CN116207516A - High-performance metamaterial wave absorber based on three-layer super surface - Google Patents
High-performance metamaterial wave absorber based on three-layer super surface Download PDFInfo
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- CN116207516A CN116207516A CN202310380030.9A CN202310380030A CN116207516A CN 116207516 A CN116207516 A CN 116207516A CN 202310380030 A CN202310380030 A CN 202310380030A CN 116207516 A CN116207516 A CN 116207516A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
- H01Q17/008—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems with a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0086—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Abstract
The invention discloses a high-performance metamaterial wave absorber based on three layers of super surfaces, which comprises wave absorbing units, wherein each wave absorbing unit comprises a medium super surface layer, a first supporting medium layer, a first electromagnetic super surface substrate, a second supporting medium layer, a second electromagnetic super surface substrate, a third supporting medium layer and a metal backboard which are sequentially arranged from top to bottom; the medium super surface layer is a regular hexagon medium patch structure with a round hole at the center; the first electromagnetic super surface comprises a special-shaped regular hexagonal ring and six first resistors loaded on the vertexes of the special-shaped regular hexagonal ring; the second electromagnetic subsurface includes a chip ring and a second resistor. The high-performance metamaterial wave absorber based on the three-layer super surface with the structure can realize-20 dB wave absorption and large-angle stability in an ultra-wideband range, so that the high-performance metamaterial wave absorber has great practical value in the fields of electromagnetic radiation reduction, electromagnetic compatibility, signal shielding and the like.
Description
Technical Field
The invention relates to the technical field of electromagnetic wave absorption, in particular to a high-performance metamaterial wave absorber based on three layers of super surfaces.
Background
Due to the rapid development of modern society technology and electronic industry, electronic products have entered into various fields of people's life, and electromagnetic radiation pollution is also brought while people's life is facilitated.
Currently, electromagnetic wave absorbing technology is the most effective measure to solve such problems. Because of the super-surface-based composite structure super-material absorber, the directional design of the wave absorbing performance can be carried out in modes of adjusting parameters of structural units, selecting characteristics of different composite materials and the like, so that the absorber becomes a research hot spot in the current wave absorbing technical field.
The metamaterial wave absorber at the present stage mainly has two research directions, one is that a plurality of absorption peaks are realized through a single complex geometric unit or a combined unit, the metamaterial wave absorber has the advantages that the thickness is relatively thin, and the disadvantage that effective wave absorption cannot be realized in a broadband range; the other is to realize 90% absorption performance in the ultra-wideband range through a multilayer super-surface design, and the advantage of the design is that the wave-absorbing frequency band is wide enough, and the disadvantage is that the wave-absorbing depth is deficient. In addition, the current collection of metamaterial absorbers generally does not consider high angle oblique incidence performance and protective designs for absorber supersurfaces.
Disclosure of Invention
In order to solve the problems, the invention provides a high-performance metamaterial wave absorber based on three layers of super surfaces, wherein when electromagnetic waves are vertically incident, the frequency band with the reflectivity lower than-10 dB is 2.2GHz-20.1GHz, and the relative bandwidth is 160.5%; the frequency band with the reflectivity lower than-20 dB is 2.7GHz-18.2GHz, and the relative bandwidth is 160.5%; when the incident angle of electromagnetic wave is 60 degrees, the frequency band with reflectivity lower than-10 dB is 4.9GHz-16.9GHz, and the relative bandwidth is 148.3%. The invention can realize that the reflectivity is lower than-20 dB in the ultra-wideband range, the oblique incidence angle is larger than 60 degrees, and the invention has the advantages of certain environmental stability, larger absorption intensity, good oblique incidence stability and the like.
In order to achieve the above purpose, the invention provides a high-performance metamaterial wave absorber based on three layers of super surfaces, which comprises a plurality of wave absorbing units with hexahedral structures, wherein each wave absorbing unit comprises a medium super surface layer, a first supporting medium layer, a first electromagnetic super surface substrate, a second supporting medium layer, a second electromagnetic super surface substrate, a third supporting medium layer and a metal backboard which are sequentially arranged from top to bottom;
the medium super surface layer is a regular hexagon medium patch structure with a round hole at the center;
the first electromagnetic super surface comprises a special-shaped regular hexagonal ring and six first resistors loaded on the vertexes of the special-shaped regular hexagonal ring;
the second electromagnetic subsurface includes a chip ring and a second resistor.
Preferably, the special-shaped regular hexagon ring comprises special-shaped sheet bodies arranged corresponding to each side of the regular hexagon, and a first resistor is arranged between two adjacent special-shaped sheet bodies;
the special-shaped sheet body comprises a middle bending part and right trapezoid parts arranged at two ends of the middle bending part, and a first rectangular gap is formed in one side of the right trapezoid part, which is away from the middle bending part.
Preferably, the length of each side of the special-shaped regular hexagonal ring is 3.0mm-9.0mm, and the width of each side is 0.1mm-1.5mm;
the gap for loading the first resistor on the special-shaped hexagonal ring is 0.1mm-1.2mm;
the resistance value of the first resistor is 250 omega-700 omega.
Preferably, the lower base length of the right trapezoid part is 1.0mm-2.5mm, and the upper base length of the right trapezoid part is 0.6mm-1.2mm;
the width of the first rectangular gap is 0.1mm-0.5mm;
the height of the middle bending part is 0.1mm-0.5mm.
Preferably, the shaped hexagonal ring is prepared on the first electromagnetic subsurface substrate by means of spray printing, electrochemical etching, mechanical engraving or magnetron sputtering.
Preferably, the dielectric super-surface layer has a thickness of 0.1mm-2.5mm and is made of dielectric or magnetic material with a relative dielectric constant greater than 1.0;
the relative dielectric constant of the first supporting dielectric layer is 1.0-5.0, and the thickness is 0.5-6.0 mm;
the first electromagnetic super-surface substrate is one of a PI film, a PEN film, an FR4 board and an F4B board, and the thickness of the first electromagnetic super-surface substrate is 0.1mm-1.5mm;
the second supporting medium layer is made of a material with a relative dielectric constant of 1.0-5.0 and a thickness of 4.5-6.0 mm;
the second electromagnetic super-surface substrate is one of a PI film, a PEN film, an FR4 board and an F4B board, and the thickness of the second electromagnetic super-surface substrate is 0.1mm-1.5mm;
the third supporting medium layer is made of a material with a relative dielectric constant of 1.0-5.0 and a thickness of 3.0-15.0 mm.
Preferably, the sheet-type ring is prepared on the second electromagnetic super-surface substrate by a method of spray printing, electrochemical corrosion, mechanical engraving or magnetron sputtering;
the gap for loading the second resistor on the sheet ring is 0.1mm-1.2mm; the resistance value of the second resistor is 20 to 300 omega;
the sheet type ring comprises six seamless trapezoid-like sheets which are respectively arranged corresponding to each side of the special-shaped regular hexagonal ring and a seamed trapezoid-like sheet which is arranged between two adjacent seamless trapezoid-like sheets, and a second resistor is arranged between the adjacent seamed trapezoid-like sheets and the seamless trapezoid-like sheet;
the distance between the seamless trapezoid sheet and the seamed trapezoid sheet is 0.1mm-1.1mm.
Preferably, the seamless trapezoid-like piece comprises a seamless inner isosceles trapezoid and a seamless outer rectangle, wherein the length of the bottom of the seamless inner isosceles trapezoid is 3.0mm-6.5mm, the length of the upper bottom of the seamless inner isosceles trapezoid is 0.2mm-2.5mm, and the length of the waist of the seamless inner isosceles trapezoid is 0.3mm-2.5mm; the length of the seamless outer side rectangle is the same as the length of the lower bottom of the seamless inner side isosceles trapezoid, and the width is 0.1mm-1.5mm;
the slotted trapezoid piece comprises a slotted outer isosceles trapezoid and a slotted inner rectangle, and a second rectangular slot is formed in the outer side of the slotted outer isosceles trapezoid; the length of the lower bottom of the isosceles trapezoid at the outer side of the seam is 0.5mm-5.5mm, the length of the upper bottom is 0.2mm-2.5mm, and the waist length is 1.0mm-2.0mm; the length of the rectangle on the inner side with the seam is the same as the length of the bottom of the isosceles trapezoid on the outer side with the seam, and the width is 0.1mm-1.5mm; the length of the second rectangular gap is 0.1mm-1.5mm, and the width is 0.1mm-1.1mm.
Preferably, the special-shaped regular hexagonal ring and the sheet-type ring are made of one of gold, silver and copper;
the first resistor and the second resistor are lumped patch resistor elements or equivalent resistors obtained by one or any combination of magnetron sputtering, screen printing and jet printing.
Preferably, the dielectric super-surface layer, the first supporting dielectric layer, the first electromagnetic super-surface substrate, the second supporting dielectric layer, the second electromagnetic super-surface substrate, the third supporting dielectric layer and the metal back plate are manufactured into the wave absorbing unit through a vacuum hot pressing process.
The invention has the following beneficial effects:
1. by arranging the dielectric super surface, the oblique incidence stability of the wave absorber is ensured by the impedance compensation of the whole structure in an oblique incidence state;
2. designing a third supporting medium layer based on a quarter-wavelength loss mechanism to enhance the absorption performance of frequency bands on two sides of the central frequency of the first electromagnetic super-surface, and realizing the maximum loss in a broadband range as far as possible;
3. by arranging the metal backboard, the metal backboard is used as an electromagnetic wave reflecting board to reflect electromagnetic waves, so that interference enhancement is realized among the first electromagnetic super-surface, the second electromagnetic super-surface and the medium super-surface.
The technical scheme of the invention is further described in detail through the drawings and the embodiments.
Drawings
Fig. 1 is a schematic structural diagram of a wave absorbing unit of a high-performance metamaterial wave absorber based on three layers of super surfaces.
Fig. 2 is a cross-sectional view of a wave-absorbing unit of a high performance metamaterial wave-absorbing body based on three layers of supersurfaces in accordance with the present invention.
FIG. 3 is a schematic diagram of a dielectric supersurface structural unit of a high performance metamaterial absorber based on three layers of supersurfaces.
Fig. 4 is a schematic diagram of a first electromagnetic super-surface structural unit of a high-performance metamaterial wave absorber based on three layers of super-surfaces.
FIG. 5 is a schematic diagram of a second electromagnetic subsurface structure unit of a high performance metamaterial absorber based on three layers of subsurface.
FIG. 6 is a graph showing the frequency dependence of TE wave reflection coefficient corresponding to different incident angles according to the experimental example of the present invention.
FIG. 7 is a graph showing the frequency dependence of TE wave absorption rate corresponding to different incident angles according to an experimental example of the present invention.
FIG. 8 is a graph showing the frequency dependence of the reflection coefficient of the TM wave according to the experimental example of the present invention.
Fig. 9 is a graph showing the frequency dependence of TM wave absorption rate according to the experimental example of the present invention.
FIG. 10 is a graph showing the reflectance curves of electromagnetic waves in the vertical incidence state in three states of no dielectric super surface of the top layer, complete coverage of a dielectric plate with the same thickness and coverage of the dielectric super surface according to the experimental example of the present invention.
FIG. 11 is a graph showing the absorption rate curve of electromagnetic waves at normal incidence in three states of the top layer dielectric-free super surface and the dielectric-covered super surface according to the experimental example of the present invention.
FIG. 12 is a graph showing TE reflectivity versus frequency for different angles of incidence when the inventive examples do not include a dielectric supersurface, a first supporting dielectric layer, a first electromagnetic supersurface substrate, and a second supporting dielectric layer.
FIG. 13 is a graph showing TE reflectance versus frequency for different angles of incidence for an experimental example of the present invention without a dielectric supersurface, a first supporting dielectric layer, a second electromagnetic supersurface, and a second electromagnetic supersurface substrate.
Wherein: 1. a media supersurface; 2. a first supporting dielectric layer; 3. a first electromagnetic subsurface; 4. a first electromagnetic subsurface substrate; 5. a second supporting dielectric layer; 6. a second electromagnetic subsurface; 7. a second electromagnetic subsurface substrate; 8. a third supporting dielectric layer; 9. a metal backplate; 10. a first resistor; 11. and a second resistor.
Detailed Description
The present invention will be further described with reference to the accompanying drawings, and it should be noted that, while the present embodiment provides a detailed implementation and a specific operation process on the premise of the present technical solution, the protection scope of the present invention is not limited to the present embodiment.
The high-performance metamaterial wave absorber based on the three-layer super surface comprises a plurality of wave absorbing units which are closely paved and are in hexahedral structures, wherein each wave absorbing unit comprises a medium super surface 1 layer, a first supporting medium layer 2, a first electromagnetic super surface 3, a first electromagnetic super surface substrate 4, a second supporting medium layer 5, a second electromagnetic super surface 6, a second electromagnetic super surface substrate 7, a third supporting medium layer 8 and a metal backboard 9 which are sequentially arranged from top to bottom;
a regular hexagon medium patch structure with a round hole at the center of the medium super surface 1 layer; the medium super surface 1 has the following functions by being provided with: first, acting as a protective layer reduces the risk of damage to the first electromagnetic subsurface 3; secondly, about 0% -5% absorption enhancement can be realized in the design range; thirdly, the high-frequency impedance matching state is improved, and the high-frequency absorption performance is enhanced; fourth, the stability of oblique incidence performance is improved by using the larger dielectric constant.
The first electromagnetic super-surface 3 comprises a special-shaped regular hexagonal ring and six first resistors 10 loaded on the peaks of the special-shaped regular hexagonal ring; the structure has obvious absorption effect at 11GHz-19GHz and certain absorption enhancement effect at 4GHz-11 GHz.
The second electromagnetic super-surface 6 comprises a sheet type ring and a second resistor 11, and through the structure, the 2GHz-12GHz of the second electromagnetic super-surface has obvious absorption effect, and meanwhile, the structural unit has good oblique incidence stability.
Preferably, the special-shaped regular hexagon ring comprises special-shaped sheet bodies arranged corresponding to each side of the regular hexagon, and a first resistor 10 is arranged between two adjacent special-shaped sheet bodies;
the special-shaped sheet body comprises a middle bending part and right trapezoid parts arranged at two ends of the middle bending part, and a first rectangular gap is formed in one side of the right trapezoid part, which is away from the middle bending part.
Preferably, the length of each side of the special-shaped regular hexagonal ring is 3.0mm-9.0mm, and the width of each side is 0.1mm-1.5mm; the gap for loading the first resistor 10 on the special-shaped hexagonal ring is 0.1mm-1.2mm; the resistance of the first resistor 10 is 250 Ω -700 Ω.
Preferably, the lower base length of the right trapezoid part is 1.0mm-2.5mm, and the upper base length of the right trapezoid part is 0.6mm-1.2mm; the width of the first rectangular gap is 0.1mm-0.5mm; the height of the middle bending part is 0.1mm-0.5mm.
Preferably, the shaped hexagonal ring is produced on the first electromagnetic subsurface substrate 4 by means of jet printing, electrochemical etching, mechanical engraving or magnetron sputtering.
Preferably, the dielectric supersurface 1 layer has a thickness of 0.1mm to 2.5mm and is made of a dielectric or magnetic material having a relative dielectric constant greater than 1.0;
the relative dielectric constant of the first supporting dielectric layer 2 is 1.0-5.0, and the thickness is 0.5-6.0 mm;
the first electromagnetic super-surface substrate 4 is one of a PI film, a PEN film, an FR4 board and an F4B board, and the thickness of the first electromagnetic super-surface substrate is 0.1mm-1.5mm; in this embodiment, the first electromagnetic subsurface substrate 4 is an FR4 board, the relative dielectric constant is 4.3, and the loss tangent angle is 0.0025.
The second supporting medium layer 5 is made of a material with a relative dielectric constant of 1.0-5.0 and a thickness of 4.5-6.0 mm;
the second electromagnetic super-surface substrate 7 is one of a PI film, a PEN film, an FR4 board and an F4B board, and the thickness of the second electromagnetic super-surface substrate is 0.1mm-1.5mm; in this embodiment, the second electromagnetic subsurface substrate 7 is an FR4 board with a relative dielectric constant of 4.3 and a loss tangent angle of 0.0025.
The third supporting medium layer 8 is made of a material with a relative dielectric constant of 1.0-5.0 and has a thickness of 3.0-15.0 mm.
The dielectric constants of the first supporting dielectric layer 2, the second supporting dielectric layer 5 and the third supporting dielectric layer 8 are close to air, and can be regarded as lossless dielectric layers.
Meanwhile, the first supporting medium layer 2 and the second supporting medium layer 5 are matched with the medium super surface 1 to optimize the medium frequency absorption performance.
The metal back plate 9 is an arbitrary high-conductivity metal characteristic plate. The metal back plate 9 in this embodiment is copper metal with a thickness of 0.035mm.
Preferably, the lamellar rings are produced on the second electromagnetic supersurface substrate 7 by means of jet printing, electrochemical etching, mechanical engraving or magnetron sputtering;
the gap for loading the second resistor 11 on the sheet ring is 0.1mm-1.2mm; the resistance value of the second resistor 11 is 20 omega-300 omega;
the sheet type ring comprises six seamless trapezoid-like sheets which are respectively arranged corresponding to each side of the special-shaped regular hexagonal ring and a seamed trapezoid-like sheet which is arranged between two adjacent seamless trapezoid-like sheets, and a second resistor 11 is arranged between the adjacent seamed trapezoid-like sheets and the seamless trapezoid-like sheets;
the distance between the seamless trapezoid sheet and the seamed trapezoid sheet is 0.1mm-1.1mm.
Preferably, the seamless trapezoid-like piece comprises a seamless inner isosceles trapezoid and a seamless outer rectangle, wherein the length of the bottom of the seamless inner isosceles trapezoid is 3.0mm-6.5mm, the length of the upper bottom of the seamless inner isosceles trapezoid is 0.2mm-2.5mm, and the length of the waist of the seamless inner isosceles trapezoid is 0.3mm-2.5mm; the length of the seamless outer side rectangle is the same as the length of the lower bottom of the seamless inner side isosceles trapezoid, and the width is 0.1mm-1.5mm;
the slotted trapezoid piece comprises a slotted outer isosceles trapezoid and a slotted inner rectangle, and a second rectangular slot is formed in the outer side of the slotted outer isosceles trapezoid; the length of the lower bottom of the isosceles trapezoid at the outer side of the seam is 0.5mm-5.5mm, the length of the upper bottom is 0.2mm-2.5mm, and the waist length is 1.0mm-2.0mm; the length of the rectangle on the inner side with the seam is the same as the length of the bottom of the isosceles trapezoid on the outer side with the seam, and the width is 0.1mm-1.5mm; the length of the second rectangular gap is 0.1mm-1.5mm, and the width is 0.1mm-1.1mm.
Preferably, the special-shaped regular hexagonal ring and the sheet-type ring are made of one of gold, silver and copper;
the first resistor 10 and the second resistor 11 are lumped chip resistor elements or equivalent resistors obtained by one or any combination of magnetron sputtering, screen printing and spray printing.
Preferably, the wave absorbing unit is manufactured by a vacuum hot pressing process through the dielectric super-surface 1 layer, the first supporting dielectric layer 2, the first electromagnetic super-surface 3, the first electromagnetic super-surface substrate 4, the second supporting dielectric layer 5, the second electromagnetic super-surface 6, the second electromagnetic super-surface substrate 7, the third supporting dielectric layer 8 and the metal back plate 9. It should be noted that the dielectric super surface 1 layer is a pure dielectric plate before the hot pressing process, and the central through hole is made by an engraving machine after the hot pressing process.
Through the structure, the following steps are realized: the induced current generated by the incident electromagnetic wave on the dielectric super surface 1 realizes certain energy loss and impedance matching, and then, the surface induced current is generated on the conductive units of the first electromagnetic super surface 3 and the second electromagnetic super surface 6 to convert the electromagnetic energy into heat to realize energy loss; meanwhile, electromagnetic waves interfere between the first electromagnetic super surface 3 and the second electromagnetic super surface 6, between the first electromagnetic super surface 3 and the medium super surface 1, and between the second electromagnetic super surface 6 and the medium super surface 1 for multiple times, so that high-performance electromagnetic absorption is realized through a quarter-wavelength resonance absorption mechanism.
Experimental example:
in this experimental example, the dual-impedance layer high-performance wave-absorbing structure prepared in this example was analyzed by using simulation software to explain the working characteristics of the structure.
As can be seen from FIG. 6, the frequency band with reflectivity lower than-10 dB is 2.2GHz-20.1GHz under the condition of normal incidence of electromagnetic waves; the frequency band with the reflectivity lower than-20 dB is 2.7GHz-18.2GHz; when the incident angle of electromagnetic wave is 60 degrees, the frequency band with the reflectivity lower than-10 dB is 4.9GHz-16.9GHz.
Also, as can be seen from FIG. 7, the 90% wave absorption frequency band corresponds to the-10 dB reflection coefficient band in FIG. 6.
As can be seen from FIG. 8, the wave absorbing structure of the present invention has a frequency band of 2.2GHz-20.1GHz with reflectivity lower than-10 dB at normal incidence; the frequency band with the reflectivity lower than-20 dB is 2.7GHz-18.2GHz; when the incident angle of the electromagnetic wave is 15 DEG, the frequency band with the reflectivity lower than-20 dB is 2.9GHz-18.9GHz, and when the incident angle of the electromagnetic wave is 45 DEG, the frequency band with the reflectivity lower than-10 dB is 3.5GHz-17.9GHz.
Also, as can be seen from fig. 9, the 90% wave absorption frequency band corresponds to the-10 dB reflection coefficient frequency band in fig. 8.
As can be seen from fig. 10, when the top layer has no dielectric super surface 1, the wave absorber with double-layer super surface has only a frequency band with reflectivity lower than-10 dB; when a pure dielectric plate with a certain thickness is added, a frequency band with reflectivity lower than-20 dB is generated in the frequency band of 2.7GHz-11.8 GHz; when the pure dielectric plate is designed into the dielectric super-surface 1 with the same thickness, the frequency band with the wave absorber reflectivity lower than-20 dB reaches 2.7GHz-18.2GHz.
As can be seen from fig. 11, after the dielectric super surface 1 is increased, the wave absorption rate of the wave absorber is improved by 0 to 5% in a wide band range.
As is clear from fig. 12, at normal incidence, the frequency band having a reflectance lower than-10 dB is 2.7GHz to 10.8GHz, and the absorption band gradually shifts to high frequency with increasing incidence angle, thereby demonstrating the working principle of the present invention.
As can be seen from FIG. 13, at normal incidence, the band with reflectivity below-10 dB is 11.7GHz-17.1GHz. As the incident angle increases, the low-frequency absorption band gradually shifts to high frequency, and the absorption intensity gradually increases; the high frequency absorption band gradually moves to high frequency within 0 DEG to 30 DEG, and the high frequency absorption band is greatly weakened after the incident angle is larger than 30 DEG, thereby proving the working principle of the invention.
Therefore, the high-performance metamaterial wave absorber based on the three-layer super surface with the structure can realize-20 dB wave absorption and large-angle stability in an ultra-wideband range, so that the high-performance metamaterial wave absorber has great practical value in the fields of electromagnetic radiation reduction, electromagnetic compatibility, signal shielding and the like.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention and not for limiting it, and although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that: the technical scheme of the invention can be modified or replaced by the same, and the modified technical scheme cannot deviate from the spirit and scope of the technical scheme of the invention.
Claims (10)
1. The utility model provides a high performance metamaterial wave absorber based on three-layer super surface, is hexahedral structure's a plurality of wave absorbing unit, its characterized in that including closely laying: each wave absorbing unit comprises a medium super-surface layer, a first supporting medium layer, a first electromagnetic super-surface substrate, a second supporting medium layer, a second electromagnetic super-surface substrate, a third supporting medium layer and a metal backboard which are sequentially arranged from top to bottom;
the medium super surface layer is a regular hexagon medium patch structure with a round hole at the center;
the first electromagnetic super surface comprises a special-shaped regular hexagonal ring and six first resistors loaded on the vertexes of the special-shaped regular hexagonal ring;
the second electromagnetic subsurface includes a chip ring and a second resistor.
2. The three-layer super surface based high performance metamaterial wave absorber as defined in claim 1, wherein: the special-shaped regular hexagon ring comprises special-shaped sheet bodies arranged corresponding to each side of the regular hexagon, and a first resistor is arranged between two adjacent special-shaped sheet bodies;
the special-shaped sheet body comprises a middle bending part and right trapezoid parts arranged at two ends of the middle bending part, and a first rectangular gap is formed in one side of the right trapezoid part, which is away from the middle bending part.
3. The three-layer super surface based high performance metamaterial wave absorber as defined in claim 2, wherein: the length of each side of the special-shaped regular hexagonal ring is 3.0mm-9.0mm, and the width of each side is 0.1mm-1.5mm;
the gap for loading the first resistor on the special-shaped hexagonal ring is 0.1mm-1.2mm;
the resistance value of the first resistor is 250 omega-700 omega.
4. A three-layer super surface based high performance metamaterial wave absorber as defined in claim 3, wherein: the lower bottom length of the right trapezoid part is 1.0mm-2.5mm, and the upper bottom length of the right trapezoid part is 0.6mm-1.2mm;
the width of the first rectangular gap is 0.1mm-0.5mm;
the height of the middle bending part is 0.1mm-0.5mm.
5. The three-layer super surface based high performance metamaterial wave absorber as defined in claim 1, wherein: the special-shaped hexagonal ring is prepared on the first electromagnetic super-surface substrate by a spray printing method, an electrochemical corrosion method, a mechanical engraving method or a magnetron sputtering method.
6. The three-layer super surface based high performance metamaterial wave absorber as defined in claim 1, wherein: the thickness of the dielectric super-surface layer is 0.1mm-2.5mm, and the dielectric super-surface layer is made of dielectric or magnetic materials with relative dielectric constants greater than 1.0;
the relative dielectric constant of the first supporting dielectric layer is 1.0-5.0, and the thickness is 0.5-6.0 mm;
the first electromagnetic super-surface substrate is one of a PI film, a PEN film, an FR4 board and an F4B board, and the thickness of the first electromagnetic super-surface substrate is 0.1mm-1.5mm;
the second supporting medium layer is made of a material with a relative dielectric constant of 1.0-5.0 and a thickness of 4.5-6.0 mm;
the second electromagnetic super-surface substrate is one of a PI film, a PEN film, an FR4 board and an F4B board, and the thickness of the second electromagnetic super-surface substrate is 0.1mm-1.5mm;
the third supporting medium layer is made of a material with a relative dielectric constant of 1.0-5.0 and a thickness of 3.0-15.0 mm.
7. The three-layer super surface based high performance metamaterial wave absorber as defined in claim 1, wherein: the chip ring is prepared on the second electromagnetic super-surface substrate by a spray printing method, an electrochemical corrosion method, a mechanical engraving method or a magnetron sputtering method;
the gap for loading the second resistor on the sheet ring is 0.1mm-1.2mm; the resistance value of the second resistor is 20 to 300 omega;
the sheet type ring comprises six seamless trapezoid-like sheets which are respectively arranged corresponding to each side of the special-shaped regular hexagonal ring and a seamed trapezoid-like sheet which is arranged between two adjacent seamless trapezoid-like sheets, and a second resistor is arranged between the adjacent seamed trapezoid-like sheets and the seamless trapezoid-like sheet;
the distance between the seamless trapezoid sheet and the seamed trapezoid sheet is 0.1mm-1.1mm.
8. The three-layer super surface based high performance metamaterial wave absorber as defined in claim 7, wherein: the seamless trapezoid-like piece comprises a seamless inner isosceles trapezoid and a seamless outer rectangle, wherein the length of the lower bottom of the seamless inner isosceles trapezoid is 3.0-6.5 mm, the length of the upper bottom of the seamless inner isosceles trapezoid is 0.2-2.5 mm, and the waist length of the seamless inner isosceles trapezoid is 0.3-2.5 mm; the length of the seamless outer side rectangle is the same as the length of the lower bottom of the seamless inner side isosceles trapezoid, and the width is 0.1mm-1.5mm;
the slotted trapezoid piece comprises a slotted outer isosceles trapezoid and a slotted inner rectangle, and a second rectangular slot is formed in the outer side of the slotted outer isosceles trapezoid; the length of the lower bottom of the isosceles trapezoid at the outer side of the seam is 0.5mm-5.5mm, the length of the upper bottom is 0.2mm-2.5mm, and the waist length is 1.0mm-2.0mm; the length of the rectangle on the inner side with the seam is the same as the length of the bottom of the isosceles trapezoid on the outer side with the seam, and the width is 0.1mm-1.5mm; the length of the second rectangular gap is 0.1mm-1.5mm, and the width is 0.1mm-1.1mm.
9. The three-layer super surface based high performance metamaterial wave absorber as defined in claim 1, wherein: the special-shaped regular hexagonal ring and the sheet-type ring are made of one of gold, silver and copper;
the first resistor and the second resistor are lumped patch resistor elements or equivalent resistors obtained by one or any combination of magnetron sputtering, screen printing and jet printing.
10. The three-layer super surface based high performance metamaterial wave absorber as defined in claim 1, wherein: the wave absorbing unit is manufactured by a vacuum hot pressing process through the medium super-surface layer, the first supporting medium layer, the first electromagnetic super-surface substrate, the second supporting medium layer, the second electromagnetic super-surface substrate, the third supporting medium layer and the metal backboard.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116864994A (en) * | 2023-08-04 | 2023-10-10 | 中南大学 | Double-impedance-layer high-performance wave-absorbing structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116864994A (en) * | 2023-08-04 | 2023-10-10 | 中南大学 | Double-impedance-layer high-performance wave-absorbing structure |
| CN116864994B (en) * | 2023-08-04 | 2024-01-16 | 中南大学 | Double-impedance-layer high-performance wave-absorbing structure |
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