CN116230596A - Online liquid etching machine of joining in marriage of semiconductor wafer - Google Patents
Online liquid etching machine of joining in marriage of semiconductor wafer Download PDFInfo
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- CN116230596A CN116230596A CN202310513261.2A CN202310513261A CN116230596A CN 116230596 A CN116230596 A CN 116230596A CN 202310513261 A CN202310513261 A CN 202310513261A CN 116230596 A CN116230596 A CN 116230596A
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- 239000007788 liquid Substances 0.000 title claims abstract description 371
- 238000005530 etching Methods 0.000 title claims abstract description 124
- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000005304 joining Methods 0.000 title claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 150
- 235000012431 wafers Nutrition 0.000 claims abstract description 59
- 230000007246 mechanism Effects 0.000 claims abstract description 57
- 238000011084 recovery Methods 0.000 claims abstract description 31
- 238000005507 spraying Methods 0.000 claims abstract description 27
- 238000002360 preparation method Methods 0.000 claims abstract description 15
- 238000004064 recycling Methods 0.000 claims description 26
- 238000012545 processing Methods 0.000 claims description 15
- 230000009471 action Effects 0.000 claims description 13
- 230000008859 change Effects 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 18
- 230000008569 process Effects 0.000 abstract description 6
- 238000004891 communication Methods 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 29
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 238000003756 stirring Methods 0.000 description 15
- 239000013078 crystal Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 239000011259 mixed solution Substances 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- 230000005484 gravity Effects 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- 238000013329 compounding Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention belongs to the technical field of semiconductors, in particular to an online liquid preparation etching machine for semiconductor wafers, which comprises a supporting base for placing and etching single wafers, a bent rod which is driven to rotate by a motor is arranged on the upper surface of one end of the supporting base, a liquid spraying pipe is fixedly connected to the outer surface of the bent rod through a binding ring, a mixing tank for etching liquid is arranged in communication with the liquid spraying pipe, a liquid inlet mechanism is arranged on the outer surface of the mixing tank, a mixing mechanism is arranged in the mixing tank, and a liquid recovery mechanism is also arranged in communication with the liquid spraying pipe. This online liquid etching machine of joining in marriage of semiconductor wafer, when meetting U type nozzle stub through multiple liquid that goes into from the feed liquor branch pipe, can flow back through U type nozzle stub, and then take place to offset with the liquid that mixes the liquid pipe process, just also realize the preliminary mixing of liquid, also can slow down the velocity of flow that multiple liquid got into the blending tank inside for the time of preliminary mixing increases, and then improves the mixing efficiency of etching solution.
Description
Technical Field
The invention relates to the technical field of semiconductor processes, in particular to an online liquid preparation etching machine for a semiconductor wafer.
Background
A wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because of its circular shape, and various circuit element structures can be manufactured on the silicon wafer to be a product having a specific electrical function. The starting material of the wafer is silicon and the crust surface is useful in inexhaustible dioxideSilicon. Silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon, a wafer manufacturing factory then melts the polysilicon, seed crystals are planted in the melt, and then the silicon crystal is slowly pulled out to form a cylindrical monocrystalline silicon crystal rod, and the process is called as crystal growth because the silicon crystal rod is gradually generated in a molten silicon raw material by the seed crystals determined by the orientation of one crystal face. The silicon crystal bar is cut, rolled, sliced, chamfered, polished, laser-etched and packaged to obtain the basic raw material of integrated circuit factory-silicon wafer, i.e. wafer. A layer of Al of about 2um is attached to the wafer surface 2 O 3 And a glycerol mixed solution protective layer, and chemical etching and surface cleaning are required before manufacturing.
At present, etching liquid is stored in an etching liquid barrel after being pre-prepared and pumped into a discharging pipe by a pump body to realize etching, but in practice, the types of the etching liquid, the required temperature and the respective densities are different, and the etching liquid is configured in advance: 1. after the etchants with different densities are mixed, stirring is needed continuously before use so as to keep uniform density and prevent layering; 2. the etching solution itself is to adopt the principle of corrosion to realize the etching action to the wafer, and the pH value is different between the etching solutions, and when the etching solution is reheated to 40-80 etching temperature, the etching solution is easy to volatilize, even in a closed barrel, the etching solution can volatilize at the top space in the barrel, so that the concentration of the etching solution is different, the concentration of the etching solution can be changed due to long-term storage of the etching solution, and the layering phenomenon exists in the etching density, so the invention solves the defects of the technical problems.
