CN116230338A - Patch PTC overcurrent protection element with improved welding performance - Google Patents
Patch PTC overcurrent protection element with improved welding performance Download PDFInfo
- Publication number
- CN116230338A CN116230338A CN202211720651.9A CN202211720651A CN116230338A CN 116230338 A CN116230338 A CN 116230338A CN 202211720651 A CN202211720651 A CN 202211720651A CN 116230338 A CN116230338 A CN 116230338A
- Authority
- CN
- China
- Prior art keywords
- conductive
- electrode
- ptc
- layer
- base layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 26
- 239000010410 layer Substances 0.000 claims abstract description 100
- 239000002131 composite material Substances 0.000 claims abstract description 65
- 229920000642 polymer Polymers 0.000 claims abstract description 27
- 239000011247 coating layer Substances 0.000 claims abstract description 13
- 238000005530 etching Methods 0.000 claims abstract description 13
- 238000013461 design Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 6
- 229920002521 macromolecule Polymers 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000011888 foil Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000005553 drilling Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000011162 core material Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 239000002356 single layer Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000007613 environmental effect Effects 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000011231 conductive filler Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 238000012546 transfer Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000011218 segmentation Effects 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 9
- 238000009413 insulation Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000000976 ink Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- -1 drilling Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/028—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
Abstract
The utility model relates to a patch PTC overcurrent protection element with improved welding performance, which is characterized in that a conductive high polymer composite material is used as a surface-mounted high polymer PTC (positive temperature coefficient) overcurrent protection element, and an element chip layer adopts a two-angle conduction process; the bonding pad segmentation design is adopted, so that the product can be effectively prevented from being uneven after welding; the etching area of the PTC chip layer with the protection effect is reduced, and the resistance of the element can be effectively reduced; the four sides of the element are coated with coating layers.
Description
Technical Field
The utility model relates to an electronic component taking a conductive high-molecular polymer composite material as a main material, in particular to an overcurrent protection element with a novel structure, which has the advantages of reducing element resistance and improving flatness of the element after welding.
Background
The PTC material with positive temperature coefficient can maintain lower resistance value at normal temperature, has sharp response to temperature change, namely when overcurrent or overtemperature phenomenon occurs in the circuit, the resistance of the PTC material can be instantaneously increased to a high resistance value, so that the circuit is in an open circuit state, and the aim of protecting circuit elements is fulfilled. The polymer-based conductive composite can thus be connected into an electrical circuit as a material for a current sensing element. Overcurrent protection elements prepared from such materials have been widely used in electronic circuits.
In recent years, along with the development of miniaturization and intellectualization of intelligent devices, requirements on PTC elements are also increasing, PTC elements are required to have smaller size, lower resistance and better environmental stability, and currently, surface mount overcurrent protection elements with excellent environmental stability on the market generally use four side coating processes, and as the four sides of the elements are coated with coating materials, the four side coating particles of the product are likely to have areas higher than the front surface of the product, as shown in fig. 1, one coating particle 1 is provided. When the element passes through the furnace for welding, the element cannot be in flat contact with the circuit board, and when the element passes through the furnace, the solder paste is not uniformly melted and dispersed, so that the phenomena of element welding deviation, unevenness or cold joint and the like are caused, and the use of a customer is seriously influenced.
In the prior art, the PTC of the surface-mounted device with excellent environmental performance is coated by using coating materials on four sides, and the PTC chip is isolated from the outside, so as to achieve the purpose of improving environmental performance, and in the process of production and coating, there are situations that four side coating layers are higher than the front side of the device, resulting in phenomena of offset, unevenness or cold welding during the welding of the device, and seriously affecting the use of customers.
Disclosure of Invention
The utility model aims at: a patch PTC overcurrent protection element with improved welding performance is provided, so as to solve the problems of offset, unevenness, cold joint and the like caused by the fact that a coating layer is higher than the front surface of the element during the welding of a coating type PTC.
