CN108587046A - A kind of electronic product casing plastics with antistatic and heat dissipation performance - Google Patents
A kind of electronic product casing plastics with antistatic and heat dissipation performance Download PDFInfo
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- CN108587046A CN108587046A CN201810516783.7A CN201810516783A CN108587046A CN 108587046 A CN108587046 A CN 108587046A CN 201810516783 A CN201810516783 A CN 201810516783A CN 108587046 A CN108587046 A CN 108587046A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
- C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The present invention relates to technical field of polymer materials, and in particular to a kind of electronic product casing plastics with antistatic and heat dissipation performance.Plastics include following component：ABS resin, makrolon, electric conductivity heat dissipation particle, glass fibre, ethylene propylene diene rubber, compatilizer, lubricant, antioxidant and coupling agent, wherein electric conductivity heat dissipation particle is the copper powder of gel cladding；The fibre length of glass fibre is 0.3 0.5mm；Compatilizer is the mixture of nano-calcium carbonate and maleic anhydride stem grafting polyolefin copolymer；Lubricant is zinc stearate or magnesium stearate；Coupling agent is one kind in γ glycidoxypropyl trimethoxies silane, γ aminopropyltriethoxywerene werenes and γ chloropropyltrimethoxy silanes.The type resin material not only has good intensity and hardness, can also significantly improve the heat dissipation performance and anti-static effect of ABS resin material.
Description
Technical field
The present invention relates to technical field of polymer materials, and in particular to a kind of electronics production with antistatic and heat dissipation performance
Product shell plastics.
Background technology
Some electronics or electrical equipment are typically provided with shell, and the effect of shell is protected internal structure, is kept away
Exempt from internal precision components to be damaged by light, heat source, vapor, corrosive substance, or is impacted by external force, from
And ensure the normal work of equipment, improve the service life of equipment.The conventional device housings material that relates to includes metal material, glass
The types such as material, ceramic material, wood materials and high-molecular organic material.These materials all have the advantage and disadvantage of itself, such as
The structural strength high-impact of metal material can be outstanding, but corrosion resistance and insulation performance are poor；The cost of wood materials
It is cheap, it is easy to process, but the ageing-resistant performance relative deficiency of material.Different equipment can use field according to equipment itself
The requirement of scape is selected.
Engineering plastics are a kind of industrial plastics for being used as industrial part or sheathing material, and this kind of plastics are in the strong of material
Degree, impact resistance, heat resistance, hardness and ageing resistance are improved, to meet under various usage scenarios for equipment
The performance requirement of sheathing material.Engineering plastics are widely used in electric, automobile, building, office equipment, machinery, aviation
The industries such as space flight.Common engineering plastics type includes makrolon, polyamide, polyacetals, denaturation polyphenylene oxide, polyester, polyphenyl
Thioether, poly- aryl ester, unsaturated polyester (UP), phenol plastic cement, epoxy plastic cement etc..
In engineering plastics type, ABS engineering plastics are a kind of to be widely used general plastics kind, ABS engineering plastics
For Chinese name in chemical industry plastic alloy, this material had both had excellent heat-resisting weatherability, the dimensionally stable of PC resin
Property and impact resistance, and with the excellent processing fluidity of ABS resin.So applying in thin-walled and complicated shape product, energy
Its excellent performance is kept, and keeps the mouldability of plastics and a kind of material of ester composition.The disadvantage of ABS engineering plastics maximums
It is exactly quality weight, heat conductivility is not good enough；It is also possible to produce in use in addition, being used as the plastics that electrical appliance enclosure uses
Raw electrostatic, to be impacted to the work of internal component.
In order to solve the problems, such as that heat dissipation and antistatic, patent publication No. CN102746607A propose a kind of insulating heat-conductive ring
Environment friendly flame-retardant ABS resin and preparation method thereof, this resin are added in raw material components with aluminium nitride, hexagonal boron nitride, oxidation
Insulating nano heat filling based on magnesium, aluminium oxide；To improve the heat dissipation performance of resin material.Patent publication No.
