat conducting filler modified by the coupling agent, compatibility of the heat conducting filler and the resin matrix is enhanced, the heat conducting filler is fully and uniformly dispersed in the resin matrix, then the resin matrix is dispersed in the diluent to obtain the resin solution, the viscosity of the resin is reduced, and finally the heat conducting filler modified by the coupling agent, the resin solution, the plasticizer, the curing agent and the solvent are uniformly mixed to obtain the coating.
In the above step S01, the coating according to the embodiment of the present application includes the resin matrix, the heat conductive filler, the coupling agent, the diluent, the plasticizer, the curing agent, and the solvent, respectively, in proportion.
In an embodiment, a method for preparing a composite particulate thermally conductive filler of thermally conductive fillers includes: mixing micron-sized heat-conducting filler particles and nano-sized heat-conducting filler particles for ball milling treatment. Wherein, the conditions of the ball milling treatment comprise: the rotating speed is 4000-6000 rmp/min, such as 4000rmp/min, 5000rmp/min, 6000rmp/min, etc., and the time is 6-8 h, such as 6h, 7h, 8h, etc. The ball milling medium may be selected from corundum spheres. In the ball milling process of mixing micron-sized heat-conducting filler particles and nano-sized heat-conducting filler particles, ceramic grinding balls, micron-sized heat-conducting filler particles, nano-sized heat-conducting filler particles and tank walls are continuously collided and impacted, part of energy is transferred to the heat-conducting filler particles, after the heat-conducting filler particles are subjected to impact, extrusion, vibration, friction and other forms of motion energy, small parts of particles start to be broken, most of particle surfaces start to have defects such as cracks, new surfaces are generated, and the surface energy is increased. At the same time, the surface of the heat conducting filler particles deforms under the impact energy to generate new chemical bonds and unsaturated atoms, so that the surface energy is increased, and therefore, the micron-sized heat conducting filler particles and the nanometer-sized heat conducting filler particles tend to be mutually adsorbed to reduce the energy due to the increase of the surface energy, so that the nanometer-sized heat conducting filler particles are coated and surrounded on the surface of the micron-sized heat conducting filler particles, and the micron-sized heat conducting filler particles and the nanometer-sized heat conducting filler particles form the composite granular heat conducting filler with a core-shell structure.
In the above step S02, the step of surface-modifying the heat conductive filler with the coupling agent includes: adding the solution containing the coupling agent into the heat conducting filler, stirring, adjusting the pH value of the mixed solution to 3-5, and then placing the mixed solution into a water bath with the temperature of 60-80 ℃ for stirring for 4-6 hours. Specifically, a coupling agent is added into 95% ethanol to be dissolved to form a coupling agent-containing solution, then the coupling agent-containing solution is added into a heat-conducting filler to be stirred and the pH of the mixed solution is regulated to 3-5, so that a group (Si-O) of the coupling agent is hydrolyzed to form a silicon hydroxyl group (Si-OH) under the acidic condition, so that a part of the silicon hydroxyl group is hydrogen-bonded with a hydroxyl group on the surface of the heat-conducting filler, then a dehydration condensation reaction is further carried out in a water bath at 60-80 ℃ to form a-Si-O-X covalent bond (X is a group or an atom on the surface of the heat-conducting filler), and meanwhile, a condensation reaction is also carried out between another part of the silicon hydroxyl group and a silicon hydroxyl group of an adjacent coupling agent to form a network structure, and the network structure covers the surface of the heat-conducting filler. The solvent is volatilized after stirring for 4-6 hours, then the mixture is dried for 10 hours at 120 ℃ and dried for 1 hour at 150 ℃ to obtain the coupling agent modified heat-conducting filler, thereby realizing the organization of the heat-conducting filler, enhancing the compatibility of the heat-conducting filler and a resin matrix, being beneficial to fully and uniformly dispersing the heat-conducting filler in the resin matrix and forming more heat-conducting passages, and being beneficial to improving the heat conductivity of the coating. It is understood that when the heat conductive filler includes fibrous heat conductive filler and composite particulate heat conductive filler, the fibrous heat conductive filler modified with the coupling agent and the composite particulate heat conductive filler modified with the coupling agent are obtained after the surface modification treatment. For example, the heat-conducting filler comprises magnesium oxide fibers and composite alumina particles, and the magnesium oxide fibers modified by the coupling agent and the composite alumina particles modified by the coupling agent are obtained after surface modification treatment.
