CN116246986A - Package with exposed lead frame and manufacturing method thereof - Google Patents
Package with exposed lead frame and manufacturing method thereof Download PDFInfo
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- CN116246986A CN116246986A CN202310518419.5A CN202310518419A CN116246986A CN 116246986 A CN116246986 A CN 116246986A CN 202310518419 A CN202310518419 A CN 202310518419A CN 116246986 A CN116246986 A CN 116246986A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a package with an exposed lead frame and a manufacturing method thereof, wherein the method comprises the steps of obtaining a half-package lead frame after plastic package; wherein the second side of the half-package lead frame is fully exposed and the first side is partially exposed; performing half cutting on the second side of the half-package lead frame according to a preset cutting position to obtain a half-cut lead frame with exposed side pins; tinning the outer surfaces of all exposed areas of the half-cut lead frame to obtain a tinned lead frame; and performing half-cutting on the first side of the tinned lead frame according to the preset cutting position, so that the tinned lead frame is cut off at the preset cutting position, and a target package is obtained. The side pins of the packaging piece manufactured by the method are provided with the tin plating layer, so that oxidation of the side pins of the device can be effectively prevented, the side pins after welding can fully climb tin, and the welding quality requirement of high-reliability electronic products can be met.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to a packaging piece with an exposed lead frame and a manufacturing method thereof.
Background
Among some specific Package types of devices, for example, QFN (Quad Flat No-lead Package) devices and DFN (Double Flat No-lead Package, extended Package belonging to QFN Package) devices, lead frames thereof are exposed, and because of this, these devices can provide excellent electrical performance and heat dissipation performance through the exposed lead frames, and thus are widely used in integrated circuits.
These devices with exposed lead frames, after package fabrication, have pins distributed on either sides (i.e., DFN type packages) or four sides (i.e., QFN type packages) of the package and have a rectangular overall appearance. The manufacturing method of the packaging piece is mainly completed in a grinding wheel blade cutting mode, namely, a lead frame is used as a carrier, after the back of a chip is plated with tin, the grinding wheel blade is used for cutting according to fixed steps, and a single device is obtained.
However, in the packaging manufacturing process, the side pins of the packaged package body are not subjected to tin plating treatment, the side pins of the device are directly exposed to the air without tin protection, if the side pins are exposed to the air for a long time, particularly in an environment with high humidity, the side pins are very easy to oxidize, an oxide film formed by oxidation can obstruct the infiltration between soldering tin and the pins, the component of the soldering tin is difficult to damage the oxide film, and the oxide film can finally lead the side pins to be incapable of being plated with tin or insufficient in tin climbing height, so that the quality requirement of a high-reliability electronic product cannot be met.
Disclosure of Invention
In view of this, the present invention provides a package with an exposed lead frame and a method for manufacturing the same, so as to solve the problem that in the prior art, in the package manufacturing process, the side pins cannot be plated with tin or the tin climbing height is insufficient, and thus the quality requirement of the high-reliability electronic product cannot be met.
The invention provides a manufacturing method of a package with an exposed lead frame, which comprises the following steps:
obtaining a half-package lead frame after plastic package; wherein the second side of the half-package lead frame is fully exposed and the first side is partially exposed;
performing half cutting on the second side of the half-package lead frame according to a preset cutting position to obtain a half-cut lead frame with exposed side pins;
tinning the outer surfaces of all exposed areas of the half-cut lead frame to obtain a tinned lead frame;
and performing half-cutting on the first side of the tinned lead frame according to the preset cutting position, so that the tinned lead frame is cut off at the preset cutting position, and a target package is obtained.
Optionally, the obtaining the encapsulated semi-encapsulated lead frame includes:
providing a component to be packaged and a lead frame carrier;
attaching the component to be packaged to the first side of the lead frame carrier according to preset mounting parameters;
according to preset bonding parameters, bonding wires are adopted to electrically connect the leading-out ends of the components to be packaged with the leading-out ends of the lead frame carrier, so that a lead frame to be molded is formed;
injection molding is carried out on the lead frame to be subjected to plastic packaging according to preset plastic packaging parameters to form a plastic packaging body which enables the first side of the lead frame carrier and the component to be packaged to be subjected to plastic packaging, and the semi-packaged lead frame after plastic packaging is obtained;
the second side of the lead frame carrier is exposed, and the first side is exposed except for the area of the plastic package body.
