CN116174909A - Machining method for directly machining special-shaped holes with coatings through laser - Google Patents

Abstract

The invention relates to a processing method for directly processing a coated special-shaped hole by laser, which is based on six-axis linkage numerical control machine tool control, matches millisecond long pulse laser and is realized in a three-dimensional space in a precise cutting mode, and comprises the following steps: firstly, carrying out positioning initialization, secondly, removing a thermal barrier coating in a target area, then roughly processing a through hole smaller than the aperture requirement to enable metal oxide and metal splash generated by subsequent scanning to pass through the hole, then precisely adjusting the focal position to transversely move a laser spot to scan out of a diffusion section, and finally, using pulse laser to rotationally cut a Kong Zhiduan cylindrical hole to a set size. The invention can realize one-step processing and forming by laser, has high feasibility and practicality and greatly improves the processing efficiency.

Description

Machining method for directly machining special-shaped holes with coatings through laser

Technical Field

The invention relates to the technical field of laser processing holes, in particular to a processing method for directly processing a special-shaped hole with a coating by laser, and particularly relates to a method for directly processing a special-shaped air film hole with a thermal barrier coating by millisecond long-pulse laser

Background

With the increase of the thrust-weight ratio of the aeroengine, the temperature born by the hot end part is greatly increased, and higher requirements are put forward on the heat resistance, corrosion resistance, oxidation resistance and gas impact resistance. The hot end component adopts advanced cooling technology, and meanwhile, the plasma spraying thermal barrier coating taking yttria stabilized zirconia as a surface layer is widely applied.

The special-shaped air film hole with the thermal barrier coating is an effective method for enhancing the cooling effect of the hot end part of the aeroengine and prolonging the service life of components. The special-shaped hole pattern mainly comprises Kong Zhiduan and a hole diffusion section, and the thermal barrier coating is positioned on one side of the hole diffusion section. Because of the non-conductive characteristic of the yttria stabilized zirconia thermal barrier coating, the electric machining, mechanical machining or other secondary combined machining methods are difficult to apply to the hole type machining, and the laser machining is an effective machining method for solving the problem of the special-shaped air film hole with the thermal barrier coating.

At present, a method for processing a special-shaped air film hole with a thermal barrier coating by adopting ultra-fast pulse laser such as femtosecond and picosecond based on a scanning galvanometer filling processing mode has certain feasibility and effectiveness, but the scanning preparation process step before processing is complex, the time consumption is long, the single-hole processing time reaches 150 seconds, the processing efficiency is low, and the cost is high. The processing mode based on the laser drilling equipment to control the position and energy of the laser head effectively improves the processing speed, but the coating with the thermal barrier coating special-shaped air film hole has limited bonding force with the substrate, and the absorptivity of the coating and the substrate to laser is different, and the laser directly processes on the coating to cause the thermal defect of the coating and the substrate, and seriously cause the adverse consequences such as coating bursting and the like.

Disclosure of Invention

In order to solve the technical problems, the invention aims to provide a processing method for directly processing a coated special-shaped hole by laser.

In order to achieve the above purpose, the invention adopts the following technical scheme:

a processing method for directly processing a special-shaped hole with a coating by laser,

the method comprises the following steps:

step 1: focusing laser on the center of a hole to be machined on the side surface of a workpiece coating by utilizing the self-adaptive laser focal length of a numerical control machine tool, and adjusting the axis of a laser head to coincide with the axis of the special-shaped hole to be machined;

step 2: enabling a plane of a machine tool to rotate, enabling the plane to be perpendicular to a beam axis, moving a laser spot position on the plane, adopting a defocusing process, and removing a thermal barrier coating on the surface of a target area by a plurality of single-pulse processing to expose a metal matrix;

step 3: returning the laser to the center of the hole to be processed on the side surface of the coating, moving the position of a laser spot, and properly increasing the defocusing amount, wherein a plurality of continuous pulses penetrate through the matrix metal layer, so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole;

step 4: returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process;

step 5: and (5) returning the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using a pulse laser.

Preferably, the processing method for directly processing the coated special-shaped hole by using the laser is based on six-axis linkage numerical control machine tool control, matches millisecond long-pulse laser, and the laser beam is always parallel to the axis of the special-shaped hole in the whole processing period.

Preferably, in the processing method for directly processing the coated special-shaped hole by using laser, in the step 2, a processing parameter range of removing the thermal barrier coating on the surface of the target area is: peak power is 1000-4000W, pulse width is 1-4 ms, frequency is 10-60 Hz, and defocus amount is 2-8 mm.

Preferably, in the processing method for directly processing the special-shaped hole with the coating by using the laser, the aperture of the processed hole in the step 3 is 1/2 to 2/3 of the aperture of Kong Zhiduan, wherein the defocus amount in the perforation in the step 3 is smaller than that in the step 2, and the laser processing parameters in the step 3 are in the range of: peak power is 6000-12000W, pulse width is 1-3 ms, frequency is 10-60 Hz, and defocus amount is 0-4 mm.

Preferably, in the processing method for directly processing the coated special-shaped hole by using the laser, the processing direction of the step 4 is from the center to two sides, and the power of each single pulse is increased and then reduced from the center of the special-shaped hole to the edge of a hole diffusion section; the processing parameter range is as follows: peak power is 2000-6000W, pulse width is 1-3 ms, frequency is 10-60 Hz, and defocus amount is 2-8 mm.

Preferably, the machining direction of the step 5 is performed in a clockwise or counterclockwise direction along the axis of the special-shaped hole, and the laser machining parameters range: peak power 3000-6000W, pulse width 0.5-2.5 ms, frequency 10-60 Hz, defocus amount-1 mm.

Preferably, the processing method for directly processing the coated special-shaped hole by laser is characterized by comprising the following steps of:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 2000W, pulse width 3ms, frequency 20Hz, defocus 5mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 10000W, pulse width 2ms, frequency 20Hz, defocus 1mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 2000W, pulse width 2ms, frequency 20Hz, defocus 5mm;

step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 5000W, pulse width 1ms, frequency 30Hz, defocus 0mm.

Preferably, the processing method for directly processing the coated special-shaped hole by laser is characterized by comprising the following steps of:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 1000W, pulse width 1ms, frequency 10Hz, defocus 2mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 6000W, pulse width 1ms, frequency 10Hz, defocus 1mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 2000W, pulse width 1ms, frequency 10Hz, defocus 2mm.

Step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 3000W, pulse width 0.5ms, frequency 10Hz, defocus-1 mm.

Preferably, the processing method for directly processing the coated special-shaped hole by laser is characterized by comprising the following steps of:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 4000W, pulse width 4ms, frequency 50Hz, defocus 8mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 12000W, pulse width 3ms, frequency 60Hz, defocus 4mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 6000W, pulse width 3ms, frequency 50Hz, defocus 8mm;

step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 6000W, pulse width 2ms, frequency 50Hz, defocus 1mm.

Preferably, the processing method for directly processing the coated special-shaped hole by laser is characterized by comprising the following steps of:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 3000W, pulse width 2ms, frequency 40Hz, defocus 6mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 8000W, pulse width 2ms, frequency 30Hz, defocus 3mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 4000W, pulse width 2ms, frequency 40Hz, defocus 6mm;

step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 4000W, pulse width 2ms, frequency 30Hz, defocus 0mm.

By means of the scheme, the invention has at least the following advantages:

the processing time can be reduced by the processing method, and the original 150 seconds is only needed for 12 seconds, so that the processing efficiency is improved.

The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the shape of a thermal barrier coated profiled film hole;

FIG. 2 is a cross-sectional view of a thermal barrier coated profiled film hole;

figure 3 is a block diagram of A-A.

FIGS. 4a to 4f are whole process flow diagrams of the special-shaped air film hole with the thermal barrier coating;

fig. 5 is a cross-sectional profile of a hole wall of a special-shaped hole machined by the special-shaped hole machining method according to the embodiment of the invention.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present application, it should be noted that, the terms "vertical," "horizontal," "inner," "outer," and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or an azimuth or the positional relationship that the product of the application is conventionally put in use, merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or vertical, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

Examples

The invention is based on six-axis linkage numerical control machine tool control, the laser source is millisecond long pulse laser, the machining of the special-shaped air film hole with the thermal barrier coating is realized in a three-dimensional space in a precise cutting mode, and the laser beam is always parallel to the axis of the special-shaped hole in the machining process.

As shown in fig. 4a to 4f, a processing method for directly processing a coated special-shaped hole by using laser comprises the following steps:

firstly, positioning and initializing, as shown in fig. 2-3, focusing laser on the center of a hole to be processed on the side surface of a workpiece coating by utilizing the self-adaptive function of the laser focal length of a numerical control machine tool, and adjusting the axis of a laser head to coincide with the axis of the special-shaped hole to be processed;

secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation function of the machine tool to rotate the plane to be perpendicular to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; typical laser parameters are: peak power 2000W, pulse width 3ms, frequency 20Hz, defocus 5mm.

Then perforating, returning the laser to the center 4 of the hole to be processed on the side surface of the coating, moving the laser spot position and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through the metal layer of the matrix, so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, the separation of the coating and the matrix caused by splash recoil in the sweeping process is eliminated, and the heat accumulation in the sweeping process is reduced; typical laser parameters are: peak power 10000W, pulse width 2ms, frequency 20Hz, defocus 1mm.

Then scanning out the shape of the hole diffusion section, returning the laser focus to the center 4 of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; typical laser parameters are: peak power 2000W, pulse width 2ms, frequency 20Hz, defocus 5mm.

Finally, returning the laser focus to the center 4 of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; typical laser parameters are: peak power 5000W, pulse width 1ms, frequency 30Hz, defocus 0mm.

In the above embodiment, as shown in fig. 2 and 3, the hole pattern includes Kong Zhiduan and hole diffusion sections 2, kong Zhiduan, wherein the hole diffusion sections 2 are cylindrical through holes, the hole diffusion sections 2 diffuse along the hole center line 3 to two ends, kong Zhiduan 1 are smoothly transited and tangent to the inside of the hole diffusion sections 2, and the edge positions of the diffusion sections are semi-cylindrical.

When the processing method is used for processing the special-shaped air film hole with the thermal barrier coating, the results are shown as 1 and 5, and the appearance of the special-shaped Kong Zhiduan and the diffusion section are consistent with the set model, so that the processing method has good feasibility and effectiveness.

Example 1

A processing method for directly processing a coated special-shaped hole by laser comprises the following steps:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 2000W, pulse width 3ms, frequency 20Hz, defocus 5mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 10000W, pulse width 2ms, frequency 20Hz, defocus 1mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 2000W, pulse width 2ms, frequency 20Hz, defocus 5mm;

step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 5000W, pulse width 1ms, frequency 30Hz, defocus 0mm.

Example two

The processing method for directly processing the special-shaped holes with the coating by laser comprises the following steps:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 1000W, pulse width 1ms, frequency 10Hz, defocus 2mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 6000W, pulse width 1ms, frequency 10Hz, defocus 1mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 2000W, pulse width 1ms, frequency 10Hz, defocus 2mm.

Step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 3000W, pulse width 0.5ms, frequency 10Hz, defocus-1 mm.

Example III

The processing method for directly processing the special-shaped holes with the coating by laser is characterized by comprising the following steps of:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 4000W, pulse width 4ms, frequency 50Hz, defocus 8mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 12000W, pulse width 3ms, frequency 60Hz, defocus 4mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 6000W, pulse width 3ms, frequency 50Hz, defocus 8mm;

step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 6000W, pulse width 2ms, frequency 50Hz, defocus 1mm.

Example IV

The processing method for directly processing the special-shaped holes with the coating by laser is characterized by comprising the following steps of:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 3000W, pulse width 2ms, frequency 40Hz, defocus 6mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 8000W, pulse width 2ms, frequency 30Hz, defocus 3mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 4000W, pulse width 2ms, frequency 40Hz, defocus 6mm;

step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 4000W, pulse width 2ms, frequency 30Hz, defocus 0mm.

The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and it should be noted that it is possible for those skilled in the art to make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims (10)

1. A processing method for directly processing a special-shaped hole with a coating by laser is characterized in that,

the method comprises the following steps:

step 1: focusing laser on the center of a hole to be machined on the side surface of a workpiece coating by utilizing the self-adaptive laser focal length of a numerical control machine tool, and adjusting the axis of a laser head to coincide with the axis of the special-shaped hole to be machined;

step 2: enabling a plane of a machine tool to rotate, enabling the plane to be perpendicular to a beam axis, moving a laser spot position on the plane, adopting a defocusing process, and removing a thermal barrier coating on the surface of a target area by a plurality of single-pulse processing to expose a metal matrix;

step 3: returning the laser to the center of the hole to be processed on the side surface of the coating, moving the position of a laser spot, and properly increasing the defocusing amount, wherein a plurality of continuous pulses penetrate through the matrix metal layer, so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole;

step 4: returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process;

step 5: and (5) returning the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using a pulse laser.

2. The method for directly processing the coated special-shaped hole by using the laser according to claim 1, wherein the method comprises the following steps: based on six-axis linkage numerical control machine tool control, millisecond long pulse laser is matched, and the laser beam is always parallel to the axis of the special-shaped hole in the whole processing period.

3. The method for directly processing the coated special-shaped hole by using the laser according to claim 1, wherein the method comprises the following steps: and 2, removing a processing parameter range of the thermal barrier coating on the surface of the target area in the step: peak power is 1000-4000W, pulse width is 1-4 ms, frequency is 10-60 Hz, and defocus amount is 2-8 mm.

4. The method for directly processing the coated special-shaped hole by using the laser according to claim 1, wherein the method comprises the following steps: the aperture of the processing hole in the step 3 is 1/2 to 2/3 of the aperture of Kong Zhiduan, wherein the defocusing amount in the process of punching in the step 3 is smaller than that in the step 2, and the laser processing parameters in the step 3 range: peak power is 6000-12000W, pulse width is 1-3 ms, frequency is 10-60 Hz, and defocus amount is 0-4 mm.

5. The method for directly processing the coated special-shaped hole by using the laser according to claim 1, wherein the method comprises the following steps: the machining direction of the step 4 is from the center to two sides, and the power of each single pulse is increased and then reduced from the center of the special-shaped hole to the edge of the hole diffusion section; the processing parameter range is as follows: peak power is 2000-6000W, pulse width is 1-3 ms, frequency is 10-60 Hz, and defocus amount is 2-8 mm.

6. The method for directly processing the coated special-shaped hole by using the laser according to claim 1, wherein the method comprises the following steps: the machining direction in the step 5 is performed along the axial lead of the special-shaped hole in a clockwise or anticlockwise direction, and the laser machining parameters range is as follows: peak power 3000-6000W, pulse width 0.5-2.5 ms, frequency 10-60 Hz, defocus amount-1 mm.

7. A method of machining a coated profiled bore directly by laser according to any one of claims 1 to 6, comprising the steps of:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 2000W, pulse width 3ms, frequency 20Hz, defocus 5mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 10000W, pulse width 2ms, frequency 20Hz, defocus 1mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 2000W, pulse width 2ms, frequency 20Hz, defocus 5mm;

step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 5000W, pulse width 1ms, frequency 30Hz, defocus 0mm.

8. A method of machining a coated profiled bore directly by laser according to any one of claims 1 to 6, comprising the steps of:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 1000W, pulse width 1ms, frequency 10Hz, defocus 2mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 6000W, pulse width 1ms, frequency 10Hz, defocus 1mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 2000W, pulse width 1ms, frequency 10Hz, defocus 2mm.

Step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 3000W, pulse width 0.5ms, frequency 10Hz, defocus-1 mm.

9. A method of machining a coated profiled bore directly by laser according to any one of claims 1 to 6, comprising the steps of:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 4000W, pulse width 4ms, frequency 50Hz, defocus 8mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 12000W, pulse width 3ms, frequency 60Hz, defocus 4mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 6000W, pulse width 3ms, frequency 50Hz, defocus 8mm;

step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 6000W, pulse width 2ms, frequency 50Hz, defocus 1mm.

10. A method of machining a coated profiled bore directly by laser according to any one of claims 1 to 6, comprising the steps of:

step 2: secondly, removing the thermal barrier coating on the surface of the target area, starting the plane rotation work of the machine tool, rotating the plane to be vertical to the beam axis, moving the laser spot position on the plane, adopting a defocusing process, and removing the thermal barrier coating on the surface of the target area by a plurality of single-pulse processes to expose the metal matrix; the laser parameters are as follows: peak power 3000W, pulse width 2ms, frequency 40Hz, defocus 6mm;

step 3: perforating, returning laser to the center of a hole to be processed on the side surface of the coating, moving the position of a laser spot and increasing the defocusing amount by a proper amount, and enabling a plurality of continuous pulses to penetrate through a base metal layer so that metal oxides and metal splashes generated by subsequent sweeping pass through the hole, wherein the laser parameters are as follows: peak power 8000W, pulse width 2ms, frequency 30Hz, defocus 3mm;

step 4: sweeping out the shape of the hole diffusion section, returning the laser focus to the center of the hole to be processed on the side surface of the coating, adopting a defocusing process, and alternately and transversely moving a laser head along the center line of the hole towards two ends, wherein a plurality of single pulse processing hole diffusion sections are used in the moving process; the laser parameters are as follows: peak power 4000W, pulse width 2ms, frequency 40Hz, defocus 6mm;

step 5: resetting the laser focus to the center of the hole to be processed on the side surface of the coating, and rotationally cutting the Kong Zhiduan cylindrical hole to a set size by using pulse laser; the laser parameters are as follows: peak power 4000W, pulse width 2ms, frequency 30Hz, defocus 0mm.

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