CN116191825A - Manufacturing control method of modularized power supply circuit, modularized power supply circuit and device - Google Patents

Manufacturing control method of modularized power supply circuit, modularized power supply circuit and device Download PDF

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Publication number
CN116191825A
CN116191825A CN202310194909.4A CN202310194909A CN116191825A CN 116191825 A CN116191825 A CN 116191825A CN 202310194909 A CN202310194909 A CN 202310194909A CN 116191825 A CN116191825 A CN 116191825A
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circuit
sub
power supply
module
supply circuit
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CN202310194909.4A
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CN116191825B (en
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罗育云
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Guangdong Zhongyuan Computer Equipment Co ltd
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Guangdong Zhongyuan Computer Equipment Co ltd
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
    • H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
    • H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
    • H02M3/325—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
    • H02M3/335—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/33569—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
    • H02M3/33576—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
    • H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
    • H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
    • H02M3/325—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
    • H02M3/335—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/33569—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
    • H02M3/33576—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer
    • H02M3/33592—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer having a synchronous rectifier circuit or a synchronous freewheeling circuit at the secondary side of an isolation transformer

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Power Sources (AREA)

Abstract

The application discloses a manufacturing control method of a modularized power supply circuit, the modularized power supply circuit and a device, and relates to the technical field of circuit manufacturing. And acquiring the application environment requirements of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit in the modularized power supply circuit. According to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit, generating an initial layout scheme of the modularized power supply circuit, performing multi-dimensional verification on the initial layout scheme, and determining the initial layout scheme as a target layout scheme under the condition that the initial layout scheme passes the multi-dimensional verification. And installing each sub-module circuit according to the target layout scheme to generate the modularized power supply circuit. In the method, the hidden operation risks of manual operation can be removed to the greatest extent, the labor cost is greatly reduced, the production and manufacturing efficiency of the modularized power supply circuit is improved, the faults of the modularized power supply circuit are reduced, and the fault processing and tracing are facilitated.

Description

Manufacturing control method of modularized power supply circuit, modularized power supply circuit and device
Technical Field
The application relates to the technical field of blockchain, in particular to a manufacturing control method of a modularized power supply circuit, the modularized power supply circuit and a device.
Background
A switch mode power supply (Switch Mode Power Supply, SMPS for short), also called a switching power supply, a switching converter, is a high frequency power conversion device, which is a type of power supply. The function is to convert a voltage of one level into a voltage or current required by the user terminal through different types of structures. The input of the switching power supply is mostly an ac power supply (e.g. mains supply) or a dc power supply, while the output is mostly a device requiring a dc power supply, such as a personal computer, and the switching power supply is used for converting voltage and current between the two.
In the existing method, a large number of cable connection modes are adopted in the circuit design process of the switch mode power supply, so that a large number of workers are needed to participate in the production and manufacturing process of the switch mode power supply, the mechanization degree is low, namely, the assembly and the production of the switch mode power supply are carried out manually, time and labor are wasted, and the efficiency is low.
Disclosure of Invention
The application provides a manufacturing control method of a modularized power supply circuit, the modularized power supply circuit and a device aiming at the existing problems, and the specific technical scheme is as follows:
In a first aspect of the present application, there is provided a method of manufacturing control of a modular power circuit, the method comprising:
acquiring the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit in the modularized power supply circuit;
generating an initial layout scheme of the modularized power supply circuit according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit;
performing multi-dimensional verification on the initial layout scheme, and determining the initial layout scheme as a target layout scheme under the condition that the initial layout scheme passes through the multi-dimensional verification;
and installing each sub-module circuit according to the target layout scheme to generate the modularized power supply circuit.
Optionally, the step of generating an initial layout scheme of the modular power circuit according to the application environment requirement of the modular power circuit and the theoretical power consumption of each sub-module circuit includes:
determining the layout coordinates and the layout order of each sub-module circuit according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit;
And connecting each sub-module circuit according to the layout coordinates and the layout sequence of each sub-module circuit and a preset connection relation to generate an initial layout scheme of the modularized power supply circuit.
Optionally, the step of determining the layout coordinates and the layout order of each sub-module circuit according to the application environment requirement of the modular power supply circuit and the theoretical power consumption of each sub-module circuit includes:
determining the load stability level of the modularized power supply circuit according to the application environment requirements of the modularized power supply circuit;
determining the heat dissipation space area of each sub-module circuit according to the theoretical power consumption of each sub-module circuit;
and determining the layout coordinates and the layout sequence of each sub-module circuit according to the load stability level of the modularized power supply circuit and the heat dissipation space area of each sub-module circuit.
Optionally, the step of determining the layout coordinates and the layout sequence of each sub-module circuit according to the load stability level of the modular power circuit and the heat dissipation space area of each sub-module circuit includes:
determining a load stability supporting coefficient corresponding to each sub-module circuit according to the load stability grade of the modularized power supply circuit;
According to the heat dissipation space area of each sub-module circuit, determining a heat dissipation demand coefficient corresponding to each sub-module circuit;
calculating a weight coefficient of each sub-module circuit according to the product of the load stable support coefficient and the heat dissipation demand coefficient;
performing rank ordering on each sub-module circuit according to the height of the weight coefficient so as to determine the layout order of each sub-module circuit;
and determining the layout coordinates of each sub-module circuit according to the heat dissipation space area of each sub-module circuit.
Optionally, the multi-dimensional verification includes energy consumption reference verification, power supply electrical margin verification and wiring specification verification; the step of performing multi-dimensional verification on the initial layout scheme comprises the following steps:
according to the difference relation between the theoretical power consumption of each sub-module circuit and the energy consumption reference, performing energy consumption reference verification on the initial layout scheme;
carrying out power supply electricity allowance verification on the initial layout scheme according to the ratio relation between the theoretical power consumption of each sub-module circuit and the power supply allowance;
and carrying out wiring specification verification on the initial layout scheme according to the interference degree of the layout circuit of each sub-module circuit on other sub-module circuits and the coupling capacitance capacity of the layout circuit of each sub-module circuit.
Optionally, the method further comprises:
generating a verification result analysis report according to the results of the energy consumption reference verification, the power supply electricity allowance verification and the wiring specification verification under the condition that the initial layout scheme does not pass the multidimensional verification;
and adjusting the initial layout scheme according to the verification result analysis report to generate an optimized layout scheme, and iteratively executing the step of performing multidimensional verification on the optimized layout scheme.
Optionally, the initial layout scheme passing through the multi-dimensional verification is at least one, and after the step of passing through the multi-dimensional verification, the method further includes:
encoding each initial layout scheme passing through multi-dimensional verification to generate an initial population;
based on a target evaluation function, respectively carrying out fitness evaluation on each individual in the initial population, and determining elite individuals according to the result of the fitness evaluation;
generating a newly added individual according to the elite individual through a cross mutation strategy so as to update the initial population;
and iteratively executing the target evaluation function, respectively carrying out fitness evaluation on each individual in the initial population, determining elite individuals according to the result of the fitness evaluation, and generating new individuals according to the elite individuals through a cross mutation strategy so as to realize the step of updating the initial population.
