CN116153955A - Display panel and preparation method thereof - Google Patents
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- CN116153955A CN116153955A CN202111391194.9A CN202111391194A CN116153955A CN 116153955 A CN116153955 A CN 116153955A CN 202111391194 A CN202111391194 A CN 202111391194A CN 116153955 A CN116153955 A CN 116153955A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display panel and a preparation method of the display panel, wherein the display panel comprises the following components: the backboard comprises a binding part; the light-emitting element is arranged on one side of the backboard and comprises a body part and a connecting electrode which are connected; the connecting electrode is provided with a notch on one side facing the backboard, and is at least partially embedded into the binding part. Through set up the breach in the one side of connecting electrode towards the backplate in order to reduce the just to the area of connecting electrode and binding portion, can effectively reduce the resistance that connecting electrode received when embedding in the binding portion, avoid light emitting component to appear empting, the offset scheduling problem, improved the stability when light emitting component and backplate are connected.
Description
Technical Field
The invention belongs to the technical field of electronic products, and particularly relates to a display panel and a preparation method of the display panel.
Background
The light emitting diode (Light Emitting Diode, LED) is widely used in the technical fields of illumination, display, etc. due to its advantages of small size, low power, long service life, high brightness, etc. The micro LED display has an LED array of individual pixel elements, which has better contrast, faster response speed and lower power consumption than the display devices widely used at present.
Since micro LEDs are individually manufactured in the form of chips, the size is in the order of micrometers. The LED chip is limited by the existing technological process, materials and an LED structure, the risk of rollover occurs in the laser stripping process, and the binding effect between the LED and the backboard cannot meet the requirements.
Therefore, a new display panel and a method for manufacturing the display panel are needed.
Disclosure of Invention
The embodiment of the invention provides a display panel and a preparation method of the display panel, which can effectively reduce the resistance born by a connecting electrode when the connecting electrode is embedded into a binding part, avoid the problems of toppling, position deviation and the like of a light-emitting element and improve the stability of the light-emitting element when the light-emitting element is connected with a backboard by arranging a notch to reduce the opposite area of the connecting electrode and the binding part.
In one aspect, an embodiment of the present invention provides a display panel, including: a back plate including a binding portion; the light-emitting element is arranged on one side of the backboard and comprises a body part and a connecting electrode which are connected with each other; the connecting electrode is provided with a notch on one side facing the backboard, and the connecting electrode is at least partially embedded into the binding part.
According to one aspect of the invention, the connecting electrode has an annular structure, and at least part of the notch is arranged in an area surrounded by the annular structure and the body part.
According to one aspect of the invention, the orthographic projection of the connecting electrode on the backboard is in a closed ring shape; orthographic projection of the connecting electrode on the backboard is in a circular shape.
According to one aspect of the invention, the orthographic projection of the body part on the backboard is circular, and the width of the connecting electrode is less than or equal to one third of the radius of the body part; the width of the connecting electrode is 1-50 μm.
In another aspect, the embodiment of the invention provides a method for preparing a display panel, which includes the following steps: providing a first substrate and a backboard; forming a light-emitting element on one side of the first substrate, wherein the light-emitting element comprises a body part and a connecting electrode which are connected, the body part is connected with the first substrate, the connecting electrode is arranged on one side of the body part, which is away from the first substrate, and the connecting electrode is provided with a notch and is in an annular structure; separating the first substrate and the light emitting element; and providing a back plate, transferring the light-emitting element through a second substrate and enabling the connecting electrode part to be embedded in a binding part of the back plate.
According to another aspect of the present invention, the step of forming a light emitting element on the first substrate side and the step of separating the first substrate from the light emitting element further include: and providing a third substrate, wherein the third substrate is provided with a bonding adhesive layer, and the connecting electrode of the light-emitting element is embedded and fixed on the bonding adhesive layer.
According to another aspect of the present invention, between the step of separating the first substrate and the light emitting element and the step of transferring the light emitting element through the second substrate and fitting the connection electrode portion to the binding portion of the back plate, further comprises: and removing the bonding adhesive layer surrounding the connection electrode, and transferring the light-emitting element from the third substrate through the second substrate.