The utility model aims at realizing the following scheme: a patch PTC overcurrent protection element for improving welding performance is of a single-layer structure or a multi-layer PTC chip parallel structure, and comprises:
the PTC chip includes: polymer conductive composite base layer with positive temperature coefficient
(a) The first conductive electrode is positioned on the first surface of the macromolecule conductive composite material base layer;
(b) The second conductive electrode is positioned on the second surface of the macromolecule conductive composite material base layer;
wherein,,
the first conductive hole is positioned at one corner of the PTC chip and is electrically connected with one conductive electrode in each macromolecule conductive composite material base layer, and is not connected with the other conductive electrode;
the second conductive hole is positioned at the other corner of the PTC chip position, is not connected with the conductive electrode which is electrically connected with the first conductive hole in each macromolecule conductive composite material base layer, and is electrically connected with the conductive electrode which is not connected with the first conductive hole in each macromolecule conductive composite material base layer;
the first end electrode is positioned on two surfaces of the outermost layer of the whole element, is connected with the first conductive hole and used as a bonding pad, and is welded into the protection circuit by adopting a bonding pad separation design to ensure that the element is electrically connected with one pole of the external circuit;
the second terminal electrode is positioned on two sides of the outermost layer of the whole element as well as the first terminal electrode, is electrically isolated from the first terminal electrode, is connected with the second conductive hole and is used as a bonding pad, and the terminal electrode connected with the conductive electrode is welded into a circuit by adopting a bonding pad separation design so as to electrically connect the element with the other electrode of the external circuit;
the insulating layer is adhered between the conductive electrode and the terminal electrode on the outermost polymer conductive composite material base layer, and the conductive electrode among the layers of more than two composite material layers is electrically isolated by the insulating layer;
the side coating layers are positioned on four sides of the element, so that the conductive composite material base layer is isolated from the external environment.
Preferably, the volume resistivity of the conductive composite substrate is less than 0.01 Ω.m.
Preferably, the end electrode of the overcurrent protection element connected with the conductive electrode adopts a segmentation mode.
Preferably, the conducting holes are positioned at two corners of two end electrodes of the element, so that the element has better welding performance; the conductive holes are formed by laser drilling, mechanical drilling and other processes, and the conductive metal layers are attached to the surfaces of the holes, so that the shapes of the conductive holes can be any regular or irregular shape.
Preferably, the conductive filler is selected from one of carbon black powder, metal powder or conductive ceramic powder and a mixture thereof.
Preferably, the side coating layer is one of epoxy resin, polyester resin, polyamide resin, silicone rubber, polyurethane, UV resin or inorganic glue or a compound thereof.
Preferably, the upper and lower surfaces of the PTC element are divided into two parts by one electrode.
The utility model provides a method for preparing a patch PTC overcurrent protection element with improved welding performance, which comprises the steps of forming a composite sheet by a high polymer composite material base layer and a first conductive electrode and a second conductive electrode which are closely adhered on two sides of the high polymer material base layer, etching an insulating groove on the conductive electrode of the composite sheet by an inner layer pattern transfer etching technology, then pressing by a press, wherein insulating PP and metal foil are adopted on the uppermost layer and the lowermost layer of a PTC core material by a single-layer structure element, insulating PP and metal foil are adopted on the uppermost layer and the lowermost layer of the PTC core material except for the multi-layer parallel structure element, insulating PP is also required to be pressed between the PTC core materials, then, the pressed substrate is subjected to the steps of tinning, etching an outer layer pattern, printing solder resist ink, curing solder resist ink, drilling, copper deposition, copper plating and the like by the subsequent steps, and finally cutting and coating to obtain the PTC overcurrent protection element with excellent welding performance and environmental performance.
The utility model is characterized in that: 1. the protection element is of a single-layer structure or a multi-layer PTC chip parallel structure, the PTC chips are connected in a two-angle conductive mode, the other two angles are not treated, the etching area of the PTC can be effectively reduced, the area of the PTC chips is increased, and the resistance is reduced; the PTC adopts a bonding pad segmentation design, so that the problems of offset, unevenness, cold joint and the like generated during the welding of the elements can be effectively reduced.