Optionally, the step of installing each sub-module circuit according to the target layout scheme, and generating the modularized power supply circuit includes:
and sequentially splicing the PCB circuit board corresponding to each sub-module circuit with the main PCB circuit board according to the layout coordinates and the layout sequence of each sub-module circuit in the target layout scheme.
In a second aspect, an embodiment of the present invention provides a modular power circuit manufactured according to the manufacturing control method of the modular power circuit described in the first aspect of the embodiment of the present application, where the modular power circuit includes: the device comprises a boosting submodule circuit, a synchronous rectification driving submodule circuit, an output feedback submodule circuit, a central control submodule circuit and a filtering submodule circuit;
the input end of the filtering submodule circuit is connected with the alternating current power supply end, and the output end of the filtering submodule circuit is connected with the input end of the boosting submodule circuit;
the output end of the boosting submodule circuit is connected with the input end of the central control submodule circuit;
the output end of the central control sub-module circuit is connected with the input end of the synchronous rectification driving sub-module circuit;
the output end of the synchronous rectification driving submodule circuit is connected with the input end of the output feedback submodule circuit;
The central control submodule circuit comprises a main control chip, a first pin of the main control chip is connected with one end of a first resistor, a second resistor, a third resistor and a first capacitor in a common point manner, the other end of the first resistor is connected with a high-voltage end after being connected with a fourth resistor and a fifth resistor in series, a second pin of the main control chip is connected with one end of a sixth resistor, a seventh resistor and a second capacitor in a common point manner, the other end of the sixth resistor is connected with a seventh resistor and an eighth resistor in series and then is connected with a first input voltage end, a third pin of the main control chip is connected with a ninth resistor in series and then is connected with a chip selection signal end, a third pin of the main control chip is also connected with one end of the third capacitor in a common point manner, one ends of the fourth pin of the main control chip and the fifth capacitor and the other end of the third capacitor in a common point manner are connected with a grounding point, the fifth pin of the main control chip is connected with a tenth resistor, the sixth pin of the main control chip is connected with the other end of the fourth capacitor and the positive electrode of the first diode in a common mode, the seventh pin of the main control chip is connected with the synchronous counting end, the eighth pin of the main control chip is connected with the other end of the fifth capacitor and one end of the sixth capacitor in a common mode, the tenth pin of the main control chip is connected with the other end of the sixth capacitor in a common mode with a grounding point in a common mode, the eleventh pin of the main control chip is connected with the negative electrode of the first diode and one end of the seventh capacitor in a common mode, the twelfth pin of the main control chip is connected with the second input voltage end, the thirteenth pin of the main control chip is connected with the other end of the seventh capacitor in a common mode, the fifteenth pin of the main control chip is connected with one end of the eighth capacitor in a common mode, one end of a ninth capacitor, one end of a tenth capacitor, one end of an eleventh resistor and one end of an anode of a second diode are connected in a common point mode, a sixteenth pin of a main control chip is connected with one end of the ninth capacitor, a cathode of the second diode and one end of the twelfth resistor in a common point mode, a seventeenth pin of the main control chip is connected with one end of the eleventh capacitor, an eighteenth pin of the main control chip is connected with a feedback pin end, a nineteenth pin of the main control chip is connected with one end of a thirteenth resistor, the other end of the thirteenth resistor is connected with the other end of the eleventh resistor and the other end of the tenth capacitor in a common point mode, a twentieth pin of the main control chip is connected with the other end of the eleventh capacitor in a common point mode, and a fifteenth pin is connected in a common point mode.
In a third aspect, an embodiment of the present invention provides a manufacturing control apparatus for a modular power supply circuit, the apparatus including:
the acquisition module is used for acquiring the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit in the modularized power supply circuit;
the initial scheme generation module is used for generating an initial layout scheme of the modularized power supply circuit according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit;
the verification module is used for carrying out multi-dimensional verification on the initial layout scheme and determining the initial layout scheme as a target layout scheme under the condition that the multi-dimensional verification is passed;
and the layout module is used for installing each sub-module circuit according to the target layout scheme to generate the modularized power supply circuit.
Optionally, the initial scheme generation module includes:
the parameter determining submodule is used for determining the layout coordinate and the layout order of each submodule circuit according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each submodule circuit;
and the scheme generating sub-module is used for generating an initial layout scheme of the modularized power supply circuit according to the layout coordinates and the layout sequence of each sub-module circuit and connecting each sub-module circuit according to a preset connection relation.
Optionally, the parameter determination submodule includes:
the load stability grade determining unit is used for determining the load stability grade of the modularized power supply circuit according to the application environment requirement of the modularized power supply circuit;
the heat dissipation space area determining unit is used for determining the heat dissipation space area of each sub-module circuit according to the theoretical power consumption of each sub-module circuit;
and the calculating unit is used for determining the layout coordinates and the layout sequence of each sub-module circuit according to the load stability level of the modularized power supply circuit and the heat dissipation space area of each sub-module circuit.
Optionally, the computing unit includes:
the load stability supporting coefficient determining subunit is used for determining a load stability supporting coefficient corresponding to each submodule circuit according to the load stability grade of the modularized power supply circuit;
the heat dissipation demand coefficient determination subunit is used for determining the heat dissipation demand coefficient corresponding to each sub-module circuit according to the heat dissipation space area of each sub-module circuit;
the weight coefficient determining subunit is used for calculating the weight coefficient of each submodule circuit according to the product of the load stable supporting coefficient and the heat dissipation demand coefficient;
The sequencing subunit is used for sequencing each sub-module circuit in order according to the height of the weight coefficient so as to determine the layout sequence of each sub-module circuit;
and the coordinate determining subunit is used for determining the layout coordinate of each sub-module circuit according to the heat dissipation space area of each sub-module circuit.
Optionally, the verification module includes:
the first verification submodule is used for carrying out energy consumption reference verification on the initial layout scheme according to the difference relation between the theoretical power consumption of each submodule circuit and the energy consumption reference;
the second checking submodule is used for checking the power supply electric margin of the initial layout scheme according to the ratio relation between the theoretical power consumption of each submodule circuit and the power supply margin;
and the third verification sub-module is used for verifying the wiring specification of the initial layout scheme according to the interference degree of the layout circuit of each sub-module circuit on other sub-module circuits and the coupling capacitance capacity of the layout circuit of each sub-module circuit.
Optionally, the verification module further includes:
the analysis report generation module is used for generating a verification result analysis report according to the results of the energy consumption reference verification, the power supply electricity allowance verification and the wiring specification verification under the condition that the initial layout scheme does not pass the multidimensional verification;
And the iteration sub-module is used for adjusting the initial layout scheme according to the verification result analysis report, generating an optimized layout scheme, and iteratively executing the step of carrying out multi-dimensional verification on the optimized layout scheme.
