CN116177895A

CN116177895A - Method for thinning laminated plate glass, thinned laminated plate glass and display device

Info

Publication number: CN116177895A
Application number: CN202310005916.5A
Authority: CN
Inventors: 张迅; 易伟华; 谢凯立; 杨会良; 徐艳勇
Original assignee: WG Tech Jiangxi Co Ltd
Current assignee: WG Tech Jiangxi Co Ltd
Priority date: 2023-01-04
Filing date: 2023-01-04
Publication date: 2023-05-30

Abstract

The invention relates to a method for thinning laminated glass, thinned laminated glass and a display device. The method for thinning the laminated glass comprises the following steps: obtaining a laminated glass, wherein the laminated glass comprises a first substrate and a second substrate which are arranged in a laminated manner; a first protective film is arranged on the surface of one side of the first substrate away from the second substrate; a circle of second protective film is arranged along the edge of one side surface of the second substrate away from the first substrate; etching and thinning the second substrate to a first preset thickness; removing the first protective film, and arranging a third protective film on the surface of one side of the second substrate far away from the first substrate; etching and thinning the first substrate to a second preset thickness; removing the third protective film; and removing the area covered by the second protective film. The thinning method can thin the laminated glass to 0.06mm or below, and has low breaking rate.

Description

Method for thinning laminated plate glass, thinned laminated plate glass and display device

Technical Field

The invention relates to the field of glass thinning, in particular to a method for thinning laminated glass, thinned laminated glass and a display device.

Background

Along with the development of flexible display in the display industry, the requirement of flexible bending performance is gradually put forward for the LCD liquid crystal screen, and the glass substrate with conventional thickness (such as 1.0 mm) does not have bending performance, but has better flexible performance when the glass substrate is thinned to a certain thickness (such as 0.1 mm).

In the conventional method for manufacturing a flexible glass substrate, a thick glass substrate is generally subjected to HF etching to thin the glass substrate, and the thickness can be reduced to 30 μm or less at the minimum. However, in the case of laminated glass, since two glass substrates are bonded together by a frame glue, if the thickness of the laminated glass is required to be thinned to 60 μm or less (30 μm or less on a single plate), the difficulty is higher and the risk of breaking the laminated glass is higher, and there is no scheme in the industry to thin the laminated glass to 60 μm or less.

Disclosure of Invention

Based on this, it is necessary to provide a method capable of thinning the laminated glass to 60 μm or less, and which can significantly reduce the chipping rate.

In addition, it is necessary to provide a thinned laminated glass and a display device treated by the above method.

A method for thinning glass of a plywood comprises the following steps:

obtaining a laminated glass, wherein the laminated glass comprises a first substrate and a second substrate which are arranged in a laminated manner;

A first protective film is arranged on the surface of one side of the first substrate far away from the second substrate, and the first protective film completely shields the first substrate;

a circle of second protective film is arranged along the edge of one side surface of the second substrate far away from the first substrate;

etching and thinning the second substrate to a first preset thickness;

removing the first protective film, arranging a third protective film on the surface of one side of the second substrate far away from the first substrate, and enabling the third protective film to completely shield the second substrate;

etching and thinning the first substrate to a second preset thickness;

removing the third protective film; a kind of electronic device with high-pressure air-conditioning system

And cutting the etched edge of the laminated glass, and removing the area covered by the second protective film.

In one embodiment, the width of the second protective film is 5mm to 10mm.

In one embodiment, the step of disposing a third protective film on a side surface of the second substrate remote from the first substrate includes: firstly, a release layer is arranged in a region of the second substrate, which is not provided with the second protective film, and then the third protective film is arranged on the surface of the second substrate.

In one embodiment, the step of disposing a third protective film on a side surface of the second substrate remote from the first substrate includes: firstly, a filling layer is arranged in a region of the second substrate, which is not provided with the second protective film, then a release layer is laminated, and then the third protective film is arranged on the surface of the second substrate, wherein the thickness of the filling layer is the same as the thickness of the second substrate in a thinning way.

In one embodiment, the thicknesses of the first protective film, the second protective film, and the third protective film are each independently 80 μm to 120 μm.

In one embodiment, the first protective film, the second protective film, and the third protective film are each independently selected from any one of an acid-fast heating-reducing film and a UV-reducing film.

In one embodiment, before the step of disposing the first protective film on a side surface of the first substrate away from the second substrate, the method further includes: and (3) spot-coating UV glue for one circle along the gap between the first substrate and the second substrate, and then carrying out UV irradiation to solidify the UV glue.

In one embodiment, the width of the UV glue dispensing area is 2 mm-3 mm.

In one embodiment, the thickness of the first substrate and the second substrate is 0.2mm to 0.55mm independently, and the first preset thickness and the second preset thickness are less than or equal to 0.03mm independently.

In one embodiment, the size of the laminated glass is ≡500mm×600mm.

A method for thinning glass of a plywood comprises the following steps:

etching and thinning the second substrate to a first preset thickness;

setting a second protective film on the surface of the thinned second substrate, and enabling the second protective film to completely shield the second substrate;

removing the first protective film on the surface of the first substrate, and arranging a circle of third protective film along the edge of one side surface of the first substrate, which is far away from the second substrate;

etching and thinning the first substrate to a second preset thickness;

removing the second protective film; a kind of electronic device with high-pressure air-conditioning system

And cutting the edge of the etched laminated plate glass, and removing the area covered by the third protective film.

A method for thinning glass of a plywood comprises the following steps:

a peripheral protective film is arranged along at least one edge of the side surface of the second substrate away from the first substrate;

etching and thinning the first substrate and the second substrate to a preset thickness; a kind of electronic device with high-pressure air-conditioning system

And cutting the edge of the etched laminated plate glass, and removing the area covered by the protective film.

The thinned laminated glass is obtained after being processed by the thinning method of the laminated glass.

A display device comprises the thinned laminated glass.

According to the method for thinning the laminated plate glass, the mode of single-sided sequential etching is adopted, in the first etching process, the second protective film is arranged on the edge of the second substrate, so that the edge of the second substrate is not etched, the thickness is thicker, on one hand, taking and placing are convenient, the breaking risk in the taking and placing process is reduced, on the other hand, the film tearing is facilitated due to the thicker edge of the second substrate, and when the laminated plate glass is thinned to the preset thickness, the laminated plate glass cannot warp and curl due to the surface tension of the protective film, good flatness is still guaranteed, and the breaking risk of the film tearing is low. Experiments prove that the method for thinning the laminated glass can realize the thinning of the laminated glass to the thickness of 60 mu m or less, and the breaking rate is as low as 5 percent or less, thereby being beneficial to flexible display of an LCD.

Drawings

FIG. 1 is a process flow diagram of a method for thinning a laminated glass according to a first embodiment of the present invention;

FIG. 2 is a schematic diagram of step S130 in the process flow chart shown in FIG. 1;

FIG. 3 is a process flow diagram of a method for thinning a laminated glass according to a second embodiment of the present invention;

fig. 4 is a process flow diagram of a method for thinning a laminated glass according to a third embodiment of the present invention.

Detailed Description

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to specific embodiments that are now described. Preferred embodiments of the invention are given in the detailed description. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Unless otherwise indicated or contradicted, terms or phrases used in the present invention have the following meanings:

In the present invention, "first," "second," "third," etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature.

In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

When a range of values is disclosed in the present invention, the range is considered to be continuous and includes the minimum and maximum values of the range, as well as each value between such minimum and maximum values. Further, when a range refers to an integer, each integer between the minimum and maximum values of the range is included. Further, when multiple range description features or characteristics are provided, the ranges may be combined. In other words, unless otherwise indicated, all ranges disclosed herein are to be understood to encompass any and all subranges subsumed therein.

In the invention, the technical characteristics described in an open mode comprise a closed technical scheme composed of the listed characteristics and also comprise an open technical scheme comprising the listed characteristics.

The terms "comprising" and "having" and any variations thereof in embodiments of the present invention are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may alternatively include other steps or elements not listed or inherent to such process, method, article, or apparatus.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the described embodiments of the invention may be combined with other embodiments.

Referring to fig. 1, a method for thinning a laminated glass according to a first embodiment includes the following steps:

step S110: a laminated glass is obtained, the laminated glass comprising a first substrate and a second substrate arranged in a stack.

The laminated glass is formed by bonding two glass substrates together through a frame glue. In some embodiments, the laminated glass may be, but is not limited to, an LCD glass substrate. A liquid crystal material, a metal wiring, and the like are further provided between the first substrate and the second substrate.

In some embodiments, the thickness of the ply glass may be, but is not limited to, 0.4mm to 1.1mm. For example, the thickness of the laminated glass is 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm or a range consisting of any two of these values.

Further, the thickness of the first substrate and the second substrate is each independently 0.2mm to 0.55mm.

In some embodiments, the size of the laminated glass is ≡500mm×600mm. The size of the plywood glass is larger, the breaking risk is higher in the etching process, and the breaking rate can be obviously reduced by adopting the thinning method of the embodiment.

Step S120: a first protective film is arranged on one side surface of the first substrate far away from the second substrate, and the first protective film completely shields the first substrate.

In some embodiments, the first protective film is selected from any one of acid-fast heating and UV-reducing films. It is understood that the first protective film is not limited to the above materials, but may be other acid-resistant films commonly used in the art.

In some embodiments, the first protective film has a thickness of 80 μm to 120 μm. In a specific example, the thickness of the first protective film may be, but is not limited to, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, or a range composed of any two of these values. At the above thickness, the first protective film can better protect the first substrate from etching.

By arranging the first protective film on the surface of one side of the first substrate far away from the second substrate and completely shielding the first substrate, when the second substrate is etched, the first substrate is not etched and only one side is etched.

In some embodiments, before the step of disposing the first protective film on a side surface of the first substrate remote from the second substrate, the method further includes: and (3) spot-coating the UV glue along the gap between the first substrate and the second substrate for one circle, and then carrying out UV irradiation to solidify the UV glue. In one embodiment, the UV glue is dispensed through the dispensing needle and penetrates into the gap between the first substrate and the second substrate. Through the steps, the gap between the first substrate and the second substrate has acid resistance, and etching acid liquor is prevented from penetrating into the surface through the gap between the two substrates when the laminated glass is etched, so that metal circuits and liquid crystal materials of the laminated glass are corroded.

In some of these embodiments, the width of the UV glue dispensing area is 2mm to 3mm. When the UV glue is applied, the UV glue should not contact the liquid crystal material, the metal circuit and the like so as not to pollute the liquid crystal material and the metal circuit, so that the width of the UV glue applying area is not too large, and acid liquor can be effectively prevented from entering a gap under the width and the liquid crystal material and the metal circuit can not be polluted.

It will be appreciated that in some embodiments, UV glue is pre-provided between the first and second substrates of the laminated glass, and this step may be omitted.

Step S130: a periphery of the second protective film is arranged along the edge of one side surface of the second substrate away from the first substrate.

The edge of one side surface of the second substrate far away from the first substrate is provided with a circle of second protective film, the edge of the second substrate can be protected from being etched in the etching process, and the middle part of the second substrate is etched, so that a frame with a certain thickness is formed at the edge of the second substrate, subsequent sheet taking and placing and film tearing are facilitated, and the breaking rate is reduced.

In some embodiments, the width of the second protective film is 5mm to 10mm. In a specific example, the thickness of the second protective film may be, but is not limited to, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm, or a range consisting of any two of these values. At the above thickness, the second protective film can better protect the edge from etching and from collapsing.

In some embodiments, the second protective film is selected from any one of acid-fast heating and UV-reducing films. It is understood that the second protective film is not limited to the above materials, but may be other acid-resistant films commonly used in the art, and further, the second protective film may be the same as or different from the first protective film.

In some embodiments, the second protective film has a thickness of 80 μm to 120 μm. In a specific example, the thickness of the second protective film may be, but is not limited to, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, or a range consisting of any two of these values. At the above thickness, the second protective film can better protect the edge of the second glass substrate from etching. It is understood that the thickness of the second protective film may be the same as or different from the thickness of the first protective film.

Referring to fig. 2, a second protective film 201 is disposed around the edge of the second substrate, and the width W of the second protective film 201 is 5mm to 10mm.

Step S140: and etching and thinning the second substrate to a first preset thickness.

In some embodiments, the first predetermined thickness is less than or equal to 0.03mm.

In some embodiments, the etching solution is not particularly limited, and may be a glass thinning etching solution commonly used in the art. For example, in one embodiment, the etching solution is a 4mol/L to 6mol/L HF solution.

In some embodiments, the etching method is not particularly limited and may be a common etching method in the art. For example, in one embodiment, the etching is selected from any one of a soak etch, a top spray etch, and a plate etch. Further, the etching mode is plate etching. The soaking etching has the defects of poor tooth mark, uneven etching thickness, extremely poor thickness and the like, and the top spraying etching has the defect of poor tooth mark and the like although the etching thickness uniformity of the top spraying etching is improved compared with that of the soaking etching. The flat etching does not need to be inserted into a basket, and the flat etching can not contact with a rack, so that the risks of extremely poor etching thickness and tooth position printing can be avoided.

In the etching process, after the middle part of the second substrate is etched, the edge is not etched due to the protection of the second protective film, so that a certain height difference is formed between the edge of the second substrate and the middle area, the edge is thicker, and fragments are not easy to break in the picking and placing process.

Taking the total thickness of the laminated glass as 1.1mm, the thicknesses of the first substrate and the second substrate are 0.55mm, the preset thickness is 0.03mm as an example, firstly, the middle area of the second substrate is thinned to the preset thickness, namely, from 0.55mm to 0.03mm, namely, the laminated glass is thinned from 1.1mm to 0.58mm (0.03mm+0.55 mm), and the total thickness of the laminated glass after one etching reaches 0.58mm (still thicker), so that the wafer can be normally taken and placed, a backboard is not needed, the process difficulty is lower, and the wafer breakage is avoided.

Step S150: and removing the first protective film, arranging a third protective film on the surface of one side of the second substrate far away from the first substrate, and enabling the third protective film to completely shield the second substrate.