Disclosure of Invention
Based on the technical problems that the existing etching liquid is prepared in advance and then stored in an etching liquid barrel and pumped into a discharging pipe by a pump body to realize etching, the concentration of the etching liquid can be changed after the etching liquid is stored for a long time, and the layering phenomenon exists in the etching density, the invention provides an on-line liquid preparation etching machine for a semiconductor wafer.
The invention provides an online liquid preparation etching machine for a semiconductor wafer, which comprises a supporting base for placing and etching a single wafer, wherein the upper surface of one end of the supporting base is provided with a bent rod driven to rotate by a motor, the outer surface of the bent rod is fixedly connected with a liquid spraying pipe through a binding ring, a mixing tank for etching liquid is arranged in communication with the liquid spraying pipe, the outer surface of the mixing tank is provided with a liquid inlet mechanism, a mixing mechanism is arranged in the mixing tank, and a liquid recovery mechanism is also arranged in communication with the liquid spraying pipe.
The liquid feeding mechanism synchronously inputs acid-base liquid with various components of the etching liquid to perform online liquid preparation action.
The mixing mechanism mixes a plurality of liquids entering the mixing tank on line and carries out conveying action.
The liquid recycling mechanism absorbs etching liquid flowing back from the liquid spraying pipe and performs repeated use.
Preferably, the liquid inlet mechanism comprises a liquid mixing pipe which surrounds the outer surface of the upper end of the mixing tank and is annular, a processing base is arranged on the lower surface of the mixing tank, the upper surface of the processing base is fixedly connected with the lower surface of the liquid mixing pipe through support columns distributed in an annular array, and one end of the liquid mixing pipe is fixedly communicated with the inner part of the upper end of the mixing tank.
According to the technical scheme, when the wafer is subjected to an etching procedure, the wafer silicon wafers are usually placed on the upper surface of the supporting base one by one, etching liquid is input into the liquid spraying pipe to enable the liquid spraying pipe to etch the surfaces of the wafer silicon wafers, but at present, the etching liquid is stored in the etching liquid barrel after being pre-prepared, and is pumped into the discharging pipe by the pump body to realize etching, but actually, the types of the etching liquid, required temperatures and the densities of the etching liquid are different, the etching agents with different densities are configured in advance, and after the etching agents with different densities are mixed in advance, the mixing pipe is required to be continuously stirred before use so as to keep uniform density, layering is prevented, the etching liquid is placed for a long time to be easy to volatilize part of the etching liquid, the acid-base of the etching liquid cannot meet the etching requirement, the online liquid preparation is realized by the mixing tank with smaller volume, the etching liquid is synchronously prepared according to the amount of the etching liquid needed by one or a lot of wafer silicon wafers, the types of the etching liquid are more, the online liquid is synchronously input for improving the efficiency of online liquid preparation, the various liquids are mixed better, the various liquids are arranged, the mixing liquid is enabled to enter the mixing tank, and the mixing tank is enabled to be mixed in advance, and the online liquid mixing efficiency is improved.
Preferably, the liquid inlet mechanism further comprises a plurality of liquid inlet branch pipes, one ends of the liquid inlet branch pipes are communicated with the inside of the other end of the liquid mixing pipe, and electromagnetic flow valves are arranged on the outer surfaces of the liquid inlet branch pipes.
Through the technical scheme, in order to control the liquid inlet amount of various liquids of the etching liquid, the concentration of the etching liquid reaches the operation requirement, and the inlet end of the liquid mixing pipe is provided with the liquid inlet branch pipe in a beam shape and used for synchronously introducing different liquids, and the liquid flow flowing in the liquid mixing pipe is monitored through the electromagnetic flow valve arranged outside.
Preferably, the liquid inlet mechanism further comprises a plurality of U-shaped short pipes, wherein a plurality of U-shaped short pipes are uniformly distributed at intervals and are communicated with the inside of the liquid mixing pipe, and a plurality of U-shaped short pipes are distributed in an inclined side state.
Through the technical scheme, in order to enable the liquid mixing pipe to realize preliminary mixing of various liquids, the U-shaped short pipe is arranged on the outer surface of the liquid mixing pipe, the liquid mixing pipe is made to form an annular Tesla valve pipe, when the various liquids entering from the liquid inlet branch pipe meet the U-shaped short pipe, the various liquids flow back through the U-shaped short pipe, and then the various liquids passing through the liquid mixing pipe are subjected to opposite flushing, so that preliminary mixing of the liquids is realized, the flow rate of the various liquids entering the mixing tank can be slowed down, and the time for preliminary mixing is prolonged.