According to another aspect of the present invention, in the step of removing the bonding adhesive layer surrounding the connection electrode, it includes: and etching the bonding adhesive layer surrounding the connecting electrode through an etching process, and reserving the bonding adhesive layer in the connecting electrode.
According to another aspect of the present invention, in the step of forming a light emitting element on the first substrate: the body portion comprises gallium nitride or gallium arsenide, and the connection electrode comprises at least one of gold, chromium, and platinum.
According to another aspect of the present invention, in the step of forming a light emitting element on the first substrate: the connection electrode is formed on the body portion by a metal thermal evaporation process.
Compared with the prior art, the display panel provided by the embodiment of the invention comprises the back plate and the light-emitting element, the binding part is arranged on the back plate, the connecting electrode of the light-emitting element is at least partially embedded in the binding part, and a notch is arranged on one side of the connecting electrode facing the back plate, so that the right facing area of the connecting electrode and the binding part is reduced by arranging the notch, the resistance born by the connecting electrode when the connecting electrode is embedded in the binding part can be effectively reduced, the problems of toppling, position deviation and the like of the light-emitting element are avoided, and the stability when the light-emitting element is connected with the back plate is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of one of the light emitting elements of FIG. 1;
FIG. 3 is a top view of one of the light emitting elements of FIG. 1;
fig. 4 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a display panel according to an embodiment of the present invention in a manufacturing process;
FIG. 6 is a schematic diagram of another display panel according to an embodiment of the present invention;
FIG. 7 is a schematic diagram illustrating a structure of a display panel according to another embodiment of the present invention;
FIG. 8 is a schematic diagram illustrating a structure of a display panel according to another embodiment of the present invention;
fig. 9 is a schematic structural diagram of another display panel according to an embodiment of the present invention in the manufacturing process.
In the accompanying drawings:
1-a back plate; 11-binding part; a 2-light emitting element; 21-a body portion; 22-connecting electrodes; 3-a first substrate; 4-a second substrate; 5-a third substrate; 51-a bonding adhesive layer; k-notch.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are merely configured to illustrate the invention and are not configured to limit the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by showing examples of the invention.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
It will be understood that when a layer, an area, or a structure is described as being "on" or "over" another layer, another area, it can be referred to as being directly on the other layer, another area, or another layer or area can be included between the layer and the other layer, another area. And if the component is turned over, that layer, one region, will be "under" or "beneath" the other layer, another region.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims (the claims) and their equivalents. The embodiments provided by the embodiments of the present invention may be combined with each other without contradiction.
Embodiments of the present invention provide a display panel and a method for manufacturing a display panel, and embodiments of the display panel and the method for manufacturing a display panel will be described below with reference to fig. 1 to 9 of the accompanying drawings.
Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the invention; FIG. 2 is a cross-sectional view of one of the light emitting elements of FIG. 1; FIG. 3 is a top view of one of the light emitting elements of FIG. 1; . An embodiment of the present invention provides a display panel including: a back plate 1, the back plate 1 including a binding portion 11; the light-emitting element 2 is arranged on one side of the back plate 1, the light-emitting element 2 comprises a body part 21 and a connecting electrode 22 which are connected, wherein a notch K is formed on one side of the connecting electrode 22 facing the back plate 1, and the connecting electrode 22 is at least partially embedded in the binding part 11.
The display panel provided by the embodiment of the invention comprises the back plate 1 and the light-emitting element 2, wherein the binding part 11 is arranged on the back plate 1, the connecting electrode 22 of the light-emitting element 2 is at least partially embedded into the binding part 11, a notch K is arranged on one side of the connecting electrode 22 facing the back plate 1, and the opposite areas of the connecting electrode 22 and the binding part 11 are reduced by arranging the notch K, so that the resistance born by the connecting electrode 22 when the connecting electrode 22 is embedded into the binding part 11 can be effectively reduced, the problems of toppling, position deviation and the like of the light-emitting element 2 are avoided, and the stability when the light-emitting element 2 is connected with the back plate 1 is improved.
The light emitting element 23 may be specifically a Micro LED (Micro Light Emitting Diode ) or a Mini LED (small light emitting diode). The Micro LED and the Mini LED have the advantages of small size, high luminous efficiency, low energy consumption and the like, the size of the Micro LED is smaller than 50 mu m, the size of the Mini LED is smaller than 100 mu m, and the figures and the patterns can be clearly displayed on a smaller display panel.
The LED chip structure is divided into a normal structure, a vertical structure and a flip-chip structure. The embodiment of the invention is applicable to LEDs with normal structure, vertical structure and flip-chip structure. The embodiment of the present invention will be described by taking an LED chip having a vertical structure as an example of the light emitting element 2.
Since the positive and negative electrodes of the vertical structure are separately disposed at two sides, only one electrode of the light emitting element 2 of the vertical structure is disposed at one side facing the back plate 1, and the size of the electrode facing the back plate 1 is relatively large, so that the injection range of the current can be increased, but the side turnover risk of the light emitting element 2 occurs in the subsequent laser lift-off process. In addition, since the electrode area is relatively large, the adhesion between the light emitting element 2 and the temporary substrate for temporarily fixing the light emitting element 2 in the laser lift-off process is increased, which causes great difficulty in the subsequent pick-up process. Thus, in this embodiment, the notch K may be disposed on the side of the connection electrode 22 facing the back plate 1, so as to reduce the area of the electrode, improve the stability of the light emitting element 2 in the laser lift-off process, and facilitate the subsequent pick-up process.
Alternatively, the body portion 21 of the light emitting element 2 includes a sapphire substrate or a gallium arsenide substrate, gaN (gallium nitride) or GaAs (gallium arsenide) layer, and the connection electrode 22 includes a P electrode and an N electrode.
Alternatively, the back plate 1 may be a PCB (Printed Circuit Board ) back plate 1, LTPS (Low Temperature Poly-Silicon, low temperature polysilicon) back plate 1, CMOS (Complementary Metal Oxide Semiconductor ) back plate 1, IGZO (Indium Gallium Zinc Oxide, indium gallium zinc oxide) back plate 1, or the like. The bonding portion 11 on the back plate 1 may be formed by using a solder, and the metal solder may be an elemental metal such as indium (In), tin (Sn), copper (Cu), or the like, or may be an alloy solder such as an In/Sn alloy, an In/Sn/Bi alloy, or the like.
Alternatively, the back plate 1 includes a plurality of pixel circuits (not shown in the drawings) including a driving transistor, and the binding portion 11 is electrically connected to one of the source and the drain of the driving transistor.
It should be noted that, the driving transistor may specifically be a thin film transistor, where the thin film transistor includes a gate electrode, a source electrode, a drain electrode, a source electrode, and a gate electrode, and the material of the thin film transistor may include one or more of molybdenum, titanium, aluminum, copper, and the like. The gate electrode of the thin film transistor is generally used for receiving a control signal, so that the thin film transistor is turned on or off under the control of the control signal. One of the source and the drain of the thin film transistor is connected to the binding portion 11, and is further connected to the connection electrode 22 of the light emitting element 2 through the binding portion 11 to control the normal light emission of the light emitting element 2.
In some alternative embodiments, the connection electrode 22 has an annular structure, and at least a portion of the notch K is disposed in an area surrounded by the annular structure and the body portion 21.
The connection electrode 22 has a ring-shaped structure; specifically, the orthographic projection of the connection electrode 22 on the back plate 1 is annular, that is, the connection electrode 22 is hollow, and the notch K is a hollow portion of the connection electrode 22.
The connection electrode 22 may be in a closed ring shape, for example, a complete ring shape or a rectangular ring shape, or may be in an unsealed ring shape, for example, the connection electrode 22 may be provided with a plurality of openings, and the like, and is not particularly limited.
As shown in fig. 2, specifically, the orthographic projection of the connection electrode 22 on the back plate 1 is in a closed ring shape; optionally, the orthographic projection of the connection electrode 22 on the back plate 1 is in a ring shape. It can be appreciated that, since the body portion 21 of the light emitting element 2 is generally cylindrical, in order to match the shape of the body portion 21 of the light emitting element 2, the shape is convenient, in this embodiment, the connection electrode 22 has a circular ring structure, and the symmetry of the circular ring is better, so that the stability of the light emitting element 2 and the back plate 1 when connected can be further improved.
As shown in fig. 2 and 3, to further facilitate stable embedding of the light emitting element 2 into the binding portion 11, in some alternative embodiments, the orthographic projection of the body portion 21 on the back plate 1 is circular, and the width a of the connecting electrode 22 in the orthographic projection is less than or equal to one third of the radius of the body portion 21.
It will be appreciated that the width a of the connection electrode 22 in the shape of a circular ring, i.e., the difference between the outer radius of the connection electrode 22 and the inner radius of the connection electrode 22, i.e., the width of the connection electrode 22 in the direction along the center of the body portion 21 toward the connection electrode 22. The larger the width a of the connection electrode 22 in the shape of a circular ring, the larger the resistance when the connection electrode 22 is embedded in the binding portion 11, and at the same time, the larger the adhesion force of the light emitting element 2 and the temporary substrate for temporarily fixing the light emitting element 2 in the pick-up process, which is disadvantageous for the separation of the light emitting element 2 and the temporary substrate. While considering that the width a of the circular ring-shaped connection electrode 22 also affects the stability of the light emitting element 2 when it is fixed, the width a of the connection electrode 22 in the shape of a circular ring in front projection is optionally equal to one third of the radius of the body portion 21.
It will be appreciated that the dimensions of the connection electrode 22, such as the width a, are chosen according to the desired physical dimensions of the light emitting element 2, since the Micro LEDs are smaller than 50 μm and the Mini LEDs are smaller than 100 μm, alternatively the connection electrode 22, which is in the shape of a circular ring in front projection, has a width a of 1 μm to 50 μm.
Referring to fig. 4, the embodiment of the invention further provides a method for manufacturing a display panel, which includes the following steps:
s110: providing a first substrate 3 and a back plate 1;
s120: forming a light-emitting element 2 on one side of a first substrate 3, wherein the light-emitting element 2 comprises a body part 21 and a connecting electrode 22 which are connected, the body part 21 is connected with the first substrate 3, the connecting electrode 22 is arranged on one side of the body part 21 away from the first substrate 3, and the connecting electrode 22 is provided with a notch K as shown in fig. 5; optionally, the connection electrode 22 has an annular structure, and at least a portion of the notch K is formed in an area surrounded by the annular structure and the body portion 21.
S130: separating the first substrate 3 and the light emitting element 2;
s140: the light emitting element 2 is transferred through the second substrate 4 and the connection electrode 22 is partially fitted to the binding portion 11 of the back plate 1, as shown in fig. 6.
According to the manufacturing method of the display panel provided by the embodiment of the invention, the notch K is formed on the side, facing the backboard 1, of the connecting electrode 22, and the opposite area of the connecting electrode 22 and the binding portion 11 is reduced by arranging the notch K, so that the resistance applied when the connecting electrode 22 is embedded into the binding portion 11 can be effectively reduced, the problems of toppling, position deviation and the like of the light-emitting element 2 are avoided, and the stability when the light-emitting element 2 is connected with the backboard 1 is improved. At the same time, the stability of the light-emitting element 2 can be improved when the first substrate 3 and the light-emitting element 2 are separated, and the problems of rollover and the like can be avoided.
In step S110, the first substrate 3, i.e., the growth substrate of the light emitting element 2, is used to form the light emitting element 2, and the first substrate 3 may be made of a material such as sapphire or gallium arsenide, depending on the color of the light emitting element 2.
In step S120, the light-emitting element 2 is formed on the first substrate 3, the material of the body portion 21 of the light-emitting element 2 may be GaN (gallium nitride) or GaAs (gallium arsenide), and the connection electrode 22 may be deposited on the body portion 21 by a metal thermal deposition process, but the connection electrode 22 may be formed by another process, and is not particularly limited. The connection electrode 22 may have a ring-shaped structure, specifically, may have a circular ring, a square ring, or the like, or may have a closed ring or a non-closed ring, that is, an open ring, or the like, and is not particularly limited. Optionally, the connection electrode 22 comprises at least one of gold, chromium, platinum.
In step S130, the GaN layers of the light emitting element 2 and the first substrate 3 are decomposed by means of laser irradiation, which may be DPSS (Diode Pumped Solid State laser, all solid-state semiconductor laser) laser or excimer laser, in particular. DPSS lasers have great flexibility in terms of modulating pulse shape, repetition rate, beam quality, etc., and the harmonics that they generate allow a user to obtain a shorter wavelength beam suitable for multiple material processing.
