CN116215958A

CN116215958A - Packaging tray and packaging method for micro-mucosa-attached flexible circuit board

Info

Publication number: CN116215958A
Application number: CN202211728798.2A
Authority: CN
Inventors: 黄新泓; 吴琼; 刘绪愿
Original assignee: Shenzhen Xindahui Flex Circuit Technology Co ltd
Current assignee: Shenzhen Xindahui Flex Circuit Technology Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-06-06

Abstract

The invention provides a packaging tray for a micro-mucosa attached flexible circuit board and a packaging method, the packaging tray comprises a tray body, the tray body comprises a front surface and a back surface, a plurality of circuit board placement areas are arranged in the front surface, a non-concave area corresponding to the placement areas is a non-placement area, and the packaging tray further comprises: the edge of the non-placing area is provided with a flange boss; the flange boss is provided with a plurality of hand through grooves; the placement area is provided with a plurality of placement grooves; the connection part of the placement grooves is provided with interval bulges which divide the placement area into a plurality of placement grooves; the hand through groove is connected with the placing groove. Pressing the release film through the hand through groove to enable the release film to be attached to the micro-mucosa, aligning and placing the circuit board, and rapidly packaging the circuit board; the tray placing area is provided with interval protrusions for preventing micro-mucosa adhesion from overlapping, and the number and the positions of the tray placing area can be set according to the specification of the shipment package, so that products with uniform specification can be produced rapidly at the same time, and the packaging efficiency is improved; the hand through groove is attached to the finger of a person in size, so that the hand through groove accords with human engineering and is convenient to operate.

Description

Packaging tray and packaging method for micro-mucosa-attached flexible circuit board

Technical Field

The invention relates to the field of printed circuit board production, in particular to a packaging tray for a micro-adhesive-film-attached flexible circuit board and a packaging method.

Background

The flexible circuit board, namely the flexible board or the FPC for short, can provide excellent electrical performance, can also meet the design requirement of smaller and higher-density installation, is beneficial to reducing assembly procedures and enhancing reliability, and is the best solution for meeting the miniaturization and movement requirements of electronic products. The flexible bending type wire bending machine can be freely bent, wound and folded, can bear millions of dynamic bending without damaging wires, can be randomly arranged according to space layout requirements, and can be randomly moved and stretched in a three-dimensional space, so that the integration of component assembly and wire connection is achieved; the flexible circuit board can greatly reduce the volume and weight of the electronic product, and is suitable for the requirements of the electronic product on high density, miniaturization and high reliability.

Nowadays, with the rapid development of flexible circuit boards, flexible circuit boards are increasingly developed toward the trend of light weight, thinness and miniaturization, and at the same time, requirements for quality, appearance, performance and the like of flexible circuit boards are also increasingly high. The production process of the flexible circuit board is to directly process the whole part of the continuous printing plate product, and the continuous printing plate product of the flexible circuit board contains a plurality of single flexible circuit board products which are uniformly distributed at intervals.

The flexible circuit boards passing ICT test are usually placed in a general tray in disorder, and overlapping crush injury of the flexible circuit boards is easy to occur; the packaging worker manually and singly sticks the single flexible circuit board to the micro-mucosa according to typesetting sequence, and covers the release film, so that the process is complicated, manual alignment is needed, the film sticking efficiency is low, and the circuit board is easy to discard and damage; meanwhile, when the order quantity is large and the time of the exchange is urgent, the flexible circuit board is packaged by the manual single pcs, so that the overall packaging efficiency is low, the efficiency of work and production is affected, and the manpower time following cost is increased.

Disclosure of Invention

In view of the above, the present invention provides a flexible circuit board packaging tray and a packaging method for attaching a micro-adhesive film to a flexible circuit board in order to improve packaging efficiency of the flexible circuit board.

The invention provides the following technical scheme:

the utility model provides a attached flexible circuit board encapsulation tray of little mucosa, includes the tray body, the tray body include the front with the back that the front is relative, the front is inside to be provided with a plurality of sunken circuit board and places the district, with place other non-sunken areas that the district corresponds and be non-and place the district, include:

the edge of the non-placing area is provided with a flange boss;

the flange boss is provided with a plurality of hand through grooves;

the placement area is provided with a plurality of placement grooves;

the connecting part of the placing grooves is provided with spacing protrusions which divide the placing area into a plurality of placing grooves;

the hand through groove is connected with the placing groove.

Preferably, the upper surface of the placement groove is provided with a micro-adhesive film, the micro-adhesive film is arranged in the opposite direction of the placement groove, and the circuit board is placed on the micro-adhesive film.

Preferably, the micro-mucosa size is not larger than the placement groove size.

Preferably, the hand through groove is arranged at one end and/or two ends of the placing groove; the height of the hand through groove is not higher than that of the placing groove.

Preferably, the flange boss is provided with a plurality of supporting grooves; the support grooves face the back to form support columns protruding out of the back; when stacking and placing the trays, the support columns on the back of the upper tray are buckled and installed with the support grooves of the lower tray.

Preferably, the length of the hand through groove is 5 mm-12 mm; the width of the hand through groove is 0 mm-5 mm; the depth of the hand through groove is 10-11 mm; the length of the hand through groove is not more than that of the placing groove; the width of the hand through groove is consistent with that of the flange boss.

Preferably, one corner of the tray is provided with a fool-proof chamfering notch.

Preferably, the upper surface of the flange boss is provided with a fool-proof arrow mark.

Preferably, the tray material comprises an antistatic material.

A packaging method of a micro-mucosa attached flexible circuit board comprises the following steps:

s01, cutting a micro-mucosa according to the size of a groove for placing the tray, separating a release film on the surface of the micro-mucosa, and placing the release film on one side for later use;

s02, placing a micro-adhesive film on the upper surface of a placement groove on the front surface of the tray through a hand through groove, wherein the micro-adhesive film is upwards with an adhesive layer;

s03, grabbing the flexible circuit board by the equipment manipulator to perform an ICT process, and sequentially arranging the flexible circuit board passing through the ICT process on the micro-mucosa of the placement groove;

s04, aligning the release film with the placement groove through the hand through groove, and placing the release film on the placement groove attached with the continuous flexible circuit board;

s05, pressing the release film towards the direction of the placement groove through the hand through groove, so that the release film is attached to the micro-mucosa, and the packaged continuous flexible circuit board is obtained.

Embodiments of the present invention have the following advantages:

placing a micro-adhesive film on the upper surface of a tray placing groove in advance, after a mechanical arm of the equipment automatically places a circuit board, placing a release film on the upper surface of the placing groove by a worker, and pressing the release film towards the direction of the tray through a hand through groove, so that the release film is attached to the micro-adhesive film, and the circuit board can be packaged rapidly without placing and accurately aligning the circuit board;

the hand through grooves are arranged at one end and/or two ends of the placing groove, meanwhile, the length of each hand through groove is fit with the width of a finger of a person, and each hand through groove can accommodate 1-5 fingers of the person to be placed in, so that a worker can place the fingers in the hand through grooves to fit the release film, and the habit of pasting the release film by the worker is met;

the tray placing area is provided with the interval protrusions, so that the micro-mucosa can be prevented from adhering and overlapping, and the alignment is convenient when the release film is attached, and the release film is prevented from being attached to the offset; the number and the positions of the interval protrusions can be set according to the specification of the circuit board shipment package, so that workers can simultaneously and rapidly produce products with uniform specification, and the packaging efficiency is improved;

the tray is provided with a plurality of support grooves, and support grooves form the support column that protrudes in the back towards the back, and when stacking the placing tray, the support column at the tray back above and the support groove buckle installation of tray below for when the tray stacks, when guaranteeing to just detain between the tray, the space is higher between two trays, can not take the below tray when sucking up the top tray.

In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. FIG. 1 is a schematic diagram of the front structure of a tray before attaching a micro-adhesive film, which is a flexible circuit board packaging tray and a packaging method for attaching a micro-adhesive film;

fig. 2 is a schematic diagram of the front structure of a tray for placing a circuit board after attaching a micro-adhesive film, which is a flexible circuit board packaging tray and a packaging method for attaching a micro-adhesive film according to the present invention;

FIG. 3 is a schematic view of the reverse side of a tray for packaging a flexible circuit board and a packaging method for attaching a micro-adhesive film;

the attached drawings are used for identifying and describing:

1-a tray; 11-flange bosses; 111-support grooves; 112-support columns; 12-a hand through groove; 13-placing grooves; 14-spacing projections; 15-a micro-mucosa; 2-a circuit board; 3-fool-proof chamfering notch.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the templates herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Example 1

The utility model provides a flexible circuit board packaging tray is attached to little mucosa, includes tray 1 body, in this embodiment, the size of tray 1 body is: 39 x 30 x 1.2cm; the tray 1 body comprises a back surface opposite to the front surface, wherein a plurality of recessed circuit board 2 placement areas are arranged in the front surface, and the size of each placement area is 35.55 x 25.55 x 0.8cm; the other non-recessed areas corresponding to the placement areas are non-placement areas;

the placement area is provided with two placement grooves 13, and the placement grooves 13 are of the following size: 25.55 x 17.63 x 0.8cm; a spacing protrusion 14 is arranged at the joint of the two placement grooves 13 to divide the placement area into two placement grooves 13; the upper surface of the placement groove 13 is provided with a micro-adhesive film 15, and the size of the micro-adhesive film 15 is slightly smaller than the size of the placement groove 13, so that a worker can place the micro-adhesive film 15 into the placement groove 13; the micro-adhesive film 15 with the adhesive layer after the release film is removed faces to the opposite direction of the placing groove 13;

in the present embodiment, the size of the spacing projections 14 is: 25.55 x 0.3 x 0.8cm; the spacing protrusions 14 are connected with the two flange bosses 11, so that the adhesion and overlapping of the micro-adhesive films 15 can be prevented, the number and the positions of the spacing protrusions 14 can be set according to the specification of the circuit board 2 shipment package, a worker can simultaneously and rapidly produce products with uniform specification, and the packaging efficiency is improved;

in this embodiment, eight double-sided flexible circuit boards 2 are placed on a micro adhesive film 15 with an adhesive layer, so that sixteen double-sided flexible circuit boards 2 can be placed on one tray 1;

the edges of the four sides of the non-placing area are provided with flange bosses 11;

the flange boss 11 is provided with four hand through grooves 12; the hand through grooves 12 are in corresponding relation with each other, the two hand through grooves 12 are a group, and the hand through grooves 12 are connected with the placing groove 13; the two groups of hand through grooves 12 are respectively arranged at two sides of the two placing grooves 13, namely the left side and the right side, respectively correspond to the left hand and the right hand of a person, so that a worker can use the left hand and the right hand to match and paste a release film, and the working habit of the person is met;

in the embodiment, the length of the hand through groove 12 is 11.22cm; the width of the hand through groove 12 is 3.21cm; the depth of the hand through groove 12 is 0.11cm; the length of the hand through groove 12 is not more than that of the placing groove 13; the width of the hand through groove 12 is consistent with that of the flange boss 11, so that a worker can press the release film positioned above the placement groove 13 through the hand through groove 12;

the height of the finger through groove is not higher than that of the placing groove 13, so that a worker can press the release film to the micro-adhesive film 15 with an adhesive layer through the finger through groove, and the release film is tightly attached; if the finger through groove is higher than the placing groove 13, there is a risk that the release film cannot be attached to the micro-mucosa 15 or has bubbles;

each rib boss 11 is provided with one to two support grooves 111; the supporting groove 111 has a groove depth of 0.3cm; the support groove 111 forms a support column 112 protruding from the back toward the back; when stacking and placing the trays 1, the support columns 112 on the back of the upper tray 1 are buckled and installed with the support grooves 111 of the lower tray 1, so that when the trays 1 are stacked, the gap between the two trays 1 is higher when the forward and reverse buckling between the trays 1 is ensured, and the lower tray 1 cannot be taken up when the upper tray 1 is sucked up.

One corner of the tray 1 is provided with a chamfer notch 3; meanwhile, the arrow is arranged on the upper surface of the flange boss 11, so that the direction of the tray 1 can be conveniently distinguished, and the fool-proof effect is achieved.

The tray 1 is made of black PS antistatic materials, and static electricity is prevented from being generated, so that workers are prevented from being adhered to a release film to have deviation, and the electrical property of the FPC is prevented from being damaged due to electrostatic breakdown of components.

Example 2

s01, cutting the micro-mucosa 15 according to the size of the placement groove 13 of the tray 1, separating a release film on the surface of the micro-mucosa 15, and placing the release film on one side for standby;

in this embodiment, the size of the single placement groove 13 is 25.55×17.63×0.8cm, and the size of the single micro-mucosa 15 is 25×17cm;

s02, placing the micro-adhesive film 15 on the upper surface of the groove through the hand through groove 12, wherein the micro-adhesive film 15 is provided with an adhesive layer upwards;

s03, grabbing the flexible circuit board 2 by an equipment manipulator to perform an ICT process, and sequentially arranging the flexible circuit board 2 passing through the ICT process on the adhesive layer of the micro-adhesive film 15 of the placement groove 13; eight double-sided flexible circuit boards 2 are in a group, and one tray 1 is used for placing two groups of circuit boards 2, namely sixteen;

s04, manually aligning the release film to a placing groove 13 through the head-tail through groove, and placing the release film on the placing groove 13 attached with a group of flexible circuit boards 2;

s05, manually pressing the release film to the direction of the tray 1 through the hand through groove 12 to attach the release film to the micro-adhesive film 15, and repeating S04 to attach the second group of flexible circuit boards 2 to the release film to obtain two groups of packaged flexible circuit boards 2.

