CN116193703A - Car lamp flexible circuit board with insulation and heat dissipation combined structure and preparation process - Google Patents

Car lamp flexible circuit board with insulation and heat dissipation combined structure and preparation process Download PDF

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Publication number
CN116193703A
CN116193703A CN202211099224.3A CN202211099224A CN116193703A CN 116193703 A CN116193703 A CN 116193703A CN 202211099224 A CN202211099224 A CN 202211099224A CN 116193703 A CN116193703 A CN 116193703A
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CN
China
Prior art keywords
reinforcing plate
copper
insulation
clad
insulating
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211099224.3A
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Chinese (zh)
Inventor
万海平
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Jiaxing Wenliang Electronic Technology Co ltd
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Jiaxing Wenliang Electronic Technology Co ltd
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Publication date
Application filed by Jiaxing Wenliang Electronic Technology Co ltd filed Critical Jiaxing Wenliang Electronic Technology Co ltd
Priority to CN202211099224.3A priority Critical patent/CN116193703A/en
Publication of CN116193703A publication Critical patent/CN116193703A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a car lamp flexible circuit board with an insulation and heat dissipation combined structure and a preparation process, wherein the structure comprises the following steps: the metal reinforcing plate, insulating reinforcing plate, thermosetting adhesive, copper-clad single panel and protection film, insulating reinforcing plate and metal reinforcing plate embedded connection, metal reinforcing plate and insulating reinforcing plate pass through thermosetting adhesive and are connected with copper-clad single panel, and copper-clad single panel is connected with the protection film. Compared with the prior art, the circuit board for the car lamp is more compact in wiring, saves the installation space of the car, meets the functions of heat dissipation and insulation, and improves the production efficiency.