In step S140, the binding portion 11 of the back plate 1 may be formed of a metal solder material to ensure the electrical connection effect with the light emitting element 2, and the binding portion 11 may be formed of an elemental metal such as indium (In), tin (Sn), copper (Cu), or the like, or an alloy solder such as an In/Sn alloy, an In/Sn/Bi alloy, or the like. The connection electrode 22 having a ring-like structure is embedded in the bonding portion 11, which is solder on the back plate 1, under pressure, and then the light emitting element 2 and the back plate 1 are electrically connected by a reflow process.
Referring to fig. 7, in order to temporarily fix the light emitting element 2 when separating the first substrate 3 from the light emitting element 2, in some alternative embodiments, between the step of forming the light emitting element 2 on the first substrate 3 and the step of separating the first substrate 3 from the light emitting element 2, further includes: the third substrate 5 is provided, and the third substrate 5 has a bonding adhesive layer 51, so that the connection electrode 22 of the light emitting element 2 is embedded and fixed in the bonding adhesive layer 51.
It should be noted that, because the connection electrode 22 is in a ring structure and has a hollow space, when the resistance of the connection electrode 22 when being embedded into the bonding adhesive layer 51 is effectively reduced, part of the bonding adhesive layer 51 also enters the hollow space of the connection electrode 22 to play a role in supporting and fixing the light-emitting element 2, so that the problem that the light-emitting element 2 is laterally turned over in the process of separating the first substrate 3 from the light-emitting element 2 by laser is effectively avoided, the stability of the center of gravity of the light-emitting element 2 is improved, and the stability of the light-emitting element 2 and the bonding adhesive layer 51 is further improved. The bonding adhesive layer 51 may be formed of a polymer material such as epoxy, polyurethane, PDMS (Polydimethylsiloxane), or the like.
Referring to fig. 8 and 9, in order to transfer the light emitting element 2 to the back plate 1, the bonding adhesive layer 51 and the light emitting element 2 need to be separated, and in some alternative embodiments, between the step of separating the first substrate 3 and the light emitting element 2 and the step of transferring the light emitting element 2 through the second substrate 4 and partially fitting the connection electrode 22 to the binding portion 11 of the back plate 1, the method further includes: the bonding adhesive layer 51 surrounding the connection electrode 22 is removed and the light emitting element 2 is transferred from the third substrate 5 through the second substrate 4.
The bonding adhesive layer 51 surrounding the connection electrode 22 is removed to separate the light emitting element 2 from the third substrate 5, and the second substrate 4 may be a PDMS, electrostatic, electromagnetic, vacuum, or other type transfer substrate, and the light emitting element 2 on the third substrate 5 is picked up by using an adhesive force or electrostatic force.
Referring to fig. 9, optionally, the step of removing the bonding adhesive layer 51 surrounding the connection electrode 22 includes: the bonding adhesive layer 51 surrounding the connection electrode 22 is etched by an etching process, and the bonding adhesive layer 51 within the connection electrode 22 remains. The connection electrode 22 with the annular structure can protect the bonding adhesive layer 51 in the ring from being over etched, and improve the etching stability and uniformity, thereby being beneficial to the yield of the etching process. Specifically, the etching material used in the etching process may be a solution, etching strong acid, strong alkali or organic solution, or a gas etching material such as O2, ar, etc.
It can be understood that after the bonding adhesive layer 51 surrounding the connection electrode 22 is etched by the etching process, the bonding adhesive layer 51 in the connection electrode 22 remains, so that the bonding adhesive layer 51 in the connection electrode 22 can also play a role of supporting the light-emitting element 2 in the process of picking up the light-emitting element 2 by the second substrate 4, the success rate of picking up the light-emitting element 2 by the second substrate 4 is improved, and the problems of position deviation or rollover and the like of the light-emitting element 2 when the light-emitting element 2 is picked up by the second substrate 4 are avoided, so that the alignment accuracy of the light-emitting element 2 and the backboard 1 is affected.
Because the area of the connecting electrode 22 embedded into the bonding adhesive layer 51 with the annular structure is smaller than the area of the connecting electrode 22 embedded into the bonding adhesive layer 51 with the whole surface, the adhesive force between the connecting electrode 22 and the bonding adhesive layer 51 is effectively reduced, the difficulty of picking up the light-emitting element 2 by the second substrate 4 is reduced, and the success rate of picking up the light-emitting element 2 by the second substrate 4 is further improved.
The method for manufacturing a display panel provided by the embodiment of the present invention has the technical effects of the technical scheme of the display panel in any of the above embodiments, and the same or corresponding structures and explanations of terms as those of the above embodiments are not repeated herein. The display panel provided by the embodiment of the invention can be a mobile phone or any electronic product with a display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, vehicle-mounted display, medical equipment, industrial control equipment, touch interactive terminal, etc., which are not particularly limited in this embodiment of the invention.
In the foregoing, only the specific embodiments of the present invention are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present invention is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present invention, and they should be included in the scope of the present invention.
It should also be noted that the exemplary embodiments mentioned in this disclosure describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, or may be performed in a different order from the order in the embodiments, or several steps may be performed simultaneously.
Claims (10)
1. A display panel, comprising:
a back plate including a binding portion;
the light-emitting element is arranged on one side of the backboard and comprises a body part and a connecting electrode which are connected with each other;
the connecting electrode is provided with a notch on one side facing the backboard, and the connecting electrode is at least partially embedded into the binding part.
2. The display panel according to claim 1, wherein the connection electrode has a ring structure, and at least a part of the notch is disposed in an area surrounded by the ring structure and the body portion.
3. The display panel according to claim 1 or 2, wherein the orthographic projection of the connection electrode on the back plate is in a closed ring shape;
preferably, the orthographic projection of the connecting electrode on the backboard is in a circular shape.
4. A display panel according to claim 3, wherein the orthographic projection of the body portion on the back plate is circular, and the width of the connection electrode is less than or equal to one third of the radius of the body portion;
preferably, the width of the connection electrode is 1 μm to 50 μm.
5. A method for manufacturing a display panel, comprising the steps of:
providing a first substrate and a backboard;
forming a light-emitting element on one side of the first substrate, wherein the light-emitting element comprises a body part and a connecting electrode which are connected, the body part is connected with the first substrate, the connecting electrode is arranged on one side of the body part, which is away from the first substrate, and the connecting electrode is provided with a notch;
separating the first substrate and the light emitting element;
the light emitting element is transferred through the second substrate and the connection electrode portion is fitted to the binding portion of the back plate.
6. The method of manufacturing a display panel according to claim 5, wherein between the step of forming a light emitting element on the first substrate side and the step of separating the first substrate and the light emitting element, further comprising:
and providing a third substrate, wherein the third substrate is provided with a bonding adhesive layer, and the connecting electrode of the light-emitting element is embedded and fixed on the bonding adhesive layer.
7. The method of manufacturing a display panel according to claim 6, wherein between the step of separating the first substrate and the light emitting element and the step of transferring the light emitting element through the second substrate and fitting the connection electrode portion to the binding portion of the back plate, further comprises:
and removing the bonding adhesive layer surrounding the connection electrode, and transferring the light-emitting element from the third substrate through the second substrate.
8. The method of manufacturing a display panel according to claim 7, wherein the step of removing the bonding adhesive layer surrounding the connection electrode comprises:
and etching the bonding adhesive layer surrounding the connecting electrode through an etching process, and reserving the bonding adhesive layer in the connecting electrode.
9. The method of manufacturing a display panel according to claim 5, wherein in the step of forming a light emitting element on the first substrate:
the body portion comprises gallium nitride or gallium arsenide, and the connection electrode comprises at least one of gold, chromium, and platinum.
10. The method of manufacturing a display panel according to claim 5, wherein in the step of forming a light emitting element on the first substrate:
the connection electrode is formed on the body portion by a metal thermal evaporation process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111391194.9A CN116153955A (en) | 2021-11-23 | 2021-11-23 | Display panel and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111391194.9A CN116153955A (en) | 2021-11-23 | 2021-11-23 | Display panel and preparation method thereof |
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| CN116153955A true CN116153955A (en) | 2023-05-23 |
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