Optionally, the preset plastic package parameters include an injection molding thickness, a mold closing pressure, an injection molding pressure and an injection molding time.
Optionally, the mold closing pressure ranges from 20 to 50 tons, and/or the injection pressure ranges from 0.8 to 1.2 tons, and/or the injection time ranges from 7 to 15 seconds.
Optionally, the performing half-cutting on the second side of the half-package lead frame according to the preset cutting position to obtain a half-cut lead frame with exposed side pins includes:
manufacturing a cutting positioning mark on the semi-packaging lead frame in advance based on the preset cutting position;
identifying the cutting positioning mark, generating a first cutting path according to the cutting positioning mark, and presetting a first preset cutting parameter;
and according to the first cutting path and the first preset cutting parameters, performing half cutting on the second side of the half-package lead frame, so that the lead frame carrier on the second side of the half-package lead frame is cut off, and the plastic package body on the first side of the half-package lead frame is not cut off, thereby obtaining the half-cut lead frame with exposed side pins.
Optionally, the performing half-cutting on the first side of the tin-plated lead frame according to the preset cutting position, so that the tin-plated lead frame is located at the preset cutting position and is cut off, to obtain a target package, including:
generating a second cutting path according to the cutting positioning mark, and presetting a second preset cutting parameter;
and according to the second cutting path and the second preset cutting parameters, performing half cutting on the first side of the tinned lead frame, so that the tinned lead frame positioned at the preset cutting position is cut off from the plastic package body to the lead frame carrier, and the target package piece is obtained.
Optionally, the first preset cutting parameter and the second preset cutting parameter each include a cutting speed and a cutting depth.
Optionally, the number of the target packages is one or more.
Optionally, after the obtaining the target package, the method further includes:
providing a circuit to be soldered of the target package;
and performing electrical property test on the target packaging piece, and welding the target packaging piece passing the electrical property test and the circuit to be welded together.
In addition, the invention also provides a package with the exposed lead frame, which is manufactured by adopting the manufacturing method.
The invention has the beneficial effects that: firstly, a half-packaged lead frame after plastic packaging is obtained, and a half-cut lead frame exposing side pins is obtained by performing half-cutting on the exposed second side surface, and the half-cut lead frame is still an integral body because the first side surface of the half-packaged lead frame is not cut; then, tinning is carried out on the outer surfaces of all the exposed areas of the half-cut lead frame, so that the surfaces of the exposed side pins are also tinned, and a tinned lead frame is obtained; finally, performing secondary half-cutting on the first side of the tinned lead frame, so that the tinned lead frame is cut off at a preset cutting position, and a single target packaging piece can be obtained; compared with the traditional device with tin-free side pins obtained by one-time cutting, the circuit with the tin plating layer on the side pins can effectively prevent oxidation of the side pins of the device, and the welded side pins can fully climb tin, so that the welding quality requirement of high-reliability electronic products can be met.
Drawings
The features and advantages of the present invention will be more clearly understood by reference to the accompanying drawings, which are illustrative and should not be construed as limiting the invention in any way, in which:
fig. 1 is a flowchart of a method for manufacturing a package with an exposed lead frame according to a first embodiment of the present invention;
fig. 2 shows a cross-sectional view of a half-encapsulated leadframe after plastic encapsulation in accordance with a first embodiment of the present invention;
fig. 3 shows a cross-sectional view of a half-cut lead frame obtained after a first half-cut in a first embodiment of the present invention;
fig. 4 is a cross-sectional view showing a tin-plated lead frame obtained after a tin plating treatment in the first embodiment of the present invention;
fig. 5 shows a cross-sectional view of a tin-plated lead frame through a second half cut in accordance with a first embodiment of the invention;
fig. 6 shows a cross-sectional view of the target package obtained in the first embodiment of the present invention.
Reference numerals illustrate:
1. and the component to be packaged comprises 2 parts of plastic package body, 3 parts of lead frame carrier, 4 parts of first cutting groove, 5 parts of tin layer, 6 parts of second cutting groove, 7 parts of bonding wire.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
The package with exposed lead frame and the manufacturing method thereof can be applied to devices with exposed lead frames on the sides of packages such as QFN, DFN and the like, and for convenience of explanation, the embodiment takes the QFN packaged devices as an example for explanation.
Example 1
A method for manufacturing a package with an exposed lead frame, as shown in fig. 1, includes the following steps:
s1: obtaining a half-package lead frame after plastic package; wherein the second side of the half-package lead frame is fully exposed and the first side is partially exposed;
s2: performing half cutting on the second side of the half-package lead frame according to a preset cutting position to obtain a half-cut lead frame with exposed side pins;
s3: tinning the outer surfaces of all exposed areas of the half-cut lead frame to obtain a tinned lead frame;
s4: and performing half-cutting on the first side of the tinned lead frame according to the preset cutting position, so that the tinned lead frame is cut off at the preset cutting position, and a target package is obtained.
In the embodiment, firstly, the half-packaged lead frame after plastic packaging is obtained, and firstly, half-cutting is carried out on the exposed second side face of the half-packaged lead frame for one time to obtain the half-cut lead frame with the exposed side face pins; then, tinning is carried out on the outer surfaces of all the exposed areas of the half-cut lead frame, so that the surfaces of the exposed side pins are also tinned, and a tinned lead frame is obtained; finally, performing secondary half-cutting on the first side of the tinned lead frame, so that the tinned lead frame is cut off at a preset cutting position, and a single target packaging piece can be obtained; compared with the traditional device with tin-free side pins obtained by one-time cutting, the circuit with the tin plating layer on the side pins can effectively prevent oxidation of the side pins of the device, and the welded side pins can fully climb tin, so that the welding quality requirement of high-reliability electronic products can be met.
Specifically, as shown in fig. 2, a cross-sectional view of a half-encapsulated lead frame after plastic encapsulation in this embodiment includes a component 1 to be encapsulated, a plastic encapsulation body 2, a lead frame carrier 3 and bonding wires 7, wherein the upper side of the lead frame carrier 3 is a first side, and the lower side is a second side, so that the component 1 to be encapsulated is attached to the first side of the lead frame carrier 3, the plastic encapsulation body 2 is plastic encapsulated on the first side of the lead frame carrier 3, and covers the component 1 to be encapsulated, the first side of the lead frame carrier 3 is exposed except for an area where the plastic encapsulation body 2 is opened, and the second side of the lead frame carrier 3 is completely exposed; the lead frame carrier 3 is electrically connected with the component 1 to be packaged by bonding wires 7.
As shown in fig. 2, since the lead frame carrier 3 is made of copper alloy, the lead frame carrier 3 has a certain thickness (typically 0.203 mm), and since the first side is exposed except the area where the plastic package 2 is opened and the second side is exposed, the outer surfaces of the left and right sides (i.e., the thickness direction of the lead frame) are exposed. For ease of illustration, the left side of the leadframe carrier 3 is referred to as the third side and the right side is referred to as the fourth side, and the third side and the fourth side of the leadframe carrier 3 of the half-package leadframe are also exposed.
The component 1 to be packaged comprises components such as a chip, an inductor, a capacitor and the like, and the plastic package body 2 is made of plastic package resin.
Preferably, S1 comprises:
s11: providing a component to be packaged and a lead frame carrier;
s12: attaching the component to be packaged to the first side of the lead frame carrier according to preset mounting parameters;
s13: according to preset bonding parameters, bonding wires are adopted to electrically connect the leading-out ends of the components to be packaged with the leading-out ends of the lead frame carrier, so that a lead frame to be molded is formed;
s14: injection molding is carried out on the lead frame to be subjected to plastic packaging according to preset plastic packaging parameters to form a plastic packaging body which enables the first side of the lead frame carrier and the component to be packaged to be subjected to plastic packaging, and the semi-packaged lead frame after plastic packaging is obtained;
the second side of the lead frame carrier is exposed, and the first side is exposed except for the area of the plastic package body.
According to the steps, components to be packaged are respectively mounted on the lead frame carrier, and the plastic package body is formed by injection molding, so that the core part of the integrated circuit product packaged in QFN and other types can be manufactured, and the functionality of the integrated circuit product is ensured.
The preset chip mounting parameters comprise chip mounting positions, chip mounting types (including normal mounting and flip chip mounting) and the like; the lead-out end of the component to be packaged is electrically connected with the lead-out end of the lead frame carrier by adopting bonding wires, so that the electrical conduction of the whole semi-packaged lead frame can be ensured, and the normal realization of the functions of the semi-packaged lead frame is facilitated; the preset die attach parameters and the preset bonding parameters according to which the electrical connection is performed are determined according to the design of the specific integrated circuit, which is not limited in this embodiment.
Preferably, the preset plastic package parameters include injection thickness, mold closing pressure, injection pressure and injection time.
Specifically, the die clamping pressure ranges from 20 to 50 tons.
Specifically, the injection pressure ranges from 0.8 to 1.2ton.
Specifically, the injection molding time ranges from 7 s to 15s.
The injection thickness refers to the thickness of the plastic package 2 finally formed in fig. 2, depending on the specific integrated circuit design; the clamping pressure refers to the maximum clamping force applied to a mold by a clamping mechanism adopted in the injection molding process, and reflects the size of a product which can be processed by the injection molding machine to a certain extent; the injection molding pressure is provided by an injection molding machine hydraulic system, the pressure of a hydraulic cylinder is transmitted to injection molding melt through an injection molding machine screw, the plastic melt enters a main runner of a mold through a nozzle under the pushing of the pressure, and is injected into a mold cavity through a winding port to complete injection molding, and the pressure of the hydraulic cylinder is the injection molding pressure; the injection molding time refers to the time taken for the entire injection molding process.
Through the preset plastic package parameters in the range, a plastic package body which meets the actual requirement can be formed, the component to be packaged and the lead frame carrier are plastic packaged together, and a device foundation is provided for the subsequent packaging manufacturing process.
Of course, the preset plastic package parameters of the present embodiment may also include other parameters, such as injection molding temperature, injection molding amount, and the like. The specific operation methods of the above-mentioned mounting in S12, wire bonding in S13 and injection molding in S14 all adopt the existing conventional operation methods, and the specific details thereof are not described here again.
Preferably, S2 comprises:
s21: manufacturing a cutting positioning mark on the semi-packaging lead frame in advance based on the preset cutting position;
s22: identifying the cutting positioning mark, generating a first cutting path according to the cutting positioning mark, and presetting a first preset cutting parameter;
s23: and according to the first cutting path and the first preset cutting parameters, performing half cutting on the second side of the half-package lead frame, so that the lead frame carrier on the second side of the half-package lead frame is cut off, and the plastic package body on the first side of the half-package lead frame is not cut off, thereby obtaining the half-cut lead frame with exposed side pins.
The preset cutting position is a cutting position which is preset on the semi-packaging lead frame in advance, in the actual manufacturing process, the cutting positioning mark is manufactured on the semi-packaging lead frame based on the preset cutting position, the cutting positioning mark is convenient to automatically acquire and identify subsequently, the first cutting path and the second cutting path are automatically generated, and the efficiency and the precision of the twice cutting process can be effectively improved by combining the preset first preset cutting parameter and the preset second preset cutting parameter, so that the manufacturing efficiency of the whole packaging piece is improved.
In this embodiment, the cutting positioning mark is obtained and identified, and the position corresponding to the cutting positioning mark can be identified by using a machine vision method, and then a path planning algorithm (which may use the existing conventional algorithm) is used to obtain the first cutting path and the second cutting path respectively. The cutting positioning marks can be identifiable marks such as T-shaped marks and cross-shaped marks on the semi-packaging lead frame, so that the first cutting path and the second cutting path can be conveniently obtained respectively, the cutting positioning marks can be manufactured on the outer surface of the lead frame carrier on the first side of the semi-packaging lead frame and the outer surface of the plastic package body on the second side of the semi-packaging lead frame respectively, and the cutting positioning marks on the two outer surfaces correspond to each other in position.
Specifically, the first preset cutting parameters include a cutting speed and a cutting depth.
In this embodiment, the cutting speed in the first preset cutting parameter refers to the feeding speed of the cutting machine, and the range of the cutting speed is 10-40 mm/s; the cutting depth in the first preset cutting parameter refers to the depth of cutting into the second side of the lead frame carrier, and the range of the cutting depth is 0.21-0.25 mm, which is slightly larger than the thickness of the lead frame carrier, so as to ensure that the lead frame carrier is cut.
Of course, the first preset cutting parameters in this embodiment may further include a cutting width (which refers to a width of a first cutting groove formed by one-half cutting, and may depend on a specific circuit design) and a spindle rotation speed of the cutting machine, where the spindle rotation speed ranges from 20 to 40krpm.
The cross-sectional view of the half-cut lead frame obtained in this embodiment is shown in fig. 3, and the plastic package body 2 in the half-cut lead frame is still complete and still can support the entire half-packaged lead frame, and 4 in fig. 3 is the first cutting groove formed after one half-cut.
Preferably, the present embodiment S3 includes:
and (3) adopting a chemical tinning method to carry out tinning treatment on the outer surfaces of all the exposed areas of the half-cut lead frame.
Through the tin plating treatment, the tin plating layer on the side surface pins can be ensured, the oxidation of the side surface pins of the device can be effectively prevented, the tin can be fully climbed on the welded side surface pins, and the welding quality requirement of high-reliability electronic products can be met.
In the electroless zinc plating process described above, the electroless zinc plating is performed using a tin plating solution, and the process is based on the electroless plating principle, in which a reducing agent in the tin plating solution provides electrons to reduce and deposit plated metal ions on the target surface (i.e., the outer surfaces of all exposed areas of all half-cut lead frames). As shown in fig. 4, 5 denotes a tin layer, and the tin layer 5 is plated on the outer surface of the region of the half-cut lead frame except the plastic package 2 on the first side, the second side, the third side and the fourth side.
Preferably, S4 comprises:
s41: generating a second cutting path according to the cutting positioning mark, and presetting a second preset cutting parameter;
s42: and according to the second cutting path and the second preset cutting parameters, performing half cutting on the first side of the tinned lead frame, so that the tinned lead frame positioned at the preset cutting position is cut off from the plastic package body to the lead frame carrier, and the target package piece is obtained.
Through the second half cutting, the whole tinned lead frame is cut into a single target packaging piece, and mass production of high-reliability electronic products is facilitated on the basis of effectively preventing side pins from oxidizing and ensuring sufficient tin climbing.
Specifically, the method for acquiring the second cutting path is the same as the method for acquiring the first cutting path. The second preset cutting parameters are also similar to the first preset cutting parameters, including cutting speed and cutting depth. The cutting speed may be the same as the cutting speed in the first preset cutting parameter; the cutting depth in the second preset cutting parameters refers to the depth of cutting into the second side plastic package body of the semi-encapsulated lead frame, so that the plastic package body is cut off, the grinding wheel of the cutting machine is not contacted with the tin layer on the outer surface of the second side, the tin layer is prevented from being damaged, and the range of the cutting depth can be slightly larger than the thickness of the plastic package body. Because the thickness of the plastic package of each circuit product is different, the cutting depth in the second preset cutting parameters of different circuit products can be set and adjusted according to the design of the specific circuit product.
The specific operation process of the first half-cutting and the second half-cutting can adopt a conventional operation method, and specific details are not repeated here.
In this embodiment, the second half-cut cross-section of the tin-plated lead frame is shown in fig. 5, 6 in fig. 5 refers to a second cutting groove formed by the second half-cut, and the tin-plated lead frame is cut at the same preset cutting positions on the upper and lower sides, so that the first cutting groove and the second cutting groove form a whole, and a plurality of target packages are finally formed through the two half-cuts.
Specifically, the number of the target packages in this embodiment is one or more.
One or more target packages are manufactured, so that the mass production of power chip packages can be realized, and the production efficiency of a production line is improved.
The cross-sectional view of the one or more target packages finally obtained in this embodiment is shown in fig. 6, where the outer surface of the exposed area of the second side, the outer surface of the third side and the outer surface of the fourth side are plated with a tin layer 5.
Preferably, after S4, further comprising:
providing a circuit to be soldered of the target package;
and performing electrical property test on the target packaging piece, and welding the target packaging piece passing the electrical property test and the circuit to be welded together.
The quality of the packaging process can be detected through the electrical property test of the target packaging piece, and the pre-screening of the final integrated circuit product is realized; after passing the electrical performance test, the target packaging piece is welded with the provided circuit to be welded, so that the welding upper plate of the target packaging piece can be realized, and the target packaging piece is put into the whole machine for use, and the required integrated circuit product is manufactured.
Example two
As shown in fig. 6, a package with an exposed lead frame is manufactured by the manufacturing method of the first embodiment, and the package includes:
a lead frame carrier 3;
the component 1 to be packaged is attached to the outer surface of the first side of the lead frame carrier 3 and is electrically connected with the lead frame carrier 3;
the plastic package body 2 is injection-molded on the outer surface of the first side of the lead frame carrier 3, and the component 1 to be packaged and the first side of the lead frame carrier 3 are plastic-packaged together; and
a tin layer 5 is plated on the outer surface of all exposed areas of the leadframe carrier 3.
The side pins of the package with the exposed lead frame are plated with the tin layer, so that oxidation of the side pins of the device can be effectively prevented, the side pins after welding can fully climb tin, and the welding quality requirement of high-reliability electronic products can be met.
The details of the package with the exposed lead frame in this embodiment are described in detail in the first embodiment and the detailed descriptions in fig. 1 to 6, and are not repeated here.
Although embodiments of the present invention have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the invention, and such modifications and variations are within the scope of the invention as defined by the appended claims.
Claims (10)
1. A method of making a package having an exposed leadframe, comprising:
obtaining a half-package lead frame after plastic package; wherein the second side of the half-package lead frame is fully exposed and the first side is partially exposed;
performing half cutting on the second side of the half-package lead frame according to a preset cutting position to obtain a half-cut lead frame with exposed side pins;
tinning the outer surfaces of all exposed areas of the half-cut lead frame to obtain a tinned lead frame;
and performing half-cutting on the first side of the tinned lead frame according to the preset cutting position, so that the tinned lead frame is cut off at the preset cutting position, and a target package is obtained.
2. The method for manufacturing a package with an exposed lead frame according to claim 1, wherein the obtaining the molded half-package lead frame comprises:
providing a component to be packaged and a lead frame carrier;
attaching the component to be packaged to the first side of the lead frame carrier according to preset mounting parameters;
according to preset bonding parameters, bonding wires are adopted to electrically connect the leading-out ends of the components to be packaged with the leading-out ends of the lead frame carrier, so that a lead frame to be molded is formed;
injection molding is carried out on the lead frame to be subjected to plastic packaging according to preset plastic packaging parameters to form a plastic packaging body which enables the first side of the lead frame carrier and the component to be packaged to be subjected to plastic packaging, and the semi-packaged lead frame after plastic packaging is obtained;
the second side of the lead frame carrier is exposed, and the first side is exposed except for the area of the plastic package body.
3. The method of claim 2, wherein the predetermined molding parameters include an injection thickness, a mold clamping pressure, an injection pressure, and an injection time.
4. The method of claim 3, wherein the mold clamping pressure is in a range of 20 to 50 tons, and/or the injection pressure is in a range of 0.8 to 1.2 tons, and/or the injection time is in a range of 7 to 15 seconds.
5. The method of manufacturing a package with exposed lead frame according to claim 2, wherein the performing a half-cut on the second side of the half-package lead frame according to the preset cutting position to obtain a half-cut lead frame with exposed side leads comprises:
manufacturing a cutting positioning mark on the semi-packaging lead frame in advance based on the preset cutting position;
identifying the cutting positioning mark, generating a first cutting path according to the cutting positioning mark, and presetting a first preset cutting parameter;
and according to the first cutting path and the first preset cutting parameters, performing half cutting on the second side of the half-package lead frame, so that the lead frame carrier on the second side of the half-package lead frame is cut off, and the plastic package body on the first side of the half-package lead frame is not cut off, thereby obtaining the half-cut lead frame with exposed side pins.
6. The method of manufacturing a package with an exposed leadframe according to claim 5, wherein the semi-cutting the first side of the tin-plated leadframe according to the predetermined cutting position such that the tin-plated leadframe is cut at the predetermined cutting position to obtain the target package, comprising:
generating a second cutting path according to the cutting positioning mark, and presetting a second preset cutting parameter;
and according to the second cutting path and the second preset cutting parameters, performing half cutting on the first side of the tinned lead frame, so that the tinned lead frame positioned at the preset cutting position is cut off from the plastic package body to the lead frame carrier, and the target package piece is obtained.
7. The method of claim 6, wherein the first predetermined cutting parameters and the second predetermined cutting parameters each include a cutting speed and a cutting depth.
8. The method of manufacturing packages with exposed lead frames according to any of claims 1 to 7, wherein the number of target packages is one or more.
9. The method of manufacturing a package with an exposed leadframe according to any one of claims 1 to 7, further comprising, after the obtaining the target package:
providing a circuit to be soldered of the target package;
and performing electrical property test on the target packaging piece, and welding the target packaging piece passing the electrical property test and the circuit to be welded together.
10. A package with an exposed leadframe, produced by the method of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310518419.5A CN116246986A (en) | 2023-05-10 | 2023-05-10 | Package with exposed lead frame and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310518419.5A CN116246986A (en) | 2023-05-10 | 2023-05-10 | Package with exposed lead frame and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116246986A true CN116246986A (en) | 2023-06-09 |
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| CN202310518419.5A Pending CN116246986A (en) | 2023-05-10 | 2023-05-10 | Package with exposed lead frame and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117637660A (en) * | 2024-01-25 | 2024-03-01 | 荣耀终端有限公司 | QFN packaging structure, manufacturing method thereof and QFN device |
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| GB201320715D0 (en) * | 2013-06-04 | 2014-01-08 | Cambridge Silicon Radio Ltd | A QFN with wettable flank |
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| US9741642B1 (en) * | 2014-05-07 | 2017-08-22 | UTAC Headquarters Pte. Ltd. | Semiconductor package with partial plating on contact side surfaces |
| CN108198804A (en) * | 2017-12-29 | 2018-06-22 | 江苏长电科技股份有限公司 | There is stack package structure and its manufacturing process that pin side wall climbs tin |
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| US20120049335A1 (en) * | 2010-08-31 | 2012-03-01 | Utac Thai Limited | Singulation method for semiconductor package with plating on side of connectors |
| GB201320715D0 (en) * | 2013-06-04 | 2014-01-08 | Cambridge Silicon Radio Ltd | A QFN with wettable flank |
| US9741642B1 (en) * | 2014-05-07 | 2017-08-22 | UTAC Headquarters Pte. Ltd. | Semiconductor package with partial plating on contact side surfaces |
| CN104576407A (en) * | 2014-12-30 | 2015-04-29 | 杰群电子科技（东莞）有限公司 | Lead frame pipe pin end face tinned packaging method and packaging structure |
| CN106169443A (en) * | 2015-05-18 | 2016-11-30 | 东和株式会社 | Semiconductor device and manufacture method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117637660A (en) * | 2024-01-25 | 2024-03-01 | 荣耀终端有限公司 | QFN packaging structure, manufacturing method thereof and QFN device |
| CN117637660B (en) * | 2024-01-25 | 2024-05-31 | 荣耀终端有限公司 | QFN packaging structure, manufacturing method thereof and QFN device |
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