Preferably, the mixing mechanism comprises a stirring rod in a frame shape, the outer surface of the stirring rod is in sliding connection with the inner wall of the mixing tank, a temperature control base is fixedly connected with the lower surface of the mixing tank, the lower surface of the temperature control base is fixedly connected with the upper surface of the processing base, a forward and backward rotating motor is fixedly connected with the lower surface of the processing base, and the outer surface of an output shaft of the forward and backward rotating motor is fixedly connected with the outer surface of the stirring rod through a coupler.
Through above-mentioned technical scheme, in order to carry out the mixing stirring to the etching solution that gets into the blending tank, make it fully mix, thereby can carry out the etching action, and then through setting up the puddler in the inside of blending tank and realize the mixing of liquid, in order to improve the efficiency of mixing, thereby make puddler and the output shaft of positive and negative rotation motor carry out being connected, make positive and negative rotation motor control puddler carry out positive and negative at uniform velocity rotation, in order to make the liquid of mixing reach the etched requirement, thereby set up the control by temperature change base, make it realize on-line heating to the liquid in the blending tank, thereby improve the mixing efficiency of etching solution.
Preferably, the upper and lower ends of the outer surface of one side of the mixing tank are respectively provided with a liquid level sensor and a temperature sensor for monitoring the inside of the mixing tank.
Through above-mentioned technical scheme, in order to monitor the liquid volume in the blending tank to be convenient for stir, thereby set up level sensor, in order to carry out the accuse to reaction temperature simultaneously, thereby set up temperature sensor.
Preferably, the mixing mechanism further comprises a liquid outlet pipe, one end of the liquid outlet pipe is communicated with the inside of the bottom end of the mixing tank, an electromagnetic valve is mounted on the outer surface of the liquid outlet pipe, and one end of the liquid outlet pipe is fixedly communicated with a suction pump.
Through the technical scheme, in order to extract the etching liquid mixed on line, the etching of the same batch of wafer silicon wafers can be realized, so that the electromagnetic valve is opened, and the suction pump extracts the etching liquid in the mixing tank through the liquid outlet pipe.
Preferably, the liquid recovery mechanism comprises a Y-shaped connecting pipe, one end of the Y-shaped connecting pipe is fixedly communicated with the inside of the liquid spraying pipe, and an inclined side branch pipe of the Y-shaped connecting pipe is fixedly communicated with the liquid outlet end of the suction pump.
Through the technical scheme, in order to facilitate the absorption of the reflux liquid generated after the liquid spraying pipe sprays the etching liquid once and stops, the Y-shaped connecting pipe is arranged at the liquid inlet end of the liquid spraying pipe to connect, so that the etching liquid mixed on line enters the liquid spraying pipe through the branch pipe of the Y-shaped connecting pipe, and the reflux liquid is discharged into another tank body along the vertical pipe of the Y-shaped connecting pipe under the action of gravity to realize recovery.
Preferably, the recycling liquid mechanism further comprises a recycling tank supported by the other temperature control base, the outer surface of the lower end of the Y-shaped connecting pipe extends to the bottom end of the inside of the recycling tank, the outer surface of the Y-shaped connecting pipe is in sealing connection with the inside of the recycling tank, and the other temperature sensor, the first concentration sensor and the second concentration sensor are fixedly installed on the outer surface of the recycling tank respectively.
Through above-mentioned technical scheme, the etching of silicon is usually nitric acid and hydrofluoric acid's mixed solution, in order to realize retrieving the better short time storage to this kind of mixed solution to the direct utilization of next time, thereby use another control by temperature change base to retrieve the inside realization temperature control of jar, and then make the mixed solution in the jar of retrieving be in low temperature environment, avoid causing the volatilization of mixed solution, and realize the control of temperature through another temperature sensor, utilize first concentration sensor and second concentration sensor to realize the detection to nitric acid and hydrofluoric acid concentration in the mixed solution simultaneously.
Preferably, the recycling liquid mechanism further comprises a linear tesla valve pipe which is vertically arranged, one end of the linear tesla valve pipe is communicated with the inside of the recycling tank through a pump body, and the other end of the tesla valve pipe is communicated with the inside of one of the U-shaped short pipes.
Through the technical scheme, in order to facilitate recycling of recovered liquid, raw material waste is avoided, and therefore in the process of online liquid preparation, when mixed liquid is input through the liquid inlet branch pipe, the recovered liquid in the recovery tank is pumped out through the pump body, the recovered liquid enters the liquid mixing pipe through the U-shaped short pipe to achieve mixing, and the flow rate of various liquids entering the liquid inlet branch pipe is controlled according to the data of the first concentration sensor and the second concentration sensor, so that the concentration of the mixed liquid in the liquid mixing pipe meets the requirement of etching liquid, volatilization of the recovered liquid in the recovery tank can be avoided due to long-time storage of the recovered liquid in the recovery tank, and in addition, the recovered liquid is fully mixed with the liquid in the liquid mixing pipe when the liquid in the recovery tank is discharged, and then the recovered liquid is conveyed through the Tesla valve pipe.