In some embodiments, the first protective film is acid resistant and heat resistant and has been removed by heating the laminated glass and then tearing the first protective film. After acid-resistant heating and mucosa-reducing heating, the viscosity can be greatly reduced, so that the film can be torn more conveniently.

In other embodiments, the first protective film is a UV-reduced film, and the laminated glass is UV-irradiated and then the first protective film is peeled off. After UV irradiation, the viscosity of the UV-reducing film can be greatly reduced, so that the film can be more conveniently torn off.

Since the first substrate is not etched, the thickness is still thicker, the first protective film is easier to remove, and the risk of chipping is lower.

In some embodiments, the step of disposing a third protective film on a side surface of the second substrate remote from the first substrate includes: firstly, a release layer is arranged in a region of the second substrate, which is not provided with the second protective film, and then a third protective film is arranged.

Because there is certain difference in height (thickness reduction) at the edge and the mid portion of second glass substrate, the thickness of the second substrate of corresponding mid region is thinner, and third protection film directly contacts rather than, exists the rupture risk when tearing the membrane, through setting up the release layer in this region, prevents the glue film of membrane material and directly contacts with thin glass substrate, reduces its rupture risk of tearing the membrane. The edge thickness of the second substrate is thicker, a release layer is not required to be arranged, and the breaking rate is greatly reduced when the film is torn.

In some of these embodiments, the release layer may be, but is not limited to, release paper or a centrifuge membrane.

Further, in some embodiments, the step of disposing a third protective film on a side surface of the second substrate remote from the first substrate includes: firstly, a filling layer is arranged in a region of the second substrate, on which the second protective film is not arranged, then a release layer is laminated, and then a third protective film is arranged. Because a certain height difference exists between the edge and the middle of the second substrate, the second substrate is filled by arranging the filling layer, and is prevented from being suspended. In one specific example, the material of the filler layer is foam. Further, the thickness of the filling layer is the same as the thickness of the second substrate thinned.

In some embodiments, the third protective film is selected from any one of acid-fast heating and UV-reducing films. It is to be understood that the third protective film is not limited to the above materials, and may be other acid-resistant films commonly used in the art, and the third protective film may be the same as or different from the first protective film and the second protective film.

In some embodiments, the thickness of the third protective film is 80 μm to 120 μm. In a specific example, the thickness of the third protective film may be, but is not limited to, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, or a range composed of any two of these values. It is understood that the thickness of the third protective film may be the same as or different from the thickness of the first protective film and the second protective film.

Step S160: and etching and thinning the first substrate to a second preset thickness.

In some embodiments, the second predetermined thickness is less than or equal to 0.03mm.

The manner of etching and thinning the first substrate is the same as that of etching and thinning the second substrate, and will not be described again.

The total thickness of the laminated glass is thinned to be less than or equal to 0.06mm through the steps.

In general, when an ultrathin glass substrate manufactured by a single-sided thinning method is thinned to a certain thickness, for example, 0.1mm or less, the glass substrate is warped or even rolled up along with the warpage of the protective film. This presents a significant challenge for film tearing, with high chipping rates, especially for large sized glass substrates (e.g., 500 x 600mm or more). In the present embodiment, the edge of the second substrate is not etched, so that the thickness is thick, and when the laminated glass is thinned to a thin thickness, warpage does not occur, and the film is easily torn, thereby reducing the breaking rate.

Step S170: the third protective film is removed.

In some embodiments, the third protective film is acid resistant and heat resistant and has been removed by heating the laminated glass and then tearing the third protective film. After acid-resistant heating and mucosa-reducing heating, the viscosity can be greatly reduced, so that the film can be torn more conveniently.

In other embodiments, the third protective film is a UV-reduced film, and the laminated glass is UV-irradiated and then the third protective film is peeled off. After UV irradiation, the viscosity of the UV-reducing film can be greatly reduced, so that the film can be more conveniently torn off.

Step S180: and cutting the etched laminated glass to remove the area covered by the second protective film.

In some embodiments, the cutting is performed by laser cutting. It will be appreciated that during the dicing process, the UV spot gluing areas are also removed.

The conventional glass etching method is only to thin a single glass substrate by a single-sided etching method, but for a laminated glass formed by combining two glass substrates, a thinner thickness cannot be achieved at all by a single-sided etching method. And etching is carried out simultaneously on two sides, because when etching to certain thickness, glass is thinner, needs one side to support through the backplate to also can not reach thinner thickness.

In this embodiment, since the edge of the second substrate is not etched, the thickness is thicker, on one hand, the taking and placing are convenient, the breaking risk in the taking and placing process is reduced, on the other hand, due to the existence of the frame, when the frame is thinned to the preset thickness, the laminated plate glass cannot warp and curl due to the surface tension of the protective film, the better ground level is still ensured, and the tearing risk of the film is low.

In addition, set up the protection film at the edge of second base plate, form the frame in the etching process of first time, in the etching process of second time, the protection film glues with thick frame mutually, and the rupture risk is low in the dyestripping process.

The method for thinning the laminated glass has at least the following advantages:

according to the method for thinning the laminated plate glass, the mode of single-sided sequential etching is adopted, and the protective film is arranged on the edge of the second substrate in the first etching process, so that the edge of the second substrate is not etched, the thickness is thicker, on one hand, taking and placing are convenient, the breaking risk in the taking and placing process is reduced, on the other hand, due to the fact that the edge of the second substrate is thicker, when the thickness is thinned to the preset thickness, the laminated plate glass cannot warp and curl due to the surface tension of the protective film, the good ground level is still guaranteed, and the tearing risk is low. Experiments prove that the method for thinning the laminated glass can realize the thinning of the laminated glass to the thickness of 60 mu m or less, and the breaking rate is as low as 5 percent or less, thereby being beneficial to flexible display of an LCD.

It should be understood that, although the steps in the flowchart shown in fig. 1 are shown in sequence as indicated by the arrows, the steps are not necessarily performed in the sequence as indicated by the arrows, unless otherwise specifically indicated herein, the execution of the steps is not strictly limited to the order shown, and may be performed in other sequences, and at least some of the steps in fig. 1 may include multiple sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, the order of their execution not necessarily being performed in sequence, but may be performed alternately or alternately with at least some of the other steps or other sub-steps or stages.

Referring to fig. 3, a method for thinning a laminated glass according to a second embodiment of the present invention includes the following steps:

step S210: a laminated glass is obtained, the laminated glass comprising a first substrate and a second substrate arranged in a stack.

Specifically, in step S210, the same as step S110 of the first embodiment is omitted.

Step S220: a first protective film is arranged on one side surface of the first substrate far away from the second substrate, and the first protective film completely shields the first substrate.

Specifically, step S220 is the same as step S120 of the first embodiment, and will not be described again.

Step S230: and etching and thinning the second substrate to a first preset thickness.

Step S240: and arranging a second protective film on the surface of the thinned second substrate, and enabling the second protective film to completely shield the second substrate.

In some embodiments, the second protective film is selected from any one of acid-fast heating and UV-reducing films. It is understood that the second protective film is not limited to the above materials, but may be other acid-resistant films commonly used in the art.

In some embodiments, the second protective film has a thickness of 80 μm to 120 μm. In a specific example, the thickness of the second protective film may be, but is not limited to, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, or a range consisting of any two of these values. Under the thickness, the second protective film can better protect the second substrate from being etched in the subsequent process.

Step S250: the first protective film on the surface of the first substrate is removed, and a circle of third protective film is arranged along the edge of one side surface of the first substrate, which is far away from the second substrate.

Specifically, the step of removing the first protective film on the surface of the first substrate is the same as that of the first embodiment, and will not be described in detail.

The edge of one side surface of the first substrate far away from the second substrate is provided with a circle of third protective film, the edge of the first substrate can be protected from being etched in the etching process, and the middle part of the first substrate is etched, so that a frame with a certain thickness is formed at the edge of the first substrate, subsequent sheet taking and placing and film tearing are facilitated, and the breaking rate is reduced.

In some embodiments, the width of the third protective film is 5mm to 10mm. In a specific example, the thickness of the third protective film may be, but is not limited to, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm, or a range consisting of any two of these values. At the above thickness, the third protective film can better protect the edge from etching and from collapsing.

In some embodiments, the third protective film is selected from any one of acid-fast heating and UV-reducing films. It is understood that the third protective film is not limited to the above materials, and may be other acid-resistant films commonly used in the art, and further, the third protective film may be the same as or different from the first protective film.

In some embodiments, the thickness of the third protective film is 80 μm to 120 μm. In a specific example, the thickness of the third protective film may be, but is not limited to, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, or a range composed of any two of these values. At the above thickness, the third protective film can better protect the edge of the first substrate from etching. It is understood that the thickness of the third protective film may be the same as or different from the thickness of the first protective film.

Step S260: and etching and thinning the first substrate to a second preset thickness.

Step S270: the second protective film is removed.

Specifically, step S270 is the same as step S170 of the first embodiment, and will not be described again.

Step S280: and cutting the edge of the etched laminated glass, and removing the area covered by the third protective film.

According to the method for thinning the laminated plate glass, the second substrate is etched and thinned to the preset thickness, then the first substrate is etched, in the etching process, the edge of the first substrate is coated, the edge of the first substrate is protected from being etched, the sheet taking and placing are facilitated, the risk of breaking the sheet in the taking and placing process is reduced, in addition, the laminated plate glass cannot warp and curl due to the surface tension of the protective film when the second substrate is thinned to the preset thickness, the good ground plane degree is still guaranteed, and the risk of tearing the sheet is low.

Referring to fig. 4, a method for thinning a laminated glass according to a third embodiment of the present invention includes the following steps:

step S310: a laminated glass is obtained, the laminated glass comprising a first substrate and a second substrate arranged in a stack.

Specifically, step S310 is the same as step S110 in the first embodiment, and will not be described again.

Step S320: a protective film is provided along at least one of edges of a side surface of the first substrate away from the second substrate and edges of a side surface of the second substrate away from the first substrate.

In some embodiments, the protective film has a width of 5mm to 10mm. In a specific example, the thickness of the protective film may be, but is not limited to, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm, or a range consisting of any two of these values. At the above thickness, the protective film can better protect the edge from etching and from collapsing.

In some embodiments, the protective film is selected from any one of acid-fast heating and UV-reducing films. It will be appreciated that the protective film is not limited to the above materials, but may be other acid-resistant films commonly used in the art.

In some embodiments, the protective film has a thickness of 80 μm to 120 μm. In a specific example, the thickness of the protective film may be, but is not limited to, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, or a range consisting of any two of these values. At the above thickness, the protective film can better protect the edge of the glass substrate from etching.

It is understood that step S320 includes: a circle of protective films are arranged only along the edge of one side surface of the first substrate, which is far away from the second substrate, or a circle of protective films are arranged only along the edge of one side surface of the second substrate, which is far away from the first substrate, or a circle of first protective films are arranged along the edge of one side surface of the first substrate, which is far away from the second substrate, and a circle of second protective films are arranged along the edge of one side surface of the second substrate, which is far away from the first substrate, and the first protective films and the second protective films can be identical or different, and the widths and the thicknesses of the first protective films and the second protective films can be identical or different, and are specifically as described above.

The edge of one side surface of the first substrate far away from the second substrate is provided with a circle of protective film, the edge of the first substrate can be protected from being etched in the etching process, and the middle part of the first substrate is etched, so that a frame with a certain thickness is formed at the edge of the first substrate, subsequent sheet taking and placing and film tearing are facilitated, and the breaking rate is reduced.

The edge of one side surface of the second substrate far away from the first substrate is provided with a circle of protective film, the edge of the second substrate can be protected from being etched in the etching process, and the middle part of the second substrate is etched, so that a frame with a certain thickness is formed at the edge of the second substrate, subsequent sheet taking and placing and film tearing are facilitated, and the breaking rate is reduced.

Step S330: and etching and thinning the first substrate and the second substrate to a preset thickness.

In some embodiments, the predetermined thickness is less than or equal to 0.03mm. It can be appreciated that in step S330, the first substrate and the second substrate are etched and thinned at the same time until the thicknesses of the first substrate and the second substrate reach the preset thickness.

Step S340: cutting the edge of the etched laminated glass, and removing the area covered by the protective film.

According to the method for thinning the laminated plate glass, the edge of at least one of the first substrate and the second substrate is coated, so that the edge of at least one of the first substrate and the second substrate is not etched in the etching process, the thickness is thicker, the sheet taking and placing are facilitated, the risk of breaking the sheet in the taking and placing process is reduced, and the laminated plate glass cannot warp and curl due to the surface tension of the protective film when the edge of the first substrate and the edge of the second substrate are thicker, the better ground plane degree is still ensured, and the risk of tearing the sheet is low.

The invention also provides an embodiment of the thinned laminated glass, which is obtained by processing the laminated glass according to the first embodiment, the second embodiment or the third embodiment.

In some embodiments, the thinned ply glass has a thickness of 0.06mm or less.

In some embodiments, the thinned ply glass has dimensions of 500mm by 600mm.

The invention also provides a display device of an embodiment, which comprises the thinned laminated glass of the embodiment.

In some embodiments, the display device includes, but is not limited to, a television, a computer, and the like.

In order to make the objects and advantages of the present invention more apparent, the following more particular description of the method for thinning the laminated glass and the effects thereof will be given in connection with the specific embodiments thereof, it being understood that the specific embodiments described herein are for illustration only and are not intended to limit the invention. The following examples, unless otherwise specified, do not include other components than the unavoidable impurities. The drugs and apparatus used in the examples are all routine choices in the art, unless specifically indicated. The experimental methods without specific conditions noted in the examples were carried out according to conventional conditions, such as those described in the literature, books, or recommended by the manufacturer.

Example 1

The embodiment provides a thinning method of an LCD (liquid crystal display) plywood glass substrate, which specifically comprises the following steps:

(1) An LCD glass substrate with the thickness of 1.1mm (the thickness of a single plate is 0.55 mm), the length and the width of the single plate are 920 multiplied by 730mm respectively, UV glue is coated between the gaps of the first substrate and the second substrate of the LCD glass substrate through a dispensing needle head, and then UV irradiation is carried out to cure the UV glue, so that edge sealing treatment is realized.

(2) The surface of the first substrate far away from the second substrate is covered with acid-resistant heating and viscosity reducing film, and the thickness is 100 μm.

(3) An acid-resistant heat-reducing film was provided along an edge of a side surface of the second substrate remote from the first substrate for a week, the width of the acid-resistant heat-reducing film was 10mm, and the thickness was 100. Mu.m.

(4) The second substrate was etched using a 5mol/L HF solution until the thickness of the intermediate region of the second substrate, which was not provided with the acid-fast heating-reducing film, was 0.03mm, while the thickness of the edge region provided with the acid-fast heating-reducing film was still 0.55mm.

(5) The LCD glass substrate is firstly placed on a heating platform, heated at 70 ℃ and then torn off the film, and acid-resistant heating and film-reducing films on the surface of the first substrate are removed.

(6) And (3) arranging foam with the thickness of 0.52mm in the middle area of the second substrate, which is not provided with the acid-resistant heating and mucosa-reducing film, filling, then coating release paper, and then coating the acid-resistant heating and mucosa-reducing film on the surface of the second substrate, wherein the thickness is 100 mu m.

(7) Etching is carried out on the first substrate, the etching solution adopts HF solution with the concentration of 5mol/L, the thickness of the first substrate is 0.03mm, and the total thickness of the LCD glass substrate is 0.06mm.

(8) And (3) firstly placing the LCD glass substrate on a heating platform, heating at 70 ℃ and tearing the film, removing acid-resistant heating and film-reducing films on the surface of the second substrate, and cleaning the etched LCD glass substrate.

(9) And cutting the thinned LCD glass substrate to the target size of 80mm multiplied by 160mm by adopting a laser cutting mode, and removing the edge area of the second substrate.

Example 2

The present embodiment provides a thinning method of an LCD glass substrate, similar to the thinning method of an LCD glass substrate of embodiment 1, except that in step (3), the width of the acid-resistant heat-reduced film is different, and in the present embodiment, the width of the acid-resistant heat-reduced film is 3mm.

Example 3

The present embodiment provides a method for thinning an LCD glass substrate, similar to the method for thinning an LCD glass substrate of embodiment 1, wherein step (6) of the present embodiment is different from step (6) in that: and (3) distributing a release paper on the middle area of the second substrate, which is not provided with the acid-resistant heating and viscosity reducing film, and further distributing the acid-resistant heating and viscosity reducing film on the surface of the second substrate, wherein the thickness is 100 mu m.

Example 4

The present embodiment provides a method for thinning an LCD glass substrate, similar to the method for thinning an LCD glass substrate of embodiment 1, wherein step (6) of the present embodiment is different from step (6) in that: the second substrate surface is covered with acid-resistant heating and viscosity reducing film, and the thickness is 100 μm.

Example 5

The embodiment provides a method for thinning an LCD glass substrate, which specifically comprises the following steps:

(3) The second substrate was etched using a 5mol/L HF solution until the thickness of the second substrate was 0.03mm.

(4) The LCD glass substrate is firstly placed on a heating platform, heated at 70 ℃ and then torn off the film, and acid-resistant heating and film-reducing films on the surface of the first substrate are removed.

(5) The second substrate surface is covered with acid-resistant heating and viscosity reducing film, and the thickness is 100 μm.

(6) A circumference of acid-resistant heating-reduced film was provided on the edge of the first substrate, and the width of the acid-resistant heating-reduced film was 10mm and the thickness was 100. Mu.m.

Example 6

(2) A circumference of acid-resistant heating-reduced film was provided on the edge of the first substrate, and the width of the acid-resistant heating-reduced film was 10mm and the thickness was 100. Mu.m. A circumference of acid-resistant heating and viscosity-reducing film is arranged at the edge of one side surface of the second substrate far away from the first substrate, the width of the acid-resistant heating and viscosity-reducing film is 10mm, and the thickness is 100 mu m.

(3) The first substrate and the second substrate were simultaneously etched with an HF solution of 5mol/L until the thickness of the areas of the first substrate and the second substrate not covered with the acid-resistant heating-reducing film was 0.03mm.

(4) And cutting the thinned LCD glass substrate to the target size of 80mm multiplied by 160mm by adopting a laser cutting mode, and simultaneously removing the edge areas of the first substrate and the second substrate.

Comparative example 1

Comparative example 1 provides a thinning method of an LCD glass substrate, similar to that of example 1, except that the step (3) treatment is not performed.

Comparative example 2

Comparative example 1 provides a thinning method of an LCD glass substrate, specifically comprising the steps of:

(2) And (3) etching the two sides of the LCD glass substrate, wherein the etching solution adopts 5mol/L HF solution, and the thickness of the LCD glass substrate is 0.06mm.

(3) And cleaning the etched LCD glass substrate.

(4) And cutting the thinned LCD glass substrate to the target size of 80mm multiplied by 160mm by adopting a laser cutting mode.

50 LCD glass substrates were taken and processed according to the thinning methods of the LCD glass substrates of the above examples and comparative examples, the number of fragments in the thinning process was recorded, and the fragment rate was calculated, as shown in Table 1 below. The breaking refers to breaking after the etching and thinning of the LCD glass substrate, and the breaking rate is the breaking number/total production number.

Table 1 fragmentation rate data for each of the thinning methods of examples and comparative examples

	Fragment rate/%
		Example 1	0
Example 2	2
		Example 3	10
Example 4	14
		Example 5	6
Example 6	10
		Comparative example 1	40
Comparative example 2	100

From the above experimental data, it can be seen that the chipping rate in the etching process can be significantly reduced by providing a protective film for one week on the edges of the first substrate and the second substrate. Wherein, the protection film is arranged on one side, and the fragmentation rate can be further reduced by a mode of etching one side in turn. In example 6, since the double-sided etching was performed simultaneously, when the laminated glass was thinned to a certain thickness (e.g., 0.1mm or less), the laminated glass was likely to be broken by the tumbling etching liquid in the bubbling etching liquid due to the lack of the supporting back plate, and the bubbling flow rate was generally 180L/min or more, and if the breaking rate was to be ensured, the bubbling flow rate was required to be small (e.g., 30L/min or less), and even the bubbling was closed, resulting in uneven etching of the thinned laminated glass of example 6. The thinned plate glass of examples 1 to 5 was better in etching uniformity.

Comparative example 1 differs from example 1 in that a protective film was not provided at the edge in comparative example 1, and the chipping rate was significantly high. In comparative example 2, both sides were etched simultaneously, but comparative example 2 was not provided with a protective film at the edge, and the chipping rate was significantly higher.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples merely represent a few embodiments of the present invention, which facilitate a specific and detailed understanding of the technical solutions of the present invention, but are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. It should be understood that, based on the technical solutions provided by the present invention, those skilled in the art can obtain technical solutions through logical analysis, reasoning or limited experiments, which are all within the protection scope of the appended claims. The scope of the patent is therefore intended to be covered by the appended claims, and the description and drawings may be interpreted as illustrative of the contents of the claims.

Claims

1. A method for thinning glass of a plywood is characterized by comprising the following steps:

etching and thinning the second substrate to a first preset thickness;

etching and thinning the first substrate to a second preset thickness;

2. The method for thinning a laminated glass according to claim 1, wherein the width of the second protective film is 5mm to 10mm.

3. The method of thinning a laminated glass according to claim 1, wherein the step of providing a third protective film on a side surface of the second substrate remote from the first substrate comprises: firstly, a release layer is arranged in a region of the second substrate, which is not provided with the second protective film, and then the third protective film is arranged on the surface of the second substrate.

4. The method of thinning a laminated glass according to claim 3, wherein the step of providing a third protective film on a side surface of the second substrate remote from the first substrate comprises: firstly, a filling layer is arranged in a region of the second substrate, which is not provided with the second protective film, then a release layer is laminated, and then the third protective film is arranged on the surface of the second substrate, wherein the thickness of the filling layer is the same as the thickness of the second substrate in a thinning way.

5. The method for thinning a laminated glass according to claim 1, wherein the thickness of the first protective film, the second protective film, and the third protective film is each independently 80 μm to 120 μm.

6. The method for thinning a laminated glass according to any one of claims 1 to 5, wherein the first protective film, the second protective film and the third protective film are each independently selected from any one of acid-resistant heating-reduced film and UV-reduced film.

7. The method for thinning a laminated glass according to any one of claims 1 to 5, further comprising, before the step of disposing the first protective film on a side surface of the first substrate remote from the second substrate: and (3) spot-coating UV glue for one circle along the gap between the first substrate and the second substrate, and then carrying out UV irradiation to solidify the UV glue.

8. The method of claim 7, wherein the UV glue spot-coating area has a width of 2mm to 3mm.

9. The method for thinning a laminated glass according to any one of claims 1 to 5 and 8, wherein the thickness of the first substrate and the second substrate is each independently 0.2mm to 0.55mm, and the first preset thickness and the second preset thickness are each independently 0.03mm or less.

10. The method for thinning a laminated glass according to any one of claims 1 to 5 and 8, wherein the size of the laminated glass is not less than 500mm x 600mm.

11. A method for thinning glass of a plywood is characterized by comprising the following steps:

etching and thinning the second substrate to a first preset thickness;

etching and thinning the first substrate to a second preset thickness;

12. A method for thinning glass of a plywood is characterized by comprising the following steps:

a peripheral protective film is arranged along at least one edge of the side surface of the first substrate away from the second substrate;

13. A thinned laminated glass, characterized by being obtained by being treated by the method for thinning a laminated glass according to any one of claims 1 to 12.

14. A display device comprising the thinned laminated glass of claim 13.