Any particular values in all examples shown and described herein are to be construed as merely illustrative and not a limitation, and thus other examples of exemplary embodiments may have different values.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

The above examples merely represent a few embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the present invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.

Claims

1. The utility model provides a flexible circuit board packaging tray is attached to little mucosa, includes tray (1) body, tray (1) body include openly with the back that openly is relative, openly inside is provided with a plurality of sunken circuit board (2) and places the district, with place other non-sunken regions that the district corresponds and be non-and place the district, its characterized in that includes:

a flange boss (11) is arranged at the edge of the non-placing area;

the flange boss (11) is provided with a plurality of hand through grooves (12);

the placement area is provided with a plurality of placement grooves (13);

the connection part of the placement grooves (13) is provided with spacing protrusions (14) which divide the placement area into a plurality of placement grooves (13);

the hand through groove (12) is connected with the placement groove (13).

2. The flexible circuit board packaging tray for micro-adhesive attachment according to claim 1, wherein the micro-adhesive film (15) is arranged on the upper surface of the placement groove (13), the adhesive layer of the micro-adhesive film (15) faces the opposite direction of the placement groove (13), and the circuit board (2) is placed on the adhesive layer of the micro-adhesive film (15).

3. The micro-adhesive film attached flexible circuit board packaging tray according to claim 2, wherein the micro-adhesive film (15) has a size not larger than the placement groove (13).

4. The flexible circuit board packaging tray for micro-adhesive attachment according to claim 1, wherein the hand through groove (12) is arranged at one end and/or two ends of the placement groove (13); the depth of the hand through groove (12) is not higher than that of the placing groove (13).

5. The flexible circuit board packaging tray for micro-adhesive attachment according to claim 1, wherein the flange boss (11) is provided with a plurality of support grooves (111); the support groove (111) forms a support column (112) protruding from the back surface towards the back surface; when the trays (1) are stacked, the support columns (112) on the back of the upper tray (1) are buckled with the support grooves (111) of the lower tray (1).

6. The flexible circuit board packaging tray for micro-adhesive attachment according to claim 1, wherein the length of the hand through slot (12) is 5 mm-12 mm; the width of the hand through groove (12) is 0 mm-5 mm; the depth of the hand through groove (12) is 10-11 mm; the length of the hand through groove (12) is not more than that of the placing groove (13); the width of the hand through groove (12) is consistent with that of the flange boss (11); the depth of the hand through groove (12) is consistent with that of the placement groove (13).

7. The micro-adhesive film attached flexible circuit board packaging tray according to claim 1, wherein a corner of the tray (1) is provided with a fool-proof chamfer notch (3).

8. The flexible circuit board packaging tray for micro-adhesive attachment as claimed in claim 1, wherein the upper surface of the flange boss (11) is provided with fool-proof arrow marks.

9. The flexible circuit board packaging tray for micro-adhesive attachment as claimed in claim 1, wherein the tray (1) material comprises an antistatic material.

10. The packaging method of the micro-mucosa attached flexible circuit board is characterized by comprising the following steps of:

s01, cutting a micro-mucosa (15) according to the size of a placement groove (13) of the tray, separating a release film on the surface of the micro-mucosa (15), and placing the release film on one side for later use;

s02, placing a micro-adhesive film (15) on the upper surface of a placement groove (13) on the front surface of the tray (1) through the hand through groove (12), wherein the micro-adhesive film (15) is provided with an adhesive layer upwards;

s03, grabbing the flexible circuit board (2) by an equipment manipulator to perform an ICT process, and sequentially arranging the flexible circuit board (2) passing through the ICT process on the micro-mucosa (15) of the placement groove (13);

s04, aligning the release film with the placement groove (13) through the hand through groove (12), and placing the release film on the placement groove (13) attached with the continuous flexible circuit board (2);

s05, pressing the release film towards the placing groove (13) through the hand through groove (12) to enable the release film to be attached to the micro-mucosa (15), and obtaining the packaged continuous flexible circuit board (2).