The beneficial effects of the invention are as follows:
1. through setting up feed liquor mechanism, carry out synchronous input to the acid-base liquid of multiple composition of etching solution and carry out online liquid action of joining in marriage, at the in-process of regulation, through the feed liquor branch pipe that is the beam form in the entering end setting of mixing the liquid pipe, be used for letting in different liquids in step, and monitor its inside circulated liquid flow through externally mounted's electromagnetic flow valve, multiple liquid that goes into from the feed liquor branch pipe can flow back through U type nozzle stub when meetting U type nozzle stub, and then take place the offset with the liquid that mixes the liquid pipe process, just also realize the preliminary mixing of liquid, also can slow down the velocity of flow that multiple liquid got into the blending tank inside, make preliminary mixed time increase, and then improve the mixing efficiency of etching solution.
2. Through setting up compounding mechanism, can carry out intensive mixing to multiple composition of etching solution, at the in-process of adjusting, through making positive and negative rotation motor control puddler carry out positive and negative at uniform velocity and rotate, in order to make the liquid of mixing reach the etching requirement to set up the control by temperature change base, make it realize on-line heating to the liquid in the blending tank, thereby improve the mixing efficiency of etching solution, avoid leading to the layering phenomenon of etching solution simultaneously.
3. Through setting up the recovery liquid mechanism, can absorb the backward flow liquid of etching solution and reuse, in the in-process of adjusting, through the branch pipe that makes online mixed etching solution enter into the hydrojet pipe through Y type connecting pipe, and the liquid of backward flow realizes retrieving in another jar body along the vertical pipe discharge of Y type connecting pipe because of the action of gravity, when entering mixed liquid through the feed liquor branch pipe, take out the recovery liquid in the recovery jar through the pump body, make it get into mixed liquid pipe through U type nozzle stub and realize mixing, and control the flow of various liquid that the feed liquor branch pipe got into according to the data of first concentration sensor and second concentration sensor, and then make mixed liquid concentration in the mixed liquid pipe reach the requirement of etching solution, and then can avoid storing the recovery liquid in the recovery jar for a long time and volatilize, and in order to carry out intensive mixing with the mixed liquid intraductal liquid when discharging the recovery jar, and then realize the transportation to the recovery liquid through tesla valve pipe, thereby realized the reuse of etching solution on line, avoid its long-time storage volatilize to cause, and then cause the waste of resource.
Drawings
FIG. 1 is a schematic diagram of an on-line liquid dispensing etcher for semiconductor wafers in accordance with the present invention;
FIG. 2 is a perspective view of a liquid spraying pipe structure of an on-line liquid dispensing etcher for semiconductor wafers in accordance with the present invention;
FIG. 3 is a perspective view of a liquid feeding mechanism of an on-line liquid dispensing etcher for semiconductor wafers in accordance with the present invention;
fig. 4 is a perspective view of a liquid mixing pipe structure of an on-line liquid mixing etching machine for semiconductor wafers according to the present invention;
FIG. 5 is a perspective view of a liquid inlet branch pipe structure of an on-line liquid distribution etching machine for semiconductor wafers according to the present invention;
FIG. 6 is a perspective view of a mixing mechanism of an on-line liquid-dispensing etcher for semiconductor wafers in accordance with the present invention;
FIG. 7 is a perspective view of a stirring rod of an on-line liquid preparation etching machine for semiconductor wafers;
FIG. 8 is a perspective view of a liquid recovery mechanism of an on-line liquid dispensing etcher for semiconductor wafers in accordance with the present invention;
FIG. 9 is a perspective view of a suction pump of an on-line liquid dispensing etcher for semiconductor wafers in accordance with the present invention;
FIG. 10 is a perspective view of a recovery tank structure of an on-line liquid dispensing etcher for semiconductor wafers in accordance with the present invention;
fig. 11 is a perspective view of a linear tesla valve tube structure of an on-line liquid dispensing etcher for semiconductor wafers.
In the figure: 1. a support base; 11. bending a rod; 12. a liquid spraying pipe; 2. a mixing tank; 21. processing a base; 3. a liquid inlet mechanism; 31. a liquid mixing pipe; 32. a liquid inlet branch pipe; 33. an electromagnetic flow valve; 34. a U-shaped short pipe; 4. a mixing mechanism; 41. a stirring rod; 42. a temperature control base; 43. a forward and reverse rotation motor; 44. a liquid level sensor; 45. a temperature sensor; 46. a liquid outlet pipe; 47. an electromagnetic valve; 48. a suction pump; 5. a liquid recovery mechanism; 51. a Y-shaped connecting pipe; 52. a recovery tank; 53. a first concentration sensor; 54. a second concentration sensor; 55. a linear tesla valve tube.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-11, an online liquid etching machine of preparing of semiconductor wafer, including single wafer place and carry out etched support base 1, support base 1's one end upper surface carries out the bent rod 11 of drive rotation through the motor, the surface of bent rod 11 is through binding ring fixedly connected with hydrojet pipe 12, be provided with the blending tank 2 of etching liquid with hydrojet pipe 12 intercommunication, the surface of blending tank 2 is provided with feed liquor mechanism 3, the inside of blending tank 2 is provided with compounding mechanism 4, still be provided with recovery liquid mechanism 5 with hydrojet pipe 12 intercommunication.
Referring to fig. 3 to 5, the liquid feeding mechanism 3 performs on-line liquid preparation operation by synchronously inputting acid-base liquid of various components of the etching liquid.
In order to improve the efficiency of online liquid preparation to make multiple liquid carry out synchronous input, and in order to better mixing to multiple liquid, then feed liquor mechanism 3 is including encircling at mixing tank 2 upper end surface and being annular mixed liquid pipe 31, the lower surface of mixing tank 2 is provided with processing base 21, the upper surface of processing base 21 is through being the support column and the lower fixed surface who mixes liquid pipe 31 that annular array distributes, the one end of mixed liquid pipe 31 and the inside fixed intercommunication of upper end of mixing tank 2, make preliminary mixing before multiple liquid gets into mixing tank 2, and then improved the efficiency of online liquid preparation.
In order to control the liquid inlet amounts of various liquids of the etching liquid so that the concentration of the etching liquid reaches the operation requirement, the liquid inlet mechanism 3 further comprises a plurality of liquid inlet branch pipes 32, one ends of the liquid inlet branch pipes 32 are communicated with the inside of the other ends of the liquid mixing pipes 31, and electromagnetic flow valves 33 are arranged on the outer surfaces of the liquid inlet branch pipes 32.
In order to enable the liquid mixing pipe 31 to realize preliminary mixing of various liquids, the liquid mixing efficiency of etching liquid is improved, then the liquid feeding mechanism 3 further comprises a plurality of U-shaped short pipes 34, the plurality of U-shaped short pipes 34 are uniformly distributed at intervals and are communicated with the inside of the liquid mixing pipe 31, the plurality of U-shaped short pipes 34 are distributed in an inclined side state, therefore, when the plurality of liquids entering from the liquid feeding branch pipe 32 meet the U-shaped short pipes 34, the liquids flowing back through the U-shaped short pipes 34 and then are opposite to each other with the liquids passing through the liquid mixing pipe 31, preliminary mixing of the liquids is realized, the flow rate of the plurality of liquids entering the inside of the mixing tank 2 can be slowed down, and the time for preliminary mixing is prolonged.
Through setting up feed liquor mechanism 3, carry out synchronous input to the acid-base liquid of multiple composition of etching solution and carry out online liquid action of joining in marriage, at the in-process of adjusting, through set up the feed liquor branch pipe 32 that is the beam form at the entry end of mixing liquid pipe 31, be used for letting in different liquids in step, and monitor its inside circulated liquid flow through externally mounted electromagnetic flow valve 33, multiple liquid that goes into from feed liquor branch pipe 32 when meetting U type nozzle stub 34, can flow back through U type nozzle stub 34, and then take place the hedging with the liquid that mixing liquid pipe 31 passed, just also realize the preliminary mixing of liquid, also can slow down the velocity of flow that multiple liquid got into the inside of blending tank 2, make preliminary mixed time increase, and then improve the mixing efficiency of etching solution.
Referring to fig. 6 to 7, the mixing mechanism 4 performs in-line mixing of a plurality of liquids introduced into the mixing tank 2, and performs a conveying operation.
In order to mix and stir the etching liquid entering the mixing tank 2 fully, so that the etching liquid can be fully mixed, the mixing mechanism 4 comprises a stirring rod 41 in a frame shape, the outer surface of the stirring rod 41 is in sliding connection with the inner wall of the mixing tank 2, in order to enable the mixed liquid to meet the etching requirement, a temperature control base 42 is fixedly connected to the lower surface of the mixing tank 2, the lower surface of the temperature control base 42 is fixedly connected with the upper surface of the processing base 21, in order to improve the mixing efficiency, a forward and reverse rotating motor 43 is fixedly connected to the lower surface of the processing base 21, and the outer surface of an output shaft of the forward and reverse rotating motor 43 is fixedly connected with the outer surface of the stirring rod 41 through a coupler.
In order to monitor the liquid volume in the mixing tank 2 for stirring and to control the reaction temperature, a liquid level sensor 44 and a temperature sensor 45 for monitoring the inside of the mixing tank 2 are respectively installed at the upper and lower ends of the outer surface of one side of the mixing tank 2.
In order to extract the etching liquid of online mixing and use, and then can realize the etching to the wafer silicon chip of same batch, then compounding mechanism 4 still includes drain pipe 46, and the one end of drain pipe 46 communicates with the inside bottom of blending tank 2, and the surface mounting of drain pipe 46 has electromagnetic valve 47, and the fixed intercommunication of one end of drain pipe 46 has suction pump 48 to open through electromagnetic valve 47, draw the etching liquid in the blending tank 2 through drain pipe 46 by suction pump 48.
Through setting up compounding mechanism 4, can carry out intensive mixing to multiple composition of etching solution, at the in-process of adjusting, through making positive and negative rotating motor 43 control puddler 41 carry out positive and negative at uniform velocity rotation, in order to make the liquid of mixing reach the etching requirement to set up control by temperature change base 42, make it realize on-line heating to the liquid in the blending tank 2, thereby improve the mixing efficiency of etching solution, avoid leading to the layering phenomenon of etching solution simultaneously.
Referring to fig. 8 to 11, the liquid recovery mechanism 5 absorbs the etching liquid flowing back from the liquid ejecting pipe 12 and performs a repeated use operation.
In order to facilitate the absorption of the reflux liquid generated after the liquid spraying pipe 12 sprays the etching liquid once and stops, the liquid recycling mechanism 5 comprises a Y-shaped connecting pipe 51, one end of the Y-shaped connecting pipe 51 is fixedly communicated with the inside of the liquid spraying pipe 12, an inclined side branch pipe of the Y-shaped connecting pipe 51 is fixedly communicated with the liquid outlet end of the suction pump 48, the etching liquid mixed on line enters the liquid spraying pipe 12 through the branch pipe of the Y-shaped connecting pipe 51, and the reflux liquid is discharged into another tank body along the vertical pipe of the Y-shaped connecting pipe 51 under the action of gravity so as to realize recycling.
In order to realize better short-time storage after recycling the mixed liquid so as to be convenient for the next direct utilization, the recycling liquid mechanism 5 further comprises a recycling tank 52 supported by another temperature control base 42, the outer surface of the lower end of the Y-shaped connecting pipe 51 extends to the inner bottom end of the recycling tank 52, the outer surface of the Y-shaped connecting pipe 51 is in sealing connection with the inner part of the recycling tank 52, and the outer surface of the recycling tank 52 is fixedly provided with another temperature sensor 45, a first concentration sensor 53 and a second concentration sensor 54 respectively.
In order to facilitate recycling of recovered liquid, avoid causing raw materials waste, then recovery liquid mechanism 5 still includes the linear tesla valve pipe 55 that is vertical setting, the one end of linear tesla valve pipe 55 communicates with the inside of recovery jar 52 through the pump body, the other end of linear tesla valve pipe 55 communicates with the inside of one of them U type nozzle stub 34, thereby in the in-process of carrying out online liquid preparation, when the mixed liquid is input through feed liquor branch pipe 32, take out the recovered liquid in the recovery jar 52 through the pump body, make it get into mix liquid pipe 31 through U type nozzle stub 34 and realize mixing, and control the flow of various liquids that feed liquor branch pipe 32 got into according to the data of first concentration sensor 53 and second concentration sensor 54, and then make the mixed liquid concentration in the mix liquid pipe 31 reach the requirement of etching solution, and then can avoid causing volatilize to the long-time storage of the recovered liquid in the recovery jar 52.
Through setting up retrieve liquid mechanism 5, can absorb and reuse to the backward flow liquid of etching solution, in the in-process of adjusting, through making the etching solution that mixes on line enter into hydrojet pipe 12 through the branch pipe of Y type connecting pipe 51, and the liquid that flows back is realized retrieving along the vertical pipe row of Y type connecting pipe 51 in another jar body because of the effect of gravity, when importing the mixed liquid through feed liquor branch pipe 32, take out the recovered liquid in retrieving jar 52 through the pump body, make it get into mixed liquid pipe 31 through U type nozzle stub 34 and realize mixing, and control the flow of each liquid that feed liquor branch pipe 32 got into according to the data of first concentration sensor 53 and second concentration sensor 54, and then make the mixed liquid concentration in mixed liquid pipe 31 reach the requirement of etching solution, and then can avoid causing volatilize to retrieve liquid long-time storage in retrieving jar 52, and in order to carry out intensive mixing with the liquid in mixed liquid pipe 31 when retrieving jar 52 liquid discharge, and then realize the transportation to retrieve liquid through tesla valve pipe, thereby realized the reuse of etching solution on line, it causes the waste of volatilize for a long time, and then cause the resource waste.
Working principle: in a specific embodiment, when a wafer is used for carrying out an etching procedure, wafer silicon wafers are usually placed on the upper surface of a supporting base 1 one by one, etching liquid is input into a liquid spraying pipe 12, so that the liquid spraying pipe 12 etches the surface of the wafer silicon wafers, in order to carry out online etching liquid distribution, information is transmitted to the etching liquid procedure before the wafer is transmitted to the etching liquid procedure in a certain procedure, the etching liquid is distributed online in advance, and therefore, a beam-shaped liquid inlet branch pipe 32 is arranged at the inlet end of a liquid mixing pipe 31 and used for synchronously introducing different liquids, and the flow rate of the liquid flowing in the liquid mixing pipe is monitored through an externally-mounted electromagnetic flow valve 33;
when various liquids enter the liquid mixing pipe 31 from the liquid inlet branch pipe 32 and are conveyed in the liquid mixing pipe 31, the liquids flow back through the U-shaped short pipe 34 when encountering the U-shaped short pipe 34, and then are opposite to the liquid passing through the liquid mixing pipe 31, so that the primary mixing of the liquids is realized, and the flow rate of the various liquids entering the mixing tank 2 can be slowed down;
after etching liquid enters the mixing tank 2, the liquid volume in the tank is monitored by a liquid level sensor 44, and a forward and reverse rotation motor 43 on the lower surface of the processing base 21 acts to control a stirring rod 41 to rotate forward and reverse at a constant speed by an output shaft of the processing motor, and in the process of stirring the liquid, the liquid in the tank is heated on line by a temperature control base 42 on the lower surface of the mixing tank 2, and the mixing efficiency of the etching liquid is improved by a temperature sensor 45;
when the etching liquid in the mixing tank 2 is manufactured, the electromagnetic valve 47 is opened, and the suction pump 48 pumps the etching liquid in the mixing tank 2 through the liquid outlet pipe 46, so that the etching liquid enters the Y-shaped connecting pipe 51 and then is introduced into the liquid spraying pipe 12 for spraying for etching;
after the primary wafer etching is completed, the etching liquid is refluxed, so that the refluxed liquid is discharged into the recovery tank 52 along the vertical pipe of the Y-shaped connecting pipe 51 for collection under the action of gravity, and the other temperature control base 42 is used for realizing temperature control on the inside of the recovery tank 52, so that the mixed liquid in the recovery tank 52 is in a low-temperature environment, volatilization of the mixed liquid is avoided, temperature monitoring is realized through the other temperature sensor 45, and meanwhile, the concentration of nitric acid and hydrofluoric acid in the mixed liquid is detected by the first concentration sensor 53 and the second concentration sensor 54;
when waiting for online liquid preparation next time, when the mixed liquid is input through the liquid inlet branch pipe 32, the recycled liquid in the recycling tank 52 is pumped out through the pump body, the recycled liquid is conveyed through the Tesla valve pipe, the recycled liquid enters the liquid mixing pipe 31 through the U-shaped short pipe 34 to be mixed, the flow of various liquids entering the liquid inlet branch pipe 32 is controlled according to the data of the first concentration sensor 53 and the second concentration sensor 54, and the concentration of the mixed liquid in the liquid mixing pipe 31 meets the requirement of etching liquid, so that the waste of resources of the etching liquid can be avoided.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (10)
1. The utility model provides an online liquid etching machine of joining in marriage of semiconductor wafer, includes that single wafer places and carries out etched support base (1), its characterized in that: the etching device comprises a supporting base (1), a bent rod (11) which is driven to rotate by a motor, wherein a liquid spraying pipe (12) is fixedly connected to the outer surface of the bent rod (11) through a binding ring, a mixing tank (2) which is communicated with the liquid spraying pipe (12) and is provided with etching liquid, a liquid inlet mechanism (3) is arranged on the outer surface of the mixing tank (2), a mixing mechanism (4) is arranged in the mixing tank (2), and a liquid recovery mechanism (5) is also arranged in the mixing tank and is communicated with the liquid spraying pipe (12); the liquid feeding mechanism (3) synchronously inputs acid-base liquid with various components of etching liquid to perform online liquid preparation action; wherein the mixing mechanism (4) performs online mixing on various liquids entering the mixing tank (2) and performs conveying action; wherein, the liquid recovery mechanism (5) absorbs the etching liquid which flows back from the liquid spraying pipe (12) and performs repeated use actions.
2. The on-line liquid dispensing etcher for semiconductor wafers as set forth in claim 1, wherein: the utility model provides a feed liquor mechanism (3) is including encircling mix jar (2) upper end surface and be annular muddy liquid pipe (31), the lower surface of mix jar (2) is provided with processing base (21), the upper surface of processing base (21) through be annular array distribution the support column with mix the lower fixed surface of liquid pipe (31) and be connected, mix the one end of liquid pipe (31) with mix the inside fixed intercommunication of upper end of jar (2).
3. The on-line liquid dispensing etcher for semiconductor wafers as set forth in claim 2, wherein: the liquid inlet mechanism (3) further comprises a plurality of liquid inlet branch pipes (32), one ends of the liquid inlet branch pipes (32) are communicated with the inside of the other end of the liquid mixing pipe (31), and electromagnetic flow valves (33) are arranged on the outer surfaces of the liquid inlet branch pipes (32).
4. The on-line liquid dispensing etcher for semiconductor wafers as set forth in claim 3, wherein: the liquid inlet mechanism (3) further comprises a plurality of U-shaped short pipes (34), the U-shaped short pipes (34) are uniformly distributed at intervals and are communicated with the inside of the liquid mixing pipe (31), and the U-shaped short pipes (34) are distributed in an inclined side state.
5. The on-line liquid dispensing etcher for semiconductor wafers as set forth in claim 4, wherein: mixing mechanism (4) is including puddler (41) that are the frame shape, the surface of puddler (41) with the inner wall sliding connection of blending tank (2), the lower surface fixedly connected with control by temperature change base (42) of blending tank (2), the lower surface of control by temperature change base (42) with the upper surface fixed connection of processing base (21), the lower surface fixed connection of processing base (21) has positive and negative rotation motor (43), the output shaft surface of positive and negative rotation motor (43) pass through the shaft coupling with the surface fixed connection of puddler (41).
6. The on-line liquid dispensing etcher for semiconductor wafers as set forth in claim 5, wherein: the upper end and the lower end of the outer surface of one side of the mixing tank (2) are respectively provided with a liquid level sensor (44) and a temperature sensor (45) for monitoring the inside of the mixing tank.
7. The on-line liquid dispensing etcher for semiconductor wafers as set forth in claim 6, wherein: the mixing mechanism (4) further comprises a liquid outlet pipe (46), one end of the liquid outlet pipe (46) is communicated with the inside of the bottom end of the mixing tank (2), an electromagnetic valve (47) is mounted on the outer surface of the liquid outlet pipe (46), and one end of the liquid outlet pipe (46) is fixedly communicated with a suction pump (48).
8. The on-line liquid dispensing etcher for semiconductor wafers as set forth in claim 7, wherein: the liquid recovery mechanism (5) comprises a Y-shaped connecting pipe (51), one end of the Y-shaped connecting pipe (51) is fixedly communicated with the inside of the liquid spraying pipe (12), and an inclined side branch pipe of the Y-shaped connecting pipe (51) is fixedly communicated with a liquid outlet end of the suction pump (48).
9. The on-line liquid dispensing etcher for semiconductor wafers as set forth in claim 8, wherein: the recycling liquid mechanism (5) further comprises a recycling tank (52) supported by the other temperature control base (42), the outer surface of the lower end of the Y-shaped connecting pipe (51) extends to the bottom end of the inside of the recycling tank (52), the outer surface of the Y-shaped connecting pipe (51) is in sealing connection with the inside of the recycling tank (52), and the other temperature sensor (45) and the first concentration sensor (53) and the second concentration sensor (54) are fixedly installed on the outer surface of the recycling tank (52) respectively.
10. The on-line liquid dispensing etcher for semiconductor wafers as set forth in claim 9, wherein: the recycling liquid mechanism (5) further comprises a linear Tesla valve pipe (55) which is vertically arranged, one end of the linear Tesla valve pipe (55) is communicated with the inside of the recycling tank (52) through a pump body, and the other end of the linear Tesla valve pipe (55) is communicated with the inside of one U-shaped short pipe (34).
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| CN117542765A (en) * | 2024-01-03 | 2024-02-09 | 苏州智程半导体科技股份有限公司 | Full-automatic nozzle for semiconductor wafer etching |
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Address after: No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215300 Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, no.299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |