CN116141214A - Preparation method of recyclable mixed abrasive polishing film - Google Patents
Preparation method of recyclable mixed abrasive polishing film Download PDFInfo
- Publication number
- CN116141214A CN116141214A CN202210934985.XA CN202210934985A CN116141214A CN 116141214 A CN116141214 A CN 116141214A CN 202210934985 A CN202210934985 A CN 202210934985A CN 116141214 A CN116141214 A CN 116141214A
- Authority
- CN
- China
- Prior art keywords
- abrasive
- tpe
- micron
- sized
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 67
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 45
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 17
- 150000002910 rare earth metals Chemical class 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000005266 casting Methods 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 3
- 239000002245 particle Substances 0.000 claims description 10
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 7
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims description 4
- 150000001336 alkenes Chemical class 0.000 claims description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 2
- 150000001993 dienes Chemical class 0.000 claims description 2
- 229910003443 lutetium oxide Inorganic materials 0.000 claims description 2
- MPARYNQUYZOBJM-UHFFFAOYSA-N oxo(oxolutetiooxy)lutetium Chemical compound O=[Lu]O[Lu]=O MPARYNQUYZOBJM-UHFFFAOYSA-N 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229920002397 thermoplastic olefin Polymers 0.000 claims 1
- 238000001125 extrusion Methods 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000003754 machining Methods 0.000 abstract description 5
- 239000000919 ceramic Substances 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000004575 stone Substances 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 21
- 235000012431 wafers Nutrition 0.000 description 8
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 238000012876 topography Methods 0.000 description 5
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000003082 abrasive agent Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007596 consolidation process Methods 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000002407 reforming Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229920001222 biopolymer Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a preparation method of a recyclable mixed abrasive polishing film, which comprises the following steps: (1) Heating a thermoplastic elastomer (TPE) to a molten state to obtain a molten state TPE; (2) Uniformly mixing a micron-sized hard abrasive and a micron-sized rare earth abrasive to prepare a mixed abrasive; (3) uniformly mixing the mixed abrasive with the molten TPE; (4) Extruding and casting the material obtained in the step (3) to obtain the mixed abrasive polishing film. The mixed abrasive polishing film prepared by the invention has wide application range, is widely applicable to ceramic substrate polishing, flat stone surface polishing, semiconductor wafer polishing and precision machining of large-size planes, can be formed again by a simple extrusion casting method after being heated to a molten state under the condition of damage, and greatly reduces the preparation cost.
Description
Technical Field
The invention belongs to the technical field of ultra-precise machining tools, and particularly relates to a preparation method of a recyclable mixed abrasive polishing film.
Background
Currently in the field of ultra-precision machining, particularly polishing machining. Chemical mechanical polishing is used as the main stream method of polishing at present, different chemical reagents are added into polishing liquid, and the abrasive particles and the workpiece generate partial chemical reaction in the chemical reagent environment, so that the surface hardness of the workpiece is reduced, the quality of the processed surface can be improved, and the processing efficiency can also be improved. In terms of abrasive use, there are two types of free abrasive polishing and fixed abrasive polishing. Better surface quality can be obtained by polishing with a fixed abrasive, but the problems of scratch, serious damage to tools and the like can be caused. The free abrasive cannot control the track of the abrasive particles, so that the processing efficiency is low and the processing effect is poor. At present, a plurality of processing methods are to add high-hardness abrasive materials into a polishing film in a consolidation way, then to prepare slurry of micron-sized rare earth abrasive materials, and to prepare polishing liquid by mixing the slurry with various chemical reagents according to a proportion, so that the process is complicated and the storage is difficult. When the micron-sized rare earth abrasive is independently used as polishing abrasive, the processing effect is poor no matter the abrasive is added into a polishing film by using a consolidation method or is prepared into a free slurry form, and the requirements of no scratch and no surface defect on the surface processing of a wafer cannot be met at present. Meanwhile, after the polishing film of the fixed abrasive is used, the situation that the high polymer material and abrasive particles fall off can occur, so that the processing effect is poor, the service life is short, and the waste of resources is caused.
