CN116230593A - 一种芯片植球装置 - Google Patents
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Abstract
本发明提供一种芯片植球装置,涉及芯片植球技术领域,所述固定台的顶面固定安装有千分尺A和千分尺B,所述固定台的底面固装有千分尺C和压网气缸,所述固定台的侧面固定安装有离子风嘴,所述压网气缸的输出端安装有阶梯植球钢网,所述固定台的顶面固定安装有毛刷组件,所述毛刷组件的输出端安装有植球毛刷。本发明中的锡球通过网板均匀地安装在芯片、基板、晶圆等器件上,并且解决了静电、水平、锡球氧化等问题对锡球在植入安装过程中的影响,实现0.15mm以上锡球植球良率在99.99%以上,其中所配合使用的网板、芯片器件之固定治具制作时间通常为3‑7天,时效上仅相当于针式吸嘴贴球时间的十分之一到三十分之一,实用性较高。
Description
技术领域
本发明涉及芯片植球技术领域,尤其涉及一种芯片植球装置。
背景技术
随着技术的进步,电子设备的小型化趋势越来越明显,为了满足小型化发展趋势,提高芯片集成度,IC产品大多采用BGA封装,而封装时,需要进行芯片植球,但是目前现有的芯片植球主要是通过带吸嘴的顶针针盘,将锡球吸到针盘上的每一个吸嘴上,然后再转印贴片到芯片或基板的焊盘上,完成植球,其中植球的针盘治具生产制作周期通常需要1-3个月,并且成本较高,通常制作5-8个产品的治具成本即可再购买一台设备,提高了生产成本,需要进行改进。
发明内容
本发明的目的是为了解决现有技术中存在的缺点,而提出的一种芯片植球装置。
为了实现上述目的,本发明采用了如下技术方案:一种芯片植球装置,包括固定台,所述固定台的顶面固定安装有千分尺A和千分尺B,所述固定台的底面固装有千分尺C和压网气缸,所述固定台的侧面固定安装有离子风嘴,所述压网气缸的输出端安装有阶梯植球钢网,所述固定台的顶面固定安装有毛刷组件,所述毛刷组件的输出端安装有植球毛刷,所述固定台的表面固定安装有钢网定位组件,所述固定台的顶面连通有氮气入口,所述固定台的顶面安装有铜质柔性片。
为了提高实用性,本发明改进有,所述阶梯植球钢网的表面开设有孔洞,且孔洞均匀分布于阶梯植球钢网的表面。
为了方便调整,本发明改进有,所述千分尺C的数量为四组,四组所述千分尺C均匀分布于固定台的底面。
为了提高使用效果,本发明改进有,所述压网气缸在固定台的底面呈对称状分布。
为了提高质量,本发明改进有,所述固定台的表面边缘开设有倒角。
与现有技术相比,本发明的优点和积极效果在于,
本发明中的锡球通过网板均匀地安装在芯片、基板、晶圆等器件上,并且解决了静电、水平、锡球氧化等问题对锡球在植入安装过程中的影响,实现0.15mm以上锡球植球良率在99.99%以上,其中所配合使用的网板、芯片器件之固定治具制作时间通常为3-7天,时效上仅相当于针式吸嘴贴球时间的十分之一到三十分之一,实用性较高。
附图说明
图1为本发明提出一种芯片植球装置的示意图;
图2为本发明提出一种芯片植球装置的正视图。
图例说明:
1、离子风嘴;2、千分尺A;3、千分尺B;4、千分尺C;5、压网气缸;6、毛刷组件;7、阶梯植球钢网;8、钢网定位组件;9、氮气入口;10、植球毛刷;11、铜质柔性片;12、固定台。
具体实施方式
为了能够更清楚地理解本发明的上述目的、特征和优点,下面结合附图和实施例对本发明做进一步说明。需要说明的是,在不冲突的情况下,本申请的实施例及实施例中的特征可以相互组合。
在下面的描述中阐述了很多具体细节以便于充分理解本发明,但是,本发明还可以采用不同于在此描述的其他方式来实施,因此,本发明并不限于下面公开说明书的具体实施例的限制。
实施例一