Optionally, the layout module includes:
and the assembly sub-module is used for sequentially splicing the PCB circuit board corresponding to each sub-module circuit with the main PCB circuit board according to the layout coordinates and the layout sequence of each sub-module circuit in the target layout scheme.
A fourth aspect of an embodiment of the present invention provides an electronic device, including:
at least one processor; and a memory communicatively coupled to the at least one processor; wherein, the liquid crystal display device comprises a liquid crystal display device,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method steps set forth in the first aspect of the embodiments of the present invention.
A fifth aspect of the embodiments of the present invention proposes a computer readable storage medium, on which a computer program is stored, which program, when being executed by a processor, implements a method as proposed in the first aspect of the embodiments of the present invention.
The application has the following beneficial effects:
The embodiment of the application provides a manufacturing control method of a modularized power supply circuit, which comprises the following steps: firstly, the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit in the modularized power supply circuit are obtained. And then, according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit, generating an initial layout scheme of the modularized power supply circuit, carrying out multi-dimensional verification on the initial layout scheme, and determining the initial layout scheme as a target layout scheme under the condition that the initial layout scheme passes the multi-dimensional verification. And finally, installing each sub-module circuit according to the target layout scheme to generate the modularized power supply circuit. In this application, through the connection combination that breaks up into a plurality of submodule circuits with whole power supply circuit and carry out the modularization to make every submodule circuit be in the position of laying that has the best heat dispersion and minimum wiring line distance simultaneously, make the modularization power supply circuit that the equipment obtained can have better heat dispersion and power supply performance, and can remove the operation bad risk that manual operation was hidden to the maximize, and reduced the cost of labor greatly, also can improve production manufacturing efficiency greatly, also reduced the trouble of modularization power supply circuit, and do benefit to the processing and the tracing of trouble.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic structural diagram of an electronic device in a hardware running environment according to an embodiment of the present application.
Fig. 2 is a flowchart of steps of a method for manufacturing and controlling a modular power circuit according to an embodiment of the present application.
Fig. 3 is a schematic circuit diagram of a modular power circuit in an embodiment of the present application.
Fig. 4 is a schematic functional block diagram of a manufacturing control device of a modular power circuit according to an embodiment of the present application.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will become more readily apparent, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be apparent that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The following further describes the aspects of the present application with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device in a hardware running environment according to an embodiment of the present application.
As shown in fig. 1, the electronic device may include: a processor 1001, such as a central processing unit (Central Processing Unit, CPU), a communication bus 1002, a user interface 1003, a network interface 1004, a memory 1005. Wherein the communication bus 1002 is used to enable connected communication between these components. The user interface 1003 may include a Display, an input unit such as a Keyboard (Keyboard), and the optional user interface 1003 may further include a standard wired interface, a wireless interface. The network interface 1004 may optionally include a standard wired interface, a WIreless interface (e.g., a WIreless-FIdelity (WI-FI) interface). The Memory 1005 may be a high-speed random access Memory (Random Access Memory, RAM) Memory or a stable nonvolatile Memory (NVM), such as a disk Memory. The memory 1005 may also optionally be a storage device separate from the processor 1001 described above.
Those skilled in the art will appreciate that the structure shown in fig. 1 is not limiting of the electronic device and may include more or fewer components than shown, or may combine certain components, or may be arranged in different components.
As shown in fig. 1, an operating system, a data storage module, a network communication module, a user interface module, and an electronic program may be included in the memory 1005 as one type of storage medium.
In the electronic device shown in fig. 1, the network interface 1004 is mainly used for data communication with a network server; the user interface 1003 is mainly used for data interaction with a user; the processor 1001 and the memory 1005 in the electronic device of the present invention may be disposed in the electronic device, and the electronic device invokes the manufacturing control device of the modularized power supply circuit stored in the memory 1005 through the processor 1001, and executes the manufacturing control method of the modularized power supply circuit provided in the embodiment of the present application.
Referring to fig. 2, based on the foregoing hardware operating environment, an embodiment of the present application provides a method for manufacturing and controlling a modular power circuit, which may specifically include the following steps:
s201: and acquiring the application environment requirements of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit in the modularized power supply circuit.
In this embodiment, the application environment requirement of the modular power circuit refers to a severe level of the application environment of the modular power circuit, and the application environment requirements of different types of power circuits are different due to different adaptive scenes, for example, the application environment requirement may be an industrial level application requirement or a civil level application requirement, the modular power circuit is obtained by combining a plurality of sub-module circuits, and the theoretical power consumption of each sub-module circuit may obtain a schematic circuit design of the modular power circuit, and may be obtained by theoretical calculation according to the schematic circuit design of the modular power circuit.
S202: and generating an initial layout scheme of the modularized power supply circuit according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit.
In this embodiment, after obtaining the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit, the circuit design schematic diagram of the power supply circuit may be simulated and checked according to the application environment requirement and the theoretical power consumption of the sub-module circuit, so as to generate an initial layout scheme of the modularized power supply circuit, and the specific steps may be:
s202-1: and determining the layout coordinates and the layout sequence of each sub-module circuit according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit.
In this embodiment, the layout coordinates and the layout order of the sub-module circuits refer to the installation and deployment positions of the PCB circuit boards corresponding to each sub-module circuit in the real object installation stage, that is, the installation and deployment order of the PCB circuit boards corresponding to the sub-module circuits, that is, how to deploy the PCB circuit boards corresponding to the sub-module circuits, and the specific steps of determining the layout coordinates and the layout order of each sub-module circuit may be:
S202-1-1: and determining the load stability level of the modularized power supply circuit according to the application environment requirements of the modularized power supply circuit.
In this embodiment, the load stability levels of the modular power circuits corresponding to different application environment requirements are different, for example, under the industrial application requirements, the requirements on the modular power circuits are higher due to the poorer environment of the application scenes, and the modular power circuits are required to have higher load stability levels, for example, under the civil application requirements, the requirements on the modular power circuits are lower due to the better environment of the application scenes, and the modular power circuits are required to have lower load stability levels.
S202-1-2: and determining the heat dissipation space area of each sub-module circuit according to the theoretical power consumption of each sub-module circuit.
In this embodiment, in order to ensure that the modular power circuit can normally and stably operate during the operation of the modular power circuit, a sufficient heat dissipation space needs to be reserved for each sub-module circuit, and the theoretical power consumption of the module circuit and the heat dissipation space required by the module circuit are in a linear relationship, so that the heat dissipation space area required by each sub-module circuit can be calculated according to the theoretical power consumption of each sub-module circuit.
S202-1-3: and determining the layout coordinates and the layout sequence of each sub-module circuit according to the load stability level of the modularized power supply circuit and the heat dissipation space area of each sub-module circuit.