At present, domestic and foreign scholars develop polishing tools with different effects aiming at the problems, such as CN102825561A discloses a water-based polishing film and a preparation method thereof, CN104002252A discloses a superfine abrasive biopolymer flexible polishing film and a preparation method thereof, CN104275651A discloses a diamond polishing film preparation method and the like, and the defects of fixed abrasives are overcome to a certain extent, but the coating with abrasive particles is coated on the surface of a substrate in a smearing or electrostatic adsorption mode, so that a polishing workpiece can have certain abrasion on the polishing film after contacting with the polishing film, and the polishing film can be corroded and shed after the polishing solution with chemical reagent is added.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a preparation method of a recyclable mixed abrasive polishing film.
The technical scheme of the invention is as follows:
a preparation method of a recyclable mixed abrasive polishing film comprises the following steps:
(1) Heating a thermoplastic elastomer (TPE) to a molten state to obtain a molten state TPE;
(2) Uniformly mixing a micron-sized hard abrasive and a micron-sized rare earth abrasive to prepare a mixed abrasive, wherein the particle size of the micron-sized hard abrasive is larger than that of the micron-sized rare earth abrasive;
(3) Uniformly mixing the mixed abrasive with the molten TPE according to the proportion of 20-40wt% to 60-80 wt%;
(4) Extruding and casting the material obtained in the step (3) to obtain the mixed abrasive polishing film.
In a preferred embodiment of the present invention, the thermoplastic elastomer TPE comprises at least one of styrenic TPE, olefinic TPE, diene TPE, vinyl chloride TPE and urethane TPE.
Further preferably, the thermoplastic elastomer TPE is a polyurethane TPE or an olefin TPE.
In a preferred embodiment of the present invention, the micron-sized hard abrasive is at least one of diamond, alumina, silicon carbide, and boron nitride.
Further preferably, the micron-sized hard abrasive is diamond or alumina.
Further preferably, the micron-sized hard abrasive has a particle size of W3-W20.
In a preferred embodiment of the present invention, the micron-sized rare earth abrasive is at least one of cerium oxide, yttrium oxide, lutetium oxide, and lanthanum oxide.
Further preferably, the micron-sized rare earth abrasive is cerium oxide and/or yttrium oxide.
Further preferably, the micron-sized rare earth abrasive has a particle size of W0.5-W2.
In a preferred embodiment of the present invention, the step (3) is: the mixed abrasive and the molten TPE are uniformly mixed according to the proportion of 25-40wt% to 60-75 wt%.
The beneficial effects of the invention are as follows:
1. the mixed abrasive polishing film prepared by the invention has wide application range and is widely suitable for polishing ceramic substrates, polishing flat stone surfaces, polishing semiconductor wafers and precisely machining large-size planes.
2. The invention adopts the processing method of the fixed abrasive, can effectively solve the problem that the processing of the free abrasive is uncontrollable, and ensures that the processing is more uniform.
3. The polishing film adopts a mode of mixing the high-hardness abrasive with the micron-sized rare earth abrasive, so that the fine-granularity micron-sized rare earth abrasive is better contacted with a workpiece to be processed in the polishing processing, and scratches and pit defects generated in the processing of the high-hardness abrasive can be eliminated in the CMP process.
4. According to the invention, the mixed abrasive is directly mixed with the thermoplastic elastomer TPE, and the thermoplastic elastomer TPE has the characteristics of good toughness, large damage tolerance and rebound resilience in the processing process, so that the damage of the high-hardness abrasive to the processing surface is reduced.
5. The thermoplastic elastomer TPE selected by the invention has the advantages of simple processing and molding, recycling and no environmental pollution, has higher mechanical energy, long service life, higher corrosion resistance and acid and alkali resistance, can be molded again by a simple extrusion casting method after being heated to a molten state under the condition of breakage, and greatly reduces the preparation cost.
6. The invention does not need long-time drying and cooling, and the large-size polishing film is directly manufactured by using an extrusion casting method, so that the prepared film has balanced performance and uniform thickness, can be cut according to the requirements for special shapes, and is suitable for mass production.
Drawings
FIG. 1 is a schematic view of an extrusion casting apparatus used in the examples of the present invention: no. 1 chill roll, no. 2 chill roll, shaping roller, peel off the roller, coiling mechanism, wherein shaping roller interval is 0.3mm.
FIG. 2 is a schematic representation of a cross-section of a mixed abrasive polishing film after formation in accordance with example 1 of the present invention.
