CN116168898A - Method for producing superconducting tape with small bending diameter, superconducting tape, and superconducting cable - Google Patents
Method for producing superconducting tape with small bending diameter, superconducting tape, and superconducting cable Download PDFInfo
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- CN116168898A CN116168898A CN202310002216.0A CN202310002216A CN116168898A CN 116168898 A CN116168898 A CN 116168898A CN 202310002216 A CN202310002216 A CN 202310002216A CN 116168898 A CN116168898 A CN 116168898A
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- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
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Abstract
The invention provides a preparation method of a superconducting tape with small bending diameter, the superconducting tape and a superconducting cable, comprising the following steps: the preparation step of the buffer layer comprises the following steps: preparing a buffer layer on a superconducting baseband; the preparation step of the superconductive layer comprises the following steps: preparing a superconducting layer on the buffer layer to obtain a superconducting strip; copper plating: and plating a copper layer on the superconducting layer. The invention can greatly reduce the turning diameter of the superconducting strip, thereby improving the performance of the superconducting strip.
Description
This application is a divisional application of the following original applications:
filing date of the original application: 2022, 06
Application number of the original application: 202210631380.3
The invention of the original application creates the name: method for producing superconducting tape with small bending diameter, superconducting tape, and superconducting cable
Technical Field
The invention relates to the field of superconducting materials, in particular to a preparation method of a superconducting tape with a small bending diameter, the superconducting tape and a superconducting cable.
Background
The professor Linang nm at the end of the card at university of Leiden, netherlands, 1911, has been one of the most active leading-edge fields of research in modern science and technology since the first discovery of superconduction in the laboratory. During the past decade, research on high-temperature superconducting power and magnet equipment represented by second-generation high-temperature superconducting tapes has been rapidly developed, and remarkable results are obtained in the fields of superconducting energy storage, superconducting motors, superconducting cables, superconducting current limiters, superconducting transformers, superconducting magnetic levitation, nuclear magnetic resonance and the like.
The second-generation superconducting tape using REBCO (RE is a rare earth element) as a material is also called a coated conductor, and has wider and better application prospect in a plurality of fields such as medical treatment, military, energy sources and the like because of stronger current carrying capacity, higher magnetic field performance and lower material cost compared with a bismuth tie material. Second generation superconducting tapes, because of their own hardness and brittleness as the superconducting current carrying core, are typically produced by a multilayer coating process on a nickel-based alloy substrate, and are also referred to as coated conductors. The second generation superconducting tape is generally composed of a base tape, a buffer layer (transition layer), a superconducting layer, and a protective layer. The function of the metal substrate is to provide the strip with excellent mechanical properties. The transition layer has the function of preventing the mutual diffusion between the superconducting layer and the metal substrate, and the uppermost transition layer is required to provide a good template for the epitaxial growth of the superconducting layer, so that the arrangement quality of REBCO crystal grains is improved. The preparation of coated conductors with excellent superconductive properties requires that the superconductive layer have a uniform biaxial texture. Biaxial texture means that the grains have a nearly uniform arrangement in both a/b and c axes (c axis perpendicular to a/b plane). Since the alignment degree (in-plane texture) of REBCO films in the a/b axis direction is relatively difficult to achieve, the poor in-plane texture severely degrades the superconducting performance. It is therefore desirable that REBCO superconducting films be grown epitaxially on transition layers already having biaxial texture and matching lattice. There are two main technical routes for realizing biaxial texture, one is a rolling assisted biaxial texture baseband technology and the other is an ion beam assisted deposition technology. Common techniques for preparing REBCO superconductive layers are classified into pulse laser deposition, metal organic chemical vapor deposition, reactive co-evaporation, and the like. The REBCO superconducting layer resists compression and stretching.