Description

Car lamp flexible circuit board with insulation and heat dissipation combined structure and preparation process
Technical Field
The invention relates to the field of metal circuit boards for LED (light-emitting diode) car lamps, in particular to a car lamp flexible circuit board with an insulation and heat dissipation combined structure and a preparation process thereof.
Background
Electronic circuit boards for automotive lamps often require soldering of electronic components, such as LEDs, resistors, capacitors, and connectors, to the flexible circuit board. The common flexible circuit board often adopts the back at the welding position of flexible circuit board, pastes dress metal stiffening plate, plays the radiating effect. However, the connector cannot be installed at the metal reinforcing plate, and the metal reinforcing plate and the pins of the connector will cause short circuit during the welding process.
Therefore, the current electronic circuit board insulation reinforcing plate for the automobile lamp and the metal heat dissipation reinforcing plate are not attached at the same position, and the welding position of the connector and the welding position of the electronic component are not at the same position.
However, if the problem that the flexible circuit board for the car lamp is welded with the LED, the resistor, the capacitor and the connector is solved, the heat dissipation function and the insulation function are simultaneously satisfied, a large number of working procedures are reduced, and the overall production efficiency is improved.
To solve the above problems, we have made a series of improvements.
Disclosure of Invention
The invention aims to provide a flexible circuit board of a car lamp with an insulation and heat dissipation combined structure and a preparation process thereof, so as to overcome the defects and the shortcomings in the prior art.
Car light flexible line way board with insulating and heat dissipation combination formula structure includes: the metal reinforcing plate, insulating reinforcing plate, thermosetting adhesive, copper-clad single-sided board and protection film, insulating reinforcing plate and metal reinforcing plate embedded connection, metal reinforcing plate and insulating reinforcing plate pass through thermosetting adhesive and are connected with copper-clad single-sided board, copper-clad single-sided board is connected with the protection film.
Further, the embedded connection of the metal reinforcing plate and the insulating reinforcing plate is of a full embedded structure, a connecting groove is formed in the metal reinforcing plate, and the insulating reinforcing plate is arranged in the connecting groove.
Further, the embedded connection of the metal reinforcing plate and the insulating reinforcing plate is of a semi-embedded structure, the metal reinforcing plate is provided with a connecting edge and a fixing opening, and the insulating reinforcing plate is connected with the connecting edge and the fixing opening.
Further, the copper-clad single-sided board includes: copper, copper-clad thermosetting adhesive and copper-clad PI membrane, the copper is connected with copper-clad PI membrane through copper-clad thermosetting adhesive.
Further, the protective film includes: the protective PI film is connected with the copper-clad single-sided board through the protective thermosetting adhesive.
A preparation process of a car lamp flexible circuit board with an insulation and heat dissipation combined structure comprises the following steps:
step 1: manufacturing a flexible circuit single-sided board, blanking raw materials, cutting a copper-clad single-sided board, a protective film and thermosetting adhesive according to the size, cleaning, sequentially starting film pasting, exposing, etching and film removing on the copper-clad single-sided board, pasting the protective film on the surface of the copper-clad single-sided board, laminating, baking and drilling, pasting the thermosetting adhesive on the back of the copper-clad single-sided board, prepressing and punching;
step 2: manufacturing a metal reinforcing plate, cleaning the metal plate, and performing laser stamping according to a drawing;
step 3: manufacturing an insulating reinforcing plate, drilling the raw materials, and punching the raw materials according to a drawing by fishing;
step 4: and (3) manufacturing a combined reinforcing plate, bonding the copper-clad single-sided board in the step (1) with the metal reinforcing plate through thermosetting adhesive, connecting the insulating reinforcing plate with the metal reinforcing plate, bonding the copper-clad single-sided board through thermosetting adhesive, and then pressing and baking.
Further, the insulation reinforcing plate in the step 4 is placed into a connecting groove of the metal reinforcing plate, or the insulation reinforcing plate is attached to the connecting edge and the fixing opening of the metal reinforcing plate.
Further, the material of the metal reinforcing plate in the step 2 is aluminum or copper, and the material of the insulating reinforcing plate in the step 3 is FR4 insulating material.
Further, in the pressing process in step 4, the pressure is as follows: 15+ -5 kg F/cm 2 Temperature: 180+/-15 ℃ for the time of: 150.+ -.30 s.
The invention has the beneficial effects that:
compared with the prior art, the circuit board for the car lamp is more compact in wiring, saves the installation space of the car, meets the functions of heat dissipation and insulation, and improves the production efficiency.
Description of the drawings:
fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic diagram of the fully embedded structure of the present invention.
FIG. 3 is a schematic diagram of a semi-embedded structure of the present invention.
Fig. 4 is a schematic diagram of the process step 1 of the present invention.
Fig. 5 is a schematic diagram of process step 2 according to the present invention.
Fig. 6 is a schematic diagram of process step 3 of the present invention.
Fig. 7 is a schematic diagram of process step 4 of the present invention.
Reference numerals:
the metal reinforcing plate 100, the connection groove 110, the connection edge 120, and the fixing hole 130.
Insulation stiffener 200, thermoset 300, copper-clad single-sided board 400, copper plate 410, copper-clad thermoset 420, and copper-clad PI film 430.
A protective film 500, a protective thermosetting adhesive 510, and a protective PI film 520.
Detailed Description
The invention will now be further described with reference to specific examples. It should be understood that the following examples are illustrative of the present invention and are not intended to limit the scope of the present invention.
Fig. 1 is a schematic structural view of the present invention. Fig. 2 is a schematic diagram of the fully embedded structure of the present invention. FIG. 3 is a schematic diagram of a semi-embedded structure of the present invention. Fig. 4 is a schematic diagram of the process step 1 of the present invention. Fig. 5 is a schematic diagram of process step 2 according to the present invention. Fig. 6 is a schematic diagram of process step 3 of the present invention. Fig. 7 is a schematic diagram of process step 4 of the present invention.
Example 1
As shown in fig. 1, a vehicle lamp flexible circuit board having an insulation and heat dissipation combined structure includes: the metal reinforcing plate 100, the insulating reinforcing plate 200, the thermosetting adhesive 300, the copper-clad single-sided board 400 and the protective film 500 are connected in an embedded mode, the insulating reinforcing plate 200 is connected with the metal reinforcing plate 100, the metal reinforcing plate 100 and the insulating reinforcing plate 200 are connected with the copper-clad single-sided board 400 through the thermosetting adhesive 300, and the copper-clad single-sided board 400 is connected with the protective film 500.
As shown in fig. 2, the embedded connection of the metal reinforcing plate 100 and the insulating reinforcing plate 200 is a fully embedded structure, the metal reinforcing plate 100 is provided with a connecting groove 110, and the insulating reinforcing plate 200 is arranged in the connecting groove 110.
As shown in fig. 3, the embedded connection of the metal reinforcing plate 100 and the insulating reinforcing plate 200 is a semi-embedded structure, the metal reinforcing plate 100 is provided with a connecting edge 120 and a fixing opening 130, and the insulating reinforcing plate 200 is connected with the connecting edge 120 and the fixing opening 130.
The copper-clad single-sided board 400 includes: copper plate 410, copper-clad thermosetting adhesive 420 and copper-clad PI film 430, copper plate 410 is connected with copper-clad PI film 430 through copper-clad thermosetting adhesive 420.
The protective film 500 includes: the protective thermosetting adhesive 510 and the protective PI film 520, the protective PI film 520 is connected with the copper-clad single-sided board 400 through the protective thermosetting adhesive 510.
A preparation process of a car lamp flexible circuit board with an insulation and heat dissipation combined structure comprises the following steps:
as shown in fig. 4, step 1: manufacturing a flexible circuit single-sided board, blanking raw materials, cutting a copper-clad single-sided board 400, a protective film 500 and a thermosetting adhesive 300 according to the size, cleaning, sequentially starting film pasting, exposing, etching and removing on the copper-clad single-sided board 400, pasting the protective film 500 on the surface of the copper-clad single-sided board 400, laminating, baking and drilling, pasting the thermosetting adhesive 300 on the back of the copper-clad single-sided board 400, prepressing and punching;
as shown in fig. 5, step 2: manufacturing a metal reinforcing plate 100, cleaning the metal plate, and performing laser stamping according to a drawing;
as shown in fig. 6, step 3: manufacturing an insulating reinforcing plate 200, drilling the raw materials, and punching the raw materials according to a drawing by fishing;
as shown in fig. 7, step 4: and (3) manufacturing a combined reinforcing plate, namely bonding the copper-clad single-sided board 400 in the step (1) with the metal reinforcing plate 100 through the thermosetting adhesive 300, connecting the insulating reinforcing plate 200 with the metal reinforcing plate 100, bonding the copper-clad single-sided board 400 through the thermosetting adhesive, and then pressing and baking.
The insulation reinforcing plate 200 in step 4 is placed in the connection groove 110 of the metal reinforcing plate 100, or the insulation reinforcing plate 200 is attached to the connection edge 120 and the fixing hole 130 of the metal reinforcing plate 100.
The material of the metal reinforcing plate 100 in step 2 is aluminum, and the material of the insulation reinforcing plate 200 in step 3 is FR4 insulation material.
In the lamination process in step 4, the pressure is: 15 kg F/cm 2 Temperature: 180 ℃, time: 150s.
The invention selects the combination of the metal reinforcing plate 100 and the insulating reinforcing plate 200, and the copper-clad single-sided plate 400 and the metal reinforcing plate 100 and the insulating reinforcing plate 200 are in press fit connection in a fully embedded or semi-embedded combination mode through the thermosetting adhesive 300, so that the circuit board for the car lamp is realized at the supporting position of the reinforcing plate, components of LEDs, resistors and capacitors can be mounted and attached, and meanwhile, a connector can be welded, and the insulating reinforcing plate and the connector are not required to be designed at other positions of the flexible circuit board. The reinforcing plate with the heat dissipation and insulation functions is designed and processed, so that the circuit board for the car lamp is more compact in wiring, saves installation space, meets the heat dissipation and insulation functions, and improves production efficiency.
In particular, the metal reinforcing plate 100 and the insulating reinforcing plate 200 of the conventional structure are not in one position when first wired, which means that there is a distance between the wires of both sides, and the absolute length of the entire flexible circuit board is also longer than that of the present invention, so that the metal reinforcing plate 100 of the present invention is in the same position as the insulating reinforcing plate 200. For the reasons mentioned above, the installation space of the vehicle is also saved. As a vehicle lamp flexible circuit board, it is a component of an automobile naturally. The installation space of the automobile is limited and precious, after the metal reinforcing plate 100 and the insulating reinforcing plate 200 form a combined structure, the volume of the whole flexible circuit board is correspondingly reduced, the naturally corresponding installation support is reduced, and the corresponding installation space in the automobile is reduced after the installation support is reduced.
On the other hand, the production efficiency is improved at the same time. The conventional insulation stiffener 200 requires one more step to install and 3M glue to fix. In the invention, the metal reinforcing plate 100 and the insulating reinforcing plate 200 are embedded or semi-embedded, so that the insulating reinforcing plate 200 can be directly fixed through the thermosetting adhesive 300 for fixing the metal reinforcing plate 100, the steps can be simultaneously integrated, and the cost of 3M adhesive can be saved in materials.
Finally, this structural improvement may save a significant amount of material costs in addition to the cost of 3M glue. The conventional insulation reinforcing plate 200 requires a positioning hole for positioning because it is also required to be installed at another place, and requires a sufficient area for punching the positioning hole. Compared with the combined structure of the invention, the metal reinforcing plate 100 becomes an anchor point of the insulating reinforcing plate 200, so that a large-area structure is not required, and the material cost is saved. In the fully embedded structure, the connection groove 110 becomes a positioning way of the insulation reinforcing plate 200; in the half-insert structure, the connecting edge 120 and the fixing hole 130 become a positioning means of the insulation reinforcing plate 200. Correspondingly, since the metal reinforcing plate 100 is partially cut out, its material cost is reduced as compared with the conventional art.
As shown in fig. 2, one technical problem encountered with the above-described improvements is the strength of the support. The flexible circuit board is easy to break due to the linear splicing combination. Therefore, the present invention adopts a fully or semi-embedded manner in the connection manner of the metal reinforcing plate 100 and the insulating reinforcing plate 200. In this embodiment, a fully embedded connection is used. The fully embedded structure is that the metal reinforcing plate 100 is provided with the connecting groove 110 at the corresponding position, then the insulating reinforcing plate 200 is put into the connecting groove 110, and the insulating reinforcing plate 200 is connected with the thermosetting adhesive 300 through the hollowed connecting groove 110. The full embedded structure can effectively ensure the supporting strength of the reinforcing plate. However, the precondition is that the pin holes of the flexible circuit board are small, the connector is short enough to meet the requirement, and the metal reinforcing plate is particularly embedded when the area of the metal reinforcing plate is larger than that of the insulating reinforcing plate of the connector.
Example 2
As shown in fig. 3, in the present embodiment, if the condition of embodiment 1 cannot be satisfied, as in the present embodiment, the widths of the metal reinforcing plate 100 and the insulating reinforcing plate 200 are identical, and thus the fully embedded structure is not suitable, because the combination of half of the metal reinforcing plate 100 and half of the insulating reinforcing plate 200 forms a straight line, there is a risk of breakage. Therefore, only half-embedded structures can be selected, and the purpose of the half-embedded structures is to avoid the bending problem. Therefore, the fixing opening 130 is designed, the protruding part blocks the formation of a straight line, a break point in the force transmission process is formed, and the bending problem is effectively prevented.
In conclusion, through the connection mode, the circuit board for the vehicle lamp is successfully arranged at the supporting position of the reinforcing plate, components of the LED, the resistor and the capacitor can be mounted and attached, and meanwhile, the connector can be welded, and the insulating reinforcing plate and the connector are not required to be arranged at other positions of the flexible circuit board. The circuit board for the car lamp is more compact in wiring, saves installation space, meets the functions of heat dissipation and insulation, and improves production efficiency.
The present invention has been described in detail with reference to the embodiments, but the present invention is not limited thereto, and various modifications may be made without departing from the spirit of the present invention.