请参阅图1-2,本发明提供一种技术方案:一种芯片植球装置,包括固定台12,固定台12的顶面固定安装有千分尺A2和千分尺B3,固定台12的底面固装有千分尺C4和压网气缸5,千分尺C4的数量为四组,四组千分尺C4均匀分布于固定台12的底面,固定台12的侧面固定安装有离子风嘴1,压网气缸5的输出端安装有阶梯植球钢网7,阶梯植球钢网7的表面开设有孔洞,孔洞用于过锡,且孔洞均匀分布于阶梯植球钢网7的表面,固定台12的顶面固定安装有毛刷组件6,毛刷组件6的输出端安装有植球毛刷10。
请参阅图1-2,固定台12的表面固定安装有钢网定位组件8,通过钢网定位组件8和阶梯植球钢网7,可以有效防止阶梯植球钢网7移位,并且通过利用压网气缸5即可固定阶梯植球钢网7,固定台12的顶面连通有氮气入口9,通过氮气入口9注入氮气以保护锡球,防止锡球氧化,同时离子风嘴1还可以对锡球吹风,从而消除植球中产生的静电,固定台12的顶面安装有铜质柔性片11,压网气缸5在固定台12的底面呈对称状分布,固定台12的表面边缘开设有倒角,倒角可以去除固定台12的边缘毛刺,提高品质。
工作原理:通过钢网定位组件8和阶梯植球钢网7,可以有效防止阶梯植球钢网7移位,并且通过利用压网气缸5即可固定阶梯植球钢网7,然后通过调整千分尺A2即可调整植球毛刷10水平,在通过调整千分尺B3即可调整植球毛刷10高度,再通过千分尺C4调整阶梯植球钢网7水平以达到植球毛刷10和阶梯植球钢网7紧密贴合,并通过铜质柔性片11来自动将植球装置、锡球、阶梯植球钢网7上的静电释放掉,以保证每一颗锡球不会与其它锡球沾结在一起,最后通过氮气入口9注入氮气以保护锡球,防止锡球氧化,同时离子风嘴1还可以对锡球吹风,从而消除植球中产生的静电。本发明中的锡球通过阶梯植球钢网7均匀地安装在芯片、基板、晶圆等器件上,并且解决了静电、水平、锡球氧化等问题对锡球在植入安装过程中的影响,实现0.15mm以上锡球植球良率在99.99%以上,其中所配合使用的阶梯植球钢网7、芯片器件之固定治具制作时间通常为3-7天,时效上仅相当于针式吸嘴贴球时间的十分之一到三十分之一。
以上所述,仅是本发明的较佳实施例而已,并非是对本发明作其它形式的限制,任何熟悉本专业的技术人员可能利用上述揭示的技术内容加以变更或改型为等同变化的等效实施例应用于其它领域,但是凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与改型,仍属于本发明技术方案的保护范围。
Claims (5)
1.一种芯片植球装置,包括固定台(12),其特征在于:所述固定台(12)的顶面固定安装有千分尺A(2)和千分尺B(3),所述固定台(12)的底面固装有千分尺C(4)和压网气缸(5),所述固定台(12)的侧面固定安装有离子风嘴(1),所述压网气缸(5)的输出端安装有阶梯植球钢网(7),所述固定台(12)的顶面固定安装有毛刷组件(6),所述毛刷组件(6)的输出端安装有植球毛刷(10),所述固定台(12)的表面固定安装有钢网定位组件(8),所述固定台(12)的顶面连通有氮气入口(9),所述固定台(12)的顶面安装有铜质柔性片(11)。
2.根据权利要求1所述的芯片植球装置,其特征在于:所述阶梯植球钢网(7)的表面开设有孔洞,且孔洞均匀分布于阶梯植球钢网(7)的表面。
3.根据权利要求1所述的芯片植球装置,其特征在于:所述千分尺C(4)的数量为四组,四组所述千分尺C(4)均匀分布于固定台(12)的底面。
4.根据权利要求1所述的芯片植球装置,其特征在于:所述压网气缸(5)在固定台(12)的底面呈对称状分布。
5.根据权利要求1所述的芯片植球装置,其特征在于:所述固定台(12)的表面边缘开设有倒角。
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