In this embodiment, after the load stability level of the modular power circuit and the heat dissipation space area of each sub-module circuit are obtained, the layout coordinates and the layout order of each sub-module circuit may be determined, and the specific steps further include:
s202-1-3-1: according to the load stability level of the modularized power supply circuit, determining a load stability supporting coefficient corresponding to each sub-module circuit;
s202-1-3-2: according to the heat dissipation space area of each sub-module circuit, determining a heat dissipation demand coefficient corresponding to each sub-module circuit;
s202-1-3-3: calculating the weight coefficient of each sub-module circuit according to the product of the load stable support coefficient and the heat dissipation demand coefficient;
s202-1-3-4: according to the height of the weight coefficient, performing rank ordering on each sub-module circuit to determine the layout order of each sub-module circuit;
s202-1-3-5: and determining the layout coordinates of each sub-module circuit according to the heat dissipation space area of each sub-module circuit.
In the embodiments of S202-1-3-1 to S202-1-3-5, the higher the load stability level of the modular power supply circuit, the higher the supporting capability of each sub-module circuit for it, the higher the corresponding load stability supporting coefficient, and between different sub-module circuits, the load stability supporting coefficient is determined according to the importance level of the sub-module circuit, and as an example, the sub-module circuits may be a boost sub-module circuit, a synchronous rectification driving sub-module circuit, an output feedback sub-module circuit, a central control sub-module circuit and a filtering sub-module circuit, wherein the order of importance level of the modular power supply circuit from high to low is as follows: the synchronous rectification driving sub-module circuit comprises a central control sub-module circuit, a synchronous rectification driving sub-module circuit, a boosting sub-module circuit, a filtering sub-module circuit and an output feedback sub-module circuit. The load stability supporting coefficient of the central control submodule circuit can be 1, the load stability supporting coefficient of the synchronous rectification driving submodule circuit can be 0.9, the load stability supporting coefficient of the boosting submodule circuit can be 0.8, the load stability supporting coefficient of the filtering submodule circuit can be 0.7, and the load stability supporting coefficient of the output feedback submodule circuit can be 0.6. The heat dissipation space area of each sub-module circuit and the heat dissipation demand coefficient are in positive correlation, namely, the larger the heat dissipation space area corresponding to the sub-module circuit is, the higher the corresponding heat dissipation demand coefficient is, so that after the load stable support coefficient and the heat dissipation demand coefficient of each sub-module circuit are obtained, the weight coefficient for reflecting the influence capacity of the sub-module circuit on the modular power circuit can be calculated, and the higher the weight coefficient is, the stronger the influence capacity of the sub-module circuit on the modular power circuit is. And then calculating the weight coefficient of each sub-module circuit, and obtaining the installation and deployment sequence of the PCB corresponding to each sub-module circuit according to the height of the weight coefficient, and determining the layout coordinates of the PCB corresponding to each sub-module circuit according to the heat dissipation space area of each sub-module circuit.
S202-2: and connecting each sub-module circuit according to the layout coordinates and the layout sequence of each sub-module circuit and a preset connection relation to generate an initial layout scheme of the modularized power supply circuit.
In this embodiment, after the layout coordinates and the layout order of each sub-module circuit are obtained, simulation layout is performed on each sub-module circuit according to the layout coordinates and the layout order, and the preset connection relationship characterizes the circuit connection relationship between different sub-module circuits, which can be obtained by importing a circuit schematic diagram of the modularized power supply circuit, and then connecting the sub-module circuits according to the circuit connection relationship, so as to generate an initial layout scheme of the modularized power supply circuit.
S203: and carrying out multidimensional verification on the initial layout scheme, and determining the initial layout scheme as a target layout scheme under the condition that the initial layout scheme passes the multidimensional verification.
In this embodiment, after obtaining an initial layout scheme of a modular power circuit, it is necessary to perform a calibration from multiple dimensions such as an energy consumption reference calibration, a power supply margin calibration, and a wiring specification calibration, and only when the energy consumption reference calibration, the power supply margin calibration, and the wiring specification calibration are all passed, the initial layout scheme can be output as a target layout scheme, and the step of performing a multi-dimensional calibration on the initial layout scheme includes:
S203-1: and performing energy consumption reference verification on the initial layout scheme according to the difference relation between the theoretical power consumption of each sub-module circuit and the energy consumption reference.
In this embodiment, the energy consumption reference refers to the maximum energy consumption allowed by the power supply circuit, and in order to ensure the energy consumption failure efficiency of the power supply circuit, it is necessary to ensure that the theoretical power consumption of the power supply circuit is smaller than the maximum energy consumption specified by the energy consumption reference, that is, the initial layout scheme can be explained to pass the energy consumption reference verification only when the theoretical power consumption of the sub-module circuit is smaller than the energy consumption reference.
S203-2: and carrying out power supply electric margin verification on the initial layout scheme according to the relation between the theoretical power consumption of each sub-module circuit and the power supply margin.
In the present embodiment, when the power supply margin is insufficient, the power supply circuit operates in a limit state, and ripple of the power supply circuit increases drastically. Therefore, before determining the power input, the maximum power consumption, that is, the sum of the theoretical power consumption of the sub-module circuits, needs to be predetermined, and then the ratio relationship between the theoretical power consumption of the sub-module circuits and the power supply margin is calculated, and it should be noted that the power supply margin generally has at least 20 more power consumption than the peak power consumption of the load, that is, the ratio relationship between the theoretical power consumption of the sub-module circuits and the power supply margin should be less than or equal to 0.8. And if the ratio of the theoretical power consumption of the submodule circuit to the power supply margin is greater than 0.8, the initial layout scheme fails the electric margin check.
S203-3: and carrying out wiring specification verification on the initial layout scheme according to the interference degree of the layout line of each sub-module circuit on other sub-module circuits and the coupling capacitance capacity of the layout line of each sub-module circuit.
In this embodiment, in the process of laying out the lines of the sub-module circuit, in order to ensure that the lines of the sub-module circuit do not generate signal interference and heating effects on other sub-module circuits, it is necessary to perform wiring specification verification on the initial layout scheme, and for the power device, the width of the wiring should be wider to realize the outflow of large current; the power line is not suitable to be overlong, bifurcation is not required to be realized during wiring, the power line flows out of the source end as much as possible, and if the interference degree and the coupling capacitance capacity of the wiring line of any one sub-module circuit to other sub-module circuits are smaller than the threshold value, the wiring line of the sub-module circuit accords with the wiring specification, and the initial wiring scheme can be determined to pass the wiring specification verification only under the condition that the wiring lines of all the sub-module circuits accord with the wiring specification.
In a possible implementation manner, if there are multiple initial layout schemes that all pass through the multi-dimensional verification, an optimal initial layout scheme needs to be selected from the multiple initial layout schemes that pass through the multi-dimensional verification, so that the optimal initial layout scheme is determined as a target layout scheme, in the process, the better the wiring position of the sub-module circuit is, the shorter the corresponding layout line is, the smaller the corresponding direct current resistance is, but the shorter the layout line is, the worse the heat dissipation effect of the sub-module circuit is, and heat is accumulated among devices. Therefore, the heat dissipation position and the optimal wiring position of the sub-module circuit are two parameters which are mutually influenced, and the process of selecting the optimal initial layout scheme from a plurality of initial layout schemes which pass through multi-dimensional verification can be considered as a process of performing multi-objective optimization on the two parameters of the heat dissipation position and the optimal wiring position. The specific implementation steps of the method can be as follows:
S203-4: and encoding each initial layout scheme passing through the multi-dimensional verification to generate an initial population.
In this embodiment, for each initial layout scheme passing through the multi-dimensional verification, the layout coordinates and the layout order of each corresponding sub-module in the scheme are different, so that the multi-dimensional vector corresponding to the layout coordinates and the layout order of each sub-module can be expanded into a digital string of a one-dimensional vector, and the digital string is used as an individual in the genetic algorithm, so that the initial layout scheme is mapped into the individual, and after all the initial layout schemes passing through the multi-dimensional verification are subjected to coding processing, an initial population consisting of a plurality of individuals can be obtained.
S203-5: and respectively carrying out fitness evaluation on each individual in the initial population based on a target evaluation function, and determining elite individuals according to the result of the fitness evaluation.
In this embodiment, the objective evaluation function may include a first evaluation function and a second evaluation function, where the first evaluation function may take the least layout line of the sub-module circuit as the optimization direction, and the second evaluation function may take the best heat dissipation effect of the sub-module circuit as the optimization direction, for the first evaluation The scaling and weighting coefficients of the function and the second evaluation function may be specifically adjusted and set according to the emphasis point of the user, which is not limited in this application. For any individual, the numerical value E1 of the layout line of the individual can be calculated according to a first evaluation function, the numerical value E2 of the heat dissipation effect of the individual can be calculated according to a second evaluation function, and then the numerical values E1 and E2 and the corresponding weight coefficient E1 are calculated according to the numerical values E1 and E2 q And E2 q The fitness evaluation of each individual can be realized, then screening is carried out according to the evaluation result of the fitness of each individual, the individual with the fitness meeting the requirement is screened out and used as the individual to be selected, the next operation is carried out, and the individual with the fitness not meeting the requirement is directly eliminated. After obtaining the candidate individual, the candidate individual with pareto dominant relationship needs to be removed according to the calculation result of the fitness. As an example, if for individuals numbered 1, 2,3 and 4, based on fitness calculation results, it is found that 1 dominates 2,3 dominates 4, and there is no dominance relationship between 1 and 3, 2 and 4 individuals may be culled, and 1 and 3 individuals may be retained. After picking the candidate individuals with the pareto dominance, determining the candidate individual with the value E1 of the shortest layout line as a first elite individual, and determining the candidate individual with the value E2 with the largest heat dissipation effect as a second elite individual.
S203-6: and generating a new individual according to the elite individual through a cross mutation strategy so as to update the initial population.
In this embodiment, a cross mutation strategy is performed on the first elite individual and the second elite individual, and a newly added first individual and a newly added second individual are generated to realize the update of the initial population. It should be noted that, when the layout position of each sub-module circuit is optimized, the optimization may be performed according to the layout order of the sub-module circuits, so as to determine the optimal layout position corresponding to each sub-module circuit successively.
As an example, the specific implementation process may be understood that the layout position of the pair of sub-module circuits L in the initial layout scheme corresponding to the first elite individual is an area a, the layout position of the pair of sub-module circuits M in the initial layout scheme corresponding to the second elite individual is an area B, the layout position of the pair of sub-module circuits L in the initial layout scheme corresponding to the second elite individual is an area C, the layout position of the pair of sub-module circuits M is an area D, and the layout order of the sub-module circuits L precedes the sub-module circuits M. After the cross mutation strategy is executed, the layout position of the sub-module circuit L pair in the scheme corresponding to the first newly-added body is a C area, the layout position of the sub-module circuit M pair is a B area, the layout position of the sub-module circuit L pair in the scheme corresponding to the second newly-added body is an A area, and the layout position of the sub-module circuit M pair is a D area. In the conversion, the newly added individual obtained through the cross mutation strategy does not need to be subjected to multidimensional verification in the corresponding scheme, and the individual with the highest fitness among the individuals to be selected in the conversion is also required to be recorded.
S203-7: and iteratively executing the target evaluation function, respectively carrying out fitness evaluation on each individual in the initial population, determining elite individuals according to the result of the fitness evaluation, and generating new individuals according to the elite individuals through a cross mutation strategy so as to realize the step of updating the initial population.
In this embodiment, when the maximum iteration number or other iteration exit conditions are reached, the individual with the highest fitness among the candidates recorded in each generation is selected again, and is determined as the final output individual, and is decoded, so as to generate the target layout scheme, where the target layout scheme includes the best layout position corresponding to each sub-module circuit, that is, the layout position having the best heat dissipation performance and the shortest layout line distance at the same time.
In a possible implementation, if the initial layout scheme does not pass the verification of all dimensions, the initial layout scheme needs to be optimized, which specifically includes the following steps:
under the condition that the initial layout scheme does not pass the multidimensional verification, a verification result analysis report is generated according to the results of the energy consumption reference verification, the power supply electricity allowance verification and the wiring specification verification;
And adjusting the initial layout scheme according to the verification result analysis report to generate an optimized layout scheme, and iteratively executing the step of carrying out multidimensional verification on the optimized layout scheme.
In this embodiment, if the initial layout scheme fails the multi-dimensional verification, the verification result may be output as a verification result analysis report, where the verification result analysis report includes a specific dimension of which verification fails, and the corresponding root cause analysis result, and a designer may modify and adjust the design scheme according to the root cause analysis result, that is, optimize the initial layout scheme, thereby generating an optimized layout scheme, and then iteratively execute the step of performing the multi-dimensional verification on the optimized layout scheme until a target layout scheme satisfying the multi-dimensional verification is obtained.
S204: and installing each sub-module circuit according to the target layout scheme to generate the modularized power supply circuit.
In this embodiment, after the target layout scheme is obtained, each sub-module circuit may be assembled according to the target layout scheme, so as to obtain a modularized power circuit, which may specifically include the following steps:
and sequentially splicing the PCB corresponding to each sub-module circuit with the main PCB according to the layout coordinates and the layout sequence of each sub-module circuit in the target layout scheme.
In this embodiment, parameters corresponding to the target layout scheme are led into a preset manipulator, so that the PCB circuit board corresponding to each sub-module circuit can be plugged with the main PCB circuit board in sequence according to the layout coordinates and the layout sequence of each sub-module circuit in the target layout scheme. Because in traditional power supply circuit, be by the cable connection or welding between the PCB circuit board, consequently also be unfavorable for power supply circuit's quick according to when power supply circuit breaks down, be unfavorable for the change very much, and in this application, can be with the PCB circuit board that every sub-module circuit corresponds and main PCB circuit board through the connection of pegging graft mode, thereby save two zero lines and live wire. Therefore, the hidden operation risk of manual operation can be removed to the greatest extent, the labor cost is greatly reduced, the whole power supply circuit is split into a plurality of sub-module circuits for assembly, the production and manufacturing efficiency is greatly improved, and the failure rate of the modularized power supply circuit is also reduced.
Compared with the traditional power circuit manufacturing method, the modularized power circuit manufactured based on the method has better heat dissipation performance, lower direct current resistance, higher assembly convenience and disassembly and assembly. The specific reasons are as follows: the traditional power supply circuit adopts a large number of cable connection modes in the manufacturing process, so that the power supply circuit has higher direct current resistance, and has poorer assembly convenience and detachability. In the application, each sub-module circuit is used as a single optimization target, and the sub-module circuits are optimized in terms of two mutual influences of optimal heat dissipation performance and minimum layout line distance, so that the layout position of each sub-module circuit is guaranteed to have the optimal heat dissipation performance and the minimum layout line distance, and the whole modularized power supply circuit can have the advantages.
The modular power circuit is manufactured according to the manufacturing method of the modular power circuit, so that each device is located at an optimal heat dissipation position and an optimal wiring position. Because each device is in the optimal heat dissipation position, the modularized power circuit has better heat dissipation performance, and because each device is in the optimal wiring position, the minimum wiring distance between the devices can be realized, and the modularized power circuit has the minimum direct current resistance. For the above reasons, the power of the modularized power supply circuit can reach more than 700W stably, and the power of the power supply circuit of the same class cannot reach 700W even if the power supply circuit adopts the officially recommended line.
The embodiment of the invention also provides a modularized power supply circuit manufactured based on the manufacturing method of the modularized power supply circuit, and the modularized power supply circuit shown in fig. 3 mainly comprises: the power supply circuit comprises a boosting submodule circuit C, a synchronous rectification driving submodule circuit D, an output feedback submodule circuit E, a central control submodule circuit B, a filtering submodule circuit A, a standby circuit, a high-voltage filtering circuit, a rectification module circuit and the like, wherein the input end A of the filtering submodule circuit is connected with an alternating current power supply end, and the output end is connected with the input end of the boosting submodule circuit C; the output end of the boosting submodule circuit C is connected with the input end of the central control submodule circuit B; the output end of the central control sub-module B circuit is connected with the input end of the synchronous rectification driving sub-module circuit D; the output end of the synchronous rectification driving submodule circuit D is connected with the input end of the output feedback submodule circuit E.
In one possible implementation, the central control submodule circuit includes a master control chip, the chip model of which is mps hr1213IC, a First Pin (FPB) of the master control chip is connected to one end of a first resistor (R7), a second resistor (R9), a third resistor (R10) and a first capacitor (C2) in a common point, the other end of the first resistor (R7) is connected to a fourth resistor (R31) and a fifth resistor (R1) in series, then connected to a high voltage end (vh+), a second pin (ACIN) of the master control chip is connected to one end of a sixth resistor (R13), a seventh resistor (R14) and a second capacitor (C4) in a common point, the other end of the sixth resistor (R13) is connected to a seventh resistor (R12) and an eighth resistor (R4) in series, then connected to a first input voltage end (VIN), a third pin (CSP) of the master control chip is connected to a ninth resistor (R23) in series, then connected to a chip select signal end (CS), a third pin (ain) of the master control chip is connected to the third pin (CSP) and the other end of the master control chip is connected to the fifth resistor (C8) in a common point (C) of the fourth resistor (C6) and the fifth resistor (C4) in series, a sixth pin (VREG) of the master control chip is connected with the other end of the fourth capacitor (C9) and the positive electrode of the first diode (D1) in a common point manner, a seventh pin (LSG) of the master control chip is connected with the synchronous digital terminal (LD), an eighth pin (VCC) of the master control chip is connected with the other end of the fifth capacitor (C10) and one end of the sixth capacitor (C13) in a common point manner, a ninth pin (NC) of the master control chip is not connected, a tenth pin (HV) of the master control chip is connected with the other end of the sixth capacitor (C13) in a common point manner, an eleventh pin (BST) of the master control chip is connected with the negative electrode of the first diode (D1) and one end of the seventh capacitor (C12) in a common point manner, a twelfth pin (HSG) of the master control chip is connected with the second input voltage terminal (HD), a thirteenth pin (SW) of the master control chip is connected with the other end of the seventh capacitor (C12) in a common point manner, a fourteenth pin of the master control chip is not connected with the first capacitor (C13) in a common point manner, a fifteenth pin (GNDD) of the master control chip is connected with the first end of the eighth capacitor (C17) of the eighth capacitor (C12) in a common point manner, a sixteenth pin of the master control chip is connected with the positive electrode (C2) of the first resistor (C2) of the eighth capacitor (C2) in a common point manner, the eighth pin (12) of the eighth pin of the master control chip is connected with the positive electrode (C2) of the eighth capacitor (C2) in a common point of the eighth capacitor (C12) in a common point manner, a seventeenth pin (UART) of the main control chip is connected with one end of an eleventh capacitor (C5), an eighteenth pin (FBL) of the main control chip is connected with a feedback pin end, a nineteenth pin (CR) of the main control chip is connected with one end of a thirteenth resistor (R30), the other end of the thirteenth resistor (R30) is connected with the other end of an eleventh resistor (R2) and the other end of a tenth capacitor (C22) in a common point manner, and a twentieth pin (SO) of the main control chip is connected with the other end of the eleventh capacitor (C5) and a fifteenth pin (GNDD) in a common point manner.
The embodiment of the invention also provides a manufacturing control device of the modularized power supply circuit, and referring to fig. 4, a functional module diagram of the manufacturing control device of the modularized power supply circuit is shown, and the device can comprise the following modules:
an obtaining module 401, configured to obtain an application environment requirement of the modular power supply circuit and a theoretical power consumption of each sub-module circuit in the modular power supply circuit;
an initial scheme generating module 402, configured to generate an initial layout scheme of the modular power circuit according to an application environment requirement of the modular power circuit and a theoretical power consumption of each sub-module circuit;
the verification module 403 is configured to perform multi-dimensional verification on the initial layout scheme, and determine the initial layout scheme as a target layout scheme when the multi-dimensional verification passes;
and the layout module 404 is configured to install each sub-module circuit according to the target layout scheme, so as to generate the modularized power supply circuit.
In one possible implementation, the initial solution generation module 402 includes:
the parameter determining submodule is used for determining the layout coordinate and the layout order of each submodule circuit according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each submodule circuit;
And the scheme generating sub-module is used for generating an initial layout scheme of the modularized power supply circuit according to the layout coordinates and the layout sequence of each sub-module circuit and connecting each sub-module circuit according to a preset connection relation.
In a possible embodiment, the parameter determination submodule includes:
the load stability grade determining unit is used for determining the load stability grade of the modularized power supply circuit according to the application environment requirement of the modularized power supply circuit;
the heat dissipation space area determining unit is used for determining the heat dissipation space area of each sub-module circuit according to the theoretical power consumption of each sub-module circuit;
and the calculating unit is used for determining the layout coordinates and the layout sequence of each sub-module circuit according to the load stability level of the modularized power supply circuit and the heat dissipation space area of each sub-module circuit.
In one possible embodiment, the computing unit comprises:
the load stability supporting coefficient determining subunit is used for determining a load stability supporting coefficient corresponding to each submodule circuit according to the load stability grade of the modularized power supply circuit;
the heat dissipation demand coefficient determination subunit is used for determining the heat dissipation demand coefficient corresponding to each sub-module circuit according to the heat dissipation space area of each sub-module circuit;
The weight coefficient determining subunit is used for calculating the weight coefficient of each submodule circuit according to the product of the load stable supporting coefficient and the heat dissipation demand coefficient;
the sequencing subunit is used for sequencing each sub-module circuit in order according to the height of the weight coefficient so as to determine the layout sequence of each sub-module circuit;
and the coordinate determining subunit is used for determining the layout coordinate of each sub-module circuit according to the heat dissipation space area of each sub-module circuit.
In one possible implementation, the verification module 403 includes:
the first verification submodule is used for carrying out energy consumption reference verification on the initial layout scheme according to the difference relation between the theoretical power consumption of each submodule circuit and the energy consumption reference;
the second checking submodule is used for checking the power supply electric margin of the initial layout scheme according to the ratio relation between the theoretical power consumption of each submodule circuit and the power supply margin;
and the third verification sub-module is used for verifying the wiring specification of the initial layout scheme according to the interference degree of the layout circuit of each sub-module circuit on other sub-module circuits and the coupling capacitance capacity of the layout circuit of each sub-module circuit.
In a possible embodiment, the verification module further includes:
the analysis report generation module is used for generating a verification result analysis report according to the results of the energy consumption reference verification, the power supply electricity allowance verification and the wiring specification verification under the condition that the initial layout scheme does not pass the multidimensional verification;
and the iteration sub-module is used for adjusting the initial layout scheme according to the verification result analysis report, generating an optimized layout scheme, and iteratively executing the step of carrying out multi-dimensional verification on the optimized layout scheme.
In one possible implementation, the layout module 404 includes:
and the assembly sub-module is used for sequentially splicing the PCB circuit board corresponding to each sub-module circuit with the main PCB circuit board according to the layout coordinates and the layout sequence of each sub-module circuit in the target layout scheme.
It should be noted that, the specific implementation of the manufacturing control apparatus 400 for a modular power circuit according to the embodiment of the present application refers to the specific implementation of the manufacturing control method for a modular power circuit set forth in the first aspect of the embodiment of the present application, and is not described herein again.
Based on the same inventive concept, another embodiment of the present invention provides an electronic device comprising a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface, the memory complete communication with each other through the communication bus,
A memory for storing a computer program;
and the processor is used for realizing the manufacturing control method of the modularized power supply circuit when executing the program stored in the memory.
The communication bus mentioned by the above terminal may be a peripheral component interconnect standard (Peripheral Component Interconnect, abbreviated as PCI) bus or an extended industry standard architecture (Extended Industry Standard Architecture, abbreviated as EISA) bus, etc. The communication bus may be classified as an address bus, a data bus, a control bus, or the like. For ease of illustration, the figures are shown with only one bold line, but not with only one bus or one type of bus. The communication interface is used for communication between the terminal and other devices. The memory may include random access memory (Random Access Memory, RAM) or non-volatile memory (non-volatile memory), such as at least one disk memory. Optionally, the memory may also be at least one storage system located remotely from the aforementioned processor.
The processor may be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU for short), a network processor (Network Processor, NP for short), etc.; but also digital signal processors (Digital Signal Processing, DSP for short), application specific integrated circuits (Application Specific Integrated Circuit, ASIC for short), field-programmable gate arrays (Field-Programmable Gate Array, FPGA for short) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.
In addition, in order to achieve the above object, an embodiment of the present application further proposes a computer-readable storage medium storing a computer program, which when executed by a processor, implements a manufacturing control method of the modular power supply circuit of the embodiment of the present application.
It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, embodiments of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, embodiments of the invention may take the form of a computer program product on one or more computer-usable vehicles having computer-usable program code embodied therein, including but not limited to disk storage, CD-ROM, optical storage, and the like.
Embodiments of the present invention are described with reference to flowchart illustrations and/or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, create a system for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. "and/or" means either or both of which may be selected. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or terminal device comprising the element.
The foregoing has described in detail the method for controlling the manufacture of a modular power supply circuit, the modular power supply circuit and the apparatus thereof, and specific examples have been applied herein to illustrate the principles and embodiments of the present application, and the description of the foregoing examples is only for helping to understand the core ideas of the method for controlling the manufacture of a modular power supply circuit, the modular power supply circuit and the apparatus thereof; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the contents of the present specification should not be construed as limiting the present application in summary.

Claims (10)

1. A method of manufacturing control of a modular power circuit, the method comprising:
acquiring the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit in the modularized power supply circuit;
generating an initial layout scheme of the modularized power supply circuit according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit;
performing multi-dimensional verification on the initial layout scheme, and determining the initial layout scheme as a target layout scheme under the condition that the initial layout scheme passes through the multi-dimensional verification;
And installing each sub-module circuit according to the target layout scheme to generate the modularized power supply circuit.
2. The method of claim 1, wherein the step of generating an initial layout scheme of the modular power circuit according to an application environment requirement of the modular power circuit and a theoretical power consumption of each of the sub-module circuits comprises:
determining the layout coordinates and the layout order of each sub-module circuit according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit;
and connecting each sub-module circuit according to the layout coordinates and the layout sequence of each sub-module circuit and a preset connection relation to generate an initial layout scheme of the modularized power supply circuit.
3. The method of manufacturing control of a modular power supply circuit according to claim 2, wherein the step of determining the layout coordinates and the layout order of each of the sub-module circuits according to the application environment requirement of the modular power supply circuit and the theoretical power consumption of each of the sub-module circuits comprises:
determining the load stability level of the modularized power supply circuit according to the application environment requirements of the modularized power supply circuit;
Determining the heat dissipation space area of each sub-module circuit according to the theoretical power consumption of each sub-module circuit;
and determining the layout coordinates and the layout sequence of each sub-module circuit according to the load stability level of the modularized power supply circuit and the heat dissipation space area of each sub-module circuit.
4. A method of manufacturing and controlling a modular power supply circuit as set forth in claim 3, wherein the step of determining the layout coordinates and the layout order of each of the sub-module circuits based on the load stabilization level of the modular power supply circuit and the heat dissipation space area of each of the sub-module circuits includes:
determining a load stability supporting coefficient corresponding to each sub-module circuit according to the load stability grade of the modularized power supply circuit;
according to the heat dissipation space area of each sub-module circuit, determining a heat dissipation demand coefficient corresponding to each sub-module circuit;
calculating a weight coefficient of each sub-module circuit according to the product of the load stable support coefficient and the heat dissipation demand coefficient;
performing rank ordering on each sub-module circuit according to the height of the weight coefficient so as to determine the layout order of each sub-module circuit;
And determining the layout coordinates of each sub-module circuit according to the heat dissipation space area of each sub-module circuit.
5. The method of claim 1, wherein the multi-dimensional verification includes a power consumption reference verification, a power supply margin verification, and a wiring specification verification; the step of performing multi-dimensional verification on the initial layout scheme comprises the following steps:
according to the difference relation between the theoretical power consumption of each sub-module circuit and the energy consumption reference, performing energy consumption reference verification on the initial layout scheme;
carrying out power supply electricity allowance verification on the initial layout scheme according to the ratio relation between the theoretical power consumption of each sub-module circuit and the power supply allowance;
and carrying out wiring specification verification on the initial layout scheme according to the interference degree of the layout circuit of each sub-module circuit on other sub-module circuits and the coupling capacitance capacity of the layout circuit of each sub-module circuit.
6. The method of manufacturing control of a modular power circuit of claim 5, further comprising:
generating a verification result analysis report according to the results of the energy consumption reference verification, the power supply electricity allowance verification and the wiring specification verification under the condition that the initial layout scheme does not pass the multidimensional verification;
And adjusting the initial layout scheme according to the verification result analysis report to generate an optimized layout scheme, and iteratively executing the step of performing multidimensional verification on the optimized layout scheme.
7. The method of manufacturing control of a modular power supply circuit according to claim 1, wherein the initial layout scheme passing the multi-dimensional verification is at least one, and after the step of in the case where the initial layout scheme passes the multi-dimensional verification, the method further comprises:
encoding each initial layout scheme passing through multi-dimensional verification to generate an initial population;
based on a target evaluation function, respectively carrying out fitness evaluation on each individual in the initial population, and determining elite individuals according to the result of the fitness evaluation;
generating a newly added individual according to the elite individual through a cross mutation strategy so as to update the initial population;
and iteratively executing the target evaluation function, respectively carrying out fitness evaluation on each individual in the initial population, determining elite individuals according to the result of the fitness evaluation, and generating new individuals according to the elite individuals through a cross mutation strategy so as to realize the step of updating the initial population.
8. The method of manufacturing and controlling a modular power supply circuit according to claim 1, wherein the step of installing each of the sub-module circuits according to the target layout scheme, generating the modular power supply circuit comprises:
and sequentially splicing the PCB circuit board corresponding to each sub-module circuit with the main PCB circuit board according to the layout coordinates and the layout sequence of each sub-module circuit in the target layout scheme.
9. A modular power supply circuit manufactured according to the manufacturing control method of a modular power supply circuit according to any one of claims 1 to 8, comprising: the device comprises a boosting submodule circuit, a synchronous rectification driving submodule circuit, an output feedback submodule circuit, a central control submodule circuit and a filtering submodule circuit;
the input end of the filtering submodule circuit is connected with the alternating current power supply end, and the output end of the filtering submodule circuit is connected with the input end of the boosting submodule circuit;
the output end of the boosting submodule circuit is connected with the input end of the central control submodule circuit;
the output end of the central control sub-module circuit is connected with the input end of the synchronous rectification driving sub-module circuit;
The output end of the synchronous rectification driving submodule circuit is connected with the input end of the output feedback submodule circuit;
the central control sub-module circuit comprises a main control chip, and the main control sub-module circuit comprises a main control chipThe first pin of the control chip is connected with one end of a first resistor, a second resistor, a third resistor and a first capacitor in a common point manner, the other end of the first resistor is connected with one end of a fourth resistor and one end of a fifth resistor in series and then is connected with a high-voltage end, the second pin of the main control chip is connected with one end of a sixth resistor, one end of a seventh resistor and one end of a second capacitor in a common point manner, the other end of the sixth resistor is connected with a seventh resistor and one end of an eighth resistor in series and then is connected with a first input voltage end, the third pin of the main control chip is connected with a chip selection signal end in series and then is connected with one end of the third capacitor in a common point manner, the fourth pin of the main control chip is connected with one end of the fourth capacitor and the other end of the fifth capacitor in a common point manner and is connected with a grounding point, the sixth pin of the main control chip is connected with the other end of the fourth capacitor and the positive electrode of the first diode in a common point manner, and the seventh pin of the main control chip is connected with the other end of the fifth capacitor in a synchronous point manner and the other end of the seventh pin of the main control chip is connected with the synchronous point of the first capacitor in a synchronous point manner ， The eighth pin of the main control chip is connected with the other end of the fifth capacitor and one end of the sixth capacitor in a common point manner, the tenth pin of the main control chip is connected with the other end of the sixth capacitor in a common point manner, the eleventh pin of the main control chip is connected with the negative electrode of the first diode and one end of the seventh capacitor in a common point manner, the twelfth pin of the main control chip is connected with the second input voltage end, the thirteenth pin of the main control chip is connected with the other end of the seventh capacitor in a common point manner, the fifteenth pin of the main control chip is connected with one end of the eighth capacitor, one end of the ninth capacitor, one end of the eleventh resistor and one end of the positive electrode of the second diode in a common point manner, the sixteenth pin of the main control chip is connected with one end of the eleventh capacitor in a common point manner, the eighteenth pin of the main control chip is connected with the feedback pin, the thirteenth pin of the main control chip is connected with the thirteenth resistor in a common point manner, and the thirteenth pin of the main control chip is connected with the thirteenth resistor in a common point manner, and the thirteenth resistor in a common point manner is connected with the thirteenth resistor in a tenth resistor in a common point manner The other end of the capacitor is connected in a common point manner, and the twentieth pin of the main control chip is connected with the other end of the eleventh capacitor and the fifteenth pin in a common point manner.
10. A manufacturing control device for a modular power circuit, the device comprising:
the acquisition module is used for acquiring the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit in the modularized power supply circuit;
the initial scheme generation module is used for generating an initial layout scheme of the modularized power supply circuit according to the application environment requirement of the modularized power supply circuit and the theoretical power consumption of each sub-module circuit;
the verification module is used for carrying out multi-dimensional verification on the initial layout scheme and determining the initial layout scheme as a target layout scheme under the condition that the multi-dimensional verification is passed;
and the layout module is used for installing each sub-module circuit according to the target layout scheme to generate the modularized power supply circuit.
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CN113127973A (en) * 2021-04-16 2021-07-16 湖南大学 CAE simulation technology-based multi-material intelligent material selection method and system and electronic equipment
CN113962186A (en) * 2021-10-28 2022-01-21 中国长城科技集团股份有限公司 Chip layout method and device, terminal equipment and computer readable storage medium
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CN110493922A (en) * 2019-08-28 2019-11-22 厦门亚锝电子科技有限公司 A kind of LED drive circuit of the low ripple without stroboscopic
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