Drawings
Fig. 1: the conventional product structure and the coating layer are higher than the front surface of the element;
fig. 2: an overall perspective view of embodiment 1 of the present utility model;
fig. 3: the whole side surface of the embodiment 1 of the utility model is coated with a perspective view;
fig. 4: an overall perspective view of embodiment 2 of the present utility model;
fig. 5: example 2 perspective view of the utility model after Whole side coating
Fig. 6: analytical map of Single layer sheet Structure according to example 1 of the present utility model
Description of the reference numerals in the drawings
1-coating layer particles;
2. 2a, 2 b-a first conductive electrode;
3. 3a, 3 b-a polymeric conductive composite substrate;
4. 4a, 4 b-second conductive electrodes;
5. 5a, 5 b-insulating layers;
6. 6a, 6b—a segmented first portion of the first end electrode;
7. 7a, 7 b-dividing the second portion of the first terminal electrode;
8. 8a, 8 b-second terminal electrodes;
9—a first conductive aperture;
10-a second conductive aperture;
11-a coating layer;
12. 12a, 12b resist the ink layer.
Detailed Description
The preparation method comprises the steps of preparing a PTC core material according to the preparation process of a traditional PTC element:
firstly, preparing a conductive polymer composite material: mixing high molecular polymer and conductive filler in high-speed mixer, granulating with twin-screw, extruding sheet with single screw, attaching electrode foil on upper and lower parts, calendaring with calender to obtain composite sheet, and subjecting the composite sheet to gamma ray (Co) 60 ) Or electron beam irradiation crosslinking with dosage of 5-100 Mrad, and preparing into surface-mounted polymer PTC overcurrent by adopting printed circuit board processAnd a protection element.
Example 1
A patch PTC overcurrent protection element for improving soldering performance of a single-layer PTC chip, as shown with reference to fig. 2, 3, and exploded view 6, comprising:
a PTC chip, a polymer conductive composite material base layer 3 with positive temperature coefficient, and
(a) The first conductive electrode 2 is positioned on the first surface of the macromolecule conductive composite material base layer;
(b) The second conductive electrode 4 is positioned on the second surface of the macromolecule conductive composite material base layer;
a first conductive hole 9, which is positioned at one corner of the PTC chip and is electrically connected with the first conductive electrode and is not connected with the corresponding second conductive electrode 3;
the second conductive hole 10 is positioned at the other corner of the PTC chip position, is not connected with the first conductive electrode 2, and is electrically connected with the second conductive electrode 4;
the first terminal electrode is positioned on two surfaces of the outermost layer of the whole element, is connected with the first conductive hole 9 and is used as a bonding pad, and the terminal electrode connected with the conductive electrode adopts a bonding pad separation design, namely, the first terminal electrode is divided into a first part 6, 6a and 6b, and the first terminal electrode is divided into a second part 7, 7a and 7b; welding the element into a protection circuit to electrically connect the element with one pole of an external circuit;
the second terminal electrode 8, locate on the two sides of the outermost layer of the whole component as the first terminal electrode, and isolate electrically with the first terminal electrode, connect the second conductive hole 10, use as the pad, the terminal electrode connected with conductive electrode adopts the pad to separate the design, weld to the circuit, make the component electrically connect with another pole of the external circuit;
an insulating layer 5a, which is attached between the first conductive electrode 2 and the terminal electrode on the outermost polymer conductive composite material base layer, and an insulating layer 5b, which is attached between the second conductive electrode 4 and the terminal electrode on the outermost polymer conductive composite material base layer;
the side coating layers 11 are positioned on four sides of the element, and isolate the conductive composite material base layer from the external environment.