In the above step S03, the step of dispersing the resin matrix in the diluent may include: and adding the diluent into the resin matrix and uniformly stirring.
In the above step S04, the step of mixing the coupling agent-modified heat conductive filler, the resin solution, the plasticizer, the curing agent, and the solvent includes: and adding the coupling agent modified heat conducting filler, the plasticizer, the curing agent and the solvent into the resin solution, and uniformly stirring.
A third aspect of the embodiments provides an electronic device comprising a coating film formed from the coating provided herein or the coating prepared by the preparation method provided herein.
The electronic device provided by the embodiment of the application has the advantages of high heat conductivity and good insulativity because the electronic device comprises the coating film formed by the coating provided by the application or the coating prepared by the preparation method provided by the application, and can rapidly emit heat generated by the electronic device into a space, so that the stability of the electronic device can be improved, and the service life of the electronic device is long.
The following description is made with reference to specific embodiments.
Example 1
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
wherein the heat conductive filler is composite alumina particles (Nano-Al 2 O 3 Coating Micro-Al 2 O 3 ) The composite alumina particles consist of micron-sized alumina particles (particle diameter: 30 μm) and nano-sized alumina particles (particle diameter: 50 nm) bonded to the surface of the micron-sized alumina particles, and the weight ratio of the nano-sized alumina particles to the micron-sized alumina particles is 1:4.
the preparation method of the coating comprises the following steps:
s11: the formulation according to this example weighed the appropriate amounts of epoxy resin, micron-sized alumina particles, nano-sized alumina particles, vinyltriethoxysilane, ethanol, phthalate and polyurethane resin, respectively;
s12: adding micron-sized alumina particles and nano-sized alumina particles into a corundum ball milling tank, and ball milling for 6 hours at a rotating speed of 6000rmp/min to obtain composite alumina particles;
s13: adding vinyl triethoxysilane into 95% ethanol for dissolution, adding the mixture into the composite alumina particles, stirring, adjusting the pH of the mixed solution to 3, placing the mixture into a water bath at 60 ℃ for stirring for 6 hours, placing the mixture into a baking oven at 120 ℃ for baking for 10 hours after the solvent is evaporated, and baking the mixture at 150 ℃ for 1 hour to obtain vinyl triethoxysilane modified composite alumina particles;
s14: adding a proper amount of ethanol into epoxy resin, and uniformly stirring to obtain an epoxy resin solution;
s15: adding vinyl triethoxysilane modified composite alumina particles into an epoxy resin solution, and adding a proper amount of ethanol, polyurethane resin and phthalate to stir uniformly to obtain the coating.
Example 2
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
wherein, the heat conduction filler comprises the following components in percentage by weight: 15 and composite alumina particles (Nano-Al 2 O 3 Coating Micro-Al 2 O 3 ) The composite alumina particles consist of micron-sized alumina particles (particle diameter: 30 μm) and nano-sized alumina particles (particle diameter: 50 nm) bonded to the surface of the micron-sized alumina particles, and the weight ratio of the nano-sized alumina particles to the micron-sized alumina particles is 1:4.
the preparation method of the coating comprises the following steps:
s21: the formulation according to this example weighed the appropriate amount of epoxy resin, magnesia fiber, micron-sized alumina particles, nano-sized alumina particles, vinyltriethoxysilane, ethanol, phthalate and polyurethane resin, respectively;
s22: adding micron-sized alumina particles and nano-sized alumina particles into a corundum ball milling tank, and ball milling for 6 hours at a rotating speed of 6000rmp/min to obtain composite alumina particles;
s23: adding vinyl triethoxysilane into 95% ethanol for dissolution, adding into mixed filler of composite alumina particles and magnesium oxide fibers, stirring, adjusting the pH of the mixed solution to 3, placing in a water bath at 60 ℃ for stirring for 6 hours, after solvent evaporation is completed, placing in a baking oven at 120 ℃ for baking for 10 hours, and baking at 150 ℃ for 1 hour to obtain vinyl triethoxysilane modified heat-conducting filler;
s24: adding a proper amount of ethanol into epoxy resin, and uniformly stirring to obtain an epoxy resin solution;
s25: and adding the vinyl triethoxysilane modified heat-conducting filler into the epoxy resin solution, and adding a proper amount of ethanol, polyurethane resin and phthalate to stir uniformly to obtain the coating.
Example 3
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
wherein, the heat conduction filler comprises the following components in percentage by weight: 25 and composite alumina particles (Nano-Al 2 O 3 Coating Micro-Al 2 O 3 ) The composite alumina particles consist of micron-sized alumina particles (particle size of 30 μm) and nano-sized alumina particles (particle size of 50 nm) bonded on the surfaces of the micron-sized alumina particles, wherein the weight ratio of the nano-sized alumina particles to the micron-sized alumina particles is 1:4.
the preparation method of the coating is concretely referred to in the procedure of example 2.
Example 4
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
wherein, the heat conduction filler comprises the following components in percentage by weight: 20 and composite alumina particles (Nano-Al 2 O 3 Coating Micro-Al 2 O 3 ) The composite alumina particles consist of micron-sized alumina particles (particle size of 30 μm) and nano-sized alumina particles (particle size of 50 nm) bonded on the surfaces of the micron-sized alumina particles, wherein the weight ratio of the nano-sized alumina particles to the micron-sized alumina particles is 1:4.
the preparation method of the coating is concretely referred to in the procedure of example 2.
Example 5
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
wherein, the heat conduction filler comprises the following components in percentage by weight: 25 and composite alumina particles (Nano-Al 2 O 3 Coating Micro-Al 2 O 3 ) The composite alumina particles consist of micron-sized alumina particles (particle size of 30 μm) and nano-sized alumina particles (particle size of 50 nm) bonded on the surfaces of the micron-sized alumina particles, wherein the weight ratio of the nano-sized alumina particles to the micron-sized alumina particles is 1:4.
the preparation method of the coating is concretely referred to in the procedure of example 2.
Example 6
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
wherein, the heat conduction filler comprises the following components in percentage by weight: 25 and composite alumina particles (Nano-Al 2 O 3 Coating Micro-Al 2 O 3 ) The composite alumina particles consist of micron-sized alumina particles (particle size of 30 μm) and nano-sized alumina particles (particle size of 50 nm) bonded on the surfaces of the micron-sized alumina particles, wherein the weight ratio of the nano-sized alumina particles to the micron-sized alumina particles is 1:6.
the preparation method of the coating comprises the following steps:
s21: the formulation according to this example weighed the right amount of phenolic epoxy resin, magnesia fiber, micron-sized alumina particles, nano-sized alumina particles, vinyltrimethoxysilane, acetone, epoxy fatty acid monoester, ethylenediamine and deionized water, respectively;
s22: adding micron-sized alumina particles and nano-sized alumina particles into a corundum ball milling tank, and ball milling for 7 hours at a rotation speed of 5000rmp/min to obtain composite alumina particles;
s23: adding vinyl trimethoxy silane into 95% ethanol for dissolution, adding the mixture into mixed filler of composite alumina particles and magnesium oxide fibers, stirring, adjusting the pH value of the mixture to 4, placing the mixture in a water bath at 70 ℃ for stirring for 5 hours, placing the mixture in a baking oven at 120 ℃ for baking for 10 hours after the solvent is evaporated, and baking the mixture at 150 ℃ for 1 hour to obtain the thermal conductive filler modified by the vinyl trimethoxy silane;
s24: adding a proper amount of acetone into phenolic epoxy resin, and uniformly stirring to obtain phenolic epoxy resin solution;
s25: and adding the vinyl trimethoxy silane modified heat conducting filler into the phenolic epoxy resin solution, and adding a proper amount of deionized water, epoxy fatty acid monoester and ethylenediamine to uniformly stir to obtain the coating.