The protective layer is mainly used for protecting the superconducting film layer, and is generally plated with a silver layer of 0.5-5 mu m on the front and back surfaces of the superconducting strip in a magnetron sputtering or vapor deposition mode, and in order to pursue lower material cost, the silver layer of the superconducting surface is generally arranged at 1-2 mu m, and the silver layer of the non-superconducting surface is generally arranged at 0.5-1 mu m. The strip is cut into strips with the thickness of 10-12 mm and the thickness of 2-8 mm according to the requirements of specific applications on the strip width. And finally, copper plating or subsequent packaging strengthening treatment is carried out. The thickness of the copper plating of the tape for subsequent encapsulation may be 1 to 10 μm. The thickness of copper plating on one side of the copper-plated reinforced strip is 10-30 mu m, and the thickness of copper plating on the other side is 20-60 mu m.
For magnet applications, hot spots have been formed in recent years with compact tokamak controlled nuclear fusion technology. The whole objective of the existing ITER-based low-temperature superconducting research and development route is basically to plan 2050-2060 for building a fusion commercial pile, the device scale is larger and larger, and the building cost, period and risk are all increased sharply. The low Wen Jiangchang characteristic far ultralow temperature superconducting material of the second-generation high temperature superconducting tape is characterized in that the fusion power density of the unit volume of the tokamak fusion reactor is proportional to the power of 4 times of the magnetic field intensity, as the second-generation high temperature superconducting tape mass production age comes, the compact tokamak based on the high temperature superconducting technology route is rapidly raised, the research and development cost is greatly reduced, the period is greatly shortened, and the market application is formed in 2030-2040 years.
In some large magnets, a sufficiently low inductance is required to ensure that the coil voltage remains at a reasonable value during charging or discharging when in use. The reduction in inductance is achieved by reducing the number of turns, which necessitates an increase in the operating current. Large magnets are therefore typically manufactured using cables rather than using a single strip. Numerous institutions have therefore begun to study cables for fusion. However, in order to achieve a significant increase in the power density of the device, how to further increase the engineering critical current density is a problem to be studied from the perspective of the base material.
Cables for compact fusion require higher current densities. This often requires the tape to have a higher critical current density, with each supplier employing a pinning process to achieve the higher current at low temperature Gao Changxia. The cable is required to have no reduction in the flow capacity when bending, which places a demand on the critical turning diameter of the ribbon. If the strip has a smaller turn diameter, which means that the same current carrying capacity can be used to make a cable with a smaller cross-sectional area, a higher critical current density can be achieved.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a preparation method of a superconducting tape with small bending diameter, the superconducting tape and a superconducting cable.
The preparation method of the superconducting tape with small bending diameter provided by the invention comprises the following steps:
the preparation step of the buffer layer comprises the following steps: preparing a buffer layer on a superconducting baseband;
the preparation step of the superconductive layer comprises the following steps: preparing a superconducting layer on the buffer layer to obtain a superconducting strip;
copper plating: and plating a copper layer on the superconducting layer.
Preferably, the buffer layer preparation step includes: the original buffer layer is MgO layer+LaMnO 3 Continued insertion of CeO over the structure of the layer 2 The buffer layer is MgO layer+CeO layer 2 The LaMnO is inserted in the middle of the layer structure 3 A layer for forming MgO layer + LaMnO layer as buffer layer 3 Layer +CeO 2 A layer.
Preferably, the superconducting layer lattice is oriented in the length direction of the tape by [100] or [010] with the angle of transition of the lattice direction being 45 degrees compared to the [110] orientation.
Preferably, the superconducting layer preparation step includes: in a bent state in which the buffer layer is located outside, a superconducting layer is prepared on the buffer layer.
Preferably, the bending means comprises wrapping the superconducting tape with the buffer layer around a roller with the buffer layer facing outwards.
Preferably, the radius of the curved arc surface is 10-20cm.
Preferably, the copper layer is soft copper.