The preparation method comprises the following steps:
mixing high-density polyethylene and metal tungsten carbide powder in a high-speed pre-mixer according to a predetermined technological proportion for 45min; granulating the mixture components at 225 ℃ in a double-screw granulator, cooling, crushing and extruding through a single-screw extruder; the upper and lower layers are attached with electrode foils after the rolling of the calender, and the area is 500cm 2 A polymer composite material base layer 3 with the thickness of 0.25-0.30 mm; the PTC composite sheet of the upper and lower electrode foils 2, 4 was heat treated in a vacuum oven at 135 ℃ for 4 hours, and then irradiated with gamma rays (Co 60 ) Irradiating with a dose of 32Mrad; thereafter, as shown in FIG. 6,
respectively etching the first conductive electrode 2 and the second conductive electrode 4 into insulation grooves by a PCB (printed circuit board) processing technology through a PCB etching technology, then superposing an insulation layer 5a between the first conductive electrode and a metal foil, superposing another insulation layer 5b between the second conductive electrode 4 and another metal foil, performing high-temperature lamination, tinning the laminated substrate through an end electrode, etching an outer layer pattern, printing solder resist inks 12 and 12b to form a first end electrode first partition part 6 and a first end electrode second partition part 7 and a second end electrode 8, and then performing subsequent drilling, copper deposition and copper plating to form a first conductive hole 9 and a second conductive hole 10; and then the side surface of the element is cut to form a coating layer 11, so that the PTC overcurrent protection element with one end electrode division and excellent welding performance is prepared.
Example 2
A patch PTC overcurrent protection element with improved welding performance, referring to fig. 4 and 5, is a double-layer PTC chip parallel structure, wherein:
the upper and lower PTC chips include: polymeric conductive composite substrates 3a, 3b having positive temperature coefficient and corresponding thereto
(a) First conductive electrodes 2a, 2b located on the first surfaces of the upper and lower polymer conductive composite base layers 3a, 3 b;
(b) Second conductive electrodes 4a, 4b located on the second surfaces of the upper and lower polymer conductive composite base layers 3a, 3 b;
a first conductive hole 9 is positioned at one corner of the PTC chip, is electrically connected with the first conductive electrode 2a in the upper macromolecule conductive composite material base layer 3a, is electrically connected with the second conductive electrode 4b in the lower macromolecule conductive composite material base layer 3b, and is not connected with the other corresponding conductive electrode 2b, 4 a;
the second conductive hole 10 is positioned at the other corner of the PTC chip position, is electrically connected with the second conductive electrode 4a in the upper macromolecule conductive composite material base layer 3a, is electrically connected with the first conductive electrode 2b in the lower macromolecule conductive composite material base layer 3b, and is not connected with the other corresponding conductive electrodes 2a and 4 b;
the first terminal electrode is located on two sides of the outermost layer of the whole component, is connected with the first conductive hole 9, is used as a bonding pad, and is connected with the conductive electrode, namely: a split first portion 6 of the first end electrode, a split second portion 7 of the first end electrode; welding the element into a protection circuit to electrically connect the element with one pole of an external circuit;
a second terminal electrode 8, which is located on both sides of the outermost layer of the entire element as the first terminal electrode, is electrically isolated from the first terminal electrode, is connected to the second conductive via 10, and is soldered to the circuit to electrically connect the element to the other electrode of the external circuit;
the insulating layer is adhered between the conducting electrode and the terminal electrode on the outermost polymer conducting composite material base layer and between the conducting electrodes of the two composite material layers, and comprises an insulating layer 5a between the first conducting electrode 2a and the terminal electrode of the upper polymer conducting composite material base layer 3a, an insulating layer 5c between the second conducting electrode 4b and the terminal electrode of the lower polymer conducting composite material base layer 3b and an insulating layer 5b between the conducting electrodes of the upper polymer conducting composite material base layers 3a and the lower polymer conducting composite material base layers 3 b;
the side coating layers 11, see fig. 4, are located on the four sides of the component, isolating the conductive composite substrate from the environment.