FIG. 3 is a surface topography of a 2 inch GaN wafer processed by CMP with a mixed abrasive polishing film prepared in example 1 of the present invention.
FIG. 4 is a surface topography of a 2 inch GaN wafer processed by CMP after heat and melt reforming of a mixed abrasive polishing film prepared in example 1 of the present invention.
Fig. 5 is a surface topography of a 2 inch sapphire substrate CMP processed with a mixed abrasive polishing film prepared in example 2 of the present invention.
FIG. 6 is a surface topography of a 2 inch sapphire substrate processed by CMP after heat and melt reforming of a mixed abrasive polishing film prepared in example 2 of the present invention.
FIG. 7 is a surface topography of a conventional consolidated polishing film prepared in comparative example 1 of the present invention with free abrasive grains added to CMP process 2 inch gallium nitride.
Detailed Description
The technical scheme of the invention is further illustrated and described below by the specific embodiments in combination with the accompanying drawings.
Example 1
Selecting polyurethane TPE (TPU 9392A), and heating to 200 ℃ to enable the TPE to be in a molten state; the W5 alumina is selected as a high-hardness abrasive, and the high-hardness abrasive, the W0.5 cerium oxide and the W0.5 yttrium oxide are mixed according to the mass ratio of 1:2:2 to prepare the mixed abrasive. The molten TPU and the mixed abrasive are uniformly mixed according to the weight percentage of 60 to 40. Pouring the mixed solvent into extrusion casting film equipment directly. The extrusion casting apparatus is shown in fig. 1. After processing, the large-size polishing film roll can be directly prepared, and the mixed abrasive polishing film is prepared. The cross section of the formed mixed abrasive polishing film is shown in fig. 2. The mixed abrasive polishing film is cut and then stuck to a UNIPO-1200S automatic grinding polisher, the rotation speed of a carrying disc is 60rpm, the rotation speed of a polishing disc is 120rpm, the polishing pressure is set to be 0.5kg, 4% potassium persulfate is selected as polishing liquid, a 2-inch gallium nitride wafer with the original roughness surface of 10nm is polished for 1h, the surface roughness can reach 0.40nm, and no obvious scratches and pits exist on the surface of the wafer. The results are shown in FIG. 3. After the cumulative processing for 6 hours, the polishing film appeared slightly dented at the processing place of the wafer. After heating, melting and extrusion molding, the 2-inch gallium nitride wafer with the original roughness surface of 10nm is polished for 1h again, the surface roughness can reach 0.38nm, and no obvious scratches and pits are formed on the surface of the wafer. The results are shown in FIG. 4.
Example 2
An olefin TPE (TPO 185) is selected and heated to 220 ℃ to be in a molten state; the W10 diamond is selected as a high-hardness abrasive and is mixed with rare earth abrasive W1 cerium oxide according to the mass ratio of 1:8 to prepare the mixed abrasive. The molten TPO and the mixed abrasive are uniformly mixed according to the weight percentage of 75 to 25. Pouring the mixed solvent into extrusion casting film equipment directly. The extrusion casting apparatus is shown in fig. 1. After processing, the large-size polishing film roll can be directly prepared, and the mixed abrasive polishing film is prepared. The cross section of the formed mixed abrasive polishing film is shown in fig. 2. The mixed abrasive polishing film is cut and then stuck to a UNIPO-1200S automatic grinding polisher, the rotation speed of a carrying disc is 65rpm, the rotation speed of a polishing disc is 130rpm, the polishing pressure is set to be 0.4kg, 2% hydrogen peroxide is selected as polishing liquid, the 2 inch sapphire substrate with the original roughness surface of 15nm is polished for 1h, the surface roughness can reach 0.42nm, and no obvious scratches and pits exist on the surface of a wafer. The results are shown in FIG. 5. After 5 hours of cumulative processing, the polishing film appeared slightly dented at the processing site of the wafer. After heating, melting and extrusion molding, the 2-inch sapphire substrate with the original roughness surface of 15nm is polished for 1h again, the surface roughness can reach 0.36nm, and no obvious scratches and pits are formed on the surface of the wafer. The results are shown in FIG. 6.