Example 7
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
wherein, the heat conduction filler comprises the following components in percentage by weight: 25 and composite alumina particles (Nano-Al 2 O 3 Coating Micro-Al 2 O 3 ) The composite alumina particles consist of micron-sized alumina particles (particle size of 30 μm) and nano-sized alumina particles (particle size of 50 nm) bonded on the surfaces of the micron-sized alumina particles, wherein the weight ratio of the nano-sized alumina particles to the micron-sized alumina particles is 1:8.
the preparation method of the coating comprises the following steps:
s21: the formulation according to this example weighed the appropriate amount of epoxy resin, magnesia fiber, micron-sized alumina particles, nano-sized alumina particles, vinyltriethoxysilane, ethanol, phthalate and polyurethane resin, respectively;
s22: adding micron-sized alumina particles and nano-sized alumina particles into a corundum ball milling tank, and ball milling for 8 hours at the rotating speed of 4000rmp/min to obtain composite alumina particles;
s23: adding vinyl triethoxysilane into 95% ethanol for dissolution, adding into mixed filler of composite alumina particles and magnesium oxide fibers, stirring, adjusting the pH of the mixed solution to 5, placing into water bath at 80 ℃ for stirring for 4 hours, after solvent evaporation is completed, placing into an oven at 120 ℃ for drying for 10 hours, and drying at 150 ℃ for 1 hour to obtain thermal conductive filler modified by vinyl triethoxysilane;
s24: adding a proper amount of ethanol into epoxy resin, and uniformly stirring to obtain an epoxy resin solution;
s25: and adding the vinyl triethoxysilane modified heat-conducting filler into the epoxy resin solution, and adding a proper amount of ethanol, polyurethane resin and phthalate to stir uniformly to obtain the coating.
Example 8
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
wherein, the heat conduction filler comprises the following components in percentage by weight: 25 and composite alumina particles (Nano-Al 2 O 3 Coating Micro-Al 2 O 3 ) The composite alumina particles consist of micron-sized alumina particles (particle size of 30 μm) and nano-sized alumina particles (particle size of 50 nm) bonded on the surfaces of the micron-sized alumina particles, wherein the weight ratio of the nano-sized alumina particles to the micron-sized alumina particles is 1:4.
the preparation method of the coating is concretely referred to in the procedure of example 2.
Comparative example 1
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
the preparation method of the coating comprises the following steps:
s1: the formulation according to this example weighed the appropriate amounts of epoxy resin, graphite particles, vinyltriethoxysilane, ethanol, phthalate and polyurethane resin, respectively;
s2: adding vinyl triethoxysilane into 95% ethanol for dissolution, adding graphite particles for stirring, adjusting the pH of the mixed solution to 3, placing the mixture in a water bath at 60 ℃ for stirring for 6 hours, placing the mixture in a baking oven at 120 ℃ for baking for 10 hours after the solvent is evaporated, and baking the mixture at 150 ℃ for 1 hour to obtain vinyl triethoxysilane modified micron-sized alumina particles;
s3: adding a proper amount of ethanol into epoxy resin, and uniformly stirring to obtain an epoxy resin solution;
s4: adding vinyl triethoxysilane modified micron-sized alumina particles into an epoxy resin solution, and adding proper amount of ethanol, polyurethane resin and phthalate to stir uniformly to obtain the coating.
Comparative example 2
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
the preparation method of the coating comprises the following steps:
s1: the formulation according to this example weighed the appropriate amounts of epoxy resin, micron-sized alumina particles, vinyltriethoxysilane, ethanol, phthalate and polyurethane resin, respectively;
s2: adding vinyl triethoxysilane into 95% ethanol for dissolution, adding the dissolved vinyl triethoxysilane into micron-sized alumina particles, stirring, adjusting the pH of the mixed solution to 3, placing the mixture in a water bath at 60 ℃ for stirring for 6 hours, placing the mixture in a baking oven at 120 ℃ for baking for 10 hours after the solvent is evaporated, and baking the mixture at 150 ℃ for 1 hour to obtain micron-sized alumina particles modified by vinyl triethoxysilane;
s3: adding a proper amount of ethanol into epoxy resin, and uniformly stirring to obtain an epoxy resin solution;
s4: adding vinyl triethoxysilane modified micron-sized alumina particles into an epoxy resin solution, and adding proper amount of ethanol, polyurethane resin and phthalate to stir uniformly to obtain the coating.