CN102268171A proposes a kind of novel antistatic ABS resin material and preparation method thereof, and tool is added in the technical solution
Conductive carbon nanotube and carbon black, to promote the antistatic property of resin material.The auxiliary agent added in these technical solutions
Contribute positively to improve corresponding performance, but the compatibility between these inorganic material auxiliary agents and high molecular material main body compared with
Difference, additive amount is too low in material of main part, cannot reach respective performances, and adding too much can then influence the material settling out of plastics
Property and intensity.Therefore how in the case where not influencing body of material basic performance, the heat dissipation performance to ABS engineering plastics is promoted
And anti-static effect, become a urgent problem to be solved.
Invention content
For problems of the prior art, the electronics production with antistatic and heat dissipation performance that the present invention provides a kind of
Product shell plastics, the type resin material not only have good intensity and hardness, can also significantly improve ABS resin material
Heat dissipation performance and anti-static effect.
A kind of electronic product casing plastics with antistatic and heat dissipation performance, according to mass fraction, in the plastics
Including following component：40-50 parts of ABS resin, 14-18 parts of makrolon, electric conductivity 8-16 parts of particle of heat dissipation, glass fibre 3-7
Part, 3-6 parts of ethylene propylene diene rubber, 4-5 parts of compatilizer, 1-3 parts of lubricant, 0.5-1.3 parts of antioxidant, 1-3 parts of coupling agent.
Preferably, according to mass fraction, the plastics include following component：45-47 parts of ABS resin, makrolon 15-
16 parts, electric conductivity 11-13 parts of particle of heat dissipation, 4-6 parts of glass fibre, 3-5 parts of ethylene propylene diene rubber, 4.4-4.7 parts of compatilizer, profit
1.8-2.4 parts of lubrication prescription, 0.8-1.0 parts of antioxidant, 1.7-2.5 parts of coupling agent.
Preferably, according to mass fraction, the plastics include following component：46 parts of ABS resin, 15 parts of makrolon,
Electric conductivity 12 parts of particle of heat dissipation, 5 parts of glass fibre, 4 parts of ethylene propylene diene rubber, 4.6 parts of compatilizer, 2.1 parts of lubricant, antioxidant
0.9 part, 2 parts of coupling agent.
In the present invention, electric conductivity radiates particle for the copper powder of gel cladding, the preparation method of electric conductivity heat dissipation particle
Include the following steps：
(1) according to volume ratio, 3 parts of ethyl orthosilicates are dissolved in 40 parts of ethyl alcohol, 3 parts of deionized water is then added
With 7 parts of acetic acid, fully dissolving is mixed and obtains A liquid；According to mass fraction, by 2 parts of boric acid, 3 parts of barium acetates and 5 parts of acetic acid
Zinc after mixing, is added in 50 parts of ethyl alcohol, is sufficiently stirred and is uniformly dispersed to obtain B liquid, by A liquid and B liquid according to volume ratio etc.
Than mixing, 1.5h is stirred at a temperature of 65 DEG C, obtains glass colloidal sol；
(2) it is 2-3 μm copper powder to be ground to grain size, pickling 20min in dilute hydrochloric acid solution is added to, then by solution mistake
Filter, obtained copper powder are cleaned 3 times with acetone soln, are dried；
(3) according to 1:Copper powder is added in glass colloidal sol by 3 mass ratio, at a temperature of 60 DEG C, is stirred 3h, is carried out
Sol-gel Coated；Liquid, which is warming up to 85 DEG C of evaporation and concentration, again makes solution become the thick slurry for having mobility, culture dish is poured into, in 70 DEG C
Dry 1h, by obtained product attrition grinding to 250-300 mesh to get required electric conductivity heat dissipation micro mist.
Wherein, the mass fraction of dilute hydrochloric acid is 15%.
Preferably, the fibre length of glass fibre is 0.3-0.5mm.
The addition of glass fibre be mainly used for promoted material tensile strength and toughness, avoid material in use by
It is broken to external impacts.
Preferably, compatilizer is the mixture of nano-calcium carbonate and maleic anhydride stem grafting polyolefin copolymer, the matter of the two
Amount is than being 1:2.
Compatilizer adds compatible between can significantly improving the different high molecular materials in component in resin material
Property, by the bonding force effect of group between different molecular between substance, improve the combination effect between molecule.
Preferably, lubricant is zinc stearate or magnesium stearate.
Preferably, coupling agent is γ-glycidoxypropyl trimethoxy silane, γ aminopropyltriethoxy silane
With one kind in γ-chloropropyltrimethoxy silane.
The preparation method of plastics provided by the invention includes the following steps：
According to mass fraction, ABS resin, makrolon, ethylene propylene diene rubber and compatilizer are added in batch mixer, with
100-120 DEG C of temperature, abundant batch mixing 15-20min, then by electric conductivity heat dissipation particle, glass fibre, lubricant, antioxidant
It is added in batch mixer with coupling agent and continues that 10-15min is mixed, then put into mixture in double screw extruder,
Carry out extruding pelletization, 180-190 DEG C of area's temperature of the extruder, two 190-200 DEG C of area's temperature, three area temperature 200-210
DEG C, four 210-220 DEG C of area's temperature, five 220-230 DEG C of area's temperature, six 230-240 DEG C of area's temperature, seven 220-230 DEG C of area's temperature, eight
210-220 DEG C of area's temperature, head temperature are 200-210 DEG C.
The present invention has following advantageous effect：
A kind of electric conductivity heat dissipation particle is added in the type resin material, this electric conductivity heat dissipation particle is a kind of gel packet
The copper powder covered, since the heat conductivility of metal fine powder is than common macromolecule resin material higher, this material tool
It is improved the effect of resin material heat dissipation performance；In addition, copper powder as with satisfactory electrical conductivity material, in resin material
In can by formed miniature electric field form the electrostatic formed in shell be discharged, reach anti-static effect.
Wherein, in order to improve the compatibility among copper powder and organic polymer base material, in the technical solution, the outer layer of copper powder
It is coated with gel like material, the compatibility of this composite material and high-molecular organic material is more preferable, therefore in use not
The problem of composite material is precipitated can occur, big influence will not be caused to the basic performance of organic polymer matrix material.Material
Compatilizer in material can act synergistically with gel like material, ABS resin, makrolon so that electrically conductive microparticle and its
That more stablizes between his high molecular material is compatible, the binding force between material is improved, so as to improve the thermal stability of plastics.
It also added the chemical stability that compatilizer and coupling agent further promote material in the plastic, pass through glass fibers
The addition of dimension promotes the tensile strength and impact resistance of plastics, and the use of ethylene propylene diene rubber and antioxidant can promote plastics
The weather resistances such as anti-aging, corrosion-resistant.
Specific implementation mode
The specific implementation mode of the present invention is further described with reference to embodiment, following embodiment is only used for more
Technical scheme of the present invention is clearly demonstrated, and not intended to limit the protection scope of the present invention.
Embodiment 1
A kind of electronic product casing plastics with antistatic and heat dissipation performance, according to mass fraction, in the plastics
Including following component：40 parts of ABS resin, 14 parts of makrolon, electric conductivity 8 parts of particle of heat dissipation, 3 parts of glass fibre, EPDM
3 parts of rubber, 4 parts of compatilizer, 1 part of lubricant, 0.5 part of antioxidant, 1 part of coupling agent.
In the present embodiment, electric conductivity radiates particle for the copper powder of gel cladding, the preparation side of electric conductivity heat dissipation particle
Method includes the following steps：
(1) according to volume ratio, 3 parts of ethyl orthosilicates are dissolved in 40 parts of ethyl alcohol, 3 parts of deionized water is then added
With 7 parts of acetic acid, fully dissolving is mixed and obtains A liquid；According to mass fraction, by 2 parts of boric acid, 3 parts of barium acetates and 5 parts of acetic acid
Zinc after mixing, is added in 50 parts of ethyl alcohol, is sufficiently stirred and is uniformly dispersed to obtain B liquid, by A liquid and B liquid according to volume ratio etc.
Than mixing, 1.5h is stirred at a temperature of 65 DEG C, obtains glass colloidal sol；
(2) it is 2-3 μm copper powder to be ground to grain size, is added to pickling 20min in dilute hydrochloric acid solution, the mass parts of dilute hydrochloric acid
Number is 15%, then filters solution, and obtained copper powder is cleaned 3 times with acetone soln, drying；
(3) according to 1:Copper powder is added in glass colloidal sol by 3 mass ratio, at a temperature of 60 DEG C, is stirred 3h, is carried out
Sol-gel Coated；Liquid, which is warming up to 85 DEG C of evaporation and concentration, again makes solution become the thick slurry for having mobility, culture dish is poured into, in 70 DEG C
Dry 1h, by obtained product attrition grinding to 250 mesh to get required electric conductivity heat dissipation micro mist.
In the present embodiment, the fibre length of glass fibre is 0.3-0.5mm.
Compatilizer is the mixture of nano-calcium carbonate and maleic anhydride stem grafting polyolefin copolymer, and the mass ratio of the two is 1:
2。
Lubricant is zinc stearate.
Coupling agent is γ-glycidoxypropyl trimethoxy silane.
The preparation method of plastics provided in this embodiment includes the following steps：
According to mass fraction, ABS resin, makrolon, ethylene propylene diene rubber and compatilizer are added in batch mixer, with
100 DEG C of temperature, abundant batch mixing 15min, then by electric conductivity heat dissipation particle, glass fibre, lubricant, antioxidant and coupling agent
It is added in batch mixer and continues that 10min is mixed, then put into mixture in double screw extruder, squeeze out and make
Grain, 180 DEG C of area's temperature of the extruder, two 190 DEG C of area's temperature, three 200 DEG C of area's temperature, four 210 DEG C of area's temperature, five area's temperature
220 DEG C of degree, six 230 DEG C of area's temperature, seven 220 DEG C of area's temperature, eight 210 DEG C of area's temperature, head temperature are 200 DEG C.
Embodiment 2
A kind of electronic product casing plastics with antistatic and heat dissipation performance, according to mass fraction, in the plastics
Including following component：50 parts of ABS resin, 18 parts of makrolon, electric conductivity 16 parts of particle of heat dissipation, 7 parts of glass fibre, EPDM
6 parts of rubber, 5 parts of compatilizer, 3 parts of lubricant, 1.3 parts of antioxidant, 3 parts of coupling agent.
In the present embodiment, electric conductivity radiates particle for the copper powder of gel cladding, the preparation side of electric conductivity heat dissipation particle
Method includes the following steps：
(1) according to volume ratio, 3 parts of ethyl orthosilicates are dissolved in 40 parts of ethyl alcohol, 3 parts of deionized water is then added
With 7 parts of acetic acid, fully dissolving is mixed and obtains A liquid；According to mass fraction, by 2 parts of boric acid, 3 parts of barium acetates and 5 parts of acetic acid
Zinc after mixing, is added in 50 parts of ethyl alcohol, is sufficiently stirred and is uniformly dispersed to obtain B liquid, by A liquid and B liquid according to volume ratio etc.
Than mixing, 1.5h is stirred at a temperature of 65 DEG C, obtains glass colloidal sol；
(2) it is 2-3 μm copper powder to be ground to grain size, is added to pickling 20min in dilute hydrochloric acid solution, the mass parts of dilute hydrochloric acid
Number is 15%, then filters solution, and obtained copper powder is cleaned 3 times with acetone soln, drying；
(3) according to 1:Copper powder is added in glass colloidal sol by 3 mass ratio, at a temperature of 60 DEG C, is stirred 3h, is carried out
Sol-gel Coated；Liquid, which is warming up to 85 DEG C of evaporation and concentration, again makes solution become the thick slurry for having mobility, culture dish is poured into, in 70 DEG C
Dry 1h, by obtained product attrition grinding to 300 mesh to get required electric conductivity heat dissipation micro mist.
In the present embodiment, the fibre length of glass fibre is 0.3-0.5mm.
Compatilizer is the mixture of nano-calcium carbonate and maleic anhydride stem grafting polyolefin copolymer, and the mass ratio of the two is 1:
2。
Lubricant is magnesium stearate.
Coupling agent is γ aminopropyltriethoxy silane.
The preparation method of plastics provided in this embodiment includes the following steps：
According to mass fraction, ABS resin, makrolon, ethylene propylene diene rubber and compatilizer are added in batch mixer, with
120 DEG C of temperature, abundant batch mixing 20min, then by electric conductivity heat dissipation particle, glass fibre, lubricant, antioxidant and coupling agent
It is added in batch mixer and continues that 15min is mixed, then put into mixture in double screw extruder, squeeze out and make
Grain, 190 DEG C of area's temperature of the extruder, two 200 DEG C of area's temperature, three 210 DEG C of area's temperature, four 220 DEG C of area's temperature, five area's temperature
230 DEG C of degree, six 240 DEG C of area's temperature, seven 230 DEG C of area's temperature, eight 220 DEG C of area's temperature, head temperature are 210 DEG C.
Embodiment 3
A kind of electronic product casing plastics with antistatic and heat dissipation performance, according to mass fraction, in the plastics
Including following component：46 parts of ABS resin, 15 parts of makrolon, electric conductivity 12 parts of particle of heat dissipation, 5 parts of glass fibre, EPDM
4 parts of rubber, 4.6 parts of compatilizer, 2.1 parts of lubricant, 0.9 part of antioxidant, 2 parts of coupling agent.
In the present embodiment, electric conductivity radiates particle for the copper powder of gel cladding, the preparation side of electric conductivity heat dissipation particle
Method includes the following steps：
(1) according to volume ratio, 3 parts of ethyl orthosilicates are dissolved in 40 parts of ethyl alcohol, 3 parts of deionized water is then added
With 7 parts of acetic acid, fully dissolving is mixed and obtains A liquid；According to mass fraction, by 2 parts of boric acid, 3 parts of barium acetates and 5 parts of acetic acid
Zinc after mixing, is added in 50 parts of ethyl alcohol, is sufficiently stirred and is uniformly dispersed to obtain B liquid, by A liquid and B liquid according to volume ratio etc.
Than mixing, 1.5h is stirred at a temperature of 65 DEG C, obtains glass colloidal sol；
(2) it is 2-3 μm copper powder to be ground to grain size, is added to pickling 20min in dilute hydrochloric acid solution, the mass parts of dilute hydrochloric acid
Number is 15%, then filters solution, and obtained copper powder is cleaned 3 times with acetone soln, drying；
(3) according to 1:Copper powder is added in glass colloidal sol by 3 mass ratio, at a temperature of 60 DEG C, is stirred 3h, is carried out
Sol-gel Coated；Liquid, which is warming up to 85 DEG C of evaporation and concentration, again makes solution become the thick slurry for having mobility, culture dish is poured into, in 70 DEG C
Dry 1h, by obtained product attrition grinding to 250-300 mesh to get required electric conductivity heat dissipation micro mist.
In the present embodiment, the fibre length of glass fibre is 0.3-0.5mm.
Compatilizer is the mixture of nano-calcium carbonate and maleic anhydride stem grafting polyolefin copolymer, and the mass ratio of the two is 1:
2。
Lubricant is zinc stearate.
Coupling agent is one kind in γ-chloropropyltrimethoxy silane.
The preparation method of plastics provided in this embodiment includes the following steps：
According to mass fraction, ABS resin, makrolon, ethylene propylene diene rubber and compatilizer are added in batch mixer, with
110 DEG C of temperature, abundant batch mixing 18min, then by electric conductivity heat dissipation particle, glass fibre, lubricant, antioxidant and coupling agent
It is added in batch mixer and continues that 13min is mixed, then put into mixture in double screw extruder, squeeze out and make
Grain, 185 DEG C of area's temperature of the extruder, two 195 DEG C of area's temperature, three 205 DEG C of area's temperature, four 215 DEG C of area's temperature, five area's temperature
225 DEG C of degree, six 235 DEG C of area's temperature, seven 225 DEG C of area's temperature, eight 215 DEG C of area's temperature, head temperature are 205 DEG C.
Performance test
1, as a comparison case with ABS resin material common in the market, the plastics of the present embodiment and the modeling of comparative example are tested
Tensile strength, elongation at break, bending strength and the impact strength of material, obtain following test data：
Table 1：The various mechanical performance of the present embodiment and comparative example plastics counts
| Test event | Testing standard | Comparative example | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Tensile strength (MPa) | ISO 527-2 | 110 | 113 | 114 | 118 |
| Elongation at break (%) | ISO 527-2 | 2.3 | 2.8 | 2.7 | 2.9 |
| Bending strength (MPa) | ISO 178 | 146 | 153 | 152 | 164 |
| Impact strength (MPa) | ISO 179 | 7.4 | 8.3 | 8.4 | 8.7 |
Above the experimental results showed that, tensile strength, elongation at break, bending strength and the impact strength of the type engineering plastics
The equal more common ABS resin material of properties has a degree of promotion, performance boost rate to reach 4-8%, every machine of material
Tool performance can reach the requirement of concerned countries standard.
2, the surface resistivity of the resin material of test the present embodiment, it is found that the surface resistivity of the plastics of the present embodiment is equal
In 105-106In the range of, the effect of good antistatic can be played.
3, using common ABS resin in the market as comparative example, the thermal conductivity of testing example and each sample of comparative example obtains
Following test data：
Table 2：The heat conductivility test result of the present embodiment and comparative example：
| Test event | Comparative example | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Thermal conductivity (W/mK) | 0.37 | 0.52 | 0.51 | 0.54 |
| Thermal conductivity enhancing rate (%) | - | 40.5% | 37.8% | 45.9% |
It is very big that the above test data shows that the more conventional ABS resin of the heat conductivility of plastics provided in this embodiment has
Promotion, the thermal conductivity of material improves 37.8-45.9%, to significantly improve when the material is used for device housings
Heat dissipation performance.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, although with reference to aforementioned reality
Applying example, invention is explained in detail, for those skilled in the art, still can be to aforementioned each implementation
Technical solution recorded in example is modified or equivalent replacement of some of the technical features.All essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.
Claims (10)
1. a kind of electronic product casing plastics with antistatic and heat dissipation performance, it is characterised in that：According to mass fraction, institute
It includes following component to state plastics：40-50 parts of ABS resin, 14-18 parts of makrolon, electric conductivity 8-16 parts of particle of heat dissipation, glass
3-7 parts of fiber, 3-6 parts of ethylene propylene diene rubber, 4-5 parts of compatilizer, 1-3 parts of lubricant, 0.5-1.3 parts of antioxidant, coupling agent 1-3
Part.
2. a kind of electronic product casing plastics with antistatic and heat dissipation performance according to claim 1, feature
It is：According to mass fraction, the plastics include following component：45-47 parts of ABS resin, 15-16 parts of makrolon are conductive
Property heat dissipation 11-13 parts of particle, 4-6 parts of glass fibre, 3-5 parts of ethylene propylene diene rubber, 4.4-4.7 parts of compatilizer, lubricant 1.8-
2.4 parts, 0.8-1.0 parts of antioxidant, 1.7-2.5 parts of coupling agent.
3. a kind of electronic product casing plastics with antistatic and heat dissipation performance according to claim 1, feature
It is：According to mass fraction, the plastics include following component：46 parts of ABS resin, 15 parts of makrolon, electric conductivity heat dissipation
12 parts of particle, 5 parts of glass fibre, 4 parts of ethylene propylene diene rubber, 4.6 parts of compatilizer, 2.1 parts of lubricant, 0.9 part of antioxidant, coupling
2 parts of agent.
4. a kind of electronic product casing plastics with antistatic and heat dissipation performance according to claim 1, feature
It is：
The electric conductivity heat dissipation particle is the copper powder of gel cladding, and the preparation method of electric conductivity heat dissipation particle includes following step
Suddenly：
（1）According to volume ratio, 3 parts of ethyl orthosilicates are dissolved in 40 parts of ethyl alcohol, 3 parts of deionized water and 7 is then added
The acetic acid of part is mixed fully dissolving and obtains A liquid；According to mass fraction, by 2 parts of boric acid, 3 parts of barium acetates and 5 parts of zinc acetates
After mixing, it is added in 50 parts of ethyl alcohol, is sufficiently stirred and is uniformly dispersed to obtain B liquid, by A liquid and B liquid according to ratios such as volume ratios
Mixing, stirs 1.5h at a temperature of 65 DEG C, obtains glass colloidal sol；
（2）It is 2-3 μm that copper powder, which is ground to grain size, is added to pickling 20min in dilute hydrochloric acid solution, then filters solution, obtains
The copper powder arrived is cleaned 3 times with acetone soln, drying；
（3）According to 1:Copper powder is added in glass colloidal sol by 3 mass ratio, at a temperature of 60 DEG C, is stirred 3h, is carried out colloidal sol
Cladding；Liquid, which is warming up to 85 DEG C of evaporation and concentration, again makes solution become the thick slurry for having mobility, pours into culture dish, dry in 70 DEG C
Dry 1h, by obtained product attrition grinding to 250-300 mesh to get required electric conductivity heat dissipation micro mist.
5. a kind of electronic product casing plastics with antistatic and heat dissipation performance according to claim 4, feature
It is：The mass fraction of the dilute hydrochloric acid is 15%.
6. a kind of electronic product casing plastics with antistatic and heat dissipation performance according to claim 1, feature
It is：The fibre length of the glass fibre is 0.3-0.5mm.
7. a kind of electronic product casing plastics with antistatic and heat dissipation performance according to claim 1, feature
It is：The compatilizer is the mixture of nano-calcium carbonate and maleic anhydride stem grafting polyolefin copolymer, and the mass ratio of the two is
1:2。
8. a kind of electronic product casing plastics with antistatic and heat dissipation performance according to claim 1, feature
It is：The lubricant is zinc stearate or magnesium stearate.
9. a kind of electronic product casing plastics with antistatic and heat dissipation performance according to claim 1, feature
It is：The coupling agent is γ-glycidoxypropyl trimethoxy silane, γ aminopropyltriethoxy silane and γ-chlorine
For one kind in propyl trimethoxy silicane.
10. a kind of electronic product casing plastics with antistatic and heat dissipation performance according to claim 1, feature
It is：The preparation method of the plastics includes the following steps：
According to mass fraction, ABS resin, makrolon, ethylene propylene diene rubber and compatilizer are added in batch mixer, with 100-
120 DEG C of temperature, abundant batch mixing 15-20min, then by electric conductivity heat dissipation particle, glass fibre, lubricant, antioxidant and idol
Connection agent, which is added in batch mixer, continues that 10-15min is mixed, and then puts into double screw extruder mixture, carries out
Extruding pelletization, 180-190 DEG C of area's temperature of the extruder, two 190-200 DEG C of area's temperature, three 200-210 DEG C of area's temperature, four
210-220 DEG C of area's temperature, five 220-230 DEG C of area's temperature, six 230-240 DEG C of area's temperature, seven 220-230 DEG C of area's temperature, eight area's temperature
210-220 DEG C of degree, head temperature are 200-210 DEG C.
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| CN201810516783.7A CN108587046A (en) | 2018-05-25 | 2018-05-25 | A kind of electronic product casing plastics with antistatic and heat dissipation performance |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810516783.7A CN108587046A (en) | 2018-05-25 | 2018-05-25 | A kind of electronic product casing plastics with antistatic and heat dissipation performance |
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| CN201810516783.7A Withdrawn CN108587046A (en) | 2018-05-25 | 2018-05-25 | A kind of electronic product casing plastics with antistatic and heat dissipation performance |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111675899A (en) * | 2020-07-02 | 2020-09-18 | 青岛易特优电子有限公司 | Household appliance sewage discharge pump body assembly composition |
| CN115785584A (en) * | 2022-12-29 | 2023-03-14 | 东莞市百高电子科技有限公司 | Plastic carrier tape material for packaging electronic components and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101724241A (en) * | 2009-12-15 | 2010-06-09 | 上海新上化高分子材料有限公司 | Antistatic thermoplastic polycarbonate composition and preparation method thereof |
-
2018
- 2018-05-25 CN CN201810516783.7A patent/CN108587046A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101724241A (en) * | 2009-12-15 | 2010-06-09 | 上海新上化高分子材料有限公司 | Antistatic thermoplastic polycarbonate composition and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111675899A (en) * | 2020-07-02 | 2020-09-18 | 青岛易特优电子有限公司 | Household appliance sewage discharge pump body assembly composition |
| CN115785584A (en) * | 2022-12-29 | 2023-03-14 | 东莞市百高电子科技有限公司 | Plastic carrier tape material for packaging electronic components and preparation method thereof |
| CN115785584B (en) * | 2022-12-29 | 2024-01-09 | 东莞市百高电子科技有限公司 | Plastic carrier tape material for packaging electronic element and preparation method thereof |
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Application publication date: 20180928 |