Preferably, the soft copper has a vickers hardness of 130-220HV;
the electroplating solution adopts: 160-230g/L of copper sulfate, 40-90g/L of sulfuric acid and 50-90ml/L of chloride ion, wherein the additive is a copper plating additive taking polyethylene glycolysis as a main body: 4-25ml/L, current density: 1-5ASD, temperature: 25-35 ℃.
Preferably, the superconducting baseband is a thin baseband.
Preferably, the thickness of the thin base band is 30um or less.
Preferably, the copper plating step is one-sided copper plating on the superconducting layer.
Preferably, the single-sided copper plating includes: the thickness of the soft copper on the superconducting layer is 10-20um, and the thickness of the soft copper under the superconducting baseband is 1-5um.
According to the superconducting tape provided by the invention, the superconducting tape with the small bending diameter is prepared by the preparation method.
According to the superconducting cable provided by the invention, the superconducting tape is adopted for preparation.
Compared with the prior art, the invention has the following beneficial effects:
insertion of LaMnO during preparation of buffer layer 3 The layer, thus change the lattice direction of the buffer layer, obtain the advantage of smaller turn diameter.
The superconducting layer is prepared in a bending state, and the superconducting layer of the superconducting tape in a flat state is in a compressed state by utilizing the compression and non-tension characteristics of the superconducting layer material, and can be stretched more when the superconducting tape is in the bending state, so that the turning diameter is reduced.
And (3) plating a copper layer on one side of the superconducting strip to enable the superconducting layer to be closer to the geometric center of the superconducting strip, thereby reducing the turning diameter.
The use of soft copper and a thin base band can further reduce the turning diameter.
The invention can be used for reducing the turning diameter of 4.8mm of the traditional superconducting tape to 1.3mm to 1.1mm.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of a buffer layer;
FIG. 2 shows insertion of LaMnO 3 Schematic diagram of lattice direction before and after layer;
FIG. 3 is a schematic diagram of a method of bending a prepared superconductive layer;
FIG. 4 is a schematic view of the microstructure of a superconductive layer prepared by bending;
FIG. 5 is a workflow diagram of the present invention;
FIG. 6 is a schematic diagram of experimental results of the present invention;
FIG. 7 is a schematic diagram of the critical current drop-off condition of the present invention.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present invention.
Example 1
As shown in fig. 1, the method for preparing a superconducting tape with a small bending diameter provided by the invention comprises the following steps:
the preparation step of the buffer layer comprises the following steps: preparing a buffer layer on a superconducting base band, and inserting LaMnO in the process of preparing the buffer layer 3 A layer.
The preparation step of the superconductive layer comprises the following steps: preparing a superconducting layer on the buffer layer to obtain a superconducting strip;
copper plating: and plating a copper layer on the superconducting layer.
A structure of the buffer layer is shown in FIG. 1 and comprises Al sequentially plated on the superconducting base tape 2 O 3 Layer, mgO layer, laMnO 3 Layer, ceO 2 Layers, but the invention is not limited in this regard. Specifically, the original buffer layer is MgO layer+LaMnO 3 Continued insertion of CeO over the structure of the layer 2 The buffer layer is MgO layer+CeO layer 2 The LaMnO is inserted in the middle of the layer structure 3 A layer for forming MgO layer + LaMnO layer as buffer layer 3 Layer +CeO 2 A layer.
As shown in FIG. 2, no LaMnO is inserted 3 In the layer, ceO 2 The lattice directions of the layers and the superconductive layers are shown on the left side, and are arranged transversely and longitudinally, and LaMnO is inserted 3 After the layer, the lattice of the superconducting layer is [100] along the length direction of the strip]Or [010]]Orientation compared to [110]]The orientation and the lattice direction are rotated 45 degrees.
Compared with the traditional standard superconducting tape with the bending diameter of 4.8mm, the embodiment can reduce the bending diameter to 4.0mm, and the critical strain is improved from 0.4% to 0.6%.
Example 2
The preparation step of the buffer layer comprises the following steps: a buffer layer is prepared on the superconducting base tape.