The preparation method comprises the following steps:
mixing high-density polyethylene and metal tungsten carbide in a high-speed mixer according to a certain proportion for 45min; granulating the mixture components at 225 ℃ in a double-screw granulator, cooling, crushing, extruding by a single-screw extruder, and attaching electrodes on the upper layer and the lower layer after the rolling of a calenderFoil, pressed into 500cm area 2 A polymer composite material base layer 3 with the thickness of 0.3mm, upper and lower electrode foils 2, 4 to obtain a polymer PTC composite sheet, heat treating in a vacuum oven at 135 deg.C for 4 hr, and irradiating with gamma rays (Co 60 ) Irradiating with a dose of 32Mrad; then, through a PCB processing technology, the first layer composite sheet material enables the first conductive electrode 2a and the second conductive electrode 4a to be respectively etched into insulation grooves through a PCB etching technology, the second layer composite sheet material enables the first conductive electrode 2b and the second conductive electrode 4b to be respectively etched into insulation grooves through a PCB etching technology, then, an insulation PP5a is overlapped between the first layer composite sheet electrode and a metal foil, and meanwhile, another insulation PP5c is used for being overlapped between the second layer composite sheet electrode and another metal foil; the insulating PP5b is connected with the first layer of composite sheet electrode 4a and the second layer of composite sheet electrode 2b, then high-temperature lamination is carried out, and the laminated substrate is subjected to steps of end electrode tin plating, outer layer pattern etching, printing solder resist ink 12 and the like to form first end electrodes 6 and 7 and a second end electrode 8; then, two conductive holes, namely a first conductive hole 9 and a second conductive hole 10, are formed through subsequent drilling, copper deposition and copper plating; and then coating 11 on the periphery of the side surface of the element after dicing, thereby preparing the polymer PTC overcurrent protection element with one end electrode segmentation and excellent welding performance.
The parallel connection structure of three layers or more PTC chips can be designed, and the parallel connection structure similar to that of the embodiment 2 is adopted, and the same conduction mode is adopted, so that the welding performance of the overcurrent protection element is improved.
The novel technical content and technical features of the present utility model have been disclosed above, however, those skilled in the art may make various substitutions and modifications based on the teaching and disclosure of the present utility model without departing from the spirit of the present utility model. Accordingly, the scope of the present utility model should not be limited to the embodiments disclosed, but should include various alternatives and modifications without departing from the utility model, and be covered by the following claims.
Claims (8)
1. A patch PTC overcurrent protection element for improving welding performance is of a single-layer structure or a multi-layer PTC chip parallel structure, and comprises:
the PTC chip includes: polymer conductive composite base layer with positive temperature coefficient
(a) The first conductive electrode is positioned on the first surface of the macromolecule conductive composite material base layer;
(b) The second conductive electrode is positioned on the second surface of the macromolecule conductive composite material base layer;
it is characterized in that the method comprises the steps of,
the first conductive hole is positioned at one corner of the PTC chip and is electrically connected with one conductive electrode in each macromolecule conductive composite material base layer, and is not connected with the other conductive electrode;
the second conductive hole is positioned at the other corner of the PTC chip position, is not connected with the conductive electrode which is electrically connected with the first conductive hole in each macromolecule conductive composite material base layer, and is electrically connected with the conductive electrode which is not connected with the first conductive hole in each macromolecule conductive composite material base layer;
the first end electrode is positioned on two surfaces of the outermost layer of the whole element, is connected with the first conductive hole and used as a bonding pad, and is welded into the protection circuit by adopting a bonding pad separation design to ensure that the element is electrically connected with one pole of the external circuit;
the second terminal electrode is positioned on two sides of the outermost layer of the whole element as well as the first terminal electrode, is electrically isolated from the first terminal electrode, is connected with the second conductive hole and is used as a bonding pad, and the terminal electrode connected with the conductive electrode is welded into a circuit by adopting a bonding pad separation design so as to electrically connect the element with the other electrode of the external circuit;
the insulating layer is adhered between the conductive electrode and the terminal electrode on the outermost polymer conductive composite material base layer, and the conductive electrode among the layers of more than two composite material layers is electrically isolated by the insulating layer;
the side coating layers are positioned on four sides of the element, so that the conductive composite material base layer is isolated from the external environment.
2. The welding performance improving patch PTC overcurrent protection element of claim 1 wherein the conductive composite base layer has a volume resistivity of less than 0.01 Ω.m.
3. The patch PTC over-current protection device according to claim 1, wherein the terminal electrode of the over-current protection device connected to the conductive electrode is divided.
4. The patch PTC overcurrent protection device for improving soldering performance according to claim 1, wherein the conductive holes are formed at both corners of the two terminal electrodes of the device by laser drilling or mechanical drilling, and the conductive metal layer is attached to the surface of the holes.