Comparative example 3
The embodiment provides a coating and a preparation method thereof.
The coating comprises the following components in percentage by weight:
the preparation method of the coating comprises the following steps:
s1: the formulation according to this example weighed the appropriate amounts of epoxy, nanoscale alumina particles, vinyltriethoxysilane, ethanol, phthalate, and polyurethane resin, respectively;
s2: adding vinyl triethoxysilane into 95% ethanol for dissolution, adding the vinyl triethoxysilane into nano-sized alumina particles, stirring, adjusting the pH of the mixed solution to 3, placing the mixture in a water bath at 60 ℃ for stirring for 6 hours, placing the mixture in a baking oven at 120 ℃ for baking for 10 hours after the solvent is evaporated, and baking the mixture at 150 ℃ for 1 hour to obtain vinyl triethoxysilane modified nano-sized alumina particles;
s3: adding a proper amount of ethanol into epoxy resin, and uniformly stirring to obtain an epoxy resin solution;
s4: adding vinyl triethoxysilane modified nano-alumina particles into an epoxy resin solution, and adding a proper amount of ethanol, polyurethane resin and phthalate to stir uniformly to obtain the coating.
Correlation performance test analysis:
to verify the progress of the coatings of the examples of the present application, the coatings provided in examples 1 to 8 and comparative examples 1 to 3 of the present application were made into coating films, and the performance test was performed on the coating films, and the test results are shown in the following table 1:
TABLE 1
From the above test results, the thermal conductivity of the coating provided in example 1 is significantly higher than that of the coatings provided in comparative examples 1 to 3, which means that the composite alumina particles contained in the coating provided in example 1 are coated on the surface of the micron-sized alumina particles by the nano-sized alumina particles, so that the number of contact points is increased, and more heat conduction paths are formed, thereby significantly improving the thermal conductivity of the coating film. The thermal conductivity of the coating provided in example 2 is significantly higher than that provided in example 1, which means that the coating provided in example 2 forms a hybrid filler by magnesium oxide fibers and composite alumina particles, so that the fillers are easier to contact with each other, the number of contact points can be further increased, and thus good thermal conduction paths can be formed in a resin matrix in a mutually overlapping manner, and therefore, the thermal conductivity of the coating film can be further improved. The coatings of the embodiments 1 to 8 have the advantages of high heat conductivity and good insulativity, and can be widely applied to electronic components or electronic products needing heat dissipation, thereby playing a role in accelerating heat dissipation.
The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.
Claims (10)
1. The coating is characterized by comprising the following components in percentage by weight, based on 100% of the total weight of the coating:
the balance being solvent;
the heat conducting filler comprises composite granular heat conducting filler, wherein the composite granular heat conducting filler consists of micron-sized heat conducting filler particles and nanometer-sized heat conducting filler particles combined on the surfaces of the micron-sized heat conducting filler particles.
2. The coating of claim 1, wherein the weight ratio of the nanoscale thermally conductive filler particles to the microscale thermally conductive filler particles is 1: (4-8); and/or
The particle size of the nano-scale heat-conducting filler particles is 20-60 nm; and/or
The particle size of the micron-sized heat conducting filler particles is 0.5-50 mu m.
3. The coating of claim 1, wherein the thermally conductive filler further comprises a fibrous thermally conductive filler in a weight ratio of (5 to 25) to the composite particulate thermally conductive filler: (15-25).
4. A coating according to claim 3, wherein the fibrous thermally conductive filler is selected from magnesium oxide fibers.
5. The coating according to any one of claims 1 to 4, wherein the nanoscale heat-conducting filler is at least one selected from the group consisting of alumina, aluminum nitride, silica, boron nitride, and silicon carbide; and/or
The micron-sized heat conducting filler is made of at least one of aluminum oxide, aluminum nitride, silicon dioxide, boron nitride and silicon carbide.
6. The coating of claim 5, wherein the nanoscale thermally conductive filler and the microscale thermally conductive filler are both alumina.
7. The coating according to any one of claims 1 to 4, wherein the resin matrix is selected from at least one of epoxy resins, epoxy modified silicone resins, phenolic epoxy resins; and/or
The coupling agent is at least one selected from vinyl triethoxysilane, vinyl trimethoxysilane and vinyl tri (beta-methoxyethoxy) silane; and/or
The diluent is at least one selected from acetone, toluene, xylene and ethanol; and/or
The plasticizer is at least one selected from phthalate, polyethersulfone, epoxy fatty acid monoester and epoxy tetrahydrophthalate; and/or
The curing agent is at least one selected from polyurethane resin, ethylenediamine and 1, 2-dimethylimidazole; and/or
The solvent is at least one selected from ethanol, xylene, isopropanol and deionized water.
8. A method for preparing a coating, comprising the steps of:
the formulation of the coating according to any one of claims 1 to 7, the components being weighed separately;
carrying out surface modification treatment on the heat-conducting filler by using the coupling agent to obtain the coupling agent modified heat-conducting filler;
dispersing the resin matrix in the diluent to obtain a resin solution;
and mixing the coupling agent modified heat-conducting filler, the resin solution, the plasticizer, the curing agent and the solvent to obtain the coating.
9. The method of producing a composite particulate heat conductive filler according to claim 8, wherein the method of producing the composite particulate heat conductive filler comprises: and mixing the micron-sized heat-conducting filler particles and the nano-sized heat-conducting filler particles for ball milling treatment.
10. An electronic device comprising a coating film formed from the coating material according to any one of claims 1 to 7 or the coating material produced by the production method according to any one of claims 8 to 9.
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| CN (1) | CN116285564A (en) |
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| US20050045855A1 (en) * | 2003-09-03 | 2005-03-03 | Tonapi Sandeep Shrikant | Thermal conductive material utilizing electrically conductive nanoparticles |
| CN102660212A (en) * | 2012-06-08 | 2012-09-12 | 焦作市卓立烫印材料有限公司 | Single-component epoxy heat-conducting adhesive |
| CN103146197A (en) * | 2013-03-11 | 2013-06-12 | 深圳大学 | Method for preparing lyophobic heat conduction material with micro-nano core-shell structure |
| CN106497412A (en) * | 2016-10-19 | 2017-03-15 | 芜湖孙杨信息咨询有限公司 | A kind of preparation technology of high temperature resistance high heat conduction coatings |
| RU2614334C1 (en) * | 2015-11-10 | 2017-03-24 | Акционерное общество "Авиаавтоматика" имени В.В. Тарасова" | Thermally conductive polymer composite material |
| CN111138947A (en) * | 2020-01-13 | 2020-05-12 | 广州视源电子科技股份有限公司 | Electric insulation radiation heat dissipation coating and preparation method thereof |
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2022
- 2022-12-27 CN CN202211683673.2A patent/CN116285564A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050045855A1 (en) * | 2003-09-03 | 2005-03-03 | Tonapi Sandeep Shrikant | Thermal conductive material utilizing electrically conductive nanoparticles |
| CN102660212A (en) * | 2012-06-08 | 2012-09-12 | 焦作市卓立烫印材料有限公司 | Single-component epoxy heat-conducting adhesive |
| CN103146197A (en) * | 2013-03-11 | 2013-06-12 | 深圳大学 | Method for preparing lyophobic heat conduction material with micro-nano core-shell structure |
| RU2614334C1 (en) * | 2015-11-10 | 2017-03-24 | Акционерное общество "Авиаавтоматика" имени В.В. Тарасова" | Thermally conductive polymer composite material |
| CN106497412A (en) * | 2016-10-19 | 2017-03-15 | 芜湖孙杨信息咨询有限公司 | A kind of preparation technology of high temperature resistance high heat conduction coatings |
| CN111138947A (en) * | 2020-01-13 | 2020-05-12 | 广州视源电子科技股份有限公司 | Electric insulation radiation heat dissipation coating and preparation method thereof |
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