CN116175401A - Circular arc straight line combination slot polishing pad - Google Patents

Circular arc straight line combination slot polishing pad Download PDF

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Publication number
CN116175401A
CN116175401A CN202310029280.8A CN202310029280A CN116175401A CN 116175401 A CN116175401 A CN 116175401A CN 202310029280 A CN202310029280 A CN 202310029280A CN 116175401 A CN116175401 A CN 116175401A
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CN
China
Prior art keywords
groove
arc
short arc
shaped groove
gradient
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CN202310029280.8A
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Chinese (zh)
Inventor
相红旗
姚力军
施建国
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Ningbo Yingwei Taike New Material Co ltd
Ningbo Jiangfeng Electronic Material Co Ltd
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Ningbo Yingwei Taike New Material Co ltd
Ningbo Jiangfeng Electronic Material Co Ltd
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Application filed by Ningbo Yingwei Taike New Material Co ltd, Ningbo Jiangfeng Electronic Material Co Ltd filed Critical Ningbo Yingwei Taike New Material Co ltd
Priority to CN202310029280.8A priority Critical patent/CN116175401A/en
Publication of CN116175401A publication Critical patent/CN116175401A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses an arc straight line combined groove polishing pad, which comprises a pad body, a gradient diffusion area, a buffer area and a high-speed area, wherein the gradient diffusion area, the buffer area and the high-speed area are arranged on the pad body; the buffer zone formed by the straight grooves with different lengths can change the flow direction of the polishing solution, thereby slowing down the flow rate of the polishing solution, prolonging the retention time of the polishing solution and improving the polishing time of the wafer.

Description

Circular arc straight line combination slot polishing pad
Technical Field
The invention relates to the technical field of chemical mechanical polishing, in particular to a circular arc linear combination groove polishing pad.
Background
In the process of manufacturing a semiconductor wafer, as the material is sequentially etched and deposited, the wafer surface becomes uneven, but the subsequent semiconductor processing requires the wafer surface to remain flat, so that the wafer surface needs to be subjected to further planarization treatment, unwanted surface defects and scratches on the wafer surface are removed, and the semiconductor wafer is polished by chemical mechanical polishing, and the polishing process of the wafer is completed by rotating the polishing pad injected with the polishing liquid and the coaxial center of the wafer, so that the entire surface of the wafer is planarized.
The prior publication number is: in the patent document of CN114918824a, there is provided a polishing pad having radial micro grooves, which is capable of changing the residence time of a polishing medium on the polishing pad, improving polishing efficiency and improving uniformity in and between sheets by a plurality of radial micro grooves provided at the outer ends of the circumferential grooves, but since the speed of the polishing medium is increased from the rotation center to the radial micro grooves during rotation of the polishing pad, the radial micro grooves provided at the periphery can achieve the lowering of the polishing medium but cannot reach the expectations, the residence time of the polishing medium on the polishing pad cannot be prolonged better, and the polishing efficiency on wafers is also slower.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a circular arc linear combination groove polishing pad.
In order to achieve the above purpose, the present invention adopts the following technical scheme: the buffer zone is arranged between the gradient diffusion zone and the high-speed zone;
the gradient diffusion region consists of a diffusion center, a long arc-shaped groove and a multi-gradient short arc-shaped groove I, wherein the diffusion center is a circular groove, and the long arc-shaped groove is connected with the circular groove; the multi-gradient short arc-shaped grooves surround two sides of the long arc-shaped groove and symmetrically diverge towards the far end;
the diffusion center and the pad body share the same axis;
the high-speed area is formed by a short arc groove II which is positioned on an extension line of the long arc groove and the short arc groove I;
the buffer zone is composed of straight grooves with different lengths, and the straight grooves are used for connecting and combining the long arc grooves with the short arc grooves I and the short arc grooves II in multiple gradients.
As a further description of the above technical solution: the first short arc-shaped groove is sequentially divided into a first gradient … … and an N gradient from the diffusion center to the high-speed region, the starting end of the first short arc-shaped groove of the N gradient is symmetrically provided with two sides of the first short arc-shaped groove of the N-1 gradient, the first short arc-shaped groove of the N gradient and the connecting end of the straight groove are located on the same circumference, and the first short arc-shaped groove of the N-1 gradient and the connecting end of the straight groove are located on the same circumference.
As a further description of the above technical solution: the starting end of the first short arc-shaped groove with the N-1 gradient is symmetrically provided with two sides of the first short arc-shaped groove with the N-2 gradient, and the first short arc-shaped groove with the N-2 gradient and the connecting end of the straight groove are positioned on the same circumference.
As a further description of the above technical solution: the joint of the straight groove and the short arc groove II is positioned on the same circumference, so that the arc length of the short arc groove II is the same.
As a further description of the above technical solution: the cross section area of the diffusion center is regular trapezoid, inverted trapezoid, circular arc, U-shaped, rectangular and triangular, and the radius of the diffusion center is 5 mm-100 mm, preferably 10 mm-40 mm.
As a further description of the above technical solution: the cross sections of the long arc-shaped groove, the short arc-shaped groove I, the straight groove and the short arc-shaped groove I are regular trapezoids, inverted trapezoids, circular arcs, U-shaped, rectangles and triangles, and the distance between two adjacent grooves at any position of the short arc-shaped groove II is 1-50 mm.
As a further description of the above technical solution: there is a difference in length between the arcs of the first short arc-shaped groove of the nth gradient and the first short arc-shaped groove of the N-1 th gradient.
As a further description of the above technical solution: referring to the polar coordinates of the coaxial center of the pad body, the track coordinates of the short arc-shaped groove are (rho, A), and the center of the short arc-shaped groove is O 2 The polar angle of any point P on the first short arc groove is a, and the radius of curvature of the first short arc groove is R, which can be expressed by the following polar coordinate equation:
ρ＝2Rcos(B-A)
wherein r=0.5r pad To 2R pad ，R pad The radius of the polishing pad is 25 mm-500 mm;
the short arcuate groove-track arc defined by the equation above is between 10 ° and 120 °.
As a further description of the above technical solution: referring to the polar coordinates of the coaxial center of the pad body, the track coordinates of the second short arc-shaped groove and the straight-line groove are (ρ ', a'), and according to the polar angle of the circle center O 'of the second short arc-shaped groove and the straight-line groove, the polar angle of any point P' on the second short arc-shaped groove and the straight-line groove is a ', and the curvature radius of the second short arc-shaped groove and the straight-line groove is R', the polar coordinate equation can be used for representing:
ρ′＝2Rcos(B′-A′)
wherein R' =0.5r pad To 2R pad ，R pad The radius of the polishing pad is 25 mm-500 mm;
the radian of the short arc-shaped groove II and the straight groove track defined by the equation is between 10 DEG and 120 deg.
As a further description of the above technical solution: the distance difference delta L between the starting point of the adjacent two-stage short arc-shaped grooves I and the circle center of the polishing pad body ranges from 5mm to 250mm.
The invention has the following beneficial effects:
according to the invention, through the buffer zone formed by the straight grooves with different lengths, the flow direction of the polishing liquid can be changed when the polishing liquid flows through the buffer zone, so that the flow speed is reduced, the retention time of the polishing liquid on the polishing disc is prolonged, and the polishing efficiency is improved; the multi-region grooves formed by the gradient diffusion region, the buffer region and the high-speed region have different groove densities, so that the uniformity of polishing inside a wafer can be effectively improved, and the use efficiency of polishing solution can be improved.
Drawings
FIG. 1 is a schematic view of a circular arc linear combination groove polishing pad according to the present invention;
FIG. 2 is a schematic view of another linear combination groove polishing pad with circular arcs according to the present invention;
FIG. 3 is a schematic view of another linear combination groove polishing pad with circular arcs according to the present invention;
fig. 4 is a schematic view of another arc-shaped linear combination groove polishing pad according to the present invention.
Legend description:
1. a cushion body; 2. a gradient diffusion region; 3. a buffer area; 4. a high-speed region; 21. a diffusion center; 22. a long arc-shaped groove; 23. a short arc-shaped groove I; 31. a straight groove; 41. and a second short arc-shaped groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, one embodiment provided by the present invention: the polishing pad comprises a pad body 11, a gradient diffusion region 2, a buffer region 3 and a high-speed region 4, wherein the gradient diffusion region 2, the buffer region 3 and the high-speed region 4 are arranged on the pad body 1, the buffer region 3 is arranged between the gradient diffusion region 2 and the high-speed region 4, the gradient diffusion region 2 consists of a diffusion center 21, a long arc-shaped groove 22 and a multi-gradient short arc-shaped groove I23, the diffusion center 21 is a circular groove, the long arc-shaped groove 22 is connected with the circular groove, the multi-gradient short arc-shaped groove surrounds both sides of the long arc-shaped groove 22 and diverges towards the far end in a symmetrical way, the diffusion center 21 and the pad body 1 share the same axis, the high-speed region 4 consists of a short arc-shaped groove II 41, the short arc-shaped groove II 41 is positioned on the extension line of the long arc-shaped groove 22 and the short arc-shaped groove I23, the buffer region 3 consists of straight grooves with different lengths, the straight grooves are used for connecting and combining the long arc-shaped groove 22 and the multi-gradient short arc-shaped groove I23 and the short arc-shaped groove II 41, the densities of the different areas are different, polishing liquid can be better left on the pad body 11, and the polishing liquid can be more evenly spread inside the wafer, and the polishing liquid can pass through the wafer uniformly; the buffer zone 3 formed by the straight grooves 31 with different lengths can change the flow direction of the polishing liquid, thereby slowing down the flow rate of the polishing liquid, prolonging the retention time of the polishing liquid and improving the polishing time of the wafer.
The cross sections of the diffusion center, the long arc-shaped groove 22, the short arc-shaped groove 23, the straight groove and the short arc-shaped groove 23 are positive trapezoids, inverted trapezoids, circular arcs, U-shaped, rectangles and triangles, wherein the radius of the diffusion center 21 is 5 mm-100 mm, preferably 10 mm-40 mm, the distance between two adjacent grooves at any position of the short arc-shaped groove two 41 is 1 mm-50 mm, the grooves enable polishing liquid to flow according to a specified path, and grooves with different shapes and depths are adopted according to requirements so as to meet various polishing requirements.
Referring to the polar coordinates of the coaxial center of the pad body 1, the track coordinates of the short arc-shaped groove I23 are (rho, A), and the circle center O of the short arc-shaped groove I23 2 The polar angle of any point P on the short arc groove one 23 is a and the radius of curvature of the short arc groove one 23 is R, can be expressed by the following polar equation:
ρ＝2Rcos(B-A)
wherein r=0.5r pad To 2R pad ，R pad The radius of the polishing pad is 25 mm-500 mm;
the arc of the short arcuate groove-23 track defined by the equation above is between 10 deg. and 120 deg..
Referring to the polar coordinates of the coaxial center of the pad body 1, the track coordinates of the second short arc-shaped groove 41 and the straight groove 31 are (ρ ', a '), and according to the polar angle of the center O ' of the second short arc-shaped groove 41 and the straight groove 31 being B ', the polar angle of any point P ' on the second short arc-shaped groove 41 and the straight groove 31 being a ', the curvature radius of the second short arc-shaped groove 41 and the straight groove 31 being R ', the following polar coordinate equation can be used to represent:
ρ′＝2Rcos(B′-A′)
wherein R' =0.5r pad To 2R pad ，R pad The radius of the polishing pad is 25 mm-500 mm;
the arc of the track of the short arc-shaped groove two 41 and the straight groove 31 defined by the equation is between 10 degrees and 120 degrees.
The first short arc-shaped groove 23 is sequentially divided into a first gradient … … and an N gradient from the diffusion center 21 to the high-speed area 4, the starting ends of the first short arc-shaped grooves 23 of the N gradient are symmetrically arranged on two sides of the first short arc-shaped groove 23 of the N-1 gradient, the starting ends of the first short arc-shaped grooves 23 of the N-1 gradient are symmetrically arranged on two sides of the first short arc-shaped groove 23 of the N-2 gradient, the connecting ends of the first short arc-shaped grooves 23 of the N gradient and the straight grooves are located on the same circumference, the connecting ends of the first short arc-shaped grooves 23 of the N-1 gradient and the straight grooves are located on the same circumference, and the connecting ends of the first short arc-shaped grooves 23 of the N-2 gradient and the straight grooves are located on the same circumference.
The tail end of the first short arc-shaped groove 23 and the tail end of the second long arc-shaped groove 22 are connected with the starting end of the second short arc-shaped groove 41 through straight grooves 31 with different lengths, so that each groove is provided with a dispersing end, polishing liquid can start from the starting end of the groove, leave the pad body 1 after reaching the dispersing end, and finish the use in the polishing process, and the radian of the first short arc-shaped groove 23 or the long arc-shaped groove 22 connected with the front end of the second arc-shaped groove is the same; the straight grooves 31 change the flow direction of the polishing liquid flowing out of the gradient diffusion region 2, so that the speed of the polishing liquid flowing through the buffer region 3 is slowed down, and the polishing uniformity is improved while the polishing speed is improved.
Embodiment two:
experimental test results:
experiments were performed using a single module integrated CMP polisher from hanzhou silicon electronics technologies (Hangzhou SIZONE Electronic Technology inc.) to determine removal rates; in this experiment, a tungsten slurry was used as the polishing liquid, and a tungsten wafer was used as the test wafer (Monitor wafer);
in addition, without separate description, the polishing conditions used in all polishing experiments were as follows: polishing platform rotational speed: 103rpm;
polishing head rotational speed: 97rpm;
flow rate of polishing solution: 85mL/min;
polishing time: 60 s/tablet.
Conclusion of experiment: after the polishing pad of the invention is used for polishing 500 tungsten wafer wafers, the usage amount of the tungsten polishing solution is saved by about 20-40% compared with that of a common polishing pad, and the polishing speed is more than 3500A/min and is faster than 500A/min compared with that of the common polishing pad.
Embodiment III:
referring to fig. 2, unlike the above embodiment, the gradient diffusion region 2 does not involve the short arc-shaped groove one 23, diffuses through the long arc-shaped formation 22, and the straight-running groove 31 forms the buffer region 3 of multiple gradients, which can buffer the polishing liquid multiple times to better prolong the residence time of the polishing liquid.
Embodiment four:
referring to fig. 3, unlike the above embodiment, the buffer zone 3 is composed of two kinds of straight grooves 31 of different lengths, and the gradient diffusion zone 2 includes only a long arc-shaped configuration 22 and a diffusion center 21 to cope with a polishing pad where the slurry stays short.
Fifth embodiment:
referring to fig. 4, unlike the above-described embodiment, the multi-gradient buffer zone 3 formed of the straight grooves 31 of various lengths occupies a large proportion on the pad body 1, and the trailing end of the straight groove 31 is connected to the short arc groove two 41 near the outer edge of the pad body 1, so that the polishing liquid flows according to the straight groove 31 for a longer time during polishing, and at the same time, the short arc groove one 22 of the gradient diffusion zone 2 is replaced by the straight groove 31, which increases the residence time of the polishing liquid on the pad body 1 to a greater extent.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present invention.

Claims (10)

1. An arc straight line combination groove polishing pad, which is characterized in that: the buffer zone is arranged between the gradient diffusion zone and the high-speed zone;
the gradient diffusion region consists of a diffusion center, a long arc-shaped groove and a multi-gradient short arc-shaped groove I, wherein the diffusion center is a circular groove, and the long arc-shaped groove is connected with the circular groove; the multi-gradient short arc-shaped grooves surround two sides of the long arc-shaped groove and symmetrically diverge towards the far end;
the diffusion center and the pad body share the same axis;
the high-speed area is formed by a short arc groove II which is positioned on an extension line of the long arc groove and the short arc groove I;
the buffer zone is composed of straight grooves with different lengths, and the straight grooves are used for connecting and combining the long arc grooves with the short arc grooves I and the short arc grooves II in multiple gradients.
2. The circular arc linear combination groove polishing pad of claim 1, wherein: the first short arc-shaped groove is sequentially divided into a first gradient … … and an N gradient from the diffusion center to the high-speed region, the starting end of the first short arc-shaped groove of the N gradient is symmetrically provided with two sides of the first short arc-shaped groove of the N-1 gradient, the first short arc-shaped groove of the N gradient and the connecting end of the straight groove are located on the same circumference, and the first short arc-shaped groove of the N-1 gradient and the connecting end of the straight groove are located on the same circumference.
3. The circular arc linear combination groove polishing pad of claim 2, wherein: the starting end of the first short arc-shaped groove with the N-1 gradient is symmetrically provided with two sides of the first short arc-shaped groove with the N-2 gradient, and the first short arc-shaped groove with the N-2 gradient and the connecting end of the straight groove are positioned on the same circumference.
4. The circular arc linear combination groove polishing pad of claim 1, wherein: the joint of the straight groove and the short arc groove II is positioned on the same circumference, so that the arc length of the short arc groove II is the same.
5. The circular arc linear combination groove polishing pad of claim 1, wherein: the cross section area of the diffusion center is regular trapezoid, inverted trapezoid, circular arc, U-shaped, rectangular and triangular, and the radius of the diffusion center is 5 mm-100 mm, preferably 10 mm-40 mm.
6. The circular arc linear combination groove polishing pad of claim 1, wherein: the cross sections of the long arc-shaped groove, the short arc-shaped groove I, the straight groove and the short arc-shaped groove I are regular trapezoids, inverted trapezoids, circular arcs, U-shaped, rectangles and triangles, and the distance between two adjacent grooves at any position of the short arc-shaped groove II is 1-50 mm.
7. The circular arc linear combination groove polishing pad of claim 1, wherein: there is a difference in length between the arcs of the first short arc-shaped groove of the nth gradient and the first short arc-shaped groove of the N-1 th gradient.
8. The circular arc linear combination groove polishing pad of claim 1, wherein: the polar coordinates of the coaxial center of the pad body are referred to, the track coordinates of the short arc-shaped groove are (ρ, A), theShort arc groove-center O 2 The polar angle of any point P on the first short arc groove is a, and the radius of curvature of the first short arc groove is R, which can be expressed by the following polar coordinate equation:
ρ＝2R cos(B-A)
wherein r=0.5r pad To 2R pad ，R pad The radius of the polishing pad is 25 mm-500 mm;
the short arcuate groove-track arc defined by the equation above is between 10 ° and 120 °.
9. The circular arc linear combination groove polishing pad of claim 1, wherein: taking the polar coordinates of the coaxial center of the pad body into consideration, the track coordinates of the second short arc-shaped groove and the straight-line groove are (ρ ', A'), and according to the polar angle of the circle center O 'of the second short arc-shaped groove and the straight-line groove, the polar angle of any point P' on the second short arc-shaped groove and the straight-line groove is A ', and the curvature radius of the second short arc-shaped groove and the straight-line groove is R', the polar coordinate equation can be used for representing the polar angle:
ρ′＝2R′cos(B′-A′)
wherein R' =0.5r pad To 2R pad ，R pad The radius of the polishing pad is 25 mm-500 mm;
the radian of the short arc-shaped groove II and the straight groove track defined by the equation is between 10 DEG and 120 deg.
10. The circular arc linear combination groove polishing pad of claim 1, wherein: the distance difference delta L between the starting point of the adjacent two-stage short arc-shaped grooves I and the circle center of the polishing pad body ranges from 5mm to 250mm.
CN202310029280.8A 2023-01-09 2023-01-09 Circular arc straight line combination slot polishing pad Pending CN116175401A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310029280.8A CN116175401A (en) 2023-01-09 2023-01-09 Circular arc straight line combination slot polishing pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310029280.8A CN116175401A (en) 2023-01-09 2023-01-09 Circular arc straight line combination slot polishing pad

Publications (1)

Publication Number Publication Date
CN116175401A true CN116175401A (en) 2023-05-30

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ID=86435892

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310029280.8A Pending CN116175401A (en) 2023-01-09 2023-01-09 Circular arc straight line combination slot polishing pad

Country Status (1)

Country Link
CN (1) CN116175401A (en)

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