5. A patch PTC over-current protection component for improving soldering performance according to claim 1, wherein the conductive filler is selected from one of carbon black powder, metal powder or conductive ceramic powder, and a mixture thereof.
6. The patch PTC over-current protection component of claim 1, wherein the side coating layer is one of epoxy resin, polyester resin, polyamide resin, silicone rubber, polyurethane, UV resin or inorganic adhesive or a composite thereof.
7. The welding performance improving patch PTC overcurrent protection device of claim 1 wherein the upper and lower faces of the PTC element are each provided with one end electrode divided into segments.
8. A method for producing a patch PTC overcurrent protection element having improved soldering properties according to any one of claims 1 to 7, characterized in that a composite sheet is formed of a polymer composite base layer and first and second conductive electrodes closely adhered to both sides of the polymer composite base layer, the conductive electrodes of the composite sheet are etched into insulating grooves by an inner pattern transfer etching technique, and then pressed by a press, and the single-layer structural element is formed by insulating PP and a metal foil on the uppermost and lowermost layers of the PTC core material; the multi-layer parallel structure element adopts insulating PP and metal foil except the uppermost layer and the lowermost layer of the PTC core material, and further needs to press insulating PP between the PTC core materials, then, the pressed substrate is subjected to the following steps of outer layer metal foil tin plating, outer layer pattern etching, solder resist ink printing, solder resist ink curing, drilling, copper deposition and copper plating, and finally, the PTC overcurrent protection element with excellent welding performance and environmental performance is obtained through scribing and coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211720651.9A CN116230338A (en) | 2022-12-30 | 2022-12-30 | Patch PTC overcurrent protection element with improved welding performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211720651.9A CN116230338A (en) | 2022-12-30 | 2022-12-30 | Patch PTC overcurrent protection element with improved welding performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116230338A true CN116230338A (en) | 2023-06-06 |
Family
ID=86590166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211720651.9A Pending CN116230338A (en) | 2022-12-30 | 2022-12-30 | Patch PTC overcurrent protection element with improved welding performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116230338A (en) |
-
2022
- 2022-12-30 CN CN202211720651.9A patent/CN116230338A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100377309B1 (en) | An Improved Method To Embed Passive Components | |
| US5041183A (en) | Method for the preparation of a hot-melt adhesive interconnector | |
| CN101923928B (en) | High-frequency patch resistor and manufacturing method thereof | |
| US20140020933A1 (en) | Thermally conductive printed circuit boards | |
| CN101335125B (en) | Surface mounted over-current over-temperature protection element and manufacturing process | |
| WO2011079549A1 (en) | Surface-mount type over-current protection element | |
| WO2024139788A1 (en) | Surface mounted overcurrent protection element | |
| EP0790625A2 (en) | PTC element | |
| CN210805371U (en) | Overcurrent protection element | |
| CN116230338A (en) | Patch PTC overcurrent protection element with improved welding performance | |
| US8451084B2 (en) | Laminated surface mounting type thermistor and manufacturing method thereof | |
| CN110853849B (en) | Overcurrent protection element | |
| CN212570572U (en) | PTC over-current protection device capable of effectively improving long-term environmental stability | |
| JP3820629B2 (en) | PTC thermistor | |
| US6656304B2 (en) | Method for manufacturing a PTC element | |
| CN113674937A (en) | Low-resistance high-reproducibility PTC (Positive temperature coefficient) overcurrent protection element | |
| CN116705440A (en) | Novel-structure parallel PTC overcurrent protection element | |
| CN210245193U (en) | Thermistor element | |
| CN112786268A (en) | Double contact surface PTC overcurrent protection element | |
| US20090002124A1 (en) | Apertured chip resistor and method for fabricating same | |
| CN102610341A (en) | Surface-mounted macromolecule PTC (positive temperature coefficient) element and manufacturing method thereof | |
| JPH09199302A (en) | Chip thermistor and its manufacture | |
| CN111696739A (en) | PTC over-current protection device capable of effectively improving long-term environmental stability | |
| JP3820825B2 (en) | PTC thermistor | |
| JP3444240B2 (en) | Manufacturing method of chip type PTC thermistor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |