CN116207009B - Monocrystalline silicon piece etching and polishing equipment - Google Patents
Monocrystalline silicon piece etching and polishing equipment Download PDFInfo
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- CN116207009B CN116207009B CN202211741410.2A CN202211741410A CN116207009B CN 116207009 B CN116207009 B CN 116207009B CN 202211741410 A CN202211741410 A CN 202211741410A CN 116207009 B CN116207009 B CN 116207009B
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- sealing
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- 238000005498 polishing Methods 0.000 title claims abstract description 81
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 75
- 238000005530 etching Methods 0.000 title claims abstract description 26
- 238000007789 sealing Methods 0.000 claims abstract description 67
- 230000007246 mechanism Effects 0.000 claims abstract description 34
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 13
- 230000001105 regulatory effect Effects 0.000 claims description 54
- 239000007788 liquid Substances 0.000 claims description 13
- 229920005549 butyl rubber Polymers 0.000 claims description 4
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims 4
- 239000002135 nanosheet Substances 0.000 claims 2
- 239000012858 resilient material Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 25
- 229910052710 silicon Inorganic materials 0.000 abstract description 25
- 239000010703 silicon Substances 0.000 abstract description 25
- 230000008859 change Effects 0.000 abstract description 7
- 230000009471 action Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 73
- 239000007787 solid Substances 0.000 description 15
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 10
- 235000017491 Bambusa tulda Nutrition 0.000 description 10
- 241001330002 Bambuseae Species 0.000 description 10
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 10
- 239000011425 bamboo Substances 0.000 description 10
- 239000013013 elastic material Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application discloses monocrystalline silicon piece etching and polishing equipment applied to the field of silicon piece etching, which is characterized in that through the arrangement of a polishing device and a negative pressure wafer fixing mechanism, the negative pressure wafer fixing mechanism can fix monocrystalline silicon pieces by utilizing negative pressure under the actions of a wafer fixing barrel, a sealing wafer abutting ring and the like, even if the monocrystalline silicon pieces are thinner, the monocrystalline silicon pieces can be effectively fixed, the falling phenomenon of the monocrystalline silicon pieces can be greatly reduced, the polishing device can simultaneously polish a plurality of monocrystalline silicon pieces by a chemical-mechanical polishing method, the polishing efficiency can be effectively improved, in addition, the setting of the reinforcing wafer fixing mechanism can lead the change of the air pressure in the wafer fixing barrel to cause the change and adjustment of the reinforcing wafer fixing mechanism, so that a plurality of wafer fixing elastic films can be tightly attached from a plurality of directions and squeeze the monocrystalline silicon pieces, the fixing effect of the monocrystalline silicon pieces can be enhanced, and the falling phenomenon of the monocrystalline silicon pieces can be further reduced.
Description
Technical Field
The application relates to the field of silicon wafer etching, in particular to monocrystalline silicon wafer etching and polishing equipment.
Background
Monocrystalline silicon is taken as a relatively active nonmetallic element crystal, is an important component of a crystal material, is at the front edge of new material development, and is mainly used as a semiconductor material and utilizes solar energy to generate electricity, supply heat and the like.
In the production and processing process of monocrystalline silicon wafers, the monocrystalline silicon wafers are often required to be etched and polished, unnecessary materials on the surfaces of the monocrystalline silicon wafers can be removed by etching, and the polishing can enable the surfaces of the monocrystalline silicon wafers to have high flatness and cleanliness.
Etching polishing equipment in the prior art is used for fixing monocrystalline silicon wafers by adopting a clamping device or a clamp when the monocrystalline silicon wafers are polished, the fixing effect is relatively poor, and particularly, for monocrystalline silicon wafers with thinner thickness, the phenomenon that the silicon wafers fall off frequently occurs in the polishing process is caused, so that the silicon wafers are scrapped easily, and the processing efficiency is affected. Therefore, we propose a monocrystalline silicon wafer etching and polishing apparatus.
Disclosure of Invention
The application aims to solve the problem that when a monocrystalline silicon wafer is polished by etching polishing equipment in the prior art, the monocrystalline silicon wafer is easy to fall off, compared with the prior art, the monocrystalline silicon wafer etching polishing equipment comprises an etching device and a polishing device, the polishing device comprises a base, a polishing pool is fixedly arranged at the top end of the base, a driving motor is fixedly arranged on the inner wall of the bottom end of the polishing pool, a baffle plate which is fixedly connected with the polishing pool in a sealing manner is arranged above the driving motor, a connecting shaft is fixedly connected with the output end of the driving motor, a polishing disk is fixedly connected with the top end of the connecting shaft, the connecting shaft penetrates through the baffle plate and is in sliding sealing connection with the baffle plate, the top end of the base is fixedly connected with a lifting cylinder, a negative pressure fixing sheet mechanism is arranged above the polishing pool, the negative pressure fixing sheet mechanism comprises a pressure regulating cylinder which is positioned right above the polishing pool, the pressure regulating cylinder is fixedly connected with the output end of the lifting cylinder through a supporting rod, a pressure regulating cylinder is fixedly arranged on the inner wall of the top end of the regulating cylinder, a piston plate is fixedly connected with the piston plate, a plurality of guide sheets which are uniformly distributed along the ring shape and are in a sealing manner and are in sliding sealing manner with the polishing cylinder, the negative pressure fixing sheets can be tightly connected with the inner wall of the silicon wafer, the negative pressure fixing sheet can be tightly sealed against the bottom end of the silicon wafer, even if the silicon wafer can be tightly sealed against the bottom end of the silicon wafer, and the silicon wafer can be tightly fixed with the silicon wafer, and the negative pressure can be tightly and the silicon wafer can be tightly and tightly pressed against the silicon wafer, and even when the silicon wafer can be tightly and the silicon.
Optionally, be provided with the reinforcing solid piece mechanism in the solid piece section of thick bamboo, the reinforcing solid piece mechanism includes the sealed baffle of the inner wall sealing fixed connection with solid piece section of thick bamboo, the top fixedly connected with annular gasbag of sealed baffle, annular cavity has been seted up in the annular gasbag, the packing in the annular cavity has the air, the middle part of sealed baffle runs through and is provided with the linkage montant with its sliding seal connection, the top fixedly connected with pressure bag board of linkage montant, the pressure bag board is located the top of annular gasbag, one side fixedly connected with linkage montant of linkage montant, the bottom fixedly connected with self-regulating tube of sealed baffle, be provided with the self-regulating plate with its sliding seal's self-regulating plate in the self-regulating tube, fixedly connected with elasticity lifting rope between self-regulating plate and the sealed baffle, the bottom fixedly connected with connecting rod of self-regulating plate, the bottom and the linkage horizontal pole fixed connection, the reinforcing solid piece mechanism still includes a plurality of air-receiving grooves and a plurality of pressure regulating holes, the air-receiving grooves equals and pressure regulating hole quantity one-to-one, the inside of solid piece section of thick bamboo outer wall is seted up in the solid piece section of thick bamboo, the pressure bag is located in the inner wall of thick bamboo, the pressure regulating hole is located the pressure regulating hole and the inner wall corresponding to the corresponding air-receiving groove and the corresponding air-bag of the corresponding connecting pipe has the elastic connecting pipe, the effect that the corresponding to the corresponding connecting pipe that can take place with the annular connecting pipe is further, the corresponding to the air-connecting pipe is connected with the air-receiving the air groove, the air-connecting pipe is connected with the corresponding, and the bottom of the air bag.
Optionally, the etching polishing equipment still includes dress piece complementary unit, dress piece complementary unit includes the backup pad, offer a plurality of and solid piece section of thick bamboo assorted in the backup pad and receive the piece groove, receive the degree of depth in piece groove and be less than monocrystalline silicon piece thickness, receive piece groove and solid piece section of thick bamboo quantity and equal, a plurality of piece grooves of receiving are along annular evenly distributed, the bottom fixedly connected with handle of backup pad can insert a plurality of monocrystalline silicon pieces simultaneously respectively in a plurality of solid piece section of thick bamboo to can help the fixed to monocrystalline silicon piece, the convenience has been improved greatly.
Optionally, the sealing abutting ring is made of elastic materials, and the elastic materials comprise but are not limited to chloroprene rubber and butyl rubber, so that the sealing performance of the joint of the monocrystalline silicon piece and the sealing abutting ring can be improved, and the fixing of the monocrystalline silicon piece is facilitated.
Optionally, the junction of driving motor and baffle is provided with the sealing washer, can improve the leakproofness of driving motor, baffle junction, and the intercommunication is provided with the fluid-discharge tube on the outer wall of polishing pond, and the one end of fluid-discharge tube is provided with the sealed lid rather than assorted for the polishing solution is convenient for discharge, change.
Compared with the prior art, the application has the advantages that:
(1) According to the application, through the arrangement of the polishing device and the negative pressure wafer fixing mechanism, the negative pressure wafer fixing mechanism can fix the monocrystalline silicon wafer by utilizing negative pressure under the actions of the wafer fixing barrel, the sealing wafer supporting ring and the like, even if the monocrystalline silicon wafer is thinner, the monocrystalline silicon wafer can be effectively fixed, the falling phenomenon of the monocrystalline silicon wafer can be greatly reduced, and the polishing device can polish a plurality of monocrystalline silicon wafers simultaneously by a chemical-mechanical polishing method, so that the polishing efficiency can be effectively improved.
(2) Through the setting of strengthening piece mechanism for fix the monocrystalline silicon piece, the change of the interior atmospheric pressure of solid piece section of thick bamboo can initiate the change regulation of strengthening piece mechanism, makes a plurality of solid piece elastic membrane can follow a plurality of directions and paste closely and extrude monocrystalline silicon piece, thereby can strengthen the fixed effect to monocrystalline silicon piece, further reduction monocrystalline silicon piece emergence of phenomenon that drops.
(3) Through the setting of dress piece auxiliary mechanism for can once only insert a plurality of monocrystalline silicon pieces simultaneously respectively in a plurality of solid piece section of thick bamboo, thereby can help the fixed to monocrystalline silicon piece, improve the convenience greatly.
(4) The sealing abutting piece ring is made of elastic materials, wherein the elastic materials comprise chloroprene rubber and butyl rubber, so that the sealing performance of the joint of the monocrystalline silicon piece and the sealing abutting piece ring can be improved, and the fixing of the monocrystalline silicon piece is facilitated.
(5) The sealing ring is arranged at the joint of the driving motor and the baffle, so that the tightness of the joint of the driving motor and the baffle can be improved, the outer wall of the polishing pool is communicated with a liquid discharge pipe, and one end of the liquid discharge pipe is provided with a sealing cover matched with the liquid discharge pipe, so that the polishing liquid is conveniently discharged and replaced.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present application;
FIG. 2 is a schematic perspective view of a polishing apparatus according to the present application;
FIG. 3 is a schematic elevational view of the polishing apparatus of the present application;
FIG. 4 is a schematic cross-sectional view of the polishing bath of the present application;
FIG. 5 is a schematic cross-sectional view of the pressure regulating cylinder of the present application;
FIG. 6 is a schematic cross-sectional view of the present application at a tablet holding cylinder;
FIG. 7 is an enlarged schematic view of the structure of FIG. 6A according to the present application;
FIG. 8 is an enlarged schematic view of the structure of FIG. 6B in accordance with the present application;
FIG. 9 is a schematic cross-sectional view of the self-regulating tube of the present application;
fig. 10 is a schematic perspective view of the auxiliary mechanism for loading chips according to the present application.
The reference numerals in the figures illustrate:
001. etching device; 002. a polishing device; 201. a base; 202. a polishing pool; 203. a driving motor; 204. a baffle; 205. a connecting shaft; 206. polishing disk; 207. a lifting cylinder; 208. a seal ring; 209. a liquid discharge pipe; 210. sealing cover; 301. a pressure regulating cylinder; 302. a pressure regulating cylinder; 303. a piston plate; 304. a support rod; 305. a fixing barrel; 306. sealing the abutting piece ring; 307. an air duct; 401. a sealing separator; 402. an annular air bag; 403. a linkage vertical rod; 404. a bag pressing plate; 405. a linkage cross bar; 406. a self-pressure regulating tube; 407. a self-adjusting pressure plate; 408. an elastic hanging rope; 409. a connecting rod; 410. a gas receiving tank; 411. a pressure regulating hole; 412. a solid piece elastic membrane; 413. a connecting pipe; 005. a loading auxiliary mechanism; 501. a support plate; 502. a tablet receiving groove; 503. a handle.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application; it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present application are within the protection scope of the present application.
Example 1:
the application discloses monocrystalline silicon wafer etching and polishing equipment, please refer to fig. 1-6, the monocrystalline silicon wafer etching and polishing equipment comprises an etching device 001 and a polishing device 002, the etching device 001 is of the prior art, the specific structure of the etching device is not repeated, the polishing device 002 comprises a base 201, a polishing tank 202 is fixedly arranged at the top end of the base 201, a driving motor 203 is fixedly arranged on the inner wall of the bottom end of the polishing tank 202, a baffle 204 which is fixedly connected with the polishing tank 202 in a sealing manner is arranged above the driving motor 203, the output end of the driving motor 203 is fixedly connected with a connecting shaft 205, the top end of the connecting shaft 205 is fixedly connected with a polishing disk 206, the connecting shaft 205 penetrates through the baffle 204 and is in sliding sealing connection with the baffle 204, the top end of the base 201 is fixedly connected with a lifting cylinder 207, a negative pressure fixing mechanism is arranged above the polishing tank 202, the negative pressure fixing mechanism comprises a pressure regulating cylinder 301 which is fixedly connected with the output end of the lifting cylinder 207 through a supporting rod 304, a pressure regulating cylinder 302 is fixedly arranged on the inner wall of the top end of the pressure regulating cylinder 301, the piston end of the pressure regulating cylinder 302 is fixedly connected with a piston plate 303, the piston end of the piston plate 303 is fixedly connected with a connecting plate 306 of the piston of the polishing cylinder is fixedly connected with the piston plate of the silicon wafer, the piston plate is fixedly connected with the bottom end of the sealing plate 305, the sealing plate is fixedly connected with the sealing plate 307, the sealing plate is fixedly arranged between the sealing plate and the sealing plate 305 is arranged on the bottom end of the sealing plate 305, and the sealing plate is fixedly connected with the sealing plate 307, and the sealing plate is arranged on the sealing plate, and the silicon wafer is fixedly connected with the sealing plate, and the silicon wafer is arranged.
During polishing, a plurality of monocrystalline silicon pieces are respectively placed below a plurality of fixed wafer drums 305, the monocrystalline silicon pieces enter the fixed wafer drums 305 from the bottom ends of the fixed wafer drums 305, the monocrystalline silicon pieces are abutted against the bottom ends of sealing abutting wafer rings 306, then a pressure regulating cylinder 302 is started, a piston plate 303 is driven to move upwards for a certain distance, a suction force is generated when the piston plate 303 moves upwards, therefore, a certain amount of air can be extracted from the fixed wafer drums 305 through an air duct 307, negative pressure is formed in the fixed wafer drums 305, the monocrystalline silicon pieces can be fixed under the action of the negative pressure, then a certain amount of polishing liquid is poured into a polishing pool 202, then a lifting cylinder 207 is started, the monocrystalline silicon pieces are driven to move downwards until the monocrystalline silicon pieces abut against a polishing disc 206, a driving motor 203 is started, the polishing disc 206 is driven to rotate, the monocrystalline silicon pieces, after polishing is finished, the monocrystalline silicon pieces are driven to move upwards, the lifting cylinder 207 is driven to move upwards, the monocrystalline silicon pieces 301 and the piston fixing cylinder to reset, then the polishing plate 307 is driven to move downwards, the monocrystalline silicon pieces are driven to move downwards, the monocrystalline silicon pieces to fall down, the silicon pieces are polished 002, the silicon pieces can be fixed by the negative pressure is reduced, and the silicon pieces can be fixed by a sealing mechanism, and the silicon pieces 002 fall down, the silicon pieces can be subjected to the fixed wafer 002, and the device can be subjected to the negative pressure treatment, and the silicon pieces are subjected to the mechanical polishing, and the fixed wafer polishing device and the falling by the fixed wafer drums, and the silicon wafers are subjected to the negative pressure and the fixed wafer polishing device and the polishing and the fixed simultaneously, and the polishing device and the polishing and the silicon wafer. The polishing efficiency can be effectively improved.
Referring to fig. 4, a sealing ring 208 is disposed at the connection between the driving motor 203 and the baffle 204, so as to improve the tightness of the connection between the driving motor 203 and the baffle 204, a liquid discharge pipe 209 is disposed on the outer wall of the polishing tank 202 in a communicating manner, and a sealing cover 210 matched with the liquid discharge pipe 209 is disposed at one end of the liquid discharge pipe 209, so that the polishing liquid is convenient to discharge and replace.
Referring to fig. 6, the sealing support ring 306 is made of an elastic material, which includes but is not limited to neoprene and butyl rubber, so as to improve the sealing performance of the junction between the monocrystalline silicon piece and the sealing support ring 306, and facilitate the fixation of the monocrystalline silicon piece.
Referring to fig. 6-9, a reinforcing sheet fixing mechanism is arranged in a sheet fixing barrel 305, the reinforcing sheet fixing mechanism comprises a sealing baffle 401 which is fixedly connected with the inner wall of the sheet fixing barrel 305 in a sealing way, an annular air bag 402 is fixedly connected at the top end of the sealing baffle 401, an annular cavity is arranged in the annular air bag 402, air is filled in the annular cavity, a linkage vertical rod 403 which is in sliding sealing connection with the middle part of the sealing baffle 401 is arranged in a penetrating way, the top end of the linkage vertical rod 403 is fixedly connected with a pressure bag plate 404, the pressure bag plate 404 is positioned above the annular air bag 402, one side of the linkage vertical rod 403 is fixedly connected with a linkage cross rod 405, the bottom end of the sealing baffle 401 is fixedly connected with a self-pressure regulating pipe 406, an elastic lifting rope 408 is fixedly connected between the self-pressure regulating baffle 407 and the sealing baffle 401, the bottom end of the self-pressure plate 407 is fixedly connected with a connecting rod 409, the bottom end of the connecting rod 409 is fixedly connected with the linkage cross rod 405, the reinforcing sheet fixing mechanism further comprises a plurality of air receiving grooves 410 and a plurality of pressure regulating holes 411, the air receiving grooves 410 are equal in number and correspond to the pressure regulating holes 411 one by one, the air receiving grooves 410 are formed in the outer wall of the sheet fixing barrel 305, the pressure regulating holes 411 are formed in the inner wall of the sheet fixing barrel 305, the pressure regulating holes 411 are communicated with the corresponding air receiving grooves 410, the inner wall of the pressure regulating holes 411 is fixedly connected with a solid sheet elastic film 412 matched with the pressure regulating holes in a sealing manner, a plurality of connecting pipes 413 are communicated with the outer wall of the annular air bag 402, the linkage vertical rods 403 are equal in number and correspond to the air receiving grooves 410 one by one, one end of the connecting pipe 413 away from the annular air bag 402 is communicated with the corresponding air receiving grooves 410, when the monocrystalline silicon sheet is fixed, air pumping can lead to air pressure below the sealing baffle 401 to be reduced, air pressure above the pressure regulating plate 407 can be larger than air pressure below the pressure regulating plate 407, under the action of air pressure, the self-pressure regulating plate 407 can move downwards, so that the self-pressure regulating plate 407 can drive the pressure bag plate 404 to move downwards through the connecting rod 409, the linkage cross rod 405 and the linkage vertical rod 403, the pressure bag plate 404 extrudes the annular air bag 402, after the annular air bag 402 is extruded, part of air in the annular air bag flows into the air receiving groove 410 through the connecting pipe 413, the fixed piece elastic film 412 expands and deforms outwards of the pressure regulating hole 411, the fixed piece elastic films 412 can be tightly attached and extrude monocrystalline silicon wafers from a plurality of directions, after polishing is finished, the self-pressure regulating plate 407 can move upwards to reset under the action of the elasticity of the elastic lifting rope 408 along with the recovery of the air pressure in the fixed piece cylinder 305, the linkage vertical rod 403, the linkage cross rod 405, the connecting rod 409 and the like are reset, and the annular air bag 402 and the fixed piece elastic film 412 also rebound, therefore, when the monocrystalline silicon wafers are fixed through the setting of the reinforcing piece mechanism, the change of the air pressure in the fixed piece cylinder 305 can trigger the change regulation of the reinforcing piece mechanism, the monocrystalline piece elastic film 412 can be tightly attached and extruded from a plurality of directions, the monocrystalline silicon wafers can be further reduced, and the effect of the monocrystalline silicon wafers can be further fixed.
Referring to fig. 10, the etching polishing apparatus further includes a wafer loading auxiliary mechanism 005, the wafer loading auxiliary mechanism 005 includes a supporting plate 501, a plurality of wafer receiving slots 502 matched with the wafer fixing barrel 305 are formed in the supporting plate 501, the depths of the wafer receiving slots 502 are smaller than the thickness of the monocrystalline silicon wafers, the number of the wafer receiving slots 502 is equal to that of the wafer fixing barrels 305, the plurality of wafer receiving slots 502 are uniformly distributed along a ring shape, a handle 503 is fixedly connected to the bottom end of the supporting plate 501, when the monocrystalline silicon wafers are fixed by the setting of the wafer loading auxiliary mechanism 005, the monocrystalline silicon wafers can be respectively placed into the plurality of wafer receiving slots 502, then the supporting plate 501 is moved by the handle 503, the supporting plate 501 is firstly moved to the lower side of the wafer fixing barrel 305, then the plurality of wafer receiving slots 502 are respectively aligned with the plurality of wafer fixing barrels 305, and then the handle 503 is moved upwards, so that the monocrystalline silicon wafers can be respectively inserted into the plurality of wafer fixing barrels 305 at one time, thereby being helpful for fixing the monocrystalline silicon wafers, and greatly improving convenience.
The above description is only of the preferred embodiments of the present application; the scope of the application is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present application, and the technical solution and the improvement thereof are all covered by the protection scope of the present application.
Claims (5)
1. The monocrystalline silicon piece etching and polishing equipment comprises an etching device (001) and a polishing device (002), and is characterized in that the polishing device (002) comprises a base (201), a polishing pool (202) is fixedly installed at the top end of the base (201), a driving motor (203) is fixedly installed on the inner wall of the bottom end of the polishing pool (202), a baffle (204) fixedly connected with the polishing pool (202) in a sealing mode is arranged above the driving motor (203), a connecting shaft (205) is fixedly connected with the output end of the driving motor (203), a polishing disc (206) is fixedly connected with the top end of the connecting shaft (205), the connecting shaft (205) penetrates through the baffle (204) and is in sliding sealing connection with the baffle, and a lifting cylinder (207) is fixedly connected with the top end of the base (201);
the polishing device comprises a polishing pool (202), and is characterized in that a negative pressure wafer fixing mechanism is arranged above the polishing pool (202), the negative pressure wafer fixing mechanism comprises a pressure regulating cylinder (301) which is arranged right above the polishing pool (202), the pressure regulating cylinder (301) is fixedly connected with the output end of a lifting cylinder (207) through a supporting rod (304), a pressure regulating cylinder (302) is fixedly arranged on the inner wall of the top end of the pressure regulating cylinder (301), a piston plate (303) is fixedly connected with the output end of the pressure regulating cylinder (302), the piston plate (303) is in sliding sealing connection with the pressure regulating cylinder (301), a plurality of wafer fixing cylinders (305) which are uniformly distributed along an annular shape and are matched with a monocrystalline wafer are arranged on the outer side of the pressure regulating cylinder (301), a sealing wafer abutting ring (306) is fixedly connected onto the inner wall of the wafer fixing cylinder (305), an air guide pipe (307) is arranged on the outer wall of the wafer fixing cylinder (305) in a communicating mode, the other end of the air guide pipe (307) is communicated with the pressure regulating cylinder (301), and the distance between the bottom end of the sealing wafer abutting ring (306) and the bottom end of the wafer fixing cylinder (305) is smaller than the thickness of the monocrystalline wafer.
The improved structure comprises a fixed sheet barrel (305), wherein a reinforcing sheet mechanism is arranged in the fixed sheet barrel (305), the reinforcing sheet mechanism comprises a sealing baffle plate (401) which is fixedly connected with the inner wall of the fixed sheet barrel (305) in a sealing way, the top end of the sealing baffle plate (401) is fixedly connected with an annular air bag (402), an annular cavity is formed in the annular air bag (402), and air is filled in the annular cavity;
the middle part of the sealing partition plate (401) is penetrated and provided with a linkage vertical rod (403) which is in sliding sealing connection with the sealing partition plate, the top end of the linkage vertical rod (403) is fixedly connected with a bag pressing plate (404), the bag pressing plate (404) is positioned above the annular air bag (402), and one side of the linkage vertical rod (403) is fixedly connected with a linkage cross rod (405);
the self-pressure regulating device is characterized in that the bottom end of the sealing partition plate (401) is fixedly connected with a self-pressure regulating pipe (406), a self-pressure regulating plate (407) which is in sliding sealing connection with the self-pressure regulating pipe (406) is arranged in the self-pressure regulating pipe, an elastic lifting rope (408) is fixedly connected between the self-pressure regulating plate (407) and the sealing partition plate (401), the bottom end of the self-pressure regulating plate (407) is fixedly connected with a connecting rod (409), and the bottom end of the connecting rod (409) is fixedly connected with a linkage cross rod (405);
the reinforcing and fixing piece mechanism further comprises a plurality of air accommodating grooves (410) and a plurality of pressure regulating holes (411), the number of the air accommodating grooves (410) is equal to that of the pressure regulating holes (411) and corresponds to that of the pressure regulating holes one by one, the air accommodating grooves (410) are formed in the bottom end of the fixed piece barrel (305) and are positioned in the outer wall of the fixed piece barrel (305), the pressure regulating holes (411) are formed in the bottom end of the fixed piece barrel (305) and are positioned on the inner wall of the fixed piece barrel (305), the pressure regulating holes (411) are communicated with the corresponding air accommodating grooves (410), and fixed piece elastic films (412) matched with the pressure regulating holes (411) are fixedly connected to the inner wall of the pressure regulating holes in a sealing mode;
the outer wall of the annular air bag (402) is communicated with a plurality of connecting pipes (413), the number of the linkage vertical rods (403) is equal to that of the air accommodating grooves (410) and corresponds to that of the air accommodating grooves one by one, and one end, far away from the annular air bag (402), of each connecting pipe (413) is communicated with the corresponding air accommodating groove (410); when fixing the single crystal silicon wafer, a plurality of fixing elastic films (412) are attached to and press the single crystal silicon wafer from a plurality of directions.
2. The monocrystalline silicon piece etching and polishing device according to claim 1, further comprising a piece loading assisting mechanism (005), wherein the piece loading assisting mechanism (005) comprises a supporting plate (501), a plurality of piece receiving grooves (502) matched with the piece fixing barrel (305) are formed in the supporting plate (501), and the depth of the piece receiving grooves (502) is smaller than the thickness of the monocrystalline silicon piece.
3. The monocrystalline silicon piece etching and polishing device according to claim 2, wherein the number of the nano-sheet grooves (502) is equal to the number of the solid-sheet barrels (305), the plurality of the nano-sheet grooves (502) are uniformly distributed along the ring shape, and the bottom end of the supporting plate (501) is fixedly connected with a handle (503).
4. A monocrystalline silicon piece etching and polishing apparatus according to claim 1, the sealing abutment ring (306) being made of resilient material including but not limited to neoprene, butyl rubber.
5. The monocrystalline silicon piece etching and polishing device according to claim 1, characterized in that a sealing ring (208) is arranged at the joint of the driving motor (203) and the baffle plate (204), a liquid discharge pipe (209) is communicated with the outer wall of the polishing pool (202), and a sealing cover (210) matched with the liquid discharge pipe (209) is arranged at one end of the liquid discharge pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211741410.2A CN116207009B (en) | 2022-12-30 | 2022-12-30 | Monocrystalline silicon piece etching and polishing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211741410.2A CN116207009B (en) | 2022-12-30 | 2022-12-30 | Monocrystalline silicon piece etching and polishing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116207009A CN116207009A (en) | 2023-06-02 |
| CN116207009B true CN116207009B (en) | 2023-10-27 |
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| CN202211741410.2A Active CN116207009B (en) | 2022-12-30 | 2022-12-30 | Monocrystalline silicon piece etching and polishing equipment |
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| DE19853059A1 (en) * | 1998-11-17 | 2000-05-25 | Siemens Ag | Polishing and grinding equipment workpiece holder e.g. for polishing semiconductor wafers |
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| CN1867424A (en) * | 2003-10-17 | 2006-11-22 | 株式会社荏原制作所 | Polishing apparatus |
| KR20100081695A (en) * | 2009-01-07 | 2010-07-15 | 주식회사 실트론 | Head assembly for edge polishing apparatus of wafer |
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| CN218137200U (en) * | 2022-09-29 | 2022-12-27 | 徐州市晨创电子科技有限公司 | Monocrystalline silicon piece polishing workbench |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200016175A (en) * | 2018-08-06 | 2020-02-14 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate holding apparatus, substrate adsorption measuring method, substrate polishing apparatus, substrate polishing method, method for removing liquid from top of polishing substrate, elastic membrane for pressing wafer to polishing pad, substrate release method and quantitative gas supply apparatus |
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2022
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19853059A1 (en) * | 1998-11-17 | 2000-05-25 | Siemens Ag | Polishing and grinding equipment workpiece holder e.g. for polishing semiconductor wafers |
| CN1867424A (en) * | 2003-10-17 | 2006-11-22 | 株式会社荏原制作所 | Polishing apparatus |
| KR20050047792A (en) * | 2003-11-18 | 2005-05-23 | 주식회사 실트론 | A polishing-head for wafer polisher |
| KR20100081695A (en) * | 2009-01-07 | 2010-07-15 | 주식회사 실트론 | Head assembly for edge polishing apparatus of wafer |
| CN204819262U (en) * | 2015-08-14 | 2015-12-02 | 麦斯克电子材料有限公司 | A silicon chip strutting arrangement for polished silicon slice surface particles detects |
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|---|---|
| CN116207009A (en) | 2023-06-02 |
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