Claims (9)

1. Car light flexible line way board with insulating and heat dissipation combination formula structure, its characterized in that includes: the copper-clad single-sided board comprises a metal reinforcing plate (100), an insulating reinforcing plate (200), thermosetting glue (300), a copper-clad single-sided board (400) and a protective film (500), wherein the insulating reinforcing plate (200) is connected with the metal reinforcing plate (100) in an embedded mode, the metal reinforcing plate (100) and the insulating reinforcing plate (200) are connected with the copper-clad single-sided board (400) through the thermosetting glue (300), and the copper-clad single-sided board (400) is connected with the protective film (500).
2. The flexible circuit board for a vehicle lamp with an insulation and heat dissipation combined structure according to claim 1, wherein the embedded connection of the metal reinforcing plate (100) and the insulation reinforcing plate (200) is a fully embedded structure, a connecting groove (110) is formed in the metal reinforcing plate (100), and the insulation reinforcing plate (200) is arranged in the connecting groove (110).
3. The flexible circuit board for a vehicle lamp with an insulation and heat dissipation combined structure according to claim 1, wherein the embedded connection of the metal reinforcing plate (100) and the insulation reinforcing plate (200) is a semi-embedded structure, a connecting edge (120) and a fixing opening (130) are arranged on the metal reinforcing plate (100), and the insulation reinforcing plate (200) is connected with the connecting edge (120) and the fixing opening (130).
4. The flexible circuit board for a vehicle lamp having a combined insulating and heat dissipating structure according to claim 1, wherein the copper-clad single-sided board (400) comprises: copper (410), copper-clad thermosetting adhesive (420) and copper-clad PI film (430), copper (410) are connected with copper-clad PI film (430) through copper-clad thermosetting adhesive (420).
5. The vehicle lamp flexible wiring board having a combined insulating and heat dissipating structure according to claim 1, wherein the protective film (500) comprises: the copper-clad single-sided board comprises a protective thermosetting adhesive (510) and a protective PI film (520), wherein the protective PI film (520) is connected with the copper-clad single-sided board (400) through the protective thermosetting adhesive (510).
6. The preparation process of the car lamp flexible circuit board with the insulation and heat dissipation combined structure is characterized by comprising the following steps of:
step 1: manufacturing a flexible circuit single-sided board, blanking raw materials, cutting a copper-clad single-sided board (400), a protective film (500) and thermosetting glue (300) according to the size, cleaning, sequentially starting film pasting, exposure, etching and film removal on the copper-clad single-sided board (400), pasting the protective film (500) on the surface of the copper-clad single-sided board (400), laminating, baking and drilling, pasting the thermosetting glue (300) on the back surface of the copper-clad single-sided board (400), and prepressing and punching;
step 2: manufacturing a metal reinforcing plate (100), cleaning the metal plate, and performing laser stamping according to a drawing;
step 3: manufacturing an insulating reinforcing plate (200), drilling the raw materials, and punching the raw materials according to a drawing by fishing;
step 4: and (3) manufacturing a combined reinforcing plate, wherein the copper-clad single-sided board (400) in the step (1) is attached to the metal reinforcing plate (100) through thermosetting glue (300), and the insulating reinforcing plate (200) is connected with the metal reinforcing plate (100) and is attached to the copper-clad single-sided board (400) through thermosetting glue, and then is subjected to lamination and baking.
7. The process for manufacturing the flexible circuit board with the combined structure of insulation and heat dissipation for the car lamp according to claim 6, wherein the process comprises the following steps: and (2) placing the insulating reinforcing plate (200) in the step (4) into the connecting groove (110) of the metal reinforcing plate (100), or attaching the insulating reinforcing plate (200) to the connecting edge (120) and the fixing opening (130) of the metal reinforcing plate (100).
8. The process for manufacturing the flexible circuit board with the combined structure of insulation and heat dissipation for the car lamp according to claim 6, wherein the process comprises the following steps: the material of the metal reinforcing plate (100) in the step 2 is aluminum or copper, and the material of the insulating reinforcing plate (200) in the step 3 is FR4 insulating material.
9. The process for manufacturing the flexible circuit board with the combined structure of insulation and heat dissipation for the car lamp according to claim 6, wherein the process comprises the following steps: in the pressing process in the step 4, the pressure is as follows: 15+ -5 kg F/cm 2 Temperature: 180+/-15 ℃ for the time of: 150.+ -.30 s.
CN202211099224.3A 2022-09-08 2022-09-08 Car lamp flexible circuit board with insulation and heat dissipation combined structure and preparation process Pending CN116193703A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211099224.3A CN116193703A (en) 2022-09-08 2022-09-08 Car lamp flexible circuit board with insulation and heat dissipation combined structure and preparation process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211099224.3A CN116193703A (en) 2022-09-08 2022-09-08 Car lamp flexible circuit board with insulation and heat dissipation combined structure and preparation process

Publications (1)

Publication Number Publication Date
CN116193703A true CN116193703A (en) 2023-05-30

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ID=86439010

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211099224.3A Pending CN116193703A (en) 2022-09-08 2022-09-08 Car lamp flexible circuit board with insulation and heat dissipation combined structure and preparation process

Country Status (1)

Country Link
CN (1) CN116193703A (en)

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