Comparative example 1
A common consolidated form of the polishing film was selected, the abrasive particles selected for W5 alumina, and the abrasive concentration was 20wt%. Meanwhile, 10wt percent of W0.5 cerium oxide, 10wt percent of W0.5 yttrium oxide and 4 percent of potassium persulfate are taken to prepare rare earth abrasive slurry. And the polishing pressure is set to be 0.5kg, and the 2-inch gallium nitride wafer with the original roughness surface of 10nm is polished for 1h, wherein the surface roughness can only reach 1nm, but slight scratches exist, and the ultra-smooth surface without scratches and surface defects cannot be achieved. The results are shown in FIG. 7. And the situation that the abrasive particles on the polishing film fall off occurs after the accumulated processing is carried out for 1.5 hours. If the processing is to be continued, a new polishing film needs to be replaced.
The foregoing description is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, i.e., the invention is not to be limited to the details of the invention.
Claims (10)
1. A preparation method of a recyclable mixed abrasive polishing film is characterized by comprising the following steps: the method comprises the following steps:
(1) Heating a thermoplastic elastomer (TPE) to a molten state to obtain a molten state TPE;
(2) Uniformly mixing a micron-sized hard abrasive and a micron-sized rare earth abrasive to prepare a mixed abrasive, wherein the particle size of the micron-sized hard abrasive is larger than that of the micron-sized rare earth abrasive;
(3) Mixing the abrasive with the molten TPE in an amount of 20 to 40wt%: mixing evenly in a proportion of 60-80 wt%;
(4) Extruding and casting the material obtained in the step (3) to obtain the mixed abrasive polishing film.
2. The method of manufacturing according to claim 1, wherein: the thermoplastic elastomer TPE includes at least one of a styrenic TPE, an olefinic TPE, a diene TPE, a vinyl chloride TPE, and a urethane TPE.
3. The method of manufacturing as claimed in claim 2, wherein: the thermoplastic elastomer TPE is polyurethane TPE or olefin TPE.
4. The method of manufacturing according to claim 1, wherein: the micron-sized hard abrasive is at least one of diamond, alumina, silicon carbide and boron nitride.
5. The method of manufacturing according to claim 4, wherein: the micron-sized hard abrasive is diamond or aluminum oxide.
6. The method of claim 4 or 5, wherein: the granularity of the micron-sized hard abrasive is W3-W20.
7. The method of manufacturing according to claim 1, wherein: the micron-sized rare earth abrasive is at least one of cerium oxide, yttrium oxide, lutetium oxide and lanthanum oxide.
8. The method of manufacturing according to claim 7, wherein: the micron-sized rare earth abrasive is cerium oxide and/or yttrium oxide.
9. The method of claim 7 or 8, wherein: the granularity of the micron-sized rare earth abrasive is W0.5-W2.
10. The method of preparing as claimed in claim 9, wherein: the step (3) is as follows: mixing the abrasive with the molten TPE in an amount of 25 to 40wt%: mixing evenly in the proportion of 60-75wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210934985.XA CN116141214B (en) | 2022-08-04 | 2022-08-04 | Preparation method of recyclable mixed abrasive polishing film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210934985.XA CN116141214B (en) | 2022-08-04 | 2022-08-04 | Preparation method of recyclable mixed abrasive polishing film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116141214A true CN116141214A (en) | 2023-05-23 |
| CN116141214B CN116141214B (en) | 2024-08-27 |
Family
ID=86349496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210934985.XA Active CN116141214B (en) | 2022-08-04 | 2022-08-04 | Preparation method of recyclable mixed abrasive polishing film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116141214B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311727A (en) * | 2003-04-07 | 2004-11-04 | Hitachi Chem Co Ltd | Polishing pad, its manufacturing method and polishing method using it |
| CN1669739A (en) * | 2000-12-01 | 2005-09-21 | 东洋橡膠工业株式会社 | Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad |
| US20060199473A1 (en) * | 2003-04-03 | 2006-09-07 | Masao Suzuki | Polishing pad, process for producing the same and method of polishing therewith |
| CN101208178A (en) * | 2005-06-30 | 2008-06-25 | 卡伯特微电子公司 | Use of CMP for aluminum mirror and solar cell fabrication |
| JP2008207324A (en) * | 2007-02-01 | 2008-09-11 | Kuraray Co Ltd | Polishing pad and manufacturing method for the polishing pad |
| JP2009078332A (en) * | 2007-09-27 | 2009-04-16 | Kuraray Co Ltd | Fiber composite polishing pad |
| CN108472788A (en) * | 2015-12-30 | 2018-08-31 | 圣戈班磨料磨具有限公司 | Milling tool and its forming method |
| CN111918992A (en) * | 2018-03-27 | 2020-11-10 | 哈伯西有限公司 | Abrasive product comprising impregnated woven fabric and abrasive particles |
-
2022
- 2022-08-04 CN CN202210934985.XA patent/CN116141214B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1669739A (en) * | 2000-12-01 | 2005-09-21 | 东洋橡膠工业株式会社 | Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad |
| US20060199473A1 (en) * | 2003-04-03 | 2006-09-07 | Masao Suzuki | Polishing pad, process for producing the same and method of polishing therewith |
| JP2004311727A (en) * | 2003-04-07 | 2004-11-04 | Hitachi Chem Co Ltd | Polishing pad, its manufacturing method and polishing method using it |
| CN101208178A (en) * | 2005-06-30 | 2008-06-25 | 卡伯特微电子公司 | Use of CMP for aluminum mirror and solar cell fabrication |
| JP2008207324A (en) * | 2007-02-01 | 2008-09-11 | Kuraray Co Ltd | Polishing pad and manufacturing method for the polishing pad |
| JP2009078332A (en) * | 2007-09-27 | 2009-04-16 | Kuraray Co Ltd | Fiber composite polishing pad |
| CN108472788A (en) * | 2015-12-30 | 2018-08-31 | 圣戈班磨料磨具有限公司 | Milling tool and its forming method |
| CN111918992A (en) * | 2018-03-27 | 2020-11-10 | 哈伯西有限公司 | Abrasive product comprising impregnated woven fabric and abrasive particles |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116141214B (en) | 2024-08-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108949036B (en) | Polishing solution and method for polishing silicon carbide crystals | |
| KR101494034B1 (en) | Compositions and methods for modifying a surface suited for semiconductor fabrication | |
| KR100726303B1 (en) | Abrasive Material | |
| CN109545680B (en) | Rapid preparation method of high-flatness and low-damage monocrystalline silicon carbide substrate | |
| CN111002235B (en) | Preparation method of novel polymeric abrasive | |
| KR101783406B1 (en) | An abrasive pad and manufacturing method thereof | |
| CN1903510A (en) | Freezing nanometer abrasive polishing pad and its prepn. method | |
| WO2008117883A1 (en) | Synthetic grindstone | |
| Tian et al. | Effects of chemical slurries on fixed abrasive chemical-mechanical polishing of optical silicon substrates | |
| CN103361530B (en) | Diamond cutting blade and preparation method thereof | |
| JP2003011066A (en) | Polishing tool and manufacturing method therefor | |
| CN114231182A (en) | Easy-to-cleave gallium oxide wafer chemical mechanical polishing process, polishing solution and preparation method thereof | |
| KR100615691B1 (en) | A member for polishing, surface plate for polishing and polishing method using the same | |
| CN116141214B (en) | Preparation method of recyclable mixed abrasive polishing film | |
| CN109321980B (en) | A kind of high-flatness, low damage major diameter single crystal silicon carbide substrates | |
| JP4573492B2 (en) | Synthetic whetstone | |
| KR100864149B1 (en) | Spherical ball polishing method and spherical ball polishing apparatus | |
| TW200940257A (en) | Method for manufacturing a conditioning disc for polishing pad | |
| CN115662877B (en) | Monocrystalline silicon surface cleaning method | |
| WO2013003811A2 (en) | An abrasive segment comprising abrasive aggregates including silicon carbide particles | |
| TWI768329B (en) | Physical dry surface treatment method of semiconductor wafer and composition for surface treatment thereof | |
| CN113814799A (en) | Polishing method for low-index crystal face of single crystal diamond | |
| JP4849590B2 (en) | Polishing tool and manufacturing method thereof | |
| CN109401183B (en) | Phenolic foam material for polishing and preparation method and application thereof | |
| US20060046064A1 (en) | Method of improving removal rate of pads |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |