CN116248071B - Filter, filter design method and communication equipment - Google Patents
Filter, filter design method and communication equipment Download PDFInfo
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- CN116248071B CN116248071B CN202310260448.6A CN202310260448A CN116248071B CN 116248071 B CN116248071 B CN 116248071B CN 202310260448 A CN202310260448 A CN 202310260448A CN 116248071 B CN116248071 B CN 116248071B
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/40—Arrangements for reducing harmonics
Abstract
The embodiment of the invention provides a filter, a design method of the filter and communication equipment, wherein the filter comprises the following components: a base, the base comprising a substrate; the sealing structure is connected with the substrate through a metal structure; the target inductor comprises a first inductor and a second inductor, and the first inductor is arranged on the sealing structure; the second inductor is arranged on the substrate of the base; the sum of the inductance value of the second inductor and the inductance value of the first inductor is equal to the inductance value of the target inductor. According to the filter provided by the embodiment of the invention, the target inductor is split into the first inductor and the second inductor and is respectively arranged at different positions of the internal structure of the filter, so that the inductance value of the second inductor positioned on the substrate of the base is reduced, the quality factor of the target inductor formed by combining the first inductor and the second inductor can be improved, and the working performance of the filter is improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of filters, in particular to a filter, a filter design method and communication equipment.
Background
The inductor is a radio frequency device commonly used in a filter and is used for realizing various functions such as impedance adjustment, impedance matching and the like. Therefore, the performance of the inductor is significant for improving the working performance of the filter. The quality factor is one of the key indexes affecting the performance of the inductor, so how to provide a technical scheme to improve the quality factor of the inductor and the working performance of the filter becomes a technical problem to be solved.
Disclosure of Invention
In view of the above, embodiments of the present invention provide a filter, a method for designing the filter, and a communication device, so as to improve the performance of the filter.
An embodiment of the present invention provides a filter including:
a base, the base comprising a substrate;
the sealing structure is connected with the substrate through a metal structure;
the target inductor comprises a first inductor and a second inductor, and the first inductor is arranged on the sealing structure; the second inductor is arranged on the substrate of the base; the sum of the inductance value of the second inductor and the inductance value of the first inductor is equal to the inductance value of the target inductor.
Optionally, the substrate is a multilayer structure; the substrate of the second inductor arranged on the base comprises:
The second inductor is arranged on one layer of the multilayer structure, or the second inductor is arranged on at least two layers of the multilayer structure in a cross-layer manner.
Optionally, the sealing structure comprises a first substrate, a second substrate and a welding structure, one side of the second substrate is in sealing connection with the first substrate, the welding structure is formed on the other side of the second substrate, and the first inductor is arranged on the welding structure.
Alternatively, the first substrate and the second substrate are single-layer substrates formed of a single material, or composite substrates formed of multiple materials; the material comprises any one of a semiconductor material, an inorganic material and an organic material.
Optionally, in a direction perpendicular to the substrate, the first inductors and the second inductors are arranged in a staggered manner, so that a plane surrounded by the outline of the first inductors and a plane surrounded by the outline of the second inductors generate a superposition plane; and the ratio of the area of the coincident plane to the largest plane of the first inductor and the second inductor is greater than or equal to 20%, or the ratio of the area of the coincident plane to the largest plane of the first inductor and the second inductor is greater than or equal to 40%.
Optionally, a ratio of a minimum inductance value of the inductance values of the first inductor and the second inductor to an inductance value of the target inductor is greater than or equal to 20%, or a ratio of a minimum inductance value of the inductance values of the first inductor and the second inductor to an inductance value of the target inductor is greater than or equal to 40%.
Optionally, the inductance value of the target inductance is greater than or equal to 0.6 nanohenry, or the total length of the wound coil of the target inductance is greater than or equal to 500 micrometers.
The embodiment of the invention also provides a design method of the filter, which comprises the following steps:
providing a substrate, wherein the substrate comprises a substrate;
setting a second inductor of a target inductor on a substrate of the base, and setting a first inductor of the target inductor on a sealing structure of the filter; the sum of the inductance value of the second inductor and the inductance value of the first inductor is equal to the inductance value of the target inductor;
and connecting the sealing structure with the substrate through a metal structure.
Optionally, the substrate is a multilayer structure, and the second inductor of the target inductor is disposed on the substrate of the base, including:
And setting a second inductor of the target inductor on one layer of the multilayer structure, or setting the second inductor of the target inductor on at least two layers of junctions of the multilayer structure in a crossing way.
Optionally, the sealing structure comprises a first substrate, a second substrate and a welding structure, wherein one side of the second substrate is in sealing connection with the first substrate, and the welding structure is formed on the other side of the second substrate; the step of setting the first inductor of the target inductor on the sealing structure of the filter comprises the following steps:
the first inductor is disposed on the welded structure.
Alternatively, the first substrate and the second substrate are single-layer substrates formed of a single material, or composite substrates formed of multiple materials; the material comprises any one of a semiconductor material, an inorganic material and an organic material.
Optionally, the disposing a second inductor of a target inductor on the substrate of the base, and disposing a first inductor of the target inductor on the sealing structure of the filter includes:
the second inductors arranged on the substrate and the first inductors arranged on the sealing structure are arranged in a staggered mode in the direction perpendicular to the base, so that a plane surrounded by the outline of the first inductors and a plane surrounded by the outline of the second inductors generate a superposition plane; and the ratio of the area of the coincident plane to the largest plane of the first inductor and the second inductor is greater than or equal to 20%, or the ratio of the area of the coincident plane to the largest plane of the first inductor and the second inductor is greater than or equal to 40%.
Optionally, a ratio of a minimum inductance value of the inductance values of the first inductor and the second inductor to an inductance value of the target inductor is greater than or equal to 20%, or a ratio of a minimum inductance value of the inductance values of the first inductor and the second inductor to an inductance value of the target inductor is greater than or equal to 40%.
The embodiment of the invention also provides communication equipment, which comprises the filter of any one of the previous embodiments.
The filter provided by the embodiment of the invention comprises a substrate, wherein the substrate comprises a substrate; the sealing structure is connected with the substrate through a metal structure; the target inductor comprises a first inductor and a second inductor, and the first inductor is arranged on the sealing structure; the second inductor is arranged on the substrate of the base; the sum of the inductance value of the second inductor and the inductance value of the first inductor is equal to the inductance value of the target inductor.
It can be seen that, in the filter provided by the embodiment of the invention, the target inductance is split into the first inductance and the second inductance; then, the second inductor is arranged on the substrate of the base, and the first inductor is arranged on the sealing structure; that is, the two split inductors are arranged at different positions of the internal structure of the filter; further, the sum of the inductance value of the first inductor and the inductance value of the second inductor is ensured to be equal to the inductance value of the target inductor, so that the total inductance value of the inductance values of the first inductor and the second inductor after splitting can ensure that the filter is normally applied; therefore, the inductance value of the second inductor on the substrate of the base is smaller than that of the target inductor on the basis of not affecting the normal application of the filter. Since the performance of the inductor on the base substrate is a main factor affecting the performance of the filter, the performance of the inductor is in a direct proportion relation with the quality factor of the inductor (the quality factor of the inductor is directly related to the loss generated when the input signal flows through the inductor), that is, the smaller the loss generated when the signal flows through the inductor, the higher the quality factor of the inductor is, and the better the performance of the filter is; therefore, the loss generated by the inductor on the base substrate is positively correlated to the magnitude of the inductance value of the inductor. Based on the above, the embodiment of the invention reduces the inductance value of the second inductor arranged on the base substrate, thereby reducing the loss generated by the second inductor on the base substrate and improving the performance of the filter; in order to ensure normal application of the filter and ensure that the total inductance of the filter is not changed, the embodiment of the invention sets the first inductance in the sealing structure of the filter, so that the inductance value of the second inductance and the inductance value of the first inductance are equal to the inductance value of the target inductance (namely, the total inductance value of the filter). Therefore, the embodiment of the invention splits the target inductor into the first inductor and the second inductor, and the first inductor and the second inductor are arranged at different positions of the internal structure of the filter, so that the loss generated by the second inductor on the base substrate of the filter can be reduced on the basis of not affecting the normal application of the filter, and the purpose of improving the performance of the filter is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a filter according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another structure of a filter according to an embodiment of the present invention;
FIG. 3 is a flow chart of a method for designing a filter according to an embodiment of the invention;
FIG. 4 is a graph of inductance value versus quality factor for a target inductance in the filter of FIG. 1;
FIG. 5 is a graph of inductance value versus quality factor for a second inductor in the filter of FIG. 2;
FIG. 6 is a graph of inductance value versus quality factor for a first inductor in the filter of FIG. 2;
fig. 7 is a schematic diagram of the insertion loss effect of the filter of fig. 2.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The filter is a filter circuit composed of resonators, connection structures of the resonators, and necessary matching elements. The matching element comprises passive devices such as inductance, capacitance and the like. The filter can effectively filter the frequency points of the specific frequency or the frequencies outside the frequency points in the power line to obtain a power signal of the specific frequency or eliminate the power signal of the specific frequency. Thus, the filter is one of the key components in the communication system and may be used to make frequency selections (i.e., pass the desired power signal frequencies while reflecting the undesired interference signal frequencies).
For realizing the filter, fig. 1 schematically shows a structure of the filter according to the embodiment of the present invention.
As shown in fig. 1, the implementation structure of the filter includes a substrate 1, a sealing structure 2, a metal structure 5 (e.g. a metal ball) connecting the sealing structure 2 and the substrate 1, and a plastic sealing glue 6 for packaging is filled in the periphery and the gaps of the sealing structure 2 and the metal structure 5.
The sealing structure 2 formed by the first substrate 21 and the second substrate 22 is an unpackaged chip, which is also called a bare Die. The first substrate 21 and the second substrate 22 are bonded together by a seal ring 23 to form a seal structure 2; the material of the seal ring 23 may be metal or nonmetal. The resonator 27 may be formed over either one of the first substrate 21 and the second substrate 22, or may be provided over both substrates. The pad 24 is in the cavity enclosed by the resonator 27 and the sealing ring 23; connecting wires of the ports (including output port, input port, ground port of the filter) are led out through the through holes 26 on one of the substrates (on the first substrate 21 or the second substrate 22 shown in fig. 1); the sealing structure 2 and the substrate 11 on the base 1 are connected by means of the bond pads 25 to the metal structure 5 (for example, a soldered connection of the bond pads 25 to the bond pads 13 on the base 1 is achieved by means of the metal structure 5), the substrate 11 of the base 1 being a multilayer structure comprising at least one dielectric layer and two metal layers. The solder mask layer 4 is used for ensuring that the solder materials of the ports of the filter can be separated at the positions of the bonding pads 41 during the soldering process, and avoiding the short circuit caused by adhesion.
In operation of the filter, the electrical signal passes through the resonator 27 in the implementation of the filter, converting the input electrical signal into an acoustic signal, and then converting the acoustic signal into an electrical signal for output. The structural arrangement of the resonator ensures that the resonator has different electrical impedance for signals with different frequencies, so that transmission and reflection of different frequencies are realized, and filter characteristics are formed. In order to be able to form a filter circuit of a resonator, an inductance is an indispensable electrical element.
The inductor is used as a common radio frequency device and is mainly used for realizing multiple functions such as impedance adjustment, port matching, signal transmission, signal isolation, signal coupling and the like. The inductor comprises two main performance parameters, an inductance value L and a quality factor Q. In general, the inductance value L of the inductor is related to the physical size of the coil, and the quality factor Q of the inductor is directly related to the loss generated when an input signal flows through the inductor; when the quality factor is large, the loss generated when the signal passes through the inductor is small, and better signal transmission can be realized. When the quality factor is low, the loss of the signal on the inductance is large, and the loss is converted into heat, which has serious influence on the performance of the filter. It can be seen that the performance of the inductor is very important for the implementation of the filter. Therefore, improvement of inductance performance is very necessary.
The metal layer will generate an inductance when energized, and in combination with the implementation of the filter shown in fig. 1, it can be seen that the inductance of the filter is mainly formed in the substrate 11 (as the target inductance 3 shown in fig. 1). When the inductance value required to be integrated is large in the design requirement of the filter, the target inductance 3 has a plurality of winding coils in the substrate 11, and is disposed across the layers of the multilayer structure of the substrate 11. When the radio frequency signal passes through, under the design structure of high inductance value, the high frequency loss generated by the target inductance 3 can be multiplied by geometric level increase under the condition of smaller inductance value. At this time, the Q value of the target inductor 3 is severely deteriorated; resulting in reduced filter performance.
From the above, it can be seen that the quality factor of the inductor has a very significant effect on the insertion loss of the filter and the transmission efficiency of the signal. It is therefore important to improve the Q value of the inductance in the acoustic wave filter. In designing the filter, the inventors of the present invention have considered that the winding pattern of the target inductor 3 on the substrate 11 can be optimized to improve the quality factor of the inductor and thus the performance of the filter. For example, increasing the wire diameter of the target inductor 3, increasing the wire pitch of the target inductor 3, or increasing the wire width of the metal (target inductor 3) improves the quality factor by increasing the wire width to reduce the resistive loss. However, the inventors of the present invention have tried the above-described method, and found that the above-described method significantly increases the area occupied by the inductor; for the overall structure of the filter, the space available for the windings of the target inductor 3 is not large, and increasing the size greatly increases the overall size of the filter. The inventors of the present invention have also considered to improve the quality factor by selecting a high-resistance substrate 11 material, with a high-resistance substrate 11 material, but this increases the overall cost of designing the filter.
The above way of improving the quality factor of the inductor to improve the performance of the filter cannot meet the design size requirement of the filter, and increases the design cost; therefore, how to provide a suitable filter to improve the quality factor of the inductor, so as to improve the performance of the filter is a technical problem to be solved.
In order to improve the quality factor of the inductor (target inductor 3), the embodiment of the invention provides a further improved filter, and the purpose of effectively improving the performance of the filter is achieved by improving the setting mode and the setting structure of the target inductor 3 of the filter.
Referring to fig. 2, fig. 2 is a schematic diagram of another structure of a filter according to an embodiment of the invention.
As shown in the drawing, the filter provided by the embodiment of the invention includes:
a base 1, the base 1 comprising a substrate 11;
a sealing structure 2 connected with the substrate 1 through a metal structure 5;
the target inductor comprises a first inductor 31 and a second inductor 32, and the first inductor 31 is arranged on the sealing structure 2; the second inductor 32 is arranged on the substrate 11 of the base 1; the sum of the inductance value of the second inductor 32 and the inductance value of the first inductor 31 is equal to the inductance value of the target inductor.
The target inductance is the target inductance 3 shown in fig. 1, and the first inductance 31 and the second inductance 32 are obtained by splitting the target inductance 3.
According to the foregoing implementation structure of the filter, it is known that the sealing structure 2 of the filter is a composite structure, and therefore the first inductor 31 may be disposed on the inner metal structure of the sealing structure 2 or on the outer metal structure of the sealing structure 2, so that the first inductor 31 may act (for example, the sum of the inductance values of the first inductor 31 and the second inductor 32 may be equal to the inductance value of the target inductor).
It can be seen that in the filter provided by the embodiment of the present invention, the target inductor 3 on the substrate 11 of the base 1 shown in fig. 1 is split, so that the inductance value of the target inductor is the sum of the inductance values of the first inductor 31 and the second inductor 32; the inductance value of the second inductor 32 provided on the substrate 11 can thereby be reduced to reduce the loss of the input signal when passing through the second inductor 32 on the substrate 11. Since the total inductance value of the filter (the inductance value of the target inductance) is not changed, and the loss generated by the second inductance 32 is reduced, the quality factor of the target inductance can be improved, and the performance of the filter can be improved.
To facilitate understanding of the principles of figure of merit improvement, the following equations are described herein.
In the above formula, Q represents the value of the quality factor of the target inductance, R represents the loss generated when the input signal passes through the target inductance, L represents the inductance value of the target inductance, and f represents the operating frequency of the target inductance.
It can be seen that the quality factor of the target inductance is proportional to the inductance value of the target inductance and inversely proportional to the loss generated by the input signal as it passes through the target inductance. Based on the foregoing, it can be seen that the smaller the loss generated by the transmission signal on the inductor, the higher the quality factor of the inductor, and the better the filtering effect. Therefore, the embodiment of the invention adopts a mode of reducing the loss R of the target inductance without changing the inductance value L of the target inductance, so as to improve the filtering effect of the filter.
Since the loss R of the input signal through the inductor is related to the winding of the inductor (i.e. the size of the inductor), the size of the inductor is in turn related to the inductance value of the inductor. Therefore, in order to achieve the purpose of reducing the loss R of the target inductor and ensuring that the inductance value L of the target inductor is unchanged, the embodiment of the present invention proposes to split the target inductor, redesign the target inductor on the substrate 11 in fig. 1, which mainly generates the loss of the input signal, so as to reduce the inductance value of the target inductor to obtain the second inductor 32; meanwhile, in order to ensure that the inductance value of the target inductor is not changed, a first inductor 31 is further arranged on the sealing structure 2, so that the sum of the inductance value of the second inductor 32 and the inductance value of the first inductor 31 is equal to the inductance value of the target inductor; therefore, the inductance value of the first inductor 31 and the inductance value of the second inductor 32 are smaller than the original inductance value of the target inductor, so that the loss generated by the input signal on the substrate 11 of the base 1 can be reduced under the condition that the inductance value L of the target inductor is unchanged, the loss generated by the control input signal on the sealing structure 2 can not be overlarge, the quality factor of the target inductor is improved finally, and the effect of the filter is improved.
It can be seen that, in the filter provided by the embodiment of the present invention, the target inductance is split into the first inductance 31 and the second inductance 32; then, the second inductor 32 is arranged on the substrate 11 of the base 1, and the first inductor 31 is arranged on the sealing structure 2; that is, the two split inductors are arranged at different positions of the internal structure of the filter; further, by ensuring that the sum of the inductance value of the first inductor 31 and the inductance value of the second inductor 32 is equal to the inductance value of the target inductor, the total inductance value of the inductance values of the first inductor 31 and the second inductor 32 after the disassembly can ensure the normal application of the filter; thereby reducing the inductance value of the second inductor 32 on the substrate 11 of the base 1 without affecting the normal application of the filter. Since the performance of the inductor on the substrate 11 of the base 1 is a main factor affecting the performance of the filter, the performance of the inductor is in a direct proportion relation with the quality factor of the inductor (the quality factor of the inductor is directly related to the loss generated when the input signal flows through the inductor), that is, the smaller the loss generated when the signal flows through the inductor, the higher the quality factor of the inductor is, and the better the performance of the filter is; therefore, the loss generated by the inductor on the substrate 11 of the base 1 is positively correlated with the magnitude of the inductance value of the inductor. Based on this, the embodiment of the invention reduces the inductance value of the second inductor 32 arranged on the substrate 11 of the base 1, so that the loss generated by the second inductor 32 on the substrate 11 of the base 1 can be reduced, and the performance of the filter can be improved; in order to ensure normal application of the filter and ensure that the total inductance of the filter is not changed, the embodiment of the invention sets the first inductance 31 in the sealing structure 2 of the filter, so that the inductance value of the second inductance 32 and the inductance value of the first inductance 31 are equal to the inductance value of the target inductance (i.e. the total inductance value of the filter). Therefore, in the embodiment of the invention, the target inductor is split into the first inductor 31 and the second inductor 32, and the first inductor 31 and the second inductor 32 are arranged at different positions of the internal structure of the filter, so that the loss generated by the second inductor 32 on the substrate 11 of the substrate 1 of the filter can be reduced on the basis of not affecting the normal application of the filter, and the purpose of improving the performance of the filter is achieved.
Based on the structure of the filter shown in fig. 1 and 2, in an alternative implementation, the substrate 11 of the filter is of a multilayer structure; therefore, in order to improve the design flexibility and practicality of the filter provided by the embodiment of the present invention, in one implementation, on the basis that the substrate is a multi-layer structure, the second inductor 32 is disposed on the substrate 11 of the base 1, and includes:
the second inductor 32 is disposed on one of the layers of the multilayer structure, or the second inductor 32 is disposed on at least two layers of the multilayer structure in a cross-layer manner.
The arrangement of the second inductor 32 in the at least two layers of the multilayer structure may be as shown in fig. 2, that is, the second inductor 32 is added in the adjacent two metal layers of the substrate 11 in a cross-layer manner. Compared to the implementation of the filter shown in fig. 1, it can be seen that the target inductance is significantly reduced in size of the second inductance 32 compared to the second inductance 32. Therefore, in the filter provided by the embodiment of the invention, the inductance value of the second inductor 32 on the substrate 11 of the substrate 1 is reduced, so that the loss generated when the input signal flows through the second inductor 32 is also reduced, and the quality factor of the second inductor 32 can be improved. The mode of arranging the second inductor 32 in a cross-layer manner on at least two layers of the multi-layer structure is adopted, so that the arrangement mode of the second inductor 32 can be flexibly changed according to the design process of the filter, and the flexibility and the practicability of the arrangement of the second inductor 32 are improved.
Alternatively, the second inductor 32 may be disposed on one of the layers of the multilayer structure, where one layer of the multilayer structure may be a metal layer structure of any one layer of the substrate 11 of the base 1 in fig. 2. For example, the second inductor 32 may be disposed on the bonding pad 13, so as to adapt to the actual processing technology of the filter, so as to be compatible with the processing technology of the filter, and facilitate operation.
In other embodiments, in order to facilitate implementation of the filter manufacturing process, the first inductor 31 may also be directly disposed on the exposed metal structure outside the sealing structure 2.
With continued reference to fig. 2, the sealing structure 2 includes a first substrate 21, a second substrate 22, and a solder structure; one side of the second substrate 22 is hermetically connected to the first substrate 21, the other side of the second substrate 22 is formed with the soldering structure, and the first inductor 31 is disposed on the soldering structure.
The solder structures may be metallic materials for transmitting signals to and from the devices in the first substrate 21 and the second substrate 22 and are connected to the connection structures (e.g. pads 13) in the base 1 by means of the metallic structures 5 (e.g. metal balls). The solder structure is a plurality of flat metal structures, which are distributed and arranged regularly or irregularly, and metal connection wires can be arranged in the solder structure to form the first inductor 31.
Alternatively, the soldering structure may refer to the bonding pad 25 shown in fig. 2, and it can be seen that the bonding pad 25 is formed under the second substrate 22, that is, on the opposite side to the sealing connection with the first substrate 21; thus, when the first inductor 31 is disposed on the pad 25, the inductor 310 may be fabricated around the pad 25 during the fabrication of the pad 25 to form the first inductor 31, without adding additional process steps and costs. Of course, the first inductor 31 may also be fabricated together during the fabrication of the metal structure 5, or may be fabricated together during the fabrication of the bonding pad 27 connected to the metal structure 5, so as to be compatible with the filter fabrication process without affecting the process flow, without adding special process steps and corresponding processing costs.
In order to be compatible with the filter processing technology, without affecting the manufacture of the filter processing technology, in one embodiment, the first substrate 21 and the second substrate 22 are single-layer substrates formed by single materials or composite substrates formed by multiple materials; the material comprises any one of a semiconductor material, an inorganic material and an organic material.
By using the same materials and manufacturing structures as the manufacturing process of the filter, it is ensured that the process steps and manufacturing costs of the filter are not increased.
In order to further reduce the size of the inductors (the first inductor 31 and the second inductor 32) while improving the performance of the filter, in one embodiment, in the filter provided by the embodiment of the invention, in a direction perpendicular to the substrate 1, the first inductors 31 and the second inductors 32 are arranged in a staggered manner, so that a plane surrounded by the outline of the first inductor 31 and a plane surrounded by the outline of the second inductor 32 generate a coincident plane; and the ratio of the area of the coincident plane to the largest plane of the first inductor 31 and the second inductor 32 is 20% or more, or the ratio of the area of the coincident plane to the largest plane of the first inductor 31 and the second inductor 32 is 40% or more.
The direction perpendicular to the substrate 1 may be referred to as the direction indicated by arrow a shown in fig. 2. The first inductors 31 and the second inductors 32 are staggered, so that the first inductors 31 and the second inductors 32 have a certain staggered area, and mutual inductance is formed between the first inductors 31 and the second inductors 32. When the first inductor 31 and the second inductor 32 generate mutual inductance, one inductor generates induced electromotive force in the other inductor, and when the winding directions of the first inductor 31 and the second inductor 32 are consistent, the inductance values generated by the two inductors are mutually enhanced; when the winding directions of the first inductor 31 and the second inductor 32 are opposite, the inductance values generated by the two inductors are weakened. Therefore, in the filter provided by the embodiment of the invention, the first inductor 31 and the second inductor 32 are staggered to a certain extent in the direction perpendicular to the substrate 1, and the overlapping plane area formed by the staggering is greater than or equal to 20%, and of course, the winding mode of the first inductor 31 and the second inductor 32 which are staggered is to simultaneously adopt clockwise or anticlockwise winding, so that when the filter is electrified, the equivalent inductance value obtained by the first inductor 31 and the second inductor 32 under the action of mutual inductance is ensured to be: the inductance value of the first inductor 31, the inductance value of the second inductor 32, and the inductance value generated by the mutual inductance coefficient are added; such as shown in the following formulas.
Where M is the mutual inductance, L1 is the inductance of the first inductor 31, and L2 is the inductance of the second inductor 32.
As can be seen from the above formula, the first inductor 31 and the second inductor 32 can generate the total inductance value in a staggered manner by using the first inductor 31 and the second inductor 32Is larger than the total inductance value l1+l2 of the first inductor 31 and the second inductor 32 which are not arranged in a staggered manner. Therefore, under the influence of the mutual inductance, in order to ensure that the inductance value of the first inductor 31 and the inductance value of the second inductor 32 can be equal to the inductance value of the target inductor, the inductance values L1 and L2 of the first inductor 31 and the second inductor 32 can be further reduced, that is, the dimensions of the first inductor 31 and the second inductor 32 can be further reduced. Thereby, the quality factor of the target inductance can be improved, and the overall size of the filter can be further reduced.
In one embodiment, when the mutual inductance m=0.2, the inductance value L1 of the first inductor 31 and the inductance value L2 of the second inductor 32 may be reduced by about 10%, so that the winding lengths of the first inductor 31 and the second inductor 32 may be reduced by 10%. The inductance values of the first inductor 31 and the second inductor 32 are further reduced, so that the overall manufacturing area of the first inductor 31 and the second inductor 32 is further reduced, and the overall size of the filter is reduced; on the other hand, the reduction of the inductance values of the first inductor 31 and the second inductor 32 can further improve the quality factors of the first inductor 31 and the second inductor 32.
To ensure that the second inductor 32 is disposed on the substrate 11 of the base 1, loss generated when an input signal flows through the second inductor 32 is reduced, so as to effectively improve the quality factor of the inductor of the filter, in one embodiment, the ratio of the minimum inductance value of the inductance values of the first inductor and the second inductor to the inductance value of the target inductor is greater than or equal to 20%, or the ratio of the minimum inductance value of the inductance values of the first inductor and the second inductor to the inductance value of the target inductor is greater than or equal to 40%.
The reason for limiting the inductance values of the two split inductors is that if the inductance value of the first inductor 31 is too small, in order to ensure that the total inductance value is the inductance value of the target inductor, the inductance value of the second inductor 32 on the substrate 11 of the base 1 is set to be relatively large, so that the magnitude of the decrease of the inductance value of the second inductor 32 is insufficient, and the quality factor of the target inductor is not obviously improved; of course, if the inductance value of the second inductor 32 is too small, the inductance value of the first inductor 31 will be reduced by an insufficient amount, which affects the overall improvement of the quality factor of the target inductor. From the theoretical relationship between the target inductance and the quality factor, the improvement in the quality factor of the target inductance is most remarkable when the inductance values of the first inductor 31 and the second inductor 32 are equivalent. Therefore, in the filter provided by the embodiment of the invention, the ratio of the minimum inductance value of the first inductor 31 and the inductance value of the second inductor 32 to the inductance value of the target inductor is set to be at least greater than or equal to 20%.
In order to further secure the improvement effect of the quality factor of the target inductor, in another alternative implementation, the ratio of the minimum inductance value of the inductance values of the first inductor 31 and the second inductor 32 to the inductance value of the target inductor needs to be greater than or equal to 40%. Since the relationship between the magnitude of the inductance value and the winding length of the inductance is relatively large, the ratio of the winding length of the inductance corresponding to the minimum inductance value to the winding length of the target inductance is set to be at least 20% or more, or the ratio of the winding length of the inductance corresponding to the minimum inductance value to the winding length of the target inductance may be 40% or more.
Based on the foregoing, it can be known that, in the internal structural design of the filter, the performance of the inductor on the substrate of the base is a main factor affecting the performance of the filter, that is, the target inductor 3 shown in fig. 1 and the second inductor 32 after being split shown in fig. 2; and the performance of the inductor is related to the quality factor of the inductor, which in turn is indicative of the loss of the input signal flowing through the inductor. Therefore, in an alternative embodiment, the inductance value of the second inductor 32, which is the inductance on the substrate 11, may be set smaller than the inductance value of the first inductor 31 on the basis of ensuring that the sum of the inductance value of the first inductor 31 and the inductance value of the second inductor 32 is equal to the inductance value of the target inductor. Because the magnitude of the inductance value is related to the winding length of the inductor, the inductance value of the second inductor 32 is set to be smaller than the inductance value of the first inductor 31, so that the winding length of the coil of the second inductor 32 can be reduced, the loss generated when an input signal flows through the second inductor 32 is reduced, the quality factor of the second inductor 32 is obviously improved, and the quality factor of the overall target inductor is improved.
In some embodiments, when the self inductance value of the target inductor is smaller, the Q value of the target inductor is already high, and then the Q value of the target inductor is not obviously improved when the target inductor is split, so in the filter provided by the embodiment of the invention, the inductance value of the target inductor is greater than or equal to 0.6 nanohenry (nH), or the total length of the winding coil of the target inductor is greater than or equal to 500 micrometers.
The embodiment of the invention also provides a design method of the filter so as to realize the manufacture of the filter provided by the embodiment.
Referring to fig. 3, fig. 3 is a flow chart illustrating a design method of a filter according to an embodiment of the invention.
As shown, the process may include the steps of:
step S100, providing a base, wherein the base comprises a substrate.
The substrate is shown in fig. 2, and when the filter is used, loss generated by the inductor mainly occurs in the inductor (target inductor) provided on the substrate of the substrate.
Step S101, setting a second inductor of a target inductor on a substrate of the base, and setting a first inductor of the target inductor on a sealing structure of the filter; the sum of the inductance value of the second inductor and the inductance value of the first inductor is equal to the inductance value of the target inductor.
Splitting the target inductor into two inductors which are respectively arranged on the substrate of the base and the sealing structure, so that the effect of reducing the inductance value of the target inductor (the second inductor) on the substrate of the base can be achieved; so as to reduce the loss generated by the inductor, improve the quality factor of the inductor and improve the performance of the filter.
Since the substrate of the base is a multi-layer structure, in order to meet the steps and process flows of the filter manufacturing process, in one embodiment, the step of disposing the second inductor of the target inductor on the substrate of the base may include:
and setting a second inductor of the target inductor on one layer structure of the multilayer structure, or setting the second inductor of the target inductor in a cross-layer manner on at least two layers of the multilayer structure.
According to the actual design requirement of the filter, the setting mode of the second inductor is flexibly selected, and compatibility with the manufacturing process of the filter is realized, so that the manufacturing cost of the filter can be reduced.
In order to further realize compatibility with the manufacturing process flow of the filter, and reduce the manufacturing cost while facilitating the manufacture of the filter, in one embodiment, the first inductor may be configured according to a specific connection form of the first substrate, the second substrate and the welding structure included in the sealing structure. Optionally, one side of the second substrate is hermetically connected to the first substrate, the other side of the second substrate is formed with the welding structure, and the step of setting the first inductance of the target inductance on the sealing structure of the filter may include:
The first inductor is disposed on the welded structure.
The solder structures may be metallic materials for introducing and extracting signals from devices in the first and second substrates and are connected to the connection structures (e.g., pads) on the base through the metallic structures. The solder structure may be a plurality of flat metal structures arranged in a distributed manner, regular or irregular, and metal connection lines may be disposed in the solder structure to form the first inductor. The welding structure is an indispensable step in the filter manufacturing process, so that the first inductor is arranged in the process of manufacturing the welding structure, the arrangement of the first inductor can be facilitated, and no additional manufacturing process is added.
In one embodiment, the first substrate and the second substrate are single-layer substrates formed of a single material or composite substrates formed of multiple materials; the material comprises any one of a semiconductor material, an inorganic material and an organic material.
The first inductor can be manufactured together with the welding structure according to the manufacturing process of the filter, so that the forming materials of the first substrate and the second substrate are not affected, and the process difference and the cost difference existing when other materials are introduced are not increased; compatibility in the filter manufacturing process may be achieved.
To further reduce the dimensions of the first inductor and the second inductor to achieve a reduction in the overall size of the filter while improving the quality factor of the target inductor, in one embodiment, the step of disposing the second inductor of the target inductor on the substrate of the base and disposing the first inductor of the target inductor on the sealing structure of the filter may include:
the second inductors arranged on the substrate and the first inductors arranged on the sealing structure are arranged in a staggered mode in the direction perpendicular to the base, so that a plane surrounded by the outline of the first inductors and a plane surrounded by the outline of the second inductors generate a superposition plane; and the ratio of the area of the coincident plane to the largest plane of the first inductor and the second inductor is greater than or equal to 20%, or the ratio of the area of the coincident plane to the largest plane of the first inductor and the second inductor is greater than or equal to 40%.
Based on the foregoing, it can be seen that when the winding patterns are the same between two opposite and staggered inductorsNamely, the winding mode of the first inductor and the winding direction of the second inductor are both clockwise or anticlockwise, and at the moment, mutual inductance is generated between the first inductor and the second inductor; therefore, under the condition of mutual inductance, the inductance value generated by the first inductor and the second inductor is higher than the sum of the inductance values of the first inductor and the second inductor; that is, under the mutual inductance condition, the inductance value generated by the first inductor and the second inductor The inductance value L1+L2 generated by the first inductor and the second inductor under the condition of no mutual inductance is larger than that generated; and because the inductance value of the inductor is positively correlated with the winding length of the inductor, namely the size of the inductor, the size of the first inductor and the second inductor can be further reduced under the condition that the first inductor and the second inductor generate mutual inductance in a staggered mode, so that the overall size of the filter is reduced.
In other embodiments, to ensure that the splitting of the first inductor and the second inductor can improve the quality factor of the target inductor, the ratio of the minimum inductance value of the first inductor and the inductance value of the second inductor to the inductance value of the target inductor is greater than or equal to 20%, or the ratio of the minimum inductance value of the first inductor and the inductance value of the second inductor to the inductance value of the target inductor is greater than or equal to 40%.
The inductance values of the two inductors (the first inductor and the second inductor) are limited, because if the inductance value of the first inductor is too small, in order to ensure that the total inductance value is the inductance value of the target inductor, the inductance value of the second inductor arranged on the substrate of the base is increased, so that the decrease amplitude of the inductance value of the second inductor is insufficient, and the quality factor of the target inductor is not obviously improved; if the inductance value of the second inductor is too small, the inductance value of the first inductor is also reduced by an insufficient extent, which affects the overall improvement of the quality factor of the target inductor. Therefore, in the filter provided by the embodiment of the invention, the ratio of the minimum inductance value of the first inductor and the inductance value of the second inductor to the inductance value of the target inductor is set to be at least greater than or equal to 20%.
Of course, in order to ensure that the split design of the target inductor is meaningful and practical in the design method of the filter provided by the embodiment of the present invention, in one embodiment, the inductance value of the target inductor is greater than or equal to 0.6 nanohenry (nH), or the total length of the winding coil of the target inductor is greater than or equal to 500 micrometers.
And step S102, connecting the sealing structure with the substrate through a metal structure.
In the design method of the filter provided by the embodiment of the invention, the target inductance is split into the first inductance and the second inductance; then, the second inductor is arranged on the substrate of the base, and the first inductor is arranged on the sealing structure; that is, the two split inductors are arranged at different positions of the internal structure of the filter; further, the sum of the inductance value of the first inductor and the inductance value of the second inductor is ensured to be equal to the inductance value of the target inductor, so that the total inductance value of the inductance values of the first inductor and the second inductor after splitting can ensure that the filter is normally applied; thereby reducing the inductance value of the second inductor on the substrate of the base without affecting the normal application of the filter. Since the performance of the inductor on the base substrate is a main factor affecting the performance of the filter, the performance of the inductor is in a direct proportion relation with the quality factor of the inductor (the quality factor of the inductor is directly related to the loss generated when the input signal flows through the inductor), that is, the smaller the loss generated when the signal flows through the inductor, the higher the quality factor of the inductor is, and the better the performance of the filter is; therefore, the loss generated by the inductor on the base substrate is positively correlated to the magnitude of the inductance value of the inductor. Based on the above, the embodiment of the invention reduces the inductance value of the second inductor arranged on the base substrate, thereby reducing the loss generated by the second inductor on the base substrate and improving the performance of the filter; in order to ensure normal application of the filter and ensure that the total inductance of the filter is not changed, the embodiment of the invention sets the first inductance in the sealing structure of the filter, so that the inductance value of the second inductance and the inductance value of the first inductance are equal to the inductance value of the target inductance (namely, the total inductance value of the filter). Therefore, the embodiment of the invention splits the target inductor into the first inductor and the second inductor, and the first inductor and the second inductor are arranged at different positions of the internal structure of the filter, so that the loss generated by the second inductor on the base substrate of the filter can be reduced on the basis of not affecting the normal application of the filter, and the purpose of improving the performance of the filter is achieved.
For convenience in explaining the effect of the filter provided by the embodiment of the present invention, please refer to fig. 4-7, fig. 4 is a graph of the relationship between the inductance value and the quality factor of the target inductor in the filter shown in fig. 1, fig. 5 is a graph of the relationship between the inductance value and the quality factor of the second inductor in the filter shown in fig. 2, fig. 6 is a graph of the relationship between the inductance value and the quality factor of the first inductor in the filter shown in fig. 2, and fig. 7 is a schematic diagram of the insertion loss effect of the filter shown in fig. 2.
The abscissa shown in fig. 4 represents the frequency (GHz) at which the filter operates, the ordinate on the left side represents the inductance value (nH) of the target inductance, and the ordinate on the right side represents the Q value (quality factor) of the inductance; the curve A1 represents the Q value diagram of the target inductance, and A2 represents the inductance value diagram of the target inductance.
Taking the reference value of the target inductance at the position shown by the vertical dashed line in fig. 4 as an example, when the frequency of the filter operation is 6.7GHz, the inductance value of the target inductance is about 1.65nH, and the Q value of the target inductance is about 44.
The abscissa shown in fig. 5 represents the frequency (GHz) at which the filter operates, the ordinate on the left side represents the inductance value (nH) of the target inductance, and the ordinate on the right side represents the Q value (quality factor) of the inductance; the curve B1 represents the schematic Q value of the second inductor, and the curve B2 represents the schematic Q value of the second inductor. The abscissa shown in fig. 6 represents the frequency (GHz) at which the filter operates, the ordinate on the left side represents the inductance value (nH) of the target inductance, and the ordinate on the right side represents the Q value (quality factor) of the inductance; the curve C1 represents the schematic Q value of the first inductor, and C2 represents the schematic Q value of the first inductor.
For comparing the effect with the filter which is not designed for splitting the target inductance shown in fig. 4, in the filters provided by the embodiments of the present invention shown in fig. 5 and 6, the inductance value and Q value corresponding to the position of 6.7GHz are selected as well. It can be seen that, in the schematic diagram shown in fig. 5, the inductance value of the second inductor is about 0.73nH and the Q value is about 115 at a frequency of 6.7 GHz. In the schematic diagram shown in fig. 6, the inductance value of the first inductor is about 0.87nH and the Q value is about 108 at a frequency of 6.7 GHz.
In the filter provided by the embodiment of the invention, the target inductor is split into the first inductor and the second inductor, so that the sum of the inductance value of the first inductor and the inductance value of the second inductor is equal to the inductance value of the target inductor, and the inductance value of the first inductor and the inductance value of the second inductor are smaller than the inductance value of the target inductor; in order to significantly improve the quality factor of the inductor (second inductor) on the substrate, in one embodiment of the present invention, the inductance value of the second inductor is set smaller than the inductance value of the first inductor in the filter provided by the embodiment of the present invention, as shown in fig. 5 and 6, at 6.7GHz, the inductance value of the second inductor is 0.73nH, and the inductance value of the first inductor is 0.87nH; the sum of the inductance value of the first inductor and the inductance value of the second inductor is about 1.6nH, which is approximately equal to the inductance value of the target inductor shown in fig. 4, which is equal to the inductance value of the target inductor shown in fig. 4. The loss of the first inductor and the second inductor of the filter provided by the embodiment of the invention can be obtained according to the formula, as follows:
The loss R1 of the first inductor is R1=2pi f L1/Q1; wherein L1 is an inductance value 0.87 of the first inductor shown in fig. 6, and Q1 is a Q value 108 of the second inductor shown in fig. 6; according to the formula, the loss R1 of the first inductor is 0.343. Similarly, the loss R2 of the second inductor can be obtained as r2=2pi f×l2/Q2; wherein L2 is the inductance value 0.73 of the second inductor shown in fig. 5, and Q2 is the Q value 115 of the second inductor shown in fig. 5; the loss R2 of the second inductance is 0.267 according to the above formula.
Therefore, in the arrangement manner of splitting the target inductor into the first inductor and the second inductor provided by the embodiment of the invention, after the loss of the first inductor and the second inductor is obtained, it may be further determined that the total quality factor, i.e. the Q value (i.e. the quality factor of the target inductor) achieved by combining the first inductor and the second inductor is:
Qe＝2πf*(L1+L2)/(R1+R2)＝110；
wherein Qe represents the total Q value achieved by splitting the first inductor and the second inductor provided by the embodiment of the present invention.
It can be seen that, compared with the Q value 44 corresponding to the target inductance when the target inductance is not split in the filter without the split design of the target inductance shown in fig. 4, the Q value 110 generated by the filter with the split design of the target inductance according to the embodiment of the invention is significantly improved.
The schematic diagram of insertion loss effect of the filter shown in fig. 7 includes that when a target inductance on a substrate of a base is set by means of a combined inductance (a first inductance and a second inductance), the effect of Q value of the filter on insertion loss of the filter after the Q value of the filter is raised is achieved; and the effect of the insertion loss of the filter when the split design is not performed on one target inductance on the substrate. Wherein the abscissa is frequency in Hz; the ordinate is insertion loss in decibels (dB).
In fig. 7, a curve D1 represents the insertion loss of the filter provided by the embodiment of the present invention, and a curve D2 represents the insertion loss of the basic filter; it can be seen that the insertion loss of the filter provided by the embodiment of the invention is obviously improved by 0.1-0.15 dB.
The embodiment of the invention also provides communication equipment, which comprises the filter in the previous embodiment.
The foregoing describes several embodiments of the present invention, and the various alternatives presented by the various embodiments may be combined, cross-referenced, with each other without conflict, extending beyond what is possible embodiments, all of which are considered to be embodiments of the present invention disclosed and disclosed.
Although the embodiments of the present invention are disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (14)
1. A filter, comprising:
a base, the base comprising a substrate;
the sealing structure is connected with the base through a metal structure, and the first substrate and the second substrate form the sealing structure;
the target inductor comprises a first inductor and a second inductor, wherein the first inductor is arranged below the second substrate and is arranged on one side, which is not in sealing connection with the first substrate, of the second substrate; the second inductor is arranged on the substrate of the base; the sum of the inductance value of the second inductor and the inductance value of the first inductor is equal to the inductance value of the target inductor.
2. The filter of claim 1, wherein the substrate is a multilayer structure; the substrate of the second inductor arranged on the base comprises:
the second inductor is arranged on one layer of the multilayer structure, or the second inductor is arranged on at least two layers of the multilayer structure in a cross-layer manner.
3. The filter of claim 1, wherein the sealing structure comprises a first substrate, a second substrate, and a soldering structure, one side of the second substrate is in sealing connection with the first substrate, the soldering structure is formed on the other side of the second substrate, and the first inductor is disposed on the soldering structure.
4. A filter according to claim 3, wherein the first substrate and the second substrate are single-layer substrates formed of a single material or composite substrates formed of a plurality of materials; the material comprises any one of a semiconductor material, an inorganic material and an organic material.
5. The filter of any of claims 1-4, wherein the first inductor and the second inductor are arranged in a staggered manner in a direction perpendicular to the substrate such that a plane defined by the contour of the first inductor and a plane defined by the contour of the second inductor produce a coincident plane; and the ratio of the area of the coincident plane to the largest plane of the first inductor and the second inductor is greater than or equal to 20%, or the ratio of the area of the coincident plane to the largest plane of the first inductor and the second inductor is greater than or equal to 40%.
6. The filter of any of claims 1-4, wherein a ratio of a minimum of the inductance values of the first and second inductors to the inductance value of the target inductor is greater than or equal to 20%, or wherein a ratio of a minimum of the inductance values of the first and second inductors to the inductance value of the target inductor is greater than or equal to 40%.
7. The filter of any of claims 1-4, wherein the target inductance has an inductance value greater than or equal to 0.6 nanohenry, or the total length of the wound coil of the target inductance is greater than or equal to 500 microns.
8. A method of designing a filter, comprising:
providing a substrate, wherein the substrate comprises a substrate;
a second inductor of a target inductor is arranged on a substrate of the base, a first substrate and a second substrate form a sealing structure of the filter, the first inductor of the target inductor is arranged on the sealing structure of the filter and is arranged below the second substrate, and one side of the second substrate which is not in sealing connection with the first substrate is arranged below the second substrate; the sum of the inductance value of the second inductor and the inductance value of the first inductor is equal to the inductance value of the target inductor;
And connecting the sealing structure with the substrate through a metal structure.
9. The method for designing a filter according to claim 8, wherein the substrate has a multilayer structure, the second inductor of the target inductor is provided on the substrate of the base, comprising:
and setting a second inductor of the target inductor on one layer of the multilayer structure, or setting the second inductor of the target inductor on at least two layers of junctions of the multilayer structure in a crossing way.
10. The method for designing a filter according to claim 8, wherein the sealing structure includes a first substrate, a second substrate, and a solder structure, one side of the second substrate is hermetically connected to the first substrate, and the other side of the second substrate is formed with the solder structure; the step of setting the first inductor of the target inductor on the sealing structure of the filter comprises the following steps:
the first inductor is disposed on the welded structure.
11. The method of designing a filter according to claim 10, wherein the first substrate and the second substrate are single-layer substrates formed of a single material or composite substrates formed of a plurality of materials; the material comprises any one of a semiconductor material, an inorganic material and an organic material.
12. The method for designing a filter according to any one of claims 8 to 11, wherein the step of providing the second inductance of the target inductance on the substrate of the base and the step of providing the first inductance of the target inductance on the sealing structure of the filter includes:
the second inductors arranged on the substrate and the first inductors arranged on the sealing structure are arranged in a staggered mode in the direction perpendicular to the base, so that a plane surrounded by the outline of the first inductors and a plane surrounded by the outline of the second inductors generate a superposition plane; and the ratio of the area of the coincident plane to the largest plane of the first inductor and the second inductor is greater than or equal to 20%, or the ratio of the area of the coincident plane to the largest plane of the first inductor and the second inductor is greater than or equal to 40%.
13. The method according to any one of claims 8 to 11, wherein a ratio of a minimum inductance value of the first inductance and the inductance value of the second inductance to an inductance value of the target inductance is 20% or more, or a ratio of a minimum inductance value of the first inductance and the inductance value of the second inductance to an inductance value of the target inductance is 40% or more.
14. A communication device comprising a filter according to any of claims 1-7.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9647634B2 (en) * | 2012-09-25 | 2017-05-09 | Murata Manufacturing Co., Ltd. | Elastic wave filter device and duplexer comprising magnetically coupled inductances |
| CN109314096A (en) * | 2016-06-22 | 2019-02-05 | 高通股份有限公司 | Stack substrate inductor |
| CN111740722A (en) * | 2020-08-05 | 2020-10-02 | 安徽安努奇科技有限公司 | Filter and radio frequency communication device |
| CN113411091A (en) * | 2021-07-30 | 2021-09-17 | 广州慧智微电子有限公司 | Signal receiving device, method and storage medium |
| CN114497369A (en) * | 2022-01-21 | 2022-05-13 | 苏州汉天下电子有限公司 | Semiconductor device structure and filter |
| CN114629463A (en) * | 2021-12-27 | 2022-06-14 | 厦门云天半导体科技有限公司 | Fan-out type filter chip packaging structure of integrated inductor and manufacturing method thereof |
| CN217159667U (en) * | 2022-02-14 | 2022-08-09 | 武汉光钜微电子有限公司 | Filter, duplexer, and multiplexer |
-
2023
- 2023-03-13 CN CN202310260448.6A patent/CN116248071B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9647634B2 (en) * | 2012-09-25 | 2017-05-09 | Murata Manufacturing Co., Ltd. | Elastic wave filter device and duplexer comprising magnetically coupled inductances |
| CN109314096A (en) * | 2016-06-22 | 2019-02-05 | 高通股份有限公司 | Stack substrate inductor |
| CN111740722A (en) * | 2020-08-05 | 2020-10-02 | 安徽安努奇科技有限公司 | Filter and radio frequency communication device |
| CN113411091A (en) * | 2021-07-30 | 2021-09-17 | 广州慧智微电子有限公司 | Signal receiving device, method and storage medium |
| CN114629463A (en) * | 2021-12-27 | 2022-06-14 | 厦门云天半导体科技有限公司 | Fan-out type filter chip packaging structure of integrated inductor and manufacturing method thereof |
| CN114497369A (en) * | 2022-01-21 | 2022-05-13 | 苏州汉天下电子有限公司 | Semiconductor device structure and filter |
| CN217159667U (en) * | 2022-02-14 | 2022-08-09 | 武汉光钜微电子有限公司 | Filter, duplexer, and multiplexer |
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| CN116248071A (en) | 2023-06-09 |
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