The preparation step of the superconductive layer comprises the following steps: in a bending state that the buffer layer is positioned at the outer side, preparing a superconducting layer on the buffer layer, wherein the radius of a bent cambered surface is 10-20cm, and obtaining a superconducting strip;
copper plating: and plating a copper layer on the superconducting layer.
One implementation of preparing the superconductive layer is shown in fig. 3, in which the superconductive base tape with the buffer layer is wound around a roller, so that the buffer layer is coated on the superconductive layer outwards, and the roller in the figure can rotate clockwise, thereby realizing dynamic coating of the superconductive layer. It can be seen from fig. 4 that the bend-plated superconductive layer is less near the buffer layer, i.e. less in the case of smaller bend diameters and more in the case of larger bend diameters.
The present embodiment can reduce the bend diameter to 3.8mm compared to a conventional standard superconducting tape with a bend diameter of 4.8 mm.
Example 3
The preparation step of the buffer layer comprises the following steps: a buffer layer is prepared on the superconducting base tape.
The preparation step of the superconductive layer comprises the following steps: preparing a superconducting layer on the buffer layer to obtain a superconducting strip;
copper plating: and plating a copper layer on one side of the superconducting layer, wherein the thickness of soft copper on the superconducting layer is 10-20um, and the thickness of soft copper under the superconducting baseband is 1-5um. The single-sided plating method comprises the steps of sticking polyimide adhesive tape on the back surface of the superconducting tape in advance, then carrying out copper plating, and removing the adhesive tape after the copper plating is completed.
The present embodiment can reduce the bend diameter to 3.7mm compared to a conventional standard superconducting tape with a bend diameter of 4.8 mm.
Example 4
The preparation step of the buffer layer comprises the following steps: a buffer layer is prepared on the superconducting base tape.
The preparation step of the superconductive layer comprises the following steps: preparing a superconducting layer on the buffer layer to obtain a superconducting strip;
copper plating: plating a soft copper layer on the superconducting layer.
The present embodiment can reduce the bend diameter to 3.8mm compared to a conventional standard superconducting tape with a bend diameter of 4.8 mm.
Example 5
The preparation step of the buffer layer comprises the following steps: a buffer layer is prepared on the superconducting base tape. In this embodiment, the superconducting base tape is a thin base tape having a thickness of 30 μm or 25. Mu.m.
The preparation step of the superconductive layer comprises the following steps: preparing a superconducting layer on the buffer layer to obtain a superconducting strip;
copper plating: and plating a copper layer on the superconducting layer.
The present embodiment can reduce the bend diameter to 4.1mm compared to a conventional standard superconducting tape of 4.8mm bend diameter.
Example 6
This example is a combination of the schemes of examples 1 to 5, and one skilled in the art can also use any number of combinations of examples 1 to 5. As shown in fig. 5, the specific preparation steps include:
the preparation step of the buffer layer comprises the following steps: preparing a buffer layer on a superconducting base band, and inserting LaMnO in the process of preparing the buffer layer 3 The layer, superconductive baseband adopts thin baseband, thickness less than or equal to 30 μm.
The preparation step of the superconductive layer comprises the following steps: in a curved state where the buffer layer is located outside, a superconducting layer is prepared on the buffer layer to obtain a superconducting tape, and the thickness of the superconducting layer of this embodiment is 2 μm.
Copper plating: plating a soft copper layer on the buffer layer, and then plating hard copper on one side.
The superconducting tape obtained in this example was subjected to a bending diameter test, and as shown in FIG. 6, the minimum bending diameter of the superconducting tape could be 1.3mm to 1.1mm. As shown in fig. 7, the solid points are critical current dip under the strain load of the present invention, and the open points are critical current dip under the coil strain load.
The superconducting tape prepared by the invention can be further prepared into superconducting cables with various topological structures, such as the Twisted Stacked Tape Cable, the Conductor On Round Core (CORC), the Roebel Assembled Coated Conductor (RACC) cable.
In the description of the present application, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a specific orientation, be configured and operated in a specific orientation, and are not to be construed as limiting the present application.
The foregoing describes specific embodiments of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without affecting the spirit of the invention. The embodiments of the present application and features in the embodiments may be combined with each other arbitrarily without conflict.
Claims (10)
1. A method of preparing a superconducting tape having a small bending diameter, comprising:
the preparation step of the buffer layer comprises the following steps: preparing a buffer layer on a superconducting baseband;
the preparation step of the superconductive layer comprises the following steps: preparing a superconducting layer on the buffer layer to obtain a superconducting strip;
copper plating: plating a copper layer on the superconducting layer;
the buffer layer preparation step comprises the following steps: the original buffer layer is MgO layer+LaMnO 3 Continued insertion of CeO over the structure of the layer 2 The buffer layer is MgO layer+CeO layer 2 The LaMnO is inserted in the middle of the layer structure 3 A layer for forming MgO layer + LaMnO layer as buffer layer 3 Layer +CeO 2 A layer.
2. The method of producing a superconducting tape having a small bending diameter according to claim 1, wherein the lattice of the superconducting layer is oriented in [100] or [010] along the length direction of the tape, and the angle of the lattice direction transition is 45 degrees as compared with the [110] orientation.
3. The method of producing a superconducting tape having a small bending diameter according to claim 1, wherein the copper layer is soft copper.
4. A method of producing a superconducting tape having a small bending diameter according to claim 3, wherein the soft copper has a vickers hardness of 130-220HV;
the electroplating solution adopts: 160-230g/L of copper sulfate, 40-90g/L of sulfuric acid and 50-90ml/L of chloride ion, wherein the additive is a copper plating additive taking polyethylene glycolysis as a main body: 4-25ml/L, current density: 1-5ASD, temperature: 25-35 ℃.
5. The method of producing a superconducting tape of small bending diameter according to claim 1, wherein the superconducting base tape is a thin base tape.
6. The method of producing a superconducting tape having a small bending diameter according to claim 5, wherein the thickness of the thin base tape is 30um or less.
7. The method for producing a superconducting tape having a small bending diameter according to claim 1, wherein the copper plating step is to single-side copper-plate the superconducting layer.
8. The method for producing a superconducting tape having a small bending diameter according to claim 3, wherein the single-sided copper plating comprises: the thickness of the soft copper on the superconducting layer is 10-20um, and the thickness of the soft copper under the superconducting baseband is 1-5um.
9. A superconducting tape, characterized by being produced by the method for producing a superconducting tape having a small bending diameter according to any one of claims 1 to 8.
10. A superconducting cable, characterized in that it is produced using the superconducting tape according to claim 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310002216.0A CN116168898A (en) | 2022-06-06 | 2022-06-06 | Method for producing superconducting tape with small bending diameter, superconducting tape, and superconducting cable |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310002216.0A CN116168898A (en) | 2022-06-06 | 2022-06-06 | Method for producing superconducting tape with small bending diameter, superconducting tape, and superconducting cable |
| CN202210631380.3A CN114843044B (en) | 2022-06-06 | 2022-06-06 | Method for preparing small-bending-diameter superconducting tape, superconducting tape and superconducting cable |
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| CN202310002216.0A Pending CN116168898A (en) | 2022-06-06 | 2022-06-06 | Method for producing superconducting tape with small bending diameter, superconducting tape, and superconducting cable |
| CN202310001839.6A Pending CN116110657A (en) | 2022-06-06 | 2022-06-06 | Method for producing superconducting tape with small bending diameter, superconducting tape, and superconducting cable |
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| WO2016130975A2 (en) * | 2015-02-13 | 2016-08-18 | Alexander Otto | Reinforced 2212 multifilament superconducting wire with low aspect shape, cables thereof, and 2223 